Abstract: An apparatus for mounting a tissue specimen on a chuck for sectioning in a cryostat including a base, a clamp for receiving a tissue preparation slide, a chuck holder secured to the base for holding the chuck in a predetermined orientation relative to the clamp, a support secured to the base and extending therefrom and terminating in a distal end, and, means for slideably securing said clamp to said support. The clamp is positionable between a first location in which the clamp is at a minimum distance from the chuck holder and a second location in which the clamp is at a maximum distance from the chuck holder. A method for using the apparatus is likewise disclosed.

Abstract: A brazing fixture apparatus is disclosed for holding a heat exchanger core during a brazing operation. The fixture includes a generally rectangular frame including a contact member disposed on one side of the frame and a single lever extending axially along the length of the frame. The lever pivots from a first position to allow placement of the core onto the frame to a second position, in response to gravity, such that in the second position, the lever applies a constant compressive force on the core to hold the core together during the brazing operation.

Abstract: A paper cutting assist (10) for holding paper sheets (28) when they are being cut with scissors (64) comprises a relatively flat lid-jaw block (12) and a relatively flat base-jaw block (14) which are hinged together along hinge edges (20, 22) thereof and which include a lid-block jaw non-slip layer (32) mounted on a lid-jaw paper-gripping surface (24) and a base support non-slip layer (32) on a flat raised base support surface (26). The lid and base blocks are constructed of sufficiently heavy material that the non-slip layers prevent movement of the paper-cutting assist on the floor surface (54) and movement of a paper sheet (28) placed between the paper gripping surfaces of the lid and base blocks. Attracting magnets (38, 40, 42 and 44) can be placed in the lid and base blocks for providing additional bias to hold the blocks together.

Abstract: A bone vise for holding a bone or bone fragment immobile during surgery to enable a surgeon to perform desired sculpting or other operations thereon. The vise includes a planar base member with an integral threaded post upstanding from its central portion and a platform threadedly received on the post. A plurality of elongated gripper members are pivotally mounted intermediate their ends on the platform about axes which are tangent to a circle whose center lies within a bone receiving and engaging region. Each gripper member has a toothed surface at one end adjacent the bone receiving and engaging region and a cam surface at the opposite end weight biased into engagement with the base member. Rotation of the platform in one direction causes movement thereof away from the base member and enlargement of the bone receiving and holding region for insertion or removal of the bone.

Abstract: A holder for a yarn package or yarn carrier including a support member to which is fixed a clamp member having a bottom jaw surface and a bell crank member pivotally supported upon the support member below the clamp member, so that the rearward and upward projecting leg of the bell crank member constitutes a pivotal clamp member for clamping the lip of the yarn carrier against the fixed clamp member and the longer, forward projecting lever arm leg of the bell crank member provides a support for the interior of the yarn carrier.

Abstract: A fixture for use in soldering a large number of integrated circuit (IC) chips to a multilayer substrate in a single reflow soldering operation. A multilayer substrate with IC chips and their leads properly positioned on the substrate is placed within the base of the fixture. The force structure portion of the fixture is positioned on the base so that force pins, which are movable with respect to the force structure, can be lowered, or moved toward the substrate to apply the weight of a force pin to each IC chip to be soldered to the substrate. The weight, or force, of a force pin forces the back metal layer of each IC chip and its leads against a chip pad and chip lead pads of the substrate. The substrate is heated to melt, or to reflow, the solder on all the chip pads and chip lead pads. After the leads and back metal layer of each chip are wetted by the solder and while the solder is molten, the force structure is moved away from the base to remove the weight of the force pins from the IC chips.