Abstract: A flexible transmission element is disclosed which can be used, in particular in a harmonic drive and which includes a sleeve-shaped, outer toothed section and a flange connected to this section, the outer toothing of the sleeve-shaped section is sheet metal toothing formed in a die.

Abstract: A uniform pressure gang bonding device and fabrication method are presented using an expandable upper chamber with an elastic surface. Typically, the elastic surface is an elastomer material having a Young's modulus in a range of 40 to 1000 kilo-Pascal (kPA). After depositing a plurality of components overlying a substrate top surface, the substrate is positioned over the lower plate, with the top surface underlying and adjacent (in close proximity) to the elastic surface. The method creates a positive upper chamber medium pressure differential in the expandable upper chamber, causing the elastic surface to deform. For example, the positive upper chamber medium pressure differential may be in the range of 0.05 atmospheres (atm) and 10 atm. Typically, the elastic surface deforms between 0.5 millimeters (mm) and 20 mm, in response to the positive upper chamber medium pressure differential.

Abstract: The present invention is a method for controlling flatness of a wafer including the steps of: providing a holding member having a holding surface including a plurality of segments, where each of the plurality of segments includes a dry adhesive fiber structure; making the holding surface of the holding member adhere to a wafer to make the holding member hold the wafer; obtaining information on flatness of the wafer by measuring flatness of the wafer to; and releasing adhesion of the dry adhesive fiber structures to the wafer in a part of the plurality of segments of the holding surface of the holding member based on the information on flatness. This can provide: a method for controlling flatness by which flatness of a wafer can be controlled sufficiently.

Abstract: A flexible transmission element (1) which can be used, in particular in a harmonic drive (9) and which includes a sleeve-shaped, outer toothed section (3) and a flange (4) connected to this section (3), the outer toothing (8) of the sleeve-shaped section (3) is sheet metal toothing formed in a die.

Abstract: A hold and release platen system for use in extrusion-based additive manufacturing system includes a platen, a vacuum source and a pressurized air source. The platen has a surface including a plurality of holes therethrough. The vacuum source is configured to provide a vacuum through the plurality of holes, and the pressurized air source is configured to eject pressurized fluid through the plurality of holes. A method includes positioning a sheet substrate on the platen surface; pulling a vacuum through one or more holes in the platen surface to secure the sheet substrate; printing a part on the sheet substrate by moving a print head along a tool path and extruding material in the path; and ejecting pressurized air through the one or more holes to create an air bearing beneath the substrate thereby facilitating removal of the sheet substrate and the printed part from the platen.

Abstract: A method for fabricating vacuum tooling is disclosed using porous granular media. A sheet of steel webbing is affixed to a frame. A plurality of layers of fiberglass is affixed to the webbing. A vacuum port is installed through the webbing and plurality of layers of fiberglass. A granular media is mixed with epoxy to form a granular mixture. The granular mixture is layered over the plurality of layers of fiberglass to form a flat surface and machined for uniformity before sealing.

Abstract: A bonding jig used for bonding a gas diffusion layer or a fuel cell constituent member including the gas diffusion layer to be sandwiched between separators and an adhesive sheet for joining the separators to the gas diffusion layer or fuel cell constituent member, the bonding jig being capable of simultaneously performing bonding and eliminating fluffy fibers on the gas diffusion layer. The bonding jig includes a loading area (recess) where the gas diffusion layer is loaded when the bonding is performed, and the recess has a plurality of communication holes that communicate with the outside and that are coupled to a suction pump. While the adhesive sheet is placed on the side of the upper face of the bonding jig so as to be integrated with the gas diffusion layer, the suction pump is actuated to eliminate fluffy fibers on the gas diffusion layer.

Abstract: Build plates for additive manufacturing systems are disclosed. The build plates of the additive manufacturing systems may include a body including a build surface, and a bottom surface positioned opposite the build surface. The build plates may also include a first conduit formed through the body and extending between the build surface and the bottom surface. The first conduit may be configured to be in fluid communication with a first aperture formed through a surface of a first component that may be built on the build surface of the body of the build plates.

Abstract: In one example, a flexible circuit board includes a signal line disposed between a first ground and a second ground; a dielectric disposed between the first ground and the signal line and between the second ground and the signal line; and a flatness improvement portion disposed on an upper portion of the second ground.

Abstract: A pedestal for a substrate processing system includes a pedestal body including a substrate-facing surface. An annular band is arranged on the substrate-facing surface that is configured to support a radially outer edge of the substrate. A cavity is defined in the substrate-facing surface of the pedestal body and is located radially inside of the annular band. The cavity creates a volume between a bottom surface of the substrate and the substrate-facing surface of the pedestal body. A plurality of vents pass through the pedestal body and are in fluid communication with the cavity to equalize pressure on opposing faces of the substrate during processing.

Abstract: A single axis application unit for processing a glass workpiece includes a workpiece supporting table, an applicator movable on a traveler shiftable along a first linear axis and a central suction unit that is activateable to grip the glass workpiece that travels along a second linear axis oriented generally perpendicular to the first linear axis. A central suction unit brake selectively secures the central suction unit both rotationally and translationally. The central suction unit is freely moveable both translationally and rotationally when the central suction unit brake is released. A mid-peripheral suction unit is located at a fixed location remote from the central suction unit and selectively activateable to grip the glass workpiece to hold the glass workpiece in a fixed orientation. A corner suction gripper is movable with the applicator parallel to the first linear axis, and is selectively activateable to grip the glass workpiece.

Abstract: In a suction nozzle, a tip portion of an air pipe includes an opening portion having an area larger than that of a flow path of the air pipe, and a slit which is formed on the tip portion of the air pipe is provided in a portion of a circumferential contact surface contacting the component. In the suction nozzle, since air supplied from the air pipe flows out through the slit, the suction state of the component is canceled from the position of the slit as a base point.

Abstract: The present disclosure discloses a fingerprint identification module and a method for manufacturing the same, and relates to the field of fingerprint identification technologies. The fingerprint identification module is obtained by dicing a board-level module, and includes a fingerprint identification chip, a filling material, a color coating and a cover. The color coating is disposed between the filling material and the cover, and the fingerprint identification chip is inversely attached in a hollow area of the filling material in a vacuum environment. The fingerprint identification module has a simple structure and is easy to manufacture. By using the method, the bubbles between the fingerprint identification chip and the cover are effectively eliminated, and the manufacture efficiency of the fingerprint identification module is improved.

Abstract: A device for treating a disc-shaped substrate is disclosed, comprising a support which has a support face for the disc-shaped substrate and a support adapter which can be coupled to the support and can support a mask used for treating the disc-shaped substrate, wherein an interface is provided which detects the coupling of the support adapter to the support and wherein a control system is provided which cooperates with the interface and detects whether the support adapter is coupled to the support, in particular whether the interface is occupied. A support adapter for use in a device of this type is further disclosed.

Abstract: A joining device for joining substrates together includes a first holding member configured to vacuum-suck a first substrate to draw and hold the first substrate on a lower surface thereof, and a second holding member disposed below the first holding member and configured to vacuum-suck a second substrate to draw and hold the second substrate on an upper surface thereof. The second holding member includes a body portion formed into a size larger than the second substrate when seen in a plan view and configured to vacuum-suck the second substrate, a plurality of pins provided on the body portion and configured to make contact with a rear surface of the second substrate, and an outer wall portion annularly provided on the body portion at an outer side of the plurality of pins and configured to support an outer periphery portion of the rear surface of the second substrate.

Abstract: A system for providing vacuum to a moving element of a transport system, the system includes: a vacuum chamber on the moving element for storing vacuum; a vacuum source; a vacuum inlet provided on the vacuum chamber and for connection to the vacuum source; and a vacuum outlet in communication with the vacuum chamber and positioned on the moving element. The vacuum source may be provided on and travel with the moving element or on the transport system and periodically engage with the vacuum chamber. Where the vacuum source is provided on the moving element, a vacuum chamber may not be required. Further, the vacuum source may be driven by electrical energy and/or mechanical energy in various configurations.

Abstract: A joining device for joining substrates together includes a first holding member configured to vacuum-suck a first substrate to draw and hold the first substrate on a lower surface thereof, and a second holding member disposed below the first holding member and configured to vacuum-suck a second substrate to draw and hold the second substrate on an upper surface thereof. The second holding member includes a body portion formed into a size larger than the second substrate when seen in a plan view and configured to vacuum-suck the second substrate, a plurality of pins provided on the body portion and configured to make contact with a rear surface of the second substrate, and an outer wall portion annularly provided on the body portion at an outer side of the plurality of pins and configured to support an outer periphery portion of the rear surface of the second substrate.

Abstract: A support table to support a surface of a substrate, wherein the support table includes: a base surface substantially parallel to the surface of the substrate, a plurality of burls protruding above the base surface, each of the burls having a respective distal end and a first height above the base surface, the burls arranged such that, when the substrate is supported by the support table, the substrate is supported by the respective distal ends, and a plurality of elongate raised protrusions separated by gaps, each of the elongate raised protrusions having a second height above the base surface, wherein the elongate raised protrusions protrude above the base surface between the burls, and the second height is less than the first height; wherein the protrusions are arranged such that a plurality of the gaps are aligned to form a straight gas flow path towards an edge of the base surface.

Abstract: A mechanism to attach a die to a substrate and method of use are disclosed. The vacuum carrier includes a frame composed of material compatible with solder reflow process. The vacuum carrier further includes a vacuum port extending from a top surface to an underside surface of the frame. The vacuum carrier further includes a seal mechanism provided about a perimeter on the underside surface of the frame of the vacuum carrier. The frame and seal mechanism are structured to maintain a flatness of a die attached to the vacuum carrier by a vacuum source during the solder reflow process.

Abstract: A vacuum cell-assembly device, for cell-assembly of an upper substrate and a lower substrate of a display panel, includes an upper machine table, a lower machine table, a control circuit and a dynamic sensing and regulating structure. The dynamic sensing and regulating structure is fixed on the upper machine table and comprises a plurality of sub-structures. Each sub-structure comprises a flatness adjustment layer, a piezoelectric induction layer and a surface adsorption layer. Further disclosed are a cell-assembly method and a device for manufacturing a display panel. The device can improve cell-assembly accuracy and cell-assembly quality.

Abstract: A support table for a lithographic apparatus, the support table having a support section and a conditioning system, wherein the support section, the conditioning system, or both, is configured such that heat transfer to or from a substrate supported on the support table, resulting from the operation of the conditioning system, is greater in a region of the substrate adjacent an edge of the substrate than it is in a region of the substrate that is at the center of the substrate.

Abstract: A chuck for testing an integrated circuit includes an upper conductive layer having a lower surface and an upper surface suitable to support a device under test. An upper insulating layer has an upper surface at least in partial face-to-face contact with the lower surface of the upper conductive layer, and a lower surface. A middle conductive layer has an upper surface at least in partial face-to-face contact with the lower surface of the upper insulating layer, and a lower surface.

Abstract: Provided is a flat carrier provided with holders for separated electronic components, comprising: a flat metal platform with a space recessed therein and an epoxy carrier structure which is arranged form-fittingly in this space and which is provided with holders for the separated electronic components. Also provided is a method for visual inspection of separated electronic components located on such a flat carrier.

Abstract: A system for providing vacuum to a moving element of a transport system, the system including a vacuum chamber on the moving element for storing vacuum, a vacuum source, and a vacuum inlet provided on the vacuum chamber for connection to the vacuum source. The system further includes a vacuum outlet in communication with the vacuum chamber and positioned on the moving element. The vacuum source may be provided on and travel with the moving element or on the transport system and periodically engage with the vacuum chamber. Where the vacuum source is provided on the moving element, a vacuum chamber may not be required. Further, the vacuum source may be driven by electrical energy and/or mechanical energy in various configurations.

Abstract: A laser processing method which can prevent an object to be processed from being cut along a line to cut from a modified region acting as a cutting start point when separating a suction table and a holding member from each other is provided. An expandable tape 23 holding an object to be processed 1 while being stuck to a frame 51 is secured by suction onto a suction table 52 of a vacuum chuck with a porous sheet 53 interposed therebetween. Since the sheet 53 has a Young's modulus lower than that of the table 52, the tape 23 is restrained from biting into fine pores of the sheet 53. As a consequence, even when the table 52 and tape 23 are separated from each other by releasing the suction securing after forming a modified region 7, no strong bending stress acts on the object 1. This can prevent the object 1 from being cut along a line to cut from the modified region 7 acting as a cutting start point when separating the table 52 and tape 23 from each other.

Abstract: An apparatus of semiconductor process including a chuck and a vacuum source is provided. The chuck has a plurality of holes for holding a semiconductor substrate, and the vacuum source is used for providing vacuum suction through the holes to make the semiconductor substrate be subjected to varied suction intensities according to a warpage level thereof.

Abstract: In a device for machining, in particular etching and/or developing, substrates, in particular wafers, in particular etching and/or developing, having a turntable, the turntable has a Venturi gap.

Abstract: A vacuum chuck is disclosed for holding and positioning wafers more stably and securely. The vacuum chuck includes a supporting assembly having a receiving groove and at least one first vacuum aperture defined in the receiving groove. A seal unit includes a seal ring bulging to form a vacuum trough. The seal ring is fixed in the receiving groove of the supporting assembly and has at least one second vacuum aperture communicating with the first vacuum aperture. A chuck connector fastened with the supporting assembly has at least one vacuum port and at least one vacuum orifice communicating with the vacuum port. At least one vacuum hose connects the first vacuum aperture, the second vacuum aperture with the vacuum orifice and the vacuum port of the chuck connector for evacuating the air of the vacuum trough to hold and position the wafer on the seal ring and the supporting assembly.

Abstract: An apparatus, particularly a chuck for retaining a thin part for micro-machining processing, is disclosed. The chuck is formed of a plate-shaped body having a first surface and a second surface opposite the first surface. The plate-shaped body includes a light-transmissive material, and at least one of the first surface or the second surface is a roughened surface. The chuck can be incorporated into a micro-machining system using a chuck support that allows light through to backlight a processed part for inspection.

Abstract: A wafer chuck holds a wafer on a surface thereof such that an image of the wafer can be formed from light reflected by the surface of the wafer chuck. The surface of the wafer chuck is a planar surface that has a reflectivity equal to or greater than 40%, and/or a whiteness index value equal to or greater than 90. The wafer chuck can include a ceramic containing aluminum oxide having a purity equal to or greater than 95%. The planar surface of the wafer chuck is such that light illuminating the surface of the wafer chuck is reflected by the surface of the wafer chuck through the wafer. The wafer chuck can be used with an apparatus for cutting the wafer, and the light reflected by the surface can be used to form an image of the wafer used identifying cutting lines on the wafer.

Abstract: A substrate holder assembly for use in a controlled spalling process is provided. The substrate holder assembly includes a base structure having a surface in which a base substrate or other work piece can be placed thereupon. A framing element is located above and spaced apart from the surface of the base structure. The framing element has a window which exposes an upper surface of the base substrate and defines an area of the upper surface of the base substrate in which another material can be applied thereto. A support structure containing at least one mechanical securing element is located on the framing element. The support structure mechanically constrains the base substrate within the substrate holder assembly. Each mechanical securing element contacts at least one surface of the support structure and, optionally, one surface of the base substrate.

Abstract: A substrate holder assembly for use in a controlled spalling process is provided. The substrate holder assembly includes a base structure having a surface in which a base substrate or other work piece can be placed thereupon. A framing element is located above and spaced apart from the surface of the base structure. The framing element has a window which exposes an upper surface of the base substrate and defines an area of the upper surface of the base substrate in which another material can be applied thereto. A support structure containing at least one mechanical securing element is located on the framing element. The support structure mechanically constrains the base substrate within the substrate holder assembly. Each mechanical securing element contacts at least one surface of the support structure and, optionally, one surface of the base substrate.

Abstract: According to one embodiment, a substrate treatment apparatus includes a substrate holding unit including a holding unit configured to hold a target substrate, a base unit which has the holding unit on a peripheral portion thereof, and a hollow rotation shaft, which contains a gas supply channel, configured to rotate together with the holding unit and the base unit, the substrate holding unit configured to hold the target substrate by supplying to the target substrate gas supplied from the gas supply channel, a substrate rotating unit, which is connected to the rotation shaft through a belt, configured to rotate the substrate holding unit, and a first substrate holding detecting unit, which is connected to the substrate rotating unit, configured to detect whether or not the target substrate is held by the substrate holding unit, by measuring a rotational frequency or a roll acceleration of the rotating substrate holding unit.

Abstract: A semiconductor wafer processing tool has a support structure for a coarse motion positioning system. A measurement head having a rigid super structure is supported from the support structure by vibration isolators and a top plate is mounted to the super structure. A vacuum transfer chuck is releasably carried by the coarse motion positioning system and releasably adherable to the top plate by application of vacuum. The vacuum transfer chuck supports a semiconductor wafer.

Abstract: Provided are a chucking device having low dusting characteristics and high detergent properties and capable of vacuum-sucking even a substrate having a large warpage, and a chucking method using the same. A chucking device according to an aspect of the present invention vacuum-sucks and holds a wafer. The chucking device includes: a perforated plate having a plurality of through-holes and being mounted with a wafer, the through-holes penetrating through both sides of the perforated plate; a porous plate that supports a surface other than a mounting surface of the perforated plate, on which the wafer is mounted, transmits a vacuum state to the wafer through the plurality of through-holes, and has a pore to limit a flow rate; and a vacuum pump that exhausts an air through the pore of the porous plate.

Abstract: A device (1) for holding a planar substrate (4), in particular for a wafer or an eWLB, is shown, with a support (2) which forms a supporting surface (3) for the substrate (2) and has at least one recess (5) provided in the region of the supporting surface (3) for the substrate (2), and with at least one holding means which is connected in terms of flow to said recess (6) and is intended for fixing the substrate (2) on the device (1) with the aid of a vacuum generated between the support (2) and substrate (4). In order to be able to grip a multiplicity of substrates of geometrically differing profile, it is proposed that the support (2) has at least one recess (6) with an elastic seal (7) which is designed to be movable from a position (9) protruding over the edge (8) of the recess (6) into a position (10) pulled back in relation to the edge (8) of the recess (6) or at most corresponding to said edge and which interacts with the recess (5) for sucking the full area of the substrate (4) onto the support (2).

Abstract: Chucks for mounting and retaining semiconductor wafers during processing are described, particularly suited for wafer processing involving total immersion of the wafer-chuck structure in a liquid. Chuck structures are disclosed for preventing or hindering processing chemicals from contacting and contaminating large portions of the underside of the wafer undergoing processing, limiting such chemical contact to readily cleaned, relatively small annular regions on the periphery of the wafer. Embodiments include structures with supplemental gas flows on the underside of the wafer as well as the creation of gas/liquid meniscusci to prevent chemical penetration of the wafer's underside. Methods of processing semiconductor wafers employing such chucks are also described.

Abstract: This invention relates to a mounting apparatus for mounting and supporting one structure side of a substrate, which structure side has structures thereon. The apparatus having a mounting element with a flat mounting surface for supporting the structures and a suction surface F2 which penetrates the mounting surface solely in an outer ring surface for effecting a fluid flow which produces suctions on the substrate.

Abstract: An apparatus for drilling holes in a glass plate has a supporting member for sucking and supporting a glass plate which is used for an automobile window or the like, as described later, and the supporting member is comprised of a suction pad for sucking the glass plate and a pair of supports for supporting the glass plate on an outer side of the suction pad. The supports are detachably mounted on the outer side of the suction pad, and the supporting member is adapted to rotate about the suction pad in an R direction. The apparatus for drilling holes in a glass plate further includes a hole forming means for forming in the glass plate holes shown in FIG. 7; a supporting means having the supporting member and for supporting the glass plate in which the holes are to be formed by the hole forming means; and a transporting means for transporting onto the supporting means the glass plate in which the holes are to be formed.

Abstract: A holding device including a first sucking section for sucking a wafer (substrate) from a side on which a dicing tape (supporting film) is adhered; a structure that supports a dicing frame (frame part) and covers a first region which (i) is on a surface of the dicing tape to which surface the wafer is not adhered and (ii) is between the wafer and the dicing frame; and a second sucking section for sealing a boundary between the structure and at least one of the dicing frame and the first region.

Abstract: An apparatus and method for securing a substantially circular wafer uses a chuck having a plurality of tensioning grooves each having at least one arcuate bend having a bend radius substantially less than an outer region radius, and a vacuum source interconnected with each of the grooves. When the wafer is placed upon the surface concentric with the chuck center and the vacuum source applied to the grooves, the wafer is held securely to the surface without distortion.

Abstract: A chucking member for holding a target is removably mounted on a chucking stage with a plurality of vacuum holes. the chucking member has a substrate removably mounted on the chucking stage. The substrate has a vacuum region in which the target being to be arranged, the vacuum region allowing gas to be vacuumed through a part of the plurality of the vacuum holes, and a vacuum inhibition region provided around the vacuum region, the vacuum inhibition region covering the other of the vacuum holes to inhibit the gas from being vacuumed through the other of the vacuum holes.

Abstract: A chuck table holds a workpiece having a warp. The chuck table includes a suction holding member having a suction holding surface for holding the workpiece under suction, and an annular seal member provided around the outer circumference of the suction holding member for supporting a peripheral portion of the workpiece. The annular seal member is formed from an elastic member. The upper surface of the annular seal member is set higher in level than the suction holding surface according to the warp of the workpiece. In holding the workpiece on the chuck table under suction, vacuum leaking from the gap between the workpiece and the suction holding surface due to the warp of the workpiece is applied to the space defined by the workpiece and the annular seal member, thereby elastically deforming the annular seal member to flatten the upper surface of the workpiece.

Abstract: An apparatus of semiconductor process including a chuck and a vacuum source is provided. The chuck has a plurality of holes for holding a semiconductor substrate, and the vacuum source is used for providing vacuum suction through the holes to make the semiconductor substrate be subjected to varied suction intensities according to a warpage level thereof.

Abstract: A chuck includes a number of gas openings positioned to provide a gas flow to a backside of a wafer secured to the chuck. The chuck also includes a number of exhaust openings positioned to exhaust the gas at a distance from a topside edge of the wafer such that adverse thermal effects on the edge are reduced to a predetermined level.

Abstract: Provided is a suction chuck that is lightweight and that sucks and releases a thin plate workpiece in such a manner that the thin plate workpiece is not in contact with an edge of the chuck. A suction chuck according to an embodiment of the present invention includes a main body having a flat plate shape, and an opposing surface. Compressed air passages are formed within the main body. The opposing surface is a surface of the main body at the side facing the workpiece. The opposing surface has a plurality of recesses formed therein. The plurality of recesses serve as a sucking element for generating a negative pressure by ejecting the compressed air. The opposing surface is formed with a shape similar to the shape of the workpiece (or with a shape that corresponds to the shape of the workpiece being offset outward) such that the shape of the opposing surface is able to completely cover the shape of the workpiece when seen along a direction perpendicular to the opposing surface.

Abstract: In an embodiment, a chuck to support a solar cell in hot spot testing is provided. This embodiment of the chuck comprises a base portion and a support portion disposed above the base portion. The support portion is configured to support the solar cell above the base portion and to define a cavity between a bottom surface of the solar cell and the base portion that thermally separates a portion of the bottom surface of the solar cell from the base portion.

Abstract: In accordance with some embodiments of the present disclosure, a substrate holding apparatus is provided. The substrate holding apparatus includes a first holding part, a second holding part and a controller. The first holding part adsorbs and holds a first region including a central portion of a substrate. The second holding part adsorbs and holds a second region located outside the first region of the substrate. The second holding part adsorbs and holds the second region of the substrate after the first holding part adsorbs and holds the first region of the substrate.

Abstract: Provided is a positioning apparatus including: a reference member that is serving as a reference for positioning; a support part that supports the reference member; and a first fixing member provided on the support part that fixes the reference member and the support part or releases the fixing. The reference member is connected to the support part in a movable state and fixed to the support part by the first fixing member after a position is determined. The reference member of the positioning apparatus is precisely installed to a reference position.

Abstract: In an embodiment, a chuck to support a solar cell in hot spot testing is provided. This embodiment of the chuck comprises a base portion and a support portion disposed above the base portion. The support portion is configured to support the solar cell above the base portion and to define a space between a bottom surface of the solar cell and the base portion that thermally separates a portion of the bottom surface of the solar cell from the base portion.