Vacuum Patents (Class 279/3)
  • Patent number: 10967572
    Abstract: Build plates for additive manufacturing systems are disclosed. The build plates of the additive manufacturing systems may include a body including a build surface, and a bottom surface positioned opposite the build surface. The build plates may also include a first conduit formed through the body and extending between the build surface and the bottom surface. The first conduit may be configured to be in fluid communication with a first aperture formed through a surface of a first component that may be built on the build surface of the body of the build plates.
    Type: Grant
    Filed: April 18, 2017
    Date of Patent: April 6, 2021
    Assignee: GENERAL ELECTRIC COMPANY
    Inventors: Jan Vladimir Schwerdtfeger, Adnan Bobar, Juan Vicente Haro Gonzalez, Danijel Medved
  • Patent number: 10681803
    Abstract: In one example, a flexible circuit board includes a signal line disposed between a first ground and a second ground; a dielectric disposed between the first ground and the signal line and between the second ground and the signal line; and a flatness improvement portion disposed on an upper portion of the second ground.
    Type: Grant
    Filed: December 19, 2018
    Date of Patent: June 9, 2020
    Assignee: GIGALANE CO., LTD.
    Inventors: Byung Hoon Jo, Sang Pil Kim, Byung Yeol Kim, Hee seok Jung
  • Patent number: 10622243
    Abstract: A pedestal for a substrate processing system includes a pedestal body including a substrate-facing surface. An annular band is arranged on the substrate-facing surface that is configured to support a radially outer edge of the substrate. A cavity is defined in the substrate-facing surface of the pedestal body and is located radially inside of the annular band. The cavity creates a volume between a bottom surface of the substrate and the substrate-facing surface of the pedestal body. A plurality of vents pass through the pedestal body and are in fluid communication with the cavity to equalize pressure on opposing faces of the substrate during processing.
    Type: Grant
    Filed: February 13, 2017
    Date of Patent: April 14, 2020
    Inventors: Patrick Breiling, Ramesh Chandrasekharan, Karl Leeser, Paul Konkola, Adrien LaVoie, Chloe Baldasseroni, Shankar Swaminathan, Ishtak Karim, Yukinori Sakiyama, Edmund Minshall, Sung Je Kim, Andrew Duvall, Frank Pasquale
  • Patent number: 10596793
    Abstract: A single axis application unit for processing a glass workpiece includes a workpiece supporting table, an applicator movable on a traveler shiftable along a first linear axis and a central suction unit that is activateable to grip the glass workpiece that travels along a second linear axis oriented generally perpendicular to the first linear axis. A central suction unit brake selectively secures the central suction unit both rotationally and translationally. The central suction unit is freely moveable both translationally and rotationally when the central suction unit brake is released. A mid-peripheral suction unit is located at a fixed location remote from the central suction unit and selectively activateable to grip the glass workpiece to hold the glass workpiece in a fixed orientation. A corner suction gripper is movable with the applicator parallel to the first linear axis, and is selectively activateable to grip the glass workpiece.
    Type: Grant
    Filed: May 24, 2017
    Date of Patent: March 24, 2020
    Assignee: Erdman Automation Corporation
    Inventor: Morgan Donohue
  • Patent number: 10568249
    Abstract: In a suction nozzle, a tip portion of an air pipe includes an opening portion having an area larger than that of a flow path of the air pipe, and a slit which is formed on the tip portion of the air pipe is provided in a portion of a circumferential contact surface contacting the component. In the suction nozzle, since air supplied from the air pipe flows out through the slit, the suction state of the component is canceled from the position of the slit as a base point.
    Type: Grant
    Filed: February 5, 2015
    Date of Patent: February 18, 2020
    Assignee: FUJI CORPORATION
    Inventors: Yusuke Tsuchiya, Tatsuya Takasu, Akira Furuichi
  • Patent number: 10350869
    Abstract: The present disclosure discloses a fingerprint identification module and a method for manufacturing the same, and relates to the field of fingerprint identification technologies. The fingerprint identification module is obtained by dicing a board-level module, and includes a fingerprint identification chip, a filling material, a color coating and a cover. The color coating is disposed between the filling material and the cover, and the fingerprint identification chip is inversely attached in a hollow area of the filling material in a vacuum environment. The fingerprint identification module has a simple structure and is easy to manufacture. By using the method, the bubbles between the fingerprint identification chip and the cover are effectively eliminated, and the manufacture efficiency of the fingerprint identification module is improved.
    Type: Grant
    Filed: August 11, 2017
    Date of Patent: July 16, 2019
    Assignee: SHENZHEN GOODIX TECHNOLOGY CO., LTD.
    Inventors: Baoquan Wu, Wei Long
  • Patent number: 10101672
    Abstract: A device for treating a disc-shaped substrate is disclosed, comprising a support which has a support face for the disc-shaped substrate and a support adapter which can be coupled to the support and can support a mask used for treating the disc-shaped substrate, wherein an interface is provided which detects the coupling of the support adapter to the support and wherein a control system is provided which cooperates with the interface and detects whether the support adapter is coupled to the support, in particular whether the interface is occupied. A support adapter for use in a device of this type is further disclosed.
    Type: Grant
    Filed: May 27, 2016
    Date of Patent: October 16, 2018
    Assignee: SUSS MICROTEC LITHOGRAPHY GMBH
    Inventors: Sven Hansen, Henrik Petry
  • Patent number: 9957116
    Abstract: A system for providing vacuum to a moving element of a transport system, the system includes: a vacuum chamber on the moving element for storing vacuum; a vacuum source; a vacuum inlet provided on the vacuum chamber and for connection to the vacuum source; and a vacuum outlet in communication with the vacuum chamber and positioned on the moving element. The vacuum source may be provided on and travel with the moving element or on the transport system and periodically engage with the vacuum chamber. Where the vacuum source is provided on the moving element, a vacuum chamber may not be required. Further, the vacuum source may be driven by electrical energy and/or mechanical energy in various configurations.
    Type: Grant
    Filed: August 23, 2016
    Date of Patent: May 1, 2018
    Assignee: ATS Automation Tooling Systems Inc.
    Inventors: Darragh Staunton, Albert Kleinikkink
  • Patent number: 9960069
    Abstract: A joining device for joining substrates together includes a first holding member configured to vacuum-suck a first substrate to draw and hold the first substrate on a lower surface thereof, and a second holding member disposed below the first holding member and configured to vacuum-suck a second substrate to draw and hold the second substrate on an upper surface thereof. The second holding member includes a body portion formed into a size larger than the second substrate when seen in a plan view and configured to vacuum-suck the second substrate, a plurality of pins provided on the body portion and configured to make contact with a rear surface of the second substrate, and an outer wall portion annularly provided on the body portion at an outer side of the plurality of pins and configured to support an outer periphery portion of the rear surface of the second substrate.
    Type: Grant
    Filed: January 24, 2014
    Date of Patent: May 1, 2018
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Shintaro Sugihara, Naoto Yoshitaka, Shigenori Kitahara, Keizo Hirose
  • Patent number: 9922859
    Abstract: A joining device for joining substrates together includes a first holding member configured to vacuum-suck a first substrate to draw and hold the first substrate on a lower surface thereof, and a second holding member disposed below the first holding member and configured to vacuum-suck a second substrate to draw and hold the second substrate on an upper surface thereof. The second holding member includes a body portion formed into a size larger than the second substrate when seen in a plan view and configured to vacuum-suck the second substrate, a plurality of pins provided on the body portion and configured to make contact with a rear surface of the second substrate, and an outer wall portion annularly provided on the body portion at an outer side of the plurality of pins and configured to support an outer periphery portion of the rear surface of the second substrate.
    Type: Grant
    Filed: January 24, 2014
    Date of Patent: March 20, 2018
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Shintaro Sugihara, Naoto Yoshitaka, Shigenori Kitahara, Keizo Hirose
  • Patent number: 9835957
    Abstract: A support table to support a surface of a substrate, wherein the support table includes: a base surface substantially parallel to the surface of the substrate, a plurality of burls protruding above the base surface, each of the burls having a respective distal end and a first height above the base surface, the burls arranged such that, when the substrate is supported by the support table, the substrate is supported by the respective distal ends, and a plurality of elongate raised protrusions separated by gaps, each of the elongate raised protrusions having a second height above the base surface, wherein the elongate raised protrusions protrude above the base surface between the burls, and the second height is less than the first height; wherein the protrusions are arranged such that a plurality of the gaps are aligned to form a straight gas flow path towards an edge of the base surface.
    Type: Grant
    Filed: September 2, 2014
    Date of Patent: December 5, 2017
    Assignee: ASML NETHERLANDS B.V.
    Inventors: Martijn Houben, Alwin De Kock, Hendrikus Johannes Marinus Van Abeelen, Marco Adrianus Peter Van Den Heuvel
  • Patent number: 9630269
    Abstract: A mechanism to attach a die to a substrate and method of use are disclosed. The vacuum carrier includes a frame composed of material compatible with solder reflow process. The vacuum carrier further includes a vacuum port extending from a top surface to an underside surface of the frame. The vacuum carrier further includes a seal mechanism provided about a perimeter on the underside surface of the frame of the vacuum carrier. The frame and seal mechanism are structured to maintain a flatness of a die attached to the vacuum carrier by a vacuum source during the solder reflow process.
    Type: Grant
    Filed: October 30, 2013
    Date of Patent: April 25, 2017
    Assignee: GLOBALFOUNDRIES INC.
    Inventors: Vijayeshwar D. Khanna, Mohammed S. Shaikh
  • Patent number: 9618778
    Abstract: A vacuum cell-assembly device, for cell-assembly of an upper substrate and a lower substrate of a display panel, includes an upper machine table, a lower machine table, a control circuit and a dynamic sensing and regulating structure. The dynamic sensing and regulating structure is fixed on the upper machine table and comprises a plurality of sub-structures. Each sub-structure comprises a flatness adjustment layer, a piezoelectric induction layer and a surface adsorption layer. Further disclosed are a cell-assembly method and a device for manufacturing a display panel. The device can improve cell-assembly accuracy and cell-assembly quality.
    Type: Grant
    Filed: November 19, 2013
    Date of Patent: April 11, 2017
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., HEFEI BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventor: Yangkun Jing
  • Patent number: 9575419
    Abstract: A support table for a lithographic apparatus, the support table having a support section and a conditioning system, wherein the support section, the conditioning system, or both, is configured such that heat transfer to or from a substrate supported on the support table, resulting from the operation of the conditioning system, is greater in a region of the substrate adjacent an edge of the substrate than it is in a region of the substrate that is at the center of the substrate.
    Type: Grant
    Filed: February 27, 2015
    Date of Patent: February 21, 2017
    Assignee: ASML NETHERLANDS B.V.
    Inventors: Johan Gertrudis Cornelis Kunnen, Martijn Houben, Thibault Simon Mathieu Laurent, Hendrikus Johannes Marinus Van Abeelen, Armand Rosa Jozef Dassen, Sander Catharina Reinier Derks
  • Patent number: 9506973
    Abstract: A chuck for testing an integrated circuit includes an upper conductive layer having a lower surface and an upper surface suitable to support a device under test. An upper insulating layer has an upper surface at least in partial face-to-face contact with the lower surface of the upper conductive layer, and a lower surface. A middle conductive layer has an upper surface at least in partial face-to-face contact with the lower surface of the upper insulating layer, and a lower surface.
    Type: Grant
    Filed: April 11, 2011
    Date of Patent: November 29, 2016
    Assignee: Cascade Microtech, Inc.
    Inventors: Michael E. Simmons, Kazuki Negishi, Roy Jensen, Ryan Garrison, Philip Wolf
  • Patent number: 9487344
    Abstract: Provided is a flat carrier provided with holders for separated electronic components, comprising: a flat metal platform with a space recessed therein and an epoxy carrier structure which is arranged form-fittingly in this space and which is provided with holders for the separated electronic components. Also provided is a method for visual inspection of separated electronic components located on such a flat carrier.
    Type: Grant
    Filed: November 3, 2011
    Date of Patent: November 8, 2016
    Assignee: Besi Netherlands B.V.
    Inventors: Johannes Gerhardus Augustinus Zweers, Jurgen Hendrikus Gerhardus Huisstede
  • Patent number: 9422121
    Abstract: A system for providing vacuum to a moving element of a transport system, the system including a vacuum chamber on the moving element for storing vacuum, a vacuum source, and a vacuum inlet provided on the vacuum chamber for connection to the vacuum source. The system further includes a vacuum outlet in communication with the vacuum chamber and positioned on the moving element. The vacuum source may be provided on and travel with the moving element or on the transport system and periodically engage with the vacuum chamber. Where the vacuum source is provided on the moving element, a vacuum chamber may not be required. Further, the vacuum source may be driven by electrical energy and/or mechanical energy in various configurations.
    Type: Grant
    Filed: October 1, 2012
    Date of Patent: August 23, 2016
    Assignee: ATS AUTOMATION TOOLING SYSTEMS INC.
    Inventors: Darragh Staunton, Albert Kleinikkink
  • Patent number: 9102005
    Abstract: A laser processing method which can prevent an object to be processed from being cut along a line to cut from a modified region acting as a cutting start point when separating a suction table and a holding member from each other is provided. An expandable tape 23 holding an object to be processed 1 while being stuck to a frame 51 is secured by suction onto a suction table 52 of a vacuum chuck with a porous sheet 53 interposed therebetween. Since the sheet 53 has a Young's modulus lower than that of the table 52, the tape 23 is restrained from biting into fine pores of the sheet 53. As a consequence, even when the table 52 and tape 23 are separated from each other by releasing the suction securing after forming a modified region 7, no strong bending stress acts on the object 1. This can prevent the object 1 from being cut along a line to cut from the modified region 7 acting as a cutting start point when separating the table 52 and tape 23 from each other.
    Type: Grant
    Filed: November 16, 2006
    Date of Patent: August 11, 2015
    Assignee: HAMAMATSU PHOTONICS K.K.
    Inventors: Kenichi Muramatsu, Takeshi Sakamoto
  • Patent number: 9022392
    Abstract: An apparatus of semiconductor process including a chuck and a vacuum source is provided. The chuck has a plurality of holes for holding a semiconductor substrate, and the vacuum source is used for providing vacuum suction through the holes to make the semiconductor substrate be subjected to varied suction intensities according to a warpage level thereof.
    Type: Grant
    Filed: August 31, 2012
    Date of Patent: May 5, 2015
    Assignee: United Microelectronics Corporation
    Inventors: Chung-Sung Jang, Ming-Tse Lin, Yung-Chang Lin
  • Patent number: 9004497
    Abstract: In a device for machining, in particular etching and/or developing, substrates, in particular wafers, in particular etching and/or developing, having a turntable, the turntable has a Venturi gap.
    Type: Grant
    Filed: November 30, 2012
    Date of Patent: April 14, 2015
    Assignee: solar-semi GmbH
    Inventor: Pirmin Muffler
  • Publication number: 20150069723
    Abstract: A vacuum chuck is disclosed for holding and positioning wafers more stably and securely. The vacuum chuck includes a supporting assembly having a receiving groove and at least one first vacuum aperture defined in the receiving groove. A seal unit includes a seal ring bulging to form a vacuum trough. The seal ring is fixed in the receiving groove of the supporting assembly and has at least one second vacuum aperture communicating with the first vacuum aperture. A chuck connector fastened with the supporting assembly has at least one vacuum port and at least one vacuum orifice communicating with the vacuum port. At least one vacuum hose connects the first vacuum aperture, the second vacuum aperture with the vacuum orifice and the vacuum port of the chuck connector for evacuating the air of the vacuum trough to hold and position the wafer on the seal ring and the supporting assembly.
    Type: Application
    Filed: March 28, 2012
    Publication date: March 12, 2015
    Applicant: ACM Research (Shanghai) Inc,.
    Inventors: Jian Wang, Yinuo Jin, Yong Shao, Hui Wang
  • Patent number: 8960686
    Abstract: An apparatus, particularly a chuck for retaining a thin part for micro-machining processing, is disclosed. The chuck is formed of a plate-shaped body having a first surface and a second surface opposite the first surface. The plate-shaped body includes a light-transmissive material, and at least one of the first surface or the second surface is a roughened surface. The chuck can be incorporated into a micro-machining system using a chuck support that allows light through to backlight a processed part for inspection.
    Type: Grant
    Filed: September 30, 2011
    Date of Patent: February 24, 2015
    Assignee: Electro Scientific Industries, Inc.
    Inventor: Robert A. Ferguson
  • Publication number: 20140319784
    Abstract: A wafer chuck holds a wafer on a surface thereof such that an image of the wafer can be formed from light reflected by the surface of the wafer chuck. The surface of the wafer chuck is a planar surface that has a reflectivity equal to or greater than 40%, and/or a whiteness index value equal to or greater than 90. The wafer chuck can include a ceramic containing aluminum oxide having a purity equal to or greater than 95%. The planar surface of the wafer chuck is such that light illuminating the surface of the wafer chuck is reflected by the surface of the wafer chuck through the wafer. The wafer chuck can be used with an apparatus for cutting the wafer, and the light reflected by the surface can be used to form an image of the wafer used identifying cutting lines on the wafer.
    Type: Application
    Filed: October 4, 2013
    Publication date: October 30, 2014
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hwa Seob CHOI, Yu Sung JANG, Tai Young EUM, Jee Ho LEE
  • Publication number: 20140312094
    Abstract: A substrate holder assembly for use in a controlled spalling process is provided. The substrate holder assembly includes a base structure having a surface in which a base substrate or other work piece can be placed thereupon. A framing element is located above and spaced apart from the surface of the base structure. The framing element has a window which exposes an upper surface of the base substrate and defines an area of the upper surface of the base substrate in which another material can be applied thereto. A support structure containing at least one mechanical securing element is located on the framing element. The support structure mechanically constrains the base substrate within the substrate holder assembly. Each mechanical securing element contacts at least one surface of the support structure and, optionally, one surface of the base substrate.
    Type: Application
    Filed: April 22, 2013
    Publication date: October 23, 2014
    Applicant: International Business Machines Corporation
    Inventors: Stephen W. Bedell, Keith E. Fogel, Paul A. Lauro, Devendra K. Sadana
  • Publication number: 20140312576
    Abstract: A substrate holder assembly for use in a controlled spalling process is provided. The substrate holder assembly includes a base structure having a surface in which a base substrate or other work piece can be placed thereupon. A framing element is located above and spaced apart from the surface of the base structure. The framing element has a window which exposes an upper surface of the base substrate and defines an area of the upper surface of the base substrate in which another material can be applied thereto. A support structure containing at least one mechanical securing element is located on the framing element. The support structure mechanically constrains the base substrate within the substrate holder assembly. Each mechanical securing element contacts at least one surface of the support structure and, optionally, one surface of the base substrate.
    Type: Application
    Filed: September 12, 2013
    Publication date: October 23, 2014
    Applicant: International Business Machines Corporation
    Inventors: Stephen W. Bedell, Keith E. Fogel, Paul A. Lauro, Devendra K. Sadana
  • Publication number: 20140225335
    Abstract: According to one embodiment, a substrate treatment apparatus includes a substrate holding unit including a holding unit configured to hold a target substrate, a base unit which has the holding unit on a peripheral portion thereof, and a hollow rotation shaft, which contains a gas supply channel, configured to rotate together with the holding unit and the base unit, the substrate holding unit configured to hold the target substrate by supplying to the target substrate gas supplied from the gas supply channel, a substrate rotating unit, which is connected to the rotation shaft through a belt, configured to rotate the substrate holding unit, and a first substrate holding detecting unit, which is connected to the substrate rotating unit, configured to detect whether or not the target substrate is held by the substrate holding unit, by measuring a rotational frequency or a roll acceleration of the rotating substrate holding unit.
    Type: Application
    Filed: September 9, 2013
    Publication date: August 14, 2014
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventor: Takehisa KURASHIMA
  • Patent number: 8800998
    Abstract: A semiconductor wafer processing tool has a support structure for a coarse motion positioning system. A measurement head having a rigid super structure is supported from the support structure by vibration isolators and a top plate is mounted to the super structure. A vacuum transfer chuck is releasably carried by the coarse motion positioning system and releasably adherable to the top plate by application of vacuum. The vacuum transfer chuck supports a semiconductor wafer.
    Type: Grant
    Filed: December 30, 2011
    Date of Patent: August 12, 2014
    Assignee: Multiprobe, Inc.
    Inventors: Andrew N. Erickson, Jeffrey M. Markakis, Anton L. Riley
  • Publication number: 20140191478
    Abstract: A device (1) for holding a planar substrate (4), in particular for a wafer or an eWLB, is shown, with a support (2) which forms a supporting surface (3) for the substrate (2) and has at least one recess (5) provided in the region of the supporting surface (3) for the substrate (2), and with at least one holding means which is connected in terms of flow to said recess (6) and is intended for fixing the substrate (2) on the device (1) with the aid of a vacuum generated between the support (2) and substrate (4). In order to be able to grip a multiplicity of substrates of geometrically differing profile, it is proposed that the support (2) has at least one recess (6) with an elastic seal (7) which is designed to be movable from a position (9) protruding over the edge (8) of the recess (6) into a position (10) pulled back in relation to the edge (8) of the recess (6) or at most corresponding to said edge and which interacts with the recess (5) for sucking the full area of the substrate (4) onto the support (2).
    Type: Application
    Filed: July 2, 2012
    Publication date: July 10, 2014
    Applicant: MECHATRONIC SYSTEMTECHNIK GMBH
    Inventor: Alexander Oremus
  • Publication number: 20140189998
    Abstract: Provided are a chucking device having low dusting characteristics and high detergent properties and capable of vacuum-sucking even a substrate having a large warpage, and a chucking method using the same. A chucking device according to an aspect of the present invention vacuum-sucks and holds a wafer. The chucking device includes: a perforated plate having a plurality of through-holes and being mounted with a wafer, the through-holes penetrating through both sides of the perforated plate; a porous plate that supports a surface other than a mounting surface of the perforated plate, on which the wafer is mounted, transmits a vacuum state to the wafer through the plurality of through-holes, and has a pore to limit a flow rate; and a vacuum pump that exhausts an air through the pore of the porous plate.
    Type: Application
    Filed: January 6, 2014
    Publication date: July 10, 2014
    Applicant: Lasertec Corporation
    Inventor: Haruhiko KUSUNOSE
  • Publication number: 20140166050
    Abstract: Chucks for mounting and retaining semiconductor wafers during processing are described, particularly suited for wafer processing involving total immersion of the wafer-chuck structure in a liquid. Chuck structures are disclosed for preventing or hindering processing chemicals from contacting and contaminating large portions of the underside of the wafer undergoing processing, limiting such chemical contact to readily cleaned, relatively small annular regions on the periphery of the wafer. Embodiments include structures with supplemental gas flows on the underside of the wafer as well as the creation of gas/liquid meniscusci to prevent chemical penetration of the wafer's underside. Methods of processing semiconductor wafers employing such chucks are also described.
    Type: Application
    Filed: December 18, 2012
    Publication date: June 19, 2014
    Applicant: INTERMOLECULAR, INC.
    Inventors: Rajesh Kelekar, Glen Eric Egami, Aaron T. Francis
  • Publication number: 20140159321
    Abstract: This invention relates to a mounting apparatus for mounting and supporting one structure side of a substrate, which structure side has structures thereon. The apparatus having a mounting element with a flat mounting surface for supporting the structures and a suction surface F2 which penetrates the mounting surface solely in an outer ring surface for effecting a fluid flow which produces suctions on the substrate.
    Type: Application
    Filed: August 12, 2011
    Publication date: June 12, 2014
    Inventors: Werner Thallner, Daniel Burgstaller
  • Patent number: 8740514
    Abstract: An apparatus for drilling holes in a glass plate has a supporting member for sucking and supporting a glass plate which is used for an automobile window or the like, as described later, and the supporting member is comprised of a suction pad for sucking the glass plate and a pair of supports for supporting the glass plate on an outer side of the suction pad. The supports are detachably mounted on the outer side of the suction pad, and the supporting member is adapted to rotate about the suction pad in an R direction. The apparatus for drilling holes in a glass plate further includes a hole forming means for forming in the glass plate holes shown in FIG. 7; a supporting means having the supporting member and for supporting the glass plate in which the holes are to be formed by the hole forming means; and a transporting means for transporting onto the supporting means the glass plate in which the holes are to be formed.
    Type: Grant
    Filed: April 27, 2011
    Date of Patent: June 3, 2014
    Assignee: Bando Kiko Co., Ltd.
    Inventor: Kazuaki Bando
  • Publication number: 20140109941
    Abstract: A holding device including a first sucking section for sucking a wafer (substrate) from a side on which a dicing tape (supporting film) is adhered; a structure that supports a dicing frame (frame part) and covers a first region which (i) is on a surface of the dicing tape to which surface the wafer is not adhered and (ii) is between the wafer and the dicing frame; and a second sucking section for sealing a boundary between the structure and at least one of the dicing frame and the first region.
    Type: Application
    Filed: May 25, 2012
    Publication date: April 24, 2014
    Applicant: TOKYO OHKA KOGYO CO., LTD.
    Inventor: Atsushi Miyanari
  • Patent number: 8695990
    Abstract: An apparatus and method for securing a substantially circular wafer uses a chuck having a plurality of tensioning grooves each having at least one arcuate bend having a bend radius substantially less than an outer region radius, and a vacuum source interconnected with each of the grooves. When the wafer is placed upon the surface concentric with the chuck center and the vacuum source applied to the grooves, the wafer is held securely to the surface without distortion.
    Type: Grant
    Filed: April 1, 2011
    Date of Patent: April 15, 2014
    Assignee: Nidec-Read Corporation
    Inventors: Bojko Vodanovic, Jakov Kogan, Marc Lévesque, Alexandr Filenkov
  • Patent number: 8698099
    Abstract: A chucking member for holding a target is removably mounted on a chucking stage with a plurality of vacuum holes. the chucking member has a substrate removably mounted on the chucking stage. The substrate has a vacuum region in which the target being to be arranged, the vacuum region allowing gas to be vacuumed through a part of the plurality of the vacuum holes, and a vacuum inhibition region provided around the vacuum region, the vacuum inhibition region covering the other of the vacuum holes to inhibit the gas from being vacuumed through the other of the vacuum holes.
    Type: Grant
    Filed: September 30, 2010
    Date of Patent: April 15, 2014
    Assignee: Kyocera Corporation
    Inventor: Tetsuya Inoue
  • Publication number: 20140091537
    Abstract: A chuck table holds a workpiece having a warp. The chuck table includes a suction holding member having a suction holding surface for holding the workpiece under suction, and an annular seal member provided around the outer circumference of the suction holding member for supporting a peripheral portion of the workpiece. The annular seal member is formed from an elastic member. The upper surface of the annular seal member is set higher in level than the suction holding surface according to the warp of the workpiece. In holding the workpiece on the chuck table under suction, vacuum leaking from the gap between the workpiece and the suction holding surface due to the warp of the workpiece is applied to the space defined by the workpiece and the annular seal member, thereby elastically deforming the annular seal member to flatten the upper surface of the workpiece.
    Type: Application
    Filed: September 30, 2013
    Publication date: April 3, 2014
    Applicant: Disco Corporation
    Inventors: Kentaro Iizuka, Masato Terajima
  • Publication number: 20140065553
    Abstract: An apparatus of semiconductor process including a chuck and a vacuum source is provided. The chuck has a plurality of holes for holding a semiconductor substrate, and the vacuum source is used for providing vacuum suction through the holes to make the semiconductor substrate be subjected to varied suction intensities according to a warpage level thereof.
    Type: Application
    Filed: August 31, 2012
    Publication date: March 6, 2014
    Applicant: UNITED MICROELECTRONICS CORPORATION
    Inventors: Chung-Sung JANG, Ming-Tse LIN, Yung-Chang LIN
  • Publication number: 20140042715
    Abstract: A chuck includes a number of gas openings positioned to provide a gas flow to a backside of a wafer secured to the chuck. The chuck also includes a number of exhaust openings positioned to exhaust the gas at a distance from a topside edge of the wafer such that adverse thermal effects on the edge are reduced to a predetermined level.
    Type: Application
    Filed: August 8, 2012
    Publication date: February 13, 2014
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chia-Hao Hsu, Kipling Yeh, Chia-Ching Huang
  • Publication number: 20140037413
    Abstract: Provided is a suction chuck that is lightweight and that sucks and releases a thin plate workpiece in such a manner that the thin plate workpiece is not in contact with an edge of the chuck. A suction chuck according to an embodiment of the present invention includes a main body having a flat plate shape, and an opposing surface. Compressed air passages are formed within the main body. The opposing surface is a surface of the main body at the side facing the workpiece. The opposing surface has a plurality of recesses formed therein. The plurality of recesses serve as a sucking element for generating a negative pressure by ejecting the compressed air. The opposing surface is formed with a shape similar to the shape of the workpiece (or with a shape that corresponds to the shape of the workpiece being offset outward) such that the shape of the opposing surface is able to completely cover the shape of the workpiece when seen along a direction perpendicular to the opposing surface.
    Type: Application
    Filed: February 23, 2012
    Publication date: February 6, 2014
    Applicant: MURATA MACHINERY, LTD.
    Inventors: Hiroki Takashima, Hideaki Nakanishi
  • Patent number: 8624621
    Abstract: In an embodiment, a chuck to support a solar cell in hot spot testing is provided. This embodiment of the chuck comprises a base portion and a support portion disposed above the base portion. The support portion is configured to support the solar cell above the base portion and to define a cavity between a bottom surface of the solar cell and the base portion that thermally separates a portion of the bottom surface of the solar cell from the base portion.
    Type: Grant
    Filed: July 15, 2013
    Date of Patent: January 7, 2014
    Assignee: SunPower Corporation
    Inventors: Jose Francisco Capulong, Emmanuel Abas
  • Publication number: 20130264780
    Abstract: In accordance with some embodiments of the present disclosure, a substrate holding apparatus is provided. The substrate holding apparatus includes a first holding part, a second holding part and a controller. The first holding part adsorbs and holds a first region including a central portion of a substrate. The second holding part adsorbs and holds a second region located outside the first region of the substrate. The second holding part adsorbs and holds the second region of the substrate after the first holding part adsorbs and holds the first region of the substrate.
    Type: Application
    Filed: April 3, 2013
    Publication date: October 10, 2013
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Yasuharu IWASHITA, Osamu HIRAKAWA, Eiji MANABE, Takeshi TAMURA, Akira FUKUTOMI
  • Patent number: 8550470
    Abstract: Provided is a positioning apparatus including: a reference member that is serving as a reference for positioning; a support part that supports the reference member; and a first fixing member provided on the support part that fixes the reference member and the support part or releases the fixing. The reference member is connected to the support part in a movable state and fixed to the support part by the first fixing member after a position is determined. The reference member of the positioning apparatus is precisely installed to a reference position.
    Type: Grant
    Filed: May 10, 2011
    Date of Patent: October 8, 2013
    Assignee: Tokyo Electron Limited
    Inventors: Yoshifumi Amano, Satoshi Kaneko
  • Patent number: 8519729
    Abstract: In an embodiment, a chuck to support a solar cell in hot spot testing is provided. This embodiment of the chuck comprises a base portion and a support portion disposed above the base portion. The support portion is configured to support the solar cell above the base portion and to define a space between a bottom surface of the solar cell and the base portion that thermally separates a portion of the bottom surface of the solar cell from the base portion.
    Type: Grant
    Filed: February 10, 2010
    Date of Patent: August 27, 2013
    Assignee: SunPower Corporation
    Inventors: Jose Francisco Capulong, Emmanuel Abas
  • Publication number: 20130168929
    Abstract: A semiconductor wafer processing tool has a support structure for a coarse motion positioning system. A measurement head having a rigid super structure is supported from the support structure by vibration isolators and a top plate is mounted to the super structure. A vacuum transfer chuck is releasably carried by the coarse motion positioning system and releasably adherable to the top plate by application of vacuum. The vacuum transfer chuck supports a semiconductor wafer.
    Type: Application
    Filed: December 30, 2011
    Publication date: July 4, 2013
    Applicant: MULTIPROBE, INC.
    Inventors: Andrew N. Erickson, Jeffrey M. Markakis, Anton Riley
  • Publication number: 20130156947
    Abstract: The present disclosure relates to a wafer chuck configured to provide a uniform photoresist layer on a workpiece. In some embodiments, the wafer chuck comprises a plurality of vacuum holes. The plurality of vacuum holes (i.e., more than one) are in fluid communication with a cavity that continuously extends along the top surface between the vacuum holes. A vacuum source, connected to each vacuum hole, is configured to remove gas molecules from the cavity located below the workpiece leaving behind a low pressure vacuum. The use of a plurality of vacuum holes increase the uniformity of the vacuum, thereby preventing the formation of high vacuum areas in close proximity to any specific vacuum hole. The reduction of high vacuum areas reduces wafer bending associated with the high vacuum areas.
    Type: Application
    Filed: December 16, 2011
    Publication date: June 20, 2013
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Wei-Hsiang Tseng, Jui-Chun Peng, Kai-Fa Ho, Ho-Ping Chen, Chia-Yun Lee
  • Publication number: 20130147129
    Abstract: A wafer supporting structure for improving the critical dimension uniformity of a wafer, including: a chuck, a plurality of pin holes, and a platform positioned under the chuck. The chick has a surface and configured to receive a wafer thereon, the plurality of pin holes form through the chuck, and the platform comprises a plurality of movable pieces which support corresponding pins, wherein the pins are configured to move in a direction perpendicularly protruding from or sinking into the surface of the chuck. The movable piece has one end supporting the bottom of the pin and the other end subjected to an pneumatic pressure, hydraulic pressure, or piezoelectricity.
    Type: Application
    Filed: December 8, 2011
    Publication date: June 13, 2013
    Applicant: NAN YA TECHNOLOGY CORPORATION
    Inventor: Chui Fu Chiu
  • Publication number: 20130140274
    Abstract: In a device for machining, in particular etching and/or developing, substrates, in particular wafers, in particular etching and/or developing, having a turntable, the turntable has a Venturi gap.
    Type: Application
    Filed: November 30, 2012
    Publication date: June 6, 2013
    Applicant: SOLAR-SEMI GMBH
    Inventor: Solar-semi GmbH
  • Publication number: 20130082448
    Abstract: An apparatus, particularly a chuck for retaining a thin part for micro-machining processing, is disclosed. The chuck is formed of a plate-shaped body having a first surface and a second surface opposite the first surface. The plate-shaped body includes a light-transmissive material, and at least one of the first surface or the second surface is a roughened surface. The chuck can be incorporated into a micro-machining system using a chuck support that allows light through to backlight a processed part for inspection.
    Type: Application
    Filed: September 30, 2011
    Publication date: April 4, 2013
    Applicant: ELECTRO SCIENTIFIC INDUSTRIES, INC.
    Inventor: Robert A. Ferguson
  • Publication number: 20130075982
    Abstract: A chuck for testing an integrated circuit includes an upper conductive layer having a lower surface and an upper surface suitable to support a device under test. An upper insulating layer has an upper surface at least in partial face-to-face contact with the lower surface of the upper conductive layer, and a lower surface. A middle conductive layer has an upper surface at least in partial face-to-face contact with the lower surface of the upper insulating layer, and a lower surface.
    Type: Application
    Filed: April 11, 2011
    Publication date: March 28, 2013
    Applicant: Cascade Microtech, Inc
    Inventors: Michael E. Simmons, Kazuki Negishi, Roy Jensen, Ryan Garrison, Philip Wolf
  • Publication number: 20130038866
    Abstract: The present invention is directed to a high speed, spinning chuck for use in a semiconductor wafer inspection system. The chuck of the present disclosure is configured with a turbulence-reducing lip. Spinning of the chuck produces radial airflows proximal to a surface of the wafer and proximal to the bottom of the chuck. The turbulence-reducing lip of the chuck of the present disclosure directs the radial airflows off of the top surface of the wafer and the bottom surface of the chuck in a manner that minimizes the size of the low pressure zone formed between these radial airflows. The minimization of the low pressure zone reduces air turbulence about the periphery of the chuck and substrate, thereby reducing the possibility of contaminants in the system being directed onto the surface of the substrate by such air turbulence.
    Type: Application
    Filed: August 2, 2012
    Publication date: February 14, 2013
    Applicant: KLA-TENCOR CORPORATION
    Inventors: George J. Kren, Paul Doyle, Alexander Belyaev