Abstract: A semiconductor wafer processing tool has a support structure for a coarse motion positioning system. A measurement head having a rigid super structure is supported from the support structure by vibration isolators and a top plate is mounted to the super structure. A vacuum transfer chuck is releasably carried by the coarse motion positioning system and releasably adherable to the top plate by application of vacuum. The vacuum transfer chuck supports a semiconductor wafer.

Abstract: The present disclosure relates to a wafer chuck configured to provide a uniform photoresist layer on a workpiece. In some embodiments, the wafer chuck comprises a plurality of vacuum holes. The plurality of vacuum holes (i.e., more than one) are in fluid communication with a cavity that continuously extends along the top surface between the vacuum holes. A vacuum source, connected to each vacuum hole, is configured to remove gas molecules from the cavity located below the workpiece leaving behind a low pressure vacuum. The use of a plurality of vacuum holes increase the uniformity of the vacuum, thereby preventing the formation of high vacuum areas in close proximity to any specific vacuum hole. The reduction of high vacuum areas reduces wafer bending associated with the high vacuum areas.

Abstract: A wafer supporting structure for improving the critical dimension uniformity of a wafer, including: a chuck, a plurality of pin holes, and a platform positioned under the chuck. The chick has a surface and configured to receive a wafer thereon, the plurality of pin holes form through the chuck, and the platform comprises a plurality of movable pieces which support corresponding pins, wherein the pins are configured to move in a direction perpendicularly protruding from or sinking into the surface of the chuck. The movable piece has one end supporting the bottom of the pin and the other end subjected to an pneumatic pressure, hydraulic pressure, or piezoelectricity.

Abstract: In a device for machining, in particular etching and/or developing, substrates, in particular wafers, in particular etching and/or developing, having a turntable, the turntable has a Venturi gap.

Abstract: An apparatus, particularly a chuck for retaining a thin part for micro-machining processing, is disclosed. The chuck is formed of a plate-shaped body having a first surface and a second surface opposite the first surface. The plate-shaped body includes a light-transmissive material, and at least one of the first surface or the second surface is a roughened surface. The chuck can be incorporated into a micro-machining system using a chuck support that allows light through to backlight a processed part for inspection.

Abstract: A chuck for testing an integrated circuit includes an upper conductive layer having a lower surface and an upper surface suitable to support a device under test. An upper insulating layer has an upper surface at least in partial face-to-face contact with the lower surface of the upper conductive layer, and a lower surface. A middle conductive layer has an upper surface at least in partial face-to-face contact with the lower surface of the upper insulating layer, and a lower surface.

Abstract: The present invention is directed to a high speed, spinning chuck for use in a semiconductor wafer inspection system. The chuck of the present disclosure is configured with a turbulence-reducing lip. Spinning of the chuck produces radial airflows proximal to a surface of the wafer and proximal to the bottom of the chuck. The turbulence-reducing lip of the chuck of the present disclosure directs the radial airflows off of the top surface of the wafer and the bottom surface of the chuck in a manner that minimizes the size of the low pressure zone formed between these radial airflows. The minimization of the low pressure zone reduces air turbulence about the periphery of the chuck and substrate, thereby reducing the possibility of contaminants in the system being directed onto the surface of the substrate by such air turbulence.

Abstract: Methods and systems, in one embodiment, are described related to a chuck with a plurality of vacuum grooves on a surface. Each single vacuum groove of the plurality of vacuum grooves has a single port connected with a single vacuum line coupled to a vacuum source. The single vacuum line is not shared with another groove and a restriction is applied to the single vacuum line in order to isolate each single vacuum groove.

Abstract: Apparatuses of manufacturing semiconductor packages are provided. An apparatus includes a chuck having a body, a porous plate disposed on the body, and a buffer pad disposed on the plate to provide a place on which a plurality of chips are loaded. The buffer pad has elasticity greater than the plate. The apparatus also includes a vacuum part supplying vacuum to the chuck so that the plurality of chips are sucked onto the buffer pad. Methods of manufacturing semiconductor packages using the apparatus are also provided.

Abstract: An operating valve of the present invention is a differential pressure operating valve 100 for performing a vacuum suction of a substrate, the operating valve comprises a body 4 having an opening which is provided at an exhaust side for exhausting an air from an inside to an outside and is opposed to a suction side for sucking the air from the outside to the inside, a valve 8, and a spring 9 whose one end is connected with one of the suction side and the exhaust side of the body 4 and the other end is connected with the valve 8. The spring 9 is configured to stretch or compress in accordance with a differential pressure between the suction side and the exhaust side, and the valve 8 is provided with at least one hole.

Abstract: A support substrate or chuck 20 supports wafer die 11 during and after dicing of a wafer 10. The support substrate comprises an array of islands 21, upper faces of which are raised above a major face of the support substrate for alignment with an array of dies on, or singulated from, the wafer. Spacing between the islands is not less than a kerf of a laser, or a width of a blade, used to dice the wafer. For laser dicing the upper faces of the islands are a sufficient height above the major face that energy of a laser beam 30 used to dice the wafer is dissipated in channels between the islands without substantially machining the support substrate.

Abstract: A vacuum chuck and a process chamber equipped with the same are provided. The vacuum chuck assembly comprises a support body, a plurality of protrusions, a plurality of channels, at least one support member supporting the support body, at least one resilient member coupled with the support member, a hollow shaft supporting the support body, at least one electrical connector disposed through the hollow shaft, and an air-cooling apparatus. The support body has a support surface for holding a substrate (such as a wafer) thereon. The protrusions are formed on and project from the support surface for creating a gap between the substrate and the support surface. The channels are formed on the support surface for generating reduced pressure in the gap. The air-cooling apparatus is used for providing air cooling in the vicinity of the electrical connector.

Abstract: The present invention is directed to an apparatus and method of forming a thermos layer surrounding a chuck for holding a wafer during ion implantation. The thermos layer is located below a clamping surface, and comprises a vacuum gap and an outer casing encapsulating the vacuum gap. The thermos layer provides a barrier blocking condensation to the outside of the chuck within a process chamber by substantially preventing heat transfer between the chuck when it is cooled and the warmer environment within the process chamber.

Abstract: A chuck with triaxial construction comprises a receiving surface for a test substrate and arranged below the receiving surface: an electrically conductive first surface element, an electrically conductive second surface element electrically insulated therefrom, and an electrically conductive third surface element electrically insulated therefrom, and, between the first and the second surface element, a first insulation element and, between the second and the third surface element, a second insulation element.

Abstract: In the present invention, a ceramic vacuum chuck 2 having an upper surface for adsorbing a substrate is formed from a colored ceramic sintered body comprising 55-75% by weight alumina (Al2O3), at least 3% by weight Si in terms of oxide (SiO2), at least 0.4% by weight Ca in terms of oxide (CaO), at least 0.4% by weight Mg in terms of oxide (MgO), coloring agent, and 1% or less of impurities. A plurality of pins 4 for supporting the substrate, and a rim 6 are formed on the upper surface by shot blasting using abrasive grains, and the whole of the upper surface is shot peened using spherical particles.

Abstract: A coating apparatus includes a driving unit configured to rotate a substrate holding member about a vertical axis to spread a coating liquid supplied on a front side central portion of a substrate toward a front side peripheral portion of the substrate by a centrifugal force. The apparatus is provided with a wobble damping mechanism including a gas delivery port and a suction port both disposed to face a back side of the substrate and configured to damp a wobble of the substrate being rotated by delivering a gas from the delivery port and sucking the gas into the suction port.

Abstract: A chucking device is disclosed. The chucking device includes plural protruding portions that support the central portion of a semiconductor substrate and that are provided on a base portion. The chucking device also includes a cylindrical peripheral portion that supports the outer peripheral portion of the semiconductor substrate, plural suction holes that chuck the semiconductor substrate, and a vacuum source that vacuum draws the plural suction holes at differing timings. A plurality of mutually independent vacuum drawable suction holes are provided in at least one portion of the protruding portions.

Abstract: A separating device according to the present invention separates a support plate (14) from a substrate (12) of a laminate (10) including the substrate (12) and the support plate (14) bonded to each other. The separating device includes: a first storing section (20) for storing the laminate (10); a plurality of first processing sections (30) for reducing adhesive force of an adhesive (13) applied between the substrate (12) and the support plate (14); and a first carrying section (50) which is capable of moving in the first direction and carries the laminate (10) from the first storing section (20) to the first processing section (30) while holding the laminate (10). With the first carrying section (50), it is possible to provide a separating device (100) which moves straightly so as to carry the laminate (10).

Abstract: A method for centering a circular optical element using a non-self-centering chuck adapted to grip the element at two grip strengths. The element is rotated in the chuck while measuring the lateral position of the element's outer rim with a probe. The positions of maximum and minimum run-out of the element as a function of its angular position are determined. Chuck rotation is stopped at an angular position with the maximum rim run-out positioned at a predetermined point. The grip of the chuck is reduced such that the element is still held in the chuck but can be moved in a lateral direction without damaging its surface. The element is moved in a direction connecting the predetermined point of maximum run-out and the axis of rotation of the chuck, in order to reduce the run-out of the element. The procedure is repeated until the desired centering is achieved.

Abstract: A workpiece vacuum chuck head, which serves to vacuum-chuck a light, minute workpiece and to release and place the vacuum-chucked workpiece on a workpiece placement surface, includes a base section, a workpiece vacuum chuck section, and a follower mechanism section for connecting together the base section and the workpiece vacuum chuck section. These sections form an integral structure. The base section has an attachment surface for attaching the workpiece vacuum chuck head to a head drive mechanism. The workpiece vacuum chuck section has a workpiece vacuum chuck surface and a negative-pressure chamber, which opens at the workpiece vacuum chuck surface via a suction hole. The follower mechanism section has a structure that is easily elastically deformable, and is appropriately deformed in a three-dimensional space so as to cause the workpiece vacuum chuck surface to follow an inclination of the workpiece placement surface.

Abstract: A substrate holding apparatus includes a base part and a support part that is formed on the base part and supports a rear surface of the substrate. A first circumferential wall is formed on the base part, has a first upper surface that opposes the rear surface of the substrate, which is supported by the support part, and surrounds a first space that is between the substrate, which is supported by the support and the base part. A second circumferential wall is formed on the base part, has a second upper surface that opposes the rear surface of the substrate, which is supported by the support part, with a gap interposed therebetween, and surrounds the first circumferential wall. A third circumferential wall is formed on the base part, has a third upper surface that opposes the rear surface of the substrate, which is supported by the support part; and surrounds the support part and the second circumferential wall.

Abstract: Provided is a positioning apparatus including: a reference member that is serving as a reference for positioning; a support part that supports the reference member; and a first fixing member provided on the support part that fixes the reference member and the support part or releases the fixing. The reference member is connected to the support part in a movable state and fixed to the support part by the first fixing member after a position is determined. The reference member of the positioning apparatus is precisely installed to a reference position.

Abstract: An apparatus and method are disclosed for securing a substantially circular wafer comprising a chuck comprising a plurality of tensioning grooves each comprising at least one arcuate bend having a bend radius substantially less than an outer region radius, and a vacuum source interconnected with each of the grooves. When the wafer is placed upon the surface concentric with the chuck centre and the vacuum source applied to the grooves, the wafer is held securely to the surface. Additionally, there is disclosed an apparatus for securing a wafer comprising a chuck and a collar comprising a rigid support and an o-ring, the o-ring having a diameter slightly smaller than the outer perimeter. When the wafer is lowered onto the surface in a position concentric with the check centre, the collar is placed against the upper surface concentric with the perimeter and the vacuum source is applied securing the wafer to the surface.

Abstract: An improved wafer carrier device for carrying and holding semiconductor wafers that have a thickness of below 100 micrometers includes a transportable wafer chuck having an enclosed vacuum reservoir and a top surface configured to support a wafer. The top surface has one or more through-openings extending from the top surface to the vacuum reservoir and the wafer is held onto the top surface via vacuum from the vacuum reservoir drawn through the through-openings.

Abstract: A chuck for releasably retaining a substrate, where the chuck has a body with a substrate receiving surface disposed in an X-Y coordinate plane and adapted to receive the substrate. The body has gas pressure delivery channels and gas vacuum drawing channels, where the gas pressure delivery channels and gas vacuum drawing channels are mutually exclusive within the body. The substrate receiving surface has gas pressure delivery portions in communication with the gas pressure delivery channels, for delivering a gas pressure against the substrate while the substrate is retained by the chuck, and thereby keeping the substrate from contacting the substrate receiving surface. The substrate receiving surface also has gas vacuum drawing portions in communication with the gas vacuum drawing channels, for drawing a gas vacuum against the substrate while the substrate is retained by the chuck, and thereby retaining the substrate proximate the substrate receiving surface.

Abstract: In a method for releasing a work having an adhesive tape from a holding member which sucks and holds the work having the adhesive tape, the work having the adhesive tape is released from the holding member while supplying a gas which reduces a holding force of the holding member between the holding member and the work having the adhesive tape.

Abstract: A fixture apparatus includes at least one top vacuum chuck and a driving mechanism. The at least one top vacuum chuck is capable of applying negative force to a surface of a top cover of an electronic device. The driving mechanism is connected to the at least one top vacuum chuck. The driving mechanism is capable of driving the top vacuum chuck to disengage the top cover from a bottom cover of the electronic device.

Abstract: A solar cell production system utilizes self-contained vacuum chucks that hold and cool solar cell wafers during transport on a conveyor between processing stations during a fabrication process. Each self-contained vacuum chuck includes its own local vacuum pump and a closed-loop cooling system. After each wafer is processed, it is removed from its vacuum chuck, and the vacuum chuck is returned to the start of the production line by a second conveyor belt. In one embodiment, each vacuum chuck includes an inductive power supply that is inductively coupled to an external source to drive that vacuum chuck's vacuum pump and cooling system. An optional battery is recharged by the inductive power supply, and is used to power the vacuum pump and cooling system during hand-off between adjacent processing stations.

Abstract: An apparatus for drilling holes in a glass plate has a supporting member for sucking and supporting a glass plate which is used for an automobile window or the like, as described later, and the supporting member is comprised of a suction pad for sucking the glass plate and a pair of supports for supporting the glass plate on an outer side of the suction pad. The supports are detachably mounted on the outer side of the suction pad, and the supporting member is adapted to rotate about the suction pad in an R direction. The apparatus for drilling holes in a glass plate further includes a hole forming means for forming in the glass plate holes shown in FIG. 7; a supporting means having the supporting member and for supporting the glass plate in which the holes are to be formed by the hole forming means; and a transporting means for transporting onto the supporting means the glass plate in which the holes are to be formed.

Abstract: An applicator head for a device with an air suction source for applying individual flat materials elements to objects. The applicator head has an applicator surface in air communication with the air suction source and has perforatable, weak locations. The weak locations can be selectively perforated and, when perforated, a weak location can function as a suction intake opening.

Abstract: A chucking member for holding a target is removably mounted on a chucking stage with a plurality of vacuum holes. the chucking member has a substrate removably mounted on the chucking stage. The substrate has a vacuum region in which the target being to be arranged, the vacuum region allowing gas to be vacuumed through a part of the plurality of the vacuum holes, and a vacuum inhibition region provided around the vacuum region, the vacuum inhibition region covering the other of the vacuum holes to inhibit the gas from being vacuumed through the other of the vacuum holes.

Abstract: The invention relates to a vacuum chuck capable of reducing cost and weight by making its structure simple and shortening the clamping time.

Abstract: A workpiece vacuum chuck head, which serves to vacuum-chuck a light, minute workpiece and to release and place the vacuum-chucked workpiece on a workpiece placement surface, includes a base section, a workpiece vacuum chuck section, and a follower mechanism section for connecting together the base section and the workpiece vacuum chuck section. These sections form an integral structure. The base section has an attachment surface for attaching the workpiece vacuum chuck head to a head drive mechanism. The workpiece vacuum chuck section has a workpiece vacuum chuck surface and a negative-pressure chamber, which opens at the workpiece vacuum chuck surface via a suction hole. The follower mechanism section has a structure that is easily elastically deformable, and is appropriately deformed in a three-dimensional space so as to cause the workpiece vacuum chuck surface to follow an inclination of the workpiece placement surface.

Abstract: Methods and systems, in one embodiment, are described related to a chuck with a plurality of vacuum grooves on a surface. Each single vacuum groove of the plurality of vacuum grooves has a single port connected with a single vacuum line coupled to a vacuum source. The single vacuum line is not shared with another groove and a restriction is applied to the single vacuum line in order to isolate each single vacuum groove.

Abstract: A vacuum chuck and a process chamber equipped with the same are provided. The vacuum chuck assembly comprises a support body, a plurality of protrusions, a plurality of channels, at least one support member supporting the support body, at least one resilient member coupled with the support member, a hollow shaft supporting the support body, at least one electrical connector disposed through the hollow shaft, and an air-cooling apparatus. The support body has a support surface for holding a substrate (such as a wafer) thereon. The protrusions are formed on and project from the support surface for creating a gap between the substrate and the support surface. The channels are formed on the support surface for generating reduced pressure in the gap. The air-cooling apparatus is used for providing air cooling in the vicinity of the electrical connector.

Abstract: A support device for supporting a set of integrated circuit units (65), the device comprising: a support member having a metal surface, said surface having an array of recesses (27); a soft material layer, overlaying the recesses of the metal surface so as to protect the units (65) from damage caused by contact with the metal surface, and; a vacuum means (35) in communication with said recesses (27), such that the vacuum means supports each unit within a respective recess, wherein the soft material layer is formed of a plurality of independent inserts (40), each insert engageable with at least one recess using engagement means (50, 55) for engaging each insert (40) with the at least one recess (27).

Abstract: The present invention relates to an apparatus and method for improving and speeding up substrate loading process. One embodiment provides a method for vacuum chucking a substrate. The method comprises venting a center chamber of a flexible membrane configured for mounting the substrate, moving the substrate such that a backside of the substrate is in full contact with the flexible membrane, and vacuuming the center chamber to vacuum chuck the backside of the substrate to the flexible membrane.

Abstract: A method for manufacturing a doughnut-shaped glass substrate by use of a glass substrate manufacturing apparatus, the glass substrate manufacturing apparatus comprising a work stage, three drilling machines and a conveying device capable of moving the work stage, comprising fixing a glass sheet on the work stage; moving the glass sheet to a position just above the core drill of the first drilling machine by use of the conveying device; partially drilling the glass sheet from downward by use of the core drill of the first drilling machine; moving the glass sheet to a position just under the core drill of the second drilling machine by use of the conveying device; forming the inner circular hole in the doughnut-shaped glass substrate by drilling the partially drilled portion from upward by use of the core drill of the second drilling machine; moving the glass sheet to a position just under the core drill of the third drilling machine by use of the conveying device; and separating the doughnut-shaped glass subst

Abstract: Embodiments of a vacuum chuck having an axisymmetrical and/or more uniform thermal profile are provided herein. In some embodiments, a vacuum chuck includes a body having a support surface for supporting a substrate thereupon; a plurality of axisymmetrically arranged grooves formed in the support surface, at least some of the grooves intersecting; and a plurality of chucking holes formed through the body and within the grooves, the chucking holes for fluidly coupling the grooves to a vacuum source during operation, wherein the chucking holes are disposed in non-intersecting portions of the grooves.

Abstract: A solar cell production system utilizes self-contained vacuum chucks that hold and cool solar cell wafers during transport on a conveyor between processing stations during a fabrication process. Each self-contained vacuum chuck includes its own local vacuum pump and a closed-loop cooling system. After each wafer is processed, it is removed from its vacuum chuck, and the vacuum chuck is returned to the start of the production line by a second conveyor belt. In one embodiment, each vacuum chuck includes an inductive power supply that is inductively coupled to an external source to drive that vacuum chuck's vacuum pump and cooling system. An optional battery is recharged by the inductive power supply, and is used to power the vacuum pump and cooling system during hand-off between adjacent processing stations.

Abstract: The present invention relates to a substrate processing apparatus useful for plating a substrate or processing a substrate by dipping a substrate in a processing liquid. A substrate processing apparatus of the present invention includes: a loading/unloading area for carrying in and out a substrate; a cleaning area for cleaning the substrate; and a plating area for plating the substrate. The loading/unloading area is provided with a substrate transfer robot having a plurality of hands of dry-use design, a loading port mounted with a cassette for housing substrates, and a reversing machine of dry-use design for reversing the substrate from face up to face down.

Abstract: Disclosed is a wafer chuck, which has protrusions for supporting a substrate, for attracting and holding the substrate by negative pressure while the substrate is being supported by the protrusions. The wafer chuck includes pin-shaped protrusions dispersed on a suction side of the chuck, and circular peripheral wall portions disposed in the vicinity of the rim of the supported substrate and in the vicinity of the outer peripheral portion of a lifting hole, respectively. The suction side of the wafer chuck is provided with a first area in which the pin-shaped protrusions are arrayed in a grid-line manner, and a second area in which the pin-shaped protrusions are arrayed in circumferential form. The second area is provided in the vicinity of the peripheral wall portion and peripheral wall portion, and the first area is provided elsewhere.

Abstract: This patent document relates, as its title indicates, to a tool holder with suction system of the type used in automatic machining systems with numerical control for the adaptation and securing of different machining tools, characterised in that it integrates in a single device the functionality of a conventional automatic tool holder, being capable of bearing a retractable element for improving precision in the control of the depth of machining, and a suction system for the powder and swarf generated during the process, enabling in an alternative embodiment the use of an axial knuckle joint in the sensing device that enables automatic adaptation to the irregularities of the surface to be machined with the subsequent reduction in machining error, and also enabling in another alternative embodiment the use of a plurality of slide guides in the retractable elements for improving the sliding of the sensing element.

Abstract: In a method for releasing a work having an adhesive tape from a holding member which sucks and holds the work having the adhesive tape, the work having the adhesive tape is released from the holding member while supplying a gas which reduces a holding force of the holding member between the holding member and the work having the adhesive tape.

Abstract: The invention relates to a vacuum system, in particular a vacuum gripping system having at least one vacuum gripping apparatus for gripping workpieces and/or a vacuum component, in particular having a sensor for sensing states in the vacuum gripping system and/or one of the components and for generating state data, wherein the vacuum gripping apparatus and/or at least one of the components is equipped with an energy generation device for generating new electrical energy, which is not stored in the vacuum system, for operating a module consuming electrical energy.

Abstract: The present invention is a chuck having a vacuum groove that is capable of holding a wafer as the chuck rotates on a spindle. As the chuck rotates the air pressure above the center of the wafer is reduced. In order to reduce the bowing of the wafer that can result from this low pressure area above the wafer, the present invention introduces venturi holes in the chuck which reduces the air pressure in the area below the wafer. In order to prevent the air pressure in the area below the wafer from decreasing too far, the present invention uses air inlet holes to balance the affect of the venturi holes in order to substantially balance the air pressure above and below the wafer which results in significantly less bowing of the wafer when compared to conventional systems. The present invention accomplishes this without requiring sensors or other active measuring devices to help reduce the bowing of the wafer.

Abstract: Provided are an apparatus for transferring a semiconductor chip and a method of transferring a semiconductor chip using the same, which can inhibit the occurrence of a void to enhance the reliability of a semiconductor package. The apparatus for transferring the semiconductor chip includes: a holder member including a first vacuum hole connected to a vacuum line; a plate member including at least one second vacuum hole corresponding to the first vacuum hole and redistributed to edges of the plate member, the plate member combined with the holder member; and an absorption member including at least one third vacuum hole corresponding to the second vacuum hole and a groove connected to the third vacuum hole, the absorption member combined with the plate member and the holder member.

Abstract: A semiconductor manufacturing apparatus includes a supporting unit for supporting a semiconductor wafer received from a CMP apparatus and a vacuuming system for holding the wafer on the supporting unit. The vacuuming is applied only in a peripheral area of the wafer. In the peripheral area of the wafer, any circuit such as interconnections and devices are not manufactured. When the wafer is released by supplying gas to the vacuumed space, even if static electricity occurs, the electronic circuit to be manufactured on the wafer does not harmed, because the static electricity occurs only in the peripheral area where any circuit does not exist.

Abstract: A spindle device to mount and rotate an object, including: a housing; a main shaft supported by the housing rotatably to the housing wherein the main shaft includes a through hole which goes through from an end to the other end thereof, and an opening of the through hole forms a mounting section to mount the object at the end, and an opening of the through hole forms a suction section at the other end; a connecter member disposed to cover-the outside of the other end and connected with the external negative-pressure source; and a bearing disposed between the circumference of the main shaft at other end and the connecter member covering the outside; wherein the object is suctioned onto the mounting section at the end with the external negative-pressure source through the through hole.

Abstract: A substrate supporting apparatus for supporting a substrate or wafer in a non-contact state by Bernoulli theorem is disclosed. The substrate supporting apparatus 1 comprises a housing 2, a rotatable chuck 3 which is disposed in the housing 2, which is provided at its central portion with a hollow 12 and which supports a substrate 6, and a cylindrical nozzle member 4 which is disposed in the housing 2, which has a nozzle hole 7 and which can vertically move in the hollow 12. A nozzle hole 7 is formed in a central portion of the nozzle member 4. Gas is discharged from a gas source 8 through the nozzle hole 7, thereby holding the substrate 6 by an upper surface of the chuck 3 in a non-contact state. When the substrate 6 is to be detached, the nozzle member 4 is moved upward while discharging gas from the nozzle hole 7, thereby floating the substrate 6.