Abstract: A microelectromechanical systems device includes a vibrator and a reinforcing film. The vibrator includes a piezoelectric element configured to convert pressure to an electrical signal. The reinforcing film is configured to reinforce strength of the vibrator. The vibrator further has a groove at which a portion of the reinforcing film is disposed.

Abstract: An input device includes: a panel on which a pressing operation is performed by an operating body; a substrate provided on a back surface side of the panel; a first electrode provided on the substrate; a holder that is provided on a back surface side of the substrate, includes a second electrode at a part facing the first electrode, and engages with the panel; a push-in detector that detects electrostatic capacity between the first electrode and the second electrode; and a vibration device held by the holder. The holder moves relative to the substrate when the pressing operation is performed on the panel, has rigidity and conductivity, and covers the second electrode from its back surface side.

Abstract: Acoustic resonator devices and filters are disclosed. An acoustic resonator includes a substrate having a surface. A back surface of a single-crystal piezoelectric plate is attached to the surface of the substrate except for a portion of the piezoelectric plate forming a diaphragm spanning a cavity in the substrate. An interdigital transducer (IDT) is formed on a front surface of the piezoelectric plate with interleaved IDT fingers of the IDT disposed on the diaphragm. Back-side fingers are formed the back surface of the diaphragm.

Abstract: A single-hole ultrasonic detection device for continuous integrity and a rock entry depth of a concrete diaphragm wall and a method using the same are provided. the single-hole ultrasonic detection device includes an apparatus host, an ultrasonic transducer and an ultrasonic signal feedback device, and the apparatus host is respectively connected to the ultrasonic transducer and the ultrasonic signal feedback device via a corresponding one of signal lines, the apparatus host includes an ultrasonic transmitter and an ultrasonic signal collector, the ultrasonic transmitter is configured to generate ultrasonic waves and the ultrasonic waves are transmitted via the ultrasonic transducer, the ultrasonic transducer is configured to collect and recover a reflected wave of the ultrasonic waves, convert signals of the reflected wave of the ultrasonic waves into electric signals, and send the electric signals back into the apparatus host.

Abstract: A piezoelectric micromachined ultrasonic transducer (PMUT) device includes a substrate having an opening therethrough and a membrane attached to the substrate over the opening. An actuating structure layer on a surface of the membrane includes a piezoelectric layer sandwiched between the membrane and an upper electrode layer. The actuating structure layer is patterned to selectively remove portions of the actuating structure from portions of the membrane to form in a central portion proximate a center of the open cavity and three or more rib portions projecting radially outward from the central portion.

Abstract: A vibration device includes a semiconductor substrate having a first surface at which an integrated circuit is provided and a second surface that is a rear surface with respect to the first surface, which is a front surface, a vibration element disposed at the first surface, a lid having a recess that opens toward the first surface and a contact surface that is in contact with the first surface, the lid being bonded to the first surface via the contact surface, and a metal layer disposed between the first surface and the contact surface, and at least part of the integrated circuit overlaps with the metal layer in a plan view viewed in the direction of a normal to the first surface.

Abstract: A surface acoustic wave resonator device, manufacturing method therefor and filter, the surface acoustic wave resonator device includes: an interdigital transducer, located on a piezoelectric substrate and including first and second interdigital electrode lead-out parts, and first and second interdigital electrodes extending along a first direction and alternately arranged along a second direction, the first interdigital electrode is connected to the first interdigital electrode lead-out part, and the second interdigital electrode is connected to the second interdigital electrode lead-out part; and a clutter suppression structure, including a body structure and a sawtooth structure, wherein the body structure continuously extends along the second direction and overlaps with the interdigital electrodes in a third direction, and the sawtooth structure is disposed at a side of the body structure in the first direction, and at least a portion of the sawtooth structure overlaps with the interdigital electrodes in

Abstract: A method of manufacture for an acoustic resonator or filter device. In an example, the present method can include forming metal electrodes with different geometric areas and profile shapes coupled to a piezoelectric layer overlying a substrate. These metal electrodes can also be formed within cavities of the piezoelectric layer or the substrate with varying geometric areas. Combined with specific dimensional ratios and ion implantations, such techniques can increase device performance metrics. In an example, the present method can include forming various types of perimeter structures surrounding the metal electrodes, which can be on top or bottom of the piezoelectric layer. These perimeter structures can use various combinations of modifications to shape, material, and continuity. These perimeter structures can also be combined with sandbar structures, piezoelectric layer cavities, the geometric variations previously discussed to improve device performance metrics.

Abstract: Embodiments of the present disclosure provide a flexible sensor, including a flexible substrate; a plurality of ultrasonic detectors, on the flexible substrate; and a plurality of detection circuits, respectively corresponding to the ultrasonic detectors; wherein each of the detection circuits is between the flexible substrate and the corresponding ultrasonic detector, and configured to drive the ultrasonic detector to emit an ultrasonic wave, and detect a detection signal output by the ultrasonic detector after receiving the ultrasonic wave; each of the ultrasonic detectors includes: a first electrode coupled to the corresponding detection circuit, a second electrode on a side of the first electrode away from the flexible substrate, and a piezoelectric induction layer between the first electrode and the second electrode; a plurality of holes are provided in a region other than a region where the detection circuits are located.

Abstract: There is disclosed acoustic resonators and filter devices. An acoustic resonator includes a substrate having a surface and a single-crystal piezoelectric plate having front and back surfaces, the back surface attached to the surface of the substrate except for a portion of the piezoelectric plate forming a diaphragm that spans a cavity in the substrate. An interdigital transducer (IDT) is formed on the front surface of the single-crystal piezoelectric plate such that interleaved fingers of the IDT are disposed on the diaphragm. The piezoelectric plate and the IDT are configured such that a radio frequency signal applied to the IDT excites a primary shear acoustic mode in the diaphragm. The interleaved fingers comprise a first layer proximate the diaphragm, a second layer over the first layer, and a third layer over the second layer, wherein adjacent layers are different materials.

Abstract: A piezoelectric device includes a base portion and an upper layer on an upper side of and supported by the base portion. The upper layer includes a membrane portion that does not overlap with the base portion in plan view. The membrane portion includes at least one piezoelectric layer sandwiched by electrode layers from a top and a bottom thereof. An intermediate layer is between a lower electrode and the base portion. The intermediate layer includes one or more individual layers, and an individual layer exposed as a lower surface of the membrane portion among the one or more individual layers includes a bent portion, which extends from the lower surface of the membrane portion to a lateral wall, on a boundary between a portion defining and functioning as the lower surface of the membrane portion and a portion overlapping with the base portion.

Abstract: A surface acoustic wave resonator device, and method for manufacturing the same and filter, the method includes: forming an interdigital transducer including interdigital electrodes on the piezoelectric substrate; forming the interdigital transducer includes: forming initial interdigital electrodes on the piezoelectric substrate, wherein each initial interdigital electrode has a first width, and every two adjacent initial interdigital electrodes have an initial interdigital gap with a first spacing therebetween; and forming additional interdigital electrodes on the piezoelectric substrate, wherein each initial interdigital gap has a portion filled by one of additional interdigital electrodes; each interdigital electrode includes an initial interdigital electrode and an additional interdigital electrode connected to each other; each interdigital electrode has a second width, and every two adjacent interdigital electrodes have a second spacing therebetween; the second width is greater than the first width, and

Abstract: A head chip, a liquid jet head, and a liquid jet recording device each capable of achieving a reduction in size and an increase in nozzle density are provided.

Abstract: A level fork protection sleeve includes a first cylinder and a second cylinder disposed within the first cylinder. The cylinders are joined together via a material bonding such as welding. A gap in the second cylinder along its length provides a channel within the sleeve for the ingress and egress of liquid media. The sleeve is embodied to fit onto a shaft of a vibronic limit level device and to extend over and protect the vibrating member of the limit level device.

Abstract: The disclosure belongs to the technical field of additive manufacturing, and discloses a flexible piezoelectric sensor based on 4D printing. The sensor includes a magnetic part and a conductive part, wherein: the conductive part includes two substrates disposed opposite to each other and a spiral structure disposed between the two substrates. Both the two substrates and the spiral structure are made of conductive metal materials. The magnetic part has a flexible porous structure and is arranged between the two substrates to generate a magnetic field. When the two substrates are subjected to external pressure, the spiral structure and the magnetic part are compressed simultaneously, the magnetic flux passing through the spiral structure changes, and the voltage of the two substrates changes, by measuring the voltage change of the two substrates to reflect the change of external pressure, the pressure measuring process is achieved.

Abstract: Techniques for improving acoustic wave device structures are disclosed, including filters and systems that may include such devices. An acoustic wave device may include a substrate. The acoustic wave device may include first and second layers of piezoelectric material acoustically coupled with one another, in which the first layer of piezoelectric material has a first piezoelectric axis orientation, and the second layer of piezoelectric material has a second piezoelectric axis orientation that substantially opposes the first piezoelectric axis orientation of the first layer of piezoelectric material. The acoustic wave device may include an interposer layer interposed between the first and second layers of piezoelectric material. The interposer may facilitate an enhancement of an electromechanical coupling coefficient of the acoustic wave device.

Abstract: An actuating device includes an actuator and a stationary portion. The actuator has at least one driving portion. The stationary portion is provided at an arbitrary position along the actuator such that the driving portion forms a first driving portion and a second driving portion. The first driving portion and the second driving portion can be provided with the same actuating ability or with different actuating abilities respectively by adjusting the position of the stationary portion.

Abstract: Provided in the embodiments are a transfer structure and a method thereof, and a transfer device and a manufacturing method thereof. The transfer structure includes: a first electrode, a piezoelectric layer, a second electrode and an adhesive layer stacked on a substrate in sequence, wherein the first electrode and the second electrode are insulated from each other. The transfer structure further includes: a position-limiting layer, wherein the position-limiting layer includes a cavity; the piezoelectric layer and at least part of the adhesive layer are located in the cavity of the position-limiting layer; and in the direction perpendicular to the substrate, the distance between the surface, away from the substrate, of the position-limiting layer and the substrate is greater than the distance between the surface, away from the substrate, of the adhesive layer and the substrate.

Abstract: A cover unit includes: a body to which an ultrasound generator adapted to generate ultrasound is coupled; first slits disposed at a lower portion of the body in the form of multiple rings having different radii and spaced apart from each other, the first slits having a first width; second slits depressed from an upper surface of the body to communicate with the first slits and having a second width smaller than the first width; third slits depressed from the upper surface of the body and each disposed between adjacent second slits, the third slits having a third width smaller than the first width; a bottom formed under the first slits; a first sidewall formed between adjacent first slits; and a second sidewall formed between the second slit and the third slit.

Abstract: Acoustic resonator devices and filters are disclosed. An acoustic resonator includes a substrate having a surface and a single-crystal lithium niobate (LN) plate having front and back surfaces, the back surface attached to the surface of the substrate except for a portion of the LN plate forming a diaphragm that spans a cavity in the substrate. An interdigital transducer (IDT) is formed on the front surface of the LN plate such that interleaved fingers of the IDT are disposed on the diaphragm. A half-lambda dielectric layer is formed on one of the front surface and back surface of the diaphragm. Euler angles of the LN plate are [0°, ?, 0°], where 20°???25°.

Abstract: A resonator comprising a piezoelectric film which creates an acoustic path that is slightly longer in a central region of the resonator than at an edge of the resonator.

Abstract: A sensor device for process variable determination in an industrial environment, comprising a sensor base and a first expansion module. The sensor base includes circuitry that determines the process variable, a first mechanical interface for mechanically accommodating a first expansion module and a first communication interface to the first expansion module for transmitting measurement and/or control data. In this case, the first expansion module has a second mechanical interface to the sensor base, a third mechanical interface for mechanically accommodating a second expansion module, a second communication interface to the sensor base for transmitting measurement and/or control data, and a third communication interface to the second expansion module for transmitting measurement and/or control data.

Abstract: In a micromirror device, the upper electrode of the piezoelectric element consists of a plurality of individual electrode parts, each of which is separated by a first stress inversion region and a second stress inversion region. In the first stress inversion region, positive and negative, of a principal stress component having a maximum absolute value among a principal stress, are inverted in a maximum displacement state, in a case of driving in a first resonance mode in which the mirror part is tilted and oscillated around the first axis. In the second stress inversion region, positive and negative, of a principal stress component having a maximum absolute value among a principal stress, are inverted, in a case of driving in a second resonance mode in which the mirror part is tilted and oscillated around the second axis.

Abstract: A method of producing wet laid disposable bath tissue, facial tissue, and paper towel with enhanced properties through application of surface additives using a piezoelectrical apparatus or application device.

Abstract: In some embodiments, the present disclosure relates to a piezomicroelectromechanical system (piezoMEMS) device that includes a second piezoelectric layer arranged over the first electrode layer. A second electrode layer is arranged over the second piezoelectric layer. A first contact is arranged over and extends through the second electrode layer and the second piezoelectric layer to contact the first electrode layer. A dielectric liner layer is arranged directly between the first contact and inner sidewalls of the second electrode layer and the second piezoelectric layer. A second contact is arranged over and electrically coupled to the second electrode layer, wherein the second contact is electrically isolated from the first contact.

Abstract: In a piezoelectric device, a piezoelectric driving portion includes layers and is directly or indirectly supported by a base portion. The piezoelectric driving portion includes a piezoelectric layer, an upper electrode layer, and a lower electrode layer. The upper electrode layer is disposed on the upper side of the piezoelectric layer. The lower electrode layer faces at least a portion of the upper electrode layer with the piezoelectric layer interposed therebetween. The piezoelectric driving portion includes a through groove extending through the piezoelectric driving portion in the vertical direction, so that a pair of inner side surfaces are provided. The pair of inner side surfaces each include a first small-width portion in which the width of the through groove decreases in a downward direction from an upper end surface of the piezoelectric layer.

Abstract: An acoustic resonator device with low thermal impedance has a substrate and a single-crystal piezoelectric plate having a back surface attached to a top surface of the substrate via a bonding oxide (BOX) layer. An interdigital transducer (IDT) formed on the front surface of the plate has interleaved fingers disposed on the diaphragm, the overlapping distance of the interleaved fingers defining an aperture of the resonator device. Contact pads are formed at selected locations over the surface of the substrate to provide electrical connections between the IDT and contact bumps to be attached to the contact pads. The piezoelectric plate is removed from at least a portion of the surface area of the device beneath each of the contact pads to provide lower thermal resistance between the contact bumps and the substrate.

Abstract: Multiplexers are disclosed. A multiplexer can include a first filter and a second filter that are coupled to a common node. The second filter can include a first type of acoustic wave resonators (e.g., bulk acoustic wave resonators) and a series acoustic wave resonator of a second type (e.g., a surface acoustic wave resonator) that is coupled between the acoustic wave resonators of the first type and the common node. The first filter can provide a single-ended radio frequency signal. In certain embodiments, the first filter can be a receive filter and the second filter can be a transmit filter.

Abstract: The disclosed technology generally relates to packaging a quartz crystal, and more particularly to bonding a quartz crystal using sintering silver paste. In one aspect, a method of packaging a quartz crystal comprises attaching a quartz crystal to a package substrate using one or more silver paste layers comprising silver particles. The method additionally comprises sintering the silver paste in a substantially oxygen-free atmosphere and at a sintering temperature sufficient to cause sintering of the silver particles. The sintering is such that the quartz crystal exhibits a positive drift in resonance frequency of the quartz crystal over time. The method further comprises hermetically sealing the quartz crystal in the package substrate.

Abstract: A method reduces internal resistance of a battery (204, 300). In the method, a charging current is directed to a battery (204, 300), where the charging current includes spin-polarized and charged electrons. A dedicated spin generator (203) is capable of providing the charging current including spin-polarized and charged electrons. Next, the battery (204, 300) has been manufactured so that the battery includes either ferroelectric or pyroelectric material at least either in an anode (305), in a cathode (302), or in an other element of the battery (204, 300). The material can be selected to be polyvinylidene fluoride (“PVDF”) or modified materials thereof. After at least one cycle of charging of the battery (204, 300), the battery (204, 300) with reduced internal resistance is obtained.

Abstract: A disclosed vibration device comprises a first vibration generator and a first connection member disposed on a first surface of the first vibration generator. The first vibration generator may comprise a first vibration part including a plurality of inorganic material portions having a piezoelectric characteristic and an organic material portion between the plurality of inorganic material portions.

Abstract: A wearable sound device includes a venting module, configured to form at least one vent to connect a volume within the wearable sound device and ambient, and a sound producing device, configured to produce sound according to an equalized input signal. The venting module, including at least one venting device, operates among a plurality of statuses corresponding to a plurality of degrees of opening. A controller generates the equalized input signal according to a degree of opening among the plurality of degrees of opening, in order to counteract a roll off caused by the at least one vent.

Abstract: An intravascular ultrasound (IVUS) device that includes a flexible elongate member having a proximal portion and a distal portion; a controller coupled to the distal portion of the flexible elongate member; an ultrasound transducer disposed at the distal portion of the flexible elongate member and in communication with the controller; a pressure transducer disposed at the distal portion of the flexible elongate member and in communication with the controller; and plurality of conductors extending from the controller to the proximal portion of the catheter, at least one conductor of the plurality of conductors being configured to carry both the signals representing information captured by the ultrasound transducer and information captured by the pressure transducer.

Abstract: A surgical footswitch for controlling a surgical instrument. The surgical footswitch includes a base. A treadle is rotatably coupled to the base to operate the surgical instrument. A foot guard is also rotatably coupled to the base. A blocking portion of the foot guard is configured to prevent physical access to the treadle in a lateral direction in a first position and permit access to the treadle in a lateral direction in a second position. A floor engagement portion of the foot guard engages a floor surface when the blocking portion is in the first position. The floor engagement portion is spaced from the floor surface when the blocking portion is in the second position. The floor engagement portion permits physical access to the treadle in a longitudinal direction when the blocking portion is in both the first position and the second position.

Abstract: A head chip, a liquid jet head, and a liquid jet recording device each capable of inhibiting mechanical crosstalk, and exerting a desired jet performance are provided. The head chip according to an aspect of the present disclosure includes a flow channel member having a plurality of pressure chambers containing liquid, an actuator plate which is stacked on the flow channel member in a state of being opposed in a first direction to the pressure chambers, and a drive electrode which is formed on a surface of the actuator plate, the surface facing to the first direction, and which is configured to deform the actuator plate in the first direction to change a volume of at least one of the pressure chambers. A dividing groove which is configured to zone the actuator plate between the pressure chambers adjacent to each other is formed in a portion of the actuator plate, the portion being located between the pressure chambers adjacent to each other when viewed from the first direction.

Abstract: A method for fabricating a film bulk acoustic resonator (FBAR) structure includes: sequentially forming a top electrode material layer, a piezoelectric layer, and a bottom electrode material layer on a substrate; patterning the bottom electrode material layer to form a bottom electrode; forming a sacrificial layer above the bottom electrode; bonding a bottom cap wafer onto the sacrificial layer; removing the substrate; patterning the top electrode material layer to form a top electrode; and removing a portion of the sacrificial layer to form a lower cavity.

Abstract: A method of manufacturing a bulk acoustic wave filter is provided, including: forming an acoustic reflection air cavity, a sacrificial layer, a seed layer, a lower electrode layer and a piezoelectric layer of n resonators on a substrate in sequence, wherein n is greater than or equal to 2; taking N from 1 to n for respectively repeating following steps: forming an N-th metal hard mask layer, defining an effective area of a first resonator to an N-th resonator by using a photolithography process, removing the N-th metal hard mask layer outside the effective area of the first resonator to the N-th resonator, oxidizing the piezoelectric layer outside the effective area of the first resonator to the N-th resonator to form an N-th oxidized part of the piezoelectric layer, and etching the N-th oxidized part of the piezoelectric layer; removing the metal hard mask layer of the effective area of the first resonator to the N-th resonator, so as to form the piezoelectric layer having different thicknesses of the first

Abstract: Disclosed herein are embodiments of a wound treatment apparatus with electronic components integrated within a wound dressing. In some embodiments, a wound dressing apparatus can comprise a wound dressing. The wound dressing can comprise an absorbent material, an electronics unit comprising a negative pressure source, the electronics unit integrated within the wound dressing and at least partially encapsulated by a flexible film. The electronics unit can include translucent or transparent components that allow light to travel through to reach adhesives or coatings on the electronic components that would otherwise be obscured.

Abstract: A fluid pump module includes a heat dissipation board assembly, a fixing frame body, fluid pumps, a control board and a conveying pipe is provided. The fixing frame body is fixed at one side of the heat dissipation board assembly, so as to form two accommodating spaces between the heat dissipation board assembly and the fixing frame body. Two fluid pumps are respectively disposed in the two accommodating spaces. The control board is disposed at another side of the heat dissipation board assembly. The conveying pipe connects the two fluid pumps in series so as to form a series connection therebetween. The control board controls operations of the fluid pumps, and the heat dissipation board assembly dissipates heats produced by a module formed by the two fluid pumps.

Abstract: Provided is a method of manufacturing a bulk acoustic wave resonator, which includes: providing a piezoelectric substrate for forming a piezoelectric layer; forming a first electrode structure on the portion of the piezoelectric substrate for forming the piezoelectric layer; forming a dielectric layer on the first electrode structure, and performing a patterning process on the dielectric layer to form a patterned dielectric layer comprising a sacrificial dielectric part and a periphery dielectric part; forming a boundary layer on the patterned dielectric layer, the boundary layer covering a surface of the patterned dielectric layer and surrounding the sacrificial dielectric part; thinning the piezoelectric substrate to form the piezoelectric layer, the first electrode structure being located at a first side of the piezoelectric layer; forming a second electrode structure on a second side of the piezoelectric layer; and removing the sacrificial dielectric part to form a resonant cavity.

Abstract: An acoustic resonator is fabricated with multiple piezoelectric plate thicknesses on a single chip. After conductor patterns are formed on a piezoelectric plate, the plate is bonded to a sacrificial substrate, with the conductor patterns facing the sacrificial substrate. The piezoelectric plate is then thinned to a desired thickness for shunt resonators. A mask is applied to the surface of the plate and selected areas of the piezoelectric plate are further thinned to a desired thickness for series resonators to form a thinned piezoelectric plate. A substrate with swimming pool cavities is bonded to the thinned piezoelectric plate, and the sacrificial substrate is removed.

Abstract: In a method for determining cleanliness of a cleaning member that contacts a substrate and with which scrub cleaning is performed, the method includes a first step of self-cleaning a cleaning member by releasing contaminants from the cleaning member into a cleaning liquid, and a second step of bringing a self-cleaning discharged liquid into contact with an electrode of a crystal oscillator, attaching the contaminants contained in the discharged liquid onto the electrode of the crystal oscillator, then measuring a frequency response of the crystal oscillator in which the contaminants are attached onto the electrode, and determining cleanliness of the cleaning member based on the measured frequency response.

Abstract: The present invention relates to a heterostructure, in particular, a piezoelectric structure, comprising a cover layer, in particular, a layer of piezoelectric material, the material of the cover layer having a first coefficient of thermal expansion, assembled to a support substrate, the support substrate having a second coefficient of thermal expansion substantially different from the first coefficient of thermal expansion, at an interface wherein the cover layer comprises at least a recess extending from the interface into the cover layer, and its method of fabrication.

Abstract: A control device including a control section configured to vibrate a contact region in a case where it is determined that an operation is performed on an input section by a target object coming into contact with the contact region, the input section having the contact region touched by the target object, wherein the control section adjusts displacement rise time as a control parameter for performing control of vibrating the contact region.

Abstract: Intravascular devices, systems, and methods are disclosed. In some instances, a method for treating a vessel of a patient includes collecting intravascular ultrasound imaging data of the placement of the stent using the intravascular ultrasound imaging device, estimating, using a processing device, a restenosis probability value based on the intravascular ultrasound imaging data of the placement of the stent and communicating the estimated restenosis probability value to a clinician. Associated devices and systems are also provided.

Abstract: Acoustic resonator devices and filters are disclosed. An acoustic resonator chip includes a piezoelectric plate attached to a substrate, a portion of the piezoelectric plate forming a diaphragm spanning a cavity in the substrate. A first conductor pattern formed on a surface of the piezoelectric plate includes interleaved fingers of an interdigital transducer on the diaphragm and a first plurality of contact pads. A second conductor pattern is formed on a surface of an interposer, the second conductor pattern including a second plurality of contact pads. Each pad of the first plurality of contact pads is directly connected to a respective pad of the second plurality of contact pads. A seal is formed between a perimeter of the piezoelectric plate and a perimeter of the interposer.

Abstract: A display apparatus includes a display panel configured to display an image; a plate on a rear surface of the display panel; a rear structure on a rear surface of the plate and configured to support the display panel; a vibration member configured to vibrate the plate; and a first supporting member between a periphery of the plate and the rear structure.

Abstract: A surface acoustic wave (SAW) filter includes a bottom substrate, a piezoelectric layer disposed above the bottom substrate, the piezoelectric layer having a bottom surface facing the bottom substrate and a top surface opposite to the bottom surface, a lower cavity disposed below the piezoelectric layer, an interdigital transducer (IDT) disposed on the top surface of the piezoelectric layer, and a back electrode disposed on the bottom surface of the piezoelectric layer, and exposed in the lower cavity.

Abstract: There is provided an ultrasonic endoscope, in which bending of a signal cable at a time of assembling a distal end portion is alleviated and the signal cable is prevented from being disconnected, and a manufacturing method thereof.

Abstract: A composite substrate of the present disclosure is a composite substrate in which a piezoelectric substrate and a sapphire substrate are directly bonded, and a bonding surface of the sapphire substrate has a step bunch structure. A piezoelectric device of the present disclosure includes the composite substrate. A method for manufacturing a composite substrate includes the steps of: preparing a piezoelectric substrate and a sapphire substrate including a surface having a predetermined off-angle to a specific crystal plane, heat treating the sapphire substrate in an oxidizing atmosphere to form a step bunch on the surface of the sapphire substrate, and bonding the piezoelectric substrate and the surface of the sapphire substrate directly.