Piezoelectric Device Making Patents (Class 29/25.35)
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Patent number: 12040781Abstract: Acoustic resonator devices and filters are disclosed. An acoustic resonator chip includes a piezoelectric plate attached to a substrate. Portions of the piezoelectric plate form at least first and second diaphragms spanning respective cavities in the substrate. A first conductor pattern on the surface of the piezoelectric plate includes a first plurality of contact pads and at least first and second IDTs with interleaved fingers of each IDT on respective diaphragms. An interposer includes a second plurality of contacts pads. A plurality of conductive balls bond each of the contact pads of the first plurality of contact pads to respective contact pads of the second plurality of contact pads.Type: GrantFiled: October 9, 2021Date of Patent: July 16, 2024Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Patrick Turner, Mike Eddy, Andrew Kay, Ventsislav Yantchev
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Patent number: 12040784Abstract: Aspects of this disclosure relate to a surface acoustic wave device. The surface acoustic wave device includes a piezoelectric layer and an interdigital transducer. The interdigital transducer electrode includes a pair of electrodes, each electrode having a bus bar and fingers extending from the bus bar. The interdigital transducer electrode has an interdigital region defined by a portion of the fingers of the electrodes that interdigitate with each other. A dielectric layer is disposed over the interdigital transducer electrode outside the interdigital region and configured to reduce a loss of the surface acoustic wave device.Type: GrantFiled: February 23, 2023Date of Patent: July 16, 2024Assignee: Skyworks Solutions, Inc.Inventors: Gong Bin Tang, Rei Goto, Hiroyuki Nakamura
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Patent number: 12030083Abstract: Various methods and systems are provided for a multi-frequency transducer array. In one example, ground recovery in the transducer array is enabled by configuring an acoustic stack of the transducer array with an interdigitated structure, a top layer coupled to a front side of the interdigitated structure, and a bottom layer coupled to a back side of the interdigitated structure, where the top layer and the bottom is electrically continuous with the interdigitated structure.Type: GrantFiled: December 2, 2019Date of Patent: July 9, 2024Assignee: GE PRECISION HEALTHCARE LLCInventors: Edouard Dacruz, Flavien Daloz, Jason Barrett
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Patent number: 12028041Abstract: Gradient raised frames in film bulk acoustic resonators. In some embodiments, a film bulk acoustic resonator device can include a substrate, first and second metal layers implemented over the substrate, a piezoelectric layer between the first and second metal layers, and a gradient raised frame implemented relative to one of the first and second metal layers and configured to improve reflection of lateral mode waves and to reduce conversion of main mode waves into lateral mode waves.Type: GrantFiled: September 11, 2020Date of Patent: July 2, 2024Assignee: Skyworks Global Pte. Ltd.Inventors: Jiansong Liu, Kwang Jae Shin, Jae Hyung Lee, Benjamin Paul Abbott, Chun Sing Lam
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Patent number: 12023055Abstract: A balloon catheter system assisted by ultrasound and microbubbles and a method for vasodilation are provided. The system includes: a controller; a sensor catheter; a highly focused ultrasound probe, and the highly focused ultrasound probe and the sensor catheter is connected to the controller; and a balloon catheter. The method of vasodilation includes: providing a sensor catheter into a blood vessel, and controlling a highly focused ultrasound probe to focus at a hardened portion of the blood vessel; removing the sensor catheter from the blood vessel and inserting a balloon catheter into the blood vessel; infusing microbubbles into the balloon catheter and controlling the highly focused ultrasound probe to start working to destroy a calcification point of the hardened portion of the blood vessel, and smoothly inflating the balloon catheter at the hardened portion of the blood vessel.Type: GrantFiled: August 24, 2021Date of Patent: July 2, 2024Assignee: National Tsing Hua UniversityInventors: Chih-Kuang Yeh, Chieh-Yu Tsai, Jen-Kuang Lee, Chun-Yen Lai, Zong-Han Hsieh
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Patent number: 12028042Abstract: In a piezoelectric resonator device according to one or more embodiments, an internal space for hermetically sealing a vibrating part including a first excitation electrode and a second excitation electrode of a crystal resonator plate is formed by bonding a first sealing member and a second sealing member respectively to the crystal resonator plate. A through hole is formed in the second sealing member. A through electrode is formed along an inner wall surface of the through hole to establish conduction between an electrode formed on a first main surface and an external electrode terminal formed on a second main surface. A corrosion resistance structure to solder is formed on the through electrode that establishes conduction between the electrode and the external electrode terminal with a conductive metal other than Au.Type: GrantFiled: December 19, 2019Date of Patent: July 2, 2024Assignee: DAISHINKU CORPORATIONInventors: Satoru Ishino, Hiroki Yoshioka, Hiroki Fujiwara
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Patent number: 12021505Abstract: A BAW resonator is provided wherein the top electrode (TE) has an outer flap (OF). The flap extends away from the active resonator region (AR) and has a projecting section that runs at a level above the piezoelectric layer (PL) that is higher than the level of the top electrode at any of the inwardly located areas enclosed by the outer flap. The higher level is formed by an intermediate step-forming material (SM) arranged between piezoelectric layer and top electrode in the outer flap. The step forming material comprises a structured layer of an acoustic impedance that is low w.r.t. the impedance of the top electrode and the piezoelectric layer.Type: GrantFiled: May 28, 2019Date of Patent: June 25, 2024Assignee: RF360 Singapore Pte. Ltd.Inventor: Thomas Bain Pollard
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Patent number: 12022737Abstract: A system includes a piezoelectric capacitor assembly and signal processing circuitry coupled to the piezoelectric capacitor assembly. The piezoelectric capacitor assembly includes a piezoelectric member and piezoelectric capacitors located at respective lateral positions along the piezoelectric member. Each piezoelectric capacitor includes: (1) a respective portion of the piezoelectric member, (2) a first electrode, and (3) a second electrode. The first and second electrodes are positioned on opposite side of the piezoelectric member. The piezoelectric capacitors include piezoelectric force-measuring elements (PFEs). The PFEs are configured to output voltage signals between the respective first electrode and the respective second electrode in accordance with a time-varying strain at the respective portion of the piezoelectric member between the respective first electrode and the respective second electrode resulting from a low-frequency mechanical deformation.Type: GrantFiled: January 28, 2021Date of Patent: June 25, 2024Assignee: UltraSense Systems, Inc.Inventors: Hao-Yen Tang, Sina Akhbari, Mo Maghsoudnia
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Patent number: 12015897Abstract: A display apparatus includes a display module including a display panel configured to display an image and a sound generating module on a rear surface of the display panel, the sound generating module includes a vibration generating device, a circuit board on a lower surface of the vibration generating device, a first adhesive member between the circuit board and the vibration generating device, and a second adhesive member between the vibration generating device and the display panel, an elastic modulus of the second adhesive member differing from an elastic modulus of the first adhesive member.Type: GrantFiled: March 20, 2023Date of Patent: June 18, 2024Assignee: LG Display Co., Ltd.Inventors: Kyounghwan Kim, MinHo Sohn, KiDuk Kim, Sung-Jin Kang, Jeonggoo Kang, JaiHyuk Lee
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Patent number: 12015393Abstract: Acoustic resonator devices and methods are disclosed. An acoustic resonator device includes a substrate having a surface and a piezoelectric plate having front and back surfaces. The back surface of the piezoelectric plate is attached to the surface of the substrate except for a portion of the piezoelectric plate forming a diaphragm that spans a cavity in the substrate. An interdigital transducer (IDT) is formed on the front surface of the piezoelectric plate such that interleaved fingers of the IDT are disposed on the diaphragm. One or more diaphragm support pedestals extend between the substrate and the diaphragm within the cavity.Type: GrantFiled: March 31, 2022Date of Patent: June 18, 2024Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Andrew Kay, Ventsislav Yantchev, Patrick Turner
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Patent number: 12005707Abstract: A liquid discharge head includes a flow passage member, a sealing member, and an actuator member. The flow passage member is formed with individual flow passages each including a nozzle and a pressure chamber and the flow passage member has a surface on which the pressure chamber is open. The sealing member is arranged on the surface and seals the pressure chamber. The actuator member has a piezoelectric layer, a driving electrode, and a high electric potential portion. The piezoelectric layer is adhered to a first surface of the sealing member on a side opposite to the flow passage member, via a first adhesive having an insulating property. The driving electrode is arranged on a side opposite to the sealing member with respect to the piezoelectric layer at a position overlapped with the pressure chamber in a first direction orthogonal to the surface.Type: GrantFiled: May 24, 2022Date of Patent: June 11, 2024Assignee: BROTHER KOGYO KABUSHIKI KAISHAInventors: Keiji Kura, Takashi Aiba, Rui Wang, Shotaro Kanzaki
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Patent number: 12005709Abstract: A liquid discharging head includes a nozzle configured to discharge liquid, a pressure chamber communicated with the nozzle, and an individual channel communicated with the pressure chamber through a narrow part. The liquid discharging head also includes a common channel communicated with the individual channel, an energy generation element configured to generate energy, and a diaphragm configured to convey the energy to the pressure chamber. A metal oxide film is formed at inner walls of the nozzle, the pressure chamber, the narrow part, the diaphragm, and the individual channel, and a hydroxyl group has come out from the metal oxide film.Type: GrantFiled: August 8, 2022Date of Patent: June 11, 2024Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Shuhei Nakatani, Kazunobu Irie
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Patent number: 12009805Abstract: An improved DMS filter with electrode structures between a first port and a second port is provided. Wiring junctions are realized in multilayer crossing with dielectric material in between. There are insulating patches (L2) between crossing conductor layers (L1,L3). Signal wirings may be realized with multiple conductor layers (L1, L3) to reduce wiring resistance and the upper conductor layer (L3) of the signal wiring may partly overlap the insulating patches (L2). The insulating patches (L2) may extend over the acoustic path to achieve temperature compensation.Type: GrantFiled: March 16, 2020Date of Patent: June 11, 2024Assignee: RF360 Singapore Pte. Ltd.Inventors: Thomas Bauer, Ansgar Schäufele, Thomas Dengler
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Patent number: 12009162Abstract: An electronic device includes an enclosure and a keyboard positioned within the enclosure. The keyboard includes a substrate and a key mechanism. The key mechanism includes a keycap support mechanism, a keycap supported by the keycap support mechanism and movable relative to the substrate, a ferromagnetic component attached to the keycap support mechanism, and a selectively magnetizable magnet. The selectively magnetizable magnet system may include a magnetizable material and a coil configured to selectively magnetize and demagnetize the magnetizable material. The key mechanism may include a collapsible dome biasing the keycap toward the extended position.Type: GrantFiled: November 10, 2022Date of Patent: June 11, 2024Assignee: APPLE INC.Inventors: Riley E. Brandt, Richard H. Koch, Zhipeng Zhang, John C. DiFonzo, Michael B. Wittenberg
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Pressure sensor including a microelectromechanical transducer and relating pressure-detection method
Patent number: 12006207Abstract: A pressure sensor including: a structure which delimits a main cavity of a closed type, the structure being at least partially deformable as a function of a pressure external to the structure; and a MEMS device, which is arranged in the main cavity and generates an output signal, which is of an electrical type and is indicative of the pressure inside the main cavity.Type: GrantFiled: November 30, 2022Date of Patent: June 11, 2024Assignee: STMICROELECTRONICS S.r.l.Inventor: Mario Giuseppe Pavone -
Patent number: 12004373Abstract: A display apparatus includes a display panel configured to display an image and a plurality of vibration generating devices configured to vibrate the display panel. Each of the plurality of vibration generating devices includes a plurality of first portions having a piezoelectric characteristic and a plurality of second portions disposed near the plurality of first portions to have an expansion coefficient, and the plurality of vibration generating devices have different expansion coefficients.Type: GrantFiled: December 4, 2020Date of Patent: June 4, 2024Assignee: LG DISPLAY CO., LTD.Inventors: YuSeon Kho, Yong-Su Ham, YongWoo Lee
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Patent number: 12004428Abstract: An oscillator frequency modulation method includes: providing a piezoelectric material having a surface and an interior; and performing a pattern process on the piezoelectric material by a laser. A patterned processing zone is formed on the surface and/or in the interior of the piezoelectric material. The pattern process may be a material removal and/or a material modification. Therefore, without changing the appearance of the piezoelectric material, the pattern process on the piezoelectric material through the laser can accurately adjust the frequency of the oscillator and block unnecessary mode at the same time. An oscillator piezoelectric structure with frequency modulation is also provided.Type: GrantFiled: March 14, 2022Date of Patent: June 4, 2024Assignee: National Central UniversityInventors: Jeng-Rong Ho, Chih-Kuang Lin, Pi-Cheng Tung
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Patent number: 11998390Abstract: A piezoelectric actuator includes a vibrating plate including a first surface that closes an opening provided in a substrate and a second surface in which a plurality of piezoelectric elements is provided, a suppression part configured to suppress a vibration of the vibrating plate, and a first wall and a second wall protruding from the first surface to the opening. When a portion where the first electrode, the piezoelectric layer and the second electrode overlap each other is an active part of the piezoelectric element, the first wall and the second wall are provided to sandwich the active part in plan view from the stacking direction of the first electrode, the piezoelectric layer and the second electrode, and the second wall is different from the first wall at least in one of the width, height, length and physical property.Type: GrantFiled: November 24, 2021Date of Patent: June 4, 2024Assignee: SEIKO EPSON CORPORATIONInventors: Koji Ohashi, Chikara Kojima, Makoto Furuhata, Tomohide Onogi, Tomohiro Sayama
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Patent number: 12003226Abstract: An acoustic resonator device with low thermal impedance has a substrate and a single-crystal piezoelectric plate having a back surface attached to a top surface of the substrate via a bonding oxide (BOX) layer. An interdigital transducer (IDT) formed on the front surface of the plate has interleaved fingers disposed on a diaphragm of the plate that is formed over a cavity in the substrate. The piezoelectric plate and the BOX layer are removed from a least a portion of the surface area of the substrate to provide lower thermal resistance between the IDT and the substrate.Type: GrantFiled: May 12, 2021Date of Patent: June 4, 2024Assignee: MURATA MANUFACTURING CO., LTDInventors: Greg Dyer, Chris O'Brien, Neal O. Fenzi, James R. Costa
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Patent number: 11994740Abstract: An optical element drive mechanism is provided. The optical element drive mechanism includes an immovable part, a movable part, and a drive assembly. The movable part is connected to an optical element that includes an optical axis. The movable part is movable relative to the immovable part. The drive assembly drives the movable part to move relative to the immovable part.Type: GrantFiled: August 27, 2021Date of Patent: May 28, 2024Assignee: TDK TAIWAN CORP.Inventors: Pai-Jui Cheng, Shu-Shan Chen, Chieh-An Chang, Chao-Chang Hu
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Patent number: 11990887Abstract: The vibrator device includes a vibrator element, a relay substrate, a base, an element-side bonding member for bonding the vibrator element and the relay substrate to each other, and a base-side bonding member for bonding the base and the relay substrate to each other. Further, the element-side bonding member has a first bonding member and s second bonding member arranged side by side along an A axis. Further, an X axis of a first quartz crystal substrate provided to the vibrator element is parallel to the A axis, and a second quartz crystal substrate provided to the relay substrate is a Z-cut quartz crystal substrate.Type: GrantFiled: April 14, 2021Date of Patent: May 21, 2024Assignee: SEIKO EPSON CORPORATIONInventors: Ryuta Nishizawa, Shinya Aoki, Atsushi Matsuo
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Patent number: 11979132Abstract: A method for manufacturing a substrate for a radiofrequency filter by joining a piezoelectric layer to a carrier substrate via an electrically insulating layer, wherein the method comprises depositing the electrically insulating layer by spin coating an oxide belonging to the family of SOGs (spin-on glasses) on the surface of the piezoelectric layer to be joined to the carrier substrate, followed by an anneal for densifying the electrically insulating layer before joining the piezoelectric layer to the carrier substrate via the electrically insulating layer.Type: GrantFiled: March 27, 2019Date of Patent: May 7, 2024Assignee: SoitecInventors: Djamel Belhachemi, Thierry Barge
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Patent number: 11979140Abstract: A method of forming a film bulk acoustic wave resonator comprises depositing a bottom electrode on an upper surface of a layer of dielectric material disposed over a cavity defined between the layer of dielectric material and a substrate, depositing a seed layer of piezoelectric material on an upper surface of the bottom electrode, etching one or more openings through the seed layer of piezoelectric material, etching of the one or more openings including over-etching of the seed layer in an amount sufficient to damage portions of the upper surface of the bottom electrode exposed by etching of the one or more openings, and depositing a bulk film of the piezoelectric material on an upper surface of the seed layer, on a portion of the upper surface of bottom electrode including the damaged portions, and on a portion of the upper surface of the dielectric layer.Type: GrantFiled: April 25, 2023Date of Patent: May 7, 2024Assignee: SKYWORKS GLOBAL PTE. LTD.Inventors: Nobufumi Matsuo, Kwang Jae Shin
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Patent number: 11969757Abstract: A method for manufacturing a PMUT device including a piezoelectric element located at a membrane element is provided. The method includes receiving a silicon on insulator substrate having a first silicon layer, an oxide layer, and a second silicon layer. Portions of a first surface of the second silicon layer are exposed by removing exposed side portions of the first silicon layer and corresponding portions of the oxide layer, and a central portion including the remaining portions of the first silicon layer and of the oxide layer is defined. Anchor portions for the membrane element are formed at the exposed portions of the first surface of the second silicon layer. The piezoelectric element is formed above the central portion, and the membrane element is defined by selectively removing the second layer and removing the remaining portion of the oxide from under the remaining portion of the first silicon layer.Type: GrantFiled: March 3, 2021Date of Patent: April 30, 2024Assignee: STMICROELECTRONICS S.r.l.Inventors: Federico Vercesi, Alessandro Danei, Giorgio Allegato, Gabriele Gattere, Roberto Campedelli
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Patent number: 11973489Abstract: A radio frequency filter includes at least a first sub-filter and a second sub-filter connected in parallel between a first port and a second port. Each of the sub-filters has a piezoelectric plate having front and back surfaces, the back surface attached to a substrate, and portions of the piezoelectric plate forming diaphragms spanning respective cavities in the substrate. A conductor pattern is formed on the front surface of the plate, the conductor pattern includes interdigital transducers (IDTs) of a respective plurality of resonators, with interleaved fingers of each IDT disposed on a respective diaphragm of the plurality of diaphragms. A thickness of the portions of the piezoelectric plate of the first sub-filter is different from a thickness of the portions of the piezoelectric plate of the second sub-filter.Type: GrantFiled: September 8, 2022Date of Patent: April 30, 2024Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Andrew Guyette, Neal Fenzi, Greg Dyer, Sean McHugh
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Patent number: 11967944Abstract: The vibrator element includes a vibrating arm provided with an arm part, and a weight part which has a weight, the weight is provided with at least one processing scar, when an axis which overlaps a center in a width direction of the vibrating arm, and which extends along an extending direction of the vibrating arm is a central axis, and an axis which overlaps a centroid of the vibrating arm, and which extends along the extending direction of the vibrating arm is a centroid axis, the processing scar is formed in at least an area at an opposite side to the centroid axis, and S1<S2 an area of the processing scar located at the centroid axis side with respect to the central axis is S1, and an area of the processing scar located at an opposite side to the centroid axis with respect to the central axis is S2.Type: GrantFiled: February 18, 2021Date of Patent: April 23, 2024Assignee: SEIKO EPSON CORPORATIONInventor: Hideaki Kurita
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Patent number: 11965785Abstract: Provided is a pressure-sensitive element having more sufficient expandability, a relatively wide measurement range of pressure force, and a relatively simple structure, and an electronic device using the pressure-sensitive element. The pressure-sensitive element includes a plurality of first electrodes being elongated in first direction, arranged in a first plane, and including a conductive elastic body, a plurality of second electrodes being elongated in second direction intersecting the first direction, arranged in a second plane facing the first plane, and including a conductor wire, and a plurality of dielectrics covering a surface of the plurality of second electrodes. The plurality of second electrodes have bent parts K arranged periodically, and capacitance at intersections of the plurality of first electrodes and the plurality of second electrodes changes in accordance with pressure force applied between the plurality of first electrodes and the plurality of second electrodes.Type: GrantFiled: April 2, 2021Date of Patent: April 23, 2024Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Yuta Moriura, Yui Sawada, Shinobu Masuda, Hironobu Ukitsu, Takashi Matsumoto, Mitsutaka Matsumoto
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Patent number: 11957313Abstract: An endoscope includes an imager unit loading region provided at a distal end portion of an insertion portion, a cable connection surface, a wall provided to connect an opening of the imager unit loading region and an opening of the cable connection surface to each other, a contact pattern formed on a wall surface of the imager unit loading region, a wiring pattern formed on a front surface of the cable connection surface from the wall, a connection pattern formed on the cable connection surface, and a through-electrode formed in the wall so that the imager unit loading region and the cable connection surface communicate with each other, configured to cause the contact pattern and the wiring pattern to electrically continue to each other, and formed at a predetermined angle with respect to a center axis of the distal end barrel member.Type: GrantFiled: September 8, 2022Date of Patent: April 16, 2024Assignee: OLYMPUS CORPORATIONInventors: Kenjiro Kanno, Shigeru Hosokai, Takuro Horibe, Daichi Kodama, Hiroyuki Motohara
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Patent number: 11962284Abstract: A composite substrate is a plate-shaped body where a first substrate and a second substrate overlap. The composite substrate includes a hole in the first substrate and the second substrate in a thickness direction of the plate-shaped body. A ratio A/B of an average thickness A of the first substrate to an average thickness B of the second substrate is ? or less. An interface between the first substrate and the second substrate on an inner wall of the plate-shaped body that is positioned at the hole includes a part that is covered by a covering layer that contains a component that composes the second substrate.Type: GrantFiled: July 29, 2019Date of Patent: April 16, 2024Assignee: KYOCERA CORPORATIONInventor: Koji Hamazono
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Patent number: 11961670Abstract: A system may include a capacitor for an electronic device of an electric vehicle; a main bus bar; and a capacitor bus bar configured to connect the capacitor to the main bus bar, wherein the capacitor bus bar includes a first portion that is perpendicular to the main bus bar, and wherein the capacitor bus bar includes a second portion that extends from the first portion, that is perpendicular to the first portion, and that is planar with the main bus bar.Type: GrantFiled: October 6, 2022Date of Patent: April 16, 2024Assignee: Delphi Technologies IP LimitedInventors: Rajesh Mittu Ram Yadav, Teng Zhi Jau, Wayne Anthony Sozansky
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Patent number: 11950962Abstract: Ultrasound imaging systems and methods for generated clutter-reduced images are provided. For example, an ultrasound imaging system can include an array of acoustic elements in communication with a processor. The processor is configured to activate the array to perform a scan sequence to obtain a plurality of signals, identify off-axis signals from the plurality of signals by comparing the right subaperture and the left subaperture, and create a clutter-reduced image based on the comparison. Because off-axis signals are more likely to create image clutter, reducing the influence of off-axis signals on the image can therefore improve the quality of the image. Accordingly, embodiments of the present disclosure provide systems, methods, and devices for generating ultrasound images that have reduced or minimized clutter, even for images obtained using arrays that do not satisfy the Nyquist criterion.Type: GrantFiled: November 1, 2022Date of Patent: April 9, 2024Assignee: PHILIPS IMAGE GUIDED THERAPY CORPORATIONInventors: Andrew Hancock, Yiqun Yang, David Hope Simpson, Francois Guy Gerard Marie Vignon, Jun Seob Shin
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Patent number: 11955950Abstract: A formation method of a filter device includes: forming a first layer by providing a first substrate and forming a resonance device preprocessing layer with a first side and a second side opposite to the first side, wherein the first substrate is located on the first side; forming a second layer by providing a second substrate and forming a first passive device with a third side and a fourth side opposite to the third side, wherein the second substrate is located on the third side; connecting the first layer located on the fourth side and the second layer located on the second side; removing the first substrate; and forming at least one first resonance device based on the resonance device preprocessing layer. The resonance device and the passive device are integrated in one die to form a filter device, which requires less space in an RF front-end chip.Type: GrantFiled: July 28, 2020Date of Patent: April 9, 2024Assignee: SHENZHEN SUNWAY COMMUNICATION CO., LTD.Inventors: Chengcheng Yu, Yanjie Cao, Wei Wang
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Patent number: 11948610Abstract: A suspension is described. The suspension includes a base plate and a load beam coupled to the base plate. The base plate includes a distal elongated element and a proximal elongated element. The distal elongated element includes at least one non-straight baseplate edge and the proximal elongated element includes at least one non-straight baseplate edge. The load beam includes a first mounting shelf and a second mounting shelf. The load beam is coupled to the base plate such that the first mounting shelf is exposed adjacent to the distal elongated element, and the second mounting shelf is exposed adjacent to the proximal elongated element. The first and second mounting shelves are configured to receive an actuator, such that an edge of the actuator and the at least one non-straight baseplate edge forms a gap.Type: GrantFiled: September 15, 2022Date of Patent: April 2, 2024Assignee: Magnecomp CorporationInventors: Kuen Chee Ee, Ekaratch Pankaew, Preecha Sudachun
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Patent number: 11949399Abstract: Resonator devices, filter devices, and methods of fabrication are disclosed. A resonator device includes a substrate and a single-crystal piezoelectric plate having front and back surfaces. An acoustic Bragg reflector is sandwiched between a surface of the substrate and the back surface of the piezoelectric plate. An interdigital transducer (IDT) is formed on the front surface of the piezoelectric plate. The IDT and the piezoelectric plate are configured such that a radio frequency signal applied to the IDT excites a primary acoustic mode within the piezoelectric plate. The acoustic Bragg reflector comprises alternating SiO2 and diamond layers and is configured to reflect the primary acoustic mode.Type: GrantFiled: January 27, 2022Date of Patent: April 2, 2024Assignee: MURATA MANUFACTURING CO., LTD.Inventor: Ventsislav Yantchev
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Acoustic transducer with gap-controlling geometry and method of manufacturing an acoustic transducer
Patent number: 11950052Abstract: A transducer of the preferred embodiment including a transducer and a plurality of adjacent, tapered cantilevered beams. Each of the beams define a beam base, a beam tip, and a beam body disposed between the beam base and the beam tip. The beams are arranged such that each of the beam tips extends toward a common area. Each beam is joined to the substrate along the beam base and is free from the substrate along the beam body. A preferred method of manufacturing a transducer can include: depositing alternating layers of piezoelectric and electrode onto the substrate in block, processing the deposited layers to define cantilever geometry in block, depositing metal traces in block, and releasing the cantilevered beams from the substrate in block.Type: GrantFiled: February 18, 2022Date of Patent: April 2, 2024Assignee: QUALCOMM Technologies, Inc.Inventors: Karl Grosh, Robert J. Littrell -
Patent number: 11938515Abstract: The teachings of the present disclosure enable the manufacture of one or more piezoelectric micromachined ultrasonic transducers (PMUTs) having a resonant frequency of a specific target value and/or substantially matched resonant frequencies. In accordance with the present disclosure, a flexible membrane of a PMUT is modified to impart a desired parameter profile for stiffness and/or mass to tune its resonant frequency to a target value. The desired parameter profile is achieved by locally removing or adding material to regions of one or more layers of the flexible membrane to alter its geometric dimensions and/or density. In some embodiments, material is added or removed non-uniformly across the structural layer to realize a material distribution that more strongly affects membrane stiffness than mass. In some embodiments, material having a specific residual stress is added to, and/or removed from, the membrane to define a desired modal stiffness for the membrane.Type: GrantFiled: December 21, 2018Date of Patent: March 26, 2024Assignee: InvenSense, Inc.Inventors: Fabian Goericke, Stefon Shelton, Benedict Costello
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Patent number: 11938680Abstract: The disclosure belongs to the technical field of additive manufacturing, and discloses a flexible piezoelectric sensor based on 4D printing and a preparation method thereof. The sensor includes a magnetic part and a conductive part, wherein: the conductive part includes two substrates disposed opposite to each other and a spiral structure disposed between the two substrates. Both the two substrates and the spiral structure are made of conductive metal materials. The magnetic part has a flexible porous structure and is arranged between the two substrates to generate a magnetic field. When the substrate is subjected to external pressure, the spiral structure and the magnetic part are compressed simultaneously, the magnetic flux passing through the spiral structure changes, and the voltage of the two substrates changes, by measuring the voltage change of the two substrates to reflect the change of external pressure, the pressure measuring process is achieved.Type: GrantFiled: September 30, 2020Date of Patent: March 26, 2024Assignee: HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGYInventors: Bin Su, Hongzhi Wu, Chunze Yan, Yusheng Shi
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Patent number: 11941974Abstract: Systems, methods, and devices for haptic feedback are provided. A microfluidic device includes an inlet port for supplying a fluid into the microfluidic device. A tube receives the fluid from the inlet port. The microfluidic device includes a piezoelectric actuator for realizing a displacement of a substrate to which the microfluidic device is attached, the displacement based on an electrical actuation applied to the piezoelectric actuator, and an amount of the fluid or a pressure in the tube. In some embodiments, the tube includes a carbon nanotube. In some embodiments, an amount of the fluid in the tube is controlled by an actuator (e.g., the piezoelectric actuator).Type: GrantFiled: July 20, 2022Date of Patent: March 26, 2024Assignee: TDK CORPORATIONInventor: Rakesh Sethi
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Patent number: 11942916Abstract: A film bulk acoustic resonator and a fabricating method thereof is provided. The fabricating method includes: fabricating a lower electrode on a first surface of an SOI substrate; forming piezoelectric layers on the first surface of the SOI substrate and the lower electrode; forming top electrodes on the piezoelectric layers; processing an air cavity on a second surface of the SOI substrate, wherein the second surface and the first surface are oppositely arranged. The fabricating method simplifies a preparation process of FBAR, a quality of a AlN film crystal grown though the fabrication method is high, an improvement of a device performance is facilitated, and meanwhile a thickness of a top silicon is controlled through a position of a silicon injected oxygen isolation to regulate a frequency of the film bulk acoustic resonator.Type: GrantFiled: October 19, 2018Date of Patent: March 26, 2024Assignee: SUZHOU INSTITUTE OF NANO-TECH AND NANO-BIONICS (SINANO), CHINESE ACADEMY OF SCIENCESInventors: Xiaodong Zhang, Wenkui Lin, Baoshun Zhang
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Patent number: 11942915Abstract: A bulk acoustic wave resonator device comprises bottom and top electrodes (120, 360). A piezoelectric layer (355) sandwiched therebetween has a thickness in the active resonator area different from the thickness in the surrounding area. A method of manufacturing the device comprises a bonding of a piezoelectric wafer to a carrier wafer and splitting a portion of the piezoelectric wafer by an ion-cut technique. Different thicknesses of the piezoelectric layer in the active area and the surrounding area are achieved by implanting ions at different depths.Type: GrantFiled: March 7, 2019Date of Patent: March 26, 2024Assignee: RF360 Singapore Pte. Ltd.Inventors: Ulrike Roesler, Willi Aigner, Maximilian Schiek, Giuseppe Toscano
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Patent number: 11931777Abstract: Disclosed is a method for manufacturing an ultrasonic transducer assembly comprising an ultrasonic transducer chip having a main surface comprising a plurality of ultrasound transducer elements and a plurality of first contacts for connecting to said ultrasound transducer elements, a contact chip having a further main surface comprising a plurality of second contacts, a backing member comprising ultrasound absorbing and/or scattering bodies, said backing member comprising a first surface on which the transducer chip is mounted and a second surface on which the contact chip is mounted. A flexible interconnect extends over said backing member from the main surface to the further main surface, the flexible interconnect comprising a plurality of conductive tracks, each conductive track connecting one of said first contacts to a second contact.Type: GrantFiled: September 24, 2020Date of Patent: March 19, 2024Assignee: KONINKLIJKE PHILIPS N.V.Inventors: Johannes Wilhelmus Weekamp, Vincent Adrianus Henneken, Alfons Wouter Groenland, Marcus Cornelis Louwerse
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Patent number: 11932017Abstract: A liquid discharge head includes a diaphragm, a first electrode, a piezoelectric body, and a second electrode which are stacked in this order in a first direction, in which when a region of the piezoelectric body interposed between the first electrode and the second electrode is set as a first region, a region of the piezoelectric body other than the first region is set as a second region, a portion of the diaphragm that overlaps a boundary between the first region and the second region when viewed in the first direction is set as a first portion, and a portion of the diaphragm that is different from the first portion and overlaps the first region when viewed in the first direction is set as a second portion, a thickness of the first portion is smaller than a thickness of the second portion.Type: GrantFiled: October 25, 2021Date of Patent: March 19, 2024Assignee: Seiko Epson CorporationInventor: Motoki Takabe
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Patent number: 11936358Abstract: An acoustic resonator device with low thermal impedance has a substrate and a single-crystal piezoelectric plate having a back surface attached to a top surface of the substrate via a bonding oxide (BOX) layer. An interdigital transducer (IDT) formed on the front surface of the plate has interleaved fingers disposed on the diaphragm. The piezoelectric plate and the BOX layer are removed from a least a portion of the surface area of the device to provide lower thermal resistance between the conductor pattern and the substrate.Type: GrantFiled: March 30, 2021Date of Patent: March 19, 2024Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Greg Dyer, Chris O'Brien, Neal O. Fenzi, James R. Costa
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Patent number: 11936367Abstract: An acoustic wave resonator is disclosed. The acoustic wave resonator can include a piezoelectric layer, an interdigital transducer electrode positioned over the piezoelectric layer, a temperature compensation layer positioned over the interdigital transducer electrode, and a velocity reduction cover that extends over at least a portion of a central region of the interdigital transducer electrode and over at least a portion of the temperature compensation layer. The velocity reduction cover is arranged to cause a velocity of an acoustic wave generated by the acoustic wave resonator to be reduced.Type: GrantFiled: October 27, 2020Date of Patent: March 19, 2024Assignee: Skyworks Solutions, Inc.Inventors: Hironori Fukuhara, Rei Goto
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Patent number: 11929730Abstract: An acoustic wave element includes: a substrate; a bonding structure on the substrate; a support layer on the bonding structure; a first electrode including a lower surface on the support layer; a cavity positioned between the support layer and the first electrode and exposing a lower surface of the first electrode; a piezoelectric layer on the first electrode; and a second electrode on the piezoelectric layer, wherein at least one of the first electrode and the second electrode includes a first layer and a second layer that the first layer has a first acoustic impedance and a first electrical impedance, the second layer has a second acoustic impedance and a second electrical impedance, wherein the first acoustic impedance is higher than the second acoustic impedance, and the second electrical impedance is lower than the first electrical impedance.Type: GrantFiled: February 10, 2021Date of Patent: March 12, 2024Assignee: EPISTAR CORPORATIONInventors: Ta-Cheng Hsu, Wei-Shou Chen, Chun-Yi Lin, Chung-Jen Chung, Wei-Tsuen Ye, Wei-Ching Guo
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Patent number: 11912031Abstract: An active portion of a piezoelectric actuator includes a first region provided in a region opposed to a recess and extending in a first direction, and a second region provided in a region corresponding to a central part in the first direction of the recess, and being configured such that a laminated body including the active portion and a vibration plate has a thickness larger than a thickness of a portion corresponding to the first region and that deformation of the second region is suppressed as compared to deformation of the first region when a voltage is applied between a first electrode and a second electrode.Type: GrantFiled: December 28, 2021Date of Patent: February 27, 2024Assignee: Seiko Epson CorporationInventors: Yasushi Yamazaki, Daisuke Nagano
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Patent number: 11906375Abstract: The present disclosure is directed to methods for low-cost, high-volume production of strain gages having substantially uniform gage-to-gage resistances. Strain gages in accordance with the present disclosure are sculpted from a device layer of a semiconductor-on-insulator wafer using deep reactive ion etching, thereby enabling well-controlled electrical properties and physical dimensions of the strain gages. In some embodiments, groups of fully fabricated strain gages are physically connected to handling frames via sprues to facilitate handling, automated assembly, and/or tracing of individual gages from the beginning of fabrication through final packaging. In some embodiments, sprues are configured to mitigate accidental separation of the gages from their frames while simultaneously enabling their removal in response to specific forces applied by a handling tool.Type: GrantFiled: March 21, 2022Date of Patent: February 20, 2024Assignee: Piezo-Metrics IncInventors: Franklin Curtis Wong, Robert Andrew Mueller, Kimberly Lakea Harrison, Farzad Khademolhosseini, Carolyn D. Bianco
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Patent number: 11910159Abstract: An object is to provide a laminated piezoelectric element capable of preventing a short circuit between adjacent piezoelectric films and an electroacoustic transducer using the laminated piezoelectric element. The object is solved by laminating a plurality of layers of piezoelectric films polarized in a thickness direction, in which a piezoelectric layer is interposed between two thin film electrodes, and causing polarization directions of the adjacent piezoelectric films to be opposite to each other.Type: GrantFiled: May 7, 2021Date of Patent: February 20, 2024Assignee: FUJIFILM CorporationInventor: Tetsu Miyoshi
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Patent number: 11890900Abstract: The transmitter is arranged in a tire attached to a wheel and configured to transmit data to a receiver. The transmitter includes an obtaining section configured to obtain a detection result of the sensor, a generating section configured to generate the data including the detection result of the sensor, a transmitting section configured to transmit the data generated by the generating section, and an organic power generation element that is a power source of the transmitter. The organic power generation element is configured to generate power through a chemical reaction with organic matter contained in a fuel solution accommodated in the tire.Type: GrantFiled: December 26, 2018Date of Patent: February 6, 2024Assignee: PACIFIC INDUSTRIAL CO., LTD.Inventors: Akira Momose, Yasuhisa Tsujita
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Patent number: 11895921Abstract: A preparation method for a piezoelectric fiber is provided including a piezoelectric functional layer and an insulating layer coated on the piezoelectric functional layer. The piezoelectric functional layer includes a piezoelectric composite layer of a spiral winding structure, and the piezoelectric composite layer includes a first piezoelectric layer, a conductive layer and a second piezoelectric layer that are sequentially stacked. The preparation method includes taking one end of the piezoelectric composite layer as a winding axis, winding the piezoelectric composite layer in a direction perpendicular to the winding axis to form the piezoelectric functional layer, wherein turns of winding the piezoelectric composite layer are greater than 5, coating the piezoelectric functional layer with the insulating layer, and vacuum heating to consolidate, to prepare a preform rod.Type: GrantFiled: June 25, 2021Date of Patent: February 6, 2024Assignees: NANTONG TEXTILE & SILK IND TECH RES INST, SOOCHOW UNIVERSITYInventors: Yuqing Liu, Yuting Wang, Jing Hu, Xin Yang, Ranran Li, Jian Fang