Piezoelectric Device Making Patents (Class 29/25.35)
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Patent number: 12257840Abstract: A head chip, a liquid jet head, and a liquid jet recording device each capable of achieving a reduction in size and an increase in nozzle density are provided.Type: GrantFiled: December 15, 2022Date of Patent: March 25, 2025Assignee: SII PRINTEK INC.Inventor: Hitoshi Nakayama
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Patent number: 12261586Abstract: A surface acoustic wave resonator device, and method for manufacturing the same and filter, the method includes: forming an interdigital transducer including interdigital electrodes on the piezoelectric substrate; forming the interdigital transducer includes: forming initial interdigital electrodes on the piezoelectric substrate, wherein each initial interdigital electrode has a first width, and every two adjacent initial interdigital electrodes have an initial interdigital gap with a first spacing therebetween; and forming additional interdigital electrodes on the piezoelectric substrate, wherein each initial interdigital gap has a portion filled by one of additional interdigital electrodes; each interdigital electrode includes an initial interdigital electrode and an additional interdigital electrode connected to each other; each interdigital electrode has a second width, and every two adjacent interdigital electrodes have a second spacing therebetween; the second width is greater than the first width, andType: GrantFiled: January 22, 2024Date of Patent: March 25, 2025Assignee: Shenzhen Newsonic Technologies Co., Ltd.Inventors: Chencheng Zhou, Jie Zou, Gongbin Tang
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Patent number: 12259270Abstract: A level fork protection sleeve includes a first cylinder and a second cylinder disposed within the first cylinder. The cylinders are joined together via a material bonding such as welding. A gap in the second cylinder along its length provides a channel within the sleeve for the ingress and egress of liquid media. The sleeve is embodied to fit onto a shaft of a vibronic limit level device and to extend over and protect the vibrating member of the limit level device.Type: GrantFiled: October 17, 2022Date of Patent: March 25, 2025Assignee: Endress+Hauser SE+Co. KGInventors: Trevor Yenna, Wesley York
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Patent number: 12251878Abstract: The disclosure belongs to the technical field of additive manufacturing, and discloses a flexible piezoelectric sensor based on 4D printing. The sensor includes a magnetic part and a conductive part, wherein: the conductive part includes two substrates disposed opposite to each other and a spiral structure disposed between the two substrates. Both the two substrates and the spiral structure are made of conductive metal materials. The magnetic part has a flexible porous structure and is arranged between the two substrates to generate a magnetic field. When the two substrates are subjected to external pressure, the spiral structure and the magnetic part are compressed simultaneously, the magnetic flux passing through the spiral structure changes, and the voltage of the two substrates changes, by measuring the voltage change of the two substrates to reflect the change of external pressure, the pressure measuring process is achieved.Type: GrantFiled: December 21, 2023Date of Patent: March 18, 2025Assignee: HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGYInventors: Chunze Yan, Hongzhi Wu, Bin Su, Yusheng Shi
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Patent number: 12253143Abstract: An actuating device includes an actuator and a stationary portion. The actuator has at least one driving portion. The stationary portion is provided at an arbitrary position along the actuator such that the driving portion forms a first driving portion and a second driving portion. The first driving portion and the second driving portion can be provided with the same actuating ability or with different actuating abilities respectively by adjusting the position of the stationary portion.Type: GrantFiled: December 15, 2023Date of Patent: March 18, 2025Assignee: KOGE MICRO TECH CO., LTD.Inventors: Chih Chang, Po-Yuan Liao
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Patent number: 12255609Abstract: Techniques for improving acoustic wave device structures are disclosed, including filters and systems that may include such devices. An acoustic wave device may include a substrate. The acoustic wave device may include first and second layers of piezoelectric material acoustically coupled with one another, in which the first layer of piezoelectric material has a first piezoelectric axis orientation, and the second layer of piezoelectric material has a second piezoelectric axis orientation that substantially opposes the first piezoelectric axis orientation of the first layer of piezoelectric material. The acoustic wave device may include an interposer layer interposed between the first and second layers of piezoelectric material. The interposer may facilitate an enhancement of an electromechanical coupling coefficient of the acoustic wave device.Type: GrantFiled: December 29, 2021Date of Patent: March 18, 2025Assignee: QXONIX, INC.Inventors: Dariusz Burak, Kevin J. Grannen, Jack Lenell
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Patent number: 12249524Abstract: Provided in the embodiments are a transfer structure and a method thereof, and a transfer device and a manufacturing method thereof. The transfer structure includes: a first electrode, a piezoelectric layer, a second electrode and an adhesive layer stacked on a substrate in sequence, wherein the first electrode and the second electrode are insulated from each other. The transfer structure further includes: a position-limiting layer, wherein the position-limiting layer includes a cavity; the piezoelectric layer and at least part of the adhesive layer are located in the cavity of the position-limiting layer; and in the direction perpendicular to the substrate, the distance between the surface, away from the substrate, of the position-limiting layer and the substrate is greater than the distance between the surface, away from the substrate, of the adhesive layer and the substrate.Type: GrantFiled: May 29, 2020Date of Patent: March 11, 2025Assignee: BOE TECHNOLOGY GROUP CO., LTD.Inventors: Yang Yue, Tong Yang, Shi Shu, Yong Yu, Haitao Huang, Xiang Li, Qi Yao, Xue Jiang, Guangcai Yuan
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Patent number: 12235243Abstract: A cover unit includes: a body to which an ultrasound generator adapted to generate ultrasound is coupled; first slits disposed at a lower portion of the body in the form of multiple rings having different radii and spaced apart from each other, the first slits having a first width; second slits depressed from an upper surface of the body to communicate with the first slits and having a second width smaller than the first width; third slits depressed from the upper surface of the body and each disposed between adjacent second slits, the third slits having a third width smaller than the first width; a bottom formed under the first slits; a first sidewall formed between adjacent first slits; and a second sidewall formed between the second slit and the third slit.Type: GrantFiled: May 11, 2022Date of Patent: February 25, 2025Assignees: CENTER FOR ADVANCED META-MATERIALS, PUSAN NATIONAL UNIVERSITY INDUSTRY-UNIVERSITY COOPERATION FOUNDATIONInventors: Jun Hyuk Kwak, Kyung Jun Song, Jong Jin Park, Hak Joo Lee
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Patent number: 12218644Abstract: A resonator comprising a piezoelectric film which creates an acoustic path that is slightly longer in a central region of the resonator than at an edge of the resonator.Type: GrantFiled: March 5, 2021Date of Patent: February 4, 2025Inventor: David Woolsey
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Patent number: 12218650Abstract: Acoustic resonator devices and filters are disclosed. An acoustic resonator includes a substrate having a surface and a single-crystal lithium niobate (LN) plate having front and back surfaces, the back surface attached to the surface of the substrate except for a portion of the LN plate forming a diaphragm that spans a cavity in the substrate. An interdigital transducer (IDT) is formed on the front surface of the LN plate such that interleaved fingers of the IDT are disposed on the diaphragm. A half-lambda dielectric layer is formed on one of the front surface and back surface of the diaphragm. Euler angles of the LN plate are [0°, ?, 0°], where 20°???25°.Type: GrantFiled: August 3, 2023Date of Patent: February 4, 2025Assignee: MURATA MANUFACTURING CO., LTD.Inventor: Ventsislav Yantchev
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Patent number: 12190719Abstract: A sensor device for process variable determination in an industrial environment, comprising a sensor base and a first expansion module. The sensor base includes circuitry that determines the process variable, a first mechanical interface for mechanically accommodating a first expansion module and a first communication interface to the first expansion module for transmitting measurement and/or control data. In this case, the first expansion module has a second mechanical interface to the sensor base, a third mechanical interface for mechanically accommodating a second expansion module, a second communication interface to the sensor base for transmitting measurement and/or control data, and a third communication interface to the second expansion module for transmitting measurement and/or control data.Type: GrantFiled: December 20, 2019Date of Patent: January 7, 2025Assignee: VEGA Grieshaber KGInventors: Karl Griessbaum, Roland Welle
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Patent number: 12181661Abstract: In a micromirror device, the upper electrode of the piezoelectric element consists of a plurality of individual electrode parts, each of which is separated by a first stress inversion region and a second stress inversion region. In the first stress inversion region, positive and negative, of a principal stress component having a maximum absolute value among a principal stress, are inverted in a maximum displacement state, in a case of driving in a first resonance mode in which the mirror part is tilted and oscillated around the first axis. In the second stress inversion region, positive and negative, of a principal stress component having a maximum absolute value among a principal stress, are inverted, in a case of driving in a second resonance mode in which the mirror part is tilted and oscillated around the second axis.Type: GrantFiled: October 22, 2021Date of Patent: December 31, 2024Assignee: FUJIFILM CorporationInventor: Takayuki Naono
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Patent number: 12180656Abstract: A method of producing wet laid disposable bath tissue, facial tissue, and paper towel with enhanced properties through application of surface additives using a piezoelectrical apparatus or application device.Type: GrantFiled: September 24, 2021Date of Patent: December 31, 2024Assignee: First Quality Tissue, LLCInventors: James E. Sealey, II, Kevin Brennan, Justin S. Pence, Byrd Tyler Miller, IV, Matthew John Walkiewicz
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Patent number: 12185631Abstract: In some embodiments, the present disclosure relates to a piezomicroelectromechanical system (piezoMEMS) device that includes a second piezoelectric layer arranged over the first electrode layer. A second electrode layer is arranged over the second piezoelectric layer. A first contact is arranged over and extends through the second electrode layer and the second piezoelectric layer to contact the first electrode layer. A dielectric liner layer is arranged directly between the first contact and inner sidewalls of the second electrode layer and the second piezoelectric layer. A second contact is arranged over and electrically coupled to the second electrode layer, wherein the second contact is electrically isolated from the first contact.Type: GrantFiled: July 20, 2023Date of Patent: December 31, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Yi-Ren Wang, Hung-Hua Lin, Yuan-Chih Hsieh
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Patent number: 12178132Abstract: In a piezoelectric device, a piezoelectric driving portion includes layers and is directly or indirectly supported by a base portion. The piezoelectric driving portion includes a piezoelectric layer, an upper electrode layer, and a lower electrode layer. The upper electrode layer is disposed on the upper side of the piezoelectric layer. The lower electrode layer faces at least a portion of the upper electrode layer with the piezoelectric layer interposed therebetween. The piezoelectric driving portion includes a through groove extending through the piezoelectric driving portion in the vertical direction, so that a pair of inner side surfaces are provided. The pair of inner side surfaces each include a first small-width portion in which the width of the through groove decreases in a downward direction from an upper end surface of the piezoelectric layer.Type: GrantFiled: July 7, 2021Date of Patent: December 24, 2024Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Yutaka Kishimoto, Shinsuke Ikeuchi
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Patent number: 12170517Abstract: Multiplexers are disclosed. A multiplexer can include a first filter and a second filter that are coupled to a common node. The second filter can include a first type of acoustic wave resonators (e.g., bulk acoustic wave resonators) and a series acoustic wave resonator of a second type (e.g., a surface acoustic wave resonator) that is coupled between the acoustic wave resonators of the first type and the common node. The first filter can provide a single-ended radio frequency signal. In certain embodiments, the first filter can be a receive filter and the second filter can be a transmit filter.Type: GrantFiled: July 25, 2023Date of Patent: December 17, 2024Assignee: Skyworks Solutions, Inc.Inventors: Yoshiaki Ando, Yasuyuki Saito, Hiroyuki Nakamura
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Patent number: 12170513Abstract: An acoustic resonator device with low thermal impedance has a substrate and a single-crystal piezoelectric plate having a back surface attached to a top surface of the substrate via a bonding oxide (BOX) layer. An interdigital transducer (IDT) formed on the front surface of the plate has interleaved fingers disposed on the diaphragm, the overlapping distance of the interleaved fingers defining an aperture of the resonator device. Contact pads are formed at selected locations over the surface of the substrate to provide electrical connections between the IDT and contact bumps to be attached to the contact pads. The piezoelectric plate is removed from at least a portion of the surface area of the device beneath each of the contact pads to provide lower thermal resistance between the contact bumps and the substrate.Type: GrantFiled: October 20, 2021Date of Patent: December 17, 2024Assignee: Murata Manufacturing Co., Ltd.Inventors: Albert Cardona, Chris O'Brien, Greg Dyer
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Patent number: 12166467Abstract: The disclosed technology generally relates to packaging a quartz crystal, and more particularly to bonding a quartz crystal using sintering silver paste. In one aspect, a method of packaging a quartz crystal comprises attaching a quartz crystal to a package substrate using one or more silver paste layers comprising silver particles. The method additionally comprises sintering the silver paste in a substantially oxygen-free atmosphere and at a sintering temperature sufficient to cause sintering of the silver particles. The sintering is such that the quartz crystal exhibits a positive drift in resonance frequency of the quartz crystal over time. The method further comprises hermetically sealing the quartz crystal in the package substrate.Type: GrantFiled: July 16, 2021Date of Patent: December 10, 2024Assignee: Statek CorporationInventors: Yue Fang, Thomas Pham
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Patent number: 12166195Abstract: A method reduces internal resistance of a battery (204, 300). In the method, a charging current is directed to a battery (204, 300), where the charging current includes spin-polarized and charged electrons. A dedicated spin generator (203) is capable of providing the charging current including spin-polarized and charged electrons. Next, the battery (204, 300) has been manufactured so that the battery includes either ferroelectric or pyroelectric material at least either in an anode (305), in a cathode (302), or in an other element of the battery (204, 300). The material can be selected to be polyvinylidene fluoride (“PVDF”) or modified materials thereof. After at least one cycle of charging of the battery (204, 300), the battery (204, 300) with reduced internal resistance is obtained.Type: GrantFiled: July 10, 2020Date of Patent: December 10, 2024Assignee: QID OYInventors: Pekka Tapani Saastamoinen, Reijo Lappalainen, Petteri Koljonen
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Patent number: 12151934Abstract: A wearable sound device includes a venting module, configured to form at least one vent to connect a volume within the wearable sound device and ambient, and a sound producing device, configured to produce sound according to an equalized input signal. The venting module, including at least one venting device, operates among a plurality of statuses corresponding to a plurality of degrees of opening. A controller generates the equalized input signal according to a degree of opening among the plurality of degrees of opening, in order to counteract a roll off caused by the at least one vent.Type: GrantFiled: February 6, 2024Date of Patent: November 26, 2024Assignee: xMEMS Labs, Inc.Inventors: Yanchen Lu, Jemm Yue Liang, Michael David Housholder, Jengyaw Jiang
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Patent number: 12155995Abstract: A disclosed vibration device comprises a first vibration generator and a first connection member disposed on a first surface of the first vibration generator. The first vibration generator may comprise a first vibration part including a plurality of inorganic material portions having a piezoelectric characteristic and an organic material portion between the plurality of inorganic material portions.Type: GrantFiled: October 17, 2023Date of Patent: November 26, 2024Assignee: LG DISPLAY CO., LTD.Inventors: Sungwook Ko, Minji Kim, SeungRyull Park
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Patent number: 12144512Abstract: A surgical footswitch for controlling a surgical instrument. The surgical footswitch includes a base. A treadle is rotatably coupled to the base to operate the surgical instrument. A foot guard is also rotatably coupled to the base. A blocking portion of the foot guard is configured to prevent physical access to the treadle in a lateral direction in a first position and permit access to the treadle in a lateral direction in a second position. A floor engagement portion of the foot guard engages a floor surface when the blocking portion is in the first position. The floor engagement portion is spaced from the floor surface when the blocking portion is in the second position. The floor engagement portion permits physical access to the treadle in a longitudinal direction when the blocking portion is in both the first position and the second position.Type: GrantFiled: November 24, 2021Date of Patent: November 19, 2024Assignee: Stryker CorporationInventors: Aaron Levi Hoffmann, John Andrew Snodgrass
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Patent number: 12144678Abstract: An intravascular ultrasound (IVUS) device that includes a flexible elongate member having a proximal portion and a distal portion; a controller coupled to the distal portion of the flexible elongate member; an ultrasound transducer disposed at the distal portion of the flexible elongate member and in communication with the controller; a pressure transducer disposed at the distal portion of the flexible elongate member and in communication with the controller; and plurality of conductors extending from the controller to the proximal portion of the catheter, at least one conductor of the plurality of conductors being configured to carry both the signals representing information captured by the ultrasound transducer and information captured by the pressure transducer.Type: GrantFiled: December 19, 2023Date of Patent: November 19, 2024Assignee: PHILIPS IMAGE GUIDED THERAPY CORPORATIONInventors: Jeremy Stigall, Joseph Lauinger
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Patent number: 12138927Abstract: A head chip, a liquid jet head, and a liquid jet recording device each capable of inhibiting mechanical crosstalk, and exerting a desired jet performance are provided. The head chip according to an aspect of the present disclosure includes a flow channel member having a plurality of pressure chambers containing liquid, an actuator plate which is stacked on the flow channel member in a state of being opposed in a first direction to the pressure chambers, and a drive electrode which is formed on a surface of the actuator plate, the surface facing to the first direction, and which is configured to deform the actuator plate in the first direction to change a volume of at least one of the pressure chambers. A dividing groove which is configured to zone the actuator plate between the pressure chambers adjacent to each other is formed in a portion of the actuator plate, the portion being located between the pressure chambers adjacent to each other when viewed from the first direction.Type: GrantFiled: December 13, 2022Date of Patent: November 12, 2024Assignee: SII PRINTEK INC.Inventor: Hitoshi Nakayama
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Patent number: 12143085Abstract: A method for fabricating a film bulk acoustic resonator (FBAR) structure includes: sequentially forming a top electrode material layer, a piezoelectric layer, and a bottom electrode material layer on a substrate; patterning the bottom electrode material layer to form a bottom electrode; forming a sacrificial layer above the bottom electrode; bonding a bottom cap wafer onto the sacrificial layer; removing the substrate; patterning the top electrode material layer to form a top electrode; and removing a portion of the sacrificial layer to form a lower cavity.Type: GrantFiled: October 19, 2021Date of Patent: November 12, 2024Assignee: Shenzhen Newsonic Technologies Co., Ltd.Inventor: Jian Wang
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Patent number: 12143094Abstract: A method of manufacturing a bulk acoustic wave filter is provided, including: forming an acoustic reflection air cavity, a sacrificial layer, a seed layer, a lower electrode layer and a piezoelectric layer of n resonators on a substrate in sequence, wherein n is greater than or equal to 2; taking N from 1 to n for respectively repeating following steps: forming an N-th metal hard mask layer, defining an effective area of a first resonator to an N-th resonator by using a photolithography process, removing the N-th metal hard mask layer outside the effective area of the first resonator to the N-th resonator, oxidizing the piezoelectric layer outside the effective area of the first resonator to the N-th resonator to form an N-th oxidized part of the piezoelectric layer, and etching the N-th oxidized part of the piezoelectric layer; removing the metal hard mask layer of the effective area of the first resonator to the N-th resonator, so as to form the piezoelectric layer having different thicknesses of the firstType: GrantFiled: July 10, 2019Date of Patent: November 12, 2024Assignee: Epicmems(Xiamen) Co., Ltd.Inventors: Wei Wang, Ping Li, Nianchu Hu, Bin Jia
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Patent number: 12128170Abstract: Disclosed herein are embodiments of a wound treatment apparatus with electronic components integrated within a wound dressing. In some embodiments, a wound dressing apparatus can comprise a wound dressing. The wound dressing can comprise an absorbent material, an electronics unit comprising a negative pressure source, the electronics unit integrated within the wound dressing and at least partially encapsulated by a flexible film. The electronics unit can include translucent or transparent components that allow light to travel through to reach adhesives or coatings on the electronic components that would otherwise be obscured.Type: GrantFiled: January 13, 2023Date of Patent: October 29, 2024Assignee: Smith & Nephew PLCInventors: William Kelbie, Daniel Lee Steward, Charlotte Urwin
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Patent number: 12116993Abstract: A fluid pump module includes a heat dissipation board assembly, a fixing frame body, fluid pumps, a control board and a conveying pipe is provided. The fixing frame body is fixed at one side of the heat dissipation board assembly, so as to form two accommodating spaces between the heat dissipation board assembly and the fixing frame body. Two fluid pumps are respectively disposed in the two accommodating spaces. The control board is disposed at another side of the heat dissipation board assembly. The conveying pipe connects the two fluid pumps in series so as to form a series connection therebetween. The control board controls operations of the fluid pumps, and the heat dissipation board assembly dissipates heats produced by a module formed by the two fluid pumps.Type: GrantFiled: September 9, 2022Date of Patent: October 15, 2024Assignee: MICROJET TECHNOLOGY CO., LTD.Inventors: Hao-Jan Mou, Ching-Sung Lin, Chih-Kai Chen, Yung-Lung Han, Chi-Feng Huang, Tsung-I Lin
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Patent number: 12113510Abstract: An acoustic resonator is fabricated with multiple piezoelectric plate thicknesses on a single chip. After conductor patterns are formed on a piezoelectric plate, the plate is bonded to a sacrificial substrate, with the conductor patterns facing the sacrificial substrate. The piezoelectric plate is then thinned to a desired thickness for shunt resonators. A mask is applied to the surface of the plate and selected areas of the piezoelectric plate are further thinned to a desired thickness for series resonators to form a thinned piezoelectric plate. A substrate with swimming pool cavities is bonded to the thinned piezoelectric plate, and the sacrificial substrate is removed.Type: GrantFiled: June 4, 2021Date of Patent: October 8, 2024Assignee: Murata Manufacturing Co., Ltd.Inventors: Andrew Kay, Patrick Turner, Albert Cardona
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Patent number: 12113504Abstract: Provided is a method of manufacturing a bulk acoustic wave resonator, which includes: providing a piezoelectric substrate for forming a piezoelectric layer; forming a first electrode structure on the portion of the piezoelectric substrate for forming the piezoelectric layer; forming a dielectric layer on the first electrode structure, and performing a patterning process on the dielectric layer to form a patterned dielectric layer comprising a sacrificial dielectric part and a periphery dielectric part; forming a boundary layer on the patterned dielectric layer, the boundary layer covering a surface of the patterned dielectric layer and surrounding the sacrificial dielectric part; thinning the piezoelectric substrate to form the piezoelectric layer, the first electrode structure being located at a first side of the piezoelectric layer; forming a second electrode structure on a second side of the piezoelectric layer; and removing the sacrificial dielectric part to form a resonant cavity.Type: GrantFiled: March 31, 2023Date of Patent: October 8, 2024Assignee: Newsonic TechnologiesInventor: Jian Wang
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Patent number: 12101080Abstract: The present invention relates to a heterostructure, in particular, a piezoelectric structure, comprising a cover layer, in particular, a layer of piezoelectric material, the material of the cover layer having a first coefficient of thermal expansion, assembled to a support substrate, the support substrate having a second coefficient of thermal expansion substantially different from the first coefficient of thermal expansion, at an interface wherein the cover layer comprises at least a recess extending from the interface into the cover layer, and its method of fabrication.Type: GrantFiled: April 18, 2023Date of Patent: September 24, 2024Assignee: SOITECInventors: Arnaud Castex, Daniel Delprat, Bernard Aspar, Ionut Radu
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Patent number: 12101073Abstract: In a method for determining cleanliness of a cleaning member that contacts a substrate and with which scrub cleaning is performed, the method includes a first step of self-cleaning a cleaning member by releasing contaminants from the cleaning member into a cleaning liquid, and a second step of bringing a self-cleaning discharged liquid into contact with an electrode of a crystal oscillator, attaching the contaminants contained in the discharged liquid onto the electrode of the crystal oscillator, then measuring a frequency response of the crystal oscillator in which the contaminants are attached onto the electrode, and determining cleanliness of the cleaning member based on the measured frequency response.Type: GrantFiled: May 18, 2021Date of Patent: September 24, 2024Assignee: EBARA CORPORATIONInventors: Chikako Takatoh, Megumi Uno, Masahito Abe, Toshiya Kon, Yumiko Nakamura, Shohei Shima
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Patent number: 12095438Abstract: Acoustic resonator devices and filters are disclosed. An acoustic resonator chip includes a piezoelectric plate attached to a substrate, a portion of the piezoelectric plate forming a diaphragm spanning a cavity in the substrate. A first conductor pattern formed on a surface of the piezoelectric plate includes interleaved fingers of an interdigital transducer on the diaphragm and a first plurality of contact pads. A second conductor pattern is formed on a surface of an interposer, the second conductor pattern including a second plurality of contact pads. Each pad of the first plurality of contact pads is directly connected to a respective pad of the second plurality of contact pads. A seal is formed between a perimeter of the piezoelectric plate and a perimeter of the interposer.Type: GrantFiled: October 9, 2021Date of Patent: September 17, 2024Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Patrick Turner, Mike Eddy, Andrew Kay, Ventsislav Yantchev, Charles Chung
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Patent number: 12089990Abstract: Intravascular devices, systems, and methods are disclosed. In some instances, a method for treating a vessel of a patient includes collecting intravascular ultrasound imaging data of the placement of the stent using the intravascular ultrasound imaging device, estimating, using a processing device, a restenosis probability value based on the intravascular ultrasound imaging data of the placement of the stent and communicating the estimated restenosis probability value to a clinician. Associated devices and systems are also provided.Type: GrantFiled: September 14, 2020Date of Patent: September 17, 2024Assignee: PHILIPS IMAGE GUIDED THERAPY CORPORATIONInventor: Fergus Merritt
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Patent number: 12093479Abstract: A control device including a control section configured to vibrate a contact region in a case where it is determined that an operation is performed on an input section by a target object coming into contact with the contact region, the input section having the contact region touched by the target object, wherein the control section adjusts displacement rise time as a control parameter for performing control of vibrating the contact region.Type: GrantFiled: April 17, 2020Date of Patent: September 17, 2024Assignee: KABUSHIKI KAISHA TOKAI RIKA DENKI SEISAKUSHOInventors: Takeshi Ohnishi, Fumiaki Hirose, Yuma Nakai
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Patent number: 12089003Abstract: A display apparatus includes a display panel configured to display an image; a plate on a rear surface of the display panel; a rear structure on a rear surface of the plate and configured to support the display panel; a vibration member configured to vibrate the plate; and a first supporting member between a periphery of the plate and the rear structure.Type: GrantFiled: September 19, 2022Date of Patent: September 10, 2024Assignee: LG DISPLAY CO., LTD.Inventor: Kwangho Kim
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Patent number: 12088282Abstract: A surface acoustic wave (SAW) filter includes a bottom substrate, a piezoelectric layer disposed above the bottom substrate, the piezoelectric layer having a bottom surface facing the bottom substrate and a top surface opposite to the bottom surface, a lower cavity disposed below the piezoelectric layer, an interdigital transducer (IDT) disposed on the top surface of the piezoelectric layer, and a back electrode disposed on the bottom surface of the piezoelectric layer, and exposed in the lower cavity.Type: GrantFiled: July 13, 2023Date of Patent: September 10, 2024Assignee: Shenzhen Newsonic Technologies Co., Ltd.Inventors: Guojun Weng, Gongbin Tang
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Patent number: 12076187Abstract: There is provided an ultrasonic endoscope, in which bending of a signal cable at a time of assembling a distal end portion is alleviated and the signal cable is prevented from being disconnected, and a manufacturing method thereof.Type: GrantFiled: June 18, 2020Date of Patent: September 3, 2024Assignee: FUJIFILM CorporationInventors: Yasuhiko Morimoto, Tsuneo Fukuzawa
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Patent number: 12082504Abstract: A composite substrate of the present disclosure is a composite substrate in which a piezoelectric substrate and a sapphire substrate are directly bonded, and a bonding surface of the sapphire substrate has a step bunch structure. A piezoelectric device of the present disclosure includes the composite substrate. A method for manufacturing a composite substrate includes the steps of: preparing a piezoelectric substrate and a sapphire substrate including a surface having a predetermined off-angle to a specific crystal plane, heat treating the sapphire substrate in an oxidizing atmosphere to form a step bunch on the surface of the sapphire substrate, and bonding the piezoelectric substrate and the surface of the sapphire substrate directly.Type: GrantFiled: September 6, 2019Date of Patent: September 3, 2024Assignee: Kyocera CorporationInventors: Motohiro Umehara, Kuniaki Mitsuda
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Patent number: 12071761Abstract: A sound reducing system (500) includes at least one sound reducing speaker for radiating a sound wave for sound reduction. The at least one sound reducing speaker includes a piezoelectric speaker (10). The piezoelectric speaker (10) includes a piezoelectric film (35), a fixing face (17) in contact with a support supporting the piezoelectric speaker (35), and a film holding portion (55) disposed between the piezoelectric film (35) and the fixing face (17). (i) The film holding portion (55) includes a pressure-sensitive adhesive layer and the fixing face (17) is formed of a surface of the pressure-sensitive adhesive layer and/or (ii) the film holding portion (55) includes a porous body layer.Type: GrantFiled: November 20, 2018Date of Patent: August 27, 2024Assignee: NITTO DENKO CORPORATIONInventors: Yusuke Komoto, Tomoaki Hishiki, Kohei Oto, Saori Yamamoto, Yuka Sekiguchi
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Patent number: 12075211Abstract: Provided are a laminated piezoelectric element and an electroacoustic transducer capable of obtaining high piezoelectric characteristics and easily ensuring an electric contact to an electrode layer. A plurality of layers of piezoelectric films, each of which is formed by laminating a first protective layer, a first electrode layer, a piezoelectric layer, a second electrode layer, and a second protective layer in this order, are laminated. Each of the piezoelectric layers is polarized in a thickness direction. In each of the piezoelectric films, the first electrode is disposed on an upstream side in a polarization direction of the piezoelectric layer, and the second electrode is disposed on a downstream side.Type: GrantFiled: September 16, 2022Date of Patent: August 27, 2024Assignee: FUJIFILM CorporationInventors: Teruo Ashikawa, Kazuo Hiraguchi, Yusuke Kagawa, Tetsu Miyoshi
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Patent number: 12075704Abstract: Disclosed is a composite comprising: a polymer matrix formed from one or more of a monomer or a precursor polymer; and an in-situ dispersion of a piezoelectric ceramic filler and an ionic additive within the polymer matrix, wherein the composite exhibits a d33 of at least 1 pC/N when measured using a piezoelectric meter. Disclosed also herein are methods of forming the composite.Type: GrantFiled: March 19, 2019Date of Patent: August 27, 2024Assignee: SABIC Global Technologies B.V.Inventors: Soma Guhathakurta, Anantharaman Dhanabalan, Venkata Ramanarayanan Ganapathy Bhotla, Anshita Sudarshan
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Patent number: 12074586Abstract: A surface acoustic wave (SAW) filter includes a bottom substrate, a piezoelectric layer disposed above the bottom substrate, the piezoelectric layer having a bottom surface facing the bottom substrate and a top surface opposite to the bottom surface, a lower cavity disposed below the piezoelectric layer, an interdigital transducer (IDT) disposed on the top surface of the piezoelectric layer, and a back electrode disposed on the bottom surface of the piezoelectric layer, and exposed in the lower cavity.Type: GrantFiled: September 16, 2022Date of Patent: August 27, 2024Assignee: Shenzhen Newsonic Technologies Co., Ltd.Inventors: Guojun Weng, Gongbin Tang
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Patent number: 12072230Abstract: An electronic device is provided that includes a first casing and a second casing, and a distortion sensor attached to an inner wall of the casing. One side of the first casing is opened by a first opening, one side of the second casing is opened by a second opening, the casing is formed by fixing the first casing to the second casing to face each other. Moreover, the first and second casings are fixed by two or more fixing portions, the distortion sensor has a strip shape having first and second ends in the longitudinal direction, and the distortion sensor is attached to an inner wall of the second casing such that the longitudinal direction is a direction along an edge of the second opening, the first end is relatively close to the fixing portion, and the second end is far from the fixing portion.Type: GrantFiled: October 18, 2022Date of Patent: August 27, 2024Assignee: MURATA MANUFACTURING CO., LTD.Inventor: Hiroaki Kitada
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Patent number: 12068733Abstract: A method for fabricating a film bulk acoustic resonator (FBAR) filter device is provided. The method includes: forming a first electrode of each one of a first resonator and a second resonator on a first surface of a piezoelectric layer, forming a first passivation layer of each one of the first resonator and the second resonator on a corresponding one of the first electrodes, forming a second electrode of each one of the first resonator and the second resonator on a second surface of the piezoelectric layer, conducting a radio frequency (RF) performance test on the FBAR filter device, adjusting a thickness of the second electrode of the first resonator based on a result of the RF performance test, and forming a second passivation layer of each one of the first resonator and the second resonator on a corresponding one of the second electrodes.Type: GrantFiled: September 25, 2023Date of Patent: August 20, 2024Assignee: Shenzhen Newsonic Technologies Co., Ltd.Inventors: Jian Wang, Jie Zou, Gongbin Tang
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Patent number: 12063862Abstract: A piezoelectric fiber composite that includes a substrate having a first expansion and contraction rate, a piezoelectric fiber assembly having piezoelectric fibers that generate electrical charges upon application of external energy and has a second expansion and contraction rate different from the first expansion and contraction rate of the substrate, and a joint portion that joins the substrate and the piezoelectric fiber assembly.Type: GrantFiled: November 10, 2020Date of Patent: August 13, 2024Assignees: KAO CORPORATION, OKAMOTO CORPORATION, MURATA MANUFACTURING CO., LTDInventors: Kenji Ishiguro, Yutaka Murai, Kouichi Hosoya, Osamu Onishi, Daiji Tamakura, Takafumi Inoue, Masayuki Tsuji, Kenichiro Takumi
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Patent number: 12059300Abstract: Described are ultrasound transducer modules and handheld ultrasound imagers including thermal and acoustic management features to produce high quality ultrasound images in a portable, handheld form factor.Type: GrantFiled: December 30, 2021Date of Patent: August 13, 2024Assignee: Exo Imaging, Inc.Inventors: Janusz Bryzek, Jon Henry LeFors, Charles Edward Baumgartner, Thomas Stephen Tarter, Daniela Marisa Fredrick, James Alan Ewanich, Brian Lee Bircumshaw, Joseph Michael Adam
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Patent number: 12052011Abstract: The present disclosure relates to acoustic wave devices, and particularly to high quality factor (Q) transducers for surface acoustic wave (SAW) devices. An exemplary SAW device includes an interdigital transducer (IDT) between two reflective gratings to form a resonator. The resonator operates through shear horizontal mode acoustic waves, and therefore suppression of transverse modes (parallel to electrode fingers of the IDT) is desired. A piston mode can be formed in the resonator to suppress transverse modes, which may also increase energy leakage and result in a lower Q. A higher Q is achieved by adding a fast region at an end of one or more of the electrode fingers of the IDT.Type: GrantFiled: November 16, 2021Date of Patent: July 30, 2024Assignee: Qorvo US, Inc.Inventors: Marc Solal, Shogo Inoue
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Patent number: 12052923Abstract: A piezoelectric actuator includes a first piezoelectric layer and a first electrode layer disposed on a surface of the first piezoelectric layer. The first electrode layer includes a trunk portion and a plurality of brunch portions branched from the trunk portion. The trunk portion includes a plurality of junction points from each of which a corresponding branch portion of the plurality of branch portions is branched, an end spaced from the plurality of junction points, and a first through hole positioned between the plurality of junction points and the end of the trunk portion. A first mark is positioned inside the first through hole.Type: GrantFiled: February 26, 2021Date of Patent: July 30, 2024Assignee: Brother Kogyo Kabushiki KaishaInventors: Keiji Kura, Takashi Aiba
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Patent number: 12040784Abstract: Aspects of this disclosure relate to a surface acoustic wave device. The surface acoustic wave device includes a piezoelectric layer and an interdigital transducer. The interdigital transducer electrode includes a pair of electrodes, each electrode having a bus bar and fingers extending from the bus bar. The interdigital transducer electrode has an interdigital region defined by a portion of the fingers of the electrodes that interdigitate with each other. A dielectric layer is disposed over the interdigital transducer electrode outside the interdigital region and configured to reduce a loss of the surface acoustic wave device.Type: GrantFiled: February 23, 2023Date of Patent: July 16, 2024Assignee: Skyworks Solutions, Inc.Inventors: Gong Bin Tang, Rei Goto, Hiroyuki Nakamura