Abstract: A liquid ejection head includes a recording element substrate. The recording element substrate includes a recording element, a circuit wiring driving the recording element to eject liquid, a protective film, an electrode area, a plating bump, and a resin film having elastic properties. The electrode area electrically connects the circuit wiring to an external circuit through an opening in the protective film. The protective film covers the circuit wiring in an outer adjacent region to the opening to define a step in the protective film. The protective film protects the circuit wiring against the liquid. The plating bump is electrically connected to the electrode area. The resin film covers the step and extends from an inner peripheral region of the opening onto the protective film beyond an edge of the opening. The plating bump includes a part projecting from the electrode area onto an upper surface of the resin film.

Abstract: A disclosed vibration device comprises a first vibration generator and a first connection member disposed on a first surface of the first vibration generator. The first vibration generator may comprise a first vibration part including a plurality of inorganic material portions having a piezoelectric characteristic and an organic material portion between the plurality of inorganic material portions.

Abstract: An elastic wave filter apparatus includes at least one excitation electrode, a first electrode land, and second electrode lands provided on a first main surface of a device substrate including a piezoelectric layer. A signal terminal and metal members are provided on a second main surface of the device substrate. The first electrode land and the signal terminal are connected to a signal potential, and the second electrode lands and the metal members are connected to a ground potential. A first connection electrode connects the first electrode land and the signal terminal, and a second connection electrode connects at least one of the second electrode lands and at least one of the metal members. The at least one metal member connected to the second connection electrode overlaps at least a portion of the at least one excitation electrode across the device substrate.

Abstract: A resonator device includes a resonator element, a base which has a first surface and a second surface that are in front-back relation, and in which the resonator element is arranged at the first surface, an integrated circuit provided to the base, a lid which has an inner surface opposed to the resonator element, and an outer surface in a front-back relationship with the inner surface, and which is bonded to the base so as to house the resonator element, and a radiation layer which is arranged at the inner surface of the lid, and is higher in emissivity than the lid.

Abstract: A piezoelectric microelectromechanical systems microphone can be mounted on a printed circuit board. The microphone can include a substrate with an opening between a bottom end of the substrate and a top end of the substrate. The microphone can include a single piezoelectric film layer disposed over the top end of the substrate and defining a diaphragm structure, the single piezoelectric film layer having substantially zero residual stress and formed from a piezoelectric wafer. The microphone can include one or more electrodes disposed over the diaphragm structure. The diaphragm structure is configured to deflect when subjected to sound pressure via the opening in the substrate.

Abstract: For a multilayer SAW device arranged on a carrier substrate it is proposed to use a specific material for the carrier substrate. If a silicon material having a selected range of Euler angles is used as a material for the carrier substrat improved suppression of disturbing signals is achieved.

Abstract: A method of generating a piezoelectric actuator includes: forming a piezoelectric member upon a rigid substrate; and removing one or more portions of the rigid substrate to form one or more gaps in the rigid substrate, thus defining at least one deformable portion of the piezoelectric member and at least one rigid portion of the piezoelectric member.

Abstract: Methods of making acoustic resonators and filter devices. A method includes attaching a piezoelectric plate to a substrate, and forming a conductor pattern including an interdigital transducer (IDT) on a portion of the piezoelectric plate that forms a diaphragm spanning a cavity such that interleaved fingers of the IDT are on the diaphragm. The substrate and the piezoelectric plate are the same material.

Abstract: A conductive paste includes a conductive metal powder and a curable resin. The conductive metal powder includes Ag, Cu, and Ni. In the conductive metal powder, a mass ratio of Ag is about 3.0 wt % or more and about 10.0 wt % or less, a mass ratio of Cu is about {(1?mass ratio of Ag/100)×70} wt % or more and about {(1?mass ratio of Ag/100)×95} wt % or less, and a mass ratio of Ni is about {(1?mass ratio of Ag/100)×5} wt % or more and about {(1?mass ratio of Ag/100)×30} wt % or less.

Abstract: A phase-change memory (10) for the non-volatile storage of binary contents stores the binary contents electrically and/or optically in a non-volatile manner by locally switching a material (18) between an amorphous and a crystalline phase. The state with respect to the electrical conductivity of the material (18) and/or the reflection properties of the material (18) determines the information content of the phase-change memory (10). A method for non-volatile storage of binary contents in a phase-change memory (10), which stores the binary contents electrically and/or optically in a non-volatile manner by locally switching a material (18) between an amorphous and a crystalline phase, whereby the state with respect to the electrical conductivity of the material (18) and/or the reflection properties of the material (18) determines the information content of the phase-change memory (10).

Abstract: A grid of phased array transducers includes a piezoelectric layer and a plurality of ground contact traces. The piezoelectric layer includes a first side and a second side. The plurality of ground contact traces is disposed on the first side of the piezoelectric layer along an elevational direction, where each ground contact trace of the plurality of ground contact traces extends along an azimuthal direction. Further, each phased array transducer of the grid of phased array transducers is disposed between an adjacently disposed pair of ground contact traces of the plurality of ground contact traces. Moreover, each phased array transducer includes at least a portion of at least one ground contact trace of a corresponding pair of ground contact traces, and where each phased array transducer includes a plurality of transducer elements.

Abstract: In some embodiments, the present disclosure relates to a piezomicroelectromechanical system (piezoMEMS) device that includes a second piezoelectric layer arranged over the first electrode layer. A second electrode layer is arranged over the second piezoelectric layer. A first contact is arranged over and extends through the second electrode layer and the second piezoelectric layer to contact the first electrode layer. A dielectric liner layer is arranged directly between the first contact and inner sidewalls of the second electrode layer and the second piezoelectric layer. A second contact is arranged over and electrically coupled to the second electrode layer, wherein the second contact is electrically isolated from the first contact.

Abstract: Methods and systems are provided for a single element ultrasound transducer. In one embodiment, a method for the transducer comprises laminating a comb structure and a conductive base package into an acoustic stack with a non-conductive glue, grinding the acoustic stack, and dicing the ground acoustic stack along a plane extending from the top surface of the second fin of the conductive base package to the bottom surface of the acoustic stack. The resulting transducer may have a flat front face with a non-conductive groove separating a ground pad formed by the conductive base package from a signal pad formed by a matching layer of the comb structure.

Abstract: A brushless electric motor is disclosed. A group of permanent magnets are physically attached to a group of piezoelectric actuators which push them toward or pull them away from a second group of permanent magnets when the piezoelectric actuators are electrically activated. The second group of permanent magnets may also be pushed and pulled with a second group of piezoelectric actuators. Alternate configurations using electromagnets are also disclosed. A novel configuration for the groups of electromagnets which maximizes efficiency in a piezoelectrically actuated motor is also disclosed.

Abstract: There is provided print apparatus including: piezoelectric member; individual electrode; first and second common electrodes; voltage application circuit; detection circuit configured to detect a capacitance of a first capacitor configured by the piezoelectric member, the individual electrode, and the first common electrode and a second capacitor configured by the piezoelectric member, the individual electrode, and the second common electrode; first switching element; and control circuit. The control circuit is configured to execute: a first voltage application process to apply a first voltage to the second common electrode in order to discharge the ink; a detection process to detect the capacitance after electrically connecting the piezoelectric member and the detection circuit with the first switching element; and a second voltage application process to apply a second voltage to the second common electrode before the detection process, the second voltage being lower than the first voltage.

Abstract: There are provided a method for manufacturing a substrate excellent in heat dissipation with a small loss in radio frequencies with no need of a high temperature process in which a metal impurity is diffused, and a substrate of high thermal conductivity. A composite substrate according to the present invention is a composite substrate having a piezoelectric single crystal substrate, a support substrate, and an intermediate layer provided between the piezoelectric single crystal substrate and the support substrate. The intermediate layer is a film formed of an inorganic material, and at least a part of the film is thermally synthesized silica. The intermediate layer may be separated into at least two layers along the bonding surface of the composite substrate. The first intermediate layer in contact with the support substrate may be a layer including thermally synthesized silica.

Abstract: A hybrid structure for a surface acoustic wave device comprises a useful layer of piezoelectric material having a first free surface and a second surface disposed on a support substrate that has a lower coefficient of thermal expansion than that of the useful layer, wherein the useful layer comprises an area of nanocavities.

Abstract: There is provided a piezoelectric stack, including: a substrate; an electrode film; and a piezoelectric film which is comprised of alkali niobium oxide of a perovskite structure represented by a composition formula of (K1-xNax)NbO3 (0<x<1), wherein the piezoelectric film comprises crystals having a grain size with a standard deviation of 0.42 ?m or less.

Abstract: A piezoelectric element includes a first electrode layer, a piezoelectric layer, and a second electrode layer. The first electrode layer, the piezoelectric layer, and the second electrode layer are stacked in sequence on one another. The first electrode layer has a first part overlapping the piezoelectric layer in a plan view, and a second part at least partially separated from the first part and not overlapping the piezoelectric layer in the plan view. The second electrode layer has a third part overlapping the piezoelectric layer in the plan view, and a fourth part separated from the third part. The fourth part is in contact with the first part and the second part.

Abstract: Systems, methods, and apparatus that employ a connector assembly having a substrate layer with an inner aperture and an outer periphery, and one or more signal traces disposed on the substrate that extend from an inner first location to an outer second location of the apparatus, for communicating data between electronic devices positioned within an interior volume of an enclosed vessel and complementary electronic devices positioned in an ambient environment external to the enclosed vessel. An inner connector is conductively connected the signal traces at the inner first location of each signal trace, and an outer connector is conductively connected to the one or more signal traces at the outer second location of each signal trace. A substantially flat exterior surface extends radially over at least a portion of a region between the respective first locations and the respective second locations.

Abstract: Disclosed is a dual-band very low frequency antenna, which comprises positive and negative electrodes, silicon substrates, piezoelectric material units, stress-electromagnetic conversion material units and an insulator. The piezoelectric material units are arranged between the positive and negative electrodes; the stress-electromagnetic conversion material units and the silicon substrates are respectively arranged at both ends of the positive and negative electrodes. The positive and negative electrodes are used for driving the piezoelectric material units; the piezoelectric material units are used for generating flutter and conducting the flutter to the stress-electromagnetic conversion material units; the stress-electromagnetic conversion material units are used for converting vibration waves generated by flutter into electromagnetic wave radiation.

Abstract: A piezoelectric device that includes a film that has a first main surface and a second main surface, and has piezoelectricity; a first substrate; and a first connection member that connects the film to the first substrate. The first connection member is a thermosetting resin, and a curing temperature of the first connection member is lower than a temperature at which the film thermally contracts.

Abstract: The present invention relates to an electrical component for a microelectromechanical systems (MEMS) device, in particular, but not limited to, an electromechanical actuator.

Abstract: A display apparatus includes: a display panel configured to display an image, and at least one vibration module on a rear surface of the display panel, the at least one vibration module including a piezoelectric composite layer including a plurality of sub-modules configured to vibrate the display panel, each of the plurality of sub-modules including: a plurality of first portions including a piezoelectric characteristic, and a plurality of second portions having flexibility, each of the plurality of second portions being between a respective pair of the plurality first portions, wherein the plurality of first portions in the respective sub-modules are arranged in a same direction or are partially arranged in different directions.

Abstract: Embodiments of the subject invention relate to a small modular self-contained surface plasma device for decontamination of air and surfaces within enclosed volumes. Embodiments of the subject invention relate to a method and apparatus using the technical process of dielectric barrier discharge (DBD) surface plasma generation from ambient atmosphere for decontamination of air and surfaces within enclosed volumes. The primary application mode is for preservation of perishable commodities within industrial shipping containers through reduction of surface spoilage organisms and destruction of evolved gaseous ethylene that causes premature ripening. Additional implementations include deployment for oxidation of surfaces and/or container atmospheres in applications to diminish or eradicate pesticides, toxins, chemical residues, and other natural or introduced contaminants. Other embodiments envisioned include incorporation of device capabilities and or ancillary modules for feedback input (e.g.

Abstract: An ultrasonic probe of an embodiment includes a vibrator, an acoustic matching layer, and a back layer. The vibrator includes a plurality of vibrating elements arranged in a first direction. The acoustic matching layer is formed on a living body side of the vibrator. The back layer is formed on a back side of the vibrator opposite the living body side. The plurality of vibrating elements are formed by being divided by first grooves passing through the vibrator and the back layer. Second grooves passing through the vibrating elements and penetrating into the back layer are provided in each of the vibrating elements. A penetration depth of the second grooves in a second direction in the back layer is less than a width of the second grooves in the first direction in the vibrating elements.

Abstract: An intraluminal imaging device includes a flexible elongate member sized and shaped for insertion into a vessel of a patient, the flexible elongate member including a proximal portion and a distal portion; and an imaging assembly disposed at the distal portion of the flexible elongate member, the imaging assembly including a flex circuit disposed in a rolled configuration, the flex circuit comprising a spine member and a plurality of rib members extending from the spine member. Associated devices, systems, and methods are also provided.

Abstract: An optical waveguide-type soft photoactuator based on an optical micro/nanofiber includes an optical micro/nanofiber, a first deformed material membrane, and a second deformed material membrane. One end of the optical micro/nanofiber is provided with a taper region and a waist region, and the taper region and the waist region are encapsulated in the first deformed material membrane. The second deformed material membrane covers a side of the first deformed material membrane, and the first deformed material membrane or the second deformed material membrane is doped with a photothermal conversion material. The refractive index of the first deformed material membrane is less than the refractive index of a core of the optical micro/nanofiber. The coefficient of thermal expansion of the first deformed material membrane and a coefficient of thermal expansion of the second deformed material membrane are different.

Abstract: An electronic device includes a support substrate, a piezoelectric layer that is provided on the support substrate, a functional element including an electrode provided on a surface of the piezoelectric layer, a metallic frame body that is provided on the support substrate so as to surround the piezoelectric layer and the functional element in a plan view, a metallic lid that is provided on the frame body so as to form a space between the lid and the support substrate, and seals the functional element into the space, and a columnar body that is provided between the support substrate and the lid in the space.

Abstract: A process for preparing a porous ceramic body includes forming a green body with a mixture of ceramic material powder, binder material, and pore-forming particles. The process further includes extracting the binder material, decomposing the pore-forming particles, and removing residual organic materials from the green body at respective, progressively higher pre-firing temperatures. After these three stages, the green body is sintered at a still-higher temperature to form the porous ceramic body. Embodiments facilitate manufacturing and can render most or all surface grinding unnecessary, allowing electrode deposition directly onto substantially non-porous surfaces of the porous ceramic body that are naturally formed during sintering. Advantageously, the green body may be formed into net shape by injection molding the mixture that includes the pore-forming particles, and embodiments can result in porous ceramic bodies that are much thicker than currently available, with better structural integrity.

Abstract: An acoustic resonator device includes a substrate and a piezoelectric plate. A first portion of the piezoelectric plate is on the substrate. A second portion of the piezoelectric forms a diaphragm suspended over a cavity in the substrate. An interdigital transducer (IDT) is on a surface of the piezoelectric plate, the IDT including first and second busbars on the first portion and interleaved IDT fingers on the diaphragm. A plurality of tethers support the diaphragm over the cavity, each tether providing an electrical connection between a corresponding one of the interleaved IDT fingers and one of the first and second busbars.

Abstract: There is provided a piezoelectric laminate, including: a substrate; and a piezoelectric film formed on the substrate, wherein the piezoelectric film contains an alkali niobium oxide represented by a composition formula of (K1?xNax)NbO3 (0<x<1), having a perovskite structure, and contains a metallic element selected from a group consisting of Cu and Mn at a concentration of more than 0.6 at % and 2.0 at % or less.

Abstract: A method for producing a layer of composition AA?BO3, wherein A consists of at least one element selected from the group consisting of: Li, Na, K, Ca, Mg, Ba, Sr, Pb, La, Bi, Y, Dy, Gd, Tb, Ce, Pr, Nd, Sm, Eu, Ho, Zr, Sc, Ag and Tl, and B consists of at least one element selected from the group consisting of: Nb, Ta, Sb, Ti, Zr, Sn, Ru, Fe, V, Sc, C, Ga, Al, Si, Mn, Zr and Tl, is described. The method includes providing a donor substrate of composition ABO3, forming a layer of composition ABO3 by thinning the donor substrate, and exposing the layer of composition ABO3 to a medium containing ions of an element A? belonging to the same list of elements as A, A? being different from A, such that the ions penetrate into the layer of composition ABO3 to form the layer of composition AA?BO3.

Abstract: There are provided an ultrasound diagnostic apparatus and an operation method of an ultrasound diagnostic apparatus capable of performing polarization processing during the execution period of ultrasound diagnosis without affecting the image quality of an ultrasound image. In the ultrasound diagnostic apparatus and the operation method of the ultrasound diagnostic apparatus of the invention, a trigger generation circuit generates a trigger for starting polarization processing. After a trigger is given, during the execution period of ultrasound diagnosis, in a non-diagnosis period which is a period other than a period for acquiring an image of each frame and during which transmission of ultrasound waves and reception of reflected waves for performing ultrasound diagnosis are not performed, within each frame time in which an image of each frame of an ultrasound image is acquired, a control circuit performs polarization processing on a plurality of ultrasound transducers.

Abstract: A piezoelectric sensor comprises a support structure, a channel extending through the support structure, a sensing material stack coupled to the support structure and extending over the channel, and a filler material disposed within the channel and over the sensing material stack. The sensing material stack comprises an structural layer, a first electrode layer disposed on the structural layer, a piezoelectric material disposed in a piezoelectric layer on the first electrode, and a second electrode disposed on the piezoelectric layer opposite the first electrode layer.

Abstract: A display device includes a touch panel; a display panel under the touch panel and displaying an image; a piezoelectric element under the touch panel and including an upper electrode, a lower electrode and a piezoelectric layer; and a rectifying circuit connected to the piezoelectric element.

Abstract: Acoustic resonator devices, filter devices, and methods of making acoustic resonator devices and filter devices. An acoustic resonator device includes a substrate with a cavity and an alignment pattern in a surface of the substrate. The cavity and the alignment pattern have a same depth. A back surface of a piezoelectric plate is attached to the surface of the substrate. A portion of the piezoelectric plate that spans the cavity forms a diaphragm. An interdigital transducer (IDT) is on a front surface of the piezoelectric plate. Interleaved fingers of the IDT are on the diaphragm.

Abstract: Flextensional transducers and methods of using flextensional transducers. The transducer includes a piezoelectric element and may include at least one endcap coupled with the piezoelectric element. The endcap may have an outer portion formed of a first material and an inner portion formed of a second material having a greater flexibility than the first material. The endcap may be coupled with an annular piezoelectric element near either its outer circumference or its inner circumference. The piezoelectric element may be a planar disk or have a curved bowl-shape. The transducer may be coupled with, and at least partially restrained by, a support structure. The transducer may also be configured to permit light to pass therethrough.

Abstract: An ultrasonic motor is provided that includes a stator including first and second piezoelectric elements provided on a first main surface of a vibrator having a plate shape, a rotor in direct or indirect contact with a second main surface of the vibrator, and a wiring member connected to the first and second piezoelectric elements. Moreover, the wiring member includes first and second connection members connected to the first and second piezoelectric elements, a central wiring portion connected to the first and second connection members and provided in a region including a center of an axial direction, and an extended wiring portion connected to the central wiring portion. The central wiring portion is fixed to the first main surface of the vibrator and the extended wiring portion is lifted from the first main surface of the vibrator.

Abstract: An apparatus includes a piezoelectric thin film suspended above a carrier substrate, where the piezoelectric thin film is of one of lithium niobate (LiNbO3) or lithium tantalate (LiTaO3) adapted to propagate an acoustic wave in a Lamb wave mode excited by a component of an electric field that is oriented in a longitudinal direction along a length of the piezoelectric thin film. A signal electrode is disposed on, and in physical contact with, the piezoelectric thin film and oriented perpendicular to the longitudinal direction. A ground electrode disposed on, and in physical contact with, the piezoelectric thin film and oriented perpendicular to the longitudinal direction, where the ground electrode is separated from the signal electrode by a gap comprising a longitudinal distance and in which the acoustic wave resonates. A release window is formed within the piezoelectric thin film adjacent to the ground electrode.

Abstract: An electretized film of the present invention includes a cyclic olefin polymer, in which the electretized film is a non-porous film, and a piezoelectric constant d33 in a thickness direction, which is measured by applying a pressing force to the electretized film in the thickness direction, under conditions of a load of 0.5 N, a dynamic load of ±0.25 N, a frequency of 110 Hz, a temperature of 23° C., and a humidity of 50%, is equal to or more than 100 pC/N.

Abstract: Improving the accuracy of ultrasonic touch sensing and fingerprint imaging using acoustic impedance matching is disclosed. Acoustic impedance mismatches between an ultrasonic transducer array and a sensing plate can be reduced to maximize energy transfer and minimize parasitic reflections. A reduction in acoustic impedance mismatches can be accomplished using (i) a composite epoxy having a higher acoustic impedance than epoxy alone, (ii) one or more matching layers having an acoustic impedance that is approximately the geometric mean of the acoustic impedance of the sensing plate and the acoustic impedance of the transducer array, (iii) pores or perforations in the sensing plate, or (iv) geometric structures formed in the sensing plate. In addition, parasitic reflections can be suppressed using an absorbent layer.

Abstract: A substrate for a surface acoustic wave device or bulk acoustic wave device, comprising a support substrate and an piezoelectric layer on the support substrate, wherein the support substrate comprises a semiconductor layer on a stiffening substrate having a coefficient of thermal expansion that is closer to the coefficient of thermal expansion of the material of the piezoelectric layer than that of silicon, the semiconductor layer being arranged between the piezoelectric layer and the stiffening substrate.

Abstract: A semiconductor device may include: a substrate wafer, a bonding layer at least partially covering a front surface of the substrate wafer, a plurality of silicon pillars bonded to the front surface of the substrate wafer by the bonding layer, a single-crystal piezoelectric film having a first surface and an opposing second surface, a top electrode arranged adjacent to the first surface of the single-crystal piezoelectric film, and a bottom electrode arranged adjacent to the second surface of the single-crystal piezoelectric film. The single-crystal piezoelectric film may be supported by the plurality of silicon pillars such that the second surface of the piezoelectric film and the front surface of the substrate wafer enclose a cavity therebetween.

Abstract: An electronic device includes a support substrate, a piezoelectric layer that is provided on the support substrate, a functional element including an electrode provided on a surface of the piezoelectric layer, a metallic frame body that is provided on the support substrate so as to surround the piezoelectric layer and the functional element in a plan view, a metallic lid that is provided on the frame body so as to form a space between the lid and the support substrate, and seals the functional element into the space, and a columnar body that is provided between the support substrate and the lid in the space.

Abstract: There are provided an ultrasonic transducer and methods for designing and manufacturing the same. The ultrasonic transducer includes a piezoelectric composite layer configured to be in acoustic communication with a sample and having at least partially decoupled acoustic impedance and electrical impedance properties. The piezoelectric composite layer includes an array of spaced-apart piezoelectric regions, each being made from a piezoelectric material, a filler material positioned between adjacent spaced-apart piezoelectric regions, the filler material comprising a polymer matrix and a non-piezoelectric material in contact with the polymer matrix.

Abstract: A bonded body includes a supporting substrate, silicon oxide layer provided on the supporting substrate, and a piezoelectric material substrate provided on the silicon oxide layer and composed of a material selected from the group consisting of lithium niobate, lithium tantalate and lithium niobate-lithium tantalite. A nitrogen concentration at an interface between the piezoelectric material substrate and silicon oxide layer is higher than a nitrogen concentration at an interface between the silicon oxide layer and the supporting substrate.

Abstract: A metamaterial-based substrate (meta-substrate) for piezoelectric energy harvesters. The design of the meta-substrate combines kirigami and auxetic topologies to create a high-performance platform including preferable mechanical properties of both metamaterial morphable structures. The creative design of the meta-substrate can improve strain-induced vibration applications in structural health monitoring, internet-of-things systems, micro-electromechanical systems, wireless sensor networks, vibration energy harvesters, and other applications whose efficiency is dependent on their deformation performance. The meta-substrate energy harvesting device includes a meta-material substrate comprising an auxetic frame having two kirigami cuts and a piezoelectric element adhered to the auxetic frame by means of a thin layer of elastic glue.

Abstract: A die bonding method with corner or side contact without impact force includes the steps: picking up a die by a die bonding device, wherein a surface of the die has no solder and bump; moving the die to one side of a die placement area of a substrate, wherein the substrate has no solder and bump; blowing one corner or one side of the die a positive pressure from the die bonding device to bend the corner/side to contact the die placement area; forming a bonding wave after the corner/side of the die contacting the die placement area, and spreading the bonding wave from the corner/side to opposite corner/side of the die, and separating the die from the die bonding device gradually and bonding the die on the die placement area; and bonding the die on the die placement area completely.

Abstract: An elastic wave device includes an IDT electrode on a second main surface of an element substrate that includes a piezoelectric layer, a support layer on the second main surface and surrounding the IDT electrode, a cover member on the support layer, and routing wiring lines extending from the second main surface of the element substrate onto side surfaces of the element substrate.