Abstract: Two printed circuit boards are provided, each having a row of metallic pads located along an edge. The pads are spaced along the edge so that, when the boards are aligned with the two edges opposing each other, every pad in the row of one board is opposite a pad of the row of the opposing board. Each pad has a drilled center hole suitable for the insertion of a wire. The boards are opposed and spaced apart, and jumper wires are inserted to connect each pair of opposing pad holes. The jumper wires are inserted into the holes from the opposite sides of the pads and the ends of the jumpers are soldered to the pads. The jumper wires are then cut at points intermediate the two boards to provide a row of conductive mounting terminals along an edge of each board.

Abstract: A channel-shaped trim having a longitudinally extending opening for embracing and clamping an edge flange of a support member and a method for producing such a trim.The trim is comprised of a core member having a large number of disconnected channel-shaped core pieces and a covering member enclosing the core member and charged between the adjacent core pieces and in slots which are formed in the core pieces.The method for producing such a trim as described above comprises the steps of slotting a band-shaped sheet metal to form a core member comprised of a large number of core pieces composed of at least two strip-shaped elements spaced from each other and connecting portions connecting two strip-shaped elements, and weakened connecting portions connecting two adjacent core pieces, covering the core member with the covering material, breaking the weakened connecting portions, and bending the covered and broken core member to produce a channel-shaped trim.

Abstract: A method for producing a channel-shaped trim including a core member embedded within a covering material and having a longitudinally extending opening for embracing and clamping an edge flange of a support member comprising the steps of perforating a plurality of transversely extending slits of which length is made larger at predetermined intervals in a band-shaped metallic plate to form unslit connecting portions of which width is made narrower at predetermined intervals in both side end portions thereof, rolling the unslit connecting portions in a longitudinal direction thereof to form a core member, covering the core member with a covering material, breaking the core member in the narrower connecting portions to divide into a plurality of core pieces, and bending the covered and divided core member into a desired cross-sectional shape of the opening.

Abstract: In the manufacture of eyeglass bows, a metal core (2) is placed in a mold (1) and is gripped at one end (3) before the mold (1) is filled with plastic material.To ensure that the metal core (2) can be held in position in the mold (1) as the plastic charge enters, the metal core (2) at that end thereof which is opposite to its gripped end (3) is joined to a tensile element (6), which extends out of the mold. The joint between the tensile element (6) and the metal core (2) forms a rated breaking point having a limited ultimate tensile strength. Before the mold (1) has been completely filled with plastic charge, a tensile stress in excess of the ultimate tensile strength of the joint is applied to the latter by the tensile element (6) so that the tensile element will be severed and pulled out of the mold (1).

Abstract: A process for preparing semiconductor pellets from one sheet of a semiconductor wafer is disclosed. In the process of the invention, the semiconductor wafer is divided into a plurality of pellet-forming regions and reinforcing regions are formed between the pellet forming regions and at the peripheral part of the wafer.The reinforcing regions prevent breakage of the wafer without increasing the thickness of the pellets whereby a wafer having a large diameter can be used to obtain many pellets having suitable characteristics from one sheet of the wafer without substantial loss.

Abstract: In a manufacturing operation, a stretched diaphragm is used to support a quantity of small parts which are individually secured to the diaphragm in predetermined spaced relation. An individual part is elevated relative to the remainder of the array, for purpose of inspection or test, by displacing and even further stretching the associated portion of the diaphragm; then it is permitted to return to its original place in the array. When the parts are to be incorporated into manufactured assemblies each selected part is again elevated by displacing and stretching the associated portion of the diaphragm. The method is applied to the manufacture of microminiature electric circuits in which a flat wafer is first formed, and the wafer is then cut into a number of chips which must be individually tested and then they are incorporated into circuit assemblies.

Abstract: Disclosed is a method of manufacturing coplanar photocouplers comprised of a photo-conductor of transparent plastic material covered with a metal mirrors in which a mosaic of recesses is formed in a sheet of deformable metal by deep drawing and the recesses are then filled with plastic in a liquid form. After curing of the plastic the optical elements thus formed are separated from each other.

Abstract: The present invention provides an improved wire stiffening member for use in a garment such as a brassiere wherein the wire member has a flexible end provided by forming a sheath about the end, which end has a line of weakening therein, and subsequently breaking the end along the line of weakening.

Abstract: An arrangement for fabricating planar elements which may be stacked for producing predetermined surfaces and bodies. The planar elements have cross-sections corresponding to respective cross-sections of the surface to be constructed. The planar elements are formed by cutting them from plate-shaped material or sheet metal, and the cut-out elements are held to the parent sheet or plate material by tabs. The planar elements are cut successively from the sheet or plate-shaped material at spaced intervals. The cutting action is such as to leave the tabs for holding the planar elements in place. Registration holes are punched about the planar element, so that these may be readily stacked relative to each other, as required to form the surface to be constructed. Sprocket holes are also punched in the sheet material to advance the material along a processing path at which the various processing stations are located.

Abstract: A method and apparatus for continuous cold cutting or slitting of a flat material wherein the flat material is subjected to a first step of partial-shearing or penetration in a zigzag state to a controlled depth of penetration, and subsequently to a second step of flattening, thus forcing the penetration formed in the material back to substantially the original thickness of the material, thereby to perform complete severing or slitting the material having no burrs formed during the operation. The first working action is obtained from feeding of the flat material into the controlled spacing of opposing pairs of cutter discs so that there occurs partially shearing or penetration in the flat material under an optimally predetermined interfering action by the opposing pairs of cutter discs into the material when it engages therewith.

Abstract: A well pump breaking tool for mounting on a well pump stand. The tool used in conjunction with a well pump stripping tool. The stripping tool cutting elongated slots along the length of a pump barrel surrounding a pump plunger. The well pump breaking tool is used when the pump plunger becomes seized inside the surrounding barrel due to contamination in the fluid which is pumped. The tool breaking the slotted barrel thereby releases the plunger so it may be reused.

Abstract: A continuous metal foil or sheet of the desired width and thickness is formed by electroforming and is provided with lines of weakness therethrough. The sheets can be cut off into desired lengths and shipped flat. When required, the sheets can be formed either manually or in a guide form to the desired configuration or shape, by bending along the lines of weakness to provide the structure. If desired, break out portions can be removed which are defined by further lines of weakness through the sheets.

Abstract: Flat and parallel depositions of low pressure chemical vapor deposited (LPCVD) polycrystalline intrinsic silicon are formed on both sides of a wafer of P-I-N <100> substrate of silicon to support the wafer during subsequent polish removal from the top surface. This structurally reinforces the crystal wafer and helps prevent warpage and cracking during subsequent handling.

Abstract: A method of manufacturing semiconductor devices using laser beam cutting is disclosed in which the surface debris or pollution resulting from the laser beam cutting operation is removed by a preferential etching treatment. Since the polluting particles are of nonmonocrystalline semiconductor material, while the underlying material of the semiconductor disc is monocrystalline in nature, the polluting particles may be selectively removed in an effective manner by preferentially etching the nonmonocrystalline material of the particles with respect to the monocrystalline material of the disc. This preferential etching treatment may advantageously be carried out prior to the severing of the semiconductor disc to form the individual semiconductor devices.

Abstract: A process for preparing semiconductor devices by forming an insulation coating, such as a low melting point glass, on the surface of a semiconductor substrate and then forming a shaved groove through the insulation coating to the inner part of the semiconductor substrate. The insulation coating is one that is easily subject to cracking when shaved by a high speed rotating diamond blade having substantially parallel side surfaces.The low melting point glass and the semiconductor substrate are shaved by a diamond blade having a tapered edge which rotates in high speed, without forming a crack in the insulation coating or breaking a part of the semiconductor substrate. The semiconductor substrate is divided along the shaved groove in a dicing step to obtain separated semiconductor pellets.

Abstract: The disclosure is directed to an orthodontic O-ring assembly which comprises a plurality of orthodontic O-rings integrally molded to a core which can be readily wrapped about an orthodontist's hand and the respective O-rings being individually dispensed by a ligator. The ligator comprises a tool having relatively moveable jaws which are sized so as to be received within the internal diameter of the O-ring in the closed position and thereafter moved to an open or expanded position to effect the stretching of the O-ring to be dispensed, thereby causing the O-ring to separate from its core at a frangible point. In a modified form of the invention, the ligator may be provided with a lock to maintain the ligator in the open jaw position.

Abstract: A printed circuit board substrate is subdivided into sections, the boundary of each section being defined by notches which weaken the substrate and thereby permit the substrate to be fractured at the boundaries of the sections to permit the removal of a defective section. Printed conductors which electrically connect one section to another pass over the weakened substrate regions and when a section is removed, these conductors fracture at the boundary of the removed section. A replacement section may then be substituted for the removed defective section and its conductors connected to corresponding fractured conductors on the substrate.

Abstract: A plate segment for insertion in a hole, cavity or recess to position and/or lock a shaft-like portion of an object within and/or with reference to its bounding wall structure has preferred embodiments comprising plate segments formed of sheet metal in a stamping operation including tooth-like projections. Depending upon the embodiment the tooth-like projections may extend from either or both faces of the plate segments and/or its lateral extremities. The tooth-like projections are formed to provide teeth portions of which are skewed to facilitate the application and anchoring of the segment. In a particularly preferred configuration the plate segment comprises a leading end, a trailing end and side edge portions, the roots of which side edge portions are generally parallel and bound a main body portion of the plate segment which is curved on a uniform radius, in a lateral sense, to provide that the respectively remote faces thereof are formed to resemble a longitudinal portion of a cylindrical surface.

Abstract: A package and a method of packaging semiconductor devices, especially in expanded wafer form. The package is formed by sticking an adhesive backed ring to the plastic sheet upon which the expanded wafer is affixed so that the ring surrounds the wafer. The adhesive backed ring holds the plastic sheet securely and protects the surface of the wafer. The package is completed by covering the wafer with a second protective sheet and vacuum sealing in a plastic bag.

Abstract: A batch fabrication process to produce plasma display panels uses a multiple processing technique in which a series of individual plate patterns are simultaneously developed on a large master plate. When the master plate processing is completed and inspected, individual plates with associated tubulation members are provided and placed over the individual non-defective plate patterns on the master plate and sealed. The master plate is then divided into individual plates by conventional glass separation techniques such as cutting, scribing, etc. and the individual panels thus formed are completed by bakeout, backfill with an ionizable gas and tubulation tip-off. This permits plasma display panel fabrication in a batch mode using conventional fabrication techniques, permitting multiple plasma panel fabrications in a single process cycle.

Abstract: Bearing bushes are made in groups or pairs by progressive press tooling so that at each stroke of the press a group or pair of bushes is produced. The bushes may have at least one end which lies in a plane inclined to the longitudinal axis of the bush, and this is effected by providing the bush blank in the flat with a sinusoidal boundary line.

Abstract: The disclosure includes method and apparatus for handling elongated webs of sheet metal, and a sheet metal construct formed as an intermediate product and comprising a parent coil pre-divided into a plurality of daughter coils. In one method sequence, separation can be completed by the end user of the coil just before it is fed into a press or the like. In another method sequence, separation is completed during wrapping of the parent coil. In still other sequences, completion of separation can be accomplished at stages intermediate these two. Slitting may be done directly off a mill. Edge trim strip may be wound as part of the parent coil to simplify scrap handling, and may be used to protect the coil in transit.

Abstract: A stacked plurality of snap rings adhesibly retained by varnish coating, or other bonding method applied to the rings. Internal or external circular or C-shaped snap rings typically have retainer ring holes and in this invention the holes in adjacent rings in the stack are misaligned. Snap ring pliers or automated equipment can be inserted into the retainer ring holes of the endmost snap ring fastened at the top of the stack, with the tips of the pins penetrating only through the holes in the topmost ring, due to their misalignment, with the topmost ring being removed by movement of the pins relative to each other, thereby facilitating efficient dispensing of one snap ring at a time.

Abstract: The disclosure includes method and apparatus for handling elongated webs of sheet metal, and a sheet metal construct formed as an intermediate product and comprising a parent coil pre-divided into a plurality of daughter coils. In one method sequence, separation can be completed by the end user of the coil just before it is fed into a press or the like. In another method sequence, separation is completed during wrapping of the parent coil. In still other sequences, completion of separation can be accomplished at stages intermediate these two. Slitting may be done directly off a mill. Edge trim strip may be wound as part of the parent coil to simplify scrap handling, and may be used to protect the coil in transit.

Abstract: A plug is offered to make relatively easy and simple the assembly and pre-torquing of a spring-loaded hinge for doors and the like. These hinges comprise a pair of hinge leaves, each leaf defining at least one hollow hinge knuckle aligned with a hinge knuckle defined on the opposite leaf. Through the knuckles, a bi-ended torsion spring mechanism is inserted. A first plug is affixed within one hinge knuckle and engages one end of the torsion spring mechanism. At the opposite knuckle and second spring end, the novel second plug is affixed. This second plug includes a spring-engaging finger and a capstan body adapted to fit snugly within the knuckle. Atop the capstan body is a removable head which can be grasped by a wrench or like torsioning device. After this second plug is inserted in the hinge, the spring end is grasped and torqued by rotating the plug.

Abstract: A miniature electrical connector comprising an insulative body having spaced, parallel connector pins extending therethrough and held in place by a combination of abutment surfaces on the pins and block, and "C" rings on the pins. In assembling the connector, the "C" rings are formed as part of a metal stamping, and are urged as a unit onto corresponding ones of the pins extending through the body. The "C" rings are released from the stamping by bending the latter along suitably formed fracture lines.

Abstract: New reactants for catastrophically embrittling steel having a hardness of ckwell C40 or greater comprising an amalgam of 98 to 99 weight percent mercury, the balance being lithium and indium; and sulfuric acid, and methods for applying said reactants to the steel.

Abstract: This relates to the scribing and breaking of a semiconductor wafer into individual dies by anodizing the silicon in regions corresponding to the die boundaries. The regions are selectively anodized, and the anodization is continued until the anodized silicon extends into the semiconductor wafer to a depth that allows easy breakage when the wafer is stressed. To facilitate breakage, the anodized silicon may be removed with hydrofluoric acid.

Abstract: Novel glue-less staples are formed economically of sheet metal having essentially abutting but parted margins, the staples being joined to one another by localized integral connections along the margins. The connections can be of controlled size and their weakness can be controlled by mechanical working of the metal. As a specific feature, the connections can be formed to provide the standard bond strength found in glued rows of staples, so that the novel strips of staples can be made for use in conventional tackers and staplers.

Abstract: A miniature electrical connector comprising an insulative body having spaced, parallel connector pins extending therethrough and held in place by a combination of abutment surfaces on the pins and block, and C-rings on the pins. In assembling the connector, the C-rings are formed as part of a metal stamping, and are urged as a unit onto corresponding ones of the pins extending through the body. The C-rings are released from the stamping by bending the latter along suitably formed fracture lines.

Abstract: The method includes the steps of forming separately a pair of spaced recesses in a carrier plate, the recesses having a parallelogram configuration other than a rectangle and a cross member therebetween providing an axis of symmetry, the recesses being symmetrically disposed with respect to the axis of symmetry to approximate a sector of a circle; pressing and age-hardening separately a plate of friction material having a thickness corresponding to the desired thickness of the friction pads; cutting at least a pair of friction pads from the plate having the dimensions and shape of the recesses; and placing and securing each of the pair of friction pads in a different one of the recesses so that the pair of friction pads are disposed symmetrically with respect to the axis of symmetry to approximate a sector of a circle.

Abstract: A method for producing steel filaments having a heat treated microstructure is disclosed. The method comprises the steps of providing a steel coil having a carbon content from about 0.30 to about 0.95, percent by weight, scoring the surface of the steel to form a plurality of grooves that delineate continuous longitudinal segments, heat treating the steel to develop an appropriate metallurgical structure, separating the segments into individual filaments by causing the steel to fracture at the grooves, and then passing the filaments through a mechanical straightener.

Abstract: Disclosed is a breakage resistant semiconductor wafer and a method for the fabrication thereof. Intersecting grooves are formed on one side of the wafer to facilitate ultimate subdivision thereof. A portion, such as a peripheral portion, of the wafer remains ungrooved. The ungrooved portion substantially increases the strength of the wafer and prevents premature breakage. When it is desired to subdivide the wafer, laser scribe lines are formed on the opposite side of the wafer in registry with the grooves. In an alternate embodiment the second side of the wafer is also grooved. However, the grooves on the second side of the wafer traverse the entirety thereof.

Abstract: The crankshaft bearing cap of a connecting rod is formed from a forged rod blank which includes an integral circular head having an internal bearing surface and have integrally formed interconnecting lug portions. The lug portions are provided with cracking openings aligned with and parallel to a cracking plane. Each of the openings is provided with a cracking notch or recess which extends downwardly from one side of the head between twenty and fifty percent of the opening length. The assembly is located on a lubricated supporting bed with the unnotched face resting on the supporting surface. Interconnected cracking pins with a suitable tapered configuration are simultaneously forced into the cracking holes with an impact type force. The tapered pins are interconnected to a common support equalizing the cracking impact pressure as the pins are moved into cracking openings. Each of the notches is formed with a V-shape with an inclusive angle of forty-five degrees and a relatively shallow depth of from 0.

Abstract: A process for fabricating precision components of the type including at least one member which is of a sectionalized construction comprising a plurality of assemblable mated sections. The sectionalized member is produced from a plurality of preliminarily formed sections which are adhesively secured into a bonded assembly which is finish machined as a unit, whereafter the bonded assembly is cleaved to provide a matched set of sections for use in the final assembly of the component.

Abstract: 1. A method of inducing rapid failure in a shape that is under stress and is composed of cold rolled steel comprising applying against a surface of said cold rolled steel shape a mixture composed of lithium metal, lithium chloride and potassium chloride, rapidly heating that mixture as well as the surface of the steel shape in contact therewith sufficiently to melt the mixture but below the annealing temperature of the steel, and maintaining that temperature until the steel shape cracks.