With Conveying Of Work Or Disassembled Work Part Patents (Class 29/426.3)
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Patent number: 6915550Abstract: The device includes at least one continuous flexible suction conveyor which is equipped with openings and which conveys articles along a transfer path from an article feeder to an article received. A discharge point for the trimmings is provided along the transfer path. A suction system is also provided which is associated with the conveyor and which generates a suction through the openings along the transfer path. At least one obturator element, which is movable along the transfer path and which temporarily closes the openings of the conveyor opposite the trimming or trimmings, is provided.Type: GrantFiled: February 20, 2001Date of Patent: July 12, 2005Assignee: Fabio Perini, S.p.A.Inventors: Giulio Betti, Angelo Benvenuti, Mario Gioni Chiocchetti
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Patent number: 6843298Abstract: An automatic thermal debonding tool removes slider rows from a stainless steel processing fixture. The tool uses a bimodal pitch adjustment and a mechanical row detainment mechanism to remove the rows from the fixture. The tool allow full control of all critical process parameters such as accurate and repeatable row placement; controlled temperature and heat flow; controlled mechanical removal pressure; temporal control and variability; clean and contaminant-free working area; and full electrostatic discharge grounding and compatible materials. The bimodal pitch adjustment feature allows for continual, high-speed removal of the ceramic rows from the fixture after an automated heating cycle is complete. As the rows are removed, they are accurately placed into the detainment mechanism for the next process step.Type: GrantFiled: September 30, 2003Date of Patent: January 18, 2005Assignee: Hitachi Global Storage Technologies Netherlands, B.V.Inventors: John M. Borg, Sean M. Clemenza, Garrett T. Oakes, Katherine T. M. Tran
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Patent number: 6843878Abstract: An automatic thermal debonding process removes slider rows from a stainless steel processing fixture. The method uses a bimodal pitch adjustment and a mechanical row detainment mechanism to remove the rows from the fixture. The process allows full control of all critical process parameters such as accurate and repeatable row placement; controlled temperature and heat flow; controlled mechanical removal pressure; temporal control and variability; clean and contaminant-free working area; and full electrostatic discharge grounding and compatible materials. The bimodal pitch adjustment feature allows for continual, high-speed removal of the ceramic rows from the fixture after an automated heating cycle is complete. As the rows are removed, they are accurately placed into the detainment mechanism for the next process step.Type: GrantFiled: September 30, 2003Date of Patent: January 18, 2005Assignee: Hitachi Global Storage Technologies Netherlands, B.V.Inventors: John M. Borg, Sean M. Clemenza, Garrett T. Oakes, Katherine T. M. Tran
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Patent number: 6836946Abstract: An apparatus for removing nails from a tape is provided. The apparatus comprises a guide that directs a path of movement of the tape through the apparatus. The guide has a transition end over which the tape passes as the tape moves through the apparatus. The guide transition end is adapted to form a bend in the tape thereby exposing a head of the nail from the tape as the tape passes over the guide transition end. The apparatus further comprises a claw that is adapted to engage the nail head as the nail head is exposed when the tape passes over the guide transition end.Type: GrantFiled: December 5, 2001Date of Patent: January 4, 2005Inventor: Terry C. Ward
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Patent number: 6829822Abstract: A pallet board removal assembly for providing mechanical assistance to remove any board of a pallet for replacement includes a frame having rollers forming a bed. A pair of jaws are pivoted with staggered distal ends to clamp and subsequently remove a selected board from a pallet. The invention further includes a board cushioning assembly to control movement of the removed board and an optional nail press assembly to drive nail stubble into the stringers of the pallet.Type: GrantFiled: June 27, 2003Date of Patent: December 14, 2004Inventor: Juston E. Minick
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Patent number: 6826825Abstract: A manufacturing method achieves excellent magnetic recording characteristics by sequentially sputtering a non-magnetic under-layer, a non-magnetic intermediate layer, and a magnetic layer on a non-magnetic substrate in an atmosphere of H2O partial pressure of 2×10−10 Torr or lower. This process allows beneficial deposition of the magnetic layer and reduces raw materials costs. The magnetic layer includes ferromagnetic grains and non-magnetic grain boundaries. The intermediate layer has a hexagonal close-packed crystal structure. The manufacturing method allows manufacture of a high quality magnetic recording medium without a heating step thereby allowing use of lower cost materials, reduces manufacturing time, and increases savings.Type: GrantFiled: November 6, 2001Date of Patent: December 7, 2004Assignee: Fuji Electric Co., Ltd.Inventors: Naoki Takizawa, Hiroyuki Uwazumi, Takahiro Shimizu, Tadaaki Oikawa
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Publication number: 20040188017Abstract: In recapitulation, the present invention is a method and apparatus for the reliable removal and installation of a component feeding system, such as a direct die feeder, within a printed circuit board or similar assembly machine such as those used in the assembly of printed circuit boards. The invention employs a docking channel operatively affixed to the assembly machine, where the docking channel includes at least a pair of parallel grooves into which alignment rails on the component feeder may be inserted. In this way, the position of the component feeder may be controlled. The docking channel may further include stops, safety locks, alignment pins and a transport device to facilitate easy removal and exchange of component feeders on an assembly machine.Type: ApplicationFiled: March 26, 2004Publication date: September 30, 2004Applicant: Delaware Capital Formation, Inc.Inventors: Peter Davis, Dean Tarrant
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Patent number: 6773543Abstract: A method for the co-processing of bare die removal from a semiconductor wafer for the improved throughput of the extraction of die from a wafer for subsequent placement onto a substrate. The apparatus includes a pick head containing a nozzle having a suction port within that secures the bare die as it is removed from the wafer. The intermediate holding station has a plurality of nozzles, each having a vacuum port to secure and buffer a multitude of flipped die that are transferred from the pick nozzle. Vacuum flow valves enable the release and transfer of the bare die. Having a multiple of nozzles provides a buffer for the die as they are subsequently transitioned from the pick nozzle, queued within the intermediate transfer station and loaded in tandem onto a die shuttle.Type: GrantFiled: May 6, 2003Date of Patent: August 10, 2004Assignee: Delaware Capital Formation, Inc.Inventor: Michael A. Summers
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Patent number: 6763566Abstract: A method and apparatus involving releasing the rotor (1) and turning it to and fixing it at top dead center, attaching an extractor head to an exposed end of the hammer axle. A cross-piece (2.1) is applied and a releasable element of a slide (2.4) of a hammer axle puller is pulled, making a releasable connection between cross-piece and rotor attachment elements. The slide is moved to a position in which the puller head is connected to the slide in a shape-locking manner, securing the hammer position, returning the carriage whilst extracting the hammer axle (1.5) to release the hammer. The connection between the head and slide is released, moving the slide until the head and slide re-engage and returning the slide again to extract the hammer axle until the entire hammer and/or protective cap (1.4) and axle if appropriate are extracted. An Independent claim is also included for an arrangement for implementing the method.Type: GrantFiled: April 2, 2002Date of Patent: July 20, 2004Assignee: Metso Lindemann GmbHInventor: Martin Hassler
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Patent number: 6752896Abstract: A method of detaching a film of material (2) from the surface (5) of a substrate (1). An outlet (11) of a fluid delivery device (10) is engaged with an aperture (7, 8) in the substrate (1) from the opposite side of the substrate (1) from the surface (5) to which the film (2) is attached. Fluid is passed out of the outlet (11) and through the aperture (7, 8) to generate a detaching force between the film of material (2) and the surface (5) adjacent to the aperture (7, 8).Type: GrantFiled: July 10, 2001Date of Patent: June 22, 2004Assignee: ASM Technology Singapore PTE LTDInventors: See Yap Ong, Keng Hock Chew, Shu Chuen Ho, Teng Hock Kuah
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Patent number: 6732417Abstract: A dismantling system (automobile dismantling system) 1 of a product for dismantling the product having plural kinds has input means (terminal) 30a, 30b, 40a, 40b, - - - for inputting information of the dismantled product; memory means (a memory device of a host computer 2) for storing the information inputted from the input means 30a, 30b, 40a, 40b, - - - ; lot determining means (means constructed within the host computer 2) for classifying the product into the same kind or the approximately same kind on the basis of the stored product information, and determining a product number as a lot when the number of products of the same kind or the approximately same kind reaches a predetermined number; and dismantling means (automobile dismantling means) 61 for dismantling the product; wherein the product is dismantled by the dismantling means 61 every lot.Type: GrantFiled: October 17, 2001Date of Patent: May 11, 2004Assignee: Honda Giken Kogyo Kabushiki KaishaInventors: Akira Kaburagi, Fumihiro Yamaguchi
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Product disassembling and assembling system and a method of disassembling and assembling the product
Patent number: 6722010Abstract: A system and method for disassembling and assembling a product. The system includes a production facility for assembling a product, a processing facility for disassembling a used product and offering the unit or parts of the used product for assembling the product after the unit and parts are processed, and a commonly-used processing facility for practicing mutually reversible steps between the process of assembling the product and the process of disassembling the used product and offering the unit and parts for assembling the product and/or for practicing steps which are identical for the assembling and disassembling processes. The method includes the steps of performing an assembling process, performing a disassembling process, and performing in a commonly-used processing facility mutually reversible steps between the assembling and disassembling process and/or performing steps which are identical for the assembling and disassembling processes.Type: GrantFiled: March 29, 2001Date of Patent: April 20, 2004Assignee: Ricoh Company, Ltd.Inventors: Tohru Maruyama, Kenichi Shinozaki -
Patent number: 6704989Abstract: A transportable electronic sign display system and process where electronic display modules are encased in castered protective cases which are broken down on site and assembled in rows of desired length and stackably elevated and maneuvered by a lifting truss. Electronic display modules are lifted from protective case bases with minimal effort or labor. Various numbers of rows of desired length of electronic display modules can be stacked to form a desired display size.Type: GrantFiled: December 19, 2001Date of Patent: March 16, 2004Assignee: Daktronics, Inc.Inventors: Robert James Lutz, Bradley Jon VanderTuin, Mark Daniel Dennis
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Patent number: 6698486Abstract: An apparatus for removing a wafer ring tape, on which defective chips remain, from a wafer ring after normal chips are detached from the wafer ring tape, is provided. The apparatus comprises a ring table for supporting a tape-adhered wafer ring in which the wafer ring tape is attached to the wafer ring; a detaching head positionable above the ring table and movable for detaching the wafer ring tape from the wafer ring; a blocking pin disposed under the ring table to support the wafer ring tape detached from the wafer ring; and a pair of compressing plates disposed under the ring table to compress the wafer ring tape supported by the blocking pin.Type: GrantFiled: December 6, 2001Date of Patent: March 2, 2004Assignee: Samsung Electronics Co., Ltd.Inventor: Seok Goh
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Patent number: 6672496Abstract: A method, product cracker, and nest are used with a derelict product having a shell covering a core. The shell has opposed front and rear faces and a sidewall having at least one pair of diagonally opposed corner-edges extending transversely between the faces, and is separable along the sidewall into a pair of covers. In the method, the front and rear faces of the product are placed in alignment with a first axis and the pair of diagonally opposed corner-edges are placed in alignment with a second axis perpendicular to the first axis. The shell is directly supported near one corner-edge of the pair of diagonally opposed corner-edges and is impacted at the other corner-edge with sufficient force to separate the covers. The alignments are maintained during the impacting. The covers and core are collected and the core is sorted out.Type: GrantFiled: April 8, 2002Date of Patent: January 6, 2004Assignee: Eastman Kodak CompanyInventor: Gilbert E. Caster
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Patent number: 6668455Abstract: A method for preparing a multi-layer metal tube, comprises the steps of breaking the adhesion between at least a portion of a polymeric layer and an outer surface circumference of a metal tube having a corrosion resistant layer applied thereto, thereby causing the polymeric layer portion to retract and loosely adhere to a non-retracted polymeric layer adjacent the polymeric layer portion; and mechanically removing the retracted portion of the polymetric layer while leaving the corrosion resistant layer intact. An apparatus for achieving the mechanical removal is also disclosed.Type: GrantFiled: August 10, 2001Date of Patent: December 30, 2003Assignee: ITT Manufacturing Enterprises, Inc.Inventors: Joseph A. Duvall, Kevin E. Nicholls
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Patent number: 6665928Abstract: A method of mounting electronic components on a circuit substrate using an electronic component mounting device. The electronic component mounting device is operatively associated with (1) a component-supply table which includes a displaceable table and a plurality of component-supply units on the displaceable table and (2) a table displacing device which displaces the displaceable table in a desired direction and which positions the component-supply portion of each component-supply unit at a predetermined component-supply position. The electric component mounting device includes a plurality of component holders which are positioned at a component received position opposed to the component supply position. The method includes causing the component holder to receive, at the component receive position, an electric component from the component-supply portion of each component-supply unit which is positioned at the component-supply position.Type: GrantFiled: January 30, 2001Date of Patent: December 23, 2003Assignee: Fuji Machine Mfg., Co. Ltd.Inventor: Shinsuke Suhara
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Patent number: 6656320Abstract: A resin body is moulded around a die located on the front surface of a lead frame, and subsequently masking tape adhered to the rear surface of the lead frame is peeled away. While the tape is peeled away, the front surface of the lead frame is clamped by a surface which contains, or which can be deformed to contain, a recess for receiving the resin body. The peeling is performed by firstly separating an edge portion of the tape from the lead frame by a diagonal motion; and subsequently moving the edge portion across the lead frame so as to peel back the tape until its adhered surface faces away from the lead frame. A retrieval plate is urged against the adhered surface, so that the adhered surface becomes adhered to the retrieval plate. This process is repeated for successive lead frames, so that a stack of masking tape sections is formed on the retrieval plate.Type: GrantFiled: July 10, 2001Date of Patent: December 2, 2003Assignee: ASM Technology Singapore Pte LtdInventors: See Yap Ong, Tong Heng Cheah, Shu Chuen Ho, Teng Hock Kuah
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Patent number: 6651305Abstract: An apparatus for automatically handling sample cups closed with a screwable cap is disclosed. The apparatus for automatically opening, closing and transporting sample cups comprises a transportable gripper (11) which includes a rotatable gripper tool (21) adapted to enter and engage with a recess (35, 36) of said cap (34) to form a connection which can be locked by rotating the gripper tool (21) in a first sense with respect to said sample cup (31) and which can be unlocked by rotating the gripper tool (21) with respect to said sample cup (31) in a second sense opposite to the first.Type: GrantFiled: April 12, 2001Date of Patent: November 25, 2003Assignee: Roche Diagnostics CorporationInventors: Walter Fassbind, Rolf Schnarwiler
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Patent number: 6649017Abstract: A method of detaching an article (B) from a laminate unit (C), the laminate unit (C) comprising a support plate (A) and, fixed thereto, the article (B), the fixing effected through a pressure sensitive adhesive double coated sheet (1) deformable by heating to thereby exert a peeling effect, which method comprises heating at least one outer part of the laminate unit so that at least part of an outer region of the laminate unit is initially heated up, with other regions heated up later, and detaching the article (B) from the pressure sensitive adhesive double coated sheet (1) in a direction from the outer region toward the other regions. Thus, there are provided a detaching method and a detacher apparatus which enable efficiently detaching an article, such as an extremely thin wafer, having been fixed through a heat shrinkable pressure sensitive adhesive double coated sheet without cracking of the article.Type: GrantFiled: September 5, 2000Date of Patent: November 18, 2003Assignee: Lintec CorporationInventor: Shuji Kurokawa
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Publication number: 20030196308Abstract: A grind rail and transport kit provides a conveniently portable and durable grind rail. In use, the grind rail has stands that support a grind beam, thereby providing a stable riding surface. The assembled grind rail is of sufficient height, length, and stability to provide a safe and stable riding experience. To facilitate portability, the grind rail disassembles into rail pieces and stand pieces. The rail pieces and stand pieces cooperate to form a stable transportable assembly. The transportable assembly is about one-half the length of the grind rail, and is about as wide as the grind beam.Type: ApplicationFiled: April 18, 2002Publication date: October 23, 2003Inventor: Harris Daniel Kelsey
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Patent number: 6594877Abstract: A scrapping system of used-automobiles includes a reusable parts collecting station, a liquid collecting station for collecting liquids including fuel, oil and coolant, a prearrangement station for collecting chlorofluorocarbon, batteries, seats, tires, etc., a functional parts collecting station for collecting a suspension device, a non-ferrous metal parts and resin parts collecting station for collecting motors, harnesses, instrument panels, bumpers, etc., and a pressing station for pressing a body of the used-automobile which has been processed in the above stations. The stations are sequentially arranged.Type: GrantFiled: March 27, 2001Date of Patent: July 22, 2003Assignee: Yoshikawa Kogyo Co., Ltd.Inventors: Toshio Mori, Seietsu Morimoto, Katsumi Eguchi, Tomio Kawasaki, Hirohumi Kamiota
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Publication number: 20030101563Abstract: An apparatus for removing nails from a tape is provided. The apparatus comprises a guide that directs a path of movement of the tape through the apparatus. The guide has a transition end over which the tape passes as the tape moves through the apparatus. The guide transition end is adapted to form a bend in the tape thereby exposing a head of the nail from the tape as the tape passes over the guide transition end. The apparatus further comprises a claw that is adapted to engage the nail head as the nail head is exposed when the tape passes over the guide transition end.Type: ApplicationFiled: December 5, 2001Publication date: June 5, 2003Inventor: Terry C. Ward
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Publication number: 20030066179Abstract: A portion (14a, 14b) of a chip remover (14) is defined to be vibratory to give an NC machine tool (MT1) a vibration transferable onto a surface (FS) of a work (13) under a finishing by the NC machine tool (MT1), a decision is made whether the NC machine tool (MT1) enters the finishing, and vibration of the vibratory portion (14a, 14b) is controlled, as the decision is true.Type: ApplicationFiled: October 3, 2002Publication date: April 10, 2003Applicant: TOSHIBA KIKAI KABUSHIKI KAISHA.Inventors: Kazuhiro Shiba, Minoru Hamamura, Katsuhito Endo, Takao Date
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Patent number: 6502292Abstract: An apparatus for preparing an excavator stick for transport includes a base supporting two symmetrically spaced platforms for use by a mechanic. The base comprises a saddle at one end for holding the back portion of the excavator stick which has been detached from the boom of the excavator, an excavator stick point support bracket at the opposite end of the base for removably engaging the front portion of the excavator stick which has already been detached from the excavator bucket, and an extendible fork-shaped excavator stick support member disposed between the saddle and the excavator stick point support bracket for supporting the body of the excavator stick in the excavator stick support eye region of the excavator stick during preparation for transport.Type: GrantFiled: August 29, 2000Date of Patent: January 7, 2003Inventor: William E. Hartley
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Publication number: 20020148090Abstract: A dismantling system (automobile dismantling system) 1 of a product for dismantling the product having plural kinds has input means (terminal) 30a, 30b, 40a, 40b, - - - for inputting information of the dismantled product; memory means (a memory device of a host computer 2) for storing the information inputted from the input means 30a, 30b, 40a, 40b, - - - ; lot determining means (means constructed within the host computer 2) for classifying the product into the same kind or the approximately same kind on the basis of the stored product information, and determining a product number as a lot when the number of products of the same kind or the approximately same kind reaches a predetermined number; and dismantling means (automobile dismantling means) 61 for dismantling the product; wherein the product is dismantled by the dismantling means 61 every lot.Type: ApplicationFiled: October 17, 2001Publication date: October 17, 2002Inventors: Akira Kaburagi, Fumihiro Yamaguchi
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Patent number: 6423188Abstract: The present invention provides a substantially remote operable system for connecting and disconnecting a vessel. The system comprises a substantially remotely operable joint connector for connecting and disconnecting structural units. The system and the method using the system may also comprise a remote operable closure transport for removing a vessel closure from an opening in the vessel, and a substantially remote operable removal system for allowing material to be emptied from the vessel to increase operational efficiency.Type: GrantFiled: September 16, 1999Date of Patent: July 23, 2002Assignee: Automated Connectors Holdings, L.P.Inventor: Kelly Fetzer
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Patent number: 6357879Abstract: A slide mount has a first portion and a second portion. The first portion includes an interior region, an edge, and a slot extending from the interior region to the edge. A cavity is formed between the first portion and the second portion, and extends to the first edge. A film segment is disposed in the cavity. The slide mount disengageably locks in the film segment. The film segment can be released from the slide mount using an extractor arm. The slide mount can have a locking aperture for receiving a locking piston to disengage a protruding element from the film segment so as to permit extraction of the film segment from the cavity of the slide mount.Type: GrantFiled: April 29, 1999Date of Patent: March 19, 2002Assignee: Eastman Kodak CompanyInventors: Daniel M. Pagano, Dale F. McIntyre, David L. Patton, Edward Weissberger
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Patent number: 6357108Abstract: A depaneling system having multiple router stations. A feeder station in the dual routing station receives a panel from a feeder station. The feeder station then selectively delivers the panel to one of the router stations. The router station then severs all of the connections between the panel and the PC boards. The multiple router stations can also share a common router that is used by each station to sever the connections. In order to use a common router the router station have a movable receiving base which moves along a first axis. The router then moves along the second axis. The router and receiving base are then moved along the first and second axises independently to sever the connections.Type: GrantFiled: November 20, 1998Date of Patent: March 19, 2002Assignee: PMJ Cencorp, LLCInventor: Douglas Patrick Carr
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Publication number: 20010047585Abstract: The invention concerns an installation comprising continuously and successively: at least a station (A) automatically supplying tires; at least a station (B) for simultaneously removing each of the bead cores present in the tire rims; at least a station (C) for gradually crushing, along their circumference, the tires without bead cores; at least a station (D) for transversely cutting the crushed tires to obtain strip sections; at least a station (E) for treating the strip sections to separate the rubber material and the metal plies of the tire body from the running tread of each of the strip sections by reducing the rubber material to rubber crumb; means (12-13-14) for separately recuperating the rubber crumb and the strands of metal plies; the different stations and means are synchronously controlled for automatically and continuously treating and recycling tires.Type: ApplicationFiled: May 2, 2001Publication date: December 6, 2001Inventors: Sanzio Agostinelli, Daniel Da Silva, Bruno Perrin, Daniel Perrin, Neol Peyron
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Product disassembling and assembling system and a method fo disassembling and assembling the product
Publication number: 20010047578Abstract: A system and method for disassembling and assembling a product. The system includes a production facility for assembling a product, a processing facility for disassembling a used product and offering the unit or parts of the used product for assembling the product after the unit and parts are processed, and a commonly-used processing facility for practicing mutually reversible steps between the process of assembling the product and the process of disassembling the used product and offering the unit and parts for assembling the product and/or for practicing steps which are identical for the assembling and disassembling processes. The method includes the steps of performing an assembling process, performing a disassembling process, and performing in a commonly-used processing facility mutually reversible steps between the assembling and disassembling process and/or performing steps which are identical for the assembling and disassembling processes.Type: ApplicationFiled: March 29, 2001Publication date: December 6, 2001Applicant: Richoh Company, LTD.Inventors: Tohru Maruyama, Kenichi Shinozaki -
Patent number: 6296035Abstract: Apparatus is disclosed for removing a coating from synthetic resin products, such as an automobile bumper, to obtain improved coating removal rate and improved productivity. A resin material having a coating applied thereto is rolled between a resin-side roll and a coating-side roll which rotate at different peripheral speeds. A shear stress is applied to the interface between the resin material and the coating, thereby removing the coating from the resin material. Pressing means press the coating-side roll towards the resin-side roll with a predetermined force. The resin-side roll and the coating-side roll apply a normally fixed shear stress between the resin material and the coating, ensuring stable coating removal and improved productivity.Type: GrantFiled: March 27, 2000Date of Patent: October 2, 2001Assignee: Fuji Jukogyo Kabushiki KaishaInventors: Hiroshi Yamamoto, Toshikazu Watanabe
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Patent number: 6292994Abstract: Processes and apparatuses for partly disassembling tape cassettes having at least one closure flap comprise separating the closure flap from the cassette or from the cassette housing at an early time, before, during or shortly after the opening of the cassette. Several process methods and examples of apparatus are specified. The separating methods and apparatuses can be expediently used for all tape cassettes with one or more closure flaps, it being possible for these to be any type of audio, video and data cassettes.Type: GrantFiled: May 7, 1998Date of Patent: September 25, 2001Assignee: EMTEC Magnetics GmbHInventors: Manfred Schlatter, Norbert Müller, Gerhard Hoefer
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Patent number: 6289575Abstract: A stator assembly has a pair of end holes leading to a hollow region which has a larger diameter than the end holes. The assembly is manufactured around an elongated pole having a diameter equal to the end holes, which is surrounded by a temporary sleeve whose thickness fills the gap between the pole and the inner wall of the hollow region. The pieces of the assembly are placed onto the pole such that the sleeve lies within the hollow region, to thereby align them correctly with one another. After the pieces are secured to each other, the pole is removed, leaving the sleeve within the hollow region, and then the sleeve is removed. The sleeve may be flexible in order to expedite its removal from the hollow, and also may be of a magnetic material that is kept in place by magnetic forces generated by the stator assembly or by the pole.Type: GrantFiled: December 8, 1999Date of Patent: September 18, 2001Assignee: California Linear Devices, Inc.Inventors: Philip Hollingsworth, James Carl Ellard, Paul M. Lindberg
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Patent number: 6260260Abstract: A method of supplying electric components (“ECs”) with an EC supplying apparatus including an EC-supply table including a displaceable table displaceable in a reference direction, and EC-supply units provided on the displaceable table such that respective EC-supply portions of the units are arranged along a line parallel to the reference direction, each of the EC-supply units including a driven member and a carrier-tape feeding device which feeds, based on the driven member being driven, a carrier tape carrying the ECS at a EC-carry pitch, at a tape-feed pitch equal to a quotient obtained by dividing the EC-carry pitch by an integral number, so that the ECs are positioned, one by one, at the EC-supply portion of each unit, a table displacing device which displaces the displaceable table and positions the EC-supply portion of each EC-supply unit, at an EC-supply position, a drive member which is provided near the EC-supply position, and a drive device which drives the drive member which in turn driType: GrantFiled: October 28, 1998Date of Patent: July 17, 2001Assignee: Fuji Machine Mfg. Co., Ltd.Inventor: Shinsuke Suhara
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Patent number: 6260270Abstract: Method and apparatus for short-term relining or construction of a blast furnace uses a grounding apparatus for grounding of ring-shaped blast furnace segments having shells and a casting floor present as a blast furnace floor for transferring the ring-shaped blocks or shells onto a foundation of the blast furnace, and capable of safely and precisely mounting the ring-like blocks on the casting floor, wherein the grounding apparatus is integrated with a jack system utilizing rod type lift jacks and a sliding apparatus installed with intermittently movable hydraulic cylinders for safe and precision mounting of the ring-shaped blocks or shells on the casting floor.Type: GrantFiled: September 22, 1999Date of Patent: July 17, 2001Assignee: Kawasaki Steel CorporationInventors: Kazuo Kimura, Iwao Asada
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Patent number: 6248201Abstract: A semiconductor chip transferring method and apparatus is described having a movable member, a flexible structure having adhesive on a lower surface thereof, a first transport assembly, and a second transport assembly. The first transport assembly is positioned beneath the support structure and includes a rotatable base upon which is mounted at least one arm. The movable member is extended into and flexes the support structure to transfer a semiconductor chip supported on a first side by the support structure to the arm which supports it on a second side. The first transport assembly moves the chip to the second transport assembly which may, in turn, move it to an output container which supports the second side. The chip has now been inverted from its initial orientation.Type: GrantFiled: May 14, 1999Date of Patent: June 19, 2001Assignee: Lucent Technologies, Inc.Inventors: John E. Boyd, IV, Patrick J. Drummond, Jonathan V. Haggar, John S. Rizzo
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Patent number: 6223427Abstract: An apparatus for extracting screw elements from a screw shaft comprises a frame, a stationary clamp mounted on the frame and disposable between open and closed positions, a carriage mounted on the frame for motion toward and away from the stationary clamp, a movable clamp mounted on the carriage for motion therewith and disposable between open and closed positions, a first drive coupled to the stationary clamp for opening and closing the stationary clamp, a second drive coupled to the movable clamp for opening and closing the movable clamp, and a third drive coupled to the carriage for causing motion of the carriage toward and away from the stationary clamp, wherein clamping of a downstream screw element by the stationary clamp, clamping of an upstream screw element by the movable clamp and one or more strokes of the carriage away from the stationary clamp result in removal of the downstream screw element held in place by the stationary clamp from the screw shaft.Type: GrantFiled: March 24, 2000Date of Patent: May 1, 2001Assignee: Apex Tool and Manufacturing, Inc.Inventors: Robert S. Hodgson, Michael J. Mattingly
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Patent number: 6202278Abstract: An automatic plug removing apparatus has a conveying section and a plug removing section and, while a plurality of containers having test samples therein and sealed with plugs are being conveyed on a batch basis, the plugs are automatically removed from the containers. The plug removing section includes a member for holding a plurality of containers in an immovable state, a member for grasping the plugs provided to the containers and then removing the plugs from the containers, the grasping member being rockable and vertically movable by driving members, and partition plates insertable into gaps between the containers to provide isolated spaces for respective containers and prevent contamination between samples. A suction block may be added to suck the air in the vicinity of upper openings of the containers to eliminate a mist of samples floating thereabout.Type: GrantFiled: January 26, 1999Date of Patent: March 20, 2001Assignees: Daisen Sangyo Co., Ltd., Mitsubishi Kagaku Bio-Clinical Laboratories, Inc.Inventors: Naoki Nakayama, Akio Akiyama, Fumio Goda
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Patent number: 6199466Abstract: An apparatus for processing a palletized container (411), the palletized container (411) including a container (413) affixed to a pallet (415). The apparatus includes a receptacle (412) arranged and configured for receiving the palletized container (411). A shearing mechanism is incorporated within the receptacle (412). The shearing mechanism is constructed and arranged for generating relative movement between the container (413) and the pallet (415) such that the container (413) is sheared from the pallet (415). The shearing mechanism includes support structure (428) for supporting the palletized container (411) within the receptacle (412) by engaging the pallet (415) of the palletized container (411). The shearing mechanism also includes a shearing member (440) having an edge (456) spaced a predetermined distance (D1) from the support structure (428).Type: GrantFiled: February 13, 1998Date of Patent: March 13, 2001Assignees: Solid Waste Management Systems, Inc., Nelson Technical Services, Inc.Inventors: John R. Crawford, Michael L. Nelson
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Patent number: 6176966Abstract: A method of die bonding electronic components. A wafer is mounted on a dicing tape (17) comprising at least one layer of shrink film and a pressure sensitive adhesive layer so that the wafer is stuck thereto by the pressure sensitive adhesive layer. The wafer is then diced so that the wafer is cut apart into a multiplicity of chips (16). The dicing tape (17) having the multiplicity of chips stuck thereto is placed on a table equipped with heating means. This is followed by shrinking the shrink film forming part of the dicing tape by the heating means (3, 7) so that an area of adhesion and adhesive strength between the chips and the adhesive layer are decreased and so that the chips are arranged with predetermined spacings. The final step is suctioning the chips (16) arranged with predetermined spacings one at a time by a suction collet (19) disposed above the chips so that the chips are separated from each other. This method enables effective die bonding without damaging the chips.Type: GrantFiled: June 11, 1998Date of Patent: January 23, 2001Assignee: Lintec CorporationInventors: Masaki Tsujimoto, Kenji Kobayashi
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Patent number: 6173750Abstract: A direct die feeder picks known good die from a wafer and places them on a conveyor belt, which conveys the die to a pickup location. Frame (111) supports a wafer (105) which is a wafer that is sawed while adhered onto a flexible film, which is then stretched and mounted in a ring (110). A fork member (125), on which a pick head (150) is mounted slides along a horizontal axis and frame (111) slides along a vertical axis to allow the pick head (150) to access any die from the wafer. A camera (160) is directed downward at a 45° mirror (162) adjacent to the pick head to capture images of the wafer and determine the precise locations of die and qualify them. The pick head (150) can pick die from the wafer and place them directly on the conveyor belt (170) in the conventional orientation, or pass the die to a flip head (140) which then shifts to the left and lowers the die down past the pick head, placing the die on the conveyor belt in the flipped orientation.Type: GrantFiled: February 17, 1999Date of Patent: January 16, 2001Assignee: Hover-Davis, Inc.Inventors: Peter Davis, Dean Tarrant
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Patent number: RE38315Abstract: An apparatus for extracting screw elements from a screw shaft comprises a frame, a stationary clamp mounted on the frame and disposable between open and closed positions, a carriage mounted on the frame for motion toward and away from the stationary clamp, a movable clamp mounted on the carriage for motion therewith and disposable between open and closed positions, a first drive coupled to the stationary clamp for opening and closing the stationary clamp, a second drive coupled to the movable clamp for opening and closing the movable clamp, and a third drive coupled to the carriage for causing motion of the carriage toward and away from the stationary clamp, wherein clamping of a downstream screw element by the stationary clamp, clamping of an upstream screw element by the movable clamp and one or more strokes of the carriage away from the stationary clamp result in removal of the downstream screw element held in place by the stationary clamp from the screw shaft.Type: GrantFiled: July 2, 2002Date of Patent: November 18, 2003Assignee: Apex Tool and Manufacturing, Inc.Inventors: Robert S. Hodgson, Michael J. Mattingly