To Trim Electric Component Patents (Class 29/566.3)
  • Patent number: 11324124
    Abstract: A lead component mounting method includes: a component insertion process in which two lead wires are inserted into two corresponding through-holes which are formed in a circuit board from one side of the circuit board in a state in which at least a pair of pawl portions pinches and holds each of the two lead wires which are included in a lead component; and a clinching process in which protruding portions, which are portions protruding from another side of the circuit board, of the two lead wires which are inserted into the two corresponding through-holes, are bent in a state in which the two lead wires are held by at least the pair of pawl portions.
    Type: Grant
    Filed: January 31, 2020
    Date of Patent: May 3, 2022
    Assignee: FUJI CORPORATION
    Inventor: Nobuyuki Ishikawa
  • Patent number: 11037705
    Abstract: There is described a clocking angle setting tool for a wire harness having a support arm provided with a clamp for attaching a harness cable of the wire harness to the support; arm, a connector receptacle for receiving a connector provided at the end of the harness cable and a key or keyway for engaging with a complementary keyway or key of the connector. The connector receptacle is spaced from the clamp and is rotatably mounted to the support arm. A locking mechanism for locking an angular position of the connector receptacle relative to the support arm is included. The angular position of the connector receptacle relative to the support arm determines a clocking angle of the connector relative to the harness cable.
    Type: Grant
    Filed: October 10, 2018
    Date of Patent: June 15, 2021
    Assignee: ROLLS-ROYCE plc
    Inventors: Samuel J Turner, Andrew V Mather
  • Patent number: 10511131
    Abstract: A terminal crimping device includes a terminal feeding device, a crimping device and an electric-wire holding mechanism that holds an electric wire with an end portion of the electric wire placed above an electric-wire connecting portion of a crimp terminal. The electric-wire holding mechanism includes an upper surface of a terminal cutting body, on which the electric wire is placed, and an electric-wire presser that is moved downward toward the upper surface and presses and thereby holds the electric wire placed on the upper surface. Between the electric-wire placing portion and a lower surface of the electric-wire presser, an electric-wire holding space is formed that inclines in the same direction to a declining direction in which the end portion of the electric wire is declined in association with downward move of the second die toward the first die, and that holds the electric wire in a thus inclined state.
    Type: Grant
    Filed: December 13, 2016
    Date of Patent: December 17, 2019
    Assignee: YAZAKI CORPORATION
    Inventors: Hikaru Anma, Masashi Iwata, Hideki Saito, Naoki Ito
  • Patent number: 10193292
    Abstract: Provided are a jig and a press-fitting device that are capable of suppressing buckling during the press-fitting process. The jig has a jig unit in which a plurality of metal plate-shaped bodies for installing a press-fit terminal onto a substrate are combined. The jig unit includes a movable guide member having a guide groove through which a terminal main body can pass; an insertion punch having a punch groove corresponding to the guide groove, and having a pressing section formed therein; and a rear surface plate body. The movable guide member and the rear surface plate body are attached so as to be vertically movable relative to the insertion punch and, while the press-fit section is being press-fitted into the substrate by the insertion punch, the movable guide member and the rear surface plate body move upward relative to the insertion punch after the lower sides thereof abut to the substrate.
    Type: Grant
    Filed: November 27, 2013
    Date of Patent: January 29, 2019
    Assignee: J.S.T. MFG. CO., LTD.
    Inventor: Junji Onishi
  • Patent number: 9748724
    Abstract: A method of connecting an electric cable to a connector terminal includes arranging a connector terminal in a lower die so that an end portion of the electric cable in which a core wire is exposed from an outer cover is arranged in a barrel portion of the connector terminal, pressing a crimper to the barrel portion to crimp the barrel portion, overlapping the lower die with an upper die to form an injection space around the barrel portion and the end portion of the electric cable, and injecting a resin in an injection space, thereby forming a resin mold that covers and waterproofs the barrel portion and the end portion of the electric cable.
    Type: Grant
    Filed: February 20, 2014
    Date of Patent: August 29, 2017
    Assignee: YAZAKI CORPORATION
    Inventor: Kei Sato
  • Patent number: 8590143
    Abstract: An apparatus 200 for delivering semiconductor components 212 to a substrate 206a; 206b; 500a; 500b; 500c during semiconductor package manufacturing. The apparatus 200 comprises a platform 216 and a plurality of delivery modules 202a, 202b affixed to the platform 216. Each of the plurality of delivery modules 202a, 202b has a support device 204a; 204b for supporting the substrate 206a; 206b; 500a; 500b; 500c, as well as a delivery device 208a; 208b for delivering the semiconductor components 212 to the substrate 206a; 206b; 500a; 500b; 500c. In particular, heights of the support devices 204a, 204 are mutually leveled for conveying the substrate 206a; 206b; 500a; 500b; 500c between the plurality of delivery modules 202a, 202b.
    Type: Grant
    Filed: May 25, 2011
    Date of Patent: November 26, 2013
    Assignee: ASM Technology Singapore Pte. Ltd.
    Inventors: Kui Kam Lam, Yen Hsi Tang, Wai Yuen Cheung, Wing Kin Lam
  • Patent number: 8112883
    Abstract: A method for manufacturing an electronic circuit board which contains an electronic circuit on a main surface of a glass substrate according to the invention sequentially performs a step of electrically inspecting the main surface of the glass substrate on which the electronic circuit is formed, a step of specifying positions and defect types of defects on the main surface of the glass substrate, a step of calculating reference point coordinates on the main surface of the glass substrate and correcting the coordinates, a step of extracting respective defects from an image around the defects and specifying a defect to be corrected in the extracted defects by referring to a defect existing range registered in advance for each defect type, and a step of cutting the specified defect. By this method, a foreign material adhering to the glass substrate is not erroneously judged as short-circuit defect causing short-circuit on the electronic circuit, and only defect actually requiring correction can be removed.
    Type: Grant
    Filed: June 10, 2008
    Date of Patent: February 14, 2012
    Assignees: Hitachi Displays, Ltd., Panasonic Liquid Crystal Display Co., Ltd.
    Inventor: Nobuaki Nakasu
  • Patent number: 7757375
    Abstract: Aimed at stably forming sheared surfaces of leads of semiconductor devices, and at raising ratio of formation of plated layers onto the sheared surfaces of the leads, a lead cutter has a die 106, and a cutting punch 110 having a cutting edge at least on the surface facing the die, wherein clearance T between the die 106 and the cutting punch 110 is set within the range from not smaller than 2.3% and smaller than 14.0% of the total thickness of the leads to be cut and plated layers formed on the upper and the lower surfaces thereof.
    Type: Grant
    Filed: March 29, 2007
    Date of Patent: July 20, 2010
    Assignee: NEC Electronics Corporation
    Inventor: Tooru Kumamoto
  • Patent number: 7685702
    Abstract: A wire insertion tool for a push-in wire connector has a frame and a slide assembly mounted for reciprocating motion on the frame. The frame includes a carriage on which a push-in wire connector is mounted. The slide assembly carries a wire holder which mounts an electric wire opposite the wire connector. An actuator extends to advance the slide assembly and carry a wire in the holder in a direction parallel to the axis of the wire. Advancement of the wire holder inserts the wire into the connector. The wire holder is then released and the slide assembly is retracted to prepare for the next insertion cycle.
    Type: Grant
    Filed: August 7, 2007
    Date of Patent: March 30, 2010
    Assignee: IDEAL Industries, Inc.
    Inventors: Robert W. Sutter, David Niemi, Jacob C. Ward
  • Patent number: 7305758
    Abstract: A terminal crimping device is used to manufacture an electric wire with terminal by crimping a terminal fitting onto an end portion of an electric wire. This device includes: an electric wire holding portion to hold the end portion of the electric wire at a predetermined crimping position; a terminal crimping portion to crimp the terminal fitting onto the end portion of the electric wire at the crimping position; and a crimping portion moving mechanism to move the terminal crimping portion along a crimping portion moving direction. The terminal crimping portion is provided to be movable with respect to the end portion of the electric wire held at the crimping position by the electric wire holding portion along the crimping portion moving direction that intersects with a direction along which the end portion of the electric wire extends.
    Type: Grant
    Filed: March 16, 2005
    Date of Patent: December 11, 2007
    Assignee: J. S. T. Mfg. Co., Ltd.
    Inventors: Kazuma Kurooka, Junji Onishi, Shigeo Minomura, Masataka Nishiura
  • Patent number: 7243416
    Abstract: A structure of a press-contacting holding part is not complicated so that press-contacting operation of press-contacting an electric wire to the press-contacting terminal is easily and precisely performed. According to the invention, an apparatus of press-contacting of electric wire includes a case holding part for holding case provided with a press-contacting terminal, an electric wire holding part for holding the electric wire positioned by the positioning part, a press-contacting driving mechanism for driving the electric wire held by the electric wire holding part so that the electric wire is pushed into a slot part of the press-contacting terminal to provide pressure contact therebetween.
    Type: Grant
    Filed: March 23, 2004
    Date of Patent: July 17, 2007
    Assignees: Autonetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd.
    Inventor: Ryousuke Shioda
  • Patent number: 7185425
    Abstract: By forming a terminal at a tip of a lead part of a lead frame, and by fixing this terminal and a connecting pad which was formed on an upper surface of a first printed circuit board, the lead frame is attached to the first printed circuit board. By cutting off a frame part and a tie bar part from the lead frame which was attached to the first printed circuit board, the lead part is separated, and forming is applied to the lead part so as for its tip to be extended over the first printed board. After the lead part which is expanded upward is inserted into a through-hole which was opened in a second printed circuit board, by soldering the lead part and the through-hole, the first printed circuit board and the second printed circuit board are electrically connected.
    Type: Grant
    Filed: October 9, 2003
    Date of Patent: March 6, 2007
    Assignees: Fujitsu Ten Limited, Toyota Jidosha Kabushiki Kaisha
    Inventors: Takashi Ohta, Kazuaki Yamada, Kiyoshi Tsujii, Hidekazu Manabe
  • Patent number: 7162906
    Abstract: A method for removing from a carrier a carrier part with a housing arranged thereon, wherein prior to performing the separating operation a notched line is arranged in the carrier on at least one side of the carrier along at least a part of the length of a separating edge to be arranged. The invention also relates to a carrier part with a housing arranged thereon, which carrier part contains openings on the side of the carrier remote from the housing which are filled with encapsulating material, manufactured with the present method. The invention moreover relates to an apparatus for performing the method.
    Type: Grant
    Filed: January 29, 2002
    Date of Patent: January 16, 2007
    Assignee: Fico B.V.
    Inventors: Adrianus Wilhelmus Van Dalen, Henri Joseph Van Egmond
  • Patent number: 7107671
    Abstract: A method of processing a strip of lead frames is disclosed. The method includes engaging the strip with a lead frame advancement system, advancing the strip to a tooling member, and performing a tooling operation on the strip.
    Type: Grant
    Filed: May 8, 2003
    Date of Patent: September 19, 2006
    Assignee: Micron Technology, Inc.
    Inventor: Morley J. Weyerman
  • Patent number: 7096564
    Abstract: A tool assembly includes an elongated metal tool body for forcibly inserting the end of an insulated wire into a telephone connector of the insulation displacing type, and having a separate and replaceable cutting blade removably attached to the tool body for cutting off the then protruding end of the insulated wire after electrically conductive engagememnt of the wire with the blades of the connector has been achieved.
    Type: Grant
    Filed: April 29, 2004
    Date of Patent: August 29, 2006
    Inventor: Robert W. Sullivan
  • Patent number: 7073245
    Abstract: A tool that seats and cuts multiple wires inserted into terminals of a multi-terminal jack includes a support housing for a linearly translatable, and removable carrier. The carrier fixedly retains one of a blade head and a jack, and slidably retains the other of the jack and the blade head, in such a manner that the jack is maintained in precision alignment with the blade head as the carrier is linearly translated within the support housing. A carrier translation control mechanism is coupled to the support housing in a manner that pushes and thereby linearly translates the carrier, so as to bring the blades of the translated blade head into precise stuffing and cutting engagement with the wires in the jack.
    Type: Grant
    Filed: May 14, 2004
    Date of Patent: July 11, 2006
    Assignee: Fluke Corporation
    Inventors: Paul John Alexander, Michael M. Fallandy
  • Publication number: 20040255451
    Abstract: A broken trim die tool detection sensor. The lands of the tie bar die connect with the leads of the unit to form switches. The states of these switches indicate broken die lands or other malfunctions.
    Type: Application
    Filed: September 13, 2001
    Publication date: December 23, 2004
    Inventors: Ronald B. Azcarate, Alwin A. Rosete, Jong A. Foronda
  • Publication number: 20040045160
    Abstract: Electrical circuit trimming methods. In one aspect of the invention, a trimming method includes assembling one or more components of an electrical circuit onto a printed circuit board having one or more electrical connections coupled to the said one or more components. An electrical parameter of the electrical circuit is then trimmed. The trimming of the electrical parameter of the electrical circuit includes removing a portion of the printed circuit board to break the electrical connection on the printed circuit board. In another aspect of the invention, the trimming the electrical parameter of the electrical circuit includes electrical programming of the electrical circuit.
    Type: Application
    Filed: September 4, 2003
    Publication date: March 11, 2004
    Applicant: Power Integrations, Inc.
    Inventor: Balu Balakrishnan
  • Publication number: 20030230179
    Abstract: An apparatus and method are provided that increases the efficiency of material handling apparatus, such as those used to trim and form electrical leads on solid state electrical devices. The apparatus includes a plurality of rotatable pulleys, an endless belt capable of retaining devices to be processed that is disposed around the pulleys such that rotation of the pulleys will cause said belt to travel around said pulleys, and a plurality of paired tooling members, each of said paired tooling members having first and second tooling members disposed on opposing sides of the belt and directly opposing so as to cooperate and perform a tooling operation on the leads when reciprocated toward each other along a common axis. In a preferred embodiment, two horizontally aligned pulleys with vertical axes of rotation are used to rotate the belt in a horizontal plane.
    Type: Application
    Filed: May 8, 2003
    Publication date: December 18, 2003
    Inventor: Morley J. Weyerman
  • Patent number: 6625867
    Abstract: A tool cartridge for seating and cutting a communication wire in a terminal block. The cartridge includes a tool end and a base end. A wire seating blade and a wire cutting blade extend outwardly from the cartridge and are mounted for longitudinal movement relative to the cartridge and to each other. A spring bias detent assembly forces the wire seating and wire cutting blades into contact with each other for longitudinal movement together relative to the cartridge. A compression spring resists longitudinal movement of the wire seating and wire cutting blades in the direction of the base of the cartridge by seating pressure applied to the cartridge. A cam is positioned to release the detent assembly thereby disengaging the wire seating and wire cutting blades from movement together after a predetermined compression of the compression spring. The release of the blades from movement together permitting the compression spring to drive the cutting blade to its cutting position to cut the wire.
    Type: Grant
    Filed: August 10, 2001
    Date of Patent: September 30, 2003
    Assignee: Ideal Industries, Inc.
    Inventor: Jeffrey P. Jonker
  • Patent number: 6609295
    Abstract: A piezoelectric element is mounted to a clinch lever for detecting stress-strain generated therein when cutting and clinching leads of an electronic component that has been inserted in corresponding holes formed in a circuit board substrate. A detected voltage d is compared to a threshold voltage s selected from a plurality of threshold voltages preset in the device. When the detected voltage d exceeds the threshold voltage s, the insertion detecting section outputs a signal indicating that the insertion of the leads in the holes has been performed normally.
    Type: Grant
    Filed: October 25, 2001
    Date of Patent: August 26, 2003
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Toshiyuki Koyama, Satoshi Taniguchi
  • Patent number: 6601285
    Abstract: An impact tool for use by telecommunications personnel for the insertion of communications wires in a terminal block. The impact tool includes an impact tool cartridge having a seating blade and a cutting blade. The seating blade is retractable against a compression spring while the cutting blade is fixed so that upon the application of seating pressure to the impact tool, the seating blade retracts and the cutting blade is exposed to cut the wire. In another embodiment of the invention, a spring loaded detent supplements the compression spring in resisting retraction of the seating tool. A noise producing mechanism is located in the impact tool handle for producing an audible sound upon completion of the wire seating and terminating operations. A storage compartment for the seating and cutting blades is formed in the impact tool handle and has a door pivotally mounted for opening and closing movement relative to the handle.
    Type: Grant
    Filed: May 2, 2002
    Date of Patent: August 5, 2003
    Assignee: Ideal Industries, Inc.
    Inventors: Jeffrey P. Jonker, David Henke
  • Patent number: 6581277
    Abstract: A method of processing a leadframe strip defining a first row of alignment holes and a second row of alignment holes. One embodiment of the method comprises allowing incremental advancement of said leadframe strip using said first row of alignment holes and refraining from using said second row of alignment holes to allow said advancement.
    Type: Grant
    Filed: February 6, 2002
    Date of Patent: June 24, 2003
    Assignee: Micron Technology, Inc.
    Inventor: Morley J. Weyerman
  • Patent number: 6523773
    Abstract: Sensor arrangements are provided to detect whether initial and final wire leads were properly terminated to tang terminals of dynamo-electric machine components. The sensor arrangements may detect whether excess wire from the termination of the initial wire lead is present on a first side of a wire gripper. The sensor arrangements may detect whether excess wire from the termination of the final wire lead is present on a second side of a wire gripper. The sensor arrangements can include two sensors or a single sensor to detect the presence of the excess wire. Beam sensors, vision sensors, or tactile sensors may be used to detect the presence of the excess wire. A plunger device is provided to facilitate the tearing of thin initial and final wire leads to a tang terminal of a commutator.
    Type: Grant
    Filed: March 27, 2001
    Date of Patent: February 25, 2003
    Assignee: Axis USA, Inc.
    Inventors: Gianfranco Stratico, Maurizio Mugelli, Giovanni Manuelli
  • Patent number: 6463849
    Abstract: There is provided an apparatus for bundling a plurality of wires placed on a receiving plate. The apparatus is provided with a bundling pawl mechanism that includes a plate and a pair of pawl members. The pawl members are respectively supported at pivot points provided on the plate in spaced-apart relation and interconnected with driving units for opening and closing movement. The pawl members also respectively extend beyond an edge portion of the plate. A wire bundling region is formed between inner surfaces of the pawl members and the edge portion of the plate when at least one of the pawl members rotates toward the other of the pawl members in a closing direction. The bundling pawl mechanism further includes a wire catch prevention member that projects into the wire bundling region from an angled inner corner formed between the inner surface of the at least one pawl member and the edge portion of the plate when the at least one pawl member rotates in the closing position.
    Type: Grant
    Filed: April 4, 2001
    Date of Patent: October 15, 2002
    Assignee: Sumitomo Wiring Systems, Ltd.
    Inventor: Tatsuya Mizutani
  • Patent number: 6445969
    Abstract: A method and system for monitoring process parameters associated with a manufacturing or testing process. The system includes: at least one machine which is used in the manufacturing or testing process; at least one sensing device, coupled to the at least one machine, for measuring a process parameter associated with the at least one machine; and a controller, coupled to the at least one sensing device, for receiving and storing measured data from the at least one sensing device. The method includes the acts of: measuring a value of a process parameter associated with a machine used in the manufacturing or testing process; converting the measured value of the process parameter into a digital data signal having a specified data format; transmitting the digital data signal to a controller; and storing the digital data signal in a database.
    Type: Grant
    Filed: January 9, 1998
    Date of Patent: September 3, 2002
    Assignee: Circuit Image Systems
    Inventors: Jim Kenney, John Leon
  • Patent number: 6438832
    Abstract: A method of producing layered metal components is described which obviates the need for layering the terminals twice. The method includes the steps of providing a strip of base material, layering the base material with layering material, and cutting individual pieces from the strip such that the layering material is wiped across the surface of the base material which would otherwise be exposed by the separation.
    Type: Grant
    Filed: February 21, 2000
    Date of Patent: August 27, 2002
    Inventor: Larry J. Costa
  • Patent number: 6405430
    Abstract: A method for moving a workpiece having a first plurality of alignment features and a second plurality of alignment features. The method comprises attaching the workpiece to a workpiece advancer using at least a portion of the first alignment features such that the workpiece can move incrementally relative to the workpiece advancer. The method also includes shifting the workpiece using the workpiece advancer.
    Type: Grant
    Filed: October 14, 1999
    Date of Patent: June 18, 2002
    Assignee: Micron Technology, Inc.
    Inventor: Morley J. Weyerman
  • Patent number: 6298548
    Abstract: A tool for use in joining wire pairs via wire connector assemblies such as those utilized in telecommunications includes a housing and a force applicator connected to a T-bar for applying force to a wire connector assembly. A wire connector holder is provided which receives the wire connector assemblies to be connected along with the wire pairs. A pivotal wire guide is provided on one side of the wire connector holder which allows easy removal of the wires and connectors after the connection is made. An adjustable gauge wire guide is provided on the other side of the wire connector holder which accommodates different gauges of wire. The force applicator includes a removable spacer which adjusts the stroke of the force applicator to accommodate stacks having more than one connector assembly in the wire connector holder.
    Type: Grant
    Filed: November 20, 1997
    Date of Patent: October 9, 2001
    Assignee: 3M Innovative Properties Company
    Inventor: Wilson E. Suarez
  • Patent number: 6276184
    Abstract: A process for manufacturing semiconductor devices is carried out using an apparatus comprising a conversion mechanism having a drive shaft (11), a first rod (12) connected to the drive shaft (11), and a second rod (13) connecting the second rod (12) to a third rod (14) which is guided by means of a linear bearing (16, 17). The mechanism has a lever (21) extending substantially in a transverse direction (x) perpendicular to a stamping direction (z). The third rod (14) is coupled to the lever (21) via a first coupling, in this case a fourth rod (33) which is coupled at a first end to the third rod (14) via a rotary coupling (31) and is coupled to the lever (21) via a rotary coupling (32). The lever (21) is further coupled to the chassis (50) via a second coupling (40) and is coupled to a plunger (71) via a third coupling (60).
    Type: Grant
    Filed: July 13, 1999
    Date of Patent: August 21, 2001
    Assignee: U.S. Philips Corporation
    Inventor: Chuan R. Ho
  • Patent number: 6247230
    Abstract: An improved impact tool head having separate and distinct pressing and cutting blades integrally molded therein. The impact tool head allows for independent and optimal material and dimensional design of the pressing blades and the cutting blades to minimize impact damage to a terminal block and to ensure longer useful tool life. Also, through the use of multiple components, the impact tool head is readily adaptable to a wide variety of different terminal block configurations. Furthermore, sets of pressing blades and sets of cutting blades may be formed with each set comprising a continuous piece of material in order to simplify manufacturing and to ensure uniformity of production. Additionally, the integral molded structure is designed to allow post-molding sharpening of the cutting blades in order to ensure blade uniformity to further improve blade durability.
    Type: Grant
    Filed: April 19, 1999
    Date of Patent: June 19, 2001
    Inventors: William E. Hart, James B. Hart, Jackson Robert
  • Patent number: RE40283
    Abstract: An apparatus is provided with a component feeding member for feeding electronic components having lead wires in a tape-bonded state, an insertion head for separating the electronic components fed from the feeding member from the tapes and inserting to holes of a board, and a fixing head facing the insertion head via the board for cutting and folding the lead wires of the inserted electronic component in the board thereby fixing the electronic component to the board. AC servo motors operating independently of each other are individually set in the insertion head and the fixing head, which are controlled by a device so as to be synchronous with each other.
    Type: Grant
    Filed: April 18, 2005
    Date of Patent: May 6, 2008
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Yuzuru Inaba, Kiyoshi Imai, Hideaki Watanabe, Hiromi Kinoshita