Including Measuring Or Testing Of Device Or Component Part Patents (Class 29/593)
  • Patent number: 11152243
    Abstract: A device for aligning and optically inspecting a semiconductor component arranged on a receiving tool that is arranged on a turning mechanism. The device aligns the semiconductor component in relation to a center of the receiving tool in at least one axis direction and/or a direction of rotation. The turning mechanism is designed to rotate about a turning axis and to move the semiconductor component out of a receiving position into an offset position, with two slides that can be moved towards and away from each other and comprise slide sections, the two slide sections coming to rest on two lateral surfaces of the semiconductor component, at least in sections, in order to align the semiconductor component arranged on the receiving tool, the slide being defined such that it slides and/or rotates the semiconductor component into an inspection position, while the receiving tool holds the semiconductor component.
    Type: Grant
    Filed: August 31, 2018
    Date of Patent: October 19, 2021
    Assignee: MUEHLBAUER GMBH & CO. KG
    Inventors: Franz Uwe Augst, Benjamin Holzner
  • Patent number: 11117365
    Abstract: A printing device includes a controller configured or programmed to acquire, based on a width of a coating material that has been measured, at least one of a start position, an end position, or an amount of movement of a coating material scooping unit in coating material scooping operation.
    Type: Grant
    Filed: June 5, 2018
    Date of Patent: September 14, 2021
    Assignee: YAMAHA HATSUDOKI KABUSHIKI KAISHA
    Inventors: Takeshi Fujimoto, Katsumi Totani, Takeshi Miwa, Kazuyuki Sugahara
  • Patent number: 11069640
    Abstract: A package for power electronics includes a power substrate, a number of power semiconductor die, and a Kelvin connection contact. Each one of the power semiconductor die are on the power substrate and include a first power switching pad, a second power switching pad, a control pad, a semiconductor structure, and a Kelvin connection pad. The semiconductor structure is between the first power switching pad, the second power switching pad, and the control pad, and is configured such that a resistance of a power switching path between the first power switching pad and the second power switching pad is based on a control signal provided at the control pad. The Kelvin connection pad is coupled to the power switching path. The Kelvin connection contact is coupled to the Kelvin connection pad of each one of the power semiconductor die via a Kelvin conductive trace on the power substrate.
    Type: Grant
    Filed: June 14, 2019
    Date of Patent: July 20, 2021
    Assignee: Cree Fayetteville, Inc.
    Inventors: Brice McPherson, Daniel Martin, Jennifer Stabach
  • Patent number: 10948441
    Abstract: A system for carrying out electrochemical nuclear magnetic resonance spectroscopy (EC-NMR) is disclosed, along with methods of manufacturing the EC-NMR system, and methods of using the EC-NMR system to monitor electrochemical reactions. The system comprises interdigitated electrodes arranged in a cylindrically symmetric manner. The system allows for nuclear magnetic resonance spectroscopy to be carried out on a sample during electrolysis with minimal effect to its sensitivity.
    Type: Grant
    Filed: September 30, 2016
    Date of Patent: March 16, 2021
    Assignee: Georgetown University
    Inventors: YuYe J. Tong, Eric G. Sorte
  • Patent number: 10937747
    Abstract: A power inverter module includes a base module having a plurality of electrically conductive layers, including a first conductive layer, a second conductive layer and a third conductive layer. A first terminal is operatively connected to the first conductive layer at a first end and a second terminal is operatively connected to the second conductive layer at the first end. An isolation sheet is sandwiched between the first and second terminals. The first terminal and the second terminal include a respective proximal portion composed of a first material and a respective distal portion composed of a second material. At least one of the first terminal and the second terminal is bent to create an overlap zone such that a gap between the first terminal and the second terminal in the overlap zone is less than a threshold distance. The power inverter module is configured to reduce parasitic inductance.
    Type: Grant
    Filed: July 19, 2019
    Date of Patent: March 2, 2021
    Assignee: GM Global Technology Operations LLC
    Inventors: Marko Jaksic, Ajay V. Patwardhan, Constantin Stancu, John Czubay
  • Patent number: 10923995
    Abstract: A core laminator of an adhesive laminate core manufacturing apparatus includes a heating unit heating an adhesive interposed between laminar members to integrate the laminar members to form a laminate core, a pinch unit rotatably provided at a lower side of the heating unit which applies a lateral pressure to the laminate core, a squeeze unit including a cylinder rotatably provided at an upper side of the heating unit and a squeezer fixed in the cylinder to align the laminar members in a straight line, a guide provided in the heating unit for guiding a movement of the laminar members, and a driving unit for selectively rotating the pinch unit and the squeeze unit.
    Type: Grant
    Filed: June 16, 2016
    Date of Patent: February 16, 2021
    Assignee: POSCO DAEWOO CORPORATION
    Inventors: Il Gwen Chung, Duk Kyoun Woo, Chan Jung Kim, Chang Don Park
  • Patent number: 10910784
    Abstract: A plug assembly in which the insulator part can be moved from an unfolded state to a folded state. The insulator may be utilised in the unfolded state for assembly of a wiring loom, and then folded into the folded state for insertion into a connector body.
    Type: Grant
    Filed: October 8, 2018
    Date of Patent: February 2, 2021
    Assignee: BAE Systems plc
    Inventor: Gregory Warren Thompson
  • Patent number: 10873267
    Abstract: A three-phase switching unit including three identical switching cells, each including a first switch and a second switch electrically in series, including a substrate having: a first level receiving, on conductive areas, back sides of integrated circuits forming said switches; and at least one second level comprising conductive areas of interconnection of vias between the first and second levels, the conductive areas of the different levels respecting a symmetry of revolution of order 3.
    Type: Grant
    Filed: December 27, 2017
    Date of Patent: December 22, 2020
    Assignee: Commissariat à l'Énergie Atomique et aux Énergies Alternatives
    Inventor: Guillaume Lefevre
  • Patent number: 10772720
    Abstract: High resolution active matrix nanowire circuits enable a flexible platform for artificial electronic skin having pressure sensing capability. Comb-like interdigitated nanostructures extending vertically from a pair of opposing, flexible assemblies facilitate pressure sensing via changes in resistance caused by varying the extent of contact among the interdigitated nanostructures. Electrically isolated arrays of vertically extending, electrically conductive nanowires or nanofins are formed from a doped, electrically conductive layer, each of the arrays being electrically connected to a transistor in an array of transistors. The nanowires or nanofins are interdigitated with further electrically conductive nanowires or nanofins mounted to a flexible handle.
    Type: Grant
    Filed: May 12, 2018
    Date of Patent: September 15, 2020
    Assignee: International Business Machines Corporation
    Inventors: Bahman Hekmatshoartabari, Ghavam G. Shahidi, Davood Shahrjerdi
  • Patent number: 10672552
    Abstract: Disclosed is an adhesive laminate core manufacturing apparatus for successively forming lamina members of a predetermined shape while allowing a strip-shaped material, of which the surface is coated with an adhesive layer, to pass therethrough, and successively manufacturing laminate cores comprising the lamina members integrated, per predetermined sheet, by interlaminar bonding. The adhesive laminate core manufacturing apparatus according to one aspect of the present invention comprises: a protrusion forming unit pressing the material for the delamination of the laminate cores, so as to form interlaminar division protrusions on the surface of the material at each predetermined position along the longitudinal direction of the material; a blanking unit blanking the material so as to successively form the lamina members; and a lamination unit integrating the lamina members so as to successively manufacture the laminate cores.
    Type: Grant
    Filed: August 11, 2016
    Date of Patent: June 2, 2020
    Assignee: POSCO DAEWOO CORPORATION
    Inventors: Il Gwen Chung, Sae Jong Lim, Jang Hwan Seal, Seung Chul Lee, Chang Don Park, Jung Gyu Chi, Jae Young Lee
  • Patent number: 10616997
    Abstract: A circuit board structure, a binding test method and a display device are provided. The circuit board structure includes a first circuit board including a first binding region, a second circuit board including a second binding region matching with the first binding region, and a test circuit configured to test an alignment state of the first circuit board and the second circuit board. The test circuit includes multiple first electrodes and multiple second electrodes insulated from each other and arranged on the first circuit board, and multiple third electrodes arranged on the second circuit board. A group including one of the first electrodes and one of the second electrodes matches with one of the third electrodes, so that a current flows through the test circuit in case that the test circuit is supplied with power.
    Type: Grant
    Filed: March 3, 2017
    Date of Patent: April 7, 2020
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., HEFEI BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Kun Li, Tao Ma, Fengzhen Lv
  • Patent number: 10600434
    Abstract: In one embodiment, a system is provided for detecting a damaged magnetoresistive sensor. The system includes a processor, and logic or software stored in hardware that is executable by the processor. The logic or software is configured to, when executed by the processor, determine a scaled resistance of a plurality of sensors. The scaled resistances are measured against at least a first bias current, Imr, or against a square of the at least a first bias current Imr, I2mr. The system also includes logic or software stored in hardware that is configured to, when executed by the processor, output a representation of the measurements.
    Type: Grant
    Filed: January 6, 2016
    Date of Patent: March 24, 2020
    Assignee: International Business Machines Corporation
    Inventor: Icko E. Tim Iben
  • Patent number: 10505589
    Abstract: A signal bridge device is provided with a plurality of bridge signal transmission/reception units, a plurality of bridge signal transmission/reception terminals, and a bridge signal distribution unit. Non-contact reception signals received by the bridge signal transmission/reception units are input into the bridge signal distribution unit. Contact reception signals received by the bridge signal transmission/reception terminals are input into the bridge signal distribution unit. The bridge signal distribution unit can output the non-contact reception signals to the bridge signal transmission/reception terminals and can output the contact reception signals to the bridge signal transmission/reception units.
    Type: Grant
    Filed: February 19, 2015
    Date of Patent: December 10, 2019
    Assignee: PEZY COMPUTING K.K.
    Inventor: Motoaki Saito
  • Patent number: 10474044
    Abstract: A stage device is equipped with a surface plate and a wafer stage which is mounted on the surface plate and has an exhausting port formed on a surface facing the surface plate. In a state where the wafer stage lands on the surface plate, an air chamber is formed in between the surface plate and the wafer stage. Pressurized gas blows out from the exhausting port provided at a stage main section into the air chamber, and self-weight of the wafer stage is cancelled by an inner pressure of the air chamber. This allows to the wafer stage which has stopped on the surface plate to be moved manually.
    Type: Grant
    Filed: November 6, 2018
    Date of Patent: November 12, 2019
    Assignee: NIKON CORPORATION
    Inventor: Yuichi Shibazaki
  • Patent number: 10431367
    Abstract: A method for gapping a magnetic component is disclosed. The method includes: forming a feature on a substrate, the feature being a depression defining an inside surface; disposing a first conductive pattern on the substrate and the inside surface of the feature; disposing a permeability material on the inside surface of the feature and the first conductive pattern; disposing a substrate material on the substrate and the feature; disposing a second conductive pattern on the substrate material to wrap the permeability material between the first conductive pattern and the second conductive pattern to define at least one electrical circuit to facilitate a magnetic field in the permeability material; and gapping the permeability material to remove at least a portion of the permeability material to produce a gap in the at least a portion of the permeability material.
    Type: Grant
    Filed: May 30, 2016
    Date of Patent: October 1, 2019
    Assignee: Radial Electronics, Inc.
    Inventor: James E. Quilici
  • Patent number: 10416286
    Abstract: The present invention is a signal processing method to significantly improve the detection and identification of source emissions. More particularly, the present invention offers a processing method to reduce the false alarm rate of systems which remotely detect and identify the presence of electronic devices through an analysis of a received spectrum the devices' unintended emissions. The invention identifies candidate emission elements and determines their validity based on a frequency and phase association with other emissions present in the received spectrum. The invention compares the measured phase and frequency data of the emissions with a software solution of the theoretically or empirically derived closed-form expression which governs the phase and frequency distribution of the emissions within the source. Verification of this relationship serves to dramatically increase the confidence of the detection.
    Type: Grant
    Filed: August 15, 2013
    Date of Patent: September 17, 2019
    Assignee: NOKOMIS, INC
    Inventors: Stephen Dorn Freeman, Walter John Keller, III
  • Patent number: 10339846
    Abstract: The present disclosure provides a device and method for circuit testing and a display device applying the same. The device for circuit testing includes a detection circuit configured to detect whether a display panel and a printed circuit board are electrically conductive, wherein the detection circuit includes: a first metal redundant track configured to input an electrical detection signal; a second metal redundant track bonded to the first metal redundant track via a first anisotropic conductive film; a third metal redundant track electrically connected to the second metal redundant track; and a fourth metal redundant track bonded to the third metal redundant track via a second anisotropic conductive film.
    Type: Grant
    Filed: September 29, 2017
    Date of Patent: July 2, 2019
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., FUZHOU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Dongxi Li, Weiqiang Li, Yabin Lin, Jianfeng Yuan
  • Patent number: 10319516
    Abstract: A magnetic path is formed of a center core disposed inside a first coil and second coil, a first side core and second side core disposed outside the first coil and second coil and coming into contact with the center core, and a magnet disposed between the first side core and second side core, wherein a shape of a space formed by a portion of contact between the first side core and second side core is a shape that forms an insertion portion of the magnet disposed obliquely with respect to the magnetic path, and voids perpendicular with respect to the magnetic path at either end portion of the magnet.
    Type: Grant
    Filed: May 13, 2015
    Date of Patent: June 11, 2019
    Assignee: Mitsubishi Electric Corporation
    Inventors: Yuma Sumitomo, Mitsuhara Hashiba, Nobuyuki Sawazaki
  • Patent number: 10264332
    Abstract: The disclosed apparatus may include (1) a panel coupled to a network device that includes multiple network ports that each facilitate one or more network links, the panel including (A) an array of port-status indicators that each represent a status of one of the network ports on the network device and (B) an array of link-status indicators that are each dynamically assigned to represent a status of one of the network links and (2) a physical processing device communicatively coupled to the arrays of port-status indicators and link-status indicators, wherein the physical processing device (A) identifies a link-status indicator that has been dynamically assigned to a specific network link, (B) identifies a port-status indicator that corresponds to a specific network port that facilitates the specific network link, and (C) directs the port-status indicator and the link-status indicator to visually indicate whether the specific network link is functional or non-functional.
    Type: Grant
    Filed: July 1, 2017
    Date of Patent: April 16, 2019
    Assignee: Juniper Networks, Inc
    Inventors: Rajeshwar Sheshrao Sable, Chandrashekhar Kalyanaraman, Radhakrishna Kodial, Murugan Balabaskaran
  • Patent number: 10260996
    Abstract: A board production monitoring device for monitoring a production state of a board production device, including: a database section which consecutively obtains and stores production state data from the board production device; a transition graph display section which displays a transition graph showing a time-series change at least at a part of the production state data; a condition change input section which inputs condition change data which shows a change point of a production condition of the board production device and includes generation time information of the change point; and a condition change display section which displays at least the generation time information of the change point of the condition change data, at a time-series corresponding position in the transition graph, is provided.
    Type: Grant
    Filed: February 3, 2014
    Date of Patent: April 16, 2019
    Assignee: FUJI CORPORATION
    Inventor: Yukitoshi Morita
  • Patent number: 10243368
    Abstract: The disclosed Unifying Electrical Interface presents a versatile connectivity platform having the merging capabilities permitting more than a singular voltage, level or type to be made available from an electrical outlet. When wired fully, the choice of AC and/or DC made available to the consumer is broadened. Direct Current (DC) provided via the UEI would originate from a locally based DC source access point obviating the need to use wall chargers or power supplies that wastefully consume energy even when in standby mode. By this approach, the UEI based system extends an avenue for renewable energy technology to be made readily available in a building; while offering a synergistic advantage for the end user, the energy provider and the environment by reducing energy waste. That power conservation and accessibility will result in greater choice and savings for the consumer and will reduce the need for excess production from electric providers.
    Type: Grant
    Filed: February 19, 2017
    Date of Patent: March 26, 2019
    Inventors: Ambroise Prinstil, Kenneth Louis Martz, Timothy Andrew Gallagher
  • Patent number: 10171066
    Abstract: RF generators including active devices driving series resonant circuits are described. The series resonant circuits include a self-resonant dual inductor. The RF generators can be used to drive capacitive loads.
    Type: Grant
    Filed: September 12, 2016
    Date of Patent: January 1, 2019
    Assignee: SMITHS DETECTION-WATFORD LIMITED
    Inventor: Alex Paul Hiley
  • Patent number: 10110045
    Abstract: A method for producing an electrical oscillating circuit for an inductive charging device, having at least one oscillating circuit component. In a method step, the at least one oscillating circuit component is classified as a function of a structurally caused deviation of a characteristic value of the oscillating circuit component from a nominal value.
    Type: Grant
    Filed: June 21, 2016
    Date of Patent: October 23, 2018
    Assignee: ROBERT BOSCH GMBH
    Inventors: Martin Gonda, Guenter Lohr, Dragan Krupezevic
  • Patent number: 10094727
    Abstract: Provided is a knocking sensor with a support member, a piezoelectric element, a pair of electrode parts, a resistor and a case. The resistor has a resistor body formed with a metal film and connected in parallel to the pair of electrode parts. The resistor also has an outer coating film applied to cover the metal film. The outer coating film is formed of a resin material having a higher thermal deformation temperature than that of a resin material of the case.
    Type: Grant
    Filed: May 21, 2014
    Date of Patent: October 9, 2018
    Assignee: NGK SPARK PLUG CO., LTD.
    Inventor: Katsuki Aoi
  • Patent number: 10088501
    Abstract: There is described an assembly for connecting a test unit to a wiring harness or equipment to be tested, and a method for testing using the assembly. The assembly may comprise a test box unit, a generic mate-in interface, and at least one specific mate-in interface. Each one of the generic and specific mate-in interfaces has an ID comprised in an ID support on the electrical path of the generic mate-in interface and the specific mate-in interface, for example, on any one of the end connectors of the interfaces or on their wiring. Information relating to the IDs of the mate-in interfaces and the contact configuration of each mate-in interface is stored in a database of the test unit for identifying the appropriate test contacts that should be used for testing.
    Type: Grant
    Filed: February 3, 2017
    Date of Patent: October 2, 2018
    Inventor: Alain Lussier
  • Patent number: 10056182
    Abstract: Embodiments of the present disclosure are directed towards an inductor structure having one or more strips of conductive material disposed around a core. The strips may have contacts at a first end and a second end of the strips, and may be disposed around the core with a gap between the contacts. The inductor structure may be mounted on a surface of a substrate, and one or more traces may be formed in the surface of the substrate to electrically couple two or more of the strips of conductive material to one another to form inductive coils. Other embodiments may be described and/or claimed.
    Type: Grant
    Filed: February 6, 2015
    Date of Patent: August 21, 2018
    Assignee: Intel Corporation
    Inventors: Gregorio R. Murtagian, Robert L. Sankman, Brent S. Stone, Kaladhar Radhakrishnan, Joshua D. Heppner
  • Patent number: 10051744
    Abstract: An insertion head includes: a horizontal shaft member; one pair of gripping claws, extending on a surface orthogonal to the horizontal shaft member; one pair of gripping claw holding members movable on the horizontal shaft member which hold the one pair of gripping claws; a swing mechanism which rotates and drives the shaft member, and swings the one pair of gripping claw holding members around a center axis of the shaft member; and an interval changing mechanism which moves the one pair of gripping claw holding members on the shaft member and changes an interval between the one pair of gripping claws. The gripping claw extends to be bent on the surface, and each straight line portion of each tip end is offset to a perpendicular axis extending on the surface through a center axis of the shaft member in a posture of being oriented downward.
    Type: Grant
    Filed: July 15, 2015
    Date of Patent: August 14, 2018
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventor: Hideaki Watanabe
  • Patent number: 10051745
    Abstract: An insertion head includes: a horizontal shaft member; one pair of gripping claws, each gripping claw extending on a surface which is orthogonal to the horizontal shaft member; one pair of gripping claw holding members which are provided to be movable on the horizontal shaft member, and hold the one pair of gripping claws; a swing mechanism which rotates and drives the horizontal shaft member, and swings the one pair of gripping claw holding members around a center axis of the horizontal shaft member; and an interval changing mechanism which moves the one pair of gripping claw holding members on the horizontal shaft member and changes an interval between the one pair of gripping claws. A leaded component is gripped with the one pair of gripping claws, and a lead of the leaded component is inserted into an insertion hole on a printed circuit board.
    Type: Grant
    Filed: July 15, 2015
    Date of Patent: August 14, 2018
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventor: Hideaki Watanabe
  • Patent number: 10043741
    Abstract: A method of manufacturing electronic chips containing low-dispersion components, including the steps of: mapping the average dispersion of said components according to their position in test semiconductor wafers; associating, with each component of each chip, auxiliary correction elements; activating by masking the connection of the correction elements to each component according to the initial mapping.
    Type: Grant
    Filed: December 15, 2016
    Date of Patent: August 7, 2018
    Assignee: STMICROELECTRONICS (ROUSSET) SAS
    Inventors: François Tailliet, Guilhem Bouton
  • Patent number: 10020114
    Abstract: A high frequency inductor chip includes a core and a coil. The core is in the form of a single piece of a non-magnetic material. The coil is deposited on and surrounds the core and has structural characteristics indicative of the coil being formed on the core by deposition techniques. A method for making the high frequency inductor chip is also disclosed.
    Type: Grant
    Filed: May 12, 2016
    Date of Patent: July 10, 2018
    Assignee: WAFER MEMS CO., LTD.
    Inventors: Min-Ho Hsiao, Pang-Yen Lee, Yen-Hao Tseng
  • Patent number: 9998032
    Abstract: In one form, a method of manufacturing a circuit device comprises providing a lead frame comprising a plurality of leads, each comprising an island portion, a bonding portion elevated from the island portion, a slope portion extending obliquely so as to connect the island portion and the bonding portion, and a lead portion extending from the bonding portion. First and second transistors and first and second diodes are mounted upper surfaces of island portions of respective first and second leads, and are connected to the respective leads through wirings that connect the transistors and diodes to the bonding portions of the respective leads. Lower surfaces of the island portions are attached to an upper surface of a circuit board, and the circuit board, the transistors, the diodes, and the lead frame are encapsulated by a resin, so that the lead portions are not covered by the resin.
    Type: Grant
    Filed: September 12, 2017
    Date of Patent: June 12, 2018
    Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: Shigeaki Mashimo, Fumio Horiuchi, Kiyoaki Kudo, Akira Sakurai, Yuhki Inagaki
  • Patent number: 9964583
    Abstract: A monitoring apparatus, and method of use, that is capable of determining the joint characteristics by means of waveforms shifts at zero-crossing angular distortions through predictive failure algorithm specific to circuit under test.
    Type: Grant
    Filed: October 19, 2016
    Date of Patent: May 8, 2018
    Assignee: SmartKable LLC
    Inventors: Douglas S. Hirsh, Michael M. Muehlemann
  • Patent number: 9891082
    Abstract: A field device includes a housing and a process variable transducer configured to measure or control a process variable in an industrial process. Field device circuitry in the housing is coupled to the process variable transducer. A meter body mount is carried in housing. A meter is affixed to the meter body mount by an attachment mechanism. The meter includes a display element. A cover seals the meter in the housing.
    Type: Grant
    Filed: September 30, 2014
    Date of Patent: February 13, 2018
    Assignee: Rosemount Inc.
    Inventor: George Charles Hausler
  • Patent number: 9880252
    Abstract: A method of calibrating and debugging a testing system is provided. First, values of different electrical path segments are calibrated, and parameters of the electrical path segments while being calibrated are saved. After calibration, electrical tests can be processed on a DUT. If the testing system malfunctions, the values of the electrical path segments are calibrated again to compare the current parameters to the previously saved parameters. The component which goes wrong can be found out quickly in this way.
    Type: Grant
    Filed: January 9, 2017
    Date of Patent: January 30, 2018
    Assignee: MPI CORPORATION
    Inventors: Wei-Cheng Ku, Shao-Wei Lu, Hao Wei, Yu-Tse Wang
  • Patent number: 9793826
    Abstract: In one form, a method of manufacturing a circuit device comprises providing a lead frame comprising a plurality of leads, each comprising an island portion, a bonding portion elevated from the island portion, a slope portion extending obliquely so as to connect the island portion and the bonding portion, and a lead portion extending from the bonding portion. The circuit elements are mounted on upper surfaces of the island portions, and are connected to corresponding bonding portions by wirings. Two leads are adapted to be connected to positive and negative sides of a power source, and another lead is an output lead for providing alternating-current power. Lower surfaces of the island portions are attached to an upper surface of a circuit board. The circuit board, the circuit elements, and the lead frame are encapsulated by a resin, so that the lead portions are not covered by the resin.
    Type: Grant
    Filed: January 22, 2016
    Date of Patent: October 17, 2017
    Assignee: Semiconductor Components Industries, LLC
    Inventors: Shigeaki Mashimo, Fumio Horiuchi, Kiyoaki Kudo, Akira Sakurai, Yuhki Inagaki
  • Patent number: 9767402
    Abstract: Systems and methods are provided for better reading large populations of RFID tags. Such systems include an RFID reader and a plurality of RFID tags, each having an antenna and an associated RFID chip. Each chip includes an auto-tune circuit and is programmed to confirm the occurrence of a preselected condition. Upon such confirmation, the RFID chip modifies the functionality of the auto-tune circuit to reduce the effects of proximity coupling within the population. The preselected condition may be the tag being read by the RFID reader or the elapse of a preselected amount of time since a power-on-reset of the chip or some other event. The modification to the functionality of the auto-tune circuit may be the disabling of the auto-tune circuit or the changing of the impedance value of the chip or a decrease in the power supplied to the chip or some other modification.
    Type: Grant
    Filed: December 22, 2014
    Date of Patent: September 19, 2017
    Assignee: AVERY DENNISON RETAIL INFORMATION SERVICES, LLC
    Inventor: Ian James Forster
  • Patent number: 9689825
    Abstract: A system for testing a first layer disposed over a capacitive sensing device includes a test probe having a substantially flat conductive test surface, a device under test (DUT) disposed over the capacitive sensing device, and a power supply operatively connected to the test probe. The DUT can include the first layer and one or more additional layers. The substantially flat conductive test surface is positioned over a surface of the DUT and applies power to the DUT. The capacitance between the test probe and at least one capacitive sensing element in the capacitive sensing device is then measured.
    Type: Grant
    Filed: September 9, 2014
    Date of Patent: June 27, 2017
    Assignee: Apple Inc.
    Inventors: Richard W. Lim, Benjamin B. Lyon, Srdjan D. Sobajic, Giovanni Gozzini, Peter G. Panagas
  • Patent number: 9658280
    Abstract: A method for qualifying circuit board fabrication, assembly, and repair processes includes establishing primary assembly process specifications and secondary repair process specifications. A group of test circuit boards is assembled using the primary assembly process, with each board having a section of components linked together to provide functional circuits and a section of components daisy-chained together to provide non-functional circuits, and with each section also including SIR test patterns and CAF test patterns. A subset of the assembled test boards is then repaired using the secondary repair process. A sample of each set of the test boards is exposed to test conditions including thermal cycle test conditions, humidity test conditions, and vibration test conditions. Inner layer build quality, surface cleanliness, circuit performance, and solder joint quality are then evaluated using the provided circuitry.
    Type: Grant
    Filed: February 11, 2015
    Date of Patent: May 23, 2017
    Assignee: Foresite, Inc.
    Inventors: Terry L. Munson, Steve Middleton
  • Patent number: 9642294
    Abstract: A tape feeder, including a tape feeder body and a feeder wagon/linear guide, is used to direct component tape in a linear movement towards a component pick position. The feeder wagon comprises a feeder wagon body slidably mounted to the tape feeder body for movement between a first, pickup position and a second, delivery position. The feeder wagon further comprises a feeder head mounted to the feeder wagon body for movement (1) with the feeder wagon body as it moves along the first path, and (2) along a second path transverse to the first path between a first, tape-engaged position and a second, tape-released position. The feeder head comprises a tape-engaging element engageable with component tape.
    Type: Grant
    Filed: April 4, 2012
    Date of Patent: May 2, 2017
    Assignee: Micronic My Data AB
    Inventors: Kristofer Karlsson, Andreas Larsson
  • Patent number: 9559004
    Abstract: A semiconductor device comprises a carrier including an adhesive disposed over the carrier. The semiconductor device further comprises a semiconductor wafer including a plurality of semiconductor die separated by a non-active region. A plurality of bumps is formed over the semiconductor die. The semiconductor wafer is mounted to the carrier with the adhesive disposed around the plurality of bumps. Irradiated energy is applied to the non-active region to form a modified region within the non-active region. The semiconductor wafer is singulated along the modified region to separate the semiconductor die. The semiconductor wafer is singulated along the modified region by applying stress to the semiconductor wafer. The adhesive is removed from around the plurality of bumps after singulating the semiconductor wafer. The semiconductor wafer includes a plurality of semiconductor die comprising through silicon vias. The modified region optionally includes a plurality of vertically stacked modified regions.
    Type: Grant
    Filed: May 11, 2012
    Date of Patent: January 31, 2017
    Assignee: STATS ChipPAC Pte. Ltd.
    Inventors: Byung Joon Han, Il Kwon Shim, Won Kyoung Choi
  • Patent number: 9521781
    Abstract: A power component device includes a heat sink having a recess with a base surface and a first side surface. The first side surface of the recess is at a generally acute angle relative to the base surface. The power component device includes a first passive electrical component with a support element, having a first side surface which faces the first side surface of the recess, and is at generally the same angle relative to the base surface as the first side surface of the recess is relative to the base surface. A pressure transmission element has a first side surface which is averted from the first side surface of the support element. The base surface is at a generally acute angle relative to the first pressure transmission element side surface. A pressure generating apparatus presses the support element against the first side surface of the recess.
    Type: Grant
    Filed: December 12, 2013
    Date of Patent: December 13, 2016
    Assignee: Semikron Elektronik GmbH & Co., KG
    Inventors: Thomas Frank, Bernhard Kalkmann, Liane Müller-Schmidt, Sven Teuber
  • Patent number: 9508617
    Abstract: A test board includes a first chip mounting area, a first input area, a second input area, a first output area, and a second output area. The test board also includes a first conductive pattern, a second conductive pattern, a third conductive pattern, and a fourth conductive pattern. The first conductive pattern electrically connects a first pin of the first input area and a first pin of the first chip mounting area. The second conductive pattern electrically connects a first pin of the second input area and a second pin of the first chip mounting area. The third conductive pattern electrically connects a first pin of the first output area and a third pin of the first chip mounting area. The fourth conductive pattern electrically connects a first pin of the second output area and a fourth pin of the first chip mounting area.
    Type: Grant
    Filed: March 2, 2012
    Date of Patent: November 29, 2016
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Shiang-Ruei Su, Liang-Chen Lin, Chia-Wei Tu
  • Patent number: 9485895
    Abstract: A central control device used in a manufacture work machine for performing a manufacture work to control, in a centralized manner, work-element performing apparatuses each configured to perform one of work elements that constitute the manufacture work, by sequentially transmitting motion commands each of which is a command for one motion to be performed by one of the work-element performing apparatuses, the central control device including: a source-data storage section configured to store source data in which is encoded a matter of each of the work elements to be performed by each of the work-element performing apparatuses to perform manufacture work; a motion-command generating section configured to generate motion commands on the basis of the source data; and a command-transmission processing section configured to preform transmission processing to transmit the motion commands generated by the motion-command generating section to the work-element performing apparatuses.
    Type: Grant
    Filed: March 29, 2011
    Date of Patent: November 1, 2016
    Assignee: FUJI MACHINE MFG. CO., LTD.
    Inventors: Seigo Kodama, Noriaki Iwaki, Kazuya Furukawa, Toru Takahama
  • Patent number: 9463556
    Abstract: A crimp tool includes a frame, a lead screw and a nut assembly connected to the lead screw. A spring member is connected to the frame and movable with rotation of the lead screw. A first transducer is connected to the nut assembly to measure a first force applied on the nut assembly. A second transducer is connected to the spring member to measure a second force applied thereon by the spring member.
    Type: Grant
    Filed: March 13, 2013
    Date of Patent: October 11, 2016
    Assignee: Hubbell Incorporated
    Inventors: John David Lefavour, Alan Douglas Beck, Robert Michael Poirier, Peter Matthew Wason, Lawrence N. Brown
  • Patent number: 9345129
    Abstract: A mounting structure in which a plurality of substrates are electrically connected to each other includes a first substrate having a first alignment mark formed by partially cutting away a first terminal, and a second substrate having a second alignment mark formed by partially cutting away a second terminal. The first terminal and the second terminal are electrically connected to each other by being relatively positioned with respect to each other.
    Type: Grant
    Filed: July 9, 2014
    Date of Patent: May 17, 2016
    Assignee: SEIKO EPSON CORPORATION
    Inventor: Hidetaka Saito
  • Patent number: 9261562
    Abstract: A portable test device (1) can be configured as a rotor conductivity anomaly tester, a magnetic core anomaly tester, or a rotational eccentricity fault tester for a multiphasic motive force electrical machine (6) by providing an immotive multiphasic motive force electrical machine test signal from a plurality of multiphasic motive force electrical machine signal generators (4) through a detachable electrical power connectivity (2) and by having a multiphasic motive force electrical machine fault analyzer (16) that can sense responses and discern the existence of a fault. Control of the test signal can be accomplished by an immotive multiphasic test signal controller (3) that varies frequency and achieves incremental movement or to achieve stator magnetization plane angle changes or movement that tests angular relationships.
    Type: Grant
    Filed: October 4, 2008
    Date of Patent: February 16, 2016
    Assignee: SKF USA, Inc.
    Inventors: Sang Bin Lee, Ernesto Wiedenbrug
  • Patent number: 9235073
    Abstract: A display device includes a display device main body including a display panel provided on a circumferential portion thereof with an electrode unit and a dummy electrode unit, a chassis housing the display device main body, a source driver FPC configured to be electrically connected to the electrode unit and supply an electric signal to the display panel, and a flexible fixing board connected to the dummy electrode unit and fixed to the chassis.
    Type: Grant
    Filed: February 5, 2013
    Date of Patent: January 12, 2016
    Assignee: Sharp Kabushiki Kaisha
    Inventor: Mitsuru Hosoki
  • Patent number: 9189666
    Abstract: A reader for reading radio frequency identification (RFID) tags of a fiber router. The reader includes a main body and a scanner portion. The main body includes a circuit board and at least one indicating lamp electrically connected to the circuit board. The scanner portion is coupled to the main body and includes at least one scanning protrusion. Each scanning protrusion corresponds to one of the at least one indicating lamps, each scanning protrusion includes an antenna electrically connected to the circuit board, and each antenna corresponds to the indicating lamp. Each antenna receives information from a RFID tag and transmits the information to the circuit board, and the circuit board controls the corresponding indicating lamp to emit indicating colors according to the information received by each of the antennas.
    Type: Grant
    Filed: August 25, 2014
    Date of Patent: November 17, 2015
    Assignees: Fu Tai Hua Industry (Shenzhen) Co., Ltd., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Zong-Yuan Sun, Da-Hua Xiao
  • Patent number: 9159694
    Abstract: Die stacking systems and methods are disclosed. In an embodiment, a semiconductor device includes a passivation surface and a conductive die receiving surface located in an opening of the passivation surface. The conductive die receiving surface has a surface area that is larger than a footprint of a second die that is electrically coupled to the conductive die receiving surface.
    Type: Grant
    Filed: December 13, 2010
    Date of Patent: October 13, 2015
    Assignee: QUALCOMM Incorporated
    Inventors: Henry Sanchez, Laxminarayan Sharma
  • Patent number: 9153765
    Abstract: The invention relates to a piezoelectric multi-layer component with a plurality of piezoelectric layers (1) lying one above the other and with electrode layers (2a, 2b) arranged between the piezoelectric layers, wherein an absorption layer (4) of absorbing mechanical vibration energy is arranged in the layer stack.
    Type: Grant
    Filed: June 9, 2006
    Date of Patent: October 6, 2015
    Assignee: EPCOS AG
    Inventors: Heinz Florian, Michael Hirschler, Helmut Sommariva