Abstract: A manufacturing method of a laminated power storage device disclosed herein includes a step A of preparing an electrode body to which an electrode terminal is connected, a step B of preparing a laminated film, a step C of building a power storage device assembly in which the electrode body is covered with the laminated film and is sealed, and a step D of placing the power storage device assembly in a predetermined reduced-pressure atmosphere. The power storage device assembly has a welding portion in which the laminated films are stacked and welded together in a state in which part of the electrode terminal is protruded to the outside from between the laminated films around the electrode body. A pressure of the reduced-pressure atmosphere in the step D is set so as to guarantee that a weld strength of the welding portion is not less than a predetermined strength.

Abstract: A wire terminating apparatus and method which allows for determining the quality of a wire termination. The method includes terminating the wire, monitoring the thermal properties of the termination with one or more thermal sensors and comparing the monitored thermal properties to stored thermal properties to determine if the termination is defective. If the termination is defective, the termination is discarded. The apparatus includes a wire termination zone. A thermal sensor is mounted on the wire terminating apparatus proximate the wire termination zone. The thermal sensor monitors the thermal properties of the termination to determine if the termination is defective.

Abstract: A system for transferring a substrate includes a substrate transporter at which is captured a first image with which a position of the substrate at the substrate transporter is determined; a tray at which is captured a second image with which a position of each of a plurality of substrates relative to the tray is determined; a substrate mover with which the substrate is movable in a revolving manner between the substrate transporter and the tray, the substrate mover including: an arm portion movable in the revolving manner between the substrate transporter and the tray, and a substrate securing portion movable together with the arm portion; and an imager with which the first image and the second image are captured, the imager connected to the arm portion and movable in the revolving manner between the substrate transporter and the tray together with the arm portion.

Abstract: A battery defect screening device including a battery fixer for fixing a battery, a discharger, a charger, a voltmeter for measuring an initial voltage value, a first voltage value, and a second voltage value, and a defect screener for determining the battery to be normal when a first voltage change value, which is obtained by subtracting the first voltage value from the initial voltage value, is less than a first reference value, to have a hard short due to the foreign material when the first voltage change value is greater than the first reference value, to be normal when a second voltage change value, which is obtained by subtracting the second voltage value from the initial voltage value, is less than a second reference value, and to have a soft short due to the foreign material when the second voltage change value is greater than the second reference value.

Abstract: A special-figure design ribbon for connecting back contact cells includes a body, a plurality of first solder joints, and a plurality of second solder joints. The plurality of first solder joints and the plurality of second solder joints are respectively located on two sides of the body in a width direction. Each of the first solder joints stretches outward from a first side of the body. Each of the second solder joints stretches outward from a second side of the body. A shape of each first solder joint is different from a shape of each second solder joint. Center lines of at least one set of the first solder joint and the second solder joint adjacent to each other are staggered from each other in the width direction of the body.

Abstract: An assembly for interfacing an existing harness connector of an installed wiring harness to a test module. The assembly comprises: a harness-specific connector which is connectable to the existing harness connector, a test box connector module connected to the harness-specific connector, for connecting to a test module, and a unique identifier which is readable on the assembly and which is unique to the test box connector module; wherein the unique identifier is used to identify the test box connector module and to determine, from a list of unique mate-in interface IDs and associated connector configurations, which one of the associated connector configurations corresponds to the identifier of the assembly, and within the one of the associated connector configurations corresponding to the unique mate-in interface ID of the mate-in interface, to determine the correspondence between contacts of the test module to contacts of the existing harness connector.

Abstract: Provided is a fixed-state testing device including a pressing part that presses a battery, a load detection part that detects a pressing load with which the battery is pressed, and a determination part that determines whether the state of fixing of the battery to a retention hole is good or bad. The determination part determines the fixed state of the battery to be good when the battery is able to maintain the pressing load within a first test load range for a first pressing time and, moreover, to thereafter maintain the pressing load within a second test load range of which an upper limit load is smaller than a lower limit load of the first test load range for a second pressing time.

Abstract: A contact probe includes: a cylindrical pipe member; a collar including a hollow portion and fixed to an inner circumferential side of at least one end in a longitudinal direction of the pipe member; and an inner conductor including a flange configured to abut on a stepped portion formed by the pipe member and the collar, the inner conductor being expandable and contractible along the longitudinal direction and penetrating the pipe member.

Abstract: A printing device includes a coating material scooping unit configured to scoop a coating material on a mask, and a controller configured or programmed to determine whether or not the coating material scooping unit performs collecting operation to collect the coating material on the mask when the mask is replaced.

Abstract: In producing a mono-cell, the mono-cell is formed from separator, positive electrode, separator and negative electrode which are joined to each other. Negative electrode is joined, one by one, to one surface of strip of continuously conveyed separator. Positive electrode having different size from negative electrode is joined, one by one, to the other surface of separator. Strip of continuously conveyed second separator is joined to one of negative and positive electrodes. Position of negative electrode joined to separator is detected by negative electrode joining position detection cameras, and joining position of positive electrode is corrected by positive electrode alignment mechanism with this detected position of negative electrode being a reference during conveyance of positive electrode along positive electrode conveyance direction.

Abstract: An electronic component mounting machine includes an image-capturing device and a control device. The image-capturing device captures the images of sub-fiducial marks and main fiducial marks. When the control device can read the main fiducial marks from the images captured by the image-capturing device, the control device determines the mounting positions of the electronic components with respect to a substrate with reference to the main fiducial marks. On the other hand, when the main fiducial marks cannot be read from the images due to a print defect of the main fiducial marks, the control device determines the mounting positions of the electronic components with respect to the substrate with reference to the sub-fiducial marks which are the reference sources of the image-capturing positions of the main fiducial marks.

Abstract: An embodiment includes an apparatus comprising: a substrate including a surface that comprises first, second, and third apertures; and first, second, and third probes comprising proximal ends that are respectively included within and project from the first, second, and third apertures; wherein the first, second, and third probes: (a)(i) intersect a plane that is generally coplanar with the surface, (a)(ii) include distal ends configured to contact electrical contacts of a device under test (DUT), and (a)(iii) are generally linear and each include a major axis that is non-orthogonal to the plane. Other embodiments are described herein.

Abstract: Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices are described herein. In one embodiment, a set of stacked microelectronic devices includes (a) a first microelectronic die having a first side and a second side opposite the first side, (b) a first substrate attached to the first side of the first microelectronic die and electrically coupled to the first microelectronic die, (c) a second substrate attached to the second side of the first microelectronic die, (d) a plurality of electrical couplers attached to the second substrate, (e) a third substrate coupled to the electrical couplers, and (f) a second microelectronic die attached to the third substrate. The electrical couplers are positioned such that at least some of the electrical couplers are inboard the first microelectronic die.

Abstract: A pressure-sensitive sensor, includes a hollow tubular member including an elastic insulating material; and n electrode wires (n being an integer of not less than 3) arranged away from one another and held inside the tubular member, wherein when an external pressure is applied to the tubular member, the tubular member elastically deforms such that at least two of the n electrode wires contact with each other, and wherein the n electrode wires extend linearly and parallel to a central axis of the tubular member.

Abstract: An apparatus according to one embodiment includes a landing pad having a mating portion configured to mate with a mating feature of a removable element as the removable element approaches the landing pad in a first direction. The apparatus also includes a mount along which the landing pad is movable in a second direction. A lever is positionable between a disengaged position and an engaged position, the lever being coupled to the landing pad for translating the landing pad along the mount in the second direction during movement thereof from the disengaged position toward the engaged position. The first direction is different than the second direction.

Abstract: A device for aligning and optically inspecting a semiconductor component arranged on a receiving tool that is arranged on a turning mechanism. The device aligns the semiconductor component in relation to a center of the receiving tool in at least one axis direction and/or a direction of rotation. The turning mechanism is designed to rotate about a turning axis and to move the semiconductor component out of a receiving position into an offset position, with two slides that can be moved towards and away from each other and comprise slide sections, the two slide sections coming to rest on two lateral surfaces of the semiconductor component, at least in sections, in order to align the semiconductor component arranged on the receiving tool, the slide being defined such that it slides and/or rotates the semiconductor component into an inspection position, while the receiving tool holds the semiconductor component.

Abstract: A printing device includes a controller configured or programmed to acquire, based on a width of a coating material that has been measured, at least one of a start position, an end position, or an amount of movement of a coating material scooping unit in coating material scooping operation.

Abstract: A package for power electronics includes a power substrate, a number of power semiconductor die, and a Kelvin connection contact. Each one of the power semiconductor die are on the power substrate and include a first power switching pad, a second power switching pad, a control pad, a semiconductor structure, and a Kelvin connection pad. The semiconductor structure is between the first power switching pad, the second power switching pad, and the control pad, and is configured such that a resistance of a power switching path between the first power switching pad and the second power switching pad is based on a control signal provided at the control pad. The Kelvin connection pad is coupled to the power switching path. The Kelvin connection contact is coupled to the Kelvin connection pad of each one of the power semiconductor die via a Kelvin conductive trace on the power substrate.

Abstract: A system for carrying out electrochemical nuclear magnetic resonance spectroscopy (EC-NMR) is disclosed, along with methods of manufacturing the EC-NMR system, and methods of using the EC-NMR system to monitor electrochemical reactions. The system comprises interdigitated electrodes arranged in a cylindrically symmetric manner. The system allows for nuclear magnetic resonance spectroscopy to be carried out on a sample during electrolysis with minimal effect to its sensitivity.

Abstract: A power inverter module includes a base module having a plurality of electrically conductive layers, including a first conductive layer, a second conductive layer and a third conductive layer. A first terminal is operatively connected to the first conductive layer at a first end and a second terminal is operatively connected to the second conductive layer at the first end. An isolation sheet is sandwiched between the first and second terminals. The first terminal and the second terminal include a respective proximal portion composed of a first material and a respective distal portion composed of a second material. At least one of the first terminal and the second terminal is bent to create an overlap zone such that a gap between the first terminal and the second terminal in the overlap zone is less than a threshold distance. The power inverter module is configured to reduce parasitic inductance.

Abstract: A core laminator of an adhesive laminate core manufacturing apparatus includes a heating unit heating an adhesive interposed between laminar members to integrate the laminar members to form a laminate core, a pinch unit rotatably provided at a lower side of the heating unit which applies a lateral pressure to the laminate core, a squeeze unit including a cylinder rotatably provided at an upper side of the heating unit and a squeezer fixed in the cylinder to align the laminar members in a straight line, a guide provided in the heating unit for guiding a movement of the laminar members, and a driving unit for selectively rotating the pinch unit and the squeeze unit.

Abstract: A plug assembly in which the insulator part can be moved from an unfolded state to a folded state. The insulator may be utilised in the unfolded state for assembly of a wiring loom, and then folded into the folded state for insertion into a connector body.

Abstract: A three-phase switching unit including three identical switching cells, each including a first switch and a second switch electrically in series, including a substrate having: a first level receiving, on conductive areas, back sides of integrated circuits forming said switches; and at least one second level comprising conductive areas of interconnection of vias between the first and second levels, the conductive areas of the different levels respecting a symmetry of revolution of order 3.

Abstract: High resolution active matrix nanowire circuits enable a flexible platform for artificial electronic skin having pressure sensing capability. Comb-like interdigitated nanostructures extending vertically from a pair of opposing, flexible assemblies facilitate pressure sensing via changes in resistance caused by varying the extent of contact among the interdigitated nanostructures. Electrically isolated arrays of vertically extending, electrically conductive nanowires or nanofins are formed from a doped, electrically conductive layer, each of the arrays being electrically connected to a transistor in an array of transistors. The nanowires or nanofins are interdigitated with further electrically conductive nanowires or nanofins mounted to a flexible handle.

Abstract: Disclosed is an adhesive laminate core manufacturing apparatus for successively forming lamina members of a predetermined shape while allowing a strip-shaped material, of which the surface is coated with an adhesive layer, to pass therethrough, and successively manufacturing laminate cores comprising the lamina members integrated, per predetermined sheet, by interlaminar bonding. The adhesive laminate core manufacturing apparatus according to one aspect of the present invention comprises: a protrusion forming unit pressing the material for the delamination of the laminate cores, so as to form interlaminar division protrusions on the surface of the material at each predetermined position along the longitudinal direction of the material; a blanking unit blanking the material so as to successively form the lamina members; and a lamination unit integrating the lamina members so as to successively manufacture the laminate cores.

Abstract: A circuit board structure, a binding test method and a display device are provided. The circuit board structure includes a first circuit board including a first binding region, a second circuit board including a second binding region matching with the first binding region, and a test circuit configured to test an alignment state of the first circuit board and the second circuit board. The test circuit includes multiple first electrodes and multiple second electrodes insulated from each other and arranged on the first circuit board, and multiple third electrodes arranged on the second circuit board. A group including one of the first electrodes and one of the second electrodes matches with one of the third electrodes, so that a current flows through the test circuit in case that the test circuit is supplied with power.

Abstract: In one embodiment, a system is provided for detecting a damaged magnetoresistive sensor. The system includes a processor, and logic or software stored in hardware that is executable by the processor. The logic or software is configured to, when executed by the processor, determine a scaled resistance of a plurality of sensors. The scaled resistances are measured against at least a first bias current, Imr, or against a square of the at least a first bias current Imr, I2mr. The system also includes logic or software stored in hardware that is configured to, when executed by the processor, output a representation of the measurements.

Abstract: A signal bridge device is provided with a plurality of bridge signal transmission/reception units, a plurality of bridge signal transmission/reception terminals, and a bridge signal distribution unit. Non-contact reception signals received by the bridge signal transmission/reception units are input into the bridge signal distribution unit. Contact reception signals received by the bridge signal transmission/reception terminals are input into the bridge signal distribution unit. The bridge signal distribution unit can output the non-contact reception signals to the bridge signal transmission/reception terminals and can output the contact reception signals to the bridge signal transmission/reception units.

Abstract: A stage device is equipped with a surface plate and a wafer stage which is mounted on the surface plate and has an exhausting port formed on a surface facing the surface plate. In a state where the wafer stage lands on the surface plate, an air chamber is formed in between the surface plate and the wafer stage. Pressurized gas blows out from the exhausting port provided at a stage main section into the air chamber, and self-weight of the wafer stage is cancelled by an inner pressure of the air chamber. This allows to the wafer stage which has stopped on the surface plate to be moved manually.

Abstract: A method for gapping a magnetic component is disclosed. The method includes: forming a feature on a substrate, the feature being a depression defining an inside surface; disposing a first conductive pattern on the substrate and the inside surface of the feature; disposing a permeability material on the inside surface of the feature and the first conductive pattern; disposing a substrate material on the substrate and the feature; disposing a second conductive pattern on the substrate material to wrap the permeability material between the first conductive pattern and the second conductive pattern to define at least one electrical circuit to facilitate a magnetic field in the permeability material; and gapping the permeability material to remove at least a portion of the permeability material to produce a gap in the at least a portion of the permeability material.

Abstract: The present invention is a signal processing method to significantly improve the detection and identification of source emissions. More particularly, the present invention offers a processing method to reduce the false alarm rate of systems which remotely detect and identify the presence of electronic devices through an analysis of a received spectrum the devices' unintended emissions. The invention identifies candidate emission elements and determines their validity based on a frequency and phase association with other emissions present in the received spectrum. The invention compares the measured phase and frequency data of the emissions with a software solution of the theoretically or empirically derived closed-form expression which governs the phase and frequency distribution of the emissions within the source. Verification of this relationship serves to dramatically increase the confidence of the detection.

Abstract: The present disclosure provides a device and method for circuit testing and a display device applying the same. The device for circuit testing includes a detection circuit configured to detect whether a display panel and a printed circuit board are electrically conductive, wherein the detection circuit includes: a first metal redundant track configured to input an electrical detection signal; a second metal redundant track bonded to the first metal redundant track via a first anisotropic conductive film; a third metal redundant track electrically connected to the second metal redundant track; and a fourth metal redundant track bonded to the third metal redundant track via a second anisotropic conductive film.

Abstract: A magnetic path is formed of a center core disposed inside a first coil and second coil, a first side core and second side core disposed outside the first coil and second coil and coming into contact with the center core, and a magnet disposed between the first side core and second side core, wherein a shape of a space formed by a portion of contact between the first side core and second side core is a shape that forms an insertion portion of the magnet disposed obliquely with respect to the magnetic path, and voids perpendicular with respect to the magnetic path at either end portion of the magnet.

Abstract: A board production monitoring device for monitoring a production state of a board production device, including: a database section which consecutively obtains and stores production state data from the board production device; a transition graph display section which displays a transition graph showing a time-series change at least at a part of the production state data; a condition change input section which inputs condition change data which shows a change point of a production condition of the board production device and includes generation time information of the change point; and a condition change display section which displays at least the generation time information of the change point of the condition change data, at a time-series corresponding position in the transition graph, is provided.

Abstract: The disclosed apparatus may include (1) a panel coupled to a network device that includes multiple network ports that each facilitate one or more network links, the panel including (A) an array of port-status indicators that each represent a status of one of the network ports on the network device and (B) an array of link-status indicators that are each dynamically assigned to represent a status of one of the network links and (2) a physical processing device communicatively coupled to the arrays of port-status indicators and link-status indicators, wherein the physical processing device (A) identifies a link-status indicator that has been dynamically assigned to a specific network link, (B) identifies a port-status indicator that corresponds to a specific network port that facilitates the specific network link, and (C) directs the port-status indicator and the link-status indicator to visually indicate whether the specific network link is functional or non-functional.

Abstract: The disclosed Unifying Electrical Interface presents a versatile connectivity platform having the merging capabilities permitting more than a singular voltage, level or type to be made available from an electrical outlet. When wired fully, the choice of AC and/or DC made available to the consumer is broadened. Direct Current (DC) provided via the UEI would originate from a locally based DC source access point obviating the need to use wall chargers or power supplies that wastefully consume energy even when in standby mode. By this approach, the UEI based system extends an avenue for renewable energy technology to be made readily available in a building; while offering a synergistic advantage for the end user, the energy provider and the environment by reducing energy waste. That power conservation and accessibility will result in greater choice and savings for the consumer and will reduce the need for excess production from electric providers.

Abstract: RF generators including active devices driving series resonant circuits are described. The series resonant circuits include a self-resonant dual inductor. The RF generators can be used to drive capacitive loads.

Abstract: A method for producing an electrical oscillating circuit for an inductive charging device, having at least one oscillating circuit component. In a method step, the at least one oscillating circuit component is classified as a function of a structurally caused deviation of a characteristic value of the oscillating circuit component from a nominal value.

Abstract: Provided is a knocking sensor with a support member, a piezoelectric element, a pair of electrode parts, a resistor and a case. The resistor has a resistor body formed with a metal film and connected in parallel to the pair of electrode parts. The resistor also has an outer coating film applied to cover the metal film. The outer coating film is formed of a resin material having a higher thermal deformation temperature than that of a resin material of the case.

Abstract: There is described an assembly for connecting a test unit to a wiring harness or equipment to be tested, and a method for testing using the assembly. The assembly may comprise a test box unit, a generic mate-in interface, and at least one specific mate-in interface. Each one of the generic and specific mate-in interfaces has an ID comprised in an ID support on the electrical path of the generic mate-in interface and the specific mate-in interface, for example, on any one of the end connectors of the interfaces or on their wiring. Information relating to the IDs of the mate-in interfaces and the contact configuration of each mate-in interface is stored in a database of the test unit for identifying the appropriate test contacts that should be used for testing.

Abstract: Embodiments of the present disclosure are directed towards an inductor structure having one or more strips of conductive material disposed around a core. The strips may have contacts at a first end and a second end of the strips, and may be disposed around the core with a gap between the contacts. The inductor structure may be mounted on a surface of a substrate, and one or more traces may be formed in the surface of the substrate to electrically couple two or more of the strips of conductive material to one another to form inductive coils. Other embodiments may be described and/or claimed.

Abstract: An insertion head includes: a horizontal shaft member; one pair of gripping claws, extending on a surface orthogonal to the horizontal shaft member; one pair of gripping claw holding members movable on the horizontal shaft member which hold the one pair of gripping claws; a swing mechanism which rotates and drives the shaft member, and swings the one pair of gripping claw holding members around a center axis of the shaft member; and an interval changing mechanism which moves the one pair of gripping claw holding members on the shaft member and changes an interval between the one pair of gripping claws. The gripping claw extends to be bent on the surface, and each straight line portion of each tip end is offset to a perpendicular axis extending on the surface through a center axis of the shaft member in a posture of being oriented downward.

Abstract: An insertion head includes: a horizontal shaft member; one pair of gripping claws, each gripping claw extending on a surface which is orthogonal to the horizontal shaft member; one pair of gripping claw holding members which are provided to be movable on the horizontal shaft member, and hold the one pair of gripping claws; a swing mechanism which rotates and drives the horizontal shaft member, and swings the one pair of gripping claw holding members around a center axis of the horizontal shaft member; and an interval changing mechanism which moves the one pair of gripping claw holding members on the horizontal shaft member and changes an interval between the one pair of gripping claws. A leaded component is gripped with the one pair of gripping claws, and a lead of the leaded component is inserted into an insertion hole on a printed circuit board.

Abstract: A method of manufacturing electronic chips containing low-dispersion components, including the steps of: mapping the average dispersion of said components according to their position in test semiconductor wafers; associating, with each component of each chip, auxiliary correction elements; activating by masking the connection of the correction elements to each component according to the initial mapping.

Abstract: A high frequency inductor chip includes a core and a coil. The core is in the form of a single piece of a non-magnetic material. The coil is deposited on and surrounds the core and has structural characteristics indicative of the coil being formed on the core by deposition techniques. A method for making the high frequency inductor chip is also disclosed.

Abstract: In one form, a method of manufacturing a circuit device comprises providing a lead frame comprising a plurality of leads, each comprising an island portion, a bonding portion elevated from the island portion, a slope portion extending obliquely so as to connect the island portion and the bonding portion, and a lead portion extending from the bonding portion. First and second transistors and first and second diodes are mounted upper surfaces of island portions of respective first and second leads, and are connected to the respective leads through wirings that connect the transistors and diodes to the bonding portions of the respective leads. Lower surfaces of the island portions are attached to an upper surface of a circuit board, and the circuit board, the transistors, the diodes, and the lead frame are encapsulated by a resin, so that the lead portions are not covered by the resin.

Abstract: A monitoring apparatus, and method of use, that is capable of determining the joint characteristics by means of waveforms shifts at zero-crossing angular distortions through predictive failure algorithm specific to circuit under test.

Abstract: A field device includes a housing and a process variable transducer configured to measure or control a process variable in an industrial process. Field device circuitry in the housing is coupled to the process variable transducer. A meter body mount is carried in housing. A meter is affixed to the meter body mount by an attachment mechanism. The meter includes a display element. A cover seals the meter in the housing.

Abstract: A method of calibrating and debugging a testing system is provided. First, values of different electrical path segments are calibrated, and parameters of the electrical path segments while being calibrated are saved. After calibration, electrical tests can be processed on a DUT. If the testing system malfunctions, the values of the electrical path segments are calibrated again to compare the current parameters to the previously saved parameters. The component which goes wrong can be found out quickly in this way.

Abstract: In one form, a method of manufacturing a circuit device comprises providing a lead frame comprising a plurality of leads, each comprising an island portion, a bonding portion elevated from the island portion, a slope portion extending obliquely so as to connect the island portion and the bonding portion, and a lead portion extending from the bonding portion. The circuit elements are mounted on upper surfaces of the island portions, and are connected to corresponding bonding portions by wirings. Two leads are adapted to be connected to positive and negative sides of a power source, and another lead is an output lead for providing alternating-current power. Lower surfaces of the island portions are attached to an upper surface of a circuit board. The circuit board, the circuit elements, and the lead frame are encapsulated by a resin, so that the lead portions are not covered by the resin.