Means To Simultaneously Fasten Three Or More Parts Patents (Class 29/757)
  • Patent number: 10058020
    Abstract: An electronic component mounting system includes: mounting line management apparatuses disposed in each of mounting lines and an integrated management apparatus connected to the mounting line management apparatuses. The integrated management apparatus includes a first collation unit which performs collation of an electronic component based on identification information for identifying the electronic component. The mounting line management apparatus includes a second collation unit which performs collation of the electronic component. When the identification information is read out by the identification information reading-out unit, the collation of the electronic component is performed by the first collation unit if the mounting line management apparatus can access the integrated management apparatus, and the collation of the electronic component is performed by the second collation unit if the mounting line management apparatus cannot access the integrated management apparatus.
    Type: Grant
    Filed: September 24, 2015
    Date of Patent: August 21, 2018
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Yasuhiro Maenishi, Hagemu Yasojima, Hiroaki Kurata
  • Patent number: 9730336
    Abstract: Methods and systems for manufacturing a swallowable sensor device are disclosed. Such a method includes mechanically coupling a plurality of internal components, wherein the plurality of internal components includes a printed circuit board having a plurality of projections extending radially outward. A cavity is filled with a potting material, and the mechanically coupled components are inserted into the cavity. The cavity may be pre-filled with the potting material, or may be filled after the mechanically coupled components have been inserted therein. A distal end of each projection abuts against a wall of the cavity thereby preventing the potting material from covering each distal end. The cavity is sealed with a cap causing the potting material to harden within the sealed cavity to form a housing of the swallowable sensor device, wherein the distal end of each projection is exposed to an external environment of the swallowable sensor device.
    Type: Grant
    Filed: October 16, 2014
    Date of Patent: August 8, 2017
    Assignee: Innurvation, Inc.
    Inventors: Michael R. Arneson, William R. Bandy, Roger A. Davenport, Kevin J. Powell, Michael C. Sloan
  • Publication number: 20140250683
    Abstract: A method and system for installing and removing a row of cables from a cable array is provided. The method includes providing an installation tool having a first body with a plurality of arms extending from one side. The plurality of arms being configured to receive a cable connector body, the plurality of arms including at least one first projection extending from one of the plurality of arms. The installation tool is moved onto a row of cables held coupled together by a bracket, each of the cables in the row of cables having a cable connector body. The connector bodies are engaged into receptacles and the bracket is moved with the at least one first projection.
    Type: Application
    Filed: March 8, 2013
    Publication date: September 11, 2014
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventor: INTERNATIONAL BUSINESS MACHINES CORPORATION
  • Patent number: 8793867
    Abstract: A head nozzle unit includes a pair of motion guides located parallel to each other, a pair of movable blocks disposed on the pair of motion guides and movable independently of each other, a guide member transversely connected to the pair of motion guides via the pair of movable blocks, a pair of head nozzle parts disposed on opposite lateral surfaces of the guide member, the pair of head nozzle parts movable independently of each other and operable to pick up and mount electronic parts, and a driver that moves the pair of movable blocks in cooperation with one another and that moves the pair of head nozzle parts in predetermined directions. Further, an apparatus and method for mounting electronic parts includes the head nozzle unit. The pair of head nozzle parts alternately and sequentially performs a series of mounting processes of picking up the electronic parts and mounting the picked up electronic parts.
    Type: Grant
    Filed: January 21, 2011
    Date of Patent: August 5, 2014
    Assignee: Samsung Techwin Co., Ltd.
    Inventors: Tae-Young Lee, Boo-Goan Choi
  • Patent number: 8640328
    Abstract: A system for fastening a head stack to a hard drive base assembly (HDBA) comprises a threaded head stack pivot (THSP) having a socket defined therein. The socket comprises a proximal portion defined by inner walls arranged parallel to a longitudinal axis of the socket and a distal portion having a width less than a width of the proximal portion and forming a ledge adjacent to the proximal portion. The system also comprises a bit for driving the THSP into an HDBA. The bit comprises a head comprising contact surfaces arranged parallel to a longitudinal axis of the bit and tapered surfaces extending from respective contact surfaces to a distal end of the bit. The bit is configured to engage the ledge at seams formed between adjacent tapered surfaces and to engage the inner walls with respective contact surfaces when driving the THSP into the HDBA.
    Type: Grant
    Filed: June 18, 2010
    Date of Patent: February 4, 2014
    Assignee: Western Digital Technologies, Inc.
    Inventors: Chin Wai Yow, Jit Han Tan
  • Publication number: 20130212870
    Abstract: A reliable, simple and cost effective system and method for creating at least one magnetic pole on an element of an electrical machine by assembling a plurality of magnets thereon is provided. The system comprises at least one magnetic pole creating apparatus including a non-magnetic frame; magnet guiding device mounted on the frame, the magnet guiding device comprising a reciprocating inner part provided with a magnet holding plate for holding the plurality of magnets and an outer part fixed to the frame; a jig removably fitted at a pre-determined location on the element, the jig is coupled to the non-magnetic frame; and a magnet receiving apparatus coupled to the jig and co-operating with the inner part for receiving and securing the plurality of magnets to the element of the electrical machine. The system also enables simultaneous assembly of a plurality of magnetic poles on the element of the electrical machine.
    Type: Application
    Filed: February 21, 2013
    Publication date: August 22, 2013
    Applicant: JYOTI LIMITED
    Inventor: Jyoti Limited
  • Patent number: 8474131
    Abstract: A tool for joining a coupling element, such as a flange to a pipe, wherein the coupling element surrounds the pipe and has grooves facing the pipe to receive a corresponding plurality of beads provided on the pipe. The tool has a plurality of axially separated, radially movable segments. Each segment has a plurality of circle sector formed ridges. The plurality of segments thereby provides circumferentially extending ridges that are capable of deforming a pipe wall by a first pressing action on the inside wall of the pipe to create on the outside of the pipe circumferential beads in the pipe wall and to cause these beads to extend into corresponding grooves in the coupling element. The segments also have circumferentially extending portions located adjacent and between the ridges.
    Type: Grant
    Filed: November 5, 2010
    Date of Patent: July 2, 2013
    Assignee: Quickflange AS
    Inventor: Hilberg Karoliussen
  • Patent number: 8434217
    Abstract: A mounting apparatus includes a bottom panel, a first mounting member, and a second mounting member. The bottom panel includes a top surface and a bottom surface. The first mounting member includes a positioning portion and an installation portion. A concave portion is defined in the bottom surface, for receiving and preventing the positioning portion from rotating relative to the bottom panel. The bottom panel defines a through hole, for an installation portion. The second mounting member includes a locking portion. The locking portion defines an installation hole, for locking the installation portion. The bottom panel top surface t is between locking portion and positioning portion. The positioning portion bottom surface place in the same plane with the bottom panel bottom surface or is between the bottom panel top surface and the bottom panel bottom surface.
    Type: Grant
    Filed: September 13, 2011
    Date of Patent: May 7, 2013
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Po-Wen Chiu, Wen-Hu Lu, Zhan-Yang Li
  • Patent number: 8234780
    Abstract: A substrate carrier system is provided for physical management of substrate(s) during a variety of assembly techniques performed on the both sides of the substrate(s) without dismounting or changing carrier systems.
    Type: Grant
    Filed: February 27, 2008
    Date of Patent: August 7, 2012
    Assignee: Universal Instruments Corporation
    Inventors: Laurence A. Harvilchuck, George R. Westby
  • Patent number: 8191242
    Abstract: A punch-down device includes a housing, a driving mechanism, and at least one punch-down member. The housing forms therein hollow channels. The driving mechanism includes a rotation shaft and at least one rotary wheel, which is connected and supported by the rotation shaft at a top portion of the housing. The rotation shaft has an end extending outside the housing to form a coupling section. Each of the rotary wheels has a surface forming two tracks and two pegs. The two pegs of one rotary wheel are received in the two tracks of an adjacent one of the rotary wheels. The punch-down member is received in the hollow channels to correspond to the rotary wheels and be driven to move by the rotary wheels. The punch-down member has lower ends forming conductor depression sections. As such, the punch-down device carries out an operation of punching down and depressing conductors, whereby the efficiency of punch-down operation is increased and the operation is easy and reliable positioning is achieved.
    Type: Grant
    Filed: April 20, 2011
    Date of Patent: June 5, 2012
    Inventor: Yu-Tai Liang
  • Patent number: 8166638
    Abstract: Multiple connector clips are bondable onto an electronic device simultaneously with a rotary clip bonder, wherein a pick head comprising a plurality of collets is positioned at a clip supply channel. A plurality of connector clips are picked up from the clip supply channel in a fixed orientation with the pick head and are conveyed to a clip bonding area where the electronic device is located. The pick head is rotated with a rotary motor about a rotational axis passing through a shaft connecting the rotary motor to the pick head in order to change the orientation of the plurality of connector clips, before the connector clips are bonded at the clip bonding area.
    Type: Grant
    Filed: June 9, 2010
    Date of Patent: May 1, 2012
    Assignee: ASM Assembly Automation Ltd
    Inventors: Wai Lik Chan, Man Chung Ng, Ching Yuen To
  • Patent number: 8151448
    Abstract: A component placement apparatus includes: a tray storing device having slots for storing trays, a tray transporting device for transporting a tray from the tray storing device to a pickup area, a controller for controlling the transport of the trays into and out of the tray storing device, and at least one component pickup and placement device for picking-up a component in a tray located in the pickup area and placing the component on a substrate. The tray storing device includes first and second parts located proximal and distal the pickup area, respectively. The first part stores trays (i) from which at least one component may be removed and/or (ii) that are expected to be needed at the pickup area in the short term. The second part stores trays, which are empty, full, or are not expected to be needed in the pickup area in the short term.
    Type: Grant
    Filed: May 23, 2005
    Date of Patent: April 10, 2012
    Assignee: Assembleon N.V.
    Inventors: Adrianus Johannes Petrus Maria Vermeer, J. T. A van De Ven
  • Patent number: 8127436
    Abstract: A device for installing aerial electrical power conductors on utility poles. The device includes a frame having a plurality of anchors. The anchors are arranged to provide a place for securing a plurality of pull ropes during installation of the conductors. The device includes a post sized to be received in a hitch on a vehicle. In one embodiment, the device is sized to fit into an aerial platform, such as that used on utility bucket trucks. The device may be lifted to the point of connection on the utility pole.
    Type: Grant
    Filed: January 30, 2009
    Date of Patent: March 6, 2012
    Assignee: Consolidated Edison Company of New York, Inc.
    Inventors: James Michael Sauschuck, Jr., Ronald William Mege
  • Patent number: 8099863
    Abstract: A removing apparatus, for removing an electrical connector from a PCB, comprises a base, a pulling member, a pair of opposite clipping members, a lower supporting member and at least one resilient member. The pulling member connects to the base to be operated to bring the base up and down. The two clipping members pivotally mount to the base. The lower supporting member mounts below the base. The resilient member located between the base and the lower supporting member. When the base moves downwardly, the latch of the clipping member can engage with the electrical connector and pick it up from the PCB, when the base moves back, it is easy and secure to remove the electrical connector from the PCB.
    Type: Grant
    Filed: December 8, 2008
    Date of Patent: January 24, 2012
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Chun-Yi Chang, Chun-Hung Liu
  • Patent number: 8051556
    Abstract: An apparatus for control of a temperature of a substrate has a temperature-controlled base, a heater, a metal plate, a layer of dielectric material. The heater is thermally coupled to an underside of the metal plate while being electrically insulated from the metal plate. A first layer of adhesive material bonds the metal plate and the heater to the top surface of the temperature controlled base. This adhesive layer is mechanically flexible, and possesses physical properties designed to balance the thermal energy of the heaters and an external process to provide a desired temperature pattern on the surface of the apparatus. A second layer of adhesive material bonds the layer of dielectric material to a top surface of the metal plate. This second adhesive layer possesses physical properties designed to transfer the desired temperature pattern to the surface of the apparatus. The layer of dielectric material forms an electrostatic clamping mechanism and supports the substrate.
    Type: Grant
    Filed: September 22, 2008
    Date of Patent: November 8, 2011
    Assignee: Lam Research Corporation
    Inventors: Anthony J. Ricci, Keith Comendant, James Tappan
  • Publication number: 20110236801
    Abstract: Separators (5A, 5B, 6) and membrane-electrode assemblies (2) of a fuel cell stack (1) are alternately stacked in a guide box (40). The separators (5A, 5B, 6) each have groove-like gas paths (10A, 10B). Powder of an adhesive agent (7) is adhered in advance to the surfaces of the separators (5A, 5B, 6), except the gas paths (10A, 10B), through photosensitive drums (31A, 31B) to which the powder is adsorbed in a given pattern. The separators (5A, 5B, 6) and the membrane-electrode assemblies (2), stacked in the guide box (40), are heated and compressed by a press (43) and heaters (40C) to obtain a unitized fuel cell stack (1).
    Type: Application
    Filed: June 10, 2011
    Publication date: September 29, 2011
    Inventors: Akira Fujiki, Yukihiro Maekawa, Takeharu Kuramochi, Masahiko Katsu, Takayuki Hirao, Takeshi Shimizu, Masanori Iwamoto, Sadao Miki, Haruhiko Suzuki, Yoshiki Muto, Kaoru Eguchi, Masahiro Omata, Hiroshi Saitou
  • Patent number: 7992288
    Abstract: An apparatus (40) for fixing a flexible printed circuit board module (20) to a sliding mechanism (10) of a portable electronic device is provided. The apparatus includes a base (41) and a pressing device (43). The base includes an assembling stage (414) and defines a mounting space (419) therein. The assembling stage is configured for positioning the sliding mechanism and the flexible printed circuit board module thereto. The pressing device is mounted in the mounting space and configured for sliding within the mounting space and pressing the flexible printed circuit board module toward the sliding mechanism.
    Type: Grant
    Filed: July 17, 2008
    Date of Patent: August 9, 2011
    Assignee: Chi Mei Communication Systems, Inc.
    Inventor: Cheng-Lung Chang
  • Patent number: 7969689
    Abstract: An apparatus for attaching one or more HGAs to an actuator assembly including one or more actuator arms comprises a set of pivoting supports corresponding to the one or more HGAs and mechanisms that pivot each of the pivoting supports between open positions and closed positions. For each of the set of pivoting supports, in the open position, a gap adjacent to the pivoting support is sufficiently large to receive both a mounting platform of one of the actuator arms and a baseplate of one of the HGAs positioned in alignment with the mounting platform of the one of the actuator arms, and, for each of the set of pivoting supports, in the closed position, the gap is sufficiently small to constrain the baseplate of the one of the HGAs against the mounting platform of the one of the actuator arms.
    Type: Grant
    Filed: August 14, 2007
    Date of Patent: June 28, 2011
    Assignee: Seagate Technology LLC
    Inventors: Brendan J. Moore, Jeffery B. Carlson
  • Patent number: 7958625
    Abstract: An assembly device includes a base having a supporting portion upon which an isolation cover and a main body are disposed. A press-fitting mechanism is movably connected to the base, and includes a press-fitting portion facing the supporting portion and disposed corresponding in position to the supporting portion, and further portions for guiding and bending second positioning portions. The further portions are movably disposed on external side faces of the press-fitting portion. The press-fitting mechanism also has first portions for holding the further portions to the external side faces of the press-fitting portion, and has second portions passing through upper ends of the further portions. A drive mechanism is disposed at the base and has a drive portion connected to the press-fitting mechanism, for driving the press-fitting mechanism to move towards the supporting portion via the drive portion, so as to bend and fasten ends of second positioning portions.
    Type: Grant
    Filed: February 5, 2009
    Date of Patent: June 14, 2011
    Assignee: Askey Computer Corp.
    Inventors: Chia-Hung Lee, Jen-Huan Yu, Chung-Shao Huang, Ching-Feng Hsieh, Cheng-Wen Dai, Kuo-Ching Chen
  • Patent number: 7891083
    Abstract: An assembling apparatus is disclosed. The assembling apparatus includes a base, an assembling platform, and a driving part. The assembling platform and the driving part are fixed on the base. The assembling platform defines a receiving space for receiving a semiconductor chip module, a lever chamber for receiving clips of the semiconductor chip module, and a driving groove for connecting the receiving space and the lever chamber. The assembling platform further includes a lever bar removably placed in the lever chamber for expanding the clips. The driving part includes driving shafts. An end of each of the driving shafts is in the driving groove and is movable to pass through the lever chamber and reaches the receiving space. The assembling apparatus is used to assemble a semiconductor chip module conveniently and safely.
    Type: Grant
    Filed: May 25, 2007
    Date of Patent: February 22, 2011
    Assignees: Hong Fu Jin Precision Industry (Shen Zhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Chun-Chi Tsai, Jian-Hua Xiang, Yao-Zhong Chen
  • Patent number: 7814645
    Abstract: A mounting apparatus applies ultrasonic vibration exactly to a junction between a SMD and a SMD receiving device and maintains the junction at the suitable temperature, in simple construction in ultrasonic bonding of the SMD and the SMD receiving device held by holding unit. This includes SMD holding unit, SMD receiving device holding unit, moving unit moving at least one of the SMD holding unit and SMD receiving device holding units to contact each other, vibration generating unit applying ultrasonic vibration to the a contact portion between the SMD and the SMD receiving device, pressing unit applying an bias force between the SMD and SMD receiving device, heating unit arranged movably so as to surround in a noncontact manner a portion of the SMD holding unit near the SMD and heating the SMD holding unit, and interlocking unit interlocking the heating unit with the SMD holding unit.
    Type: Grant
    Filed: July 18, 2008
    Date of Patent: October 19, 2010
    Assignee: TDK Corporation
    Inventors: Toru Mizuno, Tomomi Asakura, Yuji Saito, Hiroyuki Takano, Toshinobu Miyagoshi
  • Patent number: 7774927
    Abstract: A wire positioning device for a termination machine includes a support housing configured to be located proximate to a termination zone of the termination machine. A wire gripping mechanism is coupled to the support housing and defines a wire alignment axis. The wire gripping mechanism is configured to hold a wire along the wire alignment axis. The wire gripping mechanism and wire are movable with respect to the support housing along a linear transfer path that is oriented transverse to the wire alignment axis. An electric actuator is mounted to the support housing and is joined to the wire gripping mechanism. The actuator drives the wire gripping mechanism along the transfer path.
    Type: Grant
    Filed: July 27, 2007
    Date of Patent: August 17, 2010
    Assignee: Tyco Electronics Corporation
    Inventors: Christopher John Karrasch, Michael Morris
  • Patent number: 7761978
    Abstract: An assembling apparatus for assembling an electronic component to a printed circuit board (PCB) includes a base, a fixing member fixed to the base, a sliding member slidably mounted to the base, and a driving device mounted to the base. The fixing member is configured for fixing the PCB. The sliding member is configured for supporting the electronic component. The driving device is capable of driving the sliding member to move relative to the fixing member to assemble the electronic component to the PCB.
    Type: Grant
    Filed: January 8, 2009
    Date of Patent: July 27, 2010
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventor: Cheng Liu
  • Patent number: 7707712
    Abstract: Provided is an apparatus for assembling a camera module comprising a support frame that is formed in a rectangular shape and has a jig horizontally connected to an upper end thereof; a plurality of stages that are vertically stacked and installed in the support frame and adjust a printed circuit board (PCB) in three-axis directions; a board holder that is formed to extend from one end of the uppermost stage and has the PCB mounted on the extending end thereof; and a jig assembly that is disposed on an opening of the jig and has a barrel-integrated housing mounted on the central portion thereof.
    Type: Grant
    Filed: August 14, 2007
    Date of Patent: May 4, 2010
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventor: Duck Hun Kim
  • Publication number: 20090078360
    Abstract: An apparatus for control of a temperature of a substrate has a temperature-controlled base, a heater, a metal plate, a layer of dielectric material. The heater is thermally coupled to an underside of the metal plate while being electrically insulated from the metal plate. A first layer of adhesive material bonds the metal plate and the heater to the top surface of the temperature controlled base. This adhesive layer is mechanically flexible, and possesses physical properties designed to balance the thermal energy of the heaters and an external process to provide a desired temperature pattern on the surface of the apparatus. A second layer of adhesive material bonds the layer of dielectric material to a top surface of the metal plate. This second adhesive layer possesses physical properties designed to transfer the desired temperature pattern to the surface of the apparatus. The layer of dielectric material forms an electrostatic clamping mechanism and supports the substrate.
    Type: Application
    Filed: September 22, 2008
    Publication date: March 26, 2009
    Applicant: Lam Research Corporation
    Inventors: Anthony J. Ricci, Keith Comendant, James Tappan
  • Patent number: 7503108
    Abstract: A spindle positioning apparatus for a robotic manipulator. The spindle positioning apparatus includes a mounting plate assembly, first and second spindles, and an actuator mechanism. The first spindle is disposed on the mounting plate assembly in a fixed position. The second spindle is disposed on the mounting plate assembly and is movable with respect to the first spindle. The actuator mechanism is adapted to move the second spindle with respect to the first spindle.
    Type: Grant
    Filed: June 30, 2004
    Date of Patent: March 17, 2009
    Assignee: Ford Motor Company
    Inventors: Isaac Zolotarev, Richard Lorenz, Al Marrocco, Lou LaPlante
  • Patent number: 7484285
    Abstract: A system for mating and demating a plurality of connectors mounted on a socket board with and from a plurality of corresponding connectors mounted on a motherboard includes: an adapter that is arranged above a surface opposite to the socket board surface on which the connectors are arranged and is movable in a direction in which the connectors are mated and demated; pressing means which contacts the surface of the socket board on which the semiconductor components are placed to press the socket board to the motherboard by lowering the adapter; and pulling means each of which engages with an engaging hole formed in the socket board and pulls the socket board in the direction in which the socket board is separated from the motherboard by lifting the adapter.
    Type: Grant
    Filed: February 25, 2003
    Date of Patent: February 3, 2009
    Assignee: Advantest Corp.
    Inventors: Masanori Kaneko, Hiroyuki Hama, Takaji Ishikawa, Shigeru Matsumura
  • Patent number: 7486500
    Abstract: An assembly structure for assembling a first plastic shell and a second plastic shell, thereby coupling articles to be assembled such as keyboards and adapters, including a hollow strut and an opening. The first plastic shell has the hollow strut extended from the inner side. The second plastic shell has the opening defined therein and corresponding to the hollow strut and extends inwards to form an annular flange abutting the hollow strut. The hollow strut has a portion extended through the annular flange to be melted by the ultrasonic welding technique, the thermal welding technique, or the combination thereof until reaching the annular flange, to couple the first and second plastic shells for facilitating assembly. Grinding off the melted portion may disassemble the first and second plastic shells. The disassembled the first and second plastic shells may be coupled again by fastening a fastening element in the hollow strut with the head of the fastening element held by the annular flange.
    Type: Grant
    Filed: December 13, 2004
    Date of Patent: February 3, 2009
    Assignee: Lite-On Technology Corporation
    Inventor: Ya-Tung I
  • Patent number: 7441327
    Abstract: A terminal insertion apparatus includes a wire-holding unit, a housing-holding unit, and an terminal-inserting unit. The wire-holding unit holds electric wires connected to terminal fittings. The housing-holding unit holds a connector housing. The terminal-inserting unit inserts the terminal fittings connected to the electric wires held by the wire-holding unit into the connector housing. The terminal-inserting unit keeps holding the electric wire connected to the lastly inserted terminal fitting and moves the electric wire to the wire-holding unit. Then, the wire-holding unit holds the electric wire.
    Type: Grant
    Filed: September 21, 2005
    Date of Patent: October 28, 2008
    Assignee: Yazaki Corporation
    Inventors: Hiroshi Furuya, Kazuhiko Sugimura
  • Publication number: 20080232057
    Abstract: A method of docking an electronic circuit board. The method includes securing the electronic circuit board to a mounting plate that is mechanically linked to a rigid guide plate, wherein the electronic circuit board has a first connector. The rigid guide plate is inserted in a linear insertion direction between guides that are positioned adjacent a second connector configured to receive the first connector. The rigid guide plate insertion stops in a position where the first connector of the electronic circuit board is aligned with the second connector. Actuating a positioning handle that is accessible from a trailing edge of the guide plate causes rotation of a rotatable plate relative to the guide plate.
    Type: Application
    Filed: October 12, 2007
    Publication date: September 25, 2008
    Applicant: International Business Machines Corporation
    Inventors: Norman Bruce Desrosiers, Dean Frederick Herring
  • Patent number: 7422675
    Abstract: A process for changing an anode of a cell for the production of aluminum by fused bath electrolysis including a plurality of anodes. According to the invention, an anode handling tool is used including a positioning device, a gripping device and a sensor detecting the vertical position of the gripping device, and the position sensor is used to measure the vertical distances traveled by the gripping device with respect to a reference level N. At least one sound or electromagnetic waves beam is then produced in a determined reference line or plane and the passage of the anode in the beam is used to measure the distances. The vertical position of the replacement anode in the cell is determined starting from the values obtained for the traveled distances and the replacement anode is put into this position in the place initially occupied by the spent anode.
    Type: Grant
    Filed: August 26, 2005
    Date of Patent: September 9, 2008
    Assignee: E.C.L.
    Inventors: Alain Van Acker, Patrick Marchand
  • Patent number: 7406760
    Abstract: The inventions presented herein provide an armor forming tool for use with an armor forming machine. The machine feeds a continuous strip of metal to a sub-assembly of a cable so as to wrap the continuous strip around the sub-assembly. The tool applies appropriate pressures to the wrapped continuous strip to form an interlocked armor.
    Type: Grant
    Filed: May 4, 2005
    Date of Patent: August 5, 2008
    Assignee: Southwire Company
    Inventor: Scotty Joe Ledbetter
  • Patent number: 7377028
    Abstract: A connector insertion and removal tool for an electrical system including a circuit board and at least one electrical connector therefor includes a first portion configured for coupling to a first surface of the circuit board, and a second portion configured for coupling to the first portion. At least one of the first portion and the second portion comprises an actuator adapted for movement toward and away from the circuit board to contact at least a portion of the connector.
    Type: Grant
    Filed: September 19, 2003
    Date of Patent: May 27, 2008
    Assignee: Tyco Electronics Corporation
    Inventors: Alexander William Hasircoglu, James Lee Fedder
  • Patent number: 7370407
    Abstract: A disc centering device includes a base plate, a chuck which is installed on the base plate, a hub unit which is detachably engaged to the chuck and receives discs to be stacked, disc pushers which are slidably provided outside the hub unit and include corresponding pressure members which center the discs by pushing circumferences of the discs, and a driving unit which slides the disc pushers simultaneously. Accordingly, as the accuracy of centering the discs is improved, discs with data recorded thereon having a uniform quality can be obtained. Additionally, vibration of a rotation body can be minimized due to the simple configuration the disc centering device. Therefore, in view of the simplified maintenance and repair of the disc centering device, the productivity and manufacturability of HDDs can be improved.
    Type: Grant
    Filed: October 2, 2003
    Date of Patent: May 13, 2008
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Ki-keon Yeom, Sang-jin Choi, Sang-chul Ko, Soo-hyung Kim, Tae-hoe Ha
  • Publication number: 20080072419
    Abstract: A tool for making the semiconductor package accurately contact with the terminals of a electrical connector, comprises a body with a through hole for passing through the semiconductor package thereof, a plurality of the latching members mounted on the body and a guiding member, the guiding member is received in the body and could move up and down relative to the body. The guiding member of the invention is a floatable model to decrease the damage of the semiconductor package while loading.
    Type: Application
    Filed: September 26, 2007
    Publication date: March 27, 2008
    Inventors: Ming-Yue Chen, Chun-Fu Lin
  • Patent number: 7275312
    Abstract: The specification discloses an apparatus comprising an alignment plate having a plurality of depressions therein, each depression being sized to receive a packaging cap therein and to prevent its movement, and a force applicator to apply a force to press the packaging caps and a substrate firmly together. Also disclosed is a process comprising inserting a plurality of packaging caps in a plurality of depressions on an alignment plate, each depression being sized to receive a packaging cap and prevent its movement, aligning the plurality of packaging caps with individual devices on a substrate, placing the substrate in contact with the packaging caps, and applying a force to press the caps against the substrate. Other embodiments are disclosed and claimed.
    Type: Grant
    Filed: June 30, 2003
    Date of Patent: October 2, 2007
    Assignee: Intel Corporation
    Inventors: Gregory S. Clemons, Mitesh C. Patel
  • Patent number: 7231708
    Abstract: In a method for marking a fuse in order to allow for the rapid visual identification of certain characteristics of that fuse, the fuse is provided with: a first color-coded visual indicia indicative of an amperage rating of the fuse; a second color-coded visual indicia indicative of an action value of the fuse; and/or a third color-coded visual indicia indicative of a voltage rating of the fuse.
    Type: Grant
    Filed: August 31, 2004
    Date of Patent: June 19, 2007
    Inventors: R. Dennis Chandler, Raymond Leblond
  • Patent number: 7225532
    Abstract: A terminal pliers structure includes a seat, a drive mechanism, and a clamping mechanism. The clamping mechanism includes a first clamping block, a second clamping block, and a spring. In operation, the first clamping block and the second clamping block are forced to pivot in concert with each other, thereby facilitating the user operating the terminal pliers structure, and thereby saving the manual work. In addition, the first teeth of the first clamping block mesh with the second teeth of the second clamping block to enhance the clamping force between the first clamping block and the second clamping block, so that the clamped terminal head can be clamped between the first clamping block and the second clamping block rigidly and stably.
    Type: Grant
    Filed: August 3, 2004
    Date of Patent: June 5, 2007
    Inventor: Shu Chen Wei
  • Patent number: 7222415
    Abstract: A manual machine for attaching an insulation displacement connector (10) has housing stoppers (34A,34B) for positioning it on a rest (33), a housing holder (35) for holding the connector on the rest, and a set block (36) disposed near the rest in order to position electric wires (11) at their ends or middle portions. The machine further has a wire holder (37) near the housing holder (35) so as to guide and hold the wires at a given pitch, and a wire stopper (38) pivoted to the set block (36) so as to swivel between an active position close to this block and an idle position remote from it. The wire stopper (38) has a collision portion (61) on which the wire ends (11) will impinge to be aligned one with another, and a biasing portion (63) that will urge the wires' middle portions towards the set block (36).
    Type: Grant
    Filed: September 16, 2004
    Date of Patent: May 29, 2007
    Assignee: J.S.T. MFG. Co., Ltd.
    Inventors: Keiichi Kinoshita, Kazuyuki Yamanaka
  • Patent number: 7219420
    Abstract: A protective assembly for a printed-circuit electronics card having a metal substrate and a metal screening cover electrically connected to the substrate. The substrate includes a recessed gutter in which the edge of the cover is accommodated. The edge is crimped onto the substrate in the gutter.
    Type: Grant
    Filed: March 15, 2005
    Date of Patent: May 22, 2007
    Assignee: Valeo Vision
    Inventors: Jean Marc Nicolaï, Marc Duarte, Dung Kong-A-Siou
  • Patent number: 7210221
    Abstract: A base plate and load beam for an HG assembly are formed in series, stacked, and transferred by a transfer system in the form of the stacked-layer series to undergo the necessary assembly processes such as layer joining, slider attachment, and electrical connections between the terminals thereon. When uncompleted HG assemblies are transferred for each of the manufacturing processes, the uncompleted HG assembly is mounted on the assembly jig such as a tray or a block for transference. For this reason, assembling jigs, the number of which is at least equal to the number of the uncompleted HG assemblies remaining at the respective assembly processes would be needed. Accordingly, the efficiency of work space is reduced, and a rise in manufacturing cost is brought about by the need for the assembling jigs.
    Type: Grant
    Filed: August 30, 2004
    Date of Patent: May 1, 2007
    Assignee: Hitachi Global Storage Technologies Netherlands B.V.
    Inventors: Takao Kidachi, Tadaaki Tomiyama, Yoshio Uematsu, Hiromi Ishikawa Ishikawa, Tatsushi Yoshida, Hiroyoshi Yokome, Yukihiro Nakamura, Hisashi Ohyama, Tatsumi Tsuchiya
  • Patent number: 7188402
    Abstract: A disc centering device includes a base plate, a chuck which is installed on the base plate, a hub unit which is detachably engaged to the chuck and in which a plurality of discs are stacked, disc pushers which are slidably provided outside the hub unit, and include corresponding plate springs which center the discs by pushing circumferences of the discs, supporting units which support the corresponding plate springs with respect to the disc pushers so as to reinforce a restoring force of the plate springs after a disc centering of the discs, and a driving unit which slides the disc pushers simultaneously. Accordingly, even though the disc centering is continuously performed, a centering value can be maintained within a desired range (deviation), and deformation of discs can be prevented.
    Type: Grant
    Filed: October 2, 2003
    Date of Patent: March 13, 2007
    Assignee: Samsung Electronics Co., Ltd.
    Inventor: Tae-hoe Ha
  • Patent number: 7162793
    Abstract: Reflow soldering of a variety of circuit boards (9, 11, 15) in a variety of sizes and shapes to assigned locations on the base or carrier (13) of the electronic module housing (3) is simplified by eliminating custom made metal blocks previously used to clamp the circuit boards against the carrier metal. Instead, the solder-backed circuit boards are placed in assigned positions in the module housing and the inside volume of that housing is filled (22) with particulate, such as small beads (17), covering the circuit boards, but leaving the edges of the upstanding metal shields (5 and 7) visible. A plate (21) backed foam sheet (19) is placed over the module housing (24) and clamped down (26), pressing against the beads. The clamped assembly is then heated (28) to reflow the solder, soldering the circuit boards in place.
    Type: Grant
    Filed: November 7, 2003
    Date of Patent: January 16, 2007
    Assignee: Northrop Grumman Corporation
    Inventors: Mark Kintis, Charles G. Turner
  • Patent number: 7107669
    Abstract: This invention relates to a system for mounting an underfloor electronic equipment to a rolling stock body having an underfloor storage portion formed under the floor in the longitudinal direction of the body as a portion of the body. The underfloor storage portion comprises a guidance tool for guiding and supporting the underfloor electronic equipment formed as a unit, a body-side connector corresponding to an electronic equipment-side connector formed to the electronic equipment, and a fixing tool for fixing the electronic equipment to the underfloor storage portion. The underfloor electronic equipment comprises a moving means guided by the guidance tool and the electronic equipment-side connector corresponding to the body-side connector.
    Type: Grant
    Filed: January 29, 2003
    Date of Patent: September 19, 2006
    Assignee: Hitachi, Ltd.
    Inventors: Takeshi Tanaka, Nobuaki Mizuguchi, Seijiro Todori, Shinya Mitsudomi, Yoshihiko Ina, Syu Nakaigawa
  • Patent number: 7047631
    Abstract: A method for the automatable insertion or removal of an integrated circuit board is disclosed. One or more linear actuators or similar devices are coupled to one or more cards of an electronic device (e.g., a telecommunications switch or the like) by one or more brackets, to permit substantially automatic card withdrawal/insertion cycles. A controller is operably coupled to the actuators. The controller controls the actuators to operate through a plurality of cycles in a substantially unattended fashion. Measurement and recording or logging systems can measure the occurrence or duration of service disruptions and maintain a log of test results.
    Type: Grant
    Filed: March 13, 2002
    Date of Patent: May 23, 2006
    Assignee: Cisco Technology, Inc.
    Inventor: Robert Spaulding
  • Patent number: 7028393
    Abstract: A contraction tool includes a main body, and a pressing unit mounted on the main body. The pressing unit includes two press plates each having an upper section formed with a positioning recess and a lower section formed with a tapered face. The contraction tool further comprises a push rod moved relative to the main body and inserted into the positioning recesses of the two press plates of the pressing unit, and an urging member mounted on the push rod to move therewith synchronously and inserted between the tapered faces of the two press plates of the pressing unit. Thus, the contraction tool has an enhanced pressing force and is operated easily and conveniently.
    Type: Grant
    Filed: May 29, 2003
    Date of Patent: April 18, 2006
    Inventor: Shu Chen Wei
  • Patent number: 7028389
    Abstract: A fixing device for a printed circuit board (PCB) is comprised of a shaft, an elastic washer and a fixing pillar for fixing the PCB on a shell. This device has the functions of fixing, vibration buffer, and preventing electromagnetic interference (EMI). According to the invention, the shaft penetrates through the PCB and the elastic washer and connects to the fixing pillar on a shell, thereby fixing the PCB onto the shell. The elastic washer is elastic such that it can absorb external vibrations and reduce damages to the PCB. By putting the elastic washer into contact with the PCB, the electromagnetic wave is guided to the shell, thus avoiding the EMI.
    Type: Grant
    Filed: August 26, 2002
    Date of Patent: April 18, 2006
    Assignee: Inventec Corporation
    Inventor: Lin-Wei Chang
  • Patent number: 7017258
    Abstract: A system for mounting heatsinks, in particular, high-mass heatsinks, on printed circuit boards, such as motherboards. The mounting system includes a backplate, disposed beneath the motherboard, with pins protruding up through the motherboard, and a linkage assembly, which is fixably attached to a base portion of a heatsink assembly. The linkage assembly includes scoops, for grasping the pins during engagement, and a ratcheting system, for compressing the heatsink and thermal interface material onto the package. The mounting system is designed to effectively distribute the heatsink weight, as well as the forces caused by chronic and dynamic stresses, through, rather than upon the motherboard, such as to a chassis. The mounting system thus alleviates stress cracks, component pullout, solderball stress, and other damaging conditions to the motherboard. The mounting system may be engaged and disengaged without the use of tools.
    Type: Grant
    Filed: January 26, 2004
    Date of Patent: March 28, 2006
    Assignee: Intel Corporation
    Inventors: Michael Z. Eckblad, Mark W. Anderson
  • Patent number: 6952868
    Abstract: An assembly apparatus for a magnet assembly is disclosed. The assembly apparatus includes first and second assembly nests and an assembly slide operable between an advanced position relative to the assembly nests and a retracted position for assembly. As disclosed the assembly apparatus is used to assemble spacer posts between opposed magnet/backiron assemblies. The assembly apparatus includes spacer nests proximate to the assembly nests for assembly of spacers between the opposed magnet/backiron assemblies.
    Type: Grant
    Filed: March 18, 2002
    Date of Patent: October 11, 2005
    Assignee: Seagate Technology LLC
    Inventors: Terry R. Fahley, Paul L. Johnson, David L. Duvick
  • Patent number: 6922886
    Abstract: An apparatus designed for installing anode bracelets upon pipes used in cathodic protection systems. The apparatus includes a pair of grasp booms which hold the anode bracelet during installation of the bracelet around the pipe to be cathodically protected. The grasp booms can be rotated for the installation of the anode bracelet and can be opened to receive each half of the bracelet and closed to mount the bracelet around the pipe.
    Type: Grant
    Filed: July 6, 2002
    Date of Patent: August 2, 2005
    Inventor: John L. Costley, Jr.