Means To Align And Advance Work Part Patents (Class 29/759)
  • Patent number: 9950880
    Abstract: The invention relates to a device for orienting elements, in particular filter elements (F), for fitting injection-molded parts, in particular pipette tips (P), comprising an accommodating container (1a) for accommodating the filter elements (F) as bulk material, a sieve plate (1), which forms the bottom of the accommodating container and which has bores (11) for accommodating individual filter elements (F), a buffer plate (2), which is arranged under the sieve plate (1) and which has bores (2.1) corresponding to the bores of the buffer plate (2) and which is arranged below the buffer plate in such way that the transfer plate can moved in relation to the buffer plate (2).
    Type: Grant
    Filed: March 14, 2014
    Date of Patent: April 24, 2018
    Assignee: HEKUMA GMBH
    Inventors: Christian Faltenbacher, Manuel Hilpert, Konrad Hintermaier
  • Patent number: 9387562
    Abstract: An assembly device for a writing head unit includes a head holder; a writing head; an imaging unit to image the writing head temporarily mounted on the head holder; an adjuster to adjust relative positions of the head holder and the writing head using the image of the writing head imaged by the imaging unit; and an optical unit to focus images of reference marks indicating a reference position of the writing head disposed in a direction different from the writing head, and the writing head on the same viewing field. The adjuster adjusts the writing head using the images of the writing head and the reference marks imaged simultaneously by the imaging unit.
    Type: Grant
    Filed: January 22, 2015
    Date of Patent: July 12, 2016
    Assignee: RICOH COMPANY, LTD.
    Inventor: Hiroshi Yoshikawa
  • Patent number: 9244119
    Abstract: An apparatus for testing a semiconductor package including a shuttle, a socket and a pressing unit may be provided. The shuttle may include a pocket, which is configured to receive the semiconductor package and a printed circuit board (PCB). The PCB may be configured to make electrical contact with the semiconductor package. The socket may be arranged under the shuttle and include socket pins configured to make electrical contact with the PCB. The pressing unit may be arranged on the shuttle and may be movable in a vertical direction. The pressing unit may press on the shuttle toward the socket such that the semiconductor package may be electrically connected to the socket pins. Because the semiconductor package received in the shuttle may make contact with the socket at the testing region to test the semiconductor package, the semiconductor package may not fall off or may not be slanted.
    Type: Grant
    Filed: October 22, 2013
    Date of Patent: January 26, 2016
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Gui-Heum Choi, In-Sik Kim, Bo-Keun Shim, Sung-Jae Lim
  • Publication number: 20150128408
    Abstract: In a device for producing and/or processing a workpiece, in particular circuit boards (1), in a work station (2), in particular for printing a corresponding blank or for checking finished circuit boards (1), at least one mark (15) is provided on the workpiece. In this arrangement, at least one reference (14), which can be brought into alignment with the mark (15), is provided in the work station (2).
    Type: Application
    Filed: July 12, 2013
    Publication date: May 14, 2015
    Inventors: Michael Konrad, Stefan Werner
  • Publication number: 20150121691
    Abstract: The present disclosure provides an ancillary fixture for assembling a touch display and the method for using the same. The ancillary fixture comprises a first carrying member, a second carrying member, a support structure, a first positioning mechanism, and a second positioning mechanism. The first carrying member and the second carrying member are pivoted at the support structure. The first carrying member has a first carrying surface. The second carrying member has a second carrying surface opposing to the first carrying surface. The first carrying surface and the second carrying surface are used for carrying at least one component of the touch display, respectively. The first positioning mechanism and the second positioning mechanism are used for adjusting the inclination angle of the first carrying member and the second carrying member with respect to the support structure, respectively, to finish assembling the touch display.
    Type: Application
    Filed: April 17, 2014
    Publication date: May 7, 2015
    Applicant: WISTRON CORPORATION
    Inventor: YUN-JUN WANG
  • Patent number: 9015931
    Abstract: A retention-extraction device is provided for a removable card in a chassis. The device includes an actuation rod having a cam slot, the actuation rod configured to provide linear movement along the length of the actuation rod, and an extraction lever operatively connected to a proximal end of the actuation rod and pivotally secured to the chassis. The device also includes a bell crank with a cam follower that is configured to ride in the cam slot and a latch hook that pivots between an open and closed position based on the motion of the bell crank. The linear movement of the actuation rod causes the extraction lever to apply a force to a portion of the card and causes the latch hook to pivot to an open position to allow removal of the card.
    Type: Grant
    Filed: December 30, 2011
    Date of Patent: April 28, 2015
    Assignee: Juniper Networks, Inc.
    Inventor: Kenneth D. Boetzer
  • Patent number: 8973235
    Abstract: A pulling head work station for attaching the lugs of pulling heads to cables, so that the cables may be pulled simultaneously through a conduit. The pulling head work station includes staggered cable receiving jigs, each jig having two clamps to hold a corresponding cable in place during attachment of a pulling lug. A chop saw to cut the cables and a crimper to secure a pulling lug to each stripped end portion of a cable may be slidably mounted to a work surface of the work station. A wire stripper may be removably attached to the work station.
    Type: Grant
    Filed: October 18, 2013
    Date of Patent: March 10, 2015
    Assignee: Cerro Wire LLC
    Inventors: Douglas P. Henderson, Joshua K. Young, Jeffery D. Kennedy
  • Patent number: 8966743
    Abstract: A device for changing the electrode of an electrode-holder tool of a welding device, with a first part configured to house an electrode-holder tool and including means to prevent the electrode-holder tool from moving, and a second part installed around the first part and covering the part of the electrode protruding outside the first part, where the second part can be separated from the first part by sliding along the electrode, and is able to rotate relative to the fixed part when it surrounds it, and where the second part is configured to tighten or untighten the mandrel and to attach the electrode and the second part, enabling it to be removed from the mandrel when the first part and the second part are separated.
    Type: Grant
    Filed: October 18, 2010
    Date of Patent: March 3, 2015
    Assignee: Areva NC
    Inventors: Jean-Luc Allard, Jean-Pierre Schwanck
  • Patent number: 8938875
    Abstract: A component aligning apparatus includes a component aligning jig, in which electronic components to be aligned have a rectangular parallelepiped shape whose length dimension is L, width dimension is W, and thickness dimension is T, the component aligning jig includes electronic component accommodating recesses opening on a surface, the depth Z of the accommodating recesses is shorter than the length L of the electronic components so that a single electronic component is held in each of the electronic component accommodating recesses while partially projecting upwards from each of the recesses with the WT surface on one side facing up, and letting s be the shortest separation that is larger than the thickness T and is the narrowest distance between opposing inside surfaces of each of the accommodating recesses when each of the accommodating recesses is seen in plan view, W>S>T.
    Type: Grant
    Filed: November 23, 2011
    Date of Patent: January 27, 2015
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Toshiki Miyazaki
  • Patent number: 8869385
    Abstract: An apparatus for positioning a component relative to an associated component. The apparatus includes a component receiver and onto which the component is disposed. The apparatus also includes an associated component receiver and onto which the associated component is disposed. The component receiver orients the component into a position for retaining the component to the associated component. The apparatus further includes a retention device driver for inserting a retention device, the retention device retaining the component to the associated component in the position. The apparatus also includes an optical position verifier for verifying the position of the component and the associated component.
    Type: Grant
    Filed: September 24, 2007
    Date of Patent: October 28, 2014
    Assignee: HGST Netherlands B.V.
    Inventors: Jen-Yuan Chang, Khaled M. Fawzi, Russell D. Moates, Edgar D. Rothenberg
  • Patent number: 8857045
    Abstract: A method of assembling a circuit board assembly is provided. The circuit board assembly includes a circuit board assembly fixture and a plurality of fixed circuits. The method includes coupling the plurality of fixed circuits to the circuit board assembly fixture. The plurality of fixed circuits includes at least one of a fully flexible circuit, a flexible circuit having stiffeners, and a rigid circuit. The fixture includes a plurality of supporting surfaces each including a first side, configured to receive at least one of the fixed circuits, and an opposite second side. The fixture includes at least one hinge, at least one fastening mechanism extending from the first side, and at least one retainer coupled to at least one of the plurality of supporting surfaces. The method includes folding the circuit board assembly fixture into a desired alignment.
    Type: Grant
    Filed: June 2, 2011
    Date of Patent: October 14, 2014
    Assignee: General Electric Company
    Inventors: Ryan Adam Conger, Robert Ivan Rose, Dale Stewart Apgar, Robert Paul Stachow, Jr.
  • Publication number: 20140283382
    Abstract: Wire positioning devices (1) for positioning an electrical wire (2) in a processing device, include a wire guide (4) for receiving the electrical wire (2) and a lowering device (5), movable vertically in relation to a first longitudinal axis (45) of the wire (2) received in the wire guide (4). The lowering device (5) has a press piece (6), spring-loaded via at least one spring element (15), and is provided so as to be contacted against the wire guide (4), the spring element (15) being arranged in a tube (16). Also disclosed are methods for lowering thin wires (2) and for positioning them in an oscillation-damped manner, wherein a wire positioning device (1) or a processing device are employed.
    Type: Application
    Filed: August 14, 2012
    Publication date: September 25, 2014
    Applicant: SCHLEUNIGER HOLDING AG
    Inventor: Peter Schuetz
  • Publication number: 20140261616
    Abstract: An apparatus, method, and system, the apparatus including a receiving member dimensioned to receive an array of microelectronic devices; and a linkage member coupled to the receiving member, the linkage member configured to move the receiving member in at least two dimensions so as to modify a spacing between the electronic devices within the array of microelectronic devices received by the receiving member. The method including coupling an array of microelectronic devices to an expansion assembly; and expanding the expansion assembly so as to expand the array of microelectronic devices in at least two directions within a single plane. The system including a support member; an expansion assembly coupled to the support member, the expansion assembly having a plurality of receiving members configured to move in at least two dimensions within a single plane; and a plurality of microelectronic devices coupled to each of the plurality of receiving members.
    Type: Application
    Filed: March 12, 2014
    Publication date: September 18, 2014
    Applicant: SANDIA CORPORATION
    Inventors: Jeffrey P. Koplow, Vipin P. Gupta, Gregory N. Nielson, Murat Okandan, Jose Luis Cruz-Campa, Jeffrey S. Nelson
  • Patent number: 8826518
    Abstract: The invention aims at reducing unevenness at the intersections of mutually crossing electrodes with a method of and an apparatus for forming electrodes on a substrate. After forming a number of finger electrodes on a substrate, wide bus electrodes intersecting them are formed by application of an application liquid. Upon applying the application liquid which contains an electrode material and a photo-curing resin to the substrate, the application liquid is irradiated with UV light after a predetermined time and the application liquid is thus made to harden. A time difference since applying until light irradiation is set based on the result of measurement on changes of the height of the application liquid experimentally applied.
    Type: Grant
    Filed: January 21, 2011
    Date of Patent: September 9, 2014
    Assignee: Dainippon Screen Mfg. Co., Ltd.
    Inventor: Masakazu Sanada
  • Patent number: 8826524
    Abstract: Provided is a fitting tool for a liquid absorber which is included in a liquid ejecting apparatus having a liquid ejecting head for ejecting liquid from nozzle openings formed in a nozzle forming surface and fits the liquid absorber for absorbing the liquid in a cap which is capable of being abutted to the liquid ejecting head so as to cover the nozzle openings, the fitting tool including: a holding portion which holds the liquid absorber; and a locking portion which has elasticity and is locked to a portion of the cap when the holding portion is inserted into the cap.
    Type: Grant
    Filed: July 23, 2008
    Date of Patent: September 9, 2014
    Assignee: Seiko Epson Corporation
    Inventors: Hiroki Matsuoka, Atsushi Yoshida
  • Patent number: 8813333
    Abstract: A method for servicing a stator frame of a power generator includes removing a first stator core from a main housing of the frame. A support assembly including a plurality of rails and a trolley is used to insert second laminations of a second stator core into the main housing. The rails extend axially within a bottom portion of the main housing and provide support for the trolley and for the second laminations as they are being inserted into the main housing. The trolley is provided for axial movement on the rails for inserting the second laminations into the main housing.
    Type: Grant
    Filed: May 11, 2012
    Date of Patent: August 26, 2014
    Assignee: Siemens Energy, Inc.
    Inventors: Travis J. Vitello, David T. Allen
  • Patent number: 8800132
    Abstract: A magnet loading apparatus for loading magnet pole pieces onto a field of an electric machine is described. The apparatus includes positioning means realized to hold a magnet pole piece of a plurality P of magnet pole pieces in place relative to its designated position on the field; and a transfer means realized to simultaneously transfer a plurality P of magnet pole pieces from the positioning means onto the field of the electric machine. Also described is a method of loading magnet pole pieces onto a field of an electric machine.
    Type: Grant
    Filed: July 31, 2012
    Date of Patent: August 12, 2014
    Assignee: Siemens Aktiengesellschaft
    Inventors: Torben Peter Andersen, Alan Hansen, Stefan Maroti, Klaus Thaarup
  • Patent number: 8789266
    Abstract: An apparatus for manufacturing electronic parts is provided. The apparatus includes a head unit installed on a main body and configured to move up and down, a nozzle unit installed on the head unit and configured to move up and down, and a positioning unit sequentially displacing the head unit and the nozzle unit to a position where the electronic parts are on standby to suction the electronic parts using the nozzle unit. Thus, when the head unit is used to suction the electronic parts on standby at a standby position of the electronic parts, the head unit and the nozzle unit installed on the head unit are sequentially lowered, so that it is possible to relieve an impact occurring when the electronic parts are suctioned to the ends of nozzles.
    Type: Grant
    Filed: July 22, 2010
    Date of Patent: July 29, 2014
    Assignee: Samsung Techwin Co., Ltd.
    Inventor: Seong-Ku Kim
  • Patent number: 8789267
    Abstract: A method and fixture using magnetic field assisted self-alignment for chip packaging. Typical embodiments include a magnetic device having one or more pole groups, each pole group including two or three poles. Some embodiments provide multiple pole groups arranged in a one or two dimensional pole group array. The poles can build up a self-alignment magnetic field. The structure of fixture is simple and easy to implement. Typical embodiments can greatly reduce chip packaging cost and make packaging more efficient. In accordance with typical embodiments, a chip and a substrate can be self-aligned magnetically regardless of their shapes.
    Type: Grant
    Filed: April 22, 2010
    Date of Patent: July 29, 2014
    Assignee: Chengdu Kiloway Electronics Inc.
    Inventors: Jack Zezhong Peng, David C. Fong
  • Patent number: 8782880
    Abstract: An apparatus for assembling chip devices on a wire, each chip device comprising two substantially parallel lateral walls, and a groove in one of the lateral walls for receiving said wire. The apparatus includes a pinching device having two opposing surfaces, the distance between the opposing surfaces being substantially constant and substantially equal to the distance between the two lateral walls of a chip device. A wire feeder is adapted to continuously feed the wire in contact with one of the opposing surfaces of the pinching device. A chip device feeder is adapted to drive chip devices, one at a time, between the opposing surfaces, with their grooves turned towards the wire. The pinching device may comprise two cylindrical rollers having rotation axes substantially perpendicular to the wire, the opposing surfaces being formed by respective surfaces of the rollers.
    Type: Grant
    Filed: May 25, 2011
    Date of Patent: July 22, 2014
    Assignee: Commissariat a l'Energie Atomique et aux Energies Alternatives
    Inventors: Dominique Vicard, Jean Brun
  • Patent number: 8756799
    Abstract: A substrate accommodating tray pallet has a substrate in a horizontal state, includes openings for inserting substrate removal tools for raising the substrate, and is used for transferring substrate accommodating trays which can be vertically stacked, wherein: the substrate accommodating trays are to be mounted on an upper surface; and substrate removal tool insertion openings for inserting the substrate removal tools are positioned so as to oppose openings of the mounted substrate accommodating trays.
    Type: Grant
    Filed: June 25, 2009
    Date of Patent: June 24, 2014
    Assignees: Sharp Kabushiki Kaisha, Sydek Corporation
    Inventors: Takenori Yoshizawa, Hideo Taniguchi, Hiroto Shibata
  • Patent number: 8739394
    Abstract: A method for stringing a first elongate element through a second elongate element is provided by placing the first elongate element in a channel and injecting compressed gas into the channel to propel the first elongate element therethrough. The channel has a first open end, and the second elongate element is sealed around the first open end. Compressed gas is injected into the channel towards the second elongate element, propelling the first elongate element through the second elongate element. Also disclosed is a system for performing such a method, including a source of compressed gas and a housing having a channel with a first end and a second open end. The first end is in fluid communication with the source of compressed gas. The channel has a tapered portion adjacent the open end of the channel, and the channel defines a straight longitudinal axis between the first end and the second open end.
    Type: Grant
    Filed: January 7, 2011
    Date of Patent: June 3, 2014
    Assignee: Cardiac Pacemakers, Inc.
    Inventors: Edgardo Ortiz Negron, Victor Torres Serrano
  • Patent number: 8707550
    Abstract: A bonding apparatus for bonding electronic devices including substrates comprises first and second rails arranged adjacent to each other which are configured to align the substrates in vertical orientations during transportation along the rails. A bonding system is locatable over a first bonding site which is located along the first rail and a second bonding site which is located along the second rail. A first indexer is located adjacent to the first rail and a second indexer is located adjacent to the second rail wherein each indexer is independently operative to transport a substrate along one rail while a substrate held on the other rail is being bonded. A container located at one end of the rails for holding multiple unbonded substrates is operative to feed unbonded substrates directly to the rails.
    Type: Grant
    Filed: July 24, 2009
    Date of Patent: April 29, 2014
    Assignee: ASM Technology Singapore Pte Ltd
    Inventors: Keng Yew James Song, Ka Shing Kenny Kwan, Choong Kead Leslie Lum, Ting Yu He
  • Patent number: 8701276
    Abstract: The invention provides for a placement head for a die placing assembly of an assembler for assembling dice on a carrier. The assembler has an enclosure with a support assembly for operatively supporting a wafer with dies thereon, a die picking assembly for picking dice from said wafer, a die placement assembly for placing the dies onto the carrier, a die conveyance mechanism operatively conveying the dies from the die picking and placement assemblies, and a control system controlling the assembler. The placement head includes a first translation stage mounted on the die placement assembly, said first stage operatively displaceable along a first axis relative to the die placement assembly. The placement head also includes a second translation stage mounted on the first stage, the second stage displaceable perpendicular to the first stage.
    Type: Grant
    Filed: August 19, 2008
    Date of Patent: April 22, 2014
    Assignee: Zamtec Ltd
    Inventors: David Oliver Burke, Jan Waszczuk, Desmond Bruce Boyton, Craig Donald Strudwicke, Peter John Morley Sobey, William Granger, Jason Mark Thelander, Eric Patrick O'Donnell
  • Patent number: 8689436
    Abstract: An align fixture for aligning an electronic component having a receptacle adapted to receive the electronic component and having a first abutting section and a second abutting section, the align fixture further having a first elastic unit and a second elastic unit, the first abutting section is flexibly mounted via the first elastic unit, and the second abutting section is flexibly mounted via the second elastic unit, and the first abutting section and the second abutting section are together adapted to floatingly engage the electronic component.
    Type: Grant
    Filed: August 17, 2010
    Date of Patent: April 8, 2014
    Assignee: Multitest Elektronische Systeme GmbH
    Inventors: Thomas Hofmann, Helmut Scheibenzuber
  • Publication number: 20140065747
    Abstract: A method and an apparatus for producing solar cell strings by connecting at least two solar cells by a least one conductor ribbon of a first length, wherein the solar cells are respectively spaced from one another at a string cell spacing(s), until a desired number of solar cells for producing a first solar cell string is connected together, connecting a further solar cell with a last solar cell of the first solar string by at least another conductor ribbon which is longer than the at least one conductor ribbon, wherein the second solar cell is spaced from the last solar cell at a greater spacing than the string cell spacing(s) and wherein the second solar cell forms the first solar cell for a second solar string, and separating the at least another conductor ribbon for decoupling the first solar cell string.
    Type: Application
    Filed: August 31, 2012
    Publication date: March 6, 2014
    Inventors: William D. Duncan, Adrian H. Gretler, James R. Lyon, Brad M. Dingle
  • Patent number: 8661636
    Abstract: Provided is a metal shell cutting and assembling machine for cutting a material tape with metal shells and assembling the metal shell with a plastic body of a connector. The metal shell cutting and assembling machine includes a frame, a material-feeding mechanism, a pre-press mechanism, a metal shell-cutting mechanism, a plastic body-inserting mechanism, a metal shell-inserting mechanism and a controller. The material-feeding mechanism is used for transferring the material tape. The pre-press mechanism can pre-press the metal shell of the material tape for being cut by the metal shell-cutting mechanism. The metal shell-inserting mechanism can push the metal shell held between the pre-press mechanism and the metal shell-cutting mechanism onto the plastic body-inserting mechanism, and the plastic body-inserting mechanism pushes the plastic body for assembling with the metal shell. Whereby the metal shell cutting and assembling machine can enhance the manufacture efficiency and reduce the labor cost.
    Type: Grant
    Filed: September 17, 2010
    Date of Patent: March 4, 2014
    Assignee: Cheng Uei Precision Industry Co., Ltd.
    Inventors: Yu-feng Lin, Kuo-chuan Chiu, Feng-chi Lee
  • Patent number: 8661657
    Abstract: A plurality of indicated back-up pin devices are detachably placed on a back-up plate provided on a component mounting apparatus, to a plurality of indicated positions of the back-up plate to support a board from an under surface thereof, to which already mounted components have been mounted, when another components are to be mounted on an upper surface of the board. The back-up pin device comprises a base portion detachably placed on the back-up plate, at least one support pin erected upright on the base portion to support the board by contacting an upper end thereof with an under surface of the board and at least one of an identification mark for identifying the type of the back-up pin device and a position mark as a reference to determine a position of the base portion on the back-up plate, which is provided on the base portion.
    Type: Grant
    Filed: April 19, 2011
    Date of Patent: March 4, 2014
    Assignee: Fuji Machine Mfg. Co., Ltd.
    Inventors: Hidetoshi Ito, Fumitaka Maeda
  • Patent number: 8650746
    Abstract: A lens assembly tool includes a lens receiving frame having a first surface, a positioning plate positioned on the lens receiving frame, and a pressing plate positioned on the positioning plate and having a second surface. The first surface defines a plurality of receiving holes. The positioning plate defines a plurality of through holes aligned with the plurality of receiving holes. The second surface forms a plurality of pressing punches aligned with the plurality of receiving holes.
    Type: Grant
    Filed: June 28, 2012
    Date of Patent: February 18, 2014
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Chien-Chun Wang
  • Patent number: 8646171
    Abstract: A component mounting apparatus includes: a conveyor device for sucking and holding a substrate in a substantially vertical posture and conveying the substrate in a direction extending along its flat plate surface; a plurality of working devices for performing a working process for mounting areas in edge portions of the substantially vertical-postured substrate received from the conveyor device. In the component mounting apparatus, each of the working devices includes: a substrate holder for sucking and holding the substrate in a substantially vertical posture; a holder up/down device for moving the sucked and held substrate to a downward working position; a receiving member for supporting an edge portion of the substrate positioned in the working position from its back face side; and a working unit for performing the working process on the mounting areas of the edge portions of the substrate positioned in the working position from its front face side.
    Type: Grant
    Filed: March 30, 2009
    Date of Patent: February 11, 2014
    Assignee: Panasonic Corporation
    Inventors: Nobuhiko Muraoka, Syozo Kadota
  • Patent number: 8635766
    Abstract: A component supplying apparatus which is appended to the electronic component working apparatus, for supplying electronic components to the electronic component working apparatus is provided. The component supplying apparatus includes a component storing section which stores the electronic components, and movement range regulator. The movement range regulator allows the component storing section to move between a supply position P1 which is set for supplying the electronic components and a retracted position P2 to which the component storing section is retracted for the purpose of maintenance of the electronic component working apparatus. In addition, the movement range regulator regulates the range of relative movement of the component storing section with respect to the electronic component working apparatus to a movement amount L4 that is previously established.
    Type: Grant
    Filed: December 27, 2010
    Date of Patent: January 28, 2014
    Assignee: Yamaha Hatsudoki Kabushiki Kaisha
    Inventors: Naoki Hanamura, Manabu Ihara
  • Patent number: 8555487
    Abstract: Provided are an imaging device production system, an imaging device inspection system, and an imaging device inspection method. The imaging device production system includes a assembling process for assembling each components constituting an imaging device, an inspection process in which the imaging device assembled in he assembling process is continuously transferred without being stopped except for emergency when two inspection tasks adjacent to and different from each other are performed, and a packaging for packaging the imaging device which passes through the inspection tasks to confirm quality of the imaging device.
    Type: Grant
    Filed: June 12, 2009
    Date of Patent: October 15, 2013
    Assignee: LG Electronics Inc.
    Inventors: Myeong-Woo Kim, Jin-Sang Ah, Jae-Hyun Kim
  • Patent number: 8549735
    Abstract: A challenge to be met by the present invention is to provide a component mounting device, a component mounting system, and a component mounting method that make it possible to correctly position a substrate at a working location and mount components on the substrate even when components mounted on the substrate project outside from an end of the substrate in a direction parallel to a substrate conveyance path. When a front end portion (PbT) of a substrate (Pb) conveyed by a substrate conveyance path (13) is detected to have reached inspection light (L), operation of the substrate conveyance path (13) is immediately halted.
    Type: Grant
    Filed: October 20, 2010
    Date of Patent: October 8, 2013
    Assignee: Panasonic Corporation
    Inventors: Hideki Sumi, Yoshiaki Awata
  • Publication number: 20130239406
    Abstract: Machine and insolation method for panels for turning a panel and successively insolating its first and second faces. According to the invention, this machine comprises at least one first insolation station (10), and a panel turner (30), having a first face and a second face, the latter comprising a prehension device (53, 54), configured to grip a panel (90), a displacement device, configured to displace the prehension device at least between the first and second insolation stations (10, 20), and a pivoting device, configured to pivot the prehension device (53, 54) and in this way have the panel (90) pivot about a pivoting axis (A) parallel to said panel (90), the turner (30) being configured so that it can grip the panel (90) by any one of its faces and release the panel (90) also by any one of its faces.
    Type: Application
    Filed: March 12, 2013
    Publication date: September 19, 2013
    Applicant: ALTIX
    Inventor: Christophe COUSIN
  • Patent number: 8499439
    Abstract: A positioning apparatus has a pilot holder having a hold face, a positioning pin having a tapered tip and supported by the pilot holder so that the tapered tip protrudes from the hold face of the pilot holder, a pad having a pad face that opposes the hold face of the pilot holder, and a movable member having a stop face that opposes the positioning pin and a relief hole for avoiding the tapered tip of the positioning pin from hitting the stop face, the movable member resiliently supported on the pad. The pilot holder and the pad in which the thin plate material is set between the hold face and the pad face relatively move to insert the tapered tip of the positioning pin into the positioning hole of the thin plate material. The stop face is flush with or protruding from the pad face of the pad.
    Type: Grant
    Filed: June 8, 2011
    Date of Patent: August 6, 2013
    Assignee: NHK Spring Co., Ltd.
    Inventors: Naoki Iwamoto, Hidenori Inoue
  • Patent number: 8493455
    Abstract: A lens assembly alignment apparatus for a camera lens module is provided. The lens assembly alignment apparatus includes a position alignment apparatus that moves a lens assembly in a direction of an optical axis of the lens assembly and on a plane perpendicular to the optical axis. The apparatus also includes a slant alignment apparatus having first and second rotary axes which extend perpendicular to each other and perpendicular to the optical axis of the lens assembly, respectively. The lens assembly is received in a housing, and the slant alignment apparatus aligns an optical axis of an image sensor, which is mounted in the housing, parallel to the optical axis of the lens assembly by rotating the housing about each of the first and second rotary axes.
    Type: Grant
    Filed: February 12, 2010
    Date of Patent: July 23, 2013
    Assignee: Samsung Electronics Co., Ltd
    Inventors: Kil-Soo Ko, Doo-Sik Shin
  • Patent number: 8424195
    Abstract: An apparatus for manufacturing a semiconductor package includes an index rail transferring a lead frame in forward and backward directions, the lead frame having a first surface and a second surface that is opposite to the first surface, a loader portion connected to an end portion of the index rail and supplying the lead frame to the index rail, a frame driving portion connected to the opposite end portion of the end portion of the index rail and rotating the lead frame around a normal to the first surface, and a die attach portion attaching a semiconductor chip on the lead frame supplied to the index rail.
    Type: Grant
    Filed: February 26, 2009
    Date of Patent: April 23, 2013
    Assignee: STS Semiconductor & Telecommunications Co., Ltd.
    Inventor: Sun Ha Hwang
  • Publication number: 20130095578
    Abstract: Embodiments of the invention may provide a system for the production of photovoltaic modules that comprises at least a first work line having a plurality of positioning stations in which a series of first processing operations are performed and a second work line consisting of at least a positioning station in which at least a second processing operation is performed. The process sequence may include, for example, printing a layer material used to form one or more electric contacts on a base layer, and then positioning photovoltaic cells and various layers of insulating material in a desired orientation over the base layer to form a photovoltaic module.
    Type: Application
    Filed: October 12, 2012
    Publication date: April 18, 2013
    Inventors: Andrea Baccini, Marco Gajotto, Thomas Micheletti, Diego Tonini, John Telle, Marco Maiolini, Andrea Sartoretto
  • Publication number: 20130074320
    Abstract: A method of placing an element onto a data carrier, where there is a placement actuator arranged to be able to secure the element. A transport layer is advanced until the element is located between the placement actuator and the data carrier in a desired position. The actuator is moved towards the data carrier so that it secures the element. The transport layer is then retracted to detach the element from it and then the placement element is moved towards the data carrier to bring the element into contact with the data carrier at the desired position.
    Type: Application
    Filed: September 12, 2012
    Publication date: March 28, 2013
    Applicant: OBERTHUR TECHNOLOGIES
    Inventors: Grégory SIMONNEAUX, Loïc LE GARREC
  • Patent number: 8402639
    Abstract: It is an object to provide an electronic component mounting system capable of concurrently, efficiently subjecting a plurality of substrates to component mounting operation and accomplishing both high productivity and a capability of addressing production of multiple products. An electronic component mounting system is configured by arranging, on an upstream side of a component loading unit having a plurality of substrate conveyance mechanisms, a screen printer M2 having a plurality of individual printing mechanisms and a coating and inspection machine M4 that applies a coat of a resin for use in boding an electronic component and that inspects a coated state. The coating and inspection machine M4 is equipped with a coating head 15 that performs operation for coating substrates conveyed by substrate conveyance mechanisms 12A and 12B from the screen printer M2 with the resin and an inspection head 16 that performs pre-coating inspection and post-coating inspection.
    Type: Grant
    Filed: September 29, 2009
    Date of Patent: March 26, 2013
    Assignee: Panasonic Corporation
    Inventor: Kazuhide Nagao
  • Publication number: 20130052770
    Abstract: A method of assembling a matrix of photovoltaic cells includes positioning photovoltaic cells in a desired orientation, aligning the row of photovoltaic cells relative to each other, and enabling a homogeneous downward pressure on the row of photovoltaic cells to facilitate electrical and mechanical connectivity between the photovoltaic cells.
    Type: Application
    Filed: August 31, 2011
    Publication date: February 28, 2013
    Applicant: ALTA DEVICES, INC.
    Inventors: Joseph O. DeAngelo, Sara Kieu Lesperance, Kasiraman Krishnan
  • Patent number: 8365385
    Abstract: There is provided a work processing apparatus including a plurality of work conveyance lines on which works are to be moved, a stopping unit to stop a work in a predetermined processing position on each of the work conveyance lines, a processing unit to make a desired process on the work stopped by the stopping unit, and a moving unit to move the processing unit between the work conveyance lines. Works are sequentially processed on the plurality of work conveyance lines. While a work is being processed in the processing position on one of the work conveyance lines, another work can be carried in to the other work conveyance line. Therefore, immediately after a work is completely processed on the one work conveyance line, processing of another work can be started. As a result, the production rate is higher and the apparatus can be designed smaller in size.
    Type: Grant
    Filed: December 6, 2006
    Date of Patent: February 5, 2013
    Assignee: Musashi Engineering, Inc.
    Inventor: Kazumasa Ikushima
  • Patent number: 8359735
    Abstract: A head assembly for a chip mounter is provided. The head assembly includes a nozzle module disposed above a printed circuit board (PCB) and configured to pick up and move an electronic component to mount the electronic component on the PCB, and a component recognition module electrically connected to the nozzle module and configured to recognize presence of the electronic component, a distance between the PCB and the nozzle module, and alignment of the electronic component at least one given moving position of the electronic component.
    Type: Grant
    Filed: April 16, 2010
    Date of Patent: January 29, 2013
    Assignee: Samsung Techwin Co., Ltd.
    Inventors: Jong-Eok Ban, Seong-Ku Kim
  • Patent number: 8356401
    Abstract: An electrical cable wiring head apparatus is provided to rapidly wire an electrical cable while more effectively restraining the electrical cable from floating. An electrical cable wiring head device of the electrical cable wiring head apparatus moves along a wiring surface of a wiring plate to wire an electrical cable on the wiring surface. The electrical cable wiring head device comprises: a head section supported rotatably about a rotary axis and provided with a guide recess for leading the electrical cable to the wiring surface, the guide recess being offset from the rotary axis; a head rotating mechanism for rotating the head section; a guide pushing member including a shaft portion and a roller portion provided rotatably on a distal end of the shaft portion, the guide pushing member being supported movably along the rotary axis; and a guide pushing member drive mechanism for reciprocating the guide pushing member.
    Type: Grant
    Filed: July 23, 2010
    Date of Patent: January 22, 2013
    Assignee: Sumitomo Wiring Systems, Ltd.
    Inventors: Noriyuki Tani, Akinori Ooishi
  • Patent number: 8336197
    Abstract: A tool is for attaching a coaxial cable connector to a coaxial cable by longitudinal compression of the coaxial cable connector. The tool includes a tool body defining therein a connector compression chamber and a plunger receiving chamber longitudinally adjacent thereto. A plunger having a plunger head is within the plunger receiving chamber and a plunger shaft extends outwardly therefrom, the plunger having a bore to receive an end of an inner conductor of the coaxial cable. A handle carried by the tool body is movable from a retracted position to a compressed position for driving the plunger head to longitudinally compress the coaxial cable connector within the connector compression chamber to attach the coaxial cable connector to the coaxial cable. A seating indicator is carried by the bore for contacting the inner conductor of the coaxial cable to indicate seating of the coaxial cable into the coaxial cable connector.
    Type: Grant
    Filed: January 26, 2009
    Date of Patent: December 25, 2012
    Assignee: Andrew, LLC
    Inventor: David Jones
  • Patent number: 8327530
    Abstract: An installation (1) for continuous application of thermally or electrically insulating material (6) around an elongate element (2) having a generally circular cross-section. The installation includes a forcing device (3), in form of a conical tube into which the element (2) is fed simultaneously at the large base end of the conical tube, a sheet (4), on which the insulating material (6) is placed, means for translation of the element through a circular section (2) of the sheet (4), and a device (7) for depositing of insulating material onto the sheet. Such an installation produces thermally insulated tubes or electrically insulated cables.
    Type: Grant
    Filed: September 22, 2009
    Date of Patent: December 11, 2012
    Assignees: Majus, ITP SA
    Inventors: Jean-Aurélien Damour, Philippe Marchal, Pierre Ollier, Guillaume Richard
  • Patent number: 8327529
    Abstract: An assembly tool is provided. The assembly tool comprises a body, a first vacuum channel defined within the body, and a first locating pin attached to the body. The first locating pin has a shaft portion arranged within a surrounding portion of the body. The first locating pin is configured to engage a first alignment feature of a hard drive component at a first contact area to align the hard drive component with the assembly tool. The body is configured to couple the first vacuum channel to a vacuum source and to facilitate particle evacuation from the first contact area via the first vacuum channel when a vacuum is applied by the vacuum source.
    Type: Grant
    Filed: June 4, 2010
    Date of Patent: December 11, 2012
    Assignee: Western Digital Technologies, Inc.
    Inventors: Jit Han Tan, Wai Khuen Yee
  • Patent number: 8307537
    Abstract: A method of using a tooling mandrel for assembling a disk drive is described. The method includes providing a head stack assembly including a shaft with an engagement feature, and providing the tooling mandrel including two tooling fingers, one of which is movable. The movable tooling finger is moved between a first configuration in which respective distal tips of the tooling fingers are insertable into and removable from the engagement feature and a second configuration in which the distal tips engage the engagement feature. The tooling mandrel further includes a tooling finger spreader coupled to the movable tooling finger to selectively move the movable tooling finger between the first and second configurations. The method further includes locating the distal tips at least partially within the engagement feature with the tooling fingers in the first configuration, and moving the movable tooling finger to the second configuration to engage the shaft.
    Type: Grant
    Filed: January 14, 2009
    Date of Patent: November 13, 2012
    Assignee: Western Digital Technologies, Inc.
    Inventors: Andrew S. Klassen, Robert E. Lloyd, Jr.
  • Patent number: 8296934
    Abstract: A bonding apparatus includes a frame, a first feeding mechanism, a second feeding mechanism, and a bonding mechanism. The first feeding mechanism is mounted on the frame and includes a turntable capable of rotating relative to the frame. A plurality of workpiece seats are arranged on the turntable. Each workpiece seat defines a plurality of first air holes. The second feeding mechanism is mounted on the frame and includes a first carrier and a second carrier. The first carrier includes a plurality of holding seats and the second carrier including a plurality of temporary holding seats. The first carrier is capable of rotating to stack on the second carrier. Each of the holding seats defines a plurality of second air holes. The bonding mechanism is movably mounted on the frame to correspond to the workpiece seats or the second carrier.
    Type: Grant
    Filed: June 30, 2009
    Date of Patent: October 30, 2012
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Dong-Sheng Lin, Tzyy-Chyi Tsai, Jia-Jie Chen
  • Patent number: 8281483
    Abstract: An align fixture for aligning an electronic component having a receptacle adapted to receive the electronic component, the receptacle having a first abutting section and a second abutting section, the align fixture further having an elastic unit, one of the first abutting section and the second abutting section is flexibly mounted via the elastic unit, and the other one of the first abutting section and the second abutting section is fixedly mounted; the first abutting section and the second abutting section each form a stiff member and are adapted to engage the electronic component, the elastic unit is adapted to exert two force components on one of the first abutting section and the second abutting section, the force components being angled relatively to one another.
    Type: Grant
    Filed: August 17, 2010
    Date of Patent: October 9, 2012
    Assignee: Multitest Elektronische Systeme GmbH
    Inventors: Thomas Hofmann, Johann Poetzinger, Necati Efe Varol