Abstract: A tool for extracting or inserting a connector into a connector receptacle includes a tool body having an elongated shape with a first end and a second end. The first end is adapted to engage and stabilize the connector.

Abstract: The present invention relates to an insulation stripping device for the partial removal of a cable insulation, comprising at least one electrically conductive blade (100) for cutting through the cable insulation, and to an adjustment means for use with an insulation stripping device of this type. The present invention further relates to a method for finishing cables and to an adjustment method for adjusting a blade (100) position in an insulation stripping device. According to the present invention, the insulation stripping device comprises a capacitive sensor unit, which is connected to the conductive blade (100) and is formed in such a way as to emit an output signal if the conductive blade (100) contacts a electrical conductor (104) of the cable.

Abstract: A tip linearly moved with a spot welding gun is engaged with a meshing piece and a clamping piece of a holder part, and further linear movement of the tip releases engagement of a ball plunger interposed between a base plate and a movable plate and causes the tip to be held in a sandwiched manner. Linear movement of the tip thereafter accompanied by movement in an up direction or a down direction causes the holder part to rotate the tip while holding the tip and to detach the tip from the spot welding gun. Since a long hole through which a shaft set upright in the base plate is inserted with a sufficient gap is formed in the movable plate, the movable plate and the holder part as a whole make a motion accompanied by rotation when the tip makes the linear movement accompanied by the movement in the up direction or the down direction. Consequently, the holder part can rotate the tip while holding the tip.

Abstract: Apparatus and methods for removing components from a circuit board. A conveyor transports circuit boards having components attached with solder through a heating section. When the solder has been melted by application of electromagnetic radiation, the circuit board is subjected to mechanical forces that dislodge the components to be removed from the circuit board. In one embodiment, the electromagnetic radiation is supplied by heaters operating at color temperatures in the vicinity of 973 Kelvin. The components are recovered in a form that allows their reuse.

Abstract: A plurality of reference electronic components (M1, M2) marked in advance are identified and recognized, and the positions of the plurality of the reference electronic components (M1, M2) positioned in the vicinity of an electronic component to be taken out (2a) and component arrangement information in a wafer mapping file (MF) stored in a storage device (11f) are used to calculate the position of the electronic component to be taken out (2a).

Abstract: A method for uncoupling an interference shield from a circuit board is provided. The method includes providing a circuit board including a surface mounted component and an interference shield configured to provide shielding of the surface mounted component. The interference shield is coupled to the circuit board by a joint. Heating of the joint is effected by induction heating such that the interference shield becomes configured for displacement relative to the circuit board in response to application of a mechanical force. An apparatus for effecting the uncoupling is also provided.

Abstract: A die push-up apparatus using a vertically movable die pick-up member 22 for die-peeling, the die pick-up member 22 which pushes dies upward being disposed inside a suction holding stage 10 further toward a die feeding direction side than a die push-up member 21 for die-pickup. With the die push-up member 22 lowered, the forward end portion (with respect to the die feeding direction) of a die 1A that is to be picked up is moved to above the die push-up member 22, the die push-up member 22 is next raised so that the forward end portion of the die 1A passing thereon is peeled from the wafer sheet 2; and further with the die push-up member 22 raised, the die 1A is fed to the pickup center 5 and is picked up by a collet 4 and the rising die push-up member 21.

Abstract: An apparatus and method are provided for detaching a die from an adhesive film, the apparatus comprising a vacuum platform having a surface configured to support a part of the adhesive film on which the die is attached. A plurality of pre-peeling columns having substantially flat contact surfaces are projectable relative to the surface of the vacuum platform to push against the adhesive film at the position of the die to generate initial peeling between the die and the adhesive film. Thereafter, a plurality of ejector pins that are positionable relative to the pre-peeling columns are operative to push against the adhesive film at the position of the die to generate further peeling between the die and the adhesive film. The die is then removed from the adhesive film.

Abstract: An apparatus (1, 2, 20) and method are provided for separating a length of twisted pair cable (10) into its constituent individual insulated wire conductors (11, 12) for subsequent use in telecommunications networks or other electrical equipment. The apparatus (1, 2, 20) includes a separator (15, 66) adapted for insertion between the individual insulated wire conductors (11, 12) constituting the twisted pair cable (10). Cable drive means are provided to cause displacement of the length of twisted pair cable (10) relative to the inserted separator (15, 66) in a direction (a, b) co-incident with the axis of the twisted pair cable (10). In addition to separating the insulated wire conductors (11, 12), the driving (a, b) of the twisted wire cable (10) past the separator (15, 66) also causes plastic deformation of the individual insulated wire conductors (11, 12) thus preventing them from springing back into their initial wound state.

Abstract: An apparatus for removal of a disk in a disk stack. The apparatus includes a shaft. The shaft has an end portion insertable into a disk remover tool. The shaft has a positioning portion at an end of the shaft opposite the insertable end portion. The positioning portion includes a surface de-tensionizer. The surface de-tensionizer provides disengagement of surface tension between the disk and a disk spacer during a disk removal process performed thereon.

Abstract: An apparatus for and a method of detaching a semiconductor chip from a tape minimize the likelihood that the semiconductor chip will crack. The apparatus includes a holder, a first ejector having an upper end, and a second ejector whose upper end is disposed centrally of that of the first ejector. The holder has an upper portion and a through-hole extending through the upper portion. The ejectors have upper ends that are extendable and retractable out of and back into the holder via the through-hole in the upper portion of the holder. A tape to which at least one semiconductor chip is attached is set against the upper portion of the holder. The first ejector is extended a first distance from the holder to push the semiconductor chip upward. The second ejector is extended from the holder by a second distance larger than the first distance so as to push the semiconductor chip further upward. Thus, the tape is progressively detached from the semiconductor chip.

Abstract: A specialized tool is provided for the removal of components in a microwave module in which a fixed tool having a channeled tip is positioned adjacent the component to be removed, with hot gas from the channeled tip melting the epoxy or solder and with the module forced against the fixed tool to remove it.

Abstract: A micromachine successfully reduced in parasitic capacity between input and output electrodes, and having an oscillator configured as ensuring a high S/N ratio under operation at higher frequencies is disclosed. The micromachine comprises an insulating layer formed on a substrate; a first electrode for signal input formed on the insulating layer; a second electrode for signal output formed on the insulating layer; and an oscillator electrode formed as being opposed with the first electrode and the second electrode and as being spaced therefrom by an air gap, wherein the insulating layer has a groove formed therein at least between the first electrode and the second electrode.

Abstract: A device for switching stator sections that are arranged on both sides of a guideway, for instance of a magnetic levitation railway system. In order for the device to be installed in as independent a manner as possible, the separately installed switching stations comprise not more than three switchboard sections each and are associated with only one stator section. The switching sections are therefore more compact and less heavy.

Abstract: The present invention provides an apparatus for releasing a support plate and wafer chips from each other. A wafer 5 supported on a support plate using an adhesive 3 has been divided into a plurality of wafer chips so that wafer grooves 23 are formed. In a receiving part that is defined by a peripheral wall 18 in a porous plate 10 and that is for receiving porous portions 17, the wafer chips 5 and a support plate 1 are suctioned and held via the suction by suction pipes 12 in the porous plate 10 via suction ports 15, grooves 21, communicating cutouts 22, and the porous portions 17. A release agent supplied from the external environment is guided to the wafer grooves 23 formed between a plurality of wafer chips 5? in order to contact and dissolve the adhesive agent 3.

Abstract: The invention relates to a method for applying an electronic component (24), which is provided with terminal faces (34, 35), to a substrate (33), which is provided with terminal faces (31, 32), wherein the component is removed from a feeding device by means of an application device (27), the component is subsequently positioned on the substrate by means of the application device in such a manner that the component terminal faces extending from a contact side (37) of the component up to a component rear side (38) and the substrate terminal faces are in an overlapping position and the terminal faces are subsequently contacted by means of a direct application of laser energy to the component terminal faces.

Abstract: Side rail removal apparatus and method for removal of side rails are provided. The side rail removal apparatus includes a side rail removal assembly, side rail removal pins, a turn-table, and upper and lower holders for the removal pins. Hence, the user can remove the side rails of UV tape without causing scratching to an IC package.

Abstract: A method and apparatus which quickly clamps onto the copper strand bundle in the slot of a dynamoelectric machine and rips out the coil from the slot one axial position at a time. As the copper bundle is ripped from the slot the tooling moves along the slot from one end to the other.

Abstract: A tool is designed to be attached to an actuator having a rotary fulcrum and heads on a tip end opposite to the rotary fulcrum. The tool includes a finger inserted between a first pair of mutually adjacent suspensions which are provided with heads having mutually opposing scanning surfaces, and a partitioning plate inserted between a second pair of mutually adjacent suspensions which are provided with heads having mutually opposing back surfaces that are on opposite ends from the scanning surfaces.

Abstract: An exemplary automatic disassembly machine is used for detaching a cover from a main body of a portable electronic device. The cover defines a hole therein. The automatic disassembly machine includes a holder, a mechanical hand, a power source, and a controller. The mechanical hand is fixed on the holder. The mechanical hand has an inserting element, and a positioning element. The inserting element is configured for inserting into the hole of the cover and lifting the cover up from the portable electronic device. The positioning element is configured for positioning the cover. The power source connects to the mechanical hand for driving the mechanical hand. The controller connects to the mechanical hand and the power source for respectively controlling the positioning element and the inserting element to detach the cover from the portable electronic device.

Abstract: A package removal device is for removing a package (5) from a component band (1) to expose a carrier band (2). The package removal device includes a stand (10), a first scrolling unit includes a first gear (52), and a second scrolling unit includes a second gear (85). The stand includes a platform (12) with an import end (14a) and an export end (14b). The export end includes a locating gear (18) mounted thereon, a first exit (24), and a second exit (22). The component band is separated into the package and the carrier band in the export end. The first gear meshes with the second gear to output the package from the first exit. The locating gear engages the carrier band to output the carrier band from the second exit.

Abstract: A method of separating a structure including a fragile zone delimiting two substructures to be separated, where at least one plane blade is advanced in a separation plane corresponding to a median plane of the fragile zone, from an entry edge of the structure in a direction of advance toward an exit edge of the structure, so as to cause progressive separation of the two substructures, and where the inclination of the blade in the separation plane is varied relative to the direction of advance.

Abstract: A removing apparatus, for removing an electrical connector from a PCB, comprises a base, a pulling member, a pair of opposite clipping members, a lower supporting member and at least one resilient member. The base includes a main body having a top surface. The pulling member connects to the base to be operated to bring the base up and down. The two clipping members pivotally mount to the base, and each of the clipping members has a fixing portion and a latch extending downwardly from the fixing portion for hooking the electrical connector. The lower supporting member mounts below the base and includes a plate substantially paralleling to the main body of the base. The resilient member located between the base and the lower supporting member so as the base can move downwardly relative to the supporting base. When the base moves downwardly, the latch of the clipping member can engage with the electrical connector and pick it up from the PCB when the base moves back.

Abstract: A method for remanufacturing an electronic assembly allows the assembly to be disassembled, tested and reassembled despite certain components being permanently affixed to a housing of the assembly. The electronic assembly includes a circuit assembly within the housing. During remanufacture, a first portion of the housing is removed to expose a first side of the circuit assembly and a second portion of the housing is removed to expose a second side of the circuit assembly. When removing the second portion of the housing, one of the components of the circuit assembly may also be removed. During remanufacture a connector assembly including a replacement component substantially similar to the removed component, and including one or more pins connected to the replacement component and situated to mate with one or more empty sockets of the circuit assembly is used to facilitate testing of the assembly.

Abstract: The present invention provides a wiring board including a first board provided with a first wiring pattern and a second board provided with a second wiring pattern while the first wiring pattern and the second wiring pattern are electrically connected, wherein the first board includes: a board insertion opening in which the second board is inserted; and a first connection pattern provided inside the board insertion opening and electrically connected to the first wiring pattern, and the second board includes: an inserting portion to be inserted into the board insertion opening of the first board; and a second connection pattern provided at a position opposed to the first connection pattern and electrically connected to the second wiring pattern in the case where the inserting portion of the second board is inserted into the board insertion opening of the first board, and further comprising: solder or brazing filler metal applied at least to a surface of one of the first connection pattern and second connection

Abstract: Embodiments of the present invention help to prevent deformation of a gimbal in detaching a head slider from a suspension. In an embodiment of the present invention, after a head slider has been mounted on a suspension, a test on the assembly is conducted. If a defect head slider is found in the test, the head slider is detached from the suspension. The head slider is discarded but the suspension is reused and a new head slider is mounted on the suspension. In detaching the head slider, a pin inserted in a through-hole on the center line of a gimbal tongue latches the gimbal tongue.

Abstract: A method is provided for removing a component from a medium. The method includes applying an adhesive to a portion of a component. An attachment member is inserted into the portion of the component. The attachment member is pulled with a pulling element in a direction opposite a medium in which the component is inserted.

Abstract: An assembly and disassembly device for a display monitor and a method are disclosed. The assembly and disassembly device of the present invention is used to assemble the display monitor to a seat and to disassemble the display monitor from the seat body. The assembly and disassembly device of the present invention comprises a lockup portion connected to the seat body and a framework portion connected to the display monitor. The lockup portion has at least a locking body, and the framework portion has a connecting body. The fastening body has an opening and a guiding slot, and the opening is connected with the guiding slot. When the locking body moves from the opening to the guiding slot, the lockup portion can be securely fastened to the framework portion, thereby installing the display monitor to the seat body.

Abstract: A system for removing connector pins from a backplane comprises at least two clamp plates and a plurality of pin plates coupled between the clamp plates, the pin plates configured to be positioned between adjacent rows of the connector pins. The system further comprises a tightening mechanism to tighten the clamp plates and the pin plates around the connector pins. In some embodiments, the system comprises a frame assembly configured to be positioned over the clamp plates, and configured to pull the clamp plates, the pin plates, and the connector pins off of the circuit board.

Abstract: A novel device and method for repairing MEMS systems, including probe cards for use in semiconductor testing is disclosed. In one embodiment, a probe card for use with a diagnostic computer for testing semiconductor wafers comprises a substrate, a plurality of operational probes connected to the substrate, wherein the plurality of operational probes are adapted to make an electrical connection with the diagnostic computer and a plurality of replacement probes connected to the substrate, wherein the plurality of operational probes and the plurality of replacement probes are constructed in substantially the same manufacturing process. Also disclosed is a novel probe card that can be repaired.

Abstract: Embodiments of lighting assemblies disclosed herein are particularly designed for installation in display units to more effectively distribute light towards, and thereby better illuminate, the products housed in the display unit. The lighting assemblies include at least one, but preferably a plurality of, light emitting diodes mounted on a frame. The frame is preferably formed so as to have a number of mounting arms on which to mount the LEDs. In this way, the LEDs can be positioned on the arms and their emitted light can be directed to focus on different aspects of the display unit (i.e., the products housed in the unit, banners or advertisements on the unit, etc.). The lighting assemblies may include, but do not have to include, various optical features to enhance the distribution of light emitted from the LEDs, including, but not limited to, lenses, reflectors, etc.

Abstract: A detachment jig is placed on a printed circuit board. Advancement of an inclined surface of the detachment jig is received on a solder bump of solid state disposed between the printed circuit board and an integrated circuit chip package. The solder bump melts to remove restraint to the advancement of the inclined surface, so that the inclined surface advances into a space between the printed circuit board and the chip package in response to the melt of the solder bump. A force to lift the chip package in the direction perpendicular to the surface of the printed circuit board acts on the chip package after the solder bump has completely melted down. Detachment of an electrically conductive pad is thus reliably prevented on the printed circuit board. The chip package can solely be removed without inducing detachment of the electrically conductive pad on the printed circuit board.

Abstract: The present invention springs from the discovery that mild acids could be utilized to shear undesired metals away from desired precious metals that have been plated onto circuit board runners or contacts. This shearing action occurs at a high rate when metal scrap segments are immersed in mild acid and excited by application of an electromagnetic field at specific frequencies and power levels. These frequencies and power levels are based on the end metal desired and the metals contained in the scrap and the acid utilized. When mild acid saturated with copper sulfate and loaded with scrap metals is subjected to an electromagnetic field at the appropriate frequency and power levels, copper and nickel molecules are sheared rapidly and absorbed into solution, leaving only the desired metal, such as gold, in a 99.5% pure flake which can be skimmed off the surface of the solution or filtered from the solution.

Abstract: The invention relates to a method for separating electronic components, comprising the processing steps of placing an assembly of electronic components on a manipulator, transporting the electronic components with the manipulator along a first cutting tool such that the assembly is cut through only partially along cutting lines in the thickness direction thereof, and transporting the partially severed assembly with a manipulator along a second cutting tool such that the cutting lines are severed almost completely. The invention also relates to a device for separating electronic components, and to a separated electronic component obtainable with the method.

Abstract: A peel-off device for an electronic-part delivery system has a front end portion and a recess that is indented inwardly from the front end portion, that is formed through upper and lower surfaces of the front end portion and that has a width larger than that of an electronic part of predetermined specification.

Abstract: Disclosed is an apparatus for separating interconnects between, for example, a card and a substrate. The apparatus includes one or more rotationally biased (e.g., spring-loaded, etc.) partial-circle structures (e.g., blades, squeegee, plow, etc.) and one or more temperature-sensitive releases connected to the partial-circle structures. The partial-circle structures are positioned to rotate and separate the interconnects when released by the temperature-sensitive releases. The invention can also include solder reservoirs positioned to receive solder from the interconnects separated by the partial-circle structures.

Abstract: A system and apparatus that removes and collects non-functional wire assemblies from dicorotron units is described. It has a removal tool mounted on the top of a storage box. The removal tool has an open top and bottom, the open bottom is aligned with an opening in the top of the box to permit a dislodged wire assembly to fall therethrough.

Abstract: A method for separating a metal-resin joint including the steps of: (1) immersing an article including a metal-resin joint with a counter electrode in an alkaline solution; and (2) applying a voltage over a certain time period between the metal portion of the joint and the counter electrode such that the potential of the metal portion is lower than that of a standard hydrogen electrode.

Abstract: A process for changing an anode of a cell for the production of aluminum by fused bath electrolysis including a plurality of anodes. According to the invention, an anode handling tool is used including a positioning device, a gripping device and a sensor detecting the vertical position of the gripping device, and the position sensor is used to measure the vertical distances traveled by the gripping device with respect to a reference level N. At least one sound or electromagnetic waves beam is then produced in a determined reference line or plane and the passage of the anode in the beam is used to measure the distances. The vertical position of the replacement anode in the cell is determined starting from the values obtained for the traveled distances and the replacement anode is put into this position in the place initially occupied by the spent anode.

Abstract: The inventions presented herein provide an armor forming tool for use with an armor forming machine. The machine feeds a continuous strip of metal to a sub-assembly of a cable so as to wrap the continuous strip around the sub-assembly. The tool applies appropriate pressures to the wrapped continuous strip to form an interlocked armor.

Abstract: A method and apparatus are provided for removing a component from a medium, where the apparatus includes an attachment member insertable into a portion of a component, an amount of adhesive for adhering the attachment member to the component, and a pulling element. The method includes pulling, with the pulling element, the attachment member in a direction opposite a medium in which the component is inserted.

Abstract: Methods and systems for processing semiconductor workpieces are disclosed herein. In one embodiment, a method for processing a semiconductor workpiece includes releasably attaching a plurality of microelectronic dies to a first side of a releasable film, and at least partially detaching one of the dies from the releasable film by pivoting a contact member with a surface of the contact member pressing against a second side of the releasable film.

Abstract: Tooling fixtures and methods are described for securing a solid-matrix panel for cutting. In one embodiment, a tooling fixture includes a first clamping system and a second clamping system. The first clamping system receives a solid-matrix panel of PCBs and secures the solid-matrix panel for cutting of the solid-matrix panel along a first axis. Once secured, a cutting apparatus cuts the solid-matrix panel along the first axis between the PCBs to cut the solid-matrix panel into a plurality of strips. The second clamping system then moves into a position relative to the strips of the solid-matrix panel and secures the strips for cutting of the strips along a second axis. When secured by the second clamping system, the cutting apparatus cuts the individual PCBs from the strips.

Abstract: An electronic device with a reworkable electronic component, a method of manufacturing the electronic device, and a method of reworking the electronic component are disclosed. The electronic device includes a first cavity provided in a board body. A first metal pattern is provided on the board body and adjacent to the first cavity. A first electronic component is provided in the first cavity. A first connection pattern is provided adjacent to an upper edge portion of the first electronic component and extends to the first metal pattern so that the first metal pattern is electrically connected to the first electronic component.

Abstract: A connector insertion and removal tool for an electrical system including a circuit board and at least one electrical connector therefor includes a first portion configured for coupling to a first surface of the circuit board, and a second portion configured for coupling to the first portion. At least one of the first portion and the second portion comprises an actuator adapted for movement toward and away from the circuit board to contact at least a portion of the connector.

Abstract: Provided are a thin semiconductor chip pickup apparatus and method for detaching a die bonding film from a semiconductor chip using the apparatus. The apparatus may include a stage for supporting a die-bonding film to which a semiconductor chip is attached, a plurality of suction members arranged on the center of the stage for extracting the die-bonding film by a vacuum, where the suction members detach the die-bonding film away from the semiconductor chip to form a vacuum region, and a plurality of vacuum suction ports respectively interposed between adjacent suction members to allow the suction members to detach the die-bonding film by the vacuum.

Abstract: An apparatus and method are provided for detaching a die from an adhesive film, the apparatus comprising a vacuum platform having a surface configured to support a part of the adhesive film on which the die is attached. A plurality of pre-peeling columns having substantially flat contact surfaces are projectable relative to the surface of the vacuum platform to push against the adhesive film at the position of the die to generate initial peeling between the die and the adhesive film. Thereafter, a plurality of ejector pins that are positionable relative to the pre-peeling columns are operative to push against the adhesive film at the position of the die to generate further peeling between the die and the adhesive film. The die is then removed from the adhesive film.

Abstract: A press-connecting head of a pair of press-connecting pliers for connecting a coaxial terminal, it is composed of an inserting/retracting member and two pressing dies respectively provided on two mutually opposite sides of the inserting/retracting member; wherein the inserting/retracting member is assembled with the press-connecting pliers by an inserting mode, hence by a simple action of inserting/retracting, different pressing dies of the same press-connecting head can be mutually changed to be exactly aligned with a fixed block, or the press-connecting head can be changed for another one with pressing dies of other specifications. And then the press-connecting pliers using the press-connecting head structure can allow execution of press-connecting operation of the coaxial terminals of different specifications with a coaxial signal line; thus the range of application of the press-connecting pliers can be enlarged.

Abstract: The method for resolving the stator having a coil disposed in the slots provided around an inner circumferential face of a cylindrical iron core and having an opening portion includes a step of enlarging the opening portion of the slot, and a step of extracting the coil from the slot.

Abstract: An electronic parts removing apparatus removes an electronic part from a board. The electronic part is mounted on a board using a thermally-meltable joining material. A holding member is configured to be brought into contact with the electronic parts. A melting apparatus melts the thermally-meltable joining material. A movement detecting part detects a movement of the electronic part. A load applying mechanism applies a load to the electronic part. A drive mechanism moves the holding member in a direction in which the holding member separates from the board. A control part drives the drive mechanism when the movement detecting part detects the movement of the electronic part so as to cause the holding member to move the electronic part in the direction in which the electronic part separates from the board.