Abstract: The invention is related to a kind of a PCB unloading mechanism, consisting of a floating plate and a moving mechanism attached between a fixing plate and a bed. On both sides of the floating plate insets a bushing, allowing the floating plate to move on a guiding shaft fixed between the fixing plate and the bed. The floating plate moves up and down through the control of the moving mechanism fixed on top of the fixing plate. Moreover, a plurality of ejecting pins are embedded on the surface of the floating plate. The ejecting pins can pass through the corresponding holes on the bed and the template for displacement, allowing the PCB to be released from the fixedness and complete the unloading operation smoothly so as to ensure the accuracy of the positioning for the next processed PCB.

Abstract: A method for separating an encoder shaft of an angle encoder from a drive shaft, which are axially aligned with each other along an axial direction and are self-lockingly braced on each other by a press fit along the axial direction and a central fastening screw, which connects the encoder shaft and the drive shaft in the axial direction. A head of the fastening screw rests against an end of a bore of the encoder shaft, which receives a shank of the fastening screw, and a thread of the fastening screw is screwed into an internal screw thread of the drive shaft for bracing the encoder shaft and the drive shaft. The method includes partially turning the fastening screw out of the internal screw thread of the drive shaft and canceling the press fit by generating an axially oriented force acting between the head of the fastening screw and an end of the encoder shaft opposite the press fit.

Abstract: A pin grid array insertion and extraction tool is disclosed that is used to both insert and extract pin grid array connectors. The tool comprises a rigid window frame defined by bars connected to handles wherein the bars define straight slots and ramped slots on an elongated side that engage tabs and sliders of a header and socket of a pin grid array connector. The ramped slots are used to generate mechanical advantage and bring the insertion force seen by an operator's hand down to reasonable levels when engaging or disengaging connector pins to or from their mating receptacles. By using ramped slots the insertion and extraction tool can be made very compact in almost every dimension.

Abstract: A waste fluorescent lamp dismantling method and apparatus is set up to clamp two ends of a waste fluorescent lamp adjacent to its aluminum caps, and to maintain an airtight seal between the clamp sections and the aluminum caps, so that when the aluminum caps at two ends are separated from the waste fluorescent lamp, the gas and vapor in the lamp tube will be prevented from escaping. This apparatus and method can rapidly process waste fluorescent lamps while also conforming to environmental protection requirements.

Abstract: A flash circuit board in a lens-fitted photo film unit includes a board part, and a battery contact part connected to the board part by solder. A part exchanging apparatus for the circuit board includes an eliminating unit, which melts the solder, and removes the battery contact part from the board part while the solder is melted. An assembling unit mounts an unused battery contact part on the board part. The unused battery contact part has an unused form of the first battery contact part. A soldering unit connects the unused battery contact part to the board part by use of solder.

Abstract: A tool for disengaging electrical connectors includes a central body section with disconnecting prongs projecting from the opposite ends thereof. The prongs are offset relative to the plane of the body section but extend in the same direction so that one set of the prongs forms an arcuate surface which facilitates the use of the prongs to disengage connector sections.

Abstract: A tool is described for the backside removal of single pins from a high pin density connector, either from the connector itself or a connector with pins such as compliant pins mounted in plated through vias on a host such as a printed circuit board. A pin is driven from a connector by advancing a sleeve portion to surround the pin and subsequently pushing the pin from the connector using a shaft with a spherical, concave end surface, whereby the pin is radially confined by the sleeve and aligned and driven by the shaft as it is advanced through the sleeve. Where the connector is mounted on a printed circuit board with the pin resident in a plated through via, the sleeve is aligned with and abutting the printed circuit board at the via opening and the shaft is thereafter advanced through and beyond the sleeve to engage, align and drive the pin with the via wall providing radial confinement.

Abstract: An apparatus and a method for separating a cull from a molded part including a chip mounted on a tape circuit board are provided. The apparatus includes a cull support block for supporting a cull and a cull holder for clamping the cull. The cull holder is disposed above the cull support block. The apparatus further includes a frame support block for mounting a molded part and a frame holder for pressing the molded part against the frame support block to fix the molded part thereon. The frame support block is hinged on a first axis near the cull support block. The frame holder is hinged on a second axis near the cull support block. The apparatus also includes a pressing means configured to move downward against a distal end of the frame holder to cause the frame support block and the frame holder to rotate about the first and second axes, respectively, to separate the cull from the molded part.

Abstract: Method and apparatus for extracting a fiber from connector. In accordance with our method the extraction does not compromise any failure evidence located within the ferrule of the fiber connector. The method comprises the steps of metallic etching, followed by adhesive etching, and a final step of heating and applying a load to the ferrule and/or fiber.

Abstract: A method of removing an optical device contained within a device package from a circuit board, wherein the device package is secured to the circuit board using an adhesive pad. The method includes peeling a portion of the adhesive pad away from the circuit board, inserting an optical removal tool between the optical device and the circuit board, wherein the optical removal tool has a pair of fork portions and a cavity positioned between the fork portions, and the fork portions straddle one or more leads on the optical device during the inserting step, and prying the remainder of the adhesive pad away from the circuit board using the optical device removal tool.

Abstract: Devices and methods for releasing an integrated circuit from its container are provided. The devices include a handle portion and a gripping portion. The gripping portion has one or more notches that are used to engage an integrated circuit container pin. In one aspect, the gripping portion is used to engage the container pin, and downward pressure is applied to the handle portion to remove the pin. In another aspect, the gripping portion is used to engage the container pin, and the handle portion is twisted to remove the pin.

Abstract: An apparatus and method for separating a semiconductor die (303) from an adhesive tape (32) are disclosed. The apparatus includes a blade (34) mechanically coupled to a blade holder (36), wherein the blade (34) is inclined relative to the primary surface of the semiconductor die (303). The method further comprises lifting the semiconductor die (303) while it is attached to the adhesive tape (32) to assist disengagement. The blade (34) facilitates peeling of the semiconductor die (303) from the adhesive tape (32) while distributing stress exerted on the semiconductor die (303) over a larger surface area resulting in reduced die fractures (20).

Abstract: A method of removing stators from tubular stator housings involving subjecting a tubular stator housing having an interior surface to which a worn stator is adhered by adhesive to cryogenic refrigeration until the stator shrinks and pulls away from the interior surface of the tubular stator housing.

Abstract: A method of separating a thin die (20, 60) from a support body (72) of a semiconductor wafer (70). The thin die (20, 60) being initially attached to the support body (72) by an attachment mechanism (78, 178). The attachment mechanism may be a plurality of tethers (78, 178) that extend between the thin die (20, 60) and the support body (72).

Abstract: A removing jig includes a shaft (10) having a first end (11) for abutting a motherboard (60) on which a back plate (50) is mounted and having a second end (12), a stationary hub (25) fixedly mounted on the shaft near the first end, a sliding hub (20) slidably mounted around the shaft between the second end and the stationary hub, and a plurality of claws (30) each including a finger (32) and a rib (33). Each finger has a free end (32a) having a catch (34), and a fixed end (32b) pivotably secured to the sliding hub. One end of each rib is pivotably secured to the stationary hub, and an opposite end is pivotably secured to the finger. When the sliding hub is moved toward the second end, the catches of the claws firmly clasp the back plate and pull the back plate away from the motherboard.

Abstract: A media rework tool for discs and/or a spindle motor carrying a disc pack is disclosed that has a slider plate mounted on a base for lateral movement between a retracted position and an extended position. The slider plate holds a spindle motor with a disc pack mounted on it, and moves between the two positions. The tool includes a gripper assembly having a plurality of opposing arms for grasping predetermined discs within a disc pack on the spindle motor when the slider plate is in the retracted position. The gripper assembly raises the predetermined discs and any intermediate spacer rings upward for temporary storage on a media guide to allow the remainder of the disc pack to be reworked, such as for replacement of a defective disc or spindle motor when the slider plate is laterally moved to the extended position. Following reworking of the remainder of the disc pack, the spindle motor is returned to its centered position relative to the media guide and the gripper assembly.

Abstract: A front side extractor is shown which removes single connector pins from connectors utilizing high pin densities. The tool includes a sleeve that is aligned with a pin to be extracted and advanced to surround the pin. A shaft with a terminal wedge surface is then advanced through the sleeve to wedge the pin against the inner surface of the sleeve and capture the pin, thereby allowing the pin to be extracted as it is retracted, in unison with the tool, away from the connector. To enhance the ability of the tool to capture the pin, the sleeve inner surface is roughened to increase the frictional force retaining the pin against the sleeve wall surface.

Abstract: A terminal extracting tool, which can extract a male type terminal in a female type connector, having a beam member provided at a front end thereof with a lock release pin to abut on a flexible locking piece of a connector housing, a holder slideably receiving the beam member, and an elastic member provided in the holder in a compressed condition to push the beam member rearwardly. The front end of the lock release pin is placed behind a front end surface of the holder. The beam member has juxtapositionally at least two members to slide independently of each other, each pushed rearwardly by respective elastic member. The beam member is provided at a rear area with a grip divided for each member.

Abstract: A circuit board stripper includes a deck having a top pattern plate for supporting circuit boards. The deck defines a plurality of first through-holes and the pattern plate defines a plurality of second through-holes aligned with the first through-holes. A slider is movable under the deck, and has a top face formed with a plurality of slopes under the aligned through-holes of the deck and the pattern plate. A plurality of lifting pins extend upward through the aligned through-holes, and are each formed with a bottom wheel adapted to roll on corresponding one of the slopes of the deck so that the lifting pins are lifted up when the slider is moved in a first direction and are lowered down when the slider is moved in an opposite second direction. Additionally, there is a pneumatic cylinder having a ram for moving the slider in the directions.

Abstract: A tool for removing ball grid array (BGA) packaged integrated circuit or multi-chip modules from printed circuit boards is comprised of a two-tined fork with a heated wire stretched between the tips of the tines and a thin sheet of material filling the area between the tines.

Abstract: A coaxial cable installation tool useful for folding back an exposed portion of grounded shielding on the end of a coaxial cable in preparation for the attachment of the coaxial cable to a coaxial cable connector. In a preferred embodiment, the installation tool includes a handle portion that is adapted to be comfortably grasped by an installer, and a flaring tool recessed within one end of the handle portion. The flaring tool includes a spring-loaded cylindrical flaring rod slidably mounted within a coaxial tubular housing. The flaring rod has a cylindrical receptacle in the leading end thereof, the diameter of the cylindrical receptacle being dimensioned to receive the portion of the coaxial cable underlying the grounded shielding therewithin. The inner diameter of the receptacle permits the snug insertion of a variety of coaxial cable connectors, such as, for example, F-type connectors, thereinto.

Abstract: A welding electrode tip dressing apparatus for grinding a pair of electrode tips mounted on two opposite shanks and for removing the electrode tips when they are spent. The dressing apparatus includes a tip grinding unit and a tip removal unit. The tip grinding unit is provided with a cutter so as to grind the pair of electrode tips. The tip removal unit is provided with a removal mechanism so as to remove the pair of electrode tips from shanks holding the electrode tips. The tip grinding unit and the tip removal unit are arranged side by side in an apparatus body and connected to a drive transmission mechanism connected to and driven by a single drive device.

Abstract: A system and method is provided for opening a sealed engine control module in which the module includes a substrate bent around and sealed to a central housing. In one aspect of the invention, the housing is machined around its perimeter, without damaging the substrate, to expose the sealing bead. The sealing bead is disrupted by cutting a groove in the bead, in one embodiment. The modified module is placed within an opening fixture that supports the substrate against buckling or folding while the substrate is unbent about the housing. In another aspect of the invention, a handling support can be attached to the unbent substrate to prevent buckling or folding while the circuit board supported by the substrate is evaluated or modified, and while the substrate is being transported. A closing fixture is also contemplated that supports the substrate while applying a force to fold or close the substrate about a new housing.

Abstract: A DSX jack assembly removal system, including an apparatus and a method, which includes a jack mount structure with a front end, a rear end, an upper support and a lower support and a jack aperture, a jack adapted to be slidably mounted in the jack aperture defined between the top and bottom supports of the jack mount structure, the jack including a jack body which defines a plurality of plug apertures sized to receive plugs having tip and ring contacts, and a tool aperture in one of the jack mount structure and the jack body, the tool aperture being configured to allow a jack removal tool to be inserted between the jack mount structure and the jack, such that the jack removal tool may utilize the jack mount structure as a fulcrum in removing the jack from the jack mount structure. The tool may be a bantam jack plug, a screw driver or many other prods.

Abstract: An apparatus is provided for constructing a segmented annular permanent magnet from a predetermined number of previously magnetized segments of predetermined shape and size comprising a rotateable carrousel, at least two of a plurality of removable ferromagnetic segments, an introducing means and a removing means.

Abstract: An improved tool for pulling off a rotor of a motor from a shaft or a fan from a shaft, which improved tool is provided with hooked arms that are releasably but securely held at one end in the housing, without the use of retaining clips, so that the arms do not fall off during use or become lost, and so that they do not interfere with the use of the tool when using the securing bolts for pulling off a rotor. The housing of the improved tool of the invention is circular in shape, and in a first version, is provided with a plurality of equally-spaced holes about its circumference, which holes received the hooked ends of the hooked arms, so that various configurations of hooked arms may be provided to best suit the configuration of vanes and type of fan being pulled off a shaft.

Abstract: An automatic rear combination lamp removal system includes a base, a plurality of sliding blocks slidably mounted on the base for moving in four ways on the base, a plurality of fastener removers mounted on the sliding blocks for removing nuts fixing rear combination lamps to a vehicle, and a plurality of lamp holders pivotally mounted to the fastener removers for holding the rear combination lamps.

Abstract: The decapsulating method is for an integrated circuit package and includes the steps of subjecting the encapsulant to electromagnetic radiation, and, more preferably microwave radiation, to break the polymer bonds of the polymer resin and convert the encapsulant to loosened particles. The loosened particles can then be removed to thereby decapsulate the integrated circuit package. The method may further include the step of maintaining the integrated circuit package below a predetermined temperature during the subjecting step. The step of maintaining the temperature below the predetermined temperature may be performed by controlling a power of the electromagnetic radiation, such as based upon sensing a temperature of the integrated circuit package. The method may further comprise the step of varying a frequency of the microwave radiation during the subjecting step.

Abstract: An apparatus and a method for removing a bonded lid from a substrate of variable size including nesting jaws to support and secure the substrate; and gripping jaws to grip the lid; wherein, in operation, the gripping jaws pivot with respect to the nesting jaws and create a, peeling action which separates the lid from the substrate with minimum force and without damage to the substrate or attached semiconductor devices.

Abstract: An apparatus for assembling a disc storage system includes a base having a number of subassemblies. A disc pack subassembly is mounted on the base and is configured to support a disc pack and an actuator subassembly is mounted on the base and is configured to support an actuator assembly. A drive mechanism merges the disc pack subassembly together with the actuator subassembly whereby transducer heads in the actuator subassembly are positioned on disc surfaces of the disc pack. At least one of the subassemblies is releasably mounted to the base and the subassembly can be replaced for assembly differing disc storage systems or upon failure of the subassembly.

Abstract: A tool for reworking a connector attached to an electronic board having a plurality of stacked wafer modules thereon. The tool includes first and second jaws for grasping and removing a selected one of the modules from the board, a holding structure for holding the board, and movement structure for moving the two jaws relative to the holding structure, at least one of the jaws adapted for separating each selected module from a module on each opposing side of the selected module such that removal of the selected module is attained without damage to the separated, adjacent modules.

Abstract: A device is disclosed herein for engaging and disengaging electrical connector halves, particularly electrical connector halves mounted on printed assembly boards that are to be electrically connected to a back plane. The device provides a drive train mechanism comprised of a plurality of gears and racks that, when attached, act to reduce the insertion force required to make the electrical connector halves disposed on the printed board assemblies and the back plane. A further aspect of the present invention involves the method of attaching a back plane to at least one stationary printed board assembly by actuation of a drive train.

Abstract: For the removal of a connector from a printed circuit board (12, 28) wherein the connector consist of a connector housing (14) including contact pins (16) being of the right angle type (bent at an angle of about 90°), whereby a portion of the contact pins include a compliant attachment (press-fit) area by means of which the connector is attached to the board, and wherein use is generally made of a press with a push ram (10) and a table (11) provided with an anvil, whereby the anvil (20) comprises a base portion (22) and an upper hook-shaped portion which is formed as a comb (24) wherein the openings or slots (26) are in register with the position of the contact pins (16) along the longitudinal direction of the connector (14) and which is introduced into an open side of the connector housing up to the level of the contact pins in order to provide appropriate support to the printed circuit board while the compliant attachment area's of the contact pins are being pushed out of the holes of the board.

Abstract: A gripping device for positioning a component (47) on a substrate, comprising three fingers (1, 2, 3) arranged in a triangle (7), and a drive device for moving the fingers along parallel paths (4, 5, 6) relative to each other to grip or release a component. A middle finger (2) is movable in opposite directions with respect to the outer fingers (1, 3).

Abstract: A shielding case can be easily removed for reworking. Insertion openings and cutouts individually continuing to the insertion openings are provided. To remove the shielding case fixed by soldering from a substrate, first, for example, edges of nippers are inserted into a pair of the insertion openings; then, the leg section is cut away by the nippers. The above cutting-away processing is sequentially performed for all the leg sections. Subsequently, a cover section is removed, solders fixing the individual leg sections are sequentially heated and melted one by one, and the leg sections are serially pulled out from the substrate. Thus, the shield case can be removed from the substrate.

Abstract: Disclosed is a method of removably mounting a planar electrical component, such as a computer motherboard, to a chassis. The method comprises positioning a first fastener of a mounting device adjacent a mounting slot in the chassis, inserting the first fastener of the mounting device through the mounting slot in the chassis, releasing the mounting device so that the first fastener clamps onto the chassis through the mounting slot, positioning a second fastener of the mounting device adjacent a mounting hole on the planar electrical component, and inserting the second fastener of the mounting device into the mounting hole until the second fastener clamps onto the planar electrical component through the mounting hole.

Abstract: A ripcord tool for receiving a ripcord of a cable and facilitating the making of a slit in the cable. The tool includes a ripcord section having a ripcord attachment feature for attaching the ripcord to the ripcord section. The tool also includes a torque section operative to transmit torque to the ripcord section, such that rotation of the torque section causes the ripcord section to rotate for wrapping the ripcord about the ripcord section and ripping a component of the cable. A method of using the tool is also disclosed.

Abstract: Aspects for device and package separation of a multi-layer integrated circuit device attached at a frontside to an integrated circuit package are described. In an exemplary method aspect, the method includes cutting through coupling material between the multilayer integrated circuit and the integrated circuit package with a high precision saw blade. The method further includes cutting with a high precision saw blade of approximately 50 microns thickness. Additionally, the multi-layer integrated circuit device is utilized for device analysis from a frontside following separation from the integrated circuit package by the step of cutting.

Abstract: A device for detaching a suspension assembly, adapted to support a head, staked to an actuator arm of an actuator block of a disc drive. The device includes an expandable device operable between an insertion dimension and a deswaging dimension having a flanged end defining a deswaging surface for forcing the stake from a hole of the actuator arm. In the insertion dimension, the device being sized for insertion through channels of tubular stakes for placement relative to an extended end of the stake. The device being expanded to the deswaging dimension, so that the deswaging surface of the flanged end aligns with an end surface of the stake for removing the stake from the actuator block.

Abstract: A method and apparatus for efficiently repairing or reworking a printed circuit board having a solder ball grid array thereon efficiently and at minimum cost includes the steps of drilling out a plated-through hole to sever electrical connections between a ball grid array pad on one surface of the printed circuit board and internal circuits and circuits on an opposite surface of the printed circuit board; inserting a pin having an insulated sleeve surrounding a portion thereof into the drilled-out hole, the pin having attached to one end a wire for attachment to the ball grid array on one surface of the printed circuit board and a post at the other end of the pin for attachment of a wire to the post; the pin having a stop along its length to control vertical positioning of the pin in the drilled-out hole, the pin referred to as a via replacement (VR) pin.

Abstract: Apparatus and methods are provided for handling packaged integrated circuits (IC's), particularly for inserting packaged IC's in and removing packaged IC's from low-insertion-force (LIF) sockets. The apparatus includes a precisor having a chip precisor feature for receiving an IC package and a socket precisor feature for receiving a socket in a predetermined alignment relative to the chip precisor feature. One or more releasable chip retainers are provided, such as a vacuum nozzle for pulling the packaged IC into a seated position within the chip precisor feature and a pair of gripper fingers for holding the packaged IC within the chip precisor feature during extraction from a LIF socket.

Abstract: Semiconductor dice from a scribed wafer are first separated by a stretched cloth. The dice on the stretchable cloth are then lined up with a target unit and transferred by pressure to a target unit to form a matrix. The pressure can be exerted by pressing individually the dice from the stretchable cloth to the target unit. Alternatively, the dice from the stretchable cloth can first be transferred to a transfer unit before being compressed to the target unit. The transfer unit may also be a perforated board to the hold the dice in place before the dice are soldered to the target unit.

Abstract: In handling electronic components during manufacturing or other processing, circuit devices are retained within a dual in-line processing (DIP) tube by inserting and securing DIP pins at each end of the DIP tube. The DIP pin apparatus inserts DIP pins into holes of DIP tubes by pressing a DIP pin positioned within a lower slot of a lower plate of the apparatus into a hole of a DIP tube. The DIP pin apparatus removes DIP pins from the holes of DIP tubes by lifting a DIP pin from under its head and removing the DIP pin from the DIP tube. By using the DIP pin apparatus in the handling of electronic components, the adverse effects of operator fatigue, component damage, and production inefficiencies are reduced.

Abstract: A device for detaching a suspension assembly, adapted to support a head, staked to an actuator arm of an actuator block of a disc drive. The device includes an expandable device operable between an insertion dimension and a deswaging dimension having a flanged end defining a deswaging surface for forcing the stake from a hole of the actuator arm. In the insertion dimension, the device being sized for insertion through channels of tubular stakes for placement relative to an extended end of the stake. The device being expanded to the deswaging dimension, so that the deswaging surface of the flanged end aligns with an end surface of the stake for removing the stake from the actuator block.

Abstract: A scissors-like handle tool manipulates a ZIF socket having a cover slidably engaged with a bottom, between a loosened status and a tightened status. The handle tool comprises a first lever arm pivotably connected to a second lever arm. The handle tool is operated by encountering two lower ends of the first and second lever arms with two movable sides of the socket via a pivot operation of the handle tool thereby moving the cover of the ZIF socket along the bottom.

Abstract: An apparatus which reduces the surface area with which a carrier film adheres to a die, including a plate member including laterally-spaced supports. Preferably, the apparatus also includes a vacuum source operatively connected to the plate member. Upon placement of a carrier film having an array of semiconductor dice adhered thereto onto the plate member, the dice are proximate the supports. The vacuum pulls air from the spaces between the supports, which partially releases the carrier film from the bottom surface of at least some of the dice. The apparatus may also include a die removal mechanism such as a vacuum collet type die pickup mechanism, an extendable member die plunge-up mechanism, or a combination thereof. The present invention also includes a method for reducing the surface area with which a carrier film adheres to a die to facilitate removal thereof.

Abstract: An electronic circuit interruption device having a plurality of protection, indication and control options includes a dedicated printed circuit board having electrical connection with operating circuits controlling each of the several options. Electrical connections between the operating circuits and the circuit interruption controller is made through corresponding dedicated resistors. Option selection is obtained by removal of resistors connecting with non-selected circuits on the printed circuit board.

Abstract: Disclosed is a tool for use in disengaging elements of an electrical connector comprising an elongated axial handle having a griping end and a forward distal end; first and second opposed arms extending laterally from the elongated axial handle adjacent said forward distal end; and laterally spaced first and second fingers ending forward respectively from said first and second opposed arms to be engageable with the electrical connector. A combination of this tool and an electrical connector and a method of using this tool are also disclosed.

Abstract: A tool-actuated ejector for extracting electronic modular components. The ejector, which functions as a levered cam, has a body with a first end, a second end and a pivot located intermediate the first and second ends. A tool-receiving socket mounts at the second end. A tool, such as a screwdriver with a blade that matches the shape of the socket, actuates the ejector by applying a force to the socket. A cam, located at the first end, engages the electronic modular component. To provide a mechanical advantage, the distance between the tool-receiving socket and the pivot, which constitutes one lever arm, is greater than the distance between the cam and the pivot, which constitutes a second lever arm. In addition, a shock absorber mounts on the body and gliders extend below the body to provide stability and balance to the ejector. The ejector mounts in a casing having a tool passage that communicates with the tool-receiving socket and the exterior of the casing.

Abstract: An apparatus which reduces the surface area with which a carrier film adheres to a die, including a plate member including laterally-spaced supports. Preferably, the apparatus also includes a vacuum source operatively connected to the plate member. Upon placement of a carrier film having an array of semiconductor dice adhered thereto onto the plate member, the dice are proximate the supports. The vacuum pulls air from the spaces between the supports, which partially releases the carrier film from the bottom surface of at least some of the dice. The apparatus may also include a die removal mechanism such as a vacuum collet type die pick-up mechanism, an extendable member die plunge-up mechanism, or a combination thereof. The present invention also includes a method for reducing the surface area with which a carrier film adheres to a die to facilitate removal thereof.