Abstract: According to one embodiment, a flexible substrate includes an array substrate including an insulating basement having a first surface and a second surface opposed to the first surface, a first organic insulating layer which is located alongside the second surface and which is closely adhered the array substrate, and a second organic insulating layer closely adhered the first organic insulating layer. The first organic insulating layer is located between the array substrate and the second organic insulating layer. A plurality of bubbles is mixed in the second organic insulating layer. The second organic insulating layer has an elastic modulus that is lower than that of the insulating basement.

Abstract: A light-emitting diode manufacturing method including the forming of three-dimensional semiconductor elements, extending along parallel axes, made of a III-V compound, each having a lower portion and a flared upper portion inscribed within a frustum of half apical angle ?. The method further comprises, for each semiconductor element, the forming of an active area covering the top of the upper portion and the forming of at least one semiconductor layer of the III-V compound covering the active area by vapor deposition at a pressure lower than 10 mPa, by using a flux of the group-III element along a direction inclined by an angle ?III and a flux of the group-V element along a direction inclined by an angle ?V with respect to the vertical axis, angles ?III and ?V being smaller than angle ?.

Abstract: An X-ray generating apparatus comprises a storage housing, an insulating housing arranged in the storage housing, an X-ray generating tube arranged at least partly in the insulating housing, and a plurality of electrical components arranged in the insulating housing. In the X-ray generating apparatus, the plurality of electrical components include a mold transformer, the mold transformer includes a core, an insulator covering the core, and a heat-dissipating path configured to move heat from the core to an external space of the insulator, and the heat-dissipating path includes a hole provided in the insulator to extend from the external space toward the core.

Abstract: An optical element or a lighting element assembly including an optical element, can include a first portion of transmittance defining high transmittance enabling greater that 80% of light transmission, and a second portion of transmittance defining a low transmittance enabling less than 40% of light transmission, wherein the second portion of transmittance encircles the first portion of transmittance.

Abstract: A light-emitting diode (LED) lamp for a vehicle and a method of manufacturing the same use MID and magnetic induction technologies. The LED lamp includes a LED module, a housing accommodating the LED module, and a molded interconnect device (MID) electrode formed on a surface of the housing. The LED module may be mounted on the MID electrode by soldering using magnetic induction heating, the housing may be an injection molded product, and the MID electrode may be formed on the housing using a MID process.

Abstract: A light-emitting diode manufacturing method including the forming of three-dimensional semiconductor elements, extending along parallel axes, made of a III-V compound, each having a lower portion and a flared upper portion inscribed within a frustum of half apical angle ?. The method further comprises, for each semiconductor element, the forming of an active area covering the top of the upper portion and the forming of at least one semiconductor layer of the III-V compound covering the active area by vapor deposition at a pressure lower than 10 mPa, by using a flux of the group-III element along a direction inclined by an angle ?III and a flux of the group-V element along a direction inclined by an angle ?V with respect to the vertical axis, angles ?III and ?V being smaller than angle ?.

Abstract: The present disclosure relates to an air purifier. An air purifier according to an aspect of the present disclosure may include: a first body having an inlet and an outlet; a fan; a second body coupled to the first body, having a central portion located above the first body, and extending from the central portion in a direction crossing the up-and-down direction; a substrate; a light source disposed at the central portion or at a position corresponding to the central portion in the up-and-down direction; and a light guide facing the light source, and extending in a direction away from the central portion, so it is possible to minimize the number of the light sources and deliver light to an outside of the air purifier.

Abstract: A spark plug electrode with one or more electrode tip(s) formed on one or more electrode base(s) using an additive manufacturing process, such as a powder bed fusion technique, such that each electrode tip overhangs an edge of a corresponding electrode base. The spark plug electrode may be a center electrode, a ground electrode, or an annular ground electrode and can be provided according to a number of different configurations. Each electrode tip includes a precious metal-based material, such as an iridium- or platinum-based alloy, and a plurality of laser deposition layers, and each electrode tip can be secured to an electrode base with a weldless joint. An additive manufacturing process is also provided.

Abstract: An in-situ replaceable LED car headlight and a design method, comprising a lamp body shell, a light source assembly provided with LED lamps, a driving assembly, and a fan, wherein the light source assembly is arranged at a head of the lamp body shell, and the driving assembly is arranged at a tail of the lamp body shell; a middle part of the lamp body shell is provided with a central installation part for accommodating the fan, and the fan is installed between the light source assembly and the driving assembly; the driving assembly is electrically connected with the fan by adopting a flexible board connecting wire. A structure in which the fan is arranged in the central position is adopted, so that the fan can be placed in the part with the largest internal space of the lamp body within the range limited by laws and regulations.

Abstract: Provided is an LED lamp heat dissipation structure, including: a metal plate and an LED lamp substrate. The metal plate has a first predetermined shape portion, wherein a center of the metal plate is defined to have a second predetermined shape portion, an outer edge of the metal plate is formed to be a tapered portion with outward corrugations and with a center at the second predetermined shape portion, the tapered portion has a predetermined inclination angle with respect to the second predetermined shape portion, two surfaces of the second predetermined are defined as an inner surface and an outer surface, respectively, and the tapered portion surrounds the inner surface to define an inner space. The LED lamp substrate is closely attached to the inner surface. The heat generated from the LED lamp substrate can be efficiently transferred to an ambient air through the LED lamp heat dissipation structure.

Abstract: An LED light module comprises an emitting portion; at least one LED package; a back cover; and an end cap. The emitting portion defines a first curved surface. The first curved surface extends a first length along a cylindrical axis defined by the LED light module. The back cover defines a second curved surface extending the first length along the cylindrical axis. The first curved surface and the second curved surface define a perimeter of the LED light module. In a cross-section of the LED light module taken in a plane substantially perpendicular to the cylindrical axis, the perimeter is substantially ovular, elliptical and/or tear-drop shaped. The end cap is substantially ovular, elliptical and/or tear-drop shaped, and comprises a coupling element configured to electrically and/or mechanically couple the LED light module to a subsequent LED light module or to a fixture.

Abstract: The present disclosure relates to the technical field of lamps, and discloses a wrap-around flared lamp. The wrap-around flared lamp includes a lamp base and a shell connected to the lamp base. The lamp base is provided with an extending part which is wrapped around and fixedly connected to an opening part of the shell; the wrap-around flared clamp further includes a stem structure which is electrically connected to the lamp base and extends into the shell; the stem structure includes a first metal wire, a first luminophor and a second metal wire which are electrically connected in sequence; and the first metal wire and the second metal wire are electrically connected to the lamp base respectively.

Abstract: A display apparatus includes a display module having a display panel configured to display an image; a sound generating device on a rear surface of the display panel and including a first side and a second side perpendicular to the first side and an adhesive member in a partial region of the sound generating device, the adhesive member having a size smaller than one of the first side and the second side of the sound generating device.

Abstract: A multilayer wiring substrate includes a first wiring substrate including a plurality of stacked layers made of a thermo setting resin and having a wiring layer formed between each adjacent layer of the layers in a state in contact with the adjacent layers, a second wiring substrate made of a ceramic, and a joining layer disposed between a back surface of the first wiring substrate and a front surface of the second wiring substrate and configured to join the first wiring substrate and the second wiring substrate to each other, wherein at least a surface of the joining layer adjacent to the second wiring substrate is made of a thermo plastic resin.

Abstract: A backlight module includes a drive substrate and a plurality of light sources. The drive substrate has a first side on which the plurality of light sources are provided at intervals. The backlight module further includes a first heat dissipation layer. The first heat dissipation layer is a transparent film and disposed on the first side of the drive substrate and located between adjacent light sources, to be directly in contact with the light sources, so as to block the light sources and absorb the heat of the light source and radiate heat, which is beneficial for reducing or eliminating the thermal coupling between adjacent light sources and helping the first side of the drive substrate to dissipate heat, so that the designed backlight module has better thermal stability and longer service life.

Abstract: A light-emitting device and a light emitting module are provided. The light emitting module includes a housing, at least one light guide element, and at least one light emitting element. The housing includes at least one passage passing through its a first surface and a second surface, and a coupling portion formed on an inner surface adjacent to the second surface. The light guide element arranged in the at least one passage has a light emergent surface exposed at one end of the at least one passage and a light incident surface exposed at the other end of the at least one passage. The light emitting element is coupled to the housing by the coupling portion. The light emitting element includes a light emitting surface facing to the light incident surface of the light guide element and a soldering portion exposed from the housing.

Abstract: A display module and a display device, the display module includes a display panel including a substrate, a driving circuit layer, and a display function layer; a heat dissipation layer is arranged on a side of the substrate away from the driving circuit layer and configured to dissipate heat of the display panel, a material of the heat dissipation layer comprises a thermally conductive metal material; the heat dissipation layer comprises a plurality of heat dissipation channels regularly arranged, and each of the heat dissipation channels is configured to pass a heat dissipation medium, thereby alleviating a problem of heat concentration in current vehicle-mounted display devices.

Abstract: An LED lighting device comprise a lamp cap; a case, connected to the lamp along in a first direction and having a cavity; a power supply disposed in the case; connected to the lamp along in a first direction and having a cavity; and a light emission unit. The light emission unit and the heat exchange unit are connected to form a thermal conduction path, the light emission unit and the power supply are electrically connected. When the first direction is substantially parallel to the horizontal plane, the light emitting unit of the LED lighting device provides downward light emission. The fixing unit comprises a first member, and a second member, the first member and the second member are in a form of slide connection.

Abstract: A luminaire includes a core made up of a first material and an LED lighting arrangement mounted to the core. The luminaire further includes a housing made up of a second material. The second material is different from the first material. The housing including a recess in which the core is received. The housing further includes a finned part.

Abstract: An LED lamp with an adjustable space illumination angle comprises two movable light sources and a lamp head assembly. The two movable light sources are disposed on two sides of the lamp head assembly and spaced apart from each other in a length direction of the lamp head assembly. The two movable light sources are rotatably connected to the lamp head assembly. The two movable light sources are configured to be rotated about an X-axis or a Y-axis to change an included angle between the two movable light sources. The lamp head assembly comprises a first part connected with the two movable light sources and a second part connected with a lamp holder, and the first part is rotatably connected to the second part so as to enable the two movable light sources and the first part to rotate relative to the second part about a Z-axis.

Abstract: A beam pattern module includes a heatsink base, at least one LED light and light reflector housing. The heatsink base includes a base frame and at least one at least one chip mounting surface. The chip mounting surface protrudes on an inner side surface of a base plate of the heatsink base, and the LED light is disposed on the chip mounting surface. The light reflector housing includes a side portion and a reflecting portion. The side portion is provided with a one cut-out. The side portion is fitted on the inner side surface, and the chip mounting surface and the LED light are exposed in the mounting space. The reflecting portion extending from an edge of the side portion and coupled to a rear plate of the base frame, so as to form a single module to be installed to a vehicle light device.

Abstract: Embodiments of the present disclosure provide for a light emitting apparatus comprising a directional LED array and an opaque lens configured to disperse light in an omnidirectional output pattern while maintaining similar light dispersion and heat dissipation performance as that of translucent lenses. In accordance with various aspects of the present disclosure, the desired optical properties of the present light emitting apparatus may be enabled through the use of a lens constructed from a polycarbonate or polycarbonate blend material melt blended with a concentration of organic diffusion particles to comprise a thermoplastic matrix having a desired opacity and optical characteristics.

Abstract: A heat dissipating mechanism is for heat dissipation of a display module and a heat generating module of a display apparatus and includes a frame structure, a first airflow generating device, and a conductive cover structure having first, second, and third covers. The first cover is connected to the frame structure for containing the display module. The second cover has an air inlet and an air outlet and is connected to the first cover to form a channel. The third cover is connected to the second cover for containing the heat generating module. The first airflow generating device is disposed in the air inlet to guide air into the channel and out of the air outlet, so as to form an airflow for heat dissipation of the display module and the heat generating module.

Abstract: A lighting apparatus includes a light source plate, a surface rim and a light passing cover. The light source plate is mounted with a light source. The light source plate is placed upon the support plate. The surface rim has an inner wall and an exterior wall. The inner wall has a top part and a bottom part. A bottom diameter of the bottom part is smaller than a top diameter of the top part. The light source is placed closer to the bottom part of the inner wall and surrounded by the bottom part of the inner wall. The light passing cover is attached to the top part of the inner wall. An exterior edge of the exterior wall is attached to a peripheral edge of the support plate.

Abstract: A light system includes a main body defining an internal chamber and a lighting assembly secured to the main body, wherein the lighting assembly comprises at least one light unit configured to emit light. The light system further includes a fan configured to generate an airflow and an airflow circuit configured to direct the airflow out of the main body of the lighting assembly. The light system also includes a tilt detection unit configured to detect a tilt angle of the lighting assembly and to generate a control signal to cause a speed of the airflow generated by the fan to change based at least on a detected change in the tilt angle of the lighting assembly.

Abstract: In some embodiments, a lighting assembly including at least one light-emitting device positioned within a housing is disclosed, wherein the housing is designed to allow an ambient environment to pass into the housing and transfer heat from the at least one light-emitting device. The light-emitting area of the light-emitting device may be sealed from the ambient environment. In some embodiments, the housing may include at least one recess, port, or other opening configured to allow a liquid or gas to promote heat transfer from the light-emitting device. In some embodiments, a vehicle, a marine system, or other systems may include at least one lighting assembly as contemplated herein.

Abstract: In some embodiments, a lighting assembly including at least one light-emitting device positioned within a housing is disclosed, wherein the housing is designed to allow an ambient environment to pass into the housing and transfer heat from the at least one light-emitting device. The light-emitting area of the light-emitting device may be sealed from the ambient environment. In some embodiments, the housing may include at least one recess, port, or other opening configured to allow a liquid or gas to promote heat transfer from the light-emitting device. In some embodiments, a vehicle, a marine system, or other systems may include at least one lighting assembly as contemplated herein.

Abstract: The present invention concerns a method for obtaining a finished or semi-finished zirconia-based article, the surface of the article having a metallic external appearance and non-zero surface electrical conductivity, wherein the method includes the steps of: taking at least one zirconia article, pre-shaped in its finished or semi-finished form; placing said article in a chamber in which a hydrogen and carbon/nitrogen gas mixture is heated; heating said article and the gas mixture using at least one resistive element traversed by an electric current to obtain dissociation of the hydrogen and carbon/nitrogen based gas molecules and an increase in the temperature of said article; keeping said article in the reactive atmosphere thus created to obtain diffusion of the carbon/nitrogen atoms in the external surface of said article.

Abstract: Disclosed is an LED assembly having an omnidirectional light field. The LED assembly has a transparent substrate with first and second surfaces facing to opposite orientations respectively. LED chips are mounted on the first surface and are electrically interconnected by a circuit. A transparent capsule with a phosphor dispersed therein is formed on the first surface and substantially encloses the circuit and the LED chips. First and second electrode plates are formed on the first or second surface, and electrically connected to the LED chips.

Abstract: A matrix light source intended to be supplied with a voltage and having a plurality of electroluminescent semiconductor element-based elementary light sources and a common substrate in contact with an integrated circuit. The integrated circuit includes, for each elementary light source, a switching device for selectively connecting it to a voltage source on the basis of a first control signal. The substrate includes, for at least one of the elementary light sources, an open-circuit fault detection circuit for detecting an open-circuit fault with the elementary light source.

Abstract: The present disclosure is directed to examples of a single modular heat spreader piece. In one example, the single modular heat spreader piece includes a body portion, wherein the body portion comprises a curved outer surface and a flange member coupled to a first side of the body portion, wherein the flange member has a curved outer edge, a connection member coupled to a second side of the body portion, wherein the second side of the body portion is opposite the first side, and a heat spreader member coupled to the second side of the body portion and on an opposite end of the body portion from the connection member.

Abstract: An LED bulb with an LED assembly, including a substrate having a first top surface, longer side surface and shorter side surface; a mount disposed on the first top surface, having a first inner side surface and second inner side surface facing the first inner side surface; a plurality of LED chips on the first top surface, arranged between the first and second inner side surfaces, having a second top surface; an electrode plate formed on the mount, electrically connected to the plurality of LED chips with a third top surface which does not extend beyond the shorter side surface in a top view; and a phosphor layer covering the plurality of LED chips, mount, and electrode plate, without covering the side surfaces; and a cover covering the LED assembly. The third top surface is higher than the second top surface in an elevation based on the first top surface.

Abstract: A light emission device includes: a base part; one or more semiconductor laser devices disposed on an upper surface of the base part; a frame body having a flat region that is above the lower surface of the base part and outside a region in which the one or more semiconductor laser devices are disposed, the frame body having a throughhole that extends from an upper surface to a lower surface of the flat region; an electrical conduction member disposed on a lower surface side of the flat region, the electrical conduction member including on an upper surface thereof a first conductive region and an insulative region, such that the first conductive region and the insulative region are located in a region defined by the throughhole of the frame body in a top plan view; and wiring having an end that is bonded to the first conductive region.

Abstract: The present disclosure discloses a bulb lamp, which includes a lamp cap, a lamp holder and a bulb shell. The bulb holder connects the lamp cap and the bulb shell to form a lamp body, and a light source assembly is provided in the lamp body; the bulb lamp further includes a heat radiator, the heat radiator is arranged in the lamp holder, the heat radiator includes a first hollow mechanism, a contact part is provided at one end, away from the lamp cap, of the radiator, and the light source assembly is arranged on the contact part.

Abstract: The present disclosure provides a wavelength conversion device including a first thermal conductive plate, a wavelength conversion layer and a second thermal conductive plate. The wavelength conversion layer is disposed on the first side of the first thermal conductive plate and configured to perform a wavelength conversion. The second thermal conductive plate is disposed on the second side of the first thermal conductive plate. The first thermal conductive plate and the second thermal conductive plate are combined to conduct the heat generated by the wavelength conversion layer during the wavelength conversion. Since the thermal conductivity coefficients of the at least two thermal conductive plates are increased along the heat transferring path, it is advantageous to minimize the thermal resistance of the heat transferring path.

Abstract: This document describes techniques directed to active thermal-control of a floodlight and associated floodlights. As described, an example floodlight includes a first heat-transfer subsystem that uses a fully enclosed heat sink to transfer heat from an array of LEDs to a first housing component of the floodlight. The floodlight further includes a second heat-transfer subsystem to transfer heat from one or more PSUs to a second housing component of the floodlight. Described techniques include using thermistors located throughout the floodlight to actively monitor a temperature profile within the floodlight and, if one or more operating-temperature thresholds are violated, reducing power consumption within the floodlight.

Abstract: The present invention relates to the technical field of bulbs, and discloses a waterproof bulb structure comprising a bulb shell, a lamp holder connected with the bulb shell, and further comprising a core column assembly and a rubber seal seat with an elastic waterproof seal; the core column assembly comprises a first conductive component, an LED light bar and a second conductive component that are electrically connected in sequence. The present invention has the following advantages: resistors are fixed at the rubber seal seat, with wires passing through sealing holes, and the first conductive component and the second conductive component are in fit with the sealing holes to prevent water or moisture from entering the bulb shell, so that water can be completely prevented from entering the bulb shell, and the lamp does not produce fogging when in use, and has good lighting effect and longer service life.

Abstract: The disclosure described herein is directed to an in-grade lighting fixture with improved heat dissipation that provides greater flexibility in servicing, replacing, or installing internal components within the fixture. The in-grade lighting fixture comprises features to assist in dissipating heat generated by light sources, such as LEDs, and/or other electronic components to optimize performance and allow for increased output power for the light sources. The disclosure uses a heat sink assembly that is in thermal communication with the in-grade lighting fixture in order to dissipate heat within the lighting fixture out to the ambient, which optimizes performance and allows for increased output power for the light source.

Abstract: Embodiments of the present disclosure provide for a light emitting apparatus comprising a directional LED array and an opaque lens configured to disperse light in an omnidirectional output pattern while maintaining similar light dispersion and heat dissipation performance as that of translucent lenses. In accordance with various aspects of the present disclosure, the desired optical properties of the present light emitting apparatus may be enabled through the use of a lens constructed from a polycarbonate or polycarbonate blend material melt blended with a concentration of organic diffusion particles to comprise a thermoplastic matrix having a desired opacity and optical characteristics.

Abstract: An LED lamp includes a lamp base for insertion into a reflector of an automotive front lighting assembly; a panel extending from the lamp base with a first vertical side facing into one half of the reflector and a second vertical side facing into the other half of the reflector; a primary light source including a set of LED dies on each vertical side of the panel; a two-part shield including a first shield half shielding the LED dies on the first vertical side of the panel and a second shield half shielding the LED dies on the second vertical side of the panel. The two-part shield essentially has the form of a shield in a functionally equivalent filament lamp for providing a low beam. A lighting arrangement includes such an LED lamp; a reflector to receive the lamp; and an electrical interface for connecting to a controller.

Abstract: A method of manufacturing an LED assembly is described. The method includes providing an LED package comprising one or more LEDs arranged in a support body and thermal and electrical contact regions on one or more surfaces of the support body. The method further includes providing a heatpipe and forming a thermal contact between a contact region of the LED package and a first end region of the heatpipe. An LED package, an LED assembly, and an LED lighting arrangement are also described.

Abstract: A self-conducting light valve module includes: a first transparent graphene thermal conductive film, a panel frame, an LCD light valve, and a second transparent graphene thermal conductive film; wherein the panel frame has a first plane and a second plane at two ends, respectively; a rectangular through hole is drilled at a center of the panel frame, and the LCD light valve is installed in the rectangular through hole; the first transparent graphene thermally conductive film is attached to the first plane and the incident surface of the LCD light valve; and the second transparent graphene thermally conductive film is attached to the second plane and the emergent surface of the LCD light valve. A light valve heat dissipation device includes: a heat diffusion device installed on an external peripheral wall of the self-conducting light valve module.

Abstract: A vehicular luminaire according to embodiments includes a socket; a substrate provided on the socket and including a wiring pattern on at least one surface; at least one light-emitting element electrically connected to the wiring pattern; and a plurality of power-supply terminals extending inside the socket and including one end portion exposed from the socket, the vicinity of the end portion being bent toward the substrate.

Abstract: An LED lighting device 10 includes: a substrate 15 formed in an elongated shape; a first reflector 11 formed in a single rail shape on the surface of the substrate 15; plural LED elements 16 (16a and 16b) arranged in rows at positions on both sides of the first reflector 11 on the surface of the substrate 15; and a pair of rail-shaped second reflectors 12 (12a and 12b) formed on the surface of the substrate 15 in such a manner that the LED elements 16 (16a and 16b) and the first reflector 11 are interposed between the pair of second reflectors 12a and 12b.

Abstract: A device for curing resin in a pipe liner using electromagnetic radiation includes a heat sink and LEDs for generating the radiation mounted on the heat sink. The device conducts heat away from the LEDs through the heat sink. The heat sink is positioned in the flow path of cooling fluid that draws heat away by convection. The heat sink can include elements at the ends of the LEDs that are exposed to the cooling fluid. The device can guide the cooling fluid along a flow path that includes a segment that extends over the LEDs. The device can limit fluid flow through a central cavity of the heat sink.

Abstract: The present disclosure relates to a flexible screen, including a display substrate including a first portion, a second portion folded to form an end portion of the flexible screen and a third portion, said first, second, and third portions being sequentially connected, and a support plate for supporting the display substrate, wherein the first portion and the third portion of the display substrate are opposite to each other, the support plate is arranged between the first portion and the third portion of the display substrate, and one end of the support plate faces one surface of the second portion, and wherein the surface of the second portion facing the support plate is provided with an end heat dissipation device.

Abstract: A light emitting device includes a plurality of semiconductor laser elements, a light-transmissive member, and a wavelength conversion member. Each of the semiconductor laser elements is configured to emit light having a first wavelength. The light-transmissive member includes a plurality of first inclined surfaces and a lower surface. The light-transmissive member is positioned with respect to the semiconductor laser elements so that beams of the light emitted from the semiconductor laser elements enter the light-transmissive member respectively through the first inclined surfaces and exit from the lower surface. The wavelength conversion member is disposed in contact with the lower surface of the light-transmissive member and configured to convert at least a portion of the light exiting from the lower surface to wavelength-converted light having a second wavelength.

Abstract: A display unit subassembly includes an electronic display and an open loop pathway for ambient air. An upper portion including an upper cavity for ambient air extends above, and is spaced apart from, the display unit subassembly. A frame extends between the upper portion and the display unit subassembly. An air intake is located between the upper portion and the display unit subassembly, is configured to receive ambient air, and is in fluid communication with said upper cavity and said open loop pathway.

Abstract: An electron gun comprising a cathode having an electron emitting surface and whose planar shape is circular; a heater; an anode being arranged to oppose the cathode; and a heat resistant member. The anode applies a positive potential relative to the cathode to extract electrons in a predetermined direction. The cathode has, in a central portion thereof, a through hole along a central axis of the cathode. The heat resistant member has a first portion to close the through hole and a second portion being positioned between the cathode and the heater.

Abstract: Each of a plurality of the light-emitting units (140) includes a first electrode (110), an organic layer (120), and a second electrode (130). The first electrode (110) is light-transmitting, and the second electrode (130) is light-reflective. The organic layer (120) is located between the first electrode (110) and the second electrode (130). The light-transmitting regions (104 and 106) are located between the plurality of light-emitting units (140). A sealing member (170) covers the plurality of light-emitting units (140) and the light-transmitting regions (104 and 106). The sealing member (170) is fixed directly or through an insulating layer (174) to at least one of a structure (for example, the second electrode 130) formed on a substrate (100), and the substrate (100). In addition, a haze value of the light-emitting device (10) is equal to or less than 2.0%, preferably equal to or less than 1.4%.