Abstract: Disclosed is a light emitting device. The light emitting device includes a body having a cavity, a light emitting part in the cavity, a reflective layer on an inner surface of the cavity, and a light conversion layer adjacent to the reflective layer. The light emitting device includes a body having the cavity, a light emitting part in the cavity, and a light conversion part on a path of a light from the light emitting part. The light conversion part includes a first light conversion lens part, and a second light conversion lens part beside the first light conversion lens part.

Abstract: An LED bulb having bulb-shaped shell and thermally conductive fluid or gel within the shell. The bulb includes at least one LED within the shell. The bulb includes at least one LED within the shell and a base. The base can be configured to fit within an electrical socket and can include a series of screw threads and a base pin, wherein the screw threads and base pin are dimensioned to be received within a standard electrical socket. Alternatively, the base can be configured to fit within a suitable electric socket.

Abstract: A lamp (1; 16; 20; 24; 30; 37; 39), at least comprising: a heat sink (2; 17; 21; 25), which bears at least one light source; (10) and an at least partially optically transmissive cover (11; 19; 23; 26) for the at least one light source (10), said cover being fastened to the heat sink (2; 17; 21; 25), the cover (11; 19; 23; 26; 31; 38; 40) having a wall thickness (d) which, at least sectionally, tapers as the distance from the heat sink (2; 17; 21; 25) increases.

Abstract: A liquid-cooled light emitting diode (LED) bulb which includes a base, a shell connected to the base forming an enclosed volume, and a plurality of LEDs attached to the base and disposed within the shell. The LED bulb also includes a volume of thermally-conductive liquid held within the enclosed volume. A scavenger element comprising a scavenger material is attached to the base and is exposed to the thermally-conductive liquid. The scavenger material is configured to capture contaminants in the thermally-conductive liquid.

Abstract: A LED lamp includes an optically transmissive enclosure and a base connected to the enclosure. LEDs are mounted on a substrate for emitting light when energized though an electrical path from the base. The mounting substrate for the LEDs has a surface that is exposed to the exterior of the enclosure for transmitting heat from the plurality of LEDs and dissipating heat to the ambient environment.

Abstract: A lighting device includes at least one first electrically activated emitter, at least one lumiphor support element comprising a lumiphoric material spatially segregated from the first electrically activated emitter and arranged to receive at least a portion of emissions from the first electrically activated emitter, and at least one second electrically activated emitter disposed on or adjacent to the at least one lumiphor support element. First and second electrically activated emitters having different peak wavelengths may be in conductive with first and second device-scale heat sinks, respectively.

Abstract: An organic light-emitting device includes a base plate, an organic light-emitting body formed on the base plate, a heat-transferring filling material formed around the organic light-emitting body to cover the organic light-emitting body, the heat-transferring filling material having an electrically insulating property, and a sealing plate arranged on the heat-transferring filling material.

Abstract: In accordance with a first aspect of the present inventive subject matter, a lighting device includes light-emitting elements arranged in lines that are extended in parallel with one another, the light-emitting elements being divided into groups each including the same number of light-emitting elements, a first connecting electrode is disposed adjacent to one end portion of the lines extended, a second connecting electrode is disposed adjacent to another end portion of the lines extended, and the light-emitting elements within each group are electrically connected in series with one another by metallic wires and electrically connected in series to the first connecting electrode and to the second connecting electrode. The groups each include the same number of light-emitting elements that are electrically connected in parallel between the first connecting electrode and the second connecting electrode.

Abstract: An LED light fixture including a heat-sink body having a circuit-board mounting surface and an aperture member supported over the circuit-board mounting surface and forming an optical aperture. An LED circuit board is affixed in thermal-contact relationship to the circuit-board mounting surface in position between the mounting surface and the aperture member, the circuit board having an LED-populated area and a surrounding non-LED-populated area which extends beyond the optical aperture. In some other embodiments, the fixture is a low-profile LED light fixture including a cover and a base plate which has a substantially planar back surface, a front surface and heat-dissipating surfaces extending forward from the front surface. An LED circuit board and at least one LED power-circuitry unit, which are secured with respect to the front surface along side the heat-dissipating surfaces, do not extend behind the back surface of the base plate.

Abstract: A lighting device includes a heat sink for dissipating heat from a light source. The heat sink is located between an inner case and an outer case, and a power controller is located in the inner case. The light source may include one or more light emitting diodes.

Abstract: A lighting apparatus with light-emitting diode chips and a remote phosphor layer includes a plurality of LED chips, a cover, a heat sink, a first end cap, a second end cap, at least one PCB, and a LED driver. The plurality of LED chips is positioned on the at least one PCB and electronically connected with the LED driver. The LED driver is electrically connected with male contacts which traverse through the first end cap and the second end cap. The at least one PCB is enclosed with the cover, the heat sink, the first end cap, and the second end cap. The blue light and ultraviolet light from the plurality of LED chips coverts into white or yellow light from a phosphor layer of the cover, where the phosphor layer is remotely positioned from the plurality of LED chips.

Abstract: An illumination source includes a heat sink with an inner core region and an outer core region having structures to dissipate heat from the inner core region. An LED assembly is pressed into a thermally-conductive compound disposed between the LED assembly and the inner core region. A retaining clamp is used to mechanically press the LED assembly into the thermally-conductive compound.

Abstract: Provided is an organic light emitting diode (OLED) display including: a substrate; an organic light emitting element disposed on the substrate; an encapsulation substrate disposed on the organic light emitting element; and an adhesive layer disposed on the substrate to cover the organic light emitting element and bonding the substrate including the organic light emitting element disposed therein with the encapsulation substrate. Herein, the adhesive layer is formed by laminating a filling adhesive sheet including at least one opening that is open in a vertical direction in a thickness of the adhesive layer with a heat dissipation adhesive sheet filling the opening, or by laminating a heat dissipation adhesive sheet including at least one opening that is open in a vertical direction in a thickness of the adhesive layer with a filling adhesive sheet filling the opening.

Abstract: A LUWPL luminaire has a housing with a lower transparent closure and a heat dissipating top of cast aluminum. This has a suspension eye. The housing has an upper flange via which it is bolted with the interposition of a seal to a underside rim of the top. Within the rim, the underside is substantially flat, with a magnetron attachment boss and other attachment points. A magnetron is supported by being clamped by a saddle to the attachment boss at the magnetron's anode. The magnetron is fast with a transition box and a crucible support block. A bracket fixed to certain of the attachment points extends down from the top is screwed to the transition box. Thus the LUWPL parts are securely supported below the top.

Abstract: An irradiation device includes: a light source having an amalgam alloy member that is disposed on a part of the inner surface of a light source tube; and a chamber in which the light source is disposed. The chamber includes: a main chamber body; and a first gas inflow port and a first gas outflow port that are formed in the main chamber body. The first gas inflow port and the first gas outflow port are arranged so that the outer surface of the part of the light source tube where the amalgam alloy member is disposed is positioned in a flow path of a gas that flows in through the first gas inflow port and flows out through the first gas outflow port.

Abstract: An LED bulb assembly includes a pinion, a plurality of LEDs, an upper heat sink, and a lower base. The plurality of LEDs are configured or arranged around a surface of the pinion, such that the optical axis of the LEDs face outward. An upper heat sink may be configured to provide heat transfer for the LEDs and pinion. The lower base may be configured to provide a connection to the pinion and an upper heat sink. In embodiments, one or more optical elements (e.g., lenses) or LED covers may be included. Further, for some embodiments, the upper heat sink may be upwardly offset a separation distance from an upper surface of the pinion, and may be configured to improve air flow to the upper heat sink.

Abstract: Provided is a display apparatus including a display panel for displaying an image, a heat source arranged at a side surface of at least one side of the display panel, a heat absorbing section for absorbing heat generated by the heat source, a back surface plate arranged at a back surface side of the display panel and made of a metal, a portion of the back surface plate being in close contact with the heat absorbing section, a front surface plate arranged at a front surface side of the display panel and made of a metal, and a middle chassis arranged between the front surface plate and the heat absorbing section.

Abstract: A lighting device may be provided that comprises: a heat sink; a light source which is disposed on the heat sink; a cover which is coupled to the heat sink and includes a dome disposed on the light source and a body supporting the dome; and a reflective plate which is disposed in the body and has an opening through which a part of light from the light source passes.

Abstract: An LED lighting assembly may include a printed circuit board with an LED chip, and a heat sink thermally conducted with the printed circuit board, wherein the LED lighting assembly further comprises a light guide body configured as a bulb, the light guide body having an end surface as a light incidence surface of light from the LED chip, an outer surface as a light emergent surface and an inner surface, wherein the inner surface is structured so as to form a reflecting surface, reflecting at least part of light from the end surface to the outer surface.

Abstract: An illuminating device including a hollow body and a circuit board is provided. The hollow body includes a first opening end, a second opening end and a pair of first hooking portions, wherein a bore of the second opening end is larger than a bore of the first opening end. The first hooking portions are disposed on the first opening end. The circuit board is disposed in the hollow body and has a pair of second hooking portions, wherein the first hooking portions interfere with the second hooking portions.

Abstract: The present invention provides a cup-shaped heat dissipater having heat conductive rib and flow guide hole, in which the outer cup bottom of the cup-shaped heat dissipater (100) is formed as a planar or convex or concave surface for accommodating the electric luminous body (200), so with the heat dissipation surface formed opposite to the cup-shaped inner recessed structure of the heat dissipater (100) and with the heat conductive rib structure (310) connecting between the inner periphery of the cup-shaped inner recessed structure of the heat dissipater (100) and the heat source zone having its bottom being installed with the electric luminous body (200) and the solid or tubular central column (103), the heat in the central heat source zone can be dissipated to the periphery through the surface of the heat conductive rib structure (310) and the surface of the heat dissipater (100).

Abstract: An illumination device for enhancing plant growth includes a substrate unit, a light-emitting unit, a current-limiting unit, and a control unit. The substrate unit includes a substrate body. The light-emitting unit, the current-limiting unit, and the control unit are disposed on the substrate body. The light-emitting unit includes a first light-emitting module, a second light-emitting module, and a third light-emitting module. The current-limiting unit includes a first current-limiting chip electrically connected to the first light-emitting module, a second current-limiting chip electrically connected to the second light-emitting module, and a third current-limiting chip electrically connected to the third light-emitting module.

Abstract: A solid state lighting devices includes a heatsink having a first end arranged proximate to a base end, and a second end arranged between the first end and a solid state emitter, wherein at least a portion of the heatsink is wider at point intermediate the first end and the second end than the width of the heatsink at the second end. Such reverse angled heatsink reduces obstruction of light. A heatsink may include multiple fins and a heatpipe.

Abstract: The invention relates to an electric lamp (102) comprising a primary semiconductor light source (104) in thermal communication with a primary reflector (106). Herein, the primary reflector (106) is reflective, transparent and/or translucent. The primary reflector (106) is configured for transferring heat generated by the primary semiconductor light source (104) during operation away from said primary semiconductor light, source (104). As a result, the electric lamp (102) according to the invention effectively reduces the number of parts comprised in the electric lamp (102), thereby lowering the costs of manufacturing the electric lamp (102).

Abstract: A lighting lamp for improving heat dissipation efficiency and preventing life-shorting of an lighting lamp is provided. More specifically, an lighting lamp which comprises a heat sink on peripheral surface of which a first heat transfer flow path is provided, a light emission module provided on the upper plane of the heat sink and provided with at least one light emission element, and a globe connected to the upper part of the heat sink and covering the light emission module, and a second heat transfer flow path provided on outer peripheral surface of the globe and corresponds to the first heat transfer flow path.

Abstract: A heat dissipation structure for a light bulb assembly includes a holder, a heat dissipating cover, and a light seat. The holder includes a socket and a receiving space defined in the socket to receive a circuit board, the socket includes a first abutting portion formed on a peripheral side thereof and at least one first coupling portion arranged on a lateral side thereof. The heat dissipating cover includes a through hole for inserting the socket, and at least one cooling fin arranged around an outer peripheral side thereof. The light seat is used for installing a LED light, which includes a second coupling portion connected with the at least one first coupling portion, and a second abutting portion retaining the heat dissipating cover with the first abutting portion.

Abstract: The claimed invention was made by, on behalf of, and/or in connection with one or more of the following parties to a joint university corporation research agreement: Princeton University, The University of Southern California, The University of Michigan and Universal Display Corporation. The agreement was in effect on and before the date the claimed invention was made, and the claimed invention was made as a result of activities undertaken within the scope of the agreement.

Abstract: An exit window can include an exit window foil, and a support grid contacting and supporting the exit window foil. The support grid can have first and second grids, each having respective first and second grid portions that are positioned in an alignment and thermally isolated from each other. The first and second grid portions can each have a series of apertures that are aligned for allowing the passage of a beam therethrough to reach and pass through the exit window foil. The second grid portion can contact the exit window foil. The first grid portion can mask the second grid portion and the exit window foil from heat caused by the beam striking the first grid portion.

Abstract: A lamp comprises an LED light source for emitting light. A combined heat sink and reflector is thermally coupled to the LED light source. The heat sink and reflector comprise an internal surface for reflecting the light and an exterior surface. The internal surface and the external surface are uncovered such that heat is dissipated from the interior surface and the exterior surface.

Abstract: A display device having a thinner shape and a uniform luminance includes a display panel that displays images. The display device has upper and lower peripheral regions. A printed circuit board (PCB) is positioned at the back of the display panel to control and drive the display panel and to provide power to the display panel. A thermal conductive sheet is attached to the back of the display panel. In the display device, the thermal conductive sheet includes a base film that is attached to the back of the display panel and is formed of an electrical insulating material. A power supply pattern is formed on the base film to provide power to the display panel. A ground pattern is formed to be spaced apart and electrically insulated from the power supply pattern.

Abstract: Disclosed is an LED-based bulb-type lamp, including a cooling structure and a plurality of LEDs thermally connected to the cooling structure. The lamp includes at least three separate LED arrays oriented substantially parallel to its central longitudinal axis, such that the LEDs are interspersed among a plurality of light-transmission sub-areas of the LED-based lamp. One or more portions of the cooling structure of the lamp extend to its outer surface, as assembled, such that light-transmissive and heat-dissipating areas are spread over the outer surface, for example, in an alternating manner.

Abstract: A lighting device and a lighting fixture of the embodiment of the present invention comprises a thermally conductive main body having a substrate support portion in one end portion, and having a through-hole and a groove portion formed in the substrate support portion, the through-hole penetrating from the one end portion to the other end portion of the main body, the groove portion extending continuously from the through-hole, a substrate mounted with a semiconductor light-emitting device, and disposed on the substrate support portion, an electrical connector connected to the semiconductor light-emitting device, a power supply device housed in the main body and configured to light the semiconductor light-emitting device, a wire connected to the power supply device and to the electrical connector while being inserted through the through-hole and the groove portion, and a base member provided in the other end portion of the main body and connected to the power supply device.

Abstract: An LED illumination lamp includes a lamp shell, a light emitting unit, a heat transfer substrate, and a heat dissipation unit. The light emitting unit is mounted on the heat transfer substrate. The lamp shell covers the light emitting unit. The heat dissipation unit includes a heat transfer rod. One end of the heat transfer rod is thermally connected to the heat transfer substrate, and the other end of the rod is thermally connected to the lamp shell for transferring heat from the heat transfer substrate to the lamp shell. The illumination LED lamp has the advantages of high heat dissipation efficiency.

Abstract: An LED bulb having bulb-shaped shell and thermally conductive fluid or gel within the shell. The bulb includes at least one LED within the shell. The bulb includes at least one LED within the shell and a base. The base can be configured to fit within an electrical socket and can include a series of screw threads and a base pin, wherein the screw threads and base pin are dimensioned to be received within a standard electrical socket. Alternatively, the base can be configured to fit within a suitable electric socket.

Abstract: The invention provides a heat-conducting and heat-dissipating nano-material, a method for preparation thereof and a heat-dissipating system. The method comprises the following steps: i) mixing a complex formed by a high molecular material and a substance having heat conduction and heat dissipation properties with tert-butyl acetate and 4-Chlorobenzotrifluoride, wherein the complex is of nano scale in particle size; and ii) placing a mixture obtained from step i) into water and stirring the mixture in water for a period of time to afford the heat-conducting and heat-dissipating material. Application of the heat-conducting and heat-dissipating material in a heat-dissipating system of LED light may simplify the manufacturing process, save raw materials used and reduce weight and size of heat sink of the heat-dissipating system.

Abstract: The present invention provides a resin chassis base that can correspond to for various components and components with various sizes by providing a plurality of sets of mounting holes thereon. The present invention provides a resin chassis base that fixes an electric substrate, and is mounted to a component provided in an electric apparatus, the resin chassis base having formed thereon the plurality of sets of mounting holes in order to be screwed to various components and/or components with various sizes. The resin chassis base is screwed by use of any one of the plurality of sets of the mounting holes formed on the resin chassis base.

Abstract: A lamp apparatus includes an apparatus body including a housing having a cap at one end side, and thermal conducting fins provided on an inner surface of the housing so as to extend from the one end side along the other end side thereof and project inward of the housing, a thermal radiation plate attached to the other end side of the housing in a state in which one surface side is in contact with the thermal conducting fins, a light-emitting body attached to the other surface side of the thermal radiation plate, and a lighting circuit disposed in the housing and configured to light the light-emitting body.

Abstract: The invention relates to an electric lamp (102) comprising a primary semiconductor light source (104) in thermal communication with a primary reflector (106). Herein, the primary reflector (106) is reflective, transparent and/or translucent. The primary reflector (106) is configured for transferring heat generated by the primary semiconductor light source (104) during operation away from said primary semiconductor light source (104). As a result, the electric lamp (102) according to the invention effectively reduces the number of parts comprised in the electric lamp (102), thereby lowering the costs of manufacturing the electric lamp (102).

Abstract: An LED-based lighting assembly includes a heat sink having at least one pedestal with an upwardly facing, upper planar surface that is raised in a vertical direction relative to an upwardly facing, lower planar surface of the heat sink. A PCB forms an aperture corresponding to the pedestal, includes electrical conductors on an upper surface thereof, and is attached to the lower planar surface. The upper planar surface extends into the aperture, and one or more LED chips attach directly to the upper planar surface and connect to the conductors such that light emits upwardly. A method of integrating LEDs with a heat sink includes mounting a PCB to a planar surface of the heat sink, mounting one or more LED chips to a raised surface of the heat sink that is not covered by the PCB, and electrically connecting the LED chips to conductors on the PCB.

Abstract: Disclosed is an all-angle light emitting element having high heat dissipating efficiency. The all-angle light emitting element has a transparent substrate, at least one light emitting chip, at least one heat dissipating rib and thermal glue. The transparent substrate has a chip fixing area with an area A. The heat dissipating rib is attached onto the transparent substrate, and the heat dissipating rib has a heat dissipating section and a heat source contact section, and the heat source contact section has an area B, and 3%?B/A?26%. The heat dissipating section and the heat source contact section of the heat dissipating rib can effectively conduct the heat generated by an optical chip and provide a 360-degree all-angle light emission.

Abstract: An LED lamp includes a heat dissipator, a cap, a module substrate fixed to an end of the heat dissipator and on which an LED chip is mounted, a light diffusing member mounted on an end surface of the heat dissipater so as to be located opposite the LED chip, a lighting circuit incorporated in the heat dissipator, and a glass block having an open end and formed with a recess. The light diffusing member is accommodated in the recess of the block through the open end of the glass block, and the heat dissipator is secured to the block so that the heat dissipator and the cap are exposed outside the block. When the block is placed on a placement surface, the LED lamp stands by itself by weight of the block in such a manner that the cap is prevented from contacting the placement surface.

Abstract: Exemplary embodiments of the present invention relate to an LED lamp including a substrate, a first LED, a second LED, a heat sink, and a transparent cover. The first LED is arranged on a first surface of the substrate. The second LED is arranged on a second surface of the substrate, the second surface being an opposite side of the substrate from the first surface. The heat sink has a mounting surface on which the substrate is arranged. The heat sink also has a reflection surface. The transparent cover covers the substrate, the first LED, and the second LED.

Abstract: Embodiments provide a light emitting device package including a package body having a through-hole; a radiator disposed in the through-hole and including an alloy layer having Cu; and a light emitting device disposed on the radiator, wherein the alloy layer includes at least one of W or Mo, and wherein the package body includes cavity including a sidewall and a bottom surface, and wherein the through-hole is formed in the bottom surface.

Abstract: A lighting apparatus includes: a bulb; a heat sink unit disposed in an inner space of the bulb, and including an end wall portion and a sleeve portion; a light-emitting unit disposed on the heat sink unit and including a first circuit board disposed on the end wall portion, a second circuit board disposed around the sleeve portion, and a plurality of light-emitting elements; a heat insulating unit disposed at at least one of a position between the end wall portion and the first circuit board, and a position between the sleeve portion and the second circuit board; an annular seat coupled to the bulb; and an electrical connector coupled to the annular seat.

Abstract: A light source apparatus is equipped with a discharge lamp, which has a glass tube that forms a light emitting part and a base member that is coupled thereto, and a mounting apparatus that holds the discharge lamp via the base member. Therein, the base member has a flange part that contacts positioning plate of the mounting apparatus, and a fixed part that is urged with a pressing force that presses the flange part to the positioning plate. Furthermore, the mounting apparatus has a fixing arm that urges the fixed part by a compression coil spring.

Abstract: An organic electroluminescent display device includes an organic electroluminescent display (OLED) panel having a first surface for displaying images and a second surface opposite to the first surface, a thermal pad attached to the second surface, a heat sink attached to the thermal pad such that the thermal pad is disposed between the OLED panel and the heat sink, a bottom case spaced apart from the heat sink and protecting the second surface of the OLED panel, the bottom case formed of a metallic material, and a top case covering edges of the first surface of the OLED panel and combined with the bottom case, wherein a plurality of heat-radiating pins are formed on a surface of the heat sink facing the bottom case.

Abstract: A lighting fixture utilizing LED light sources for illumination of commercial, outdoor and other large area applications incorporates efficient heat dissipation and improved convective air flow. An integrated heat transfer assembly is disclosed that is configured to enhance heat dissipation by providing an efficient thermal conductive pathway for radiation of heat to an external environment. The lighting fixture body is configured with a lens body and heat sink having a chimney tube with internally facing finned heat sink arrangement for providing enhanced convective air flow through the light fixture body. When the heat sink transfers heat from the LED light sources during operation so as to create heated air surrounding the heat sink, ambient air is drawn through the chimney and the heated air is exhausted through air gaps so as to create a conductive air current with the environment.

Abstract: This invention relates to the thermal management, extraction of light, and cost effectiveness of Light Emitting Diode, or LED, electrical circuits. An integrated circuit LED submount is described, for the packaging of high power LEDs. The LED submount provides high thermal conductivity while preserving electrical insulation. In particular, a process is described for anodizing a high thermal conductivity aluminum alloy sheet to form a porous aluminum oxide layer and a non-porous aluminum oxide layer. This anodized aluminum alloy sheet acts as a superior electrical insulator, and also provides surface morphology and mechanical properties that are useful for the fabrication of high-density and high-power multilevel electrical circuits.

Abstract: An illumination source includes a heat sink with an inner core region and an outer core region having structures to dissipate heat from the inner core region. An LED assembly is pressed into a thermally-conductive compound disposed between the LED assembly and the inner core region. A retaining clamp is used to mechanically press the LED assembly into the thermally-conductive compound.

Abstract: An LED bulb has a base, a shell connected to the base, and a thermally conductive liquid held within the shell. The LED bulb has a plurality of LEDs mounted on LED mounting surfaces disposed within the shell. The LED mounting surfaces face different radial directions, and the LED mounting surfaces are configured to facilitate a passive convective flow of the thermally conductive liquid within the LED bulb to transfer heat from the LEDs to the shell when the LED bulb is oriented in at least three different orientations. In a first orientation, the shell is disposed vertically above the base. In a second orientation, the shell is disposed on the same horizontal plane as the base. In a third orientation, the shell is disposed vertically below the base.