Abstract: To provide a method for manufacturing a lightweight light-emitting device having a light-emitting region on a curved surface. The light-emitting region is provided on a curved surface in such a manner that a light-emitting element is formed on a flexible substrate supported in a plate-like shape and the flexible substrate deforms or returns.

Abstract: To provide a method for manufacturing a lightweight light-emitting device having a light-emitting region on a curved surface. The light-emitting region is provided on a curved surface in such a manner that a light-emitting element is formed on a flexible substrate supported in a plate-like shape and the flexible substrate deforms or returns.

Abstract: A display panel, a method for manufacturing the same, and a display device are provided. The display panel includes a first substrate and a second substrate opposite to each other; a display structure on a side of the first substrate facing the second substrate; a sealant surrounding the display structure; and a barrier structure surrounding the display structure and located between the display structure and the sealant, the barrier structure being disposed on one of the first substrate or the second substrate and being spaced apart from the other of the first substrate or the second substrate.

Abstract: A display device includes a display circuit layer including a first surface and a second surface and including a display area in which an image is displayed on the first surface, a heat conductive sheet overlapping the display circuit layer below the second surface, and an optical fingerprint sensor inside the display area below the heat conductive sheet and overlapping the display circuit layer. The heat conductive sheet includes a first area overlapping the optical fingerprint sensor and a second area overlapping the display area around the optical fingerprint sensor. The heat conductive sheet includes a heat conductive material, has a shape having a light transmittance required for sensing by the optical fingerprint sensor in the first area, and has no light transmittance in the second area.

Abstract: A display panel, a production method and a display device thereof. The display panel includes: a flexible circuit board, a touch layer, a cover plate, and an auxiliary transparent layer disposed close to the cover plate; the flexible circuit board is connected to the touch layer, a first sealant is provided at a boundary position between the touch layer and the flexible circuit board and is located on a side of the flexible circuit board facing the cover; a distance between a surface of the auxiliary transparent layer facing the cover plate and the cover plate is not greater than a distance between a surface of the first sealant facing the cover plate and the cover plate.

Abstract: A display device includes a substrate having a pixel area with at least a first rounded corner portion and first to third non-pixel areas arranged sequentially along an outer circumference of the pixel area. An internal circuit in the first non-pixel area has a first end portion adjacent to the first rounded corner portion of the pixel area. The first end portion of the internal circuit is rounded in accordance with the first rounded corner portion. A plurality of routing wires are in the third non-pixel area below the pixel area. The routing wires extending to the pixel area via the second non-pixel area and the first non-pixel area. The routing wires include at least a first routing wire connected to the pixel area passing an area of the first end portion of the internal circuit.

Abstract: A stretchable display device includes a stretchable substrate, at least a portion of which is stretchable in at least one direction, a plurality of light emitting units formed on the stretchable substrate, the light emitting units being spaced apart from each other, the light emitting units each including a pixel electrode, an emission layer, a common electrode, and a common wiring electrode conducted to the common electrode, and a plurality of encapsulations covering and protecting the plurality of light emitting units, respectively.

Abstract: A display apparatus including a substrate; a display area arranged on the substrate and including a plurality of pixels, and a peripheral area arranged outside the display area; a dam surrounding the display area; a crack detector arranged between the dam and an end of the substrate and electrically connected to at least one of the plurality of pixels; a crack prevention dam arranged between the dam and the end of the substrate; and an encapsulation layer including a first inorganic layer, an organic layer, and a second inorganic layer, each covering the display area and a portion of the peripheral area. The first inorganic layer and the second inorganic layer in the encapsulation layer extend to the end of the substrate.

Abstract: A light emitting device which inactivates microorganisms is disclosed. The light emitting device may include a flexible light emitting layer emitting a light; and a transparent or translucent layer over the flexible light emitting layer. The light may travel through and exit an exterior surface of the transparent or translucent layer, creating an exiting light. The exiting light exiting the transparent or translucent layer may have at least a portion thereof having a wavelength in a range of 380 to 420 nanometers, and may disinfect the exterior surface of the transparent or translucent layer. The light emitting device may be used alone to create a self-disinfecting high touch surface, e.g., on a door, or may be shaped to mate with other structure to create a disinfecting high touch surface.

Abstract: Electronic device encapsulation process, assisted by a laser, for obtaining a sealed electronic device, wherein said process comprises: providing a first substrate and a second substrate, the second substrate being transparent in the emission wavelength of the laser, depositing an intermediate bonding contour layer on one or both of the substrates; depositing electronic device components on one or both of the substrates; joining the first substrate and second substrate with the electronic device components in-between the substrates; using the laser to direct a laser beam onto the intermediate bonding contour layer with a predefined progressive scan pattern, such that the intermediate bonding contour layer is progressively melted and forms a seal, bonding the substrates together. Preferably, each linear laser pass overlaps longitudinally the previous and the following linear laser passes along said contour.

Abstract: A strongly scattering optoceramic converter material having a density of less than 97% is provided, as well as a method for producing such an optoceramic material. By appropriately choosing in particular the composition, blending method, and sintering conditions, the production method permits to produce converter materials with tailored properties.

Abstract: An electronic device including a display is provided. The electronic device includes a housing, a display, and a bonding layer. The housing includes a front plate including a flat portion and at least one curved portion bent from a periphery of the flat portion, and disposed to face a first direction, a rear plate disposed to face a second direction that is opposite to the first direction, and a side member including a first surface disposed to face a direction that is perpendicular to the first and second directions, and extending while facing the curved portion and surrounding at least a partial space between the front plate and the rear plate. A first groove is recessed on the first surface in the second direction and in which an edge of the curved portion is accommodated, and a second groove is recessed on the inner side of the housing when viewed from the top of the front plate, the second groove is recessed in the second direction, and to which a bonding liquid is applied.

Abstract: Embodiments of the invention include a light emitting device including a substrate and a semiconductor structure including a light emitting layer. A first reflective layer surrounds the light emitting device. A wavelength converting element is disposed over the light emitting device. A second reflective layer is disposed adjacent a first sidewall of the wavelength converting element.

Abstract: A display apparatus includes a substrate including a plurality of pixel areas spaced from each other, and a plurality of non-pixel areas respectively located between neighboring pixel areas, a plurality of pixel electrodes respectively located in at least a part of the plurality of pixel areas, and a scattering layer on the plurality of pixel electrodes, and including a plurality of non-scattering areas respectively at a central portion of each of the plurality of pixel areas, and a plurality of scattering areas respectively between neighboring non-scattering areas.

Abstract: The present disclosure provides a cover plate for encapsulating a display substrate, a display panel including the cover plate, a display device including the display panel and a method for encapsulating the display panel. The cover plate includes: a base substrate including a display area and an encapsulation area arranged at a periphery of the display area; and an encapsulation layer, a first barrier layer, a water absorption layer and a second barrier layer successively arranged in the encapsulation area of the base substrate in a direction from the display area to the encapsulation area.

Abstract: An one-time programmable memory cell includes: an upper electrode; an insulating layer beneath the upper electrode; and a lower electrode with electrical field enhancement structure beneath the insulating layer, wherein the electrical field enhancement structure has a least one tip portion. The one-time programmable memory cell also includes a shallow trench isolation region, disposed adjacent to the insulating layer and the lower electrode, wherein the electrical field enhancement structure is surrounded by the shallow trench isolation region and the upper electrode partially covers the shallow trench isolation region.

Abstract: An optoelectronic assembly comprising an optoelectronic component, which comprises a specularly reflective surface and comprising a radiation cooler in direct physical contact with the optoelectronic component. The radiation cooler is arranged above the specularly reflective surface.

Abstract: A touch display panel and a touch display device including an array substrate, a light-emitting layer, an encapsulation layer, and a touch function layer are provided. The array substrate includes a first trace. The touch function layer includes a second trace. The second trace is electrically connected to the chip by a bonding end, in which the chip is integrated with functions of display control and touching control. This realizes a control of a display function and a touch function of the touch display panel or the touch display device, thereby reducing the number of chips. At the same time, the stepped structure of the edge of the encapsulation layer effectively alleviates the steep gradient between the touch function layer and the array substrate, thereby facilitating the electrical connection of the trace on the touch function layer to the trace on the array substrate.

Abstract: Disclosed herein is a light diffusion lens. The light diffusion lens according to one embodiment of the present disclosure includes a bottom surface, an incidence surface concavely formed inward the bottom surface from one area (an incidence hole) thereof, and an exit surface from which light incident through the incidence surface is emitted, wherein at least two protrusions are formed on the incidence surface symmetrically in relation to an optical axis or at least two second dimples are formed on the exit surface symmetrically in relation to the optical axis.

Abstract: Various aspects of a light emitting apparatus includes a substrate. Various aspects of the light emitting apparatus include a light emitting die arranged on the substrate. The light emitting die includes one or more side walls. Various aspects of the light emitting apparatus include a reflective die attach material extending along the one or more side walls of the light emitting die.

Abstract: The present disclosure provides a compound used as the CPL material. The compound has a structure as shown in chemical formula I, in which L1 is selected from the group consisting of a substituted or unsubstituted C6-C30 arylene, C3-C30 heteroarylene, a substituted or unsubstituted C10-C60 fused arylene, and a substituted or unsubstituted C10-C60 fused heteroarylene; Ar1 is selected from the group consisting of a substituted or unsubstituted C6-C30 arylene, C3-C30 heteroarylene, a substituted or unsubstituted C10-C60 fused arylene, and a substituted or unsubstituted C10-C60 fused heteroarylene; n is 1 or 2, and when n is 2, the two Ar1 are identical or different; R1, R2, R3 and R4 are each independently selected from the group consisting of hydrogen, and a substituted or unsubstituted aryl or fused aryl, R1 and R2 are optionally bonded to form a ring, and R3 and R4 are optionally bonded to form a ring.

Abstract: Provided is a light emitting apparatus including a substrate including a plurality of light emitting devices, wherein the substrate further includes a plurality of first members configured to diffuse light emitted from at least one of the light emitting devices, and a second member that is positioned between the first members, wherein the second member includes a light absorbing layer.

Abstract: A lighting system with a lamp including a lighting area with a disc-shaped part emitting cold-white light and ring-shaped part emitting warm white light is provided. The lighting system is programmed to automatically and periodically change between light from these two parts.

Abstract: The present application relates to an encapsulation film, a method for producing the same, an organic electronic device comprising the same, and a method for preparing an organic electronic device using the same, which allows forming a structure capable of blocking moisture or oxygen introduced into an organic electronic device from the outside, and can prevent occurrence of bright spots of the organic electronic device.

Abstract: A display panel and a display device are provided. An encapsulation layer of the display panel includes at least a first organic layer and a first inorganic layer that are stacked. In a corresponding electronic component arrangement area, a cross section of a contact surface of the first organic layer and the first inorganic layer is an arc, so that a part of light blocked by a sub-pixel light-emitting unit can pass through a lighting path of an electronic component to reach a lighting unit after being refracted by the arc, thereby improving light extraction efficiency of the electronic component.

Abstract: A display encapsulation structure and a manufacturing method thereof are provided. The manufacturing method includes steps of providing a sacrificial layer, a display device encapsulation structure, and a transparent cover; providing an encapsulating film layer; and removing the sacrificial layer to expose the transparent cover. The encapsulating film layer is removed from the transparent cover plate when the sacrificial layer is removed, so as to avoid affecting luminous efficiency by the encapsulating film layer, thereby improving the luminous efficiency of the display encapsulation structure.

Abstract: A display module and an electronic device are provided. The display module includes a substrate, a display part, a driving chip, a flexible circuit, and a buffer part. The substrate includes a soldering portion. The display part is disposed on a light emitting side of the substrate. The driving chip is disposed on a light emitting side of the soldering portion. The flexible circuit board is bent from a first surface of the soldering portion to a second surface of the soldering portion. The buffer part is disposed between the flexible circuit board and the soldering portion.

Abstract: A packaging structure, a display component and a display device are provided by the present disclosure. The packaging structure includes: a substrate; a light-emitting unit arranged on the substrate; a packaging layer, by which the light-emitting unit is packaged on the substrate; and a water-absorbing layer which is arranged in the packaging layer and completely wrapped by the packaging layer.

Abstract: A light emitting diode includes a pixel unit. The pixel unit may include a first sub-pixel configured to emit white light. The first sub-pixel may include a first microcavity adjustment layer, a scattering layer, a first transparent electrode layer, a first emitting layer, and a first semi-transparent electrode layer. The scattering layer includes a plurality of patterns formed on a surface of the scattering layer. The scattering layer may be configured to reduce color cast of the first sub-pixel to be less than about 0.025 at viewing angles in a range of about ?50 degree to +50 degree.

Abstract: A light emitting device includes a light emitting element, a light guide member, a reflecting member, a wavelength conversion member. The light emitting element has a light emitting surface and lateral surfaces. The light guiding member is provided on at least a portion of the lateral surfaces of the light emitting element. The reflecting member is provided on the lateral surface of the light emitting element with the light guiding member interposed therebetween. The wavelength conversion member is provided on the light emitting surface of the light emitting element, the light guiding member and the reflecting member. The wavelength conversion member is provided with a recess between an outer lateral surface of the wavelength conversion member and the light guiding member. The reflecting member is provided in the recess.

Abstract: An organic light-emitting display apparatus includes a substrate, an inorganic insulation film on the substrate, an organic insulation film on the inorganic insulation film, an organic light-emitting device on the organic insulation film, and an encapsulation unit including a first inorganic film covering the organic light-emitting device and having a first boundary portion contacting the organic insulation film, an organic film covering the first inorganic film and having a second boundary portion contacting the inorganic insulation film, and a second inorganic film covering the organic film and having a third boundary portion contacting the substrate.

Abstract: A display device includes a substrate including a display area and a non-display area, and a common electrode line at the non-display area of the substrate. The common electrode line may include a line unit and a plurality of protrusions that protrude from the line unit in a direction opposite from the display area.

Abstract: A display panel, a packaging method thereof, and a display device having same are described. The display panel has: a substrate having a display region and a non-display region surrounding the display region; electrode lines distributed on a surface of the substrate, and located within the display region; a package covering plate attached to the surface of the substrate having the electrode lines; a double-sided sealant adhered to the package covering plate and the surface of the substrate having the electrode lines; a conductive nanofiber layer disposed between the double-sided sealant and the substrate, and located on the electrode lines of the display region. The conductive nanofiber layer can achieve good surface contact and parallel connection with the electrode lines. Therefore, surface resistance of the electrode lines in the display panel is effectively reduced, and luminous efficiency and brightness uniformity of the display panel are improved.

Abstract: A light emitting device package including a partition structure having first and second surfaces, and first to third light emission windows penetrating through the first and second surfaces, a cell array including first to third light emitting devices on the first surface of the partition structure and overlapping the first to third light emission windows, each of the first to third light emitting devices including a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer, first and second wavelength conversion portions filling interiors of the first and second light emission windows, and having a meniscus-shaped interfaces, a first encapsulating portion including a light-transmissive organic film layer that fills the third light emission window and covers the first and second wavelength conversion portions, and a second encapsulating portion covering the first and second encapsulating portions and including a light-transmissive inorganic film layer.

Abstract: A pixel structure. The pixel structure includes a base substrate; an insulating island on the base substrate; a light emitting element on a side of the insulating island away from the base substrate; an insulating layer on the base substrate and surrounding the insulating island, the insulating layer spaced apart from the insulating island by a groove; and a reflective layer on a lateral side of the insulating layer surrounding a periphery of the light emitting element, and configured to reflect light laterally emitted from the light emitting element to exit from a light emitting surface of the pixel structure. The insulating layer has a height relative to a main surface of the base substrate greater than a height of the insulating island relative to the main surface of the base substrate. The reflective layer is in direct contact with the base substrate in the groove.

Abstract: The present invention relates to a lighting fixture having a plurality of light sources positioned at the front of a support plate. The light sources each having at least a first and a second electrical terminal. The support plate includes an upper conductive layer and a lower conductive layer. The upper and lower layers are electrically insulated from one another by an intermediate insulating layer, and in that, for each light source, the first and the second electrical terminals are electrically connected respectively to the upper and lower layer, or conversely.

Abstract: A display unit of the present disclosure includes: a plurality of pixels configured to emit emission light different from one another; and an insulating film provided between the plurality of pixels and having a reflective surface with respect to the emission light, in which an angle of the reflective surface of the insulating film is set for each of the pixels.

Abstract: Embodiments of the present invention generally relate to a touch sensible organic light emitting device. The organic light emitting device according to an exemplary embodiment of the present invention comprises: a substrate; a thin film transistor disposed on the substrate; an organic light emitting element connected to the thin film transistor and receiving a data voltage; a plurality of encapsulation thin films disposed on the organic light emitting element, and encapsulating the thin film transistor and the organic light emitting element; a planarization layer disposed on the encapsulation thin film; and a touch sensor disposed on the planarization layer.

Abstract: The present disclosure provides an OLED package structure, OLED device, display device and method for fabricating OLED package structure. The OLED package structure includes a substrate, a cover plate and a first sealant layer. The substrate, the cover plate and the first sealant layer together delimiting a sealed space. The OLED package structure further includes a functional sealant layer formed by filling the sealed space with a functional sealant, and a second sealant layer formed by a second sealant disposed between the substrate and the functional sealant layer. The second sealant has a density less than a density of the functional sealant.

Abstract: A method for manufacturing an optical-semiconductor device, including forming a plurality of first and second electrically conductive members that are disposed separately from each other on a support substrate; providing a base member formed from a light blocking resin between the first and second electrically conductive members; mounting an optical-semiconductor element on the first and/or second electrically conductive member; covering the optical-semiconductor element by a sealing member formed from a translucent resin; and obtaining individual optical-semiconductor devices after removing the support substrate.

Abstract: A method for manufacturing a light emitting device includes: preparing a baseplate having a plate surface on which a protrusion is disposed; forming a first resin frame having an opening on the plate surface, wherein the opening is located above the protrusion; forming a second resin in the opening; detaching the baseplate; bonding a light emitting element to a surface of the second resin surface that has been exposed as a result of detaching the baseplate; and forming a third resin that surrounds lateral faces of the light emitting element and that covers and contacts a portion of the first resin frame.

Abstract: The present disclosure provides a flexible organic light-emitting diode (OLED) device and a fabrication method thereof, wherein the flexible organic light emitting diode (OLED) device includes a substrate, an array unit layer, a light-emitting device layer, and an encapsulation layer that are sequentially disposed. The encapsulation layer includes a first inorganic layer, a first organic layer and a second inorganic layer that are sequentially disposed. The second inorganic layer has a continuous wavy curved-configuration, and an interface between the second inorganic layer and the first organic layer has a continuous wavy curved-shape. The present disclosure is directed to a flexible OLED device using a novel outer inorganic layer to increase the contact area between the outer inorganic layer and the inner organic layer, thereby effectively reducing risks of breakage of the outer inorganic layer.

Abstract: A method of fabricating a display device includes providing a display substrate with a plurality of pixels, mounting an encapsulation substrate on the display substrate, bonding the display substrate and the encapsulation substrate to form a display panel, and forming a module hole penetrating a hole region of the display panel in the display panel. The hole region encloses the module hole, and the display substrate and the encapsulation substrate may be bonded by irradiating the hole region with an ultra-high-frequency pulsed laser. The display substrate and the encapsulation substrate are bonded in the hole region as the ultra-high-frequency pulsed laser is irradiated onto the hole region.

Abstract: The present disclosure discloses an active matrix organic light-emitting diode display device and a manufacturing method thereof. The method includes forming a sacrificial layer on a carrier layer; forming a flexible substrate on the sacrificial layer; forming a first insulating layer on the flexible substrate; forming at least one transition metal chalcogenide based backplane on the first insulating layer; and forming an opening unit after forming a capping layer on the at least one transition metal chalcogenide based backplane; and forming at least one active matrix organic light-emitting diode unit which is electrically connected to the at least one transition metal chalcogenide based backplane in the opening unit.

Abstract: A disclosed light-emitting device may provide white light with a cyan gap coinciding with a melanopic sensitivity range and thus having reduced melanopic content. The disclosed light-emitting device may include a light source providing violet or blue light with a peak wavelength under 450 nanometers (nm). The disclosed light-emitting device may include at least one down-converter coupled to and located downstream of the light source and configured with a long-wavelength onset to convert the spectrum of the violet or blue light to generate white light with a spectral power content in a 447-531 nm wavelength range that is less than or equal to 10% of a total spectral power content in a 380-780 nm wavelength range. The disclosed light-emitting device may be incorporated in a light engine system that further includes a control system that controls a drive current to the light-emitting device.

Abstract: An encapsulation structure, a display panel and a manufacturing method thereof are provided. The display panel includes a base substrate; a device to be encapsulated on the base substrate; an encapsulation film on the base substrate, the encapsulation film covering the device to be encapsulated; and an edge encapsulation member on an edge of the encapsulation film, the edge encapsulation member being configured to cover the edge of the encapsulation film.

Abstract: The present application relates to a display screen and a display device. The display screen includes: a substrate; a display device disposed on the substrate, the display device including several film layers; and a thin film encapsulation structure disposed on a side of the display device away from the substrate, the thin film encapsulation structure including a first encapsulation film disposed on the display device, and a first atomic layer deposition film disposed on the first encapsulation film; wherein a thermal expansion coefficient of the first encapsulation film is between a thermal expansion coefficient of the film layer immediately adjacent to the first encapsulation film on the display unit and a thermal expansion coefficient of the first atomic layer deposition film.

Abstract: A display device according to an embodiment of the present invention includes: a base material including a display region and a curved region; a wiring line disposed on the base material and disposed from the display region over the curved region; and a heat dissipating layer formed corresponding to a position at which the wiring line is disposed in the curved region.

Abstract: An organic light-emitting display apparatus includes a lower substrate having a display area, and a sealing area outside of the display area, an upper substrate facing the lower substrate, a display unit at the display area, a sealing member at the sealing area, and adhering the upper substrate to the lower substrate, a metal pattern layer between the lower substrate and the sealing member, and defining a plurality of through-portions, a first metal layer along an edge of the display unit, and spaced from the metal pattern layer, and a plurality of metal patterns having island shapes between the metal pattern layer and the first metal layer.

Abstract: A display device includes a substrate, a plurality of pixels above the substrate, each of the plurality of pixels including a first electrode, a light emitting layer above the first electrode, and a second electrode above the light emitting layer, a display region including the plurality of pixels, a first organic insulating layer located between the substrate and the light emitting layer, and a sealing layer above the second electrode and covering the plurality of pixels. The first organic insulating layer includes a first opening part surrounding the display region, the sealing layer has a first inorganic insulating layer, a second organic insulating layer and a second inorganic insulating layer, the first inorganic insulating layer and the second inorganic insulating layer cover the first opening part, a second opening part passing through the first inorganic insulating layer and the second inorganic insulating layer.