Abstract: A display substrate and a display apparatus. The display substrate includes a display area provided with pixel circuits arranged in an array and a non-display area provided with M light emitting driving circuits, M control driving circuits and M reset driving circuits. Odd-numbered light emitting driving circuits are electrically connected with first and second light emitting clock signal lines, and even-numbered light emitting driving circuits are connected with third and fourth light emitting clock signal lines; and/or, odd-numbered control driving circuits are electrically connected with first and second control clock signal lines, and even-numbered control driving circuits are connected with third and fourth control clock signal lines; and/or, odd-numbered reset driving circuits are electrically connected with first and second reset clock signal lines, and even-numbered reset driving circuits are connected with third and fourth reset clock signal lines.

Abstract: A light-emitting element with high emission efficiency. The light-emitting element includes a first organic compound, a second organic compound, and a guest material. The LUMO level of the first organic compound is lower than the LUMO level of the second organic compound. The HOMO level of the first organic compound is lower than the HOMO level of the second organic compound. The HOMO level of the guest material is higher than the HOMO level of the second organic compound. The energy difference between the LUMO level of the guest material and the HOMO level of the guest material is larger than the energy difference between the LUMO level of the first organic compound and the HOMO level of the second organic compound. The guest material has a function of converting triplet excitation energy into light emission. The first organic compound and the second organic compound form an exciplex.

Abstract: A display panel includes a display layer including a light emitting element generating a source light, a first color filter on the display layer, a first color control layer between the display layer and the first color filter and including a first surface facing the first display layer and a second surface facing the first color filter, and a plurality of capping layers encapsulating the first color control layer. Among the capping layers, a capping layer between the first surface of the first color control layer and the display layer has a first-first thickness that is different from a second-first thickness of a capping layer between the second surface of the first color control layer and the first color filter.

Abstract: A pixel module includes a circuit board, a plurality of unit pixels arranged on the circuit board, and a molding member covering the plurality of unit pixels. The molding member includes a light diffusion layer and a black molding layer covering the light diffusion layer.

Abstract: Electronic devices may be provided having internal components mounted to a structural glass support member. The structural glass support member may have a planar front surface that forms a front surface of the device. The structural glass support member may have bent portions that form sidewall surfaces of the device. Portions of the structural glass support member may form a transparent display cover layer. A rigid or flexible display may be mounted to the structural glass support member. Additional internal device components may be mounted to the display. A thin enclosure for enclosing the internal components in the device may be mounted to the structural glass support member. The thin enclosure may be mounted to the structural glass support member using a peripheral member. The thin enclosure may be free from attachments to internal components or may be adhesively bonded to one or more internal components.

Abstract: The organic electroluminescence display device of an embodiment of the present invention includes a substrate, a plurality of pixels formed on the substrate, and a sealing film that covers the plurality of pixels. The sealing film includes a first barrier layer, a base layer covering the top surface of the first barrier layer, an inter layer locally formed on the top surface of the base layer, and a second barrier layer covering the top surface of the base layer and the top surface of the inter layer. The inter layer is formed so as to cover a step on the top surface of the base layer.

Abstract: An organic electroluminescence device exhibiting high light emission efficiency is provided, which includes a first electrode, a second electrode, and an emission layer disposed between the first electrode and the second electrode. The emission layer may include a compound represented by Formula 1.

Abstract: The present disclosure provides a display substrate, a manufacturing method and a display device. The display substrate includes a display region, and a non-display region surrounding the display region and including an encapsulation adhesive region surrounding the display region. The display substrate further includes an encapsulation base layer arranged at the encapsulation adhesive region; and a fanout layer arranged at the non-display region and including a first reuse portion. An orthogonal projection of the first reuse portion onto a base substrate of the display substrate at least partially overlaps an orthogonal projection of a first target region of the encapsulation adhesive region onto the base substrate, and the first reuse portion is reused as the encapsulation base layer at the first target region.

Abstract: Provided is a light emitting apparatus including a substrate including a plurality of light emitting devices, wherein the substrate further includes a plurality of first members configured to diffuse light emitted from at least one of the light emitting devices, and a second member that is positioned between the first members, wherein the second member includes a light absorbing layer.

Abstract: An optical device includes: a first substrate; a second substrate disposed opposite to the first substrate; a first conductive layer disposed on the first substrate, wherein the first conductive layer includes a first surface and a third side surface connecting to the first surface; a second conductive layer disposed on the second substrate; a sealant disposed between the first conductive layer and the second conductive layer and having a first side and a second side opposite to the first side; a liquid crystal layer disposed between the first conductive layer and the second conductive layer and locating at the first side of the sealant; and a barrier layer disposed between the first conductive layer and the second conductive layer and locating at the second side of the sealant, wherein at least part of the first surface and the third side surface are not covered by the barrier layer.

Abstract: A display assembly for a vehicle includes a support chassis having a recess, and a display module at least partially received within the recess, the display module having a front side and a back side. A cover lens is attached to the front side of the display module with a bonding material and coupled to the support chassis in a floating mounting arrangement using a flexible adhesive.

Abstract: The present disclosure relates to a display device, in more detail, to a display device in which the size of the bezel is reduced while simply improving the assembly of components constituting the display device.

Abstract: A display device can include an organic light emitting device in a display area on a substrate, a thin film transistor being connected with the organic light emitting device, a protecting portion surrounding at least a portion of a camera area on the substrate, a dam structure disposed between the thin film transistor and the protecting portion, an encapsulation layer, and a hole in the camera area. The encapsulation layer can include a first encapsulation layer, a second encapsulation layer on the first encapsulation layer, and a third encapsulation layer on the second encapsulation layer. The hole can be provided inside the display area, and the first encapsulation layer and the third encapsulation layer are disposed on a side surface and an upper surface of the dam structure.

Abstract: A package structure includes a semiconductor device and an adhesive pattern. The adhesive pattern surrounds the semiconductor device, wherein an angle ? is formed between a sidewall of the semiconductor device and a sidewall of the adhesive pattern, 0°<?<90° wherein the adhesive layer has a first opening misaligned with a corner of the semiconductor device closest to the first opening.

Abstract: Provided is a novel compound capable of improving the luminous efficiency, stability and life span of a device, an organic electric element using the same, and an electronic device thereof.

Abstract: A light emitting device includes: a base; a first terminal and a second terminal located at a surface of the base; a light emitting element array chip mounted on the base, the light emitting element array chip including: a support substrate, a plurality of first wirings and a plurality of second wirings disposed on the support substrate, and a plurality of light emitting elements, each of the light emitting elements arranged on the first wiring and the second wiring and electrically connected to the first wiring and the second wiring; and a plurality of wires including a first wire connecting the first wiring to the first terminal, and a second wire connecting the second wiring to the second terminal.

Abstract: The present disclosure provides an array substrate, a display panel and a display apparatus to avoid influence of a steep slope of a planarization layer on touch performance. The array substrate includes a display region and a mounting hole located in the display region.

Abstract: A display device includes: an array substrate including a pixel array disposed on a display area, a first transfer wiring disposed on a peripheral area adjacent to the display area and electrically connected to the pixel array, a second transfer wiring disposed on the peripheral area adjacent to the display area and electrically connected to the pixel array, and a barrier member disposed between the first transfer wiring and the second transfer wiring, the barrier member including an inorganic insulation material; and a sealing member disposed between the array substrate and an encapsulation substrate to combine the array substrate with the encapsulation substrate, the sealing member contacting at least a portion of the first transfer wiring and the second transfer wiring.

Abstract: The method of manufacturing a light emitting module includes: providing a light guiding plate having a first main surface serving as a light emitting surface; and a second main surface positioned opposite to the first main surface and provided with a recess; providing a light adjustment portion containing a fluorescent material; providing a light emitting element unit in which a light emitting element comprising an electrode is integrally bonded to the light adjustment portion; bonding the light adjustment portion of the light emitting element unit to the recess; and forming wiring on the electrode of the light emitting element.

Abstract: A display device may include a display substrate, an encapsulation substrate, and a sealing member. The display substrate may include a pixel defining layer. The sealing member may include a first portion having an inner portion between the display substrate and the encapsulation substrate and overlapping an edge portion of the pixel defining layer and an outer portion extending from the inner portion and located outside the inner portion; and a second portion between the outer portion and the display substrate.

Abstract: The present application discloses a display panel, an array substrate, and a manufacturing method thereof. The array substrate includes a substrate, a thin-film transistor layer, an insulating nanoparticle layer, and an organic polymer layer. The thin-film transistor layer is disposed on the substrate. The insulating nanoparticle layer is disposed on the substrate and covers the thin-film transistor layer. The organic polymer layer is stacked on a side of the insulating nanoparticle layer away from the thin-film transistor layer and covers the insulating nanoparticle layer.

Abstract: A method for treating a lead-containing glass that makes it possible to limit the migration of the lead contained in this glass, the method successively comprising the following distinct steps: a step of placing the lead-containing glass in contact with a solution comprising perchloric acid; a step of heat treatment of the glass at a temperature less than or equal to the glass transition temperature of the glass.

Abstract: A dielectric ceramic composition that contains an oxide of A, R, and B and an oxide of Mn. The A is at least one selected from the group consisting of K and Na. The R is at least one selected from the group consisting of La, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, Y, and Sc. The B is at least one selected from the group consisting of Nb and Ta. The molar ratio of the A:R:B:Mn is 2?x:1+x/3:5+y:z. The x, y, and z satisfy ?0.3?x?0.6, ?0.5?y?0.5, and 0.001?z?0.5, respectively.

Abstract: The disclosure provides a display substrate and a manufacturing method thereof, a display panel and a display apparatus. The display substrate includes a substrate and an electroluminescent layer on the substrate. The display substrate further includes a first reflective electrode layer, a buffer layer and a second reflective electrode layer sequentially formed on a side of the electroluminescent layer distal to the substrate. The buffer layer is provided with a first hollow region, the second reflective electrode layer is provided with a second hollow region, an overlapping region between the first hollow region and the second hollow region is configured to transmit light emitted by the electroluminescent layer. The present disclosure can detect the light-emitting brightness of each sub-pixel in the organic electroluminescent layer in real time to improve light-emitting efficiency.

Abstract: An encapsulation structure, an electronic apparatus, and an encapsulation method are provided. The encapsulation structure includes: a base substrate, an organic encapsulation layer and a barrier dam that are on the base substrate. The barrier dam is disposed outside the organic encapsulation layer; and the barrier dam includes an upper surface away from the base substrate and a side surface facing the organic encapsulation layer, and at least one of the upper surface and the side surface includes a groove and a protrusion.

Abstract: A window substrate includes a glass substrate, and a shock wave transmission layer on a first surface of the glass substrate, wherein a density and elastic modulus of the shock wave transmission layer are respectively less than those of the glass substrate.

Abstract: A light-emitting device includes a substrate including circuit pads and a resin portion. A frame disposed on the substrate to form a first space, first to third light sources, and first and second encapsulants. The frame includes an outer wall and a first partition in the first space to form the first space as independent second and third spaces. A first and second light sources are disposed at the second space and provide first and second light beams respectively. A third light source is disposed at the third space and provides a third light beam. A first encapsulant is filled at the second space to seal the first and second light sources. A second encapsulant is filled at the third space to seal the third light source. The second encapsulant includes a first wavelength conversion material converting the third light beam into a fourth light beam.

Abstract: A LED filament (100) comprising an elongated substrate (110), a first region (120), a second region (130) and a third region (140) arranged between the first and second region. The first region comprises a plurality of LEDs (121) of a first LED type configured to emit light with a first CCT, arranged along at least one row on the substrate. The second region comprises a plurality of LEDs (131) of a second LED type configured to emit light with a second CCT, different from said first CCT, arranged along at least one row on the substrate. The third region (140) comprises at least one first LED (141) of the first LED type and at least one second LED (142) of the second LED type. A first LED of the at least one first LED of the third region is located next to a second LED of the second region. A second LED of the at least one second LED of the third region is located next to a first LED of the first region.

Abstract: An electronic device may have a display with an active area configured to display images and an inactive area that is free of pixels and that does not display images. Touch sensor sense lines may have portions located in the active area and portions located in the inactive area. The active and inactive areas may be characterized by respective reflectivity values. To match the reflectivities of the active and inactive areas and thereby avoid undesired visually distinguishable differences in the appearances of these areas, the touch sensor circuitry in the inactive areas may be configured to match the reflectivity values of the active and inactive areas. Sense line portions in the inactive area may have metal traces of enhanced reflectivity and/or uneven surface topology to enhance ambient light reflections through a circular polarizer that overlaps the active and inactive areas.

Abstract: The present application provides a resin composition which effectively inhibits a photobleaching phenomenon as well as realizes excellent external blocking properties and optical properties through the secondary structure transition concentration and relaxation time of the resin composition, a reliability evaluation method thereof, and a color conversion film comprising the same.

Abstract: A semiconductor module includes: a dissipating metal plate including a recess provided on an upper surface; an insulating substrate provided on a bottom surface of the recess and including a circuit pattern; a semiconductor device provided on the insulating substrate and connected to the circuit pattern; a case bonded to a peripheral portion on the upper surface of the dissipating metal plate and surrounding the insulating substrate and the semiconductor device; a case electrode provided on the case; a wire connecting the semiconductor device and the case electrode; and a sealant provided in the case and sealing the insulating substrate, the semiconductor device, and the wire, wherein a sidewall of the recess has a taper.

Abstract: A multi-layer coating on an outer surface of a substrate includes a first layer applied directly to the outer surface of the substrate. The first layer includes diamond-like carbon (DLC) configured to mitigate metal whisker formation. A second layer is applied on a top surface of the first layer. The second layer is a conformal coating that includes a second material configured to bind to the top surface of the first layer and fill any microfractures that may form in the first layer. Optionally, a third layer is applied on a top surface of the second layer and includes DLC configured to protect the second layer from oxidation and degradation.

Abstract: Luminaires are described herein employing waveguides and associated architectures for dynamic alteration of illuminance distribution patterns. The waveguide includes a light extraction component. The waveguide transmits light from a light source to the light extraction component by total internal reflection (TIR). The light extraction component includes one or more reversibly moveable surfaces for altering illuminance distribution patterns of the luminaire in response to one or more forces applied to the light extraction component by a force application assembly of the luminaire.

Abstract: There is presented a lighting device comprising: several light-emitting filaments (15, 15?) with solid-state light sources and a circuit board (10) with first and second electrically conductive tracks (13, 14) following first and second paths, respectively. Each light-emitting filament (15, 15?) comprises a first electrical contact (19, 19?) electrically connected to the first track (13) at a first point on the first path, and a second electrical contact (20, 20?) electrically connected to the second track (14) at a second point on the second path. The first and second points associated with each light-emitting filament (15, 15?) are arranged on an axis (A) which is non-perpendicular to a tangent (T1) to the first path at the first point and to a tangent (T2) to the second path at the second point. The lighting device may be adapted to emit light from what appears to be a surface according to an observer.

Abstract: An optoelectronic assembly comprising an optoelectronic component, which comprises a specularly reflective surface and comprising a radiation cooler in direct physical contact with the optoelectronic component. The radiation cooler is arranged above the specularly reflective surface.

Abstract: A display apparatus includes a substrate including at least one hole disposed in a hole area of the substrate, a thin film transistor disposed on the substrate, a light-emitting component disposed on the substrate and electrically connected to the thin film transistor, an insulating layer disposed on the substrate, a thin film encapsulation layer disposed on the substrate, and a laser blocking layer. The substrate includes a display area and a non-display area that is disposed between the display area and the hole area. The laser blocking layer is disposed on the insulating layer in the non-display area.

Abstract: A quantum dot LED display apparatus includes a substrate having a plurality of banks deposited thereon. A plurality of red emitting LED sub-pixels, green emitting LED sub-pixels, and blue emitting LED sub-pixels are individually disposed between the banks. Each of the red emitting LED sub-pixels, green emitting LED sub-pixels, and blue emitting LED sub-pixels has an emissive layer, wherein each of the emissive layers comprises quantum dots, an organic matrix, and a photoinitiator. A first concentration of the photoinitiator in the blue emitting LED sub-pixels is lower than a second concentration of the photoinitiator in the red emitting LED sub-pixels, and lower than a third concentration of the photoinitiator in the green emitting LED sub-pixels.

Abstract: The present disclosure relates to a build composition for a 3-dimensional printing process. The build composition comprises thermoplastic polymer particles, a first photoluminescent agent and a second photoluminescent agent. The build composition has a spectral signature characteristic of the presence of the first photoluminescent agent and the second photoluminescent agent in combination.

Abstract: To provide a method for manufacturing a lightweight light-emitting device having a light-emitting region on a curved surface. The light-emitting region is provided on a curved surface in such a manner that a light-emitting element is formed on a flexible substrate supported in a plate-like shape and the flexible substrate deforms or returns.

Abstract: To provide a method for manufacturing a lightweight light-emitting device having a light-emitting region on a curved surface. The light-emitting region is provided on a curved surface in such a manner that a light-emitting element is formed on a flexible substrate supported in a plate-like shape and the flexible substrate deforms or returns.

Abstract: A display device includes a display circuit layer including a first surface and a second surface and including a display area in which an image is displayed on the first surface, a heat conductive sheet overlapping the display circuit layer below the second surface, and an optical fingerprint sensor inside the display area below the heat conductive sheet and overlapping the display circuit layer. The heat conductive sheet includes a first area overlapping the optical fingerprint sensor and a second area overlapping the display area around the optical fingerprint sensor. The heat conductive sheet includes a heat conductive material, has a shape having a light transmittance required for sensing by the optical fingerprint sensor in the first area, and has no light transmittance in the second area.

Abstract: A display panel, a method for manufacturing the same, and a display device are provided. The display panel includes a first substrate and a second substrate opposite to each other; a display structure on a side of the first substrate facing the second substrate; a sealant surrounding the display structure; and a barrier structure surrounding the display structure and located between the display structure and the sealant, the barrier structure being disposed on one of the first substrate or the second substrate and being spaced apart from the other of the first substrate or the second substrate.

Abstract: A display panel, a production method and a display device thereof. The display panel includes: a flexible circuit board, a touch layer, a cover plate, and an auxiliary transparent layer disposed close to the cover plate; the flexible circuit board is connected to the touch layer, a first sealant is provided at a boundary position between the touch layer and the flexible circuit board and is located on a side of the flexible circuit board facing the cover; a distance between a surface of the auxiliary transparent layer facing the cover plate and the cover plate is not greater than a distance between a surface of the first sealant facing the cover plate and the cover plate.

Abstract: A display device includes a substrate having a pixel area with at least a first rounded corner portion and first to third non-pixel areas arranged sequentially along an outer circumference of the pixel area. An internal circuit in the first non-pixel area has a first end portion adjacent to the first rounded corner portion of the pixel area. The first end portion of the internal circuit is rounded in accordance with the first rounded corner portion. A plurality of routing wires are in the third non-pixel area below the pixel area. The routing wires extending to the pixel area via the second non-pixel area and the first non-pixel area. The routing wires include at least a first routing wire connected to the pixel area passing an area of the first end portion of the internal circuit.

Abstract: A stretchable display device includes a stretchable substrate, at least a portion of which is stretchable in at least one direction, a plurality of light emitting units formed on the stretchable substrate, the light emitting units being spaced apart from each other, the light emitting units each including a pixel electrode, an emission layer, a common electrode, and a common wiring electrode conducted to the common electrode, and a plurality of encapsulations covering and protecting the plurality of light emitting units, respectively.

Abstract: A display apparatus including a substrate; a display area arranged on the substrate and including a plurality of pixels, and a peripheral area arranged outside the display area; a dam surrounding the display area; a crack detector arranged between the dam and an end of the substrate and electrically connected to at least one of the plurality of pixels; a crack prevention dam arranged between the dam and the end of the substrate; and an encapsulation layer including a first inorganic layer, an organic layer, and a second inorganic layer, each covering the display area and a portion of the peripheral area. The first inorganic layer and the second inorganic layer in the encapsulation layer extend to the end of the substrate.

Abstract: Electronic device encapsulation process, assisted by a laser, for obtaining a sealed electronic device, wherein said process comprises: providing a first substrate and a second substrate, the second substrate being transparent in the emission wavelength of the laser, depositing an intermediate bonding contour layer on one or both of the substrates; depositing electronic device components on one or both of the substrates; joining the first substrate and second substrate with the electronic device components in-between the substrates; using the laser to direct a laser beam onto the intermediate bonding contour layer with a predefined progressive scan pattern, such that the intermediate bonding contour layer is progressively melted and forms a seal, bonding the substrates together. Preferably, each linear laser pass overlaps longitudinally the previous and the following linear laser passes along said contour.

Abstract: A strongly scattering optoceramic converter material having a density of less than 97% is provided, as well as a method for producing such an optoceramic material. By appropriately choosing in particular the composition, blending method, and sintering conditions, the production method permits to produce converter materials with tailored properties.

Abstract: A light emitting device which inactivates microorganisms is disclosed. The light emitting device may include a flexible light emitting layer emitting a light; and a transparent or translucent layer over the flexible light emitting layer. The light may travel through and exit an exterior surface of the transparent or translucent layer, creating an exiting light. The exiting light exiting the transparent or translucent layer may have at least a portion thereof having a wavelength in a range of 380 to 420 nanometers, and may disinfect the exterior surface of the transparent or translucent layer. The light emitting device may be used alone to create a self-disinfecting high touch surface, e.g., on a door, or may be shaped to mate with other structure to create a disinfecting high touch surface.

Abstract: Embodiments of the invention include a light emitting device including a substrate and a semiconductor structure including a light emitting layer. A first reflective layer surrounds the light emitting device. A wavelength converting element is disposed over the light emitting device. A second reflective layer is disposed adjacent a first sidewall of the wavelength converting element.