Abstract: A display panel and a display device are provided. An encapsulation layer of the display panel includes at least a first organic layer and a first inorganic layer that are stacked. In a corresponding electronic component arrangement area, a cross section of a contact surface of the first organic layer and the first inorganic layer is an arc, so that a part of light blocked by a sub-pixel light-emitting unit can pass through a lighting path of an electronic component to reach a lighting unit after being refracted by the arc, thereby improving light extraction efficiency of the electronic component.

Abstract: A display module and an electronic device are provided. The display module includes a substrate, a display part, a driving chip, a flexible circuit, and a buffer part. The substrate includes a soldering portion. The display part is disposed on a light emitting side of the substrate. The driving chip is disposed on a light emitting side of the soldering portion. The flexible circuit board is bent from a first surface of the soldering portion to a second surface of the soldering portion. The buffer part is disposed between the flexible circuit board and the soldering portion.

Abstract: A display encapsulation structure and a manufacturing method thereof are provided. The manufacturing method includes steps of providing a sacrificial layer, a display device encapsulation structure, and a transparent cover; providing an encapsulating film layer; and removing the sacrificial layer to expose the transparent cover. The encapsulating film layer is removed from the transparent cover plate when the sacrificial layer is removed, so as to avoid affecting luminous efficiency by the encapsulating film layer, thereby improving the luminous efficiency of the display encapsulation structure.

Abstract: A packaging structure, a display component and a display device are provided by the present disclosure. The packaging structure includes: a substrate; a light-emitting unit arranged on the substrate; a packaging layer, by which the light-emitting unit is packaged on the substrate; and a water-absorbing layer which is arranged in the packaging layer and completely wrapped by the packaging layer.

Abstract: A light emitting device includes a light emitting element, a light guide member, a reflecting member, a wavelength conversion member. The light emitting element has a light emitting surface and lateral surfaces. The light guiding member is provided on at least a portion of the lateral surfaces of the light emitting element. The reflecting member is provided on the lateral surface of the light emitting element with the light guiding member interposed therebetween. The wavelength conversion member is provided on the light emitting surface of the light emitting element, the light guiding member and the reflecting member. The wavelength conversion member is provided with a recess between an outer lateral surface of the wavelength conversion member and the light guiding member. The reflecting member is provided in the recess.

Abstract: A light emitting diode includes a pixel unit. The pixel unit may include a first sub-pixel configured to emit white light. The first sub-pixel may include a first microcavity adjustment layer, a scattering layer, a first transparent electrode layer, a first emitting layer, and a first semi-transparent electrode layer. The scattering layer includes a plurality of patterns formed on a surface of the scattering layer. The scattering layer may be configured to reduce color cast of the first sub-pixel to be less than about 0.025 at viewing angles in a range of about ?50 degree to +50 degree.

Abstract: An organic light-emitting display apparatus includes a substrate, an inorganic insulation film on the substrate, an organic insulation film on the inorganic insulation film, an organic light-emitting device on the organic insulation film, and an encapsulation unit including a first inorganic film covering the organic light-emitting device and having a first boundary portion contacting the organic insulation film, an organic film covering the first inorganic film and having a second boundary portion contacting the inorganic insulation film, and a second inorganic film covering the organic film and having a third boundary portion contacting the substrate.

Abstract: A display device includes a substrate including a display area and a non-display area, and a common electrode line at the non-display area of the substrate. The common electrode line may include a line unit and a plurality of protrusions that protrude from the line unit in a direction opposite from the display area.

Abstract: A pixel structure. The pixel structure includes a base substrate; an insulating island on the base substrate; a light emitting element on a side of the insulating island away from the base substrate; an insulating layer on the base substrate and surrounding the insulating island, the insulating layer spaced apart from the insulating island by a groove; and a reflective layer on a lateral side of the insulating layer surrounding a periphery of the light emitting element, and configured to reflect light laterally emitted from the light emitting element to exit from a light emitting surface of the pixel structure. The insulating layer has a height relative to a main surface of the base substrate greater than a height of the insulating island relative to the main surface of the base substrate. The reflective layer is in direct contact with the base substrate in the groove.

Abstract: A light emitting device package including a partition structure having first and second surfaces, and first to third light emission windows penetrating through the first and second surfaces, a cell array including first to third light emitting devices on the first surface of the partition structure and overlapping the first to third light emission windows, each of the first to third light emitting devices including a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer, first and second wavelength conversion portions filling interiors of the first and second light emission windows, and having a meniscus-shaped interfaces, a first encapsulating portion including a light-transmissive organic film layer that fills the third light emission window and covers the first and second wavelength conversion portions, and a second encapsulating portion covering the first and second encapsulating portions and including a light-transmissive inorganic film layer.

Abstract: A display panel, a packaging method thereof, and a display device having same are described. The display panel has: a substrate having a display region and a non-display region surrounding the display region; electrode lines distributed on a surface of the substrate, and located within the display region; a package covering plate attached to the surface of the substrate having the electrode lines; a double-sided sealant adhered to the package covering plate and the surface of the substrate having the electrode lines; a conductive nanofiber layer disposed between the double-sided sealant and the substrate, and located on the electrode lines of the display region. The conductive nanofiber layer can achieve good surface contact and parallel connection with the electrode lines. Therefore, surface resistance of the electrode lines in the display panel is effectively reduced, and luminous efficiency and brightness uniformity of the display panel are improved.

Abstract: The present invention relates to a lighting fixture having a plurality of light sources positioned at the front of a support plate. The light sources each having at least a first and a second electrical terminal. The support plate includes an upper conductive layer and a lower conductive layer. The upper and lower layers are electrically insulated from one another by an intermediate insulating layer, and in that, for each light source, the first and the second electrical terminals are electrically connected respectively to the upper and lower layer, or conversely.

Abstract: A display unit of the present disclosure includes: a plurality of pixels configured to emit emission light different from one another; and an insulating film provided between the plurality of pixels and having a reflective surface with respect to the emission light, in which an angle of the reflective surface of the insulating film is set for each of the pixels.

Abstract: Embodiments of the present invention generally relate to a touch sensible organic light emitting device. The organic light emitting device according to an exemplary embodiment of the present invention comprises: a substrate; a thin film transistor disposed on the substrate; an organic light emitting element connected to the thin film transistor and receiving a data voltage; a plurality of encapsulation thin films disposed on the organic light emitting element, and encapsulating the thin film transistor and the organic light emitting element; a planarization layer disposed on the encapsulation thin film; and a touch sensor disposed on the planarization layer.

Abstract: The present disclosure provides an OLED package structure, OLED device, display device and method for fabricating OLED package structure. The OLED package structure includes a substrate, a cover plate and a first sealant layer. The substrate, the cover plate and the first sealant layer together delimiting a sealed space. The OLED package structure further includes a functional sealant layer formed by filling the sealed space with a functional sealant, and a second sealant layer formed by a second sealant disposed between the substrate and the functional sealant layer. The second sealant has a density less than a density of the functional sealant.

Abstract: A method for manufacturing an optical-semiconductor device, including forming a plurality of first and second electrically conductive members that are disposed separately from each other on a support substrate; providing a base member formed from a light blocking resin between the first and second electrically conductive members; mounting an optical-semiconductor element on the first and/or second electrically conductive member; covering the optical-semiconductor element by a sealing member formed from a translucent resin; and obtaining individual optical-semiconductor devices after removing the support substrate.

Abstract: The present disclosure provides a flexible organic light-emitting diode (OLED) device and a fabrication method thereof, wherein the flexible organic light emitting diode (OLED) device includes a substrate, an array unit layer, a light-emitting device layer, and an encapsulation layer that are sequentially disposed. The encapsulation layer includes a first inorganic layer, a first organic layer and a second inorganic layer that are sequentially disposed. The second inorganic layer has a continuous wavy curved-configuration, and an interface between the second inorganic layer and the first organic layer has a continuous wavy curved-shape. The present disclosure is directed to a flexible OLED device using a novel outer inorganic layer to increase the contact area between the outer inorganic layer and the inner organic layer, thereby effectively reducing risks of breakage of the outer inorganic layer.

Abstract: A method for manufacturing a light emitting device includes: preparing a baseplate having a plate surface on which a protrusion is disposed; forming a first resin frame having an opening on the plate surface, wherein the opening is located above the protrusion; forming a second resin in the opening; detaching the baseplate; bonding a light emitting element to a surface of the second resin surface that has been exposed as a result of detaching the baseplate; and forming a third resin that surrounds lateral faces of the light emitting element and that covers and contacts a portion of the first resin frame.

Abstract: A method of fabricating a display device includes providing a display substrate with a plurality of pixels, mounting an encapsulation substrate on the display substrate, bonding the display substrate and the encapsulation substrate to form a display panel, and forming a module hole penetrating a hole region of the display panel in the display panel. The hole region encloses the module hole, and the display substrate and the encapsulation substrate may be bonded by irradiating the hole region with an ultra-high-frequency pulsed laser. The display substrate and the encapsulation substrate are bonded in the hole region as the ultra-high-frequency pulsed laser is irradiated onto the hole region.

Abstract: An encapsulation structure, a display panel and a manufacturing method thereof are provided. The display panel includes a base substrate; a device to be encapsulated on the base substrate; an encapsulation film on the base substrate, the encapsulation film covering the device to be encapsulated; and an edge encapsulation member on an edge of the encapsulation film, the edge encapsulation member being configured to cover the edge of the encapsulation film.

Abstract: A disclosed light-emitting device may provide white light with a cyan gap coinciding with a melanopic sensitivity range and thus having reduced melanopic content. The disclosed light-emitting device may include a light source providing violet or blue light with a peak wavelength under 450 nanometers (nm). The disclosed light-emitting device may include at least one down-converter coupled to and located downstream of the light source and configured with a long-wavelength onset to convert the spectrum of the violet or blue light to generate white light with a spectral power content in a 447-531 nm wavelength range that is less than or equal to 10% of a total spectral power content in a 380-780 nm wavelength range. The disclosed light-emitting device may be incorporated in a light engine system that further includes a control system that controls a drive current to the light-emitting device.

Abstract: The present disclosure discloses an active matrix organic light-emitting diode display device and a manufacturing method thereof. The method includes forming a sacrificial layer on a carrier layer; forming a flexible substrate on the sacrificial layer; forming a first insulating layer on the flexible substrate; forming at least one transition metal chalcogenide based backplane on the first insulating layer; and forming an opening unit after forming a capping layer on the at least one transition metal chalcogenide based backplane; and forming at least one active matrix organic light-emitting diode unit which is electrically connected to the at least one transition metal chalcogenide based backplane in the opening unit.

Abstract: The present application relates to a display screen and a display device. The display screen includes: a substrate; a display device disposed on the substrate, the display device including several film layers; and a thin film encapsulation structure disposed on a side of the display device away from the substrate, the thin film encapsulation structure including a first encapsulation film disposed on the display device, and a first atomic layer deposition film disposed on the first encapsulation film; wherein a thermal expansion coefficient of the first encapsulation film is between a thermal expansion coefficient of the film layer immediately adjacent to the first encapsulation film on the display unit and a thermal expansion coefficient of the first atomic layer deposition film.

Abstract: A display device according to an embodiment of the present invention includes: a base material including a display region and a curved region; a wiring line disposed on the base material and disposed from the display region over the curved region; and a heat dissipating layer formed corresponding to a position at which the wiring line is disposed in the curved region.

Abstract: An organic light-emitting display apparatus includes a lower substrate having a display area, and a sealing area outside of the display area, an upper substrate facing the lower substrate, a display unit at the display area, a sealing member at the sealing area, and adhering the upper substrate to the lower substrate, a metal pattern layer between the lower substrate and the sealing member, and defining a plurality of through-portions, a first metal layer along an edge of the display unit, and spaced from the metal pattern layer, and a plurality of metal patterns having island shapes between the metal pattern layer and the first metal layer.

Abstract: A display device includes a substrate, a plurality of pixels above the substrate, each of the plurality of pixels including a first electrode, a light emitting layer above the first electrode, and a second electrode above the light emitting layer, a display region including the plurality of pixels, a first organic insulating layer located between the substrate and the light emitting layer, and a sealing layer above the second electrode and covering the plurality of pixels. The first organic insulating layer includes a first opening part surrounding the display region, the sealing layer has a first inorganic insulating layer, a second organic insulating layer and a second inorganic insulating layer, the first inorganic insulating layer and the second inorganic insulating layer cover the first opening part, a second opening part passing through the first inorganic insulating layer and the second inorganic insulating layer.

Abstract: Illumination devices based on quantum dot technology and methods of making such devices are described. An illumination device includes a substrate having a plurality of microLEDs, a beam splitter, and a film having a plurality of quantum dots. The beam splitter includes a plurality of layers and is disposed between the substrate and the film having the plurality of quantum dots.

Abstract: The present invention discloses an organic light-emitting display panel, a manufacturing method thereof, and an encapsulation film thereof. In this invention, an auxiliary encapsulation layer is disposed on an outer side of an inorganic layer, and the auxiliary encapsulation layer at least covers a bending region of the inorganic layer and a boundary region of the inorganic layer. Even if the inorganic layer cracks or peels in the bending region and the boundary region, a channel of water and oxygen generated at a cracked place or a peeling place is blocked by the auxiliary encapsulation layer, thereby ensuring an ability of the encapsulation film to block water and oxygen into an organic light-emitting device.

Abstract: A display device includes: a first substrate; a second substrate on the first substrate; a pixel between the first substrate and the second substrate and including a pixel area and a non-pixel area around the pixel area; a color filter between the pixel and the second substrate and overlapping with the pixel area; and a plurality of protrusions between the second substrate and the color filter, and each of the protrusions has a width that decreases as a distance from the second substrate increases.

Abstract: A display apparatus is provided. In the display apparatus, a touch electrode may be disposed on the encapsulating element covering a light-emitting device, and a touch pad may be disposed on the outside of the encapsulating element. A touch line may be connected to the touch electrode. The touch line may be connected to the touch pad by a first touch link and a second touch link. The first touch link may include a first end connected to the second touch link, and a second end connected to the touch line. The first end of the first touch link may overlap with the encapsulating element. Thus, in the display apparatus, the reliability for a touch of a user or a tool may be improved.

Abstract: An LED filament includes LED chips, two conductive electrodes, and an enclosure. The LED chips are arranged in an array along an axial direction of the LED filament and are electrically connected with one another. The two conductive electrodes are disposed corresponding to the array. Each of the two conductive electrodes is electrically connected to a corresponding LED chip at an end of the array. The enclosure is coated on two or more sides of the array and the two conductive electrodes. A portion of each of the two conductive electrodes is exposed from the enclosure. Postures of two or more of the LED chips related to an axis of the LED filament along the axial direction or related to a horizontal plane the LED filament is laid on are different from each other.

Abstract: A light-emitting element, a bonding layer, and a frame-like partition are formed over a substrate. The partition is provided to surround the bonding layer and the light-emitting element, with a gap left between the partition and the bonding layer. A pair of substrates overlap with each other under a reduced-pressure atmosphere and then exposed to an air atmosphere or a pressurized atmosphere, whereby the reduced-pressure state of a space surrounded by the pair of substrates and the partition is maintained and atmospheric pressure is applied to the pair of substrates. Alternatively, a light-emitting element and a bonding layer are formed over a substrate. A pair of substrates overlap with each other, and then, pressure is applied to the bonding layer with the use of a member having a projection before or at the same time as curing of the bonding layer.

Abstract: A display apparatus includes a lower substrate including a peripheral area around a display area, an upper substrate facing the lower substrate, a display unit in the display area including a pixel circuit and a display device electrically connected to the pixel circuit, a seal in the peripheral area to surround the display unit, the seal adhering the lower substrate to the upper substrate, a power supply line between the lower substrate and the seal such that at least a portion of the power supply line and the seal overlap each other, and a first thermally conductive layer between the power supply line and the lower substrate, at least a part of the first thermally conductive layer overlapping an end portion of the power supply line, the first thermally conductive layer being connected to the power supply line and extending toward an edge of the lower substrate.

Abstract: A display device includes: a substrate including a display area at which a pixel including a light emitting element is located and a peripheral area surrounding the display area; and a common voltage line on the substrate, the common voltage line configured to provide a common voltage to the pixel, the common voltage line including: a peripheral common voltage line on the peripheral area of the substrate to surround the display area and connected to a common electrode of the light emitting element; and a plurality of display common voltage lines crossing the display area and each contacting different portions of the peripheral common voltage line, the display common voltage lines being spaced apart from the common electrode of the light emitting element.

Abstract: The present disclosure relates to a display substrate, a method of manufacturing the same, and a display substrate. The display substrate includes: a light-emitting portion located in a display region of the display substrate; one or more dams located in a non-display region of the display substrate, the non-display region surrounding the display region; a first stress absorbing portion arranged below at least one dam of the dams.

Abstract: An organic light emitting diode display panel is disclosed. The organic light emitting diode display panel includes a first substrate and a second substrate disposed opposite to each other. The first substrate includes a first lead connected to a cathode. The second substrate includes a second lead connected to a peripheral circuit. The first lead is connected to the second lead through a connection portion.

Abstract: According to one embodiment, a display device includes a pixel area including pixels each including at least one thin film transistor includes a semiconductor layer and a gate electrode, a first terminal area including a first wiring line disposed thereon connected to the at least one thin film transistor, a first protective film provided on the semiconductor layer, the gate electrode and the first wiring line, a first insulating film provided on the first protective film, a second protective film provided on the first insulating film, a second insulating film provided on the second protective film, a first opening formed in the first terminal area, and partially exposing the first wiring line, and a second opening formed to correspond to the first opening.

Abstract: The present disclosure provides a display panel having a stress releasing structure and a method for manufacturing the same. The display panel having a stress releasing structure includes a substrate having a display area, a bending area, and a peripheral area, wherein the bending area is positioned between the display area and the peripheral area; a metal wiring disposed on the substrate and extending from the display area to the peripheral area; a planarization layer positioned in the bending area and disposed on the metal wiring; and a pixel defining layer positioned in the bending area and disposed on the planarization layer; wherein at least one of the planarization layer and the pixel defining layer includes a plurality of semi-columns parallel to each other.

Abstract: Display devices that include: an organic light emitting diode panel having a multilayer construction including one or more adhesive films; and a polymeric film incorporated within the multilayer construction of the organic light emitting diode panel.

Abstract: A method for manufacturing light emitting diodes and a light emitting diode are disclosed. In an embodiment a method includes providing a light emitting diode chip with a growth substrate and with a semiconductor layer sequence for generating radiation, soldering chip contact surfaces located on a chip underside of the semiconductor layer sequence facing away from the growth substrate to carrier contact surfaces of a carrier, applying a liquid connector transparent to the radiation to a substrate upper side of the growth substrate facing away from the semiconductor layer sequence, fastening a fluorescent body to the substrate upper side, the connector being partially displaced by the fluorescent body from the substrate upper side so that chip side faces are predominantly covered by the connector and generating a reflector on outer faces of the connector facing away from the light emitting diode chip on the chip side faces, the outer faces pointing in a direction away from the carrier.

Abstract: An aircraft beacon light includes a mounting plate having a central portion; a plurality of light sources arranged on the mounting plate around the central portion and facing away from the mounting plate; and a lens structure arranged over the plurality of light sources, wherein the lens structure is configured to reflect a first portion of light emitted by the plurality of light sources laterally outwards via total internal reflection; wherein the aircraft beacon light is configured to emit flashes of red light in operation.

Abstract: According to one embodiment, a display device includes a first basement, a first folding line and a second folding line. The first basement has a first area which is a display area including a display element, and a second area and a third area which are non-display areas and are adjacent to the first area. The first folding line is located at a border of the first area and the second area. The second folding line is located at a border of the first area and the third area. The first folding line extends in a first direction, and the second folding line extends in a second direction intersecting the first direction.

Abstract: Provided are an organic light emitting diode display panel and packaging method thereof. The organic light emitting diode display panel is provided with an adhesive layer on a passivation layer corresponding to a position of a sealant. When packaging the organic light emitting diode, the sealant on a cover plate is adhered corresponding to a position of the adhesive layer. The adhesive layer has a good bonding force with the sealant and also has a good bonding force with the passivation layer. Thus, water vapor does not easily enter the organic light emitting diode element, which will not reduce the performance of the organic light emitting diode element to improve a service life of organic light emitting diode element and to possess a good reliability performance.

Abstract: A light emitting module and a planar light source reduced in thickness are provided. A light emitting module includes: a light guide plate including a first main surface serving as a light emitting surface, a second main surface provided on a side opposite to the first main surface, and a recess provided at the second main surface; a first fluorescent material layer provided in the recess; a light emitting element provided at the first fluorescent material layer on the second main surface side; and a second fluorescent material layer provided at the second main surface.

Abstract: An organic EL device includes an active region including a plurality of organic EL elements and a peripheral region in a region other than the active region. The organic EL device includes an element substrate including a substrate supporting the organic EL elements; and a thin film encapsulation structure covering the organic EL elements and including a first inorganic barrier layer, an organic barrier layer in contact with a top surface of the first inorganic barrier layer, and a second inorganic barrier layer in contact with the top surface of the first inorganic barrier layer and a top surface of the organic barrier layer. The peripheral region includes a first protruding structure including a portion extending along at least one side of the active region, the first protruding structure supported by the substrate, and an extending portion, of the first inorganic barrier layer, extending onto the first protruding structure.

Abstract: A semiconductor package including a semiconductor die, a molding compound and a redistribution structure is provided. The molding compound laterally wraps around the semiconductor die, wherein the molding compound includes a base material and a first filler particle and a second filler particle embedded in the base material. The first filler particle has a first recess located in a top surface of the first filler particle, and the second filler particle has at least one hollow void therein. The redistribution structure is disposed on the semiconductor die and the molding compound, wherein the redistribution structure has a polymer dielectric layer. The polymer dielectric layer includes a body portion and a first protruding portion protruding from the body portion, wherein the body portion is in contact with the base material and the top surface of the first filler particle, and the first protruding portion fits with the first recess of the first filler particle.

Abstract: Disclosed is an optical component package. The optical component package according to the present invention includes: a main substrate including a plurality of metal bodies, and a vertical insulation part provided between the metal bodies; a sub-substrate provided in a cavity of the main substrate, and electrically connected to each of the metal bodies with the vertical insulation part interposed therebetween; an optical component mounted on the sub-substrate; and a light transmitting member provided above the optical component, wherein the sub-substrate includes: an insulating body; a via hole vertically passing through the insulating body, and filled with a metal material; and a metal pad connected to the optical component.

Abstract: An organic light-emitting display device including a substrate on which a plurality of sub-pixels are arranged; a thin film transistor and a first electrode of an organic light-emitting diode connected to the thin film transistor, the thin film transistor and the organic light-emitting diode being disposed in each of the plurality of sub-pixels; a first bank layer disposed on the first electrode and exposing the first electrode; and a second bank layer disposed on the first bank layer and exposing the first bank layer and the first electrode. Further, the first bank layer includes first regions overlapping with via holes through which the thin film transistor is connected to the first electrode and second regions which are regions other than the first regions, and a thickness of the first regions is greater than a thickness of the second regions.

Abstract: An electroluminescent display device includes a substrate; an overcoat layer disposed over the substrate; and a light-emitting diode disposed on the overcoat layer, comprising: a first electrode having a plurality of holes exposing a top surface of the overcoat layer, the holes having an inclined wall surface; a light-emitting layer disposed on the first electrode; and a second electrode disposed on the light-emitting layer.

Abstract: The present invention provides a display panel including a light emitting diode structure. The light emitting diode structure includes an anode located on a thin film transistor layer, a light emitting material layer located on the anode, and a cathode covering the light emitting material layer. The light emitting diode structure further includes an anode reflective layer and a quantum dot thin film. The anode reflective layer is located under the anode, and is electrically insulated from the anode through a reflective insulation layer. The quantum dot thin film is located between the anode and the anode reflective layer.