Abstract: A contour and outline transducer gage assembly for selectively making outline (gap) and contour checks of parts positioned proximate thereto is provided with a slidably movable carrier arm within the gage housing in selective spring biased operative engagement with a linear potentiometer fixedly provided within the gage housing. Selective movement of the carrier arm in relation to the linear potentiometer causes a gaging electrical signal to be generated for read-out on associated data collector means. A movable cover plate is provided externally of the gage housing in fixed actuating engagement with the movable carrier arm. An adjustable contour check pin support assembly is provided on the movable cover plate so as to provide selective horizontal, vertical and angularity adjustment of a part-engaging contour check pin mounted on the contour check pin support assembly.

Abstract: Vehicle body measuring apparatus having first and second extendible members for positioning on opposed sides of a vehicle body. A longitudinal member is connectible between the upper ends of the first and second members. First and second pointers are slidably mountable on the longitudinal member. Connecting means are provided for pivotally connecting the first and second members relative to the vehicle body and clamping means are provided for clamping the first and second members in a fixed position relative to opposed sides of the vehicle body.

Abstract: A method for centering a semiconductor wafer on a vacuum chuck having a centered shaft. A shaft centering tool which is contained in pre-existing openings in a housing surrounding the shaft is used to define the desired location of the shaft. A second device having the same circumference as the wafer, is employed on the chuck in order that teflon guides can be set into position around the chuck. Once the guides are set, wafers introduced into the guides will be centered on the chuck.

Abstract: A method and apparatus are disclosed for measuring and displaying parallelism, or the lack thereof, of first and second flat surfaces using a video monitor and three displacement transducers. The first surface is in a fixed position while the second surface may be fixed or may be adjustable so as to attain parallelism between the surfaces. A first point is selected on the first surface and a second point is selected on the other surface such that the line between the two points is perpendicular to the first surface. The three displacement transducers are zero calibrated between the two points. Subsequently, the transducers are mounted between the two surfaces in a triangular pattern and their output signals are summed and supplied to the video monitor which has a fixed display indicating theoretical parallelism. The output of the transducers is combined so as to display the actual angular relationship between the two surfaces.

Abstract: A method for centering a semiconductor wafer on a vacuum chuck having a centered shaft. A shaft centering tool which is contained in pre-existing openings in a housing surrounding the shaft is used to define the desired location of the shaft. A second device having the same circumference as the wafer, is employed on the chuck in order that teflon guides can be set into position around the chuck. Once the guides are set, wafers introduced into the guides will be centered on the chuck.

Abstract: The invention relates to a process and an apparatus for positioning a point belonging to the cutting zone of a tool in a digitally controlled lathe.The process consists of obtaining the image of the contact point of the tool cutting zone in a virtual relative mark with two perpendicular axes and then bringing about coincidence between the origin of the relative mark and the rotation axis of the tool holder capstan. The process then involves bringing about coincidence between the chosen contact point and the origin of the relative mark. The contact point is then made to coincide with the intersection point of the axes of an absolute fixed reference mark.Application to the regulation of the position of a tool in a digitally controlled lathe.