Amplifying Different Frequencies In Different Channels Patents (Class 330/126)
  • Patent number: 11223332
    Abstract: Disclosed is an electronic device including a power amplifier (PA) configured to amplify a transmission signal, a matching circuit configured to be connected with the PA and to form a load impedance, a filter configured to be connected with the matching circuit, and a control circuit configured to control a state of at least one of a bias of the PA, the matching circuit, and the filter. The control circuit may identify a network to which the electronic device is connected among a first network and a second network and may operate the matching circuit in one of a first state, a second state, and a third state based on the identified network.
    Type: Grant
    Filed: January 3, 2020
    Date of Patent: January 11, 2022
    Inventors: Hyunseok Choi, Jooseung Kim, Youngmin Lee, Hyoseok Na
  • Patent number: 11201590
    Abstract: A power amplifier apparatus is provided. The power amplifier apparatus includes a number of multi-stage power amplifiers and a bias circuit configured to generate a number of bias signals (e.g., bias current or bias voltage) to control (e.g., activate or deactivate) the multi-stage power amplifiers. In examples disclosed herein, only one of the multi-stage power amplifiers is activated at a given time. In this regard, the bias circuit can generate the bias signals to collectively activate one of the multi-stage power amplifiers, while deactivating the rest of the multi-stage power amplifiers. As such, it may be possible to control a larger number of power amplifier stages based on a smaller number of bias signals. As a result, it may be possible to eliminate a biasing bump pad(s) from the power amplifier apparatus, thus helping to reduce the footprint and cost of the power amplifier apparatus.
    Type: Grant
    Filed: February 12, 2020
    Date of Patent: December 14, 2021
    Assignee: Qorvo US, Inc.
    Inventors: Michael Nielsen, Lars Sandahl Ubbesen
  • Patent number: 11201595
    Abstract: A radio-frequency (RF) module includes a first transistor having a base, a collector, and an emitter, a radio-frequency output transmit path coupled to the collector of the first transistor at a first end and to a radio-frequency output port at a second end, and an output matching network disposed in the radio-frequency output transmit path, the output matching network including a shunt arm coupled to ground, the shunt arm including a switch that is controllable to modify an impedance of the output matching network.
    Type: Grant
    Filed: November 23, 2016
    Date of Patent: December 14, 2021
    Assignee: Skyworks Solutions, Inc.
    Inventors: John William Mitchell Rogers, Gordon Glen Rabjohn, John Jackson Nisbet
  • Patent number: 11165137
    Abstract: An antenna-integrated radio frequency (RF) module includes a multilayer substrate disposed between an integrated chip (IC) and patch antennas, signal vias, and ground members. The IC is configured to generate RF signals. The signal vias are configured to connect and transmit/receive the RF signals from each of the patch antennas to the IC. The ground members are disposed on an outer surface layer and intermediate surface layers of the multilayer substrate to surround each of the patch antennas and the signal vias.
    Type: Grant
    Filed: June 30, 2020
    Date of Patent: November 2, 2021
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hong In Kim, Thomas A. Kim, Ho Kyung Kang
  • Patent number: 11152903
    Abstract: In accordance with one embodiment, an apparatus includes a first amplifier having a noninverting input, an inverting input and an output. The noninverting input is coupled to a first ground reference. The inverting input is coupled to an output of an external sensor. The apparatus also includes a second amplifier having a noninverting input, an inverting input and an output. The noninverting input is coupled to the first ground reference. The inverting input is coupled to the power supply through a first variable capacitor and to the second ground reference through a second variable capacitor. The output is coupled to the inverting input of the first amplifier. The external sensor is coupled to a third ground reference, and the first amplifier and second amplifier are coupled to the second ground reference.
    Type: Grant
    Filed: October 22, 2019
    Date of Patent: October 19, 2021
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Nagesh Surendranath, Shriram Mahendra Devi, Sravana Kumar Goli
  • Patent number: 11121736
    Abstract: A radio frequency (RF) circuit is provided. The RF circuit may include a variety of RF filters organized into a number of filter banks and configured to support carrier aggregation (CA) in a variety of band combinations. In examples discussed herein, the RF circuit is configured to utilize separate receive and transmit filters for filtering an RF receive signal and an RF transmit signal in a time-division duplex (TDD) band, respectively. By employing separate receive and transmit filters for the TDD band, as opposed to using an integrated receive-transmit filter, it may be possible to implement the receive and transmit filters in the RF circuit with improved impedance matching, interference rejection, and insertion loss without increasing a footprint of the RF circuit.
    Type: Grant
    Filed: April 26, 2019
    Date of Patent: September 14, 2021
    Assignee: Qorvo US, Inc.
    Inventors: Vincenzo DiTommaso, Peter Richard Molnar, Jean Briot, Mudar AlJoumayly
  • Patent number: 10979665
    Abstract: Embodiments of the present disclosure disclose an equalization circuit for a CATV plug-in fixed attenuator which comprises an equalizer, an equalization compensation circuit and a MCU module. The equalizer comprises a CATV plug-in fixed attenuator identification module and an equalizing module. The CATV plug-in fixed attenuator identification module is connected to the equalizing module and the MCU module. The equalization compensation circuit is connected to an output terminal of the equalizer and the MCU module. The embodiments enable identification of a changing attenuation value and compensation of the frequency response.
    Type: Grant
    Filed: January 2, 2019
    Date of Patent: April 13, 2021
    Assignee: Global Technology Inc.
    Inventors: Li Zhang, Mingjun Bao, Renhao Tan
  • Patent number: 10944377
    Abstract: Broadband power splitter. In some embodiments, a power splitter can include an input port, a first output port and a second output port. The power splitter can further include a first signal path implemented between the input port and the first output port, and a second signal path implemented between the input port and the second output port. Each of the first and second signal paths can include a variable capacitance configured to provide a plurality of capacitance values that result in different frequency responses of the respective signal path.
    Type: Grant
    Filed: December 29, 2018
    Date of Patent: March 9, 2021
    Assignee: Skyworks Solutions, Inc.
    Inventors: Anuranjan Hosagavi Puttaraju, Gunjan Pandey, Paul Raymond Andrys
  • Patent number: 10826542
    Abstract: A signal transceiving control structure includes a power amplifier and N control branches. The N control branches are configured to control transmission of first signals or receiving of second signals of different network standards according to different control instructions. First ends of the N control branches are respectively connected to an output end of the power amplifier, second ends of the N control branches are respectively connected to N external output ends, third ends of the N control branches are respectively connected to N external input/output ends, wherein N is a positive integer greater than 1. The power amplifier is configured to perform power amplification on the first signals.
    Type: Grant
    Filed: September 21, 2019
    Date of Patent: November 3, 2020
    Assignee: SMARTER MICROELECTRONICS (SHANGHAI) CO., LTD.
    Inventors: Jun Ma, Qiang Su, Yongle Li
  • Patent number: 10692982
    Abstract: A semiconductor apparatus includes the following elements. A substrate includes a ground portion to which a ground potential is supplied. A semiconductor chip is mounted on the substrate and includes first and second output terminals, a first terminator, and a ground terminal. First and second amplifiers are respectively formed in first and second regions of the semiconductor chip and respectively amplify first and second input signals of first and second frequency bands and output first and second amplified signals from the first and second output terminals via first and second output wires. A first harmonic termination circuit includes a first wire which electrically connects the first terminator and the ground portion. A ground wire is disposed between the first wire and the second output wire in a plan view of a main surface of the semiconductor chip and electrically connects the ground terminal and the ground portion.
    Type: Grant
    Filed: February 21, 2019
    Date of Patent: June 23, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Takashi Yamada
  • Patent number: 10686413
    Abstract: A low noise amplifier circuit includes a first low noise amplifier including a common gate structure cascoded with a parallel common source structure to selectively amplify a band signal among first and second band signals; a second low noise amplifier including a common gate structure cascoded with a parallel common source structure to selectively amplify a band signal among third and fourth band signals; an output DPDT circuit including a first input terminal connected to the first low noise amplifier, a second input terminal connected to the second low noise amplifier, and a first output terminal and a second output terminal for selectively outputting signals input through the first input terminal and the second input terminal; and a control circuit performing an amplification control and a switching control for the first and second low noise amplifiers and the output DPDT circuit in response to a predetermined communications scheme.
    Type: Grant
    Filed: October 22, 2018
    Date of Patent: June 16, 2020
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hyun Hwan Yoo, Jong Mo Lim, Yoo Sam Na, Hyun Jin Yoo, Hyung Jun Cho, Yoo Hwan Kim
  • Patent number: 10641847
    Abstract: According to an embodiment of the present disclosure, disclosed is an apparatus for generating a radio frequency (RF) pulse in a magnetic resonance imaging (MRI) scanner. The apparatus for generating a radio frequency (RF) pulse in a magnetic resonance imaging scanner includes: a control module controlling a power amplifier and a signal generator; the signal generator configured to generate a signal of a predetermined waveform based on control by the control module and supply the generated signal of the predetermined waveform to the power amplifier in electromagnetic connection therewith; a power amplifier amplifying the signal supplied from the signal generator based on the control by control module and outputting the amplified signal to a coil; and the coil serving as an inductor of the power amplifier and transferring the amplified signal to the object so that an object is excited.
    Type: Grant
    Filed: November 14, 2017
    Date of Patent: May 5, 2020
    Assignee: Bilkent University
    Inventors: Ergin Atalar, Redi Poni
  • Patent number: 10629979
    Abstract: Aspects of this disclosure relate to a coupler circuit configured to receive an output of a radio frequency coupler. The coupler circuit can be arranged in a daisy chain with other coupler circuits. The coupler circuit can include a switch configured to turn on based on a signal level of a direct current component of a coupler signal from another coupler circuit and pass a radio frequency component of the coupler signal when on. The coupler circuit can pass the coupler signal while a module that includes the coupler circuit is otherwise inactive.
    Type: Grant
    Filed: October 26, 2018
    Date of Patent: April 21, 2020
    Assignee: Skyworks Solutions, Inc.
    Inventors: Srivatsan Jayaraman, Onder Oz, Pradeep A. Balaraman, Roman Zbigniew Arkiszewski, Yeung Bun Choi, Songbai Zhang
  • Patent number: 10511305
    Abstract: In one embodiment, a device includes a multi-channel capacitive sensor and a control circuit. The control circuit is configured to ground a first sense capacitor and a second sense capacitor of the multi-channel capacitive sensor. The first sense capacitor and the second sense capacitor are adapted to be connected to a drive line. The control circuit is configured to charge, by a first voltage provided on a pin of the controller, an in-series combination of a sample capacitor and the first sense capacitor while not charging the second sense capacitor by the first voltage provided on the pin of the controller. The control circuit is further configured to measure a second voltage on the pin of the controller resulting at least in part from charging the in-series combination, the second voltage providing an indication of a capacitance of the first sense capacitor.
    Type: Grant
    Filed: December 22, 2016
    Date of Patent: December 17, 2019
    Assignee: Neodrón Limited
    Inventor: John Stanley Dubery
  • Patent number: 10505505
    Abstract: A PA module includes a previous stage amplification element to amplify a high-frequency signal, a posterior stage amplification element to amplify the high-frequency signal amplified by the previous stage amplification element, and a variable filter circuit arranged between the previous stage amplification element and the posterior stage amplification element and to vary a pass band and an attenuation band in accordance with a frequency band of the high-frequency signal, in which the variable filter circuit includes a filter portion and switches, the previous stage amplification element, the switches, and the posterior stage amplification element are arranged on a mounting surface of a substrate, the filter portion is stacked and arranged so as to overlap with at least one of the previous stage amplification element, the switches, and the posterior stage amplification element when the substrate is viewed in a plan view.
    Type: Grant
    Filed: March 30, 2018
    Date of Patent: December 10, 2019
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Hidenori Obiya, Shinya Hitomi, Reiji Nakajima
  • Patent number: 10502622
    Abstract: A custom application-specific integrated circuit (ASIC) may provide strong signal integrity while reducing the load to a thermal system. Control and analog-to-digital conversion may be pushed into components close to the detector to maximize signal integrity. Processing functions may be performed at relatively high temperature, or the highest allowable temperatures, simplifying the system-level thermal design by not cooling components that do not require such cooling to function.
    Type: Grant
    Filed: June 21, 2017
    Date of Patent: December 10, 2019
    Inventors: Brian S. Smith, Markus Loose, Atul Joshi, Greg T. Alkire, Daniel P. Kelly, Edward S. Cheng
  • Patent number: 10404215
    Abstract: The disclosure relates to a lock-in amplifier comprising a plurality of channels (CH1-CHN), wherein each channel of the plurality of channels (CH1-CHN) is configured to receive an input signal (Sin1-SinN) and generate at least one output signal (Sout1-SoutN), a synchronization unit (110) configured to synchronize the generated output signals (Sout1-SoutN) of the plurality of channels (CH1-CHN), an aggregation module (150) configured to receive the generated output signals (Sout1-SoutN) and generate an aggregated signal (Sagg) based on the generated output signals (Sout1-SoutN).
    Type: Grant
    Filed: March 12, 2018
    Date of Patent: September 3, 2019
    Inventors: Holger Motzkau, Lars Andreas Rydh
  • Patent number: 10340863
    Abstract: A power amplifier module includes an output-stage amplifier, a driver-stage amplifier, an input switch, an output switch, an input matching circuit, an inter-stage matching circuit, an output matching circuit, and a control circuit. The input switch selectively connects one of a plurality of input signal paths to an input terminal of the driver-stage amplifier. The output switch selectively connects one of a plurality of output signal paths to an output terminal of the output-stage amplifier. The control circuit controls operations of the driver-stage amplifier and the output-stage amplifier. The input switch, the output switch, and the control circuit are integrated into an IC chip. The control circuit is disposed between the input switch and the output switch.
    Type: Grant
    Filed: April 3, 2018
    Date of Patent: July 2, 2019
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Hiroshi Okabe
  • Patent number: 10340862
    Abstract: A power amplification system with shared common base biasing is disclosed. A method for power amplification at a controller of a power amplification system comprising a plurality of cascode amplifier sections can include receiving a band select signal indicative of one or more frequency bands of a radio-frequency input signal to be amplified and transmitted. The method may further include biasing a common base stage of each of the plurality of cascode amplifier sections, and biasing a common emitter stage of a subset of the plurality of cascode amplifier sections.
    Type: Grant
    Filed: July 18, 2017
    Date of Patent: July 2, 2019
    Assignee: Skyworks Solutions, Inc.
    Inventors: Philip John Lehtola, David Steven Ripley
  • Patent number: 10147994
    Abstract: Aspects of this disclosure relate to a coupler circuit configured to receive an output of a radio frequency coupler. The coupler circuit can be arranged in a daisy chain with other coupler circuits. The coupler circuit can include a switch configured to turn on based on a signal level of a direct current component of a coupler signal from another coupler circuit and pass a radio frequency component of the coupler signal when on. The coupler circuit can pass the coupler signal while a module that includes the coupler circuit is otherwise inactive.
    Type: Grant
    Filed: September 22, 2017
    Date of Patent: December 4, 2018
    Assignee: Skyworks Solutions, Inc.
    Inventors: Srivatsan Jayaraman, Onder Oz, Pradeep A. Balaraman, Roman Zbigniew Arkiszewski, Yeung Bun Choi, Songbai Zhang
  • Patent number: 10103754
    Abstract: Disclosed herein are systems, circuits, architectures and methods related to front-end architectures for wireless devices configured for uplink carrier aggregation. The disclosed front-end architectures include a first power amplifier module with filters and a second filter-less power amplifier module. The front-end architectures are configured to route signals from the filter-less power amplifier module to the first power amplifier module for filtering. This reduces the size of the second filter-less module relative to a module that utilizes its own filters, thereby reducing costs, reducing size, and/or providing additional space for other modules or other functionality to be included in a wireless device.
    Type: Grant
    Filed: July 17, 2017
    Date of Patent: October 16, 2018
    Assignee: SKYWORKS SOLUTIONS, INC.
    Inventor: Joel Richard King
  • Patent number: 9998083
    Abstract: Transmission and reception of communications via high frequency antenna systems employing cooled pure copper or high-temperature superconductor filters and/or amplifiers are presented. A comb linear amplifier combiner and comb limiter combiner may be modified with, for example, cryogenically cooled pure copper and/or high-temperature superconductor components, such as matching units of bandpass filters. A computer control unit may be coupled to the transmission circuit and reception circuit to control operation of one or more filters, and/or amplifiers.
    Type: Grant
    Filed: February 20, 2015
    Date of Patent: June 12, 2018
    Assignee: Liberty University
    Inventors: Michael Anthony Maiuzzo, Ronald T. Sones
  • Patent number: 9979349
    Abstract: Multi-band device having multiple miniaturized single-band power amplifiers. In some embodiments, a power amplifier die can include a semiconductor substrate, and a plurality of power amplifiers (PAs) implemented on the semiconductor substrate. Each PA can be configured to drive approximately a characteristic load impedance of a downstream component along an individual frequency band signal path, such that each PA is sized smaller than a wide band PA configured to drive more than one of the frequency bands associated with the plurality of PAs. The downstream component can include an output filter.
    Type: Grant
    Filed: September 29, 2015
    Date of Patent: May 22, 2018
    Assignee: Skyworks Solutions, Inc.
    Inventor: Philip John Lehtola
  • Patent number: 9979350
    Abstract: An operational amplifier based circuit has an operational amplifier, a feedback circuit, and a compensation circuit block. The feedback circuit is coupled between an output port and an input port of the operational amplifier. The compensation circuit block has circuits involved in stability compensation of the operational amplifier, wherein there is no stability compensation circuit driven at the output port of the operational amplifier.
    Type: Grant
    Filed: October 23, 2015
    Date of Patent: May 22, 2018
    Assignee: MEDIATEK INC.
    Inventor: Chi-Yao Yu
  • Patent number: 9960793
    Abstract: Aspects of this disclosure relate to detecting power associated with an individual carrier of a carrier aggregated signal. In an embodiment, a carrier aggregation system includes radio frequency (RF) sources, a transmission output, and a directional coupler. The RF sources, such as power amplifiers, can each be associated with a separate carrier. The transmission output can provide a carrier aggregated signal that includes an aggregation of the separate carriers associated with the RF sources. The directional coupler can provide an indication of RF power of one of the separate carriers.
    Type: Grant
    Filed: June 22, 2016
    Date of Patent: May 1, 2018
    Assignee: Skyworks Solutions, Inc.
    Inventors: Edward James Anthony, Reza Kasnavi, John G. Freed
  • Patent number: 9954504
    Abstract: A power amplification module includes a first input terminal that receives a first transmit signal in a first frequency band, a second input terminal that receives a second transmit signal in a second frequency band having a narrower transmit/receive frequency interval than the first frequency band, a first amplification circuit that receives and amplifies the first transmit signal to produce a first amplified signal and outputs the first amplified signal, a second amplification circuit that receives and amplifies the second transmit signal to produce a second amplified signal and outputs the second amplified signal, a third amplification circuit that receives and amplifies the first or second amplified signal to produce an output signal and outputs the output signal, and an attenuation circuit located between the second input terminal and the second amplification circuit and configured to attenuate a receive frequency band component of the second frequency band.
    Type: Grant
    Filed: November 30, 2016
    Date of Patent: April 24, 2018
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Yasushi Oyama, Takayuki Tsutsui, Kazuhito Nakai
  • Patent number: 9923538
    Abstract: A technique relates to a microwave device. The microwave device includes a Josephson ring modulator, a first multimode resonator connected to the Josephson ring modulator, where the first multimode resonator is made of a first left-handed transmission line, and a second multimode resonator connected to the Josephson ring modulator, where the second multimode resonator is made of a second left-handed transmission line.
    Type: Grant
    Filed: November 25, 2015
    Date of Patent: March 20, 2018
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventor: Baleegh Abdo
  • Patent number: 9871490
    Abstract: Existing multi-band/multi-mode (MB/MM) power amplifiers (PAs) use separate signal paths for the different covered frequency bands. This results in a large degree of hardware duplication and to a large die size and cost. Solutions that achieve hardware sharing between the different signal paths of MB/MM PAs are shown. Such sharing includes bias circuit and bypass capacitors sharing, as well as sharing front-end stages and the output stage of the PA. Signal multiplexing may be realized in the transmitter or at the PA front-end while the signal de-multiplexing can be realized either in the PA output stage or at the front-end of the output stage. Such circuits can be applied with saturated and linear MB/MM PAs with adjacent or non-adjacent bands.
    Type: Grant
    Filed: April 15, 2016
    Date of Patent: January 16, 2018
    Assignee: Qorvo International PTE. LTD.
    Inventors: Baker Scott, George Maxim
  • Patent number: 9858532
    Abstract: A technique relates to a microwave device. The microwave device includes a Josephson ring modulator, a first multimode resonator connected to the Josephson ring modulator, where the first multimode resonator is made of a first left-handed transmission line, and a second multimode resonator connected to the Josephson ring modulator, where the second multimode resonator is made of a second left-handed transmission line.
    Type: Grant
    Filed: September 30, 2015
    Date of Patent: January 2, 2018
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventor: Baleegh Abdo
  • Patent number: 9853802
    Abstract: A radio frequency circuit. In the circuit, a first directional coupler receives a second transmit signal, uses a part of the second transmit signal as a third transmit signal, directly sends the third transmit signal to a first port of a circulator, and obtains a first coupling signal from the second transmit signal; the circulator outputs the third transmit signal through a second port; an impedance tuner transmits the third transmit signal to an antenna port and transmits, to the second port of the circulator, a first input signal from the antenna port; the circulator inputs the first input signal to a second directional coupler through a third port; the second directional coupler obtains a second coupling signal from the first input signal; and a controller adjusts impedance of the impedance tuner according to the first coupling signal and the second coupling signal.
    Type: Grant
    Filed: April 24, 2015
    Date of Patent: December 26, 2017
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Weinan Li, Tao Liu, Jian Liang
  • Patent number: 9853682
    Abstract: A communications module includes a front-end module including a common port configured to be connected to an antenna, a reception port configured to pass a reception signal, and a transmission port configured to pass a transmission signal, and a high frequency switch circuit connected to the reception port and/or the transmission port and configured to change signal routes for signals passing through the front-end module, wherein the front-end module is configured to amplify communications signals of different communications standards.
    Type: Grant
    Filed: March 25, 2016
    Date of Patent: December 26, 2017
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Seung Pil Jung, Young Pyo Lee
  • Patent number: 9831834
    Abstract: A low frequency loss correction circuit that improves the efficiency of a power amplifier at near-DC low frequencies The low frequency loss correction circuit can include a signal error detection circuit configured to produce an error signal in response to detecting one or more frequency components of a tracking signal below a cutoff frequency that are substantially attenuated through a capacitive path. The low frequency loss correction circuit can include a drive circuit configured to convert the error signal into a low frequency correction signal, and provide the low frequency correction signal to a voltage supply line, the low frequency correction signal including at least some of the one or more frequency components of the tracking signal below a cutoff frequency that are substantially attenuated through the capacitive path.
    Type: Grant
    Filed: July 20, 2015
    Date of Patent: November 28, 2017
    Assignee: Skyworks Solutions, Inc.
    Inventors: Florinel G. Balteanu, Jose Alejandro Macedo, Peter Harris Robert Popplewell, Jakub F. Pingot
  • Patent number: 9774298
    Abstract: According to one embodiment, a high-frequency amplifier includes an active element and an output matching circuit. The active element is provided on a substrate. The active element is configured to amplify a signal having a frequency band. The active element includes a cell region. The output matching circuit is connected to the active element. The output matching circuit includes a wire, a transmission line and an output terminal. The wire includes an input end and an output end. The input end of the wire is connected to an output part of the cell region of the active element. The transmission line is provided on the substrate. The transmission line includes an input part and an output part. The input part of the transmission line is connected to the output end of the wire. The output terminal is provided on the substrate.
    Type: Grant
    Filed: February 10, 2016
    Date of Patent: September 26, 2017
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Kenta Kuroda, Kazutaka Takagi
  • Patent number: 9761921
    Abstract: The tunable bandpass filter is used for filtering an electromagnetic signal, has a system passband between a first and a second tunable cutoff frequencies, and has a first subfilter and a second subfilter connected to one another in series between an input port and an output port and being complementary to one another in the tunable bandpass filter. At least one of the first subfilter and the second subfilter being connected to operate in reflection.
    Type: Grant
    Filed: December 8, 2015
    Date of Patent: September 12, 2017
    Assignee: HUAWEI TECHNOLOGIES CANADA CO., LTD.
    Inventors: Raafat R. Mansour, Kevin Yang, Vahid Miraftab
  • Patent number: 9685915
    Abstract: An amplification stage and a wideband power amplifier are provided. The amplification stage includes a stage input terminal, a stage output terminal, an amplifier, an input compensation network, and in output compensation network. At the stage input terminal is received a signal which is provided via the input compensation network to the amplifier. The input compensation network filters the signal to allow a wideband operation of the amplification stage around an operational frequency. The amplified signal provided by the amplifier is provided via the output compensation network to the stage output terminal. The output compensation network configured to allow a wideband operation of the amplification stage around the operational frequency with a minimal phase shift and distortion of amplitude and phase frequency response. The wideband power amplifier includes a plurality of amplification stage combined with transmission lines or their lumped element equivalents in a specific circuit topology.
    Type: Grant
    Filed: October 31, 2012
    Date of Patent: June 20, 2017
    Assignee: NXP USA, INC.
    Inventor: Igor Blednov
  • Patent number: 9685919
    Abstract: Systems and methods are provided for amplifying multiple input signals to generate multiple output signals. An example system includes: a first channel configured to receive a first input signal and a second input signal and generate a first output signal and a second output signal based at least in part on the first input signal and the second input signal; and a second channel configured to receive a third input signal and a fourth input signal and generate a third output signal and a fourth output signal based at least in part on the third input signal and the fourth input signal. A first differential signal is equal to the first input signal minus the second input signal. A second differential signal is equal to the third input signal minus the fourth input signal. The first output signal corresponds to a first phase.
    Type: Grant
    Filed: April 3, 2015
    Date of Patent: June 20, 2017
    Assignee: On-Bright Electronics (Shanghai) Co., Ltd.
    Inventors: Tingzhi Yuan, Zibin Chen, Lieyi Fang
  • Patent number: 9679550
    Abstract: A pickup device for an electric instrument may include at least one permanent magnet to detect vibrations from the electric instrument's strings. The pickup device may further include at least one coil within a magnetic field of the permanent magnet. The coil may be coupled to one or more of a plurality of selectable filters. The pickup device may be an integrated assembly and fittable within a standard-sized pickup cavity on the electric instrument.
    Type: Grant
    Filed: May 3, 2016
    Date of Patent: June 13, 2017
    Assignee: Fishman Transducers, Inc.
    Inventors: Lawrence Fishman, John Eck
  • Patent number: 9667197
    Abstract: An input signal amplification system comprises at least two different means of amplifying input signals in order to obtain amplified signals. It also comprises at least one means of summing amplified signals, and dynamic means of activating or deactivating one or more of the amplifying means based on input signals.
    Type: Grant
    Filed: February 27, 2014
    Date of Patent: May 30, 2017
    Assignees: THALES, INSTITUT POLYTECHNIQUE DE BORDEAUX, UNIVERSITE DE BORDEAUX, CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE
    Inventors: Patrick Garrec, Eric Kerherve, Pascal Cornic, Stéphane Kemkemian, Nejdat Demirel, Yves Mancuso
  • Patent number: 9667202
    Abstract: A power amplifier may include an amplifying unit configured to amplify an input signal, an impedance varying unit connected between the amplifying unit and an output port that is for outputting an amplified signal of the input signal, and a controller configured to output a first control signal based on a level of power of the amplified input signal of the amplifying unit to control a varying of impedance of the impedance varying unit.
    Type: Grant
    Filed: December 4, 2015
    Date of Patent: May 30, 2017
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Ki Joong Kim, Youn Suk Kim, Jun Goo Won, Sang Wook Park, Sung Hwan Park
  • Patent number: 9641200
    Abstract: The present invention provides a signal transceiver circuit including a band-stop filter, a first band-pass filter, and a second band-pass filter. The band-stop filter blocks signals between a first frequency and a second frequency for letting signals outside of the first frequency and the second frequency of the first multi-channel signal and the second multi-channel signal pass. The first band-pass filter blocks signals output by the band-stop filter outside of a third frequency and a fourth frequency for letting signals output by the band-stop filter between the third frequency and the fourth frequency pass. The second band-pass filter blocks signals outside of a fifth frequency and a sixth frequency of the first multi-channel signal and the second multi-channel signal for letting signals between the fifth frequency and the sixth frequency of the first multi-channel signal and the second multi-channel signal pass.
    Type: Grant
    Filed: October 13, 2015
    Date of Patent: May 2, 2017
    Assignee: WISTRON NEWEB CORP.
    Inventors: Chiung-Wen Hsin, Szu-Yuan Chen
  • Patent number: 9634618
    Abstract: An impedance matching arrangement for an amplifier includes first and second metallic transmission lines arranged on a ground plane, the first metallic transmission line being connected with a first power amplification stage of the amplifier, the second metallic transmission line being connected with a second power amplification stage of the amplifier; wherein the first and second metallic transmission lines are electrically coupled for transmitting an RF signal amplified by the first power amplification stage to the second power amplification stage.
    Type: Grant
    Filed: July 20, 2015
    Date of Patent: April 25, 2017
    Assignee: City University of Hong Kong
    Inventors: Quan Xue, Haiwai Zhang, Kam Man Shum
  • Patent number: 9595927
    Abstract: Circuitry includes a balanced amplifier and bias adjustment circuitry. The bias adjustment circuitry is coupled to the balanced amplifier and is configured to measure an RF termination voltage across an output termination impedance of the balanced amplifier and adjust a bias voltage supplied to the balanced amplifier based on the RF termination voltage. Notably, the RF termination voltage is proportional to a voltage standing wave ratio (VSWR) of the balanced amplifier, and thus enables an accurate measurement thereof. By using the RF termination voltage to adjust a bias voltage supplied to the balanced amplifier, overvoltage and/or thermally stressing conditions of the balanced amplifier as a result of high VSWR may be avoided while simultaneously avoiding the need for large or expensive isolation circuitry.
    Type: Grant
    Filed: August 18, 2014
    Date of Patent: March 14, 2017
    Assignee: Cree, Inc.
    Inventor: Kyle Baker
  • Patent number: 9590564
    Abstract: The present application provides a multiband power amplification apparatus. The first input terminal receives a signal in a frequency band f1; the second input terminal receives a signal in a frequency band f2. The first adjustment module adjusts a first channel of signal and then outputs an adjusted first channel of signal to the first adder. The second adjustment module adjusts a third channel of signal and then outputs an adjusted third channel of signal to the first adder. The first adder converges the signal adjusted by the second adjustment module and the signal output by the first adjustment module and then outputs a converged signal to a first digital-to-analog converter. The second adder converges a second channel of signal and a fourth channel of signal and then outputs a converged signal to a second digital-to-analog converter.
    Type: Grant
    Filed: December 24, 2015
    Date of Patent: March 7, 2017
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Kun Wang, Di Wu, Erni Zhu
  • Patent number: 9461598
    Abstract: A power amplifier includes a clamping circuit configured to provide a clamped voltage from a power supply; an amplifier pair having first inputs coupled to the clamping circuit, second inputs and an output for providing an amplified signal; and a biasing circuit coupled between the clamping circuit and the second inputs. The biasing circuit is configured to adjust input bias voltages of the amplifier pair such that the output of the amplifier pair varies proportionally to a change of the power supply.
    Type: Grant
    Filed: February 4, 2015
    Date of Patent: October 4, 2016
    Assignees: STMICROELECTRONICS (SHENZHEN) R&D CO. LTD, STMICROELECTRONICS S.R.L.
    Inventors: Kelvin Jian Wen, Mei Yang, Zheng Hua Song, Xian Xiong, Cristiano Meroni
  • Patent number: 9445197
    Abstract: An automobile audio system having at least two near-field speakers located close to an intended position of a listener's head is configured by determining a first binaural filter that causes sound produced by each of the near-field speakers to have characteristics at the intended position of the listener's head of sound produced by a sound source located at a first designated position other than the actual locations of the near-field speakers, determining an up-mixing rule to generate at least three component channel signals from an input audio signal having at least two channels, and configuring the audio system to, determine a first binaural signal corresponding to a combination of the component channel signals originating at the first designated position, and filter the first binaural signal using the first binaural filter and to output the filtered signals using the near-field speakers.
    Type: Grant
    Filed: May 7, 2013
    Date of Patent: September 13, 2016
    Assignee: Bose Corporation
    Inventors: Charles Oswald, Michael S. Dublin, Tobe Z. Barksdale, Wontak Kim, Jahn Dmitri Eichfeld
  • Patent number: 9432060
    Abstract: An apparatus is provided for load modulating a power amplifier that is configured to output a multiband radio frequency signal comprising at least a first frequency band and a second frequency band. The apparatus comprises a multiplexer (31) coupled to receive a multiband radio frequency signal from the output of a power amplifier, and configured to separate the multiband radio frequency signal into first and second frequency band signals. A first load modulator circuit (33i) is provided in a first branch, the first load modulator circuit coupled to receive the first frequency band signal, and configured to load modulate the first frequency band signal. A second load modulator circuit (332) is provided in a second branch, the second load modulator circuit coupled to receive the second frequency band signal, and configured to load modulate the second frequency band signal.
    Type: Grant
    Filed: October 19, 2012
    Date of Patent: August 30, 2016
    Assignee: Telefonaktiebolaget LM Ericsson (Publ)
    Inventor: Richard Hellberg
  • Patent number: 9418950
    Abstract: An integrated circuit architecture and circuitry is defined by a die structure with a plurality of exposed conductive pads arranged in a grid of rows and columns. The die structure has a first operating frequency region with a first transmit and receive chain, and a second operating frequency region with a second transmit chain and a second receive chain. There is a shared region of the die structure defined by an overlapping segment of the first operating frequency region and the second operating frequency region with a shared power supply input conductive pad connected to the first transmit chain, the second transmit chain, the first receive chain, and the second receive chain, and a shared power detection output conductive pad connected to the first transmit chain and the second transmit chain.
    Type: Grant
    Filed: April 23, 2014
    Date of Patent: August 16, 2016
    Assignee: SKYWORKS SOLUTIONS, INC.
    Inventors: Lisette L. Zhang, Oleksandr Gorbachov
  • Patent number: 9398371
    Abstract: An analog signal transfer system includes a transmission apparatus including a variable compressor that variably compresses input signals exponentially according to the amplitudes of the input signals; and a reception apparatus including a variable expander that variably expands the compressed signals exponentially according to the amplitudes of the compressed signals.
    Type: Grant
    Filed: November 29, 2012
    Date of Patent: July 19, 2016
    Assignee: Kabushiki Kaisha Audio-Technica
    Inventors: Osamu Yokoi, Yuki Abe
  • Patent number: 9363023
    Abstract: A semiconductor device including: a filter circuit to subdivide and output the received signal as a first signal with a relatively low frequency and a second signal with a relatively high frequency; a first channel containing a photocoupler to convey the first signal output from the filter circuit; a second channel containing an isolator to convey the second signal from the filter circuit; and a signal synthesis circuit to sum and output the first signal conveyed by way of a first channel and a second signal conveyed by way of a second channel.
    Type: Grant
    Filed: April 11, 2013
    Date of Patent: June 7, 2016
    Assignee: RENESAS ELECTRONICS CORPORATION
    Inventor: Hiroaki Yamazaki
  • Patent number: 9355630
    Abstract: A pickup device for an electric instrument may include at least one permanent magnet to detect vibrations from the electric instrument's strings. The pickup device may further include at least one coil within a magnetic field of the permanent magnet. The coil may be coupled to one or more of a plurality of selectable filters. The pickup device may be an integrated assembly and fittable within a standard-sized pickup cavity on the electric instrument.
    Type: Grant
    Filed: January 12, 2015
    Date of Patent: May 31, 2016
    Assignee: Fishman Transducers, Inc.
    Inventors: Lawrence Fishman, John Eck