Abstract: A method (100) for mechanically tuning a VCO that has a resonant stripline having vias in predetermined locations connected through a circuit board to ground. This includes a step (104) of measuring the operating frequency of the VCO. A following step (106) includes calculating an amount of frequency shift needed to achieve a desired frequency. A following step (108) matches the amount of frequency shift needed to values in a look-up table of frequency shifts versus via locations to determine which vias locations will provide the proper amount of frequency shift. A last step (110) includes mechanically disconnecting from ground the via locations indicated in the third step such that the desired frequency is achieved. This method (100) of tuning allows VCO frequency adjustment after final assembly avoiding problems of frequency shifts that can occur due to the placement of a metal lid on the circuit board after assembly.

Abstract: Four generally quadrant-like indentations are formed at the corners of a substrate. A conductive member is applied to the inner surfaces of the indentations to form input and output terminals, namely a power voltage terminal, a voltage control terminal, a modulation terminal, and an output terminal. By placing these terminals at the corners of the substrate, sufficient distances are provided between the input terminals and the output terminals so as to prevent interference between these terminals.

Abstract: A method (100) for tuning a voltage controlled oscillator by changing electrical circuit parasitics includes a first step (102) of providing a voltage controlled oscillator circuit on a circuit board and a plurality of different metal lids each having different numbers, sizes and locations of holes. Each different lid presents a different electrical circuit parasitic to the voltage controlled oscillator. In a second step (104), the voltage controlled oscillator frequency is measured, and the frequency shift needed to achieve a desired operating frequency is calculated in a third step (106). In a fourth step (108), a lid is chosen that will present the parasitics needed to provide the amount of frequency shift needed. As a last step (110), the chosen lid is attaching to the circuit board to obtain the desired nominal operating frequency from the voltage controlled oscillator.

Abstract: A resonant circuit of the present invention has a ceramic substrate, a quartz element provided on said substrate, and a capacitor for temperature compensation. Connection terminals are formed on the rear of the substrate in order to mount the resonant circuit to another substrate. A seam ring for air-tight sealing is positioned at the edges of the substrate. The quartz oscillator with this configuration can be mounted without resorting to leads.

Abstract: An integrated circuit for measuring the distance houses an oscillator in a package. Further, a plane inductor is provided on the surface of the package housing the oscillator. The plane inductor is connected to the oscillator so as to specify a frequency of the oscillator. If conductive material approaches the surface of the package, the frequency of the oscillator is varied by means of the plane inductor. The approaching distance of the conductive material is detected by detecting the frequency of the oscillator. The conductive material is mostly metal, however, the integrated circuit for measuring the distance can measure the approaching distance of non-metal conductive material such as conductive liquid.

Abstract: An oscillator in which organic substances derived from an active element fixing adhesive do not deposit on an oscillating element and in which when the active element or the oscillating element is damaged, other good parts that are not defective can be reused. In the oscillator, an active element 2 is mounted inside a first container 1 whose upper surface is opened, and not only the opening of the first container 1 is closed by an oscillating unit 3 having an oscillating element 6 incorporated therein, but also the oscillating unit 3 is attached onto the opening of the first container 1, so that second connecting electrodes 11a to 11d of a second container 5 of the oscillating unit 3 are electrically connected to first connecting electrodes 14a to 14d of the first container 1.

Abstract: A piezoelectric oscillator in which a resonator accommodating a piezoelectric element, such as a quartz crystal resonator or a SAW resonator, in a case thereof and an IC chip, such as an IC for PLL, electrically connected to the resonator are integrally molded by molding resin. Extending radiating leads are provided for an island of a lead frame, in which the IC chip is disposed, and a portion of the radiating leads is exposed out of the molding resin so that the heat generated in the IC chip is positively radiated. Radiating leads are also attached to the case of the resonator to project out of the molding resin so that heat conducted to the case is radiated to minimize influence of heat upon the piezoelectric element. In an oscillator, the size of which has been reduced and the frequency of which has been raised, heat generated in the IC chip is radiated to the outside of the molding resin so that a rise in the temperature of the oscillator is minimized.

Abstract: A control circuit includes: a temperature 30; a temperature sensing section 32; a memory 36, an amplifying section 31 to which the memory and the temperature sensor are electrically connected; a first D/A converting section 38 electrically interposed between the memory and the temperature sensing section; a second D/A converting section electrically interposed between the memory and the amplifying section 31, The amplifying section 31 includes: a polarity inverting circuit 33 connected to the temperature sensor; and a variable attenuator 34, an offset adjusting circuit 100, and an amplifying circuit 35 that are connected sequentially to the polarity inverting circuit. The amplifying section 31 is connected to a sample hold circuit 41 through a displacement buffering means 101. The memory has 8 or less working control voltage setting groups.

Abstract: An oscillator circuit including a metal plate secured to a dielectric substrate. A micro strip line is mounted on the dielectric substrate. One end of the micro strip line is connected to the gate terminal of a field effect transistor for microwave oscillation and the other end of the micro strip line is grounded to the metal plate via a terminal resistor. A dielectric resonator is secured with an ordinary adhesive to the inner wall of a shield case. Attaching the dielectric resonator to the shield case allows the degree of coupling, defined by the distance between the micro strip line and the dielectric resonator, to be freely set. A tuning screw is screwed through the metal plate and the dieletric substrate opposite to the dielectric resonator. The microwave oscillation circuit can be used with a down converter.

Abstract: A temperature compensation apparatus for an oscillator includes an oscillator having an output for generating a clock signal with a frequency identical to the oscillating frequency of the oscillator, a memory for storing a frequency compensation lookup table based on the relationship between output frequencies of the oscillator and the environmental temperature variations, a temperature detector for detecting the environmental temperature variations, a central processing unit for selecting a rating output frequency of the oscillator, acquiring a frequency compensation value from the frequency compensation lookup table stored in the memory in response to a detected environmental temperature, and converting the frequency compensation value into a corresponding compensation signal, and a compensation circuit receiving an output signal of the oscillator and a compensation signal from the CPU for compensating a deviation between the output frequency of the oscillator and the rating frequency and outputting a frequ

Abstract: A voltage-controlled oscillator is provided having a semiconductor integrated circuit and a piezoelectric resonator. A variable-capacitance diode may be connected in series with the piezoelectric resonator. The variable-capacitance diode may be further mounted a land of a lead frame. The piezoelectric resonator, variable-capacitance diode and lead frame may be resin molded into a single unit. In operation, a signal may be applied to a node located between the variable-capacitance diode and the DC-cutting capacitor.

Abstract: A radar module includes a high-frequency signal generator comprising upper and lower parallel conductive plates, at least one dielectric rod held between the parallel conductive plates, a metal diode mount held between the parallel conductive plates, a gunn diode member mounted on a side of the diode mount, and a printed-circuit board mounted on the side of the diode mount in covering relationship to the gunn diode member and having a bias supply circuit on its surface for supplying a bias voltage to the gunn diode member. One terminal of the gunn diode member extends through a through hole defined in the printed-circuit board, is exposed in the vicinity of the surface of the diode mount, and is connected to the bias supply circuit.

Abstract: This invention provides a temperature-compensated piezoelectric oscillator having an oscillation frequency that is easily adjusted in an adjustment procedure after its assembly. Compensation for frequency-temperature characteristics is achieved without the need for an externally installed variable reactance element. The temperature-compensated piezoelectric oscillator includes a piezoelectric oscillator element and an oscillator circuit that drives the piezoelectric oscillator element. The oscillator circuit changes the oscillation frequency in response to an applied power supply voltage VDD(T). A temperature sensor circuit senses the ambient temperature T of the piezoelectric oscillator element. A variable power supply circuit changes the power supply voltage VDD(T) applied to the oscillator circuit in response to the temperature sensed by the temperature sensor circuit. The changes in the applied power supply voltage VDD(T) changes the frequency-temperature characteristics of the oscillator circuit.

Abstract: An electronic audio circuit operates a piezoelectric audio transducer to produce a two-tone warbling audio output. The electronic circuit includes an integrated circuit double timer and integrated circuit logic gates. One timer produces a toggling frequency that operates a toggling circuit composed of a logic gate to electrically connect and disconnect an electrical component from a frequency determining network to produce two frequency determining networks. The other timer produces two tones depending upon which frequency determining network is electrically connected to the other timer. The two tone are buffered and then drive a two-element piezoelectric transducer.

Abstract: A microwave oscillator includes a substrate having a circuit pattern on the top surface, a thin copper foil covering the bottom surface, and a hole. An electronic component is mounted to the top surface of the substrate. A metal plate is attached to the bottom surface of the substrate thereby closing the bottom of the hole. A dielectric resonator is attached to the metal plate through the hole. Since the dielectric resonator is attached to the metal plate by soldering, the bond between the dielectric resonator and the metal plate is stronger and more stable than that achieved by using a conventional adhesive. This enhances the reliability against temperature changes; mechanical impact or humidity.

Abstract: A voltage controlled oscillator module (100) (400) provides tuning capability for the VCO in a shielded environment. The module includes a trimmable capacitor (110) (410) having metal plates (112, 114), (412, 414, 416) capacitively coupled through the substrate. One of the metal plates (114) (416) is a trimmable plate which can be trimmed to tune the VCO frequency. The trimmable metal plate (114) (416) remains exposed on the bottom surface (108) (408) of the substrate (104) (404) so that the frequency of the VCO can be tuned while the reminder of the oscillator circuitry (102) (402) on the top surface (106) (406) is encapsulated by a ground shield (116) (418).

Abstract: An oscillator is isolated from external mechanical and thermal effects by rrounding the oscillator on all sides with an aerogel insulation structure that provides both thermal insulation and vibrational isolation above some predetermined low frequency limit which is a function of the mass of the oscillator and the nature of the aerogel insulation structure.

Abstract: A voltage controlled oscillator module assembly (300) minimizes microphonics in a low profile package. Included within the module (300) are a substrate (302), VCO circuitry (308), and a ground shield (314) encapsulating the VCO circuitry. Included within the VCO circuitry (308) is at least one resonator (310) which is solderable on at least two of its surfaces. One surface of the resonator (310) is soldered to the substrate (302) while another surface of the resonator is soldered to the shield (314). An improved ground is thus provided to the resonator (310) which reduces the occurrences of microphonics while providing a low profile package for the module (300).

Abstract: The invention provides a piezoelectric oscillator including a semiconductor integrated circuit and a piezoelectric resonator or a voltage-controlled oscillator including a semiconductor integrated circuit, a piezoelectric resonator and another electronic component. The piezoelectric resonator has a cross-sectional shape of an ellipse or a track. The semiconductor integrated circuit and the electronic component are molded with a resin into a very thin unit.

Abstract: A function-differentiated temperature compensated crystal oscillator (10) is disclosed having an integrated circuit (12), at least one capacitor (14) and a piezoelectric element (16) being electrically coupled to a leadframe (18), and being encapsulated in a molded package body (36). The leadframe (18) includes two groups of leads (20, 26), each group accessing different functionalities of the temperature compensated crystal oscillator (10). In one application, the first group of leads (20) may be excised preventing user access to internal functions of the oscillator (10). In another application, the second group of leads (26) may be excised allowing user access to the internal functions of the oscillator (10). This configuration enables a single package to be used for different user applications and functions.

Abstract: A resin mold type piezoelectric oscillator is provided comprising a piezoelectric oscillator having outer leads, a semiconductor integrated circuit for electrically oscillating the piezoelectric oscillator, and a lead frame formed substantially in a plane for mounting the piezoelectric oscillator and integrated circuit the lead frame having connection pads for connecting to the outer leads of the piezoelectric oscillator. The outer leads of the piezoelectric oscillator are bent at least twice in a plane substantially perpendicular to the lead frame so as to provide a clearance for crossing over inner leads of the lead frame.

Abstract: A communication system providing read and write access to analog and digitally controlled calibration and configuration information contained within prepackaged crystal oscillators having a crystal oscillator electrical interface with power (VCC), ground (GND), output enable (OE), and oscillator output (XO) interface pins. An output enable (OE) signal is used to control the activity state of the crystal oscillator output, with a pullup MOSFET connected to the XO pin to detect a logic low level at the XO pin during times when the OE signal is logically inactive. A state machine controls access to a serial shift register having multiple calibration and configuration bits. The calibration and configuration bits are used in performing an oscillator specific calibration and configuration function. The state machine also controls the reads and writes of the calibration and configuration shift register.

Abstract: A piezoelectric resonator is formed with a case and a stem for housing the piezoelectric vibrating portion thereof. The case and stem are coupled by press-fitting and the interface is coated with a high temperature solder containing at least 90% lead. An inner lead of the resonator is also coated with the solder and a portion of the vibrator is fixed to the lead by melting the solder. Alternative constructions employ a resin case or a metallic plate case and a configuration in which an integrated circuit and a piezoelectric vibrator are integrally molded to achieve a highly desirable mounting configuration.

Abstract: A piezoelectric resonator is formed with a case and a stem for housing the piezoelectric vibrating portion thereof. The case and stem are coupled by press-fitting and the interface is coated with a high temperature solder containing at least 90% lead. An inner lead of the resonator is also coated with the solder and a portion of the vibrator is fixed to the lead by melting the solder. Alternative constructions employ a resin case or a metallic plate case and a configuration in which an integrated circuit and a piezoelectric vibrator are integrally molded to achieve a highly desirable mounting configuration.

Abstract: A double-sided oscillator package (200) is provided. The package (200) has an open-top receptacle (212) adapted to receive an electronic component and an open-bottom receptacle (214) adapted to receive at least a piezoelectric element and a cover, forming a hermetic environment. The electronic component (226) and piezoelectric element (234), can be suitably connected to the package (200). The package (200) is designed to be mass-producable, and is compact, easily surface mounted and provides a narrow profile.

Abstract: An oscillator circuit having an amplifier and feedback loop multiplies a generated signal by appropriate selection of capacitance ratios in the feedback loop. In order to isolate this multiplied, high voltage signal, a voltage divider is used to isolate the high voltage portion from the input and output (I/O) of an integrated circuit oscillator core. The multiplied voltage creates a high voltage signal suitable for stylus signal transmission. The divided, and relatively low, voltage is used in the feedback path to stabilize the oscillator core's operation.

Abstract: A radar module includes a high-frequency signal generator comprising upper and lower parallel conductive plates, at least one dielectric rod held between the parallel conductive plates, a metal diode mount held between the parallel conductive plates, a gunn diode member mounted on a side of the diode mount, and a printed-circuit board mounted on the side of the diode mount in covering relationship to the gunn diode member and having a bias supply circuit on its surface for supplying a bias voltage to the gunn diode member. One terminal of the gunn diode member extends through a through hole defined in the printed-circuit board, is exposed in the vicinity of the surface of the diode mount, and is connected to the bias supply circuit.

Abstract: A piezoelectric resonator is formed with a case and a stem for housing the piezoelectric vibrating portion thereof. The case and stem are coupled by press-fitting and the interface is coated with a high temperature solder containing at least 90% lead. An inner lead of the resonator is also coated with the solder and a portion of the vibrator is fixed to the lead by melting the solder. Alternative constructions employ a resin case or a metallic plate case and a configuration in which an integrated circuit and a piezoelectric vibrator are integrally molded to achieve a highly desirable mounting configuration.

Abstract: A high-frequency signal generator has upper and lower conductive plates parallel to each other, at least one dielectric rod held between the upper and lower conductive plates, a metal mount sandwiched between the upper and lower conductive plates, a oscillating element mounted on a side of the mount for generating a high-frequency signal, a printed-circuit board mounted on the side of the mount and including a bias supply circuit disposed on a surface thereof for supplying a bias voltage to the oscillating element to enable the oscillating element to generate a high-frequency signal, and a positional displacement preventing structure on at least one of the upper and lower conductive plates for preventing the mount from being positionally displaced with respect to the dielectric rod. The positional displacement preventing structure may comprise a groove defined in at least one of the upper and lower conductive plates, the mount being partly fitted in the groove.

Abstract: A battery-powered magnetic pen has an oscillator for generating a magnetic field at a contact frequency and a proximity frequency. The oscillator is connected to a resettable timer. The pen also includes a tip switch that is actuated in response to the pen being brought into engagement with an object and disengaged from the object. The tip switch is connected to a pulse generator and to the oscillator. Each time the pen is brought into engagement with an object, the pulse generator resets the timer to initiate the timing of a time out period. Assuming the oscillator is off, the first time the pen contacts an object, the resetting causes the oscillator to be turned on. So long as the oscillator is on, the opening and closing of the tip switch causes the oscillator to switch between the contact frequency and the proximity frequency. Should the timer reach the end of a predetermined time out period, the oscillator is shut off.

Abstract: A battery-powered, magnetic-pen oscillator includes a circuit having a first transistor arranged in a common emitter configuration. A feedback loop includes a transformer and the transistor that produce a loop phase shift of zero degrees and a loop gain of one to cause oscillation, and additionally creates the magnetic field emitted by the pen. A second transistor provides current mirror biasing for the first transistor and determines the amount of current flowing through the first transistor.

Abstract: A micro-miniature resonator-oscillator is disclosed. Due to the miniaturization of the resonator-oscillator, oscillation frequencies of one MHz and higher are utilized. A thickness-mode quartz resonator housed in a micro-machined silicon package and operated as a "telemetered sensor beacon" that is, a digital, self-powered, remote, parameter measuring-transmitter in the FM-band. The resonator design uses trapped energy principles and temperature dependence methodology through crystal orientation control, with operation in the 20-100 MHz range. High volume batch-processing manufacturing is utilized, with package and resonator assembly at the wafer level. Unique design features include squeeze-film damping for robust vibration and shock performance, capacitive coupling through micro-machined diaphragms allowing resonator excitation at the package exterior, circuit integration and extremely small (0.1 in. square) dimensioning.

Abstract: An RF power-generator system for the frequency range of 2 to 30 MHz and a programmable sinusoidal power output of 0 to 1000 W. The system is constructed of modules (10, 30, 50, 70 and 90) accommodated in a shallow parallelepipedal housing (1) with a capacity of 4.6 l. The housing essentially comprises two lateral lengths (4) of structural section, a sheet-metal front (6), a sheet-metal bottom (5), and a lid. A crystal-controlled power-oscillator module (10) communicates by way of an RF line (121) with an intermediate module (30). The intermediate-amplifier module communicates by way of still another RF line (122) with a terminal power-amplifier module (50). The terminal power-amplifier module communicates by way of still another RF line (123) with a high-power filter (70). The filter communicates by way of still another RF line (124) with a high-power directional coupler (90). The RF power output can be intercepted at an RF plug (2).

Abstract: A flat package piezoelectric oscillator, sealed with resin, and having leads or terminals includes an IC chip mounted on one side of an island portion of a lead frame, and a piezoelectric oscillator element mounted on an opposite side of the island portion. The resin package of the oscillator has at least one hole through one of opposite surfaces of the package. An injection hole for resin injection is provided along a diagonal line extending between diametrically opposed corners of the resin package, and a cylindrical case of the piezoelectric crystal oscillator element is located such that its longitudinal axis is aligned with the diagonal line to within a range from -45.degree. to +45.degree.. The connection portions of lead terminals for the piezoelectric oscillator element and the pads of the IC chip are located adjacent to the diagonal line. The fabrication of the piezoelectric crystal oscillator is completed by sealing the above described structure with resin.

Abstract: A piezoelectric oscillator in which radiation of higher harmonic components is reduced. A piezoelectric vibrator and a semiconductor device are provided in an oscillation circuit for making the piezoelectric vibrator oscillate, as is a filter for cutting components in a predetermined frequency band or higher harmonic components of an oscillation signal outputted from the semiconductor device. The piezoelectric vibrator, the semiconductor device and the filter are packed in one package. Radiation of the higher harmonic components is reduced by placing the filter close to the oscillator, by providing a shielding or by operating portions of the oscillator output circuit with a reduced supply voltage.

Abstract: In a voltage controlled oscillator, a dielectric resonator is mounted on a base of a conductive housing, and a dielectric substrate is secured to sidewalls of the housing in a position spaced from the dielectric resonator. A first stripline is secured to one surface of the substrate and electromagnetically coupled to the dielectric resonator, and an oscillating element is electrically connected to the first stripline. A second stripline is secured to the opposite surface of the substrate and capacitively coupled to the first stripline through the substrate. The second stripline is adapted to receive a frequency control voltage from an external circuit. A voltage-controlled variable capacitance element is secured to the substrate and electrically connected to the second stripline.

Abstract: An arrangement for stabilizing the oscillation frequency and phase of a high frequency oscillator comprising a shielding case of aluminum formed by die casting and having side walls and a base, a plurality of partition walls integrally formed with the shielding case, a printed circuit board securely mounted on the partition walls, and a high frequency oscillator securely mounted on the printed circuit board. The high frequency osilllator is encompassed with and shielded by the side walls and base of the shielding case, the partition walls, and the printed circuit board.

Abstract: The structure of a shield case for covering circuitry loaded on a hybrid substrate of an oscillator and thereby isolating the circuitry from the outside. The shield case has a bottom-open box-like configuration and is made of a conductive material. The conductive material is implemented with alloy which absorbs vibrations and thereby intercepts vibrations otherwise imparted from the outside to the circuitry. The physical distance between the vibration absorbing shield case and various parts of the circuitry provided on the substrate is not changed in spite of the external vibrations, whereby the oscillation frequency of the oscillator is maintained constant.

Abstract: A microwave oscillation circuit unit to be installed on one surface of a chassis base having a circuit substrate on its other surface. The unit is provided with at least two screws, and a power supply terminal and an output terminal on its one surface confronting the chassis base when installed on the chassis base. In such a structure, a first nut is threaded on one of the screws which is positioned adjacent to the power supply terminal and the output terminal so that torque caused by tightening the first nut to such one of the screws may act upon the chassis base, the first nut being clear from the circuit substrate. Furthermore, a second nut is threaded on the other of the screws which is positioned apart from both the terminals so that torque caused by tightening the second nut to the other of the screws acts upon both the chassis base and the circuit substrate.

Abstract: A microwave oscillator which has a dielectric resonator which has properties which are dependent on the atmospheric humidity and which should be sealed in a hermetically air tight container to eliminate variations in its characteristics. The dielectric resonator is mounted in a hermetically sealed air tight cavity inside a metal housing in which the electrical circuit is mounted and is arranged at a position relative to coupling elements on a film printed circuit board which has a metallized surface on one side thereof.

Abstract: A piezo-oscillator includes a semiconductor element having at least an oscillating circuit. A piezo-vibrator having leads extending therefrom is connected to the semiconductor element by a plurality of lead terminals. The semiconductor, vibrator and lead terminals are contained within a unitary resin package.

Abstract: An electronic thermometer has an oscillator, the frequency determining element of which is a temperature sensitive piezoelectric element (2), used as a measuring sensor, which is located inside a sealed housing (3). The piezoelectric element is provided with two termial electrodes (4, 5) which are galvanically separated from the oscillator circuit bia an inductively coupled pair of coils (6, 7); the coil (6) connected to the terminal electrodes is tightly encompassed by the housing. An evaluation unit (10) for detecting the temperature is connected to the oscillator circuit.

Abstract: An ultrahigh-frequency oscillator (10) stabilized by a dielectric resonator (20) comprising a housing (11) closed by a cover (12) and having a circuit (13) including a dielectric resonator (20) fixed in the bottom (14) of the housing (11). According to the invention, a small column (30) situated in the central part (15) of the housing (11) rigidly connects the bottom (14) of the housing (11) to the cover (12), the dielectric resonator (20) being arranged outside the said central part (15).

Abstract: An electronic thermometer has an oscillator, the frequency determining element of which is a temperature sensitive piezoelectric element, used as a measuring sensor, which is located in a sealed housing of electrically insulating material. The piezoelectric element is provided with two terminal electrodes, which are each connected via a respective capacitor to the oscillator circuit, and each of the two capacitors has electrodes, one located inside and one located outside the housing.

Abstract: A conductive and mechanical energy absorbing gasket is used between an electronics package and a cover of an enclosure to provide microphonics isolation. The electronics package is secured to the cover via a gasket using isolation damping grommets and screws, so that the only substantial transmission of mechanical energy from the case to the electronic package is through the screws themselves. The conductivity of the gasket places the entire enclosure at the same potential as the metal in the electronic package and as the mounting screws, and thus helps prevent the screws from acting as RF antennas.

Abstract: A microwave oscillator (11) stabilized by a dielectric resonator (12) constituted by a housing (13) accommodating the dielectric resonator circuit and haing a fixing surface (14) and by a support (15) having an outer surface (16) on which the housing (13) is secured. The interface between the housing (13) and the support (15) has space-defining means (17,18,19) such that the housing (13) is subjected to flexural strain when fixed by its fixing surface (14) on the other surface (16) of the support (15).

Abstract: A UHF oscillator circuit includes a plurality of first leadless, or "chip", surface mounted components machine positioned on a first side of a printed circuit (PC) board and a plurality of second lead-bearing components mounted on a second side of the PC board and coupled in circuit through the PC board to the chip components in an arrangement which substantially reduces circuit fabrication costs. Comprised of a majority of automatically positioned surface mounted chip components and making use of a minimum number of lead mounted discrete components, the low Q values of the surface mounted components are compensated for by an external surface mounted feedback capacitor coupled across the collector-emitter junction of a common base transistor to provide oscillator tuning over a frequency range greater than an octave.

Abstract: Microwave dielectric resonator apparatus which, for example, may be a microwave oscillator frequency stabilized by a dielectric resonator or may be a microwave filter whose critical frequency is determined by a dielectric resonator, has the dielectric resonator environmentally protected in a hermetic chamber. As the hermetic integrity of the chamber would be destroyed by having a tuning slug therein at the end of a screw threaded into a tapped hole through a chamber wall for rotation by a screwdriver outside the chamber, the tuning slug is instead located within a non-hermetic chamber at the end of a screw threaded into a tapped hole through a wall of the non-hermetic chamber serving also as an outer wall of a housing enclosing both chambers. The chambers have an interface which is transparent to microwave fields and proximate the dielectric resonator and tuning slug.

Abstract: A portable low-output-level generator producing simultaneous audio, ultrasonic and RF noise for the test and demonstration of instruments designed to locate electrical interference, for demonstration of the broad frequency spectrum of electrical noise radiation, for antenna tests, to test the EMI susceptibility of electronic equipment, and to illustrate the effects of said noise on TV and radio receivers. This generator is enclosed in a housing and communicates audio and ultrasonic sounds to the observer via a vibrating diaphragm mounted on the face of the housing, with means provided to attenuate the audio sounds relative to the ultrasonic, and this generator radiates RF from a retractable antenna mounted on and extending outward from the housing.

Abstract: The invention relates to an ultra-high frequency oscillator operating in the X band. The oscillator circuit comprises a common gate-connected field effect transistor. The source connected tuning circuit comprises a variable capacitor of the varactor type controlled by a voltage and a choke in parallel. The control voltage is decoupled from earth by a capacitor. According to the invention, the transistor, the varactor and the capacitor are integrated into the same box or case in the form of a micromodule. The capacitor acts as a base for the transistor and the varactor, which are welded in juxtaposed manner. The length of the connection between the varactor and the source of the transistor has a minimum value, which makes it possible to broaden the linear frequency band as a function of the control voltage.