Abstract: A high power thin film filter is disclosed includes a substrate having a substrate thickness in a Z-direction between a first surface and a second surface. A thin film capacitor may be formed over the first surface. A thin film inductor may be spaced apart from the thin film capacitor by at least the thickness of the substrate. A via may be formed in the substrate that electrically connects the thin film capacitor and the thin film inductor. The via may include a polymeric composition.

Abstract: An active filter and an analog-to-digital converter (ADC) configured to suppress out-of-band peaking. An active filter may include an active device configured to provide a power gain to an input signal, a feedback network configured to connect an output of the active device to an input of the active device, and an input impedance network configured to couple the input signal to the input of the active device. A combination of the feedback network and the input impedance network is configured to provide frequency response properties of the active filter such that a frequency domain signal transfer function of the active filter has a constant in numerator.

Abstract: An LC composite component includes a multilayer body including insulating base members that are laminated and include insulating base members on which conductor patterns are provided. Capacitor conductor patterns are provided on insulating base members different from an insulating base member on which a coil conductor pattern is provided, and each include an extending portion overlapping with a line segment connecting a center of a first terminal and a center of a second terminal in a shortest distance as viewed in the lamination direction and projecting portions projecting in directions different from the direction of the line segment, and the projecting portions overlap with linear portions of the coil conductor pattern without overlapping with bent portions thereof as viewed in the lamination direction.

Abstract: A chip resistor includes a resistor body, a first upper surface electrode, a second upper surface electrode, and an upper surface protection film on an upper surface of a substrate. The upper surface protection film covers the entire surface of the resistor body and the entire surface of the first upper surface electrode and the second upper surface electrode. The upper surface protection film includes a peripheral portion that is entirely in contact with the upper surface of the substrate.

Abstract: One or more systems, devices and/or methods of use provided herein relate to a baseband filter that can be used in a current-mode end-to-end signal path. The current-mode end-to-end signal path can include a digital to analog converter (DAC) operating in current-mode and an upconverting mixer, operating in current-mode and operatively coupled to the DAC. In one or more embodiments, a device used in the signal path can comprise a baseband filter that receives an input current and outputs an output current. The baseband filter can comprise a feedback loop component having an active circuit branch and a passive circuit branch coupled in a loop. A mirroring device can be coupled to the feedback loop component and can provide an output of the device. Selectively activating the mirroring device can vary gain, such as of the mirroring device.

Abstract: Transmitters having increased efficiency, such as may be useful in millimeter-wave devices. A semiconductor device, comprising a transmitter, comprising a modulator configured to receive a differential input signal having a first frequency and provide a differential modulated signal having the first frequency and a first clock phase; a series comprising one or more frequency multipliers, wherein the series of frequency multipliers is configured to receive the differential modulated signal and provide a differential second signal having a second frequency greater than the first frequency and having a second clock phase; and an output transformer configured to receive the differential second signal and transform the differential second signal to a single-ended output signal. Methods of using such transmitters. Systems for manufacturing devices comprising such transmitters.

Abstract: A negative differential resistance device includes a dielectric layer having a first surface and a second surface opposing the first surface, a first semiconductor layer that includes a first degenerated layer that is on the first surface of the dielectric layer and has a first polarity, a second semiconductor layer that includes a second degenerated layer that has a region that overlaps the first semiconductor layer and has a second polarity, a first electrode electrically connected to the first semiconductor layer, a second electrode electrically connected to the second semiconductor layer, and a third electrode on the second surface of the dielectric layer and which has a region overlapping at least one of the first semiconductor layer or the second semiconductor layer.

Abstract: In various embodiments, a bonded structure is disclosed. The bonded structure can include an element and a passive electronic component having a first surface bonded to the element and a second surface opposite the first surface. The passive electronic component can comprise a first anode terminal bonded to a corresponding second anode terminal of the element and a first cathode terminal bonded to a corresponding second cathode terminal of the element. The first anode terminal and the first cathode terminal can be disposed on the first surface of the passive electronic component.

Abstract: A common-mode voltage cancellation (CMVC) circuit, is disclosed. The circuit includes a set of input lines arranged to receive a respective phase voltage, and a set of output lines arranged to provide a respective output phase voltage. The circuit further includes a set of coupled inductors, each having a respective primary winding and secondary winding coupled in signal communication at a respective upstream end to a respective input line to receive a respective phase voltage therefrom, each respective phase voltage having a common-mode voltage component. Each primary winding being coupled at a respective downstream end to ground, and each secondary winding being coupled in series between the respective input line and a respective output line. The circuit includes a set of capacitors, each capacitor being electrically coupled to a respective input line and in series with a respective primary winding of the set of coupled inductors.

Abstract: A filtered feedthrough assembly includes a ferrule configured to be installed in an AIMD housing. An insulator is disposed within a ferrule opening. A conductive pathway is disposed within a passageway through the insulator. A filter capacitor is disposed on a device side having active and ground electrode plates disposed within a capacitor dielectric k greater than 0 and less than 1,000. A capacitor active metallization is electrically connected to the active electrode plates. A ground capacitor metallization is electrically connected to the ground electrode plates. The filter capacitor is the first filter capacitor electrically connected to the conductive pathway coming from a body fluid side into the device side. An active electrical connection electrically connects the conductive pathway to the capacitor active metallization. A ground electrical connection electrically connects the ground capacitor metallization to the ferrule. The filter capacitor is a flat-through or an X2Y attenuator filter capacitor.

Abstract: A shunt-resistance type current detector includes a flat-plate shaped shunt resistor joined between a flat-plate shaped first bus bar and a flat-plate shaped second bus bar. Each of the bus bars includes respective detection conductors connected to a current detector. The shunt resistor and each of the bus bars are joined via weld parts. A gap for mounting the shunt resistor is formed between the first bus bar and the second bus bar, and projected parts are formed each being projected toward the gap from opposing faces opposing to each other in the gap. The shunt resistor comes an contact with each of the projected parts in a top-and-bottom direction.

Abstract: A bass enhancement may be applied to improve the perception of low-frequency sounds by a user of an electronic device. A distortion function may be applied to the audio signal that results in creation of higher frequency content related to the low-frequency sounds. This higher frequency content may be interpreted by a listener's ear in a similar manner as the low-frequency sounds. The distortion function may be a Sigmoid function. Bass enhancements may also include scaling of the audio signal prior to distortion, adaptation of the distortion, or gap band filtering prior to the distortion.

Abstract: Polyphase filters (PPFs) can be used to generate quadrature or other phase-shifted representations of an input signal provided to the PPF. In one approach, a “passive” polyphase filter can include a combination of resistive and capacitive elements. Such a topology can be referred to as an RC-PPF topology. Another passive circuit topology can be used to provide a PPF, by replacing the resistive elements with inductive elements, and by replacing the capacitive elements with resistive elements. A filter circuit can include cascaded RC-PPF and LR-PPF sections, such as in an alternating manner (e.g., an “RC-LR” topology). In this approach, a total insertion loss of cascaded LR-PPF and RC-PPF sections can be reduced as compared to using LR-PPF or RC-PPF sections, alone.

Abstract: An integrated circuit (IC) device includes a first resistive strip having an input terminal and an output terminal. The IC device further includes a second resistive strip having a terminal coupled to a voltage. The second resistive strip may be coplanar with the first resistive strip. The IC device further includes a capacitor formed by the first resistive strip and the second resistive strip.

Abstract: A coil component capable of reducing leakage magnetic flux includes a body, a coil portion embedded therein, a shielding layer formed on a surface of the body, and a ground electrode electrically connected to the shielding layer on the surface of the body and grounding the shielding layer.

Abstract: A multilayer ceramic capacitor includes a substantially cuboid laminated body including ceramic layers and internal electrode layers laminated, and two or more exposed regions where the plurality of internal electrode layers are exposed, and external electrodes, wherein at least one of the external electrodes is an external electrode with resistance, the internal electrode layers include a first internal electrode layer and a second internal electrode layer opposed to the first internal electrode layer in the lamination direction, and the external electrode with resistance includes a thin film electrode layer in direct contact with the internal electrode layer in the exposed region, a resistive electrode layer provided on the thin film electrode layer, and an upper electrode layer provided on the resistive electrode layer, which has a lower electrical resistivity lower than the resistive electrode layer.

Abstract: An operation method of an uninterruptible power supply control device is described below. The uninterruptible power supply control device is electrically coupled to a voltage output terminal of a portable power device and a ground terminal of the portable power device. At least one electrical power conversion device has one end electrically coupled to the voltage output terminal and the other end electrically coupled to the ground terminal. If the portable power device's current is less than a threshold current of the portable power device and maintained for a first duration which is less than a threshold duration of the portable power device, an enabling current greater or equal to the threshold current is generated between the voltage output terminal and the ground terminal and as part of the current.

Abstract: A printed circuit board includes additional stitching vias placed at strategic location within a connection matrix, which provides additional isolation and further accommodates high-speed communication capabilities. The stitching vias have a variable length or depth, depending on related structures within the circuit board, so as to avoid any interference with underlining escape routing, or alternative signal transmission structures. More specifically, these stitching vias help to eliminate cross-talk in the via field caused by the close proximity of signal carrying structures. Further, differential signal communication is better accommodated based upon this reduction in cross-talk.

Abstract: A radio frequency (RF) multiplexer with isolation enhancement includes, for example, circuit networks that may be added to a set of RF filters to enhance the isolation among the ports. In one embodiment, the enhancement network may include RF filters and equalization networks. The RF multiplexer with isolation enhancement may be passive, tunable, or reconfigurable.

Abstract: A PIM probe that includes a PIM antenna carried on a wand sized for positioning by hand. The PIM antenna is tuned by loop size to receive PIM corresponding to uplink reception channels of a site antenna generated by downlink broadcast frequencies F1 and F2 of the duplex antenna. The PIM antenna vanes may include conductors printed on a PC boards or wire loops. A PIM probe system includes a signal analyzer that displays a representation of PIM received by the PIM antenna. The PIM probe system further includes an RF filter for passing the PIM frequencies of interest and suppressing the test frequencies transmitted by the site antenna, such as a cellular base station antenna. When the site antenna is broadcasting the test frequencies, the technician places the PIM antenna in various locations to detect the presence of PIM in those locations.

Abstract: A radio transceiver circuit for FDD communication is disclosed. It comprises a transmitter for FDD signal transmission in a first frequency band, a first receiver for FDD signal reception in a second frequency band, separate from the first frequency band, and a duplexer. An output port of the transmitter is operatively connected to a first port of the duplexer for transmitting, through the duplexer, signals in said first frequency band. An input port of the first receiver is operatively connected to a second port of the duplexer for receiving, through the duplexer, signals in said second frequency band. The radio transceiver circuit comprises a second receiver, separate from the first receiver, for reception in said first frequency band. An input port of the second receiver is operatively connected to said first port of the duplexer for receiving, through the duplexer, signals in said first frequency band. A related radio communication apparatus is also disclosed.

Abstract: A spectroscopic measurement apparatus includes a wavelength variable interference filter and a driving circuit. The wavelength variable interference filter includes a fixed reflection film, a movable reflection film that faces the fixed reflection film, and an electrostatic actuator that changes a distance between the fixed reflection film and the movable reflection film. The driving circuit drives the electrostatic actuator in such a way that the distance between the fixed reflection film and the movable reflection film changes at a uniform velocity.

Abstract: An apparatus includes a self-coupled transformer, a first band stop filter and a tank circuit connected in series with the first band stop filter between first and second windings of the self-coupled transformer. An inductor of the tank circuit acts as an out-of-phase third winding of the self-coupled transformer.

Abstract: A first substrate includes a substrate main body including a first principal surface and a second principal surface opposing each other in a first direction, first and second connection electrodes disposed on the first principal surface, and third and fourth connection electrodes disposed on the second principal surface. A first metal terminal includes a first connection portion electrically connected with the first connection electrode, and a first leg portion extending from the first connection portion. A second metal terminal includes a second connection portion electrically connected with the fourth connection electrode, and a second leg portion extending from the second connection portion. A multilayer capacitor is disposed on the first principal surface side of the first substrate, and an overcurrent protection device is disposed on the second principal surface side of the first substrate. The second connection electrode and the third connection electrode are electrically connected to each other.

Abstract: A semiconductor device includes a substrate and at least one inductor on the substrate. The inductor includes top portions separated from one another, bottom portions separated from one another, and side portions separated from one other. Each side portion extends between one of the top portions and one of the bottom portions. A semiconductor device includes a substrate, a first patterned conductive layer on the substrate, a second patterned conductive layer, and at least one dielectric layer between the first patterned conductive layer and the second patterned conductive layer. The first patterned conductive layer defines bottom crossbars separated from each other, each bottom crossbar including a bend angle. The second patterned conductive layer defines top crossbars separated from each other, wherein each top crossbar is electrically connected to a bottom crossbar.

Abstract: A multilayer electronic component includes an element body having an internal electrode layer and a dielectric layer. These are substantially parallel to a plane including a first axis and a second axis and are alternately laminated along a third axis direction. Side surfaces facing each other in the first axis direction are respectively equipped with an insulating layer. End surfaces facing each other in the second axis direction are respectively equipped with an external electrode. An elastic modulus of the insulating layer is 12 GPa to 140 GPa.

Abstract: Systems and method related to switchable output stages in power amplifiers. In some embodiments, a power amplifier (PA) circuit can include a driver stage configured to amplify a radio-frequency (RF) signal. The PA circuit can further include a plurality of output stages, with each output stage being configured to be capable of further amplification the RF signal. The PA circuit can further include a switch implemented to route the amplified RF signal from the driver stage to a selected one of the plurality of output stages, such that the selected output stage further amplifies the amplified RF signal.

Abstract: A first metal terminal includes a first connection portion connected to an electrode portion of a second external electrode, and a first leg portion extending from the first connection portion. A second metal terminal includes a second connection portion connected to a conductor portion of a connection conductor, and a second leg portion extending from the second connection portion. A multilayer capacitor and an overcurrent protection device are disposed in such a manner that a side surface on which an electrode portion of a first external electrode is disposed and a side surface of a second element body oppose each other. The electrode portion of the first external electrode and a fourth external electrode are connected to each other, and the connection conductor and a third external electrode are connected to each other.

Abstract: A high frequency termination device includes a printed circuit board. A ground pad having a first predetermined inductive reactance at a resonant frequency can be mounted on the printed circuit board. A resistor landing pad having a second predetermined inductive reactance at the resonant frequency can be mounted on the printed circuit board. The resistor landing pad can be selectively positioned adjacent to the ground pad to create a desired capacitive reactance at the resonant frequency to cancel at least part of the first predetermined inductive reactance and the second predetermined inductive reactance. A terminating resistor can be coupled with the resistor landing pad. An impedance of the termination device is dominated by a resistance value of the terminating resistor at the resonant frequency due to cancellation of at least part of the first predetermined inductive reactance and the second predetermined inductive reactance at the resonant frequency.

Abstract: A ceramic electronic component wherein outer electrode is placed over both end portions of a ceramic body. A first coating mainly containing Ni and a second coating containing Sn, solder, or the like are placed on a surface of the outer electrode. The outer electrode includes an end-surface portion and a side-surface turnover portion. The outer electrode includes a glass layer which is placed in a region within at least 5 ?m in linear distance L from a covering end portion of the side-surface turnover portion in a direction toward the end-surface portion so as to be in contact with the ceramic body and which contains, at least, Si. The average thickness t of the glass layer is 3 ?m to 10 ?m. The content of a Si component is 11% by weight or more (preferably 40% by weight or less).

Abstract: One end of a bus bar for leading an output voltage output from a switching power supply to the outside is a connection terminal connected to an output end associated with the switching power supply, while the other end is an output terminal VO. A ferrite core has a through-hole through which the bus bar is disposed. Electromagnetic coupling from the switching power supply is suppressed between the output terminal VO of the bus bar and at least a part of the ferrite core on the output terminal VO side along the bus bar. In this way, electromagnetic coupling of a part of a choke coil including the ferrite core with the bus bar penetrating therethrough on the output terminal VO side and the switching power supply is suppressed, whereby propagation of noise to the output terminal VO is suppressed.

Abstract: A multilayer ceramic capacitor includes: a ceramic body; first and second internal electrodes disposed so as to be alternately exposed to both end surfaces of the ceramic body with each of dielectric layers; first and second external electrodes formed so as to be extended onto portions of one main surface of the ceramic body, respectively; third and fourth external electrodes formed on both side surfaces of the ceramic body, respectively, so as to be extended onto portions of both main surfaces of the ceramic body, respectively; an intermitting part connecting the third and fourth external electrodes to one another; first and second land patterns formed so as to be connected to the first and third external electrodes, respectively; and a third land pattern formed so as to be connected to both of the second and fourth external electrodes.

Abstract: A flexible electronic device is disclosed, including: a case frame, comprising a plurality of unit case frames space at regular intervals, engaged to move relative to one another, a substrate, disposed in an inner space defined by an interior of the case frame, and electrically coupling a plurality of unit substrates that are spaced at regular intervals using a flexible electrical coupler, a battery pack, disposed in the inner space, including a plurality of unit battery cells at regular intervals using a flexible electrical connection means, the unit battery cells configured to move relative to one another, and a flexible display, coupled to the case frame and positioned so that a display surface of the flexible display is exposed.

Abstract: A reader is provided, including a power amplifier (PA), a low-noise amplifier (LNA), a circulator, an auto-tuning matching network, and a control circuit. The PA emits a first RF transmission signal. The LNA transmits a first RF induced signal corresponding to the first RF transmission signal. The circulator is coupled between the PA and LNA, transmits the first RF transmission signal to an RF connection terminal or receives the first RF induced signal from the RF connection terminal. The auto-tuning matching network is coupled to the circulator, matches impedances between the circulator and the RF connection terminal. The control circuit is coupled to the auto-tuning matching network, adjusts the auto-tuning matching network to match impedances between the circulator and the RF connection terminal.

Abstract: A circuit device includes a semiconductor substrate, a first inductor provided over the semiconductor substrate, and a second inductor provided over the semiconductor substrate and coupled to the first inductor. The first inductor and second inductor are wound in a same direction with each other from respective inner end portions to respective outer end portions thereof.

Abstract: There is provided a multilayer ceramic capacitor in which an increase in conductor resistance at an end of an internal electrode layer is suppressed, and in which a gap between the internal electrode layer and a dielectric layer is reduced. A multilayer ceramic capacitor includes a stacked body including dielectric layers and internal electrode layers alternately laminated; and an external electrode disposed on an end surface of the stacked body and connected to the internal electrode layers, the internal electrode layers each including a connection electrode portion connected to the external electrode, and an internal electrode portion which is connected to the connection electrode portion and extends toward an inner side of the stacked body, a ratio of a material having a melting point higher than that of a conductive material being higher in the connection electrode portion than in the internal electrode portion.

Abstract: A two-stage, passive, RC polyphase filter for mm-wave quadrature LO generation is presented. The filter features an innovative, symmetrical layout structure, which is more robust to parasitics than the conventional layout. Layout parasitics which become important at mm-wave frequencies are identified and a compensated. Impedance variations and transfer functions are evaluated considering these dominant parasitics. More than 15 dB improvement in image rejection ratio is achieved in comparison with conventional layouts. Using the inventive techniques more than 35 dB of image rejection ratio over a bandwidth of 6 GHz is demonstrated in an outphasing transmitter at 60 GHz in 40 nm CMOS.

Abstract: A quadrature signal generator comprises a resistor-capacitor, RC, polyphase filter and an inductor compensation arrangement. The inductor compensation arrangement comprises a first inductor connected between the first and the third output terminals, and a second inductor connected between the second and fourth output terminals. The first and second inductors are arranged to compensate for a capacitive load on the output terminals when in use. A beamforming arrangement, a communication device and a base station are also disclosed.

Abstract: A wiring board with a built-in electronic component includes a core substrate having a cavity, an electronic component accommodated in the cavity of the core substrate and having a body portion and multiple conductive portions formed on a surface of the body portion, a filling resin filling the space formed in the cavity having the component positioned in the cavity, and an resin insulation layer formed on the core substrate such that the resin insulation layer is covering an opening of the cavity and a surface of the component. The core substrate has an inclination suppressing structure formed on one or more side walls forming the cavity such that the distance between the side wall forming the cavity and the component varies in a portion of the side wall having the inclination suppressing structure and a portion of the side wall other than the portion having the inclination suppressing structure.

Abstract: A de-noise circuit and a de-noise method for differential signals and a chip for receiving differential signals are provided. The de-noise circuit includes a filter and a register. Both the filter and the register are disposed in the chip. The chip receives a differential signal through a first input terminal and a second input terminal. The filter is coupled between the first input terminal and the second input terminal of the chip. The filter filters out noises in the differential signal. The filter includes at least one filter unit. Each filter unit has at least one resistance value or at least one capacitance value. The register is coupled to the filter. The register receives and stores a control value. The register controls the resistance value or the capacitance value of at least one of the filter units based on the control value.

Abstract: A nested multi-stage polyphase filter can comprise: a first filter stage and a second filter stage. The first filter stage can be connected to the second filter stage via first through fourth intermediate connections. The first filter stage and the second filter stage can be laid out in a nested-ring layout. The first through fourth intermediate connections can be laid out so as to not cross over each other.

Abstract: A ground loop isolator for a coaxial cable, for example that blocks DC current but which allows a desired band of RF through the ground loop isolator, and which is small enough to fit in the areas where coupling of the desired electronic equipment is to occur. Embodiments may include an outer area allowing for easier manual coupling of the coaxial cable connector nut to electronic devices.

Abstract: A device is disclosed to reduce noise and temperature during measurements in cryostats comprising, the device comprising any of, or a combination of, the following PC boards, each conditioning a different frequency range: a RC-PC board having a two-stage RC filter in series with a surface-mounted pi-filter; a RF-PC board having a plurality of surface-mounted pi-filters in series, each configured with different low-frequency cutoff frequencies; and a Sapphire-PC board having a sapphire substrate having high heat conductivity at low temperature with thin metal films routed in a meandering fashion.

Abstract: A cable emulator configured to emulate the electrical transfer function and properties of a length of conductive cable is disclosed for use in transmitter, receiver and transceiver operation without need for long and expensive length of actual cable. The cable emulator includes an input port for connection to a signal source, such as a transmitter and an output port for connection to a receiver or other signal analyzer. The input port connects to an input impedance matching element, which in turn connects to one or more filter stages. The output of the one or more filter stages connects to an output impedance matching element, which then connects to the output port. The one or more filter stage comprises one or more resistors, one or more inductors and one or more capacitors.

Abstract: A multiple conductor radio-frequency transmission line including a plurality of conductive traces, an input port, and at least one output port is disclosed. The input port includes a radio-frequency signal input line which is generally aligned with and disposed in a partially or completely overlapping relationship with the plurality of conductive traces at the input port, with the radio-frequency signal input line being at least as wide as the plurality of conductive traces at the input port. The output port includes a radio-frequency signal output line which is generally aligned with and disposed in a partially or completely overlapping relationship with at least one of the plurality of conductive traces at the at least one output port, with the radio-frequency signal output line being at least as wide as the at least one of the plurality of conductive traces at the output port.

Abstract: Signal-processing devices having memristors are described for performing frequency-discrimination functions, amplitude-discrimination functions, and time-oriented functions. In each case, the time-domain behavior of the memristors described herein enables these functions to be performed. In one embodiment, memristance of an arrangement of memristors of a device is, after an initial transitional period, predominantly at a first level if frequency of an input signal of the device is less than a first frequency and predominantly at a second level if the frequency of the input signal is greater than a second frequency.

Abstract: This invention provides a digital electronic device comprising: a grounded metal portion comprising a first metal plate electrically connected to ground and a first substrate disposed on the first metal plate; at least one layer of differential-mode reference metal portion comprising a second substrate and a second metal plate electrically connected to the first metal plate by at least one conductive structure; a pair of differential signal lines at least partially disposed on the second substrate of the at least one layer of differential-mode reference metal portion and electromagnetically coupled to the second metal plate of the at least one layer of differential-mode reference metal portion; and an equalizer electrically connected to the pair of differential signal lines.

Abstract: A poly-phase filter receives inphase input signals I and ? and quadrature input signals Q and Q, and provides inphase output signals Ilow and Iout and quadrature output signals Qout and Qout. The capacitance of each variable capacitor connected to the terminals providing inphase output signals Iout and Iout is and the capacitance of each variable capacitor connected to the terminals providing quadrature output signals Qout and Qout, are different in value, and preferably by twice a predetermined value. This is because adjustment to the capacitance values may be made to each set of variable capacitors by the predetermined value.

Abstract: Systems and methods for an electric choke are provided. The choke may be provided as part of a power transmission arrangement that includes a cable for electrically coupling a power source and a powered device having a ground node and a wire separate from the cable providing a path for a common-mode current through the ground node. The power transmission arrangement also includes an unbalanced choke coupled between the power source and the powered device, wherein a number of turns of the cable in the choke is different than a number of turns of the wire in the choke.

Abstract: A delta-sigma A/D converter includes a loop filter including a resonant filter, a quantizer, and a feedback D/A converter. The resonant filter includes a resonator including a resistor and a capacitor, and a feedback path through which an output of the resonator is positively fed back to an input of the resonator. The resonant filter operates as an oscillator or a filter under the on/off control of a first switch. At least one of the resistor and the capacitor of the resonator is configured to allow a resistance value or a capacitance value thereof to be adjusted based on a third external signal.