Resonant, Discrete Frequency Selective Type Patents (Class 333/175)
  • Patent number: 12040780
    Abstract: Provided are a band-stop filter and a multi-frequency band-stop filter. The band-stop filter includes at least one band-stop filtering unit; the at least one band-stop filtering unit includes an input port, an output port, at least two resonators, and at least one inductive element; and the first terminal of the first resonator is connected between the input port and the inductive element, and the first terminal of the second resonator is connected between the output port and the inductive element.
    Type: Grant
    Filed: August 20, 2021
    Date of Patent: July 16, 2024
    Assignee: ANHUI ANUKI TECHNOLOGIES CO., LTD.
    Inventors: Qilin Shi, Chengjie Zuo, Jun He
  • Patent number: 12040768
    Abstract: A circuit device includes a substrate, and a wiring pattern and a coil component on the substrate. The wiring pattern includes a first land electrode connected to a first electrode of the coil component and a second land electrode connected to a second electrode of the coil component. The wiring pattern includes a wiring line electrically connected to the land electrode at a position shifted along a first side surface from a center of the first side surface by a shifting value and a wiring line electrically connected to the land electrode at a position shifted along a second side surface from a center of the second side surface by a shifting value.
    Type: Grant
    Filed: April 7, 2022
    Date of Patent: July 16, 2024
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Atsushi Toujo
  • Patent number: 12034426
    Abstract: A multilayer filter includes first and second ground electrodes and first and second LC resonators. The first LC resonator includes a first line electrode, a first capacitor electrode, a first via conductor, and a second via conductor. The second via conductor extends from the first line electrode to a first capacitor electrode side and connects the first line electrode and the first ground electrode. The second LC resonator includes a second line electrode, a second capacitor electrode, a third via conductor, and a fourth via conductor. The fourth via conductor extends from the second line electrode to a second capacitor electrode side and connects the second line electrode and the second ground electrode.
    Type: Grant
    Filed: April 8, 2022
    Date of Patent: July 9, 2024
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Keisuke Ogawa
  • Patent number: 12020845
    Abstract: An inductor component includes a main body, a first inductor wiring located inside the main body and extending on a virtual plane, and a second inductor wiring located inside the main body and extending in parallel to the virtual plane. The inductor component includes a third inductor wiring located between the first inductor wiring and the second inductor wiring inside the main body and extending in parallel to the virtual plane. The inductor component includes vertical wirings passing through the inside of the main body from each of the first to third inductor wirings to a surface of the main body in a direction perpendicular to the virtual plane. The third inductor wiring is a low-resistance inductor wiring having a DC electrical resistance smaller than those of the first inductor wiring and the second inductor wiring.
    Type: Grant
    Filed: September 29, 2020
    Date of Patent: June 25, 2024
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Kouji Yamauchi, Yoshimasa Yoshioka, Keisuke Kunimori
  • Patent number: 12014870
    Abstract: Air-core reactors for use with power transmission systems are disclosed. An example air-core reactor may include a main coil and an auxiliary coil. The main coil may include a first solenoid having a first diameter and a second solenoid having a second diameter, wherein the first diameter and the second diameter are different. The auxiliary coil may include a third solenoid. The first solenoid and the second solenoid may be arranged concentrically. The auxiliary coil may also be magnetically coupled to the main coil, and the auxiliary coil may be arranged concentric to the main coil.
    Type: Grant
    Filed: April 13, 2022
    Date of Patent: June 18, 2024
    Assignee: GE Infrastructure Technology LLC
    Inventors: Amit Kumar, Henrique Borges Zaninelli, Luiz Souza
  • Patent number: 12009603
    Abstract: A bias tee circuit comprises: a combining path having first and second ends and configured to transmit a combined signal which comprises a combination of an RF signal and a DC signal; an RF path having first and second ends and configured to transmit the RF signal included in the combined signal; a DC path having first and second ends and configured to transmit the DC signal included in the combined signal; and an impedance transformer connected between the first end of the combining path, the first end of the RF path and the first end of the DC path, and configured to make the reflection coefficient of the transmitted RF signal have at least two resonant modes within an operating RF band.
    Type: Grant
    Filed: March 26, 2020
    Date of Patent: June 11, 2024
    Assignee: CommScope Technologies LLC
    Inventors: Lei Yang, Hangsheng Wen
  • Patent number: 12009796
    Abstract: A high-order filter with a capacitive inner tapping technique is disclosed. The filter includes an inductor and a first resonant circuit including a first portion of the inductor and a first capacitor. The first resonant circuit is configured to attenuate first frequency components of an input signal above a cutoff frequency to generate a filtered signal. The filter further includes a second resonant circuit coupled in parallel with the first resonant circuit and including the first portion of the inductor and a second capacitor. The second resonant circuit is configured to attenuate the first frequency components of the input signal to generate the filtered signal. A third resonant circuit includes a second portion of the inductor and a third capacitor, wherein the third resonant circuit is configured to attenuate second frequency components of the filtered signal above the cutoff frequency to generate an output signal.
    Type: Grant
    Filed: September 5, 2023
    Date of Patent: June 11, 2024
    Assignee: Apple Inc.
    Inventor: Ahmed F. Aref Mahmoud
  • Patent number: 11991871
    Abstract: An impedance matching film 10 includes a mixture containing indium oxide and tin oxide and being a main component of the impedance matching film, the mixture having an amorphous structure. The impedance matching film 10 for impedance matching has a Hall mobility of 5 cm2/(V·s) or more. The impedance matching film 10 has a thickness of 16 nm or more and less than 100 nm.
    Type: Grant
    Filed: December 11, 2019
    Date of Patent: May 21, 2024
    Assignee: NITTO DENKO CORPORATION
    Inventors: Hironobu Machinaga, Motoki Haishi, Yosuke Nakanishi, Yuuki Takeda
  • Patent number: 11973483
    Abstract: Aspects of the disclosure include a filter comprising a first interleaved input, a second interleaved input, an output, a first transformer comprising a first primary winding with N1 turns and a first secondary winding with N2 turns, and a second transformer comprising a second primary winding with N3 turns and a second secondary winding with N4 turns, wherein the first primary winding and the second secondary winding are in series with the first interleaved input and the output, and the first secondary winding and the second primary winding are in series with the second interleaved input and the output.
    Type: Grant
    Filed: May 6, 2022
    Date of Patent: April 30, 2024
    Assignee: SCHNEIDER ELECTRIC IT CORPORATION
    Inventor: Henning Roar Nielsen
  • Patent number: 11962289
    Abstract: A filter includes first and second signal terminals, a filter circuit connected between the first and second signal terminals, a substrate having first and second surfaces, the first and second signal terminals being located on the first surface, a part of the filter circuit being located at a side of the second surface, a line located closer to the first surface than the filter circuit in the substrate, a first end of the line being connected to one of the first and second signal terminals, and a ground terminal that is located on the first surface and to which a second end of the line is connected, an area of a region where the line overlaps with the ground terminal being greater than an area of a region where the line overlaps with the one of the first and second signal terminals when the substrate is viewed in plan view.
    Type: Grant
    Filed: February 10, 2021
    Date of Patent: April 16, 2024
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Makoto Inoue, Hideyuki Sekine
  • Patent number: 11949396
    Abstract: An electronic component includes a stack and first to third inductors. Area of a region obtained by perpendicularly projecting a first space including a first axis and surrounded by the first inductor onto an XZ plane is larger than area of a region obtained by perpendicularly projecting a second space including a second axis and surrounded by the second inductor onto a YZ plane. The third inductor is disposed such that a third axis does not intersect the first space but intersects the second space.
    Type: Grant
    Filed: September 8, 2022
    Date of Patent: April 2, 2024
    Assignee: TDK CORPORATION
    Inventor: Takuya Sato
  • Patent number: 11942914
    Abstract: The present invention provides a noise filter that can provide a wire linking a power source and a load along a desired path regardless of an installation location of the noise filter. A noise filter is connected to a wire of a wire harness linking a power source and a load and eliminates noise transmitted from the power source to the load. The noise filter includes a housing, a capacitor that is housed inside the housing, a ground terminal that is connected to the capacitor, and a noise filter wire that has a first end connected directly to the capacitor and a second end connected by splicing to a middle portion of the wire of the wire harness.
    Type: Grant
    Filed: August 7, 2019
    Date of Patent: March 26, 2024
    Assignee: SUMITOMO WIRING SYSTEMS, LTD.
    Inventor: Takao Fukuda
  • Patent number: 11929536
    Abstract: A filter cable, which solves the problem that devices which can better cope with various problems in complex electromagnetic environment and have simple and reasonable structural design are lacking in the related art. The filter cable comprises a core wire; the core wire comprises an insulating substrate and a first conductor layer surrounding the insulating substrate; the first conductor layer has a first etching pattern; the first etching pattern is distributed along the axial direction of the filter cable; and the first etching pattern is used to make the filter cable equivalent to a first filter circuit to realize the filtering function.
    Type: Grant
    Filed: April 13, 2020
    Date of Patent: March 12, 2024
    Inventor: Yunan Han
  • Patent number: 11909367
    Abstract: The present disclosure relates to a broadband filter for confining or attenuating electromagnetic interference noise from one or more electrical signal sources, In an embodiment, the broadband filter comprises one or more filter stages electrically coupled by galvanic or by electromagnetic means to the one or more electrical signal sources for confining or attenuating conducted electromagnetic interference noise; one or more conductive shields electrically coupled by galvanic or by electromagnetic means to the electrical signal sources wherein the shields encapsulate the filter stages for confining or attenuating conducted and/or radiated electromagnetic interference noise; and one or more conductive partition layers to encapsulate the one or more filter stages such that the partition layers electromagnetically couple adjacent filter stages for a selected frequency range of the electromagnetic interference noise. The thickness of the conductive partition layers is chosen to control the degree of coupling.
    Type: Grant
    Filed: May 4, 2020
    Date of Patent: February 20, 2024
    Assignees: The Thinking Pod Innovations Ltd, The University of Nottingham
    Inventors: Zhe Zhang, Jordi Espina, Mark Johnson
  • Patent number: 11881832
    Abstract: A filter includes an input terminal, an output terminal, a first ground terminal, a second ground terminal, a first inductor having a first end coupled to a first node in a path between the input terminal and the output terminal and a second end coupled to a second node, a second inductor having a first end coupled to the second node and a second end coupled to the first ground terminal, and a third inductor having a first end coupled to the second node and a second end coupled to the second ground terminal.
    Type: Grant
    Filed: June 23, 2022
    Date of Patent: January 23, 2024
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Makoto Inoue, Jaeho Jeong, Hideyuki Sekine, Naoto Kobayashi
  • Patent number: 11881833
    Abstract: An integrated passive die includes a substrate, an input node, an output node, and RF filtering circuitry. The RF filtering circuitry includes a number of LC tank circuits coupled between the input node and the output node. Each one of the LC tank circuits include an inductor and a capacitor. The inductor is formed by a metal trace over the substrate. The capacitor is coupled in parallel with the inductor over the substrate. The inductor and the capacitor are provided such that a resonance frequency of the combination of the inductor and the capacitor is less than a self-resonance frequency of the inductor.
    Type: Grant
    Filed: October 18, 2022
    Date of Patent: January 23, 2024
    Assignee: Qorvo US, Inc.
    Inventor: Peter V. Wright
  • Patent number: 11881842
    Abstract: A composite filter device includes a connection portion connected to a common terminal, a first filter between the connection portion and a first terminal, a second filter between the connection portion and a second terminal, a first inductor that is connected in series between the second filter and the connection portion, includes a first wiring electrode wound in a predetermined direction, and is provided at an internal layer of a multilayer board, and a second inductor that is connected in series between the common terminal and the connection portion, includes a second wiring electrode wound in the predetermined direction, and is provided at an internal layer of the multilayer board. The first and second wiring electrodes at least partially overlap when the multilayer board is viewed in plan.
    Type: Grant
    Filed: December 18, 2020
    Date of Patent: January 23, 2024
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Tomoya Sato
  • Patent number: 11863150
    Abstract: An electronic component includes a stack and first to fourth inductors. The second inductor is disposed after the first inductor in a ?Y direction. The third inductor and the fourth inductor are disposed after the first inductor and the second inductor, respectively, in a ?X direction. Two or more through hole columns are connected in parallel to a part near each end of a conductor layer portion in each of the first inductor and the fourth inductor in a longitudinal direction. One through hole column is connected to a part near each end of a conductor layer portion in each of the second inductor and the third inductor in a longitudinal direction.
    Type: Grant
    Filed: September 9, 2022
    Date of Patent: January 2, 2024
    Assignee: TDK CORPORATION
    Inventor: Takuya Sato
  • Patent number: 11817843
    Abstract: An LC filter includes a first electrode connected to a first via conductor between two ends of the first via conductor, a second electrode connected to a second via conductor between two ends of the second via conductor, a third electrode connected to a third via conductor between two ends of the third via conductor, and a fourth electrode connected to a fourth via conductor between two ends of the fourth via conductor. In a plan view viewed from the laminating direction, the second via conductor and the fourth via conductor are disposed on two sides of a virtual line connecting the first via conductor and the third via conductor, respectively. The second electrode faces the first electrode and the third electrode.
    Type: Grant
    Filed: November 15, 2021
    Date of Patent: November 14, 2023
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Hiroto Motoyama
  • Patent number: 11811382
    Abstract: An LC filter includes a first capacitor electrode connected to one end of a first via conductor and faces a first ground electrode in a laminating direction. A second capacitor electrode is connected to one end of a second via conductor and faces the first ground electrode in the laminating direction. A third capacitor electrode is connected to one end of a third via conductor and faces the first ground electrode in the laminating direction. A fourth capacitor electrode is connected to one end of a fourth via conductor and faces the first ground electrode in the laminating direction. The second capacitor electrode faces each of the first capacitor electrode, the third capacitor electrode, and the fourth capacitor electrode in a direction orthogonal or substantially orthogonal to the laminating direction.
    Type: Grant
    Filed: November 15, 2021
    Date of Patent: November 7, 2023
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Hiroto Motoyama, Keisuke Ogawa
  • Patent number: 11757424
    Abstract: A band-pass filter includes a first input/output port, a second input/output port, a first high-pass filter, a first low-pass filter, and a first stub resonator. The first stub resonator includes a first distributed constant line. The first low-pass filter is provided between the first input/output port and the first high-pass filter in the circuit configuration. The first distributed constant line has a first end connected to a first path connecting the first input/output port and the first low-pass filter, and a second end closest to a ground in the circuit configuration.
    Type: Grant
    Filed: March 3, 2022
    Date of Patent: September 12, 2023
    Assignee: TDK CORPORATION
    Inventors: Takuya Sato, Yuta Ashida
  • Patent number: 11757421
    Abstract: An electrical filter circuit is disclosed. The circuit includes a first input line and a second input line. A first transmission line is coupled electrically in series at a first node with a first output line, and an inductor is coupled electrically in series between the first input line and the first transmission line. The filter also includes a second transmission line having a first impedance coupled to the first node. The second input line is coupled electrically in series at a second node with a second output line. A third transmission line is coupled to the second node, and a capacitor is coupled electrically in series between the second transmission line and the third transmission line. The first output line has a second impedance that is greater than the first impedance.
    Type: Grant
    Filed: September 1, 2021
    Date of Patent: September 12, 2023
    Assignee: GE Aviation Systems LLC
    Inventors: Cong Li, Han Xiong, Xiaochuan Jia, David Dimitri Karipides, Ren Xie
  • Patent number: 11736083
    Abstract: A filter device includes a first port, a second port, a first high-pass filter, a first low-pass filter, and a stack. The first high-pass filter includes a first inductor. The first low-pass filter includes a first inductor. At least one second conductor layer constituting the first inductor of the first low-pass filter is located between at least one first conductor layer constituting the first inductor of the first high-pass filter and a ground conductor layer in a stacking direction.
    Type: Grant
    Filed: March 3, 2022
    Date of Patent: August 22, 2023
    Assignee: TDK CORPORATION
    Inventor: Takuya Sato
  • Patent number: 11722113
    Abstract: A low-pass filter includes first to third inductors and a capacitor. A first inductor-forming conductor layer constituting at least a part of each of the first and second inductors and a second inductor-forming conductor layer including first and second portions constituting first and second inductor portions of the third inductor are connected by a plurality of first through holes. The first portion and a capacitor-forming conductor layer constituting a part of the capacitor are connected by a plurality of second through holes. The second portion and the capacitor-forming conductor layer are connected by a plurality of third through holes.
    Type: Grant
    Filed: March 17, 2022
    Date of Patent: August 8, 2023
    Assignee: TDK CORPORATION
    Inventor: Takuya Sato
  • Patent number: 11719597
    Abstract: A measuring system for measuring the displacement of at least one point of a bridge, wherein the bridge has a resonance frequency included in the frequency band [fl, fh] where fl<fh, the measuring system including: a geophone adapted to be applied in the at least one point of the bridge, the geophone having a resonance frequency fr greater than fh and a frequency response for f<fh substantially equal to that of a double shunt; an analogue compensation device connected in series to the geophone and having a frequency response equal to that of a double integrator in the frequency band [fl, fh]; an analogue integrator device connected in series to the analogue compensation device; and an analogue/digital converter device connected in series to the analogue integrator device, the analogue/digital converter device being adapted to convert the output signal from the analogue integrator device into a digital signal.
    Type: Grant
    Filed: May 27, 2019
    Date of Patent: August 8, 2023
    Assignee: MOVE S.R.L.
    Inventors: Ferdinando Frediani, Gabriele Corsi
  • Patent number: 11705881
    Abstract: A branching filter includes a common port, a first signal port, a second signal port, a first filter, which is provided between the common port and the first signal port, that selectively passes a signal of a frequency within a first passband, a second filter, which is provided between the common port and the second signal port, that selectively passes a signal of a frequency within a second passband different from the first passband, and a capacitor that has a first end and a second end and connects the first filter and the second filter.
    Type: Grant
    Filed: March 3, 2022
    Date of Patent: July 18, 2023
    Assignee: TDK CORPORATION
    Inventors: Takuya Sato, Kazuhiro Tsukamoto, Masanori Tsutsumi
  • Patent number: 11705264
    Abstract: An LC filter arrangement includes a filter capacitor that connects the first output terminal to the second output terminal, a magnetic core, and a choke having a plurality of turns surrounding the magnetic core, and a first choke terminal and a second choke terminal. Each of the turns is formed by a separate conductor segment, at least partially surrounding the magnetic core. The LC filter arrangement is mounted on a circuit board and is electrically connected to a conductor track of the circuit board.
    Type: Grant
    Filed: June 10, 2020
    Date of Patent: July 18, 2023
    Assignee: SMA Solar Technology AG
    Inventor: Jens Friebe
  • Patent number: 11689173
    Abstract: A filter element is mounted on a module substrate. The filter element includes a ground terminal and a pair of signal terminals. The module substrate includes a ground plane, a ground land, and an inductance adjusting line that connects the ground land to the ground plane. The ground terminal of the filter element is connected to the ground land of the module substrate. The inductance adjusting line includes an in-plane extending portion that extends in an in-plane direction of the module substrate.
    Type: Grant
    Filed: June 9, 2020
    Date of Patent: June 27, 2023
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Kazuhiro Takahashi, Tetsurou Ashida
  • Patent number: 11671068
    Abstract: An LC (inductor-capacitor) tank includes a primary 8-shape inductor and a serial LC network that are connected in parallel across a first node and a second node and laid out using a multi-layer structure fabricated on a substrate, wherein a magnetic coupling between the primary 8-shape inductor and the serial LC network is mitigated due to a layout symmetry, and a resonant frequency of the serial LC network is equal to three times of a resonance frequency of the LC tank.
    Type: Grant
    Filed: February 23, 2022
    Date of Patent: June 6, 2023
    Assignee: REALTEK SEMICONDUCTOR CORP.
    Inventors: Poh-boon Leong, Chia-Liang (Leon) Lin
  • Patent number: 11627380
    Abstract: The present invention is directed to a CATV & MoCA® device, such as a RF signal amplifier. The RF signal amplifier includes a RF input port to receive signals from, and transmit signals to, a service provider. The RF input port is connected to an active communication path with a downstream signal amplifier leading to an input of a resistive splitter network. The resistive splitter network has plural interconnected resistors, which split the amplified signal received at the input of the resistive splitter network and provide the signal to plural “CATV & MoCA®” output ports. Upstream CATV signals received by the “CATV & MoCA®” output ports are combined by the resistive splitter network and sent to the RF input port to be transmitted to the service provider. MoCA® signals received by any one of the “CATV & MoCA®” output ports are carried by the resistive splitter network to the other “CATV & MoCA®” output ports, and potentially to other “MoCA® only” ports of the RF signal amplifier.
    Type: Grant
    Filed: July 30, 2021
    Date of Patent: April 11, 2023
    Assignee: CommScope Technologies LLC
    Inventor: Shi Man Li
  • Patent number: 11600434
    Abstract: Disclosed are a power inductor and a method of manufacturing the same. The power inductor includes a body, a coil pattern provided in the body, an external electrode disposed on at least one surface of the body and extending to at least the other surface of the body, which is adjacent thereto, and a coupling layer provided between the body and an extended area of the external electrode.
    Type: Grant
    Filed: December 7, 2018
    Date of Patent: March 7, 2023
    Inventors: Gyeong Tae Kim, Tae Geun Seo
  • Patent number: 11588461
    Abstract: A resonant element includes first, second, and third plane electrodes, a first via electrode defining a first inductor, a second inductor, and a third inductor. The first via electrode connects the first plane electrode and the second plane electrode, and each of the second inductor and the third inductor connects the first plane electrode and the third plane electrode. The third plane electrode defines a first capacitor together with the second plane electrode, the second inductor includes second via electrodes, and the third inductor includes third via electrodes. Each of the second via electrodes and the third via electrodes is a columnar conductor extending in the extending direction of the first via electrode.
    Type: Grant
    Filed: July 15, 2022
    Date of Patent: February 21, 2023
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Shoma Yasuda, Hiroto Motoyama, Masayuki Kikuda
  • Patent number: 11533036
    Abstract: A radio frequency filtering circuitry includes a first inductor, a second inductor, and a conductive loop. The first inductor receives a first current that induces a second current in the second inductor upon receiving the first current. The first inductor and/or the second inductor induce a third current in the conductive loop. The conductive loop adjusts the third current to reduce a first gain peak of an output signal to correlate to a second gain peak of the output signal.
    Type: Grant
    Filed: April 19, 2021
    Date of Patent: December 20, 2022
    Assignee: Apple Inc.
    Inventors: Hongrui Wang, Sohrab Emami-Neyestanak, Saihua Lin
  • Patent number: 11527968
    Abstract: A method of manufacturing a MEMS vibration element having a fixed electrode, a movable electrode, and an elastic supporting unit that elastically supports the movable electrode with respect to the fixed electrode includes: etching a base material having a first thickness to form the fixed electrode and the movable electrode; and etching the base material to form the elastic supporting unit having a second thickness, the second thickness being less than the first thickness.
    Type: Grant
    Filed: August 8, 2018
    Date of Patent: December 13, 2022
    Assignees: Saginomiya Seisakusho, Inc.
    Inventors: Gen Hashiguchi, Hideaki Koga
  • Patent number: 11522259
    Abstract: A multilayered filter device includes a multilayer stack, a band pass filter, a first band elimination filter, and a second band elimination filter. The band pass filter and the first and second band elimination filters are each constructed using the multilayer stack. The band pass filter includes a plurality of first resonators with open ends. Each band elimination filter includes a connection path, and a second resonator coupled to the connection path. The connection path includes an impedance transformer. The second resonator includes a conductor line constituting a distributed constant line.
    Type: Grant
    Filed: June 29, 2021
    Date of Patent: December 6, 2022
    Assignee: TDK CORPORATION
    Inventors: Yuta Ashida, Noriyuki Hirabayashi, Shigemitsu Tomaki
  • Patent number: 11522506
    Abstract: Various embodiments relate to an integrated circuit including a transistor device having input and output terminals, and an inductor-capacitor (LC) circuit coupled to one of the terminals of the transistor device. The LC circuit includes a capacitor having a top plate and a bottom plate, a inductor having a coil structure, and a connector configured to couple the inductor and an interior portion the top plate of the capacitor. The inductor at least partially overlaps the capacitor.
    Type: Grant
    Filed: January 31, 2020
    Date of Patent: December 6, 2022
    Assignee: NXP B.V.
    Inventors: Vikas Shilimkar, Kevin Kim, Joseph Gerard Schultz
  • Patent number: 11496106
    Abstract: A filter device is mounted on a module substrate and is shielded by a shield member. The filter device has first and second side surfaces opposed to each other. A ground terminal and signal terminals are formed on a bottom surface of the filter device. The shield member includes side wall portions facing the first and second side surfaces. The filter device includes plural LC parallel resonance circuits therein. The inductors of the LC parallel resonance circuits are arranged in parallel with the first side surface and the bottom surface. Each inductor extends upward from its end portion electrically connected to the ground terminal, extends from the first side surface toward the second side surface, and then extends toward the bottom surface. The gap between the first side surface and the corresponding side wall portion is smaller than that between the second side surface and the corresponding side wall portion.
    Type: Grant
    Filed: June 2, 2020
    Date of Patent: November 8, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Kazuhiro Takahashi
  • Patent number: 11496107
    Abstract: A frontend module includes a first filter having a passband of a first frequency band, a second filter having a passband of a second frequency band, the second frequency band being higher than the first frequency band, a third filter having a passband of a third frequency band, the third frequency band being higher than the second frequency band, and a sub-filter, connected to the second filter, configured to provide attenuation characteristics for the first frequency band, wherein the second filter comprises a plurality of parallel LC resonance circuits arranged between a ground and different nodes, from among a plurality of nodes between a first terminal and a second terminal, wherein an inductor is connected to a portion of the plurality of parallel LC resonance circuits.
    Type: Grant
    Filed: May 3, 2021
    Date of Patent: November 8, 2022
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Kang Ta Jo, Seong Jong Cheon
  • Patent number: 11476822
    Abstract: A band-pass filter includes an unbalanced port, a first balanced port, a second balanced port, and first to third resonators provided between the unbalanced port and the first and second balanced ports. The second resonator and the third resonator each are a resonator with both ends open. The second resonator and the third resonator are adjacent to each other in a circuit configuration, and electromagnetically coupled by magnetic coupling as main coupling. The first resonator is provided closer to the second resonator than to the third resonator, and jump-coupled to the third resonator.
    Type: Grant
    Filed: April 27, 2021
    Date of Patent: October 18, 2022
    Assignee: TDK CORPORATION
    Inventors: Shuhei Sawaguchi, Yuta Ashida, Masahiro Tatematsu, Yoshinori Matsumaru, Shigemitsu Tomaki
  • Patent number: 11437183
    Abstract: A coil component includes a body, a coil part including a coil pattern and embedded in the body, an external electrode disposed on an external surface of the body and electrically connected to the coil part, a shielding layer disposed on the external surface of the body, and a ceramic insulating layer disposed on a surface of the shielding layer.
    Type: Grant
    Filed: November 7, 2018
    Date of Patent: September 6, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Seung Hee Oh, Tae Jun Choi, Tai Yon Cho, Byeong Cheol Moon
  • Patent number: 11437969
    Abstract: A coupling loop circuit is constructed in such a way that a sixth conductor is made to three-dimensionally cross a second conductor, an eighth conductor is made to three-dimensionally cross each of the second conductor and a fourth conductor, a first loop area and a second loop area spatially overlap each other, and an overlapping area between the first loop area and the second loop area is formed by the second conductor, the fourth conductor, the sixth conductor, and the eighth conductor.
    Type: Grant
    Filed: March 19, 2021
    Date of Patent: September 6, 2022
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Satoshi Yoneda, Kenji Hirose
  • Patent number: 11431313
    Abstract: A resonant element includes first, second, and third plane electrodes, a first via electrode defining a first inductor, a second inductor, and a third inductor. The first via electrode connects the first plane electrode and the second plane electrode, and each of the second inductor and the third inductor connects the first plane electrode and the third plane electrode. The third plane electrode defines a first capacitor together with the second plane electrode, the second inductor includes second via electrodes, and the third inductor includes third via electrodes. Each of the second via electrodes and the third via electrodes is a columnar conductor extending in the extending direction of the first via electrode.
    Type: Grant
    Filed: April 26, 2021
    Date of Patent: August 30, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Shoma Yasuda, Hiroto Motoyama, Masayuki Kikuda
  • Patent number: 11398806
    Abstract: Disclosed is a device and methods for making same. In one aspect, a device includes a package having at least four pins, and, within the package, a die that includes a filter circuit electrically coupled to the four pins. The filter can: receive, from a first pin, an input signal comprising first and second frequency components, produce, at a second pin, a first output signal of the first frequency component, and produce, at a third and fourth pin, a second output signal of the second frequency component; and/or receive, from a second pin, a first input signal comprising the first frequency component, receive, from a third or fourth pin, a second input signal comprising the second frequency component, and produce, at a first pin, an output signal comprising the first and second frequency components. The second pin is interposed between the third and fourth pins on the package.
    Type: Grant
    Filed: September 9, 2020
    Date of Patent: July 26, 2022
    Assignee: RF360 Europe GmbH
    Inventor: Magnus Olbrich
  • Patent number: 11381213
    Abstract: A noise filter includes a magnetic core including a magnetic material; and a distance adjusting member that accepts adjustment of a distance between a loop portion and the magnetic core, the loop portion being a portion of one or more conductor wiring lines wired in loop shape out of a first conductor wiring line and a second conductor wiring line.
    Type: Grant
    Filed: September 30, 2020
    Date of Patent: July 5, 2022
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Kenji Hirose, Satoshi Yoneda
  • Patent number: 11362688
    Abstract: A radio frequency module includes a radio frequency filter (10), and the radio frequency filter (10) includes a terminal (11), a terminal (12), an impedance element (Z) disposed in series on a path (13) connecting the terminal (11) and the terminal (12), and a parallel arm resonator (P) connected between a node (N) on the path (13) and the ground. The impedance element (Z) is a capacitor or an inductor, capacitance (C) between the ground and a wiring line (14) connecting the node (N) and the parallel arm resonator (P) is larger than capacitance between the ground and a wiring line (16) connecting the impedance element (Z) and a terminal out of the terminal (11) and the terminal (12) having a shorter wiring length to the impedance element (Z) (terminal (11), for example).
    Type: Grant
    Filed: April 14, 2021
    Date of Patent: June 14, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Hirotsugu Mori
  • Patent number: 11356072
    Abstract: Customizable tunable filters are provided herein. In certain implementations, a tunable filter including: a first filter bank including a plurality of high-pass filters each having a different cutoff frequency, and a second filter bank including a plurality of low-pass filters each having a different cutoff frequency. The tunable filter further includes a first pair of switches configured to select a first filter chosen from the first filter bank, and a second pair of switches configured to select a second filter chosen from the second filter bank. The tunable filter operates with a first cutoff frequency of the first filter and with a second cutoff frequency of the second filter.
    Type: Grant
    Filed: April 28, 2020
    Date of Patent: June 7, 2022
    Assignee: Analog Devices, Inc.
    Inventors: Fatih Kocer, Ekrem Oran, Christopher O'Neill, Kasey Chatzopoulos
  • Patent number: 11349449
    Abstract: Provided is a laminated electronic component in which defective formation is unlikely to cause in a shield conductor layer on a side surface of a laminate. The laminated electronic component includes a laminate 1, in which substrate layers 1a to 1i are laminated, having an outer surface including a first main surface 1B, a second main surface 1T, and a side surface 1S, internal electrodes (a ground electrode 2, coil electrodes 3, capacitor electrodes 4, and wiring electrodes 5), an external electrode 7, and a first plating layer 9 formed on a surface of the external electrode 7.
    Type: Grant
    Filed: January 8, 2021
    Date of Patent: May 31, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Issei Yamamoto, Atsunobu Okazaki, Yuki Asano
  • Patent number: 11342647
    Abstract: A free-from radio frequency (RF) media includes a substrate having a first dielectric layer formed thereon and a second dielectric layer on an upper surface of the first dielectric layer. A first conductive layer is formed on an upper surface of the first dielectric layer and has a first overall profile. A second conductive layer having a second overall profile is formed on an upper surface of the second dielectric layer such that the second dielectric layer is interposed between the first and second conductive layers. The first overall profile of the first conductive layer is different from the second overall profile of the second conductive layer.
    Type: Grant
    Filed: November 26, 2019
    Date of Patent: May 24, 2022
    Assignee: RAYTHEON COMPANY
    Inventors: David D. Heston, Mikel J. White, Michael G. Hawkins
  • Patent number: 11329560
    Abstract: A voltage converter with which energy conversion efficiency can be improved during not only low-load conditions but also high-load conditions. A step-down DC-DC converter includes a tapped inductor and a capacitor. The inductor and the capacitor form an LC filter. The inductor and a switching element form a variable inductor having a changeable inductance value. The capacitor and a variable DC voltage source form a variable capacitor having a changeable capacitance value. A control unit changes the inductance value of the variable inductor in accordance with an input/output voltage ratio Vin/Vout between a DC input voltage and a DC output voltage. The control unit changes the capacitance value of the variable capacitor to a capacitance value with which an LC resonant frequency is maintained constant when changing the inductance value of the variable inductor.
    Type: Grant
    Filed: September 15, 2020
    Date of Patent: May 10, 2022
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Norimichi Onozaki
  • Patent number: 11316492
    Abstract: A balun includes a first capacitor, a second capacitor, a first inductor, an unbalanced signal port, a first balanced signal port, and a second balanced signal port. The first capacitor and the second capacitor are electrically connected in series between the unbalanced signal port and the first balanced signal port. The first inductor is electrically connected in parallel to the first capacitor and the second capacitor electrically connected in series. A second signal path is electrically connected to a first signal path between the first capacitor and the second capacitor, and the second balanced signal port is electrically connected to the second signal path.
    Type: Grant
    Filed: September 15, 2020
    Date of Patent: April 26, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Noboru Shiokawa