Resonant, Discrete Frequency Selective Type Patents (Class 333/175)
  • Patent number: 11031662
    Abstract: The present application provides an LTCC band-pass filter, including a shell and a filtering assembly. The shell includes a top wall and a bottom wall. The filtering assembly includes a first layer, two second layers respectively overlapped on two opposite sides of the first layer, two third layers respectively overlapped on two sides of the two second layers far away from the first layer, and a fourth layer sandwiched between one of the second layers and the third layers. The first layer is served as an inductance L. The second layer is served as a grounding capacitor C. The second layer and the first layer are coupled together to form an LC resonance unit. The third layer is connected with the ground, and is served as a shielding layer of the LTCC band-pass filter.
    Type: Grant
    Filed: December 6, 2019
    Date of Patent: June 8, 2021
    Assignee: AAC Technologies Pte. Ltd.
    Inventors: Zenan Liu, Ya Wang, Yongli Chen
  • Patent number: 11018647
    Abstract: An electrical filter structure for forwarding an electrical signal from a first port to a second port in a frequency selective manner, wherein the filter is an edge-coupled filter, the filter comprising: a plurality of coupled line sections coupled in a series, comprising at least a first coupled line section and a last coupled line section; wherein the first port is connected with the first of the coupled line sections using a first transmission line; wherein the second port is connected with the last of the coupled line sections using a second transmission line; wherein the electrical filter comprises an open stub; wherein a length of the open stub is chosen such that an electrical length of the open stub is equal, within a tolerance of +/?20 percent, to a fourth of a wavelength of a signal having a frequency of twice a passband center frequency of the filter.
    Type: Grant
    Filed: April 15, 2020
    Date of Patent: May 25, 2021
    Assignee: Advantest Corporation
    Inventor: Giovanni Bianchi
  • Patent number: 10998126
    Abstract: Disclosed herein is a coil component that includes: a coil part in which a plurality of conductor layers and a plurality of interlayer insulting layers are alternately laminated, the coil part having a mounting surface substantially parallel to the lamination direction and an upper surface substantially parallel to the lamination direction and positioned on an opposite side to the mounting surface; and a direction mark comprising a conductive material that covers a part of the conductor layers exposed on the upper surface.
    Type: Grant
    Filed: June 5, 2018
    Date of Patent: May 4, 2021
    Assignee: TDK CORPORATION
    Inventors: Tomonaga Nishikawa, Tomokazu Ito, Manabu Yamatani, Masanori Suzuki, Ikuya Kokubo, Takuya Takeuchi
  • Patent number: 10972066
    Abstract: A laminated electronic component includes a multilayer body including multiple insulator layers that are laminated and including a bottom surface, a top surface, and multiple side surfaces. The laminated electronic component includes a shield film provided on at least one side surface of the multilayer body. In the laminated electronic component, at least one step difference is provided along a ridge at which the bottom surface and a corresponding one of the side surfaces of the multilayer body are connected to each other, and the shield film includes an edge portion disposed within the at least one step difference.
    Type: Grant
    Filed: August 26, 2019
    Date of Patent: April 6, 2021
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Kunihiro Miyahara
  • Patent number: 10972067
    Abstract: A filter includes: a substrate; input and output terminals located on the substrate; a resonant circuit located in a series pathway between the input and output terminals; a first component including a first inductor, which is electrically connected between a first node in the series pathway and a ground, and mounted in a first region on the substrate; a second component including a second inductor, which is electrically connected between a second node different from the first node in the series pathway and a ground, and mounted in a second region different from the first region on the substrate; and a third component including an acoustic wave resonator, which is electrically connected between a third node between the first and second nodes in the series pathway and a ground, and mounted in a third region between the first and second regions on the substrate.
    Type: Grant
    Filed: December 18, 2019
    Date of Patent: April 6, 2021
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Jaeho Jeong, Shuei Hashimoto, Naoyuki Tasaka, Sachiko Tanaka, Makoto Inoue
  • Patent number: 10950381
    Abstract: A surface-mounted LC device that includes a substrate having a first surface, multiple inductors formed on the first surface and formed respectively by multiple coiled conductor patterns, a first insulating layer covering the multiple coiled conductor patterns, and a capacitor that is formed on the first insulating layer by a planar electrode. Moreover, the planar electrode covers first zones in which portions of the coiled conductor patterns are adjacent to each other and current directions are opposite to each other in a plan view of the surface-mounted LC device.
    Type: Grant
    Filed: March 22, 2018
    Date of Patent: March 16, 2021
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Kenichi Ishizuka, Hirokazu Yazaki
  • Patent number: 10944374
    Abstract: An apparatus and method electrically coupling an electrostatic chuck RF filter box with a pedestal lift. The RF filter box has a contact block and at least one alignment feature on an outer mating surface of the RF filter block. The contact block includes self-aligning electrical connectors and the alignment feature is configured for aligning self-aligning electrical connectors with corresponding electrical connectors on the bracket of the pedestal lift such that the self-aligning electrical connectors and the corresponding electrical connectors on the bracket of the pedestal lift automatically mate when the contact block is mounted to the bracket of the pedestal lift.
    Type: Grant
    Filed: June 19, 2020
    Date of Patent: March 9, 2021
    Assignee: Lam Research Corporation
    Inventors: Miguel Benjamin Vasquez, Jeremy Jerome Pool, Damien Martin Slevin
  • Patent number: 10944205
    Abstract: A hermetic electrical adaptor including a first insulative body, a second insulative body, a plurality of contacts, a first glue body and a second glue body. The contact has a main body and first and second contacting sections located at two opposite ends of the main body. The first insulative body has a first base and a first tongue, and the second insulative body has a second base and a second tongue. The second base forms a receiving cavity to receive the first base. The first contacting section is disposed upon the first tongue, and the second contacting section is disposed upon the second tongue. The first insulative body is integrally formed with the contacts as a contact module before assembled with the second insulative body. The first base forms in a back side a receiving space to receive the first glue body.
    Type: Grant
    Filed: October 8, 2019
    Date of Patent: March 9, 2021
    Assignees: FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD., FOXCONN INTERCONNECT TECHNOLOGY LIMITED
    Inventors: De-Jin Chen, Xing-Liang Liu, Shih-Wei Hsiao
  • Patent number: 10917062
    Abstract: A method of manufacturing an electronic component includes: preparing an element body configured to have a rectangular parallelepiped shape and include a first surface serving as a mounting surface, a second surface opposing the first surface, and a third surface extending in such a way as to connect the first surface and the second surface; forming a chamfered portion chamfered between the first surface and the third surface; forming a terminal electrode on the first surface; covering the chamfered portion and the first surface with a covering member; forming a metal shield film on a part of the element body, the part including at least the second surface and the third surface and exposed from the covering member; and removing the covering member.
    Type: Grant
    Filed: December 20, 2018
    Date of Patent: February 9, 2021
    Assignee: TDK CORPORATION
    Inventors: Yoshinori Sato, Shigeyuki Doi, Takeo Ougimoto
  • Patent number: 10833567
    Abstract: A shaft grounding and monitoring system may include a grounding member slidingly engageable with a rotating shaft. An electrical sensor may be configured to be coupled with the grounding member in order to detect an electrical parameter that provides an indication of electricity flowing from the rotating shaft to ground through the grounding member. A processor may be operably coupled with the electrical sensor and may receive and analyze data from the electrical sensor at multiple sampling points taken at different rotational positions of the rotating shaft during multiple revolutions of the rotating shaft. The processor may be configured to develop, over time, a reconstructed waveform representing a compilation of the periodically sampled values of the data from the electrical sensor through one revolution of the rotating shaft.
    Type: Grant
    Filed: June 4, 2018
    Date of Patent: November 10, 2020
    Assignee: CUTSFORTH, INC.
    Inventors: David A. Jahnke, Robert S. Cutsforth, Dustin L. Cutsforth
  • Patent number: 10790793
    Abstract: A filter circuit includes a pass band filter and a multipath interference mitigation leg. The pass band filter is disposed along a signal path between a provider-side port and a user-side port. The pass band filter is configured to pass a provider bandwidth signal received at the provider-side port and block at least a portion of a home network bandwidth signal received at the user-side port. A frequency spectrum of the home network bandwidth signal is distinct from, and higher than, a frequency spectrum of the provider bandwidth signal. The multipath interference mitigation leg is operatively branched to ground from the signal path. The multipath interference mitigation leg is configured to increase a return loss in the home network bandwidth signal.
    Type: Grant
    Filed: March 20, 2019
    Date of Patent: September 29, 2020
    Assignee: PPC BROADBAND, INC.
    Inventors: Erdogan Alkan, Raymond W. Palinkas
  • Patent number: 10784834
    Abstract: A multilayer LC filter array includes an element body of a rectangular parallelepiped shape, a first filter including a first inductor and a first capacitor, a second filter including a second inductor and a second capacitor, a first input terminal electrode and a first output terminal electrode that are connected to the first inductor, a second input terminal electrode and a second output terminal electrode that are connected to the second inductor, and a ground terminal electrode that is connected to the first capacitor and the second capacitor. The element body includes a principal surface. The ground terminal electrode is disposed at a center of the principal surface. The first input terminal electrode, the first output terminal electrode, the second input terminal electrode, and the second output terminal electrode are disposed at respective different corner portions of the element body when viewed from a direction orthogonal to the principal surface.
    Type: Grant
    Filed: August 21, 2017
    Date of Patent: September 22, 2020
    Assignee: TDK CORPORATION
    Inventors: Akihiko Oide, Naoki Uchida, Yoji Tozawa, Makoto Yoshino, Seiichi Nakagawa, Shinichi Sato, Hiroshi Ono, Takashi Endo
  • Patent number: 10771034
    Abstract: A conductive path with noise filter that includes a plurality of conductive path main bodies; a plurality of insulating layers that surround respective outer circumferences of the conductive path main bodies; a plurality of conductors that are provided with the insulating layers being sandwiched between the conductors and the conductive path main bodies and form respective capacitors; a plurality of inductors that are connected to the respective conductors; and an electrical connector that includes a plurality of fitting portions into which the respective inductors can be fitted and that is attached to an electrical connection holder.
    Type: Grant
    Filed: April 4, 2017
    Date of Patent: September 8, 2020
    Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LIMITED, SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Keiji Hirata, Takeshi Aizawa
  • Patent number: 10771035
    Abstract: A multilayer LC filter includes a magnetic coupling adjustment inductor for at least one LC resonator. The magnetic coupling adjustment inductor includes a line conductor pattern and a first via conductor connected to each other. The line conductor pattern is connected to an intermediate point of a second via conductor, and the first via conductor is connected to a ground conductor pattern. A loop inductor and the magnetic coupling adjustment inductor in the LC resonator for which the magnetic coupling adjustment inductor is provided are magnetically coupled to a loop inductor in another adjacent LC resonator.
    Type: Grant
    Filed: March 29, 2019
    Date of Patent: September 8, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Akihito Oishi
  • Patent number: 10756404
    Abstract: A magnetoresistance effect device includes first and second ports, first and second circuit units, and reference potential and DC applying terminals. The first and second circuit units respectively include first and second magnetoresistance effect elements and first and second conductors. In the second conductor, the positional relationship between first and second end faces respectively on the first and opposite conductor sides in the first magnetoresistance effect element with respect to a flowing direction of a direct current flowing inside the first magnetoresistance effect element and the positional relationship between first and second end faces respectively on the second and opposite conductor sides in the second magnetoresistance effect element with respect to a flowing direction of a direct current flowing in the second magnetoresistance effect element are opposite each other.
    Type: Grant
    Filed: January 30, 2019
    Date of Patent: August 25, 2020
    Assignee: TDK CORPORATION
    Inventors: Tsuyoshi Suzuki, Shinji Hara
  • Patent number: 10749494
    Abstract: A positive electrode side input loop line (10a) and a positive electrode side output loop line (10b), and a negative electrode side input loop line (11a) and a negative electrode side output loop line (11b) form two sets of coupling loops, and the loop lines of the two sets have the same winding direction, and have the same loop sizes of and relative relationship between the loop lines. A capacitor (3) is connected in series between the positive electrode side input loop line (10a) and the negative electrode side input loop line (11a).
    Type: Grant
    Filed: August 3, 2016
    Date of Patent: August 18, 2020
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Satoshi Yoneda, Kenji Hirose, Yoshiyuki Kusano
  • Patent number: 10637429
    Abstract: An electronic component includes a multilayer body including insulator layers laminated in a lamination direction, a side surface electrode provided on a side surface defined by contiguous outer edges of the insulator layers, and connected to a ground potential, at least one conductor layer provided on the insulator layers, a shield conductor layer provided on the insulator layer that is different from the insulator layer on which the inner conductor layer is provided, and overlapping with the inner conductor layer when viewed from the lamination direction, a first lead conductor layer provided on the insulator layer that is different from the insulator layer on which the shield conductor layer is provided, and connected to the side surface electrode, and a first interlayer connection conductor passing through least one of the insulator layers in the lamination direction to connect the shield conductor layer and the first lead conductor layer.
    Type: Grant
    Filed: August 2, 2018
    Date of Patent: April 28, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Kunihiro Miyahara
  • Patent number: 10600560
    Abstract: An electronic component includes a main body, an inner conductor inside the main body, one or more outer electrodes on a bottom surface of the main body and not provided on four side surfaces of the main body, and a shield electrode covering the four side surfaces of the main body and having a cylindrical or substantially cylindrical shape, the shield electrode not being physically connected to any of the one or more outer electrodes at a surface of the main body and being connected to the inner conductor at a surface of the main body.
    Type: Grant
    Filed: October 14, 2016
    Date of Patent: March 24, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Yutaka Masuda, Kunihiro Miyahara, Yosuke Matsushita, Issei Yamamoto
  • Patent number: 10566674
    Abstract: A directional coupler includes a main line through which a first signal in a first frequency band and a second signal in a second frequency band pass from a first port to a second port, a sub-line electromagnetically coupled to the main line and having a third port and a fourth port, the third port outputting a first coupled signal corresponding to the first signal and a second coupled signal corresponding to the second signal, a first termination circuit connected to the fourth port and used in outputting the first coupled signal, a second termination circuit connected to the fourth port and used in outputting the second coupled signal, and a first filter circuit disposed between the fourth port and the first termination circuit, wherein the first filter circuit has frequency characteristics allowing the first coupled signal to pass therethrough and attenuating the second coupled signal.
    Type: Grant
    Filed: September 24, 2018
    Date of Patent: February 18, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Shota Ishihara
  • Patent number: 10560059
    Abstract: A power amplifier module includes an amplifier that amplifies an input signal and outputs an amplified signal, a matching circuit disposed between an output terminal of the amplifier and a subsequent circuit, a choke inductor having a first end to which a power supply voltage is applied and a second end from which power supply is provided to the amplifier through the output terminal of the amplifier, and a first attenuation circuit disposed between the output terminal of the amplifier and the second end of the choke inductor and configured to attenuate a harmonic component of the amplified signal.
    Type: Grant
    Filed: December 7, 2018
    Date of Patent: February 11, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Hiroki Shounai, Yoshiki Kogushi
  • Patent number: 10546686
    Abstract: An antenna system is provided that is capable of transmitting and receiving using near-field magnetic induction (NFMI). The antenna system includes a non-magnetic metallic core, a ferrite shield, and at least one electrically conducting winding. The ferrite shield is positioned between the non-magnetic metallic core and the electrically conducting winding. The non-magnetic metallic core may be a battery. The ferrite material forms a low impedance path for the magnetic field lines and increases inductance, thus providing increased energy efficiency and transmission quality. The antenna system is suitable for use in space constrained battery powered devices, such as hear instruments including hearing aids and earbuds.
    Type: Grant
    Filed: March 14, 2016
    Date of Patent: January 28, 2020
    Assignee: NXP B.V.
    Inventors: Pieter Verschueren, Anthony Kerselaers
  • Patent number: 10447225
    Abstract: A filter apparatus, which includes a feedback active common-mode filter and a feed-forward active common-mode filter, the feedback active common-mode filter includes a common-mode noise detection component and a first filter circuit, and the feed-forward active common-mode filter includes the common-mode noise detection component and a second filter circuit, where the first filter circuit is connected between the common-mode noise detection component and the device, and performs feedback filtering on a first common-mode noise signal, to obtain a second common-mode noise signal; the common-mode noise detection component is connected between the first filter circuit and the second filter circuit, detects the second common-mode noise signal, and provides the second filter circuit with the second common-mode noise signal; and the second filter circuit is connected between an external power source and the common-mode noise detection component, and performs feed-forward filtering on the second common-mode noise sig
    Type: Grant
    Filed: October 26, 2017
    Date of Patent: October 15, 2019
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Changsheng Pei, Yongbing Gao, Heling Zhang
  • Patent number: 10439582
    Abstract: A variable-frequency LC filter that has sharp attenuation characteristics and that does not increase the size of a substrate and a high-frequency frontend module using such a variable-frequency LC filter are provided. A first variable capacitor and a second variable capacitor are disposed on a principal surface such that strength of magnetic field coupling caused between a first inductor and a third inductor is greater than strength of magnetic field coupling caused between a second inductor and the first inductor and than strength of magnetic field coupling caused between the second inductor and the third inductor.
    Type: Grant
    Filed: September 13, 2018
    Date of Patent: October 8, 2019
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Hirotsugu Mori
  • Patent number: 10424873
    Abstract: A circuit board of an electrical connector includes two adjacent first touching contacts, two second touching contacts respectively arranged at two opposite outer sides of the two first touching contacts, a plurality of conductive circuits connected to the first and second touching contacts, a first layer-like capacitor, and a second layer-like capacitor, the latter two of which are embedded therein. The first layer-like capacitor includes two coplanar first comb-like portions spaced apart from each other. The second layer-like capacitor includes two coplanar second comb-like portions spaced apart from each other. The two first comb-like portions are respectively and electrically coupled to one of the two first touching contacts and one of the two second touching contacts, which are arranged away from each other. The two second comb-like portions are respectively and electrically coupled to the other first touching contact and the other second touching contact.
    Type: Grant
    Filed: September 17, 2018
    Date of Patent: September 24, 2019
    Assignees: U.D.ELECTRONIC CORP, U.D.(DONGGUAN)ELECTRONIC TECHNOLOGY CORP., U.D.(ZHONG JIANG)ELECTRONIC CORP.
    Inventors: Chih-Kai Chang, Yao-Ching Huang, Shih-Hung Chang
  • Patent number: 10418174
    Abstract: Disclosed herein is a coil component that includes a drum core including a pair of flange portions and a winding core portion positioned between the flange portions, a plurality of terminal electrodes formed on the flange portions, and a plurality of wires wound around the winding core portion, each end of the wires being electrically connected to an associated one of the terminal electrodes. Each of the flange portions has an inner side surface connected to the winding core portion and an outer side surface opposite to the inner side surface, the outer side surface has a plurality of ridges and at least one groove, and the terminal electrodes are formed on at least the ridges of the outer side surfaces such that the terminal electrodes are isolated from each other by the groove.
    Type: Grant
    Filed: July 1, 2016
    Date of Patent: September 17, 2019
    Assignee: TDK CORPORATION
    Inventors: Tasuku Mikogami, Nobuo Takagi, Kouyu Ohi, Syun Ashizawa, Setu Tsuchida
  • Patent number: 10361481
    Abstract: Inter-element couplings between radiative elements of an antenna can be reduced by increasing resonant frequencies for first selected radiative elements and decreasing resonant frequencies for second selected radiative elements. In some approaches, the radiative elements are coupled to a waveguide and the antenna configuration is a hologram that relates a reference wave of the waveguide to a radiated wave of the antenna. In some approaches, the antenna configuration is modified by identifying stationary points of the hologram and then staggering resonant frequencies for radiative elements within neighborhoods of the stationary points.
    Type: Grant
    Filed: October 31, 2016
    Date of Patent: July 23, 2019
    Assignee: The Invention Science Fund I, LLC
    Inventors: Eric J. Black, Brian Mark Deutsch, Alexander Remley Katko, Melroy Machado, Jay Howard McCandless, Yaroslav A. Urzhumov
  • Patent number: 10340585
    Abstract: Various embodiments relate to a low-profile, linearly-polarized patch antenna with parasitic elements at 5.3 GHz for the ISS C-band WiFi band. It may also use the 5.8 GHz band. A protective dome helps to meet low earth orbit space requirements.
    Type: Grant
    Filed: July 24, 2017
    Date of Patent: July 2, 2019
    Assignee: The United States of America as represented by the Administrator of NASA
    Inventor: Victor J. Marrero-Fontanez
  • Patent number: 10277190
    Abstract: A multilayer filter includes dielectric layers, a first terminal, a second terminal, a first inductor, a second inductor, and first to fifth capacitors. In a stacking direction of the dielectric layers, at least one of a first air-core portion defined by the first inductor and a second air-core portion defined by the second inductor includes, in a region from the first inductor layer to the second inductor layer, a region enabling magnetic flux to pass therethrough without being obstructed by the first to fifth capacitors and the third inductor.
    Type: Grant
    Filed: July 25, 2017
    Date of Patent: April 30, 2019
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Hiroshi Masuda, Rumiko Yuasa
  • Patent number: 10242792
    Abstract: A multilayer body includes a first pattern conductor, and first and second via conductors. A first end of the first via conductor is electrically coupled with a second signal electrode, and a second end thereof is electrically coupled with the first pattern conductor. A first end of the second via conductor is electrically coupled with the first pattern conductor. The first pattern conductor extends such that a distance between the second via conductor and a second shield electrode is larger than a distance between the first via conductor and the second shield electrode, a distance between the second via conductor and a third shield electrode is larger than a distance between the first via conductor and the third shield electrode, and a coupling portion between the second via conductor and the first pattern conductor is outside an area of the second signal electrode.
    Type: Grant
    Filed: May 17, 2017
    Date of Patent: March 26, 2019
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Kunihiro Miyahara
  • Patent number: 10242798
    Abstract: A multilayer body includes a first pattern conductor, and first and second via conductors. A first end of the first via conductor is electrically coupled with a second signal electrode, and a second end thereof is electrically coupled with the first pattern conductor. A first end of the second via conductor is electrically coupled with the first pattern conductor. The first pattern conductor extends such that a distance between the second via conductor and a second shield electrode is smaller than a distance between the first via conductor and the second shield electrode, a distance between the second via conductor and a third shield electrode is smaller than a distance between the first via conductor and the third shield electrode, and a coupling portion between the second via conductor and the first pattern conductor is outside an area of the second signal electrode.
    Type: Grant
    Filed: May 17, 2017
    Date of Patent: March 26, 2019
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Kunihiro Miyahara
  • Patent number: 10187028
    Abstract: In one aspect, the present disclosure provides a surface-mounted low-pass filter, including: a mounting surface having an input terminal electrode, an output terminal electrode, and a ground terminal electrode; a parallel resonant circuit between the input terminal electrode and the output terminal electrode; and a series resonant circuit between one end of the parallel resonant circuit and the ground terminal electrode, wherein the series resonant circuit has a first capacitor and a first inductor, and wherein, when the low-pass filter is viewed from above in a direction perpendicular to the mounting surface with the mounting surface on the bottom, the first inductor of the series resonant circuit is above the first capacitor.
    Type: Grant
    Filed: March 29, 2017
    Date of Patent: January 22, 2019
    Assignee: TAIYO YUDEN CO., LTD.
    Inventor: Hirotaka Takeuchi
  • Patent number: 10164599
    Abstract: A circuitry includes a functional circuit providing a predetermined function and a resistive device coupled between a power supply and the functional circuit to contribute a resistance on a power supplying path for the power supply to supply power to the functional circuit. The resistance is tunable.
    Type: Grant
    Filed: December 16, 2016
    Date of Patent: December 25, 2018
    Assignee: MEDIATEK SINGAPORE PTE. LTD.
    Inventors: Rong Zhou, Yipin Wu
  • Patent number: 10147530
    Abstract: Systems and implementations for inductance tuning systems that are configured to operate in a wide range of frequencies are provided herein. The subject matter described herein can in some embodiments include an inductance tuning system including at least one inductor connected to a first terminal, the at least one inductor comprising of a plurality of inductive elements that are substantially magnetically coupled to each other, wherein spacing between the inductive elements are substantially less than diameters of the windings. At least one capacitor can be connected between one or more of the plurality of inductive elements and a second terminal.
    Type: Grant
    Filed: March 17, 2014
    Date of Patent: December 4, 2018
    Assignee: WISPRY, INC.
    Inventor: Jorgen Bojer
  • Patent number: 10110114
    Abstract: The invention comprises a high frequency inductor filter apparatus and method of use thereof. In one embodiment, an inductor is used to filter/convert power, where the inductor comprises a distributed gap core and/or a powdered core material. The inductor core is wound with one or more turns, where multiple turns are optionally electrically wired in parallel. In one example, the minimum carrier frequency is above that usable by an iron-steel inductor, such as greater than ten kiloHertz at fifty or more amperes. The core is optionally an annular core, solid rod core, or a core used for multiple phases, such as a ‘C’ or ‘E’ core. Optionally, the inductor is used in an inductor/converter apparatus, where output power has a carrier frequency, modulated by a fundamental frequency, and a set of harmonic frequencies, in conjunction with one or more of a silicon carbide, gallium arsenide, and/or gallium nitride based transistor.
    Type: Grant
    Filed: November 10, 2016
    Date of Patent: October 23, 2018
    Inventor: Grant A. MacLennan
  • Patent number: 10110193
    Abstract: A low pass filter includes a first via-hole conductor connected to a first end portion of a first inductor and a third end portion of a second inductor and extending to another side in a lamination direction with respect to a second end portion of the first inductor and a fourth end portion of the second inductor, and a first capacitor electrically connected in parallel with at least a portion of the first inductor and a portion of the second inductor and defined by a first capacitor conductor layer. The low pass filter allows the interval between attenuation poles to be easily adjusted.
    Type: Grant
    Filed: February 27, 2017
    Date of Patent: October 23, 2018
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Hiroshi Masuda
  • Patent number: 10076036
    Abstract: A multilayer capacitor includes a capacitor body including dielectric layers and a plurality of first and second internal electrodes alternately disposed with one of the dielectric layers interposed between each pair of adjacent first and second internal electrodes. First and second via electrodes penetrate through the plurality of second internal electrodes to thereby be exposed to a first surface of the capacitor body, and are disposed to be spaced apart from each other. First and second external electrodes are disposed on two side surfaces of the capacitor body and connected to opposing ends of the first internal electrodes, respectively. Third and fourth external electrodes are disposed on the first surface of the capacitor body to be spaced apart from each other, and are connected to end portions of the first and second via electrodes, respectively.
    Type: Grant
    Filed: May 10, 2017
    Date of Patent: September 11, 2018
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Kyo Kwang Lee, Jin Kyung Joo, Chang Su Kim, Ho Jun Lee
  • Patent number: 10029914
    Abstract: The present invention generally relates to a mechanism for testing a MEMS hysteresis. A power management circuit may be coupled to the electrodes that cause the movable plate that is disposed between the electrodes in a MEMS device to move. The power management circuit may utilize a charge pump, a comparator and a resistor ladder.
    Type: Grant
    Filed: April 23, 2015
    Date of Patent: July 24, 2018
    Assignee: CAVENDISH KINETICS, INC.
    Inventors: James Douglas Huffman, Cong Quoc Khieu, Robertus Petrus Van Kampen, Karl F. Smayling, Vikram Joshi
  • Patent number: 10020105
    Abstract: The present disclosure includes: a laminate in which a plurality of sheets are laminated; two or more noise filters provided spaced apart by a predetermined distance from each other in the laminate and respectively provided with a plurality of coil patterns; an external electrode provided outside the laminate and connected to the two or more noise filters; and a connection electrode provided outside the laminate being spaced apart from the external electrode to connect the two or more coil patterns.
    Type: Grant
    Filed: December 31, 2015
    Date of Patent: July 10, 2018
    Assignee: INNOCHIPS TECHNOLOGY CO., LTD.
    Inventors: In Kil Park, Tae Hyung Noh, Myung Ho Lee, Song Yeon Lee, Jung Hun Lee, Hyun Mo Kang
  • Patent number: 9998086
    Abstract: An LC parallel resonator includes a plurality of dielectric layers stacked on top of one another, a capacitor electrode, and an inductor electrode. The inductor electrode defines a loop including a connection point, as a start point, connected to the capacitor electrode. The inductor electrode includes a first line electrode, first via electrodes, and second via electrodes. The first line electrode extends in a direction perpendicular or substantially perpendicular to a stacking direction of the dielectric layers. The first via electrodes arranged in parallel or substantially in parallel with one another extend in the stacking direction of the dielectric layers, and connect the capacitor electrode to the first line electrode. The second via electrodes arranged in parallel or substantially in parallel with one another extend in the stacking direction of the dielectric layers and are connected to the first line electrode.
    Type: Grant
    Filed: September 19, 2016
    Date of Patent: June 12, 2018
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Noboru Shiokawa
  • Patent number: 9979064
    Abstract: A tunable dual-band resonator and a tunable dual-band band-pass filter using the tunable dual-band resonator. The dual-band resonator is structured such that a stub is added to each half-wavelength resonator provided with half-wavelength resonator protrusions (capacity-component adjust parts). The dual-band resonator is made up of an odd-number mode resonator in a shape including a ground conductor disposed on the back surface of a dielectric body, and a strip conductor disposed on the top surface thereof, and an even-number mode resonator in such a shape as to be formed when the stub is connected to an end face on the opposite side of the open-end of the strip, characterized in that a dielectric rod having a circular cross section is provided in the space above the respective stubs and another dielectric rod having a circular cross section is provided in the space above the half-wavelength resonator protrusions.
    Type: Grant
    Filed: July 24, 2015
    Date of Patent: May 22, 2018
    Assignees: UNIVERSITY OF YAMANASHI, THE JAPAN STEEL WORKS, LTD.
    Inventors: Naoto Sekiya, Katsuhiro Terao, Kazuhito Kishida, Yasuo Sato, Noritaka Kitada
  • Patent number: 9979357
    Abstract: A power amplifier module includes an amplifier that amplifies an input signal and outputs an amplified signal, a matching circuit disposed between an output terminal of the amplifier and a subsequent circuit, a choke inductor having a first end to which a power supply voltage is applied and a second end from which power supply is provided to the amplifier through the output terminal of the amplifier, and a first attenuation circuit disposed between the output terminal of the amplifier and the second end of the choke inductor and configured to attenuate a harmonic component of the amplified signal.
    Type: Grant
    Filed: May 4, 2017
    Date of Patent: May 22, 2018
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Hiroki Shounai, Yoshiki Kogushi
  • Patent number: 9954365
    Abstract: This document relates to electricity management using modulated waveforms. One example modulates electricity to obtain modulated electricity having at least two different alternating current frequencies including a first alternating current frequency and a second alternating current frequency. The example delivers the modulated electrical power having the at least two different alternating current frequencies to multiple different electrical devices, including a first electrical device configured to utilize the first alternating current frequency and a second electrical device configured to utilize the second alternating current frequency. The modulated electricity can be delivered at least partly over an electrical line shared by the first electrical device and the second electrical device.
    Type: Grant
    Filed: March 31, 2015
    Date of Patent: April 24, 2018
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Jie Liu, Brian Janous, Gregory Joseph McKnight, Sean James, Ricardo Bianchini
  • Patent number: 9948264
    Abstract: An electronic component includes a spiral or substantially spiral first inductor extending along a stacking direction while turning around a ring-shaped or substantially ring-shaped path. The first inductor includes first inductor conductors and a first interlayer connecting conductor connected to each other. The first interlayer connecting conductor passes through some insulating layers. A second interlayer connecting conductor passes through some insulating layers, and is connected in series and is located within the ring-shaped path. A first capacitor conductor is disposed closer to one side of the stacking direction than the first inductor is. The first capacitor conductor is at least partially superposed on the ring-shaped path to define a first capacitor between the first capacitor conductor and the first inductor, and is superposed on a portion of a region surrounded by the ring-shaped path to be connected to the second interlayer connecting conductor.
    Type: Grant
    Filed: November 17, 2015
    Date of Patent: April 17, 2018
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Tetsuo Taniguchi
  • Patent number: 9897512
    Abstract: Embodiments of methods of non-destructively testing whether a laminated substrate satisfies structural requirements are disclosed herein. Additionally, laminated substrates that can be non-destructively tested are also disclosed along with methods of manufacturing the same. To non-destructively test whether the laminated substrates satisfies the structural requirement, an electrical characteristic of the laminated substrate may be detected. Since the detected electrical characteristic is related to a structural characteristic being tested, whether the structural characteristic complies with the structural requirement can be determined based on the electrical characteristic.
    Type: Grant
    Filed: April 16, 2012
    Date of Patent: February 20, 2018
    Assignee: Qorvo US, Inc.
    Inventors: Thomas Scott Morris, David C. Dening, Chris Botzis
  • Patent number: 9899141
    Abstract: Disclosed herein are a method of manufacturing a common mode filter forming a coil electrode by directly patterning metal layers laminated on both surfaces of a core insulating layer while not using a build-up process, and the common mode filter manufactured according to the method.
    Type: Grant
    Filed: December 23, 2013
    Date of Patent: February 20, 2018
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jong Yun Lee, Sung Kwon Wi
  • Patent number: 9900706
    Abstract: A microstrip filter is provided in the present disclosure. The microstrip filter includes a substrate having a first surface and a second surface opposite to each other, a first spiral metal line formed on the first surface of the substrate, and a second spiral metal line formed on the second surface of the substrate. At least part of the first spiral metal line overlaps and is coupled to the second spiral metal line for forming a filter capacitor. The present disclosure also provides a microphone device using the microstrip filter.
    Type: Grant
    Filed: March 24, 2016
    Date of Patent: February 20, 2018
    Assignee: AAC TECHNOLOGIES PTE. LTD.
    Inventor: Sijie Chi
  • Patent number: 9871499
    Abstract: Radio frequency (RF) filter structures and related methods and RF front-end circuitry are disclosed. In one embodiment, an RF filter structure includes a first terminal and a first tunable RF filter path defined between the first terminal and a second terminal. The first tunable RF filter path is tunable to provide impedance matching between the first terminal and the second terminal at a first frequency. The first frequency may be provided within a first frequency band. Additionally, the RF filter structure includes a second tunable RF filter path defined between the first terminal and the second terminal. The second tunable RF filter path is tunable to provide impedance matching between the first terminal and the second terminal at a second frequency. The second frequency may be within a second frequency band. In this manner, the RF filter structure is configured to provide impedance tuning for multiple impedance bands simultaneously.
    Type: Grant
    Filed: November 26, 2014
    Date of Patent: January 16, 2018
    Assignee: Qorvo US, Inc.
    Inventors: George Maxim, Dirk Robert Walter Leipold, Baker Scott
  • Patent number: 9853619
    Abstract: A capacitance element body is configured by two or more capacitors, the capacitors being formed of a dielectric layer and at least three internal electrodes, the internal electrodes each being laminated via the dielectric layer and arranged to allow a center of gravity of an electrode body forming electrostatic capacitance to be arranged on a straight line in a lamination direction. In the capacitance element body, said two or more capacitors are serially connected in a lamination direction of the internal electrodes. Furthermore, external terminals, each being electrically connected to an electrode body forming electrostatic capacitance, are formed in side surfaces of the capacitance element body.
    Type: Grant
    Filed: August 21, 2012
    Date of Patent: December 26, 2017
    Assignee: DEXERIALS CORPORATION
    Inventor: Noritaka Sato
  • Patent number: 9812902
    Abstract: A system and a device for wirelessly transferring power without a cable are provided. A wireless electromagnetic receiver includes a first device configured to be magnetized based on an electromagnetic field. The wireless electromagnetic receiver further includes a second device configured to transform the magnetization of the first device into a power, the second device being not in contact with the first device.
    Type: Grant
    Filed: September 12, 2012
    Date of Patent: November 7, 2017
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Alexander G. Chernokalov, Nikolay N. Olyunin, Mikhail N. Makurin, Vladimir Y. Arkhipenkov, Ki Young Kim, Young Ho Ryu
  • Patent number: 9729121
    Abstract: The present invention discloses an LC tank capable of reducing electromagnetic radiation by itself and the manufacturing method of the same. An embodiment of said LC tank comprises: a first tank area whose boundary is defined by a first part of an inductance; a second tank area whose boundary is defined by a second part of the inductance in which the second part includes a gap; a cross-interconnection structure operable to electrically connect the first and second parts of the inductance and distinguish the first tank area from the second tank area; and at least one capacitance formed inside at least one of the first and second tank areas, wherein the area ratio of the first tank area to the second tank area is between 20% and 80%.
    Type: Grant
    Filed: March 9, 2015
    Date of Patent: August 8, 2017
    Assignee: REALTEK SEMICONDUCTOR CORPORATION
    Inventors: Chih-Yu Tsai, Kai-Yi Huang, Hsiao-Tsung Yen