Monolithic Structure Patents (Class 333/184)
  • Patent number: 10515740
    Abstract: A flame-retardant flat electrical cable has a magnesium oxide dielectric layer. A plurality of spaced apart substantially parallel electrical conductors generally lie in the same plane and extend along the length of the cable. A dielectric layer is disposed on the top and/or bottom sides of the cable and covers the conductors. The dielectric layer has at least 90% magnesium oxide by weight.
    Type: Grant
    Filed: July 2, 2018
    Date of Patent: December 24, 2019
    Assignee: 3M INNOVATIVE PROPERTIES COMPANY
    Inventors: Rui Yang, Ta-Hua Yu
  • Patent number: 10498094
    Abstract: A connector is equipped with a housing capable of being fitted in a mating connector, a plurality of terminals which are held in the housing and electrically connected to each other, and a noise reduction member or members which are held in the housing. The mating connector is connected to brunch lines among a trunk line and the brunch lines constituting an electric circuit. One of the plurality of terminals is a trunk-line connection terminal which is a pressure contact terminal and is electrically connected to the trunk line directly, and a remaining terminals are branch-line connection terminals which are male terminals or female terminals and are electrically connected to the respective branch lines when the housing is connected to the mating connector. The noise reduction member is not disposed at the trunk-line connection terminal, and the noise reduction member is disposed at the branch-line connection terminal.
    Type: Grant
    Filed: September 14, 2018
    Date of Patent: December 3, 2019
    Assignee: YAZAKI CORPORATION
    Inventor: Masashi Tsukamoto
  • Patent number: 10490357
    Abstract: A film capacitor includes a body including a core body formed of an insulating material and metalized films which are wound around the core body; and first and second terminal electrodes disposed on both end surfaces in an axial direction of the body, respectively, a cross section perpendicular to an axial direction, i.e., z direction, of the core body having an oval outer periphery having a major axis and a minor axis, and an inner periphery defining a slit extending along the major axis. The provision of the core body makes it possible to suppress loosening of the metalized films or occurrence of a gap between the metalized films, thus making the film capacitor having a high insulation property.
    Type: Grant
    Filed: September 21, 2016
    Date of Patent: November 26, 2019
    Assignee: KYOCERA CORPORATION
    Inventors: Youichi Yamazaki, Yoshihiro Nakao
  • Patent number: 10230147
    Abstract: A high-frequency signal transmission line includes a body; a signal line including a first line portion provided to a first layer of the body, a second line portion provided to a second layer of the body alternately being connected; and a first ground conductor provided to the first layer or a third layer positioned on an opposite side of the second layer relative to the first layer, and also overlaid with a plurality of second line portions in planar view from a normal direction of a principal surface of the body, and also not overlaid with a plurality of the first line portions. A property impedance of the first line portion and a property impedance of the second line portion are different from each other.
    Type: Grant
    Filed: September 7, 2016
    Date of Patent: March 12, 2019
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Noboru Kato, Satoshi Ishino, Jun Sasaki
  • Patent number: 10176927
    Abstract: A coil portion providing a common mode choke coil and a protection element portion providing ESD protection elements are disposed so as to be aligned in a lamination direction of a component body. The ESD protection elements are composed of a ground electrode and discharge electrodes each located so as to be spaced apart from the ground electrode at a predetermined interval. Capacitor electrodes are provided so as to be opposed to the discharge electrodes thereby to form capacitors, and the capacitors and coil conductors of the common mode choke coil form an LC filter. Accordingly, noise removal characteristics are caused to have higher attenuation and a wider band than with a mere inductor.
    Type: Grant
    Filed: April 21, 2016
    Date of Patent: January 8, 2019
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Minoru Matsunaga
  • Patent number: 10115515
    Abstract: A second coil opposes a first coil in a first direction. The first and second coils are positioned between a first conductor and a second conductor in the first direction. The first conductor is adjacent to the first coil in the first direction and overlaps a part of the first coil when viewed from the first direction. The second conductor is adjacent to the second coil in the first direction and overlaps a part of the second coil when viewed from the first direction. The first and second conductors are of a shape extending in a line. Inner regions of the first and second coils include regions not overlapping the first and second conductors when viewed from the first direction.
    Type: Grant
    Filed: September 13, 2016
    Date of Patent: October 30, 2018
    Assignee: TDK CORPORATION
    Inventors: Yuma Ishikawa, Takuo Hattori, Makoto Yoshino
  • Patent number: 10056311
    Abstract: An electronic circuit module includes a circuit board, electronic components, an embedding layer, and a conductive film. The circuit board has a first principal surface, a second principal surface and a side surface, and includes a pattern conductor and a via conductor. The conductive film is connected to a conduction path to a ground electrode. The side surface includes a first region, a second region having a longer circumferential length than the first region, and a connection region connecting the first region and the second regions. The conductive film is formed on a region including at least part of each of an outer surface of the embedding layer, the first region, and the connection region. The conductive film formed on at least part of the connection region is connected to an exposed portion in the connection region of the via conductor included in the conduction path to the ground electrode.
    Type: Grant
    Filed: July 20, 2017
    Date of Patent: August 21, 2018
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Yoshihito Otsubo, Muneyoshi Yamamoto, Norio Sakai
  • Patent number: 9986651
    Abstract: Methods and mechanisms for mitigating attenuation in a printed circuit board connection may include selecting the relative permittivities of resin layers proximate to the connection to control connection frequency resonances such that the attenuation of signals in the connection due to frequency resonance is mitigated.
    Type: Grant
    Filed: October 30, 2015
    Date of Patent: May 29, 2018
    Assignee: DELL PRODUCTS, LP
    Inventors: Bhyrav Mutnury, Sanjay Kumar, Vijendera Kumar, Jaya Gowri Anand Burji, Mallikarjun Goud Vasa
  • Patent number: 9948263
    Abstract: A multilayer electronic component includes a body including a dielectric layer and/or a magnetic layer, a terminal part including an input terminal, an output terminal, and a ground terminal connected to the body, and a filter part including a coil part disposed in the body and a capacitor part connected to the coil part and filtering a high frequency component of an input signal input to the input terminal. The capacitor part includes a plurality of first internal electrodes connected to the coil part and a plurality of second internal electrodes exposed to an exterior of the body.
    Type: Grant
    Filed: September 25, 2015
    Date of Patent: April 17, 2018
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Young Ghyu Ahn, Min Cheol Park, Byoung Hwa Lee, Dong Hwan Lee
  • Patent number: 9928952
    Abstract: A coil-embedded integrated circuit substrate includes a core substrate having an at least partially machined space formed herein, a coil disposed in the at least partially machined space, a filling material filling air gaps in a space around the coil in the at least partially machined space, and insulating layers formed on upper and lower surfaces of the core substrate.
    Type: Grant
    Filed: November 19, 2015
    Date of Patent: March 27, 2018
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventor: Jin Mo Ahn
  • Patent number: 9906203
    Abstract: A common mode filter in which at least one surface of all of external electrodes and ground electrodes are exposed to a first surface, at least one side of each of two of the external electrodes and at least one side of one of the ground electrodes contact a first side of the first surface, and at least one side of each of the external electrodes and the ground electrodes of which sides do not contact the first side contact a second side of the first surface, thereby making it possible to improve sticking strength and decrease a short-circuit phenomenon occurrence rate.
    Type: Grant
    Filed: November 25, 2014
    Date of Patent: February 27, 2018
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jeong Min Cho, Won Chul Sim, Hye Won Bang, Geon Se Chang, Kwang Mo Kim
  • Patent number: 9894768
    Abstract: A multilayer electronic component, a manufacturing method thereof, and a board having the same. The multilayer electronic component includes a plurality of magnetic metal layers, an internal conductive layer formed on the magnetic metal layer, an upper and lower cover layers formed on and below an active part including the plurality of magnetic metal layers and internal conductive layer. The multilayer electronic component may have excellent DC bias characteristics by using a magnetic metal material, implement low direction resistance (Rdc) by increasing a cross-sectional area of an internal coil, and secure high magnetic permeability while decreasing a core loss of the magnetic metal material to thereby improve efficiency characteristic.
    Type: Grant
    Filed: May 28, 2014
    Date of Patent: February 13, 2018
    Assignee: SAMSUNG ELECTRO-MECHANICS CO, LTD.
    Inventors: Ic Seob Kim, Soo Hwan Son, Yu Jin Choi, Ho Yoon Kim, Myeong Gi Kim, So Yeon Song, Min Kyoung Cheon, Byeong Cheol Moon, Young Il Lee
  • Patent number: 9893703
    Abstract: A multilayer electronic component includes a body including one or more ceramic layers or magnetic layers; an inductor part including coil portions disposed in the body to be perpendicular to a lower surface of the body; a plurality of internal electrodes disposed in the body to be perpendicular to the lower surface of the body; and an input terminal, an output terminal, and a ground terminal disposed on the lower surface of the body. The body includes a first capacitor part and a second capacitor part having different levels of capacitance. The first and second capacitor parts each include at least two among the plurality of internal electrodes and at least one of the ceramic layers or magnetic layers is interposed therebetween.
    Type: Grant
    Filed: September 29, 2015
    Date of Patent: February 13, 2018
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Young Ghyu Ahn, Byoung Hwa Lee, Min Cheol Park
  • Patent number: 9859054
    Abstract: A method of manufacturing an inductor includes a lamination step, a division step, a firing step, and a plating step. In the lamination step, a laminate including an insulator, a coil body, and external electrodes is formed. That is, in the lamination step, insulating layers having wide filling conductors, insulating layers having narrow filling conductors, and conductor patterns having external electrode patterns are laminated. As a result, the conductor patterns form the coil body, and the wide filling conductors, the narrow filling conductors, and the external electrode patterns form the external electrodes. The narrow filling conductors have a width that is less than the widths of the wide filling conductors and the external electrode patterns, and recesses and projections are provided in the external electrodes.
    Type: Grant
    Filed: February 26, 2015
    Date of Patent: January 2, 2018
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Kazuhiko Yamano
  • Patent number: 9843299
    Abstract: A multilayer electronic component includes: a body including one or more ceramic layers or magnetic layers; an inductor part including coil portions disposed in the body to be perpendicular to a lower surface of the body; a plurality of internal electrodes disposed in the body to be perpendicular to the lower surface of the body; and an input terminal, an output terminal, and a ground terminal disposed on the lower surface of the body, wherein the body includes a capacitor part comprising at least one among the plurality of internal electrodes and at least one among the coil portions with at least one of the ceramic layers or magnetic layers interposed therebetween.
    Type: Grant
    Filed: September 29, 2015
    Date of Patent: December 12, 2017
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Young Ghyu Ahn, Byoung Hwa Lee, Min Cheol Park
  • Patent number: 9787276
    Abstract: An electronic component includes a device body and first through n-th LC parallel resonators connected in series with each other. The first through n-th LC parallel resonators respectively include first through n-th inductors and first through n-th capacitors. The first through n-th inductors are disposed in a first direction in the device body in this order. The first and n-th inductors are provided with a spiral shape or a helical shape such that they turn around respective winding axes extending along a second direction which is perpendicular or substantially perpendicular or substantially perpendicular or substantially perpendicular to the first direction. At least one of the second through (n?1)-th inductors is provided with a helical shape such that it turns around a winding axis extending along the first direction.
    Type: Grant
    Filed: April 21, 2016
    Date of Patent: October 10, 2017
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Hiroshi Masuda, Tomoshiro Isoshima
  • Patent number: 9654079
    Abstract: A composite electronic component may include: a composite body including a capacitor formed of a ceramic body in which a plurality of dielectric layers and first and second internal electrodes are laminated, and an inductor formed of a magnetic body including a coil; an input terminal disposed on a first end surface of the composite body; output terminals including a first output terminal disposed on a second end surface of the composite body and a second output terminal disposed on the second end surface of the composite body; and a ground terminal disposed on one or more of upper and lower surfaces and the first end surface of the capacitor of the composite body. The capacitor is adjacent to the inductor.
    Type: Grant
    Filed: June 25, 2014
    Date of Patent: May 16, 2017
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Soo Hwan Son, Jin Woo Hahn, Joon Hwan Kwag, Kyoung No Lee, Myeong Gi Kim, Hwan Soo Lee
  • Patent number: 9520244
    Abstract: A composite electronic component may include: a composite element in which a capacitor and an inductor are spaced apart from each other, the capacitor including a ceramic body, and the inductor including a magnetic body; a first external electrode disposed on a second end surface of the ceramic body, second external electrodes disposed on first and second side surfaces of the ceramic body, a first dummy electrode disposed on a first end surface of the ceramic body; and third and fourth external electrodes disposed on first and second end surfaces of the magnetic body. The composite element may include a first metal frame disposed on a first end surface of the composite element, a second metal frame disposed on a second end surface of the composite element, and third metal frames disposed on one or more of first and second side surfaces of the composite element.
    Type: Grant
    Filed: July 17, 2014
    Date of Patent: December 13, 2016
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Min Cheol Park, Byoung Hwa Lee, Sang Soo Park, Young Ghyu Ahn
  • Patent number: 9514885
    Abstract: There is provided a composite electronic component including a composite body having a capacitor and an inductor coupled to each other, the capacitor including a ceramic body in which a plurality of dielectric layers and first and second internal electrodes facing each other with the dielectric layers interposed therebetween are stacked, and the inductor including a magnetic body including a coil part; a first input terminal; an output terminal; and a ground terminal.
    Type: Grant
    Filed: February 24, 2014
    Date of Patent: December 6, 2016
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jea Hoon Lee, Young Ghyu Ahn
  • Patent number: 9373435
    Abstract: A laminate has a structure in which magnetic layers and a non-magnetic layer containing glass are stacked. A coil is incorporated in the laminate. The magnetic permeability ?2 in portions (low-magnetic-permeability portions), of the magnetic layers, which are adjacent to the non-magnetic layer and into which the glass diffuses is lower than the magnetic permeability ?1 in portions (high-magnetic-permeability portions), of the magnetic layers, which are not adjacent to the non-magnetic layer.
    Type: Grant
    Filed: April 3, 2015
    Date of Patent: June 21, 2016
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Mitsuru Odahara
  • Patent number: 9013246
    Abstract: The embodiments described herein can provide improved signal feeding between hybrid couplers and associated transistors. As such, these embodiments can improve the performance of amplifiers and other such RF devices that utilize these components. In one embodiment a device includes a distribution network and a compensation resonator. The distribution network is configured to output a signal through a relatively wide output feedline. This relatively wide output feedline provides distributed signal feeding that can improve signal distribution and performance. The output feedline is coupled to the compensation resonator. In general, the compensation resonator is configured to resonate with the distribution network at the frequency band of the signal. Thus, the distribution network and compensation resonator together can provide improved signal distribution while maintaining performance at the frequencies of interest.
    Type: Grant
    Filed: August 1, 2013
    Date of Patent: April 21, 2015
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Damon G. Holmes, Jeffrey K. Jones, Joseph Staudinger, Michael E. Watts
  • Publication number: 20150042414
    Abstract: A composite electronic component may include: an input terminal part receiving power converted by a power managing part; a power stabilizing part stabilizing the power and including a composite body including a capacitor and a toroidal coil and having a hexahedral shape, the capacitor including a plurality of dielectric layers, internal electrodes disposed to face each other with the respective dielectric layers interposed therebetween, and capacitor electrodes electrically coupled to the internal electrodes, and the toroidal coil being wound around the capacitor, and the capacitor and the toroidal coil being embedded in a magnetic material of the composite body; and an output terminal part supplying the stabilized power.
    Type: Application
    Filed: August 7, 2014
    Publication date: February 12, 2015
    Inventors: Young Ghyu AHN, Sang Soo PARK, Min Cheol PARK, Byoung Hwa LEE
  • Publication number: 20150035621
    Abstract: A composite electronic component includes an input terminal portion receiving power converted by a power management unit, a power stabilizing unit stabilizing the power and including a composite body including a capacitor and a coil and having a hexahedral shape, the capacitor including a plurality of dielectric layers, internal electrodes disposed so as to face each other with a respective dielectric layer interposed therebetween, and capacitor electrodes electrically connected to the internal electrodes, and the coil being wound so as to encompass the capacitor and being buried in a magnetic material portion, and an output terminal portion supplying the stabilized power.
    Type: Application
    Filed: July 30, 2014
    Publication date: February 5, 2015
    Inventors: Young Ghyu AHN, Sang Soo PARK, Min Cheol PARK, Byoung Hwa LEE
  • Patent number: 8885376
    Abstract: A switching regulator IC contains both switching regulator circuitry and an inductor and a capacitor connected in parallel to form a resonant circuit having an associated notch filter frequency response arranged such that, when connected to receive the regulated output voltage, the resonant circuit attenuates the ripple component. This is accomplished by matching the resonant notch to the ripple's fundamental frequency, either manually or automatically. In addition, the resonant circuit's inductor and capacitor can act in concert with decoupling capacitors coupled to the load to form a low pass filter which attenuates harmonics of the ripple's fundamental frequency.
    Type: Grant
    Filed: May 31, 2012
    Date of Patent: November 11, 2014
    Assignee: Analog Devices, Inc.
    Inventors: Patrick J. Meehan, Thomas Conway, Aldrick Limjoco, Donal G. O'Sullivan
  • Publication number: 20140312991
    Abstract: The present invention provides a filter. The filter includes two common electrode layers and two inner electrode layers, where the two inner electrode layers are located between the two common electrode layers, and an electrical insulation layer is disposed between any two adjacent electrode layers of the two common electrode layers and the two inner electrode layers; each of the two common electrode layers is connected to at least one grounding electrode; and each of the two inner electrode layers is connected to at least one signal electrode. The filter provided by embodiments of the present invention can perform filtering processing on low-frequency noise such as that of a direct current power supply, and has a good filtering processing effect.
    Type: Application
    Filed: June 24, 2014
    Publication date: October 23, 2014
    Inventors: Bin Tan, Ronghua Xie
  • Patent number: 8675339
    Abstract: A feedthrough capacitor includes an inner electrode that extends coaxially within a grounded outer electrode. A non-conductive, epoxy-based potting material insulates and adhesively joins opposing roughened portions of the inner and outer electrodes. A capacitor assembly extends between the inner and outer electrode and serves to bypass relatively high frequency signals carried by the inner electrode to the grounded outer electrode. The capacitor assembly includes a plurality of monolithic multilayer ceramic capacitors, each capacitor having first and second terminals that are respectively surface mounted onto inner and outer concentric conductive rings. A plurality of deflectable tines project radially inward from the inner ring and resiliently circumferentially contact the exterior of the inner electrode. Similarly, a plurality of deflectable tines project radially outward from the outer ring and resiliently circumferentially contact the interior of the outer electrode.
    Type: Grant
    Filed: May 8, 2012
    Date of Patent: March 18, 2014
    Inventor: George M. Kauffman
  • Publication number: 20130051081
    Abstract: A line filter for a switching power supply including a rectifier unit configured to rectify an AC voltage, a transformer configured to transform the voltage rectified by the rectifier unit to output a resultant voltage, a switching unit configured to drive the transformer, and a radiation unit configured to radiate heat generated during operation of the switching unit includes two capacitive elements connected in series between voltage supply lines to which the rectifier unit and the transformer are connected, and a current path configured to allow a noise current to flow between the transformer and the capacitive element.
    Type: Application
    Filed: August 27, 2012
    Publication date: February 28, 2013
    Applicant: CANON KABUSHIKI KAISHA
    Inventor: Aoji Isono
  • Publication number: 20120313729
    Abstract: An LC composite component is provided in which a capacitor section and an inductor section are alternately stacked in layers in the layering direction; either the capacitor section or the inductor section is disposed on both a first element body principal face side and a second element body principal face side; a first coil wire path portion and a second coil wire path portion are connected to an external conductor interposed between an external conductor near a first element body end face and an external conductor near a second element body end face in a first external conductor group; and the first coil wire path portion and the second coil wire path portion form a coil which is wound in a helical fashion along the layering direction.
    Type: Application
    Filed: May 24, 2012
    Publication date: December 13, 2012
    Applicant: TDK CORPORATION
    Inventor: Masaaki TOGASHI
  • Patent number: 8324980
    Abstract: A device to attenuate EMI between a source and a load is provided. The device includes a first cable to electrically couple the source and the load and a second cable positioned adjacent to the first cable and configured to attenuate a common-mode current.
    Type: Grant
    Filed: February 27, 2009
    Date of Patent: December 4, 2012
    Assignee: General Electric Company
    Inventors: Michael Joseph Schutten, Rajib Datta, Joseph Taher Mossoba
  • Patent number: 8193889
    Abstract: A filter appliance comprises first electrical terminals (201-203) for connecting to a multiphase electrical converter device, second electrical terminals (204-206) for connecting to a load, main current coils formed of foil conductors and connected between the first and the second electrical terminals, and shielding coils whose first ends are electrically connected to a third electrical terminal (219) of the filter appliance. Each of the shielding coils is formed of foil conductor that is alongside and a distance apart from the foil conductor of the corresponding main current coil so as to form a capacitive shield between successive turns of the main current coil. When the third electrical terminal is connected to constant electrical potential, the shielding coils reduce the common mode voltage applied to the load and, for example, a risk of bearing damages in an electrical motor driven by a multiphase electrical converter device is reduced.
    Type: Grant
    Filed: May 12, 2010
    Date of Patent: June 5, 2012
    Assignee: The Switch Drive Systems Oy
    Inventors: Juha Jaakko Pyrhönen, Pertti Tapani Silventoinen, Mikko Pekka Juhani Kuisma, Valentin Dzhankhotov
  • Patent number: 8130052
    Abstract: The present invention is intended to efficiently implement noise countermeasures for a semiconductor circuit board and for a semiconductor circuit. The present invention is constituted by a control substrate, and a semiconductor circuit connected to the control substrate. The semiconductor circuit includes a substrate, an integrated circuit group, and a noise countermeasure, and is separated from the control substrate. The integrated circuit group includes an integrated circuit as a noise source. The substrate has a stacked multilayer structure, and shifts the frequency of a noise generated by the integrated circuit group to the high frequency side. The noise countermeasure is connected between the integrated circuit group and the control substrate. The noise countermeasure is a filter for attenuating the high frequency of a noise.
    Type: Grant
    Filed: June 13, 2005
    Date of Patent: March 6, 2012
    Assignee: Daikin Industries Ltd.
    Inventors: Takashi Okano, Masaya Nishimura, Shuhei Kawamura
  • Patent number: 8120142
    Abstract: An electronic circuit includes a filtering circuit implemented with a distributed inductor-and-capacitor (LC) network that includes metal oxide effect (MOS) trenches opened in a semiconductor substrate filled with dielectric material for functioning as capacitors for the distributed LC network. The electronic circuit further includes a transient voltage suppressing (TVS) circuit integrated with the filtering circuit that functions as a low pass filter wherein the TVS circuit includes a bipolar transistor triggered by a diode disposed in the semiconductor substrate. The distributed LC network further includes metal coils to function as inductors disposed on a top surface of the semiconductor electrically contacting the MOS trenches.
    Type: Grant
    Filed: April 18, 2008
    Date of Patent: February 21, 2012
    Assignee: Alpha & Omega Semiconductor, Ltd.
    Inventor: Madhur Bobde
  • Patent number: 8058951
    Abstract: A configuration includes a first sheet substrate, on which a first thin film electronic component is formed on at least one main face, and an external connection terminal for connecting to an external circuit is formed one main face or the other face; a second sheet substrate, on which a second thin film electronic component is formed on at least one face; an insulator connection resin layer for fixing the first sheet substrate and the second sheet substrate opposing the first thin film electronic component against the second thin film electronic component; and an interlayer connection conductor for electrically connecting electrode terminals, which have been set in advance, of the first thin film electronic component and the second thin film electronic component.
    Type: Grant
    Filed: September 22, 2006
    Date of Patent: November 15, 2011
    Assignee: Panasonic Corporation
    Inventors: Kenichi Yamamoto, Daido Komyoji, Keizaburo Kuramasu
  • Patent number: 8022575
    Abstract: Exemplary embodiments of the present disclosure provide a method and controller for damping multimode electromagnetic oscillations in electric power systems which interconnect a plurality of generators and consumers. The controller for damping such oscillations includes a phasor measurement unit (PMU) and a power oscillation damper (POD) controller. Each oscillating mode signal is damped and then superposed to derive a control signal. A feedback controller is used to feedback the control signal to a power flow control device in the power system.
    Type: Grant
    Filed: September 16, 2009
    Date of Patent: September 20, 2011
    Assignee: ABB Research Ltd
    Inventors: Petr Korba, Mats Larsson
  • Patent number: 7800462
    Abstract: A printed board is mounted with a chip-type solid electrolytic capacitor of a four-terminal structure where a pair of positive electrode terminals are disposed at opposite positions and a pair of negative electrode terminals are disposed at opposite positions on a mounting surface. The printed board has a pair of positive electrode patterns and a pair of negative electrode patterns to which the positive electrode terminals and negative electrode terminals of the chip-type solid electrolytic capacitor are connected, respectively. The printed board further has an inductor section that is insulated from the negative electrode patterns, and electrically connects the positive electrode patterns.
    Type: Grant
    Filed: March 16, 2009
    Date of Patent: September 21, 2010
    Assignee: Panasonic Corporation
    Inventors: Junichi Kurita, Kenji Kuranuki, Youichi Aoshima, Hiroshi Higashitani, Tsuyoshi Yoshino
  • Publication number: 20090243758
    Abstract: A power conditioning circuit for conditioning power supplied by a power source at a nominal frequency over conductors in a polyphase system includes first and second phase conductors. First and second inductors are connected in series between the first and second phase conductors and first and second phase output lines, wherein all of the power supplied by the power source to the first and second phase output lines flows through the first and second inductors. An inductance of each of the first and second inductors increases when power at frequencies greater than the nominal frequency flows through the first and second phase conductors, thereby blocking power at frequencies greater than the nominal frequency from reaching the first and second phase output lines.
    Type: Application
    Filed: March 16, 2009
    Publication date: October 1, 2009
    Inventors: Michael W. Januszewski, James E. Redburn, II, James E. Redburn, III, Leonard E. Webster, John E. MacCrisken
  • Publication number: 20090146760
    Abstract: The chip (100) comprises a network of trench capacitors (102) and an inductor (114), wherein the trench capacitors (102) are coupled in parallel with a pattern of interconnects (113A,B, . . . ) that is designed so as to limit generation of eddy current induced by the inductor (114) in the interconnects (113A,B, . . . ). This allows the use of the chip (100) as a portion of a DC-DC converter, that is integrated in an assembly of a first chip and this—second chip (100). The inductor of this integrated DC-DC converter may be defined elsewhere within the assembly.
    Type: Application
    Filed: May 14, 2007
    Publication date: June 11, 2009
    Applicant: NXP B.V.
    Inventors: Derk Reefman, Roozeboom Freddy, Johan H. Klootwijk
  • Publication number: 20090051466
    Abstract: A power source IC and noise absorption capacitors (decoupling capacitors) are formed on an inductor in such a manner that the noise absorption capacitors are provided on the input side and the output side, respectively. A micro-power source module can'thus be provided which is small in occupied area and height and can reduce conduction noise due to ground lines.
    Type: Application
    Filed: August 5, 2008
    Publication date: February 26, 2009
    Applicant: Fuji Electric Device Technology Co., Ltd
    Inventor: Kenichi Nishijima
  • Publication number: 20080316335
    Abstract: A method and apparatus for minimizing noise pickup in iSoC sensors using an improved Analog Capacitor Memory (ACM) design and optimized timing methods that together prevent direct connection of the electrical grounds between the low-speed signal processing circuit and high-speed signal processing circuit of an imaging System-on-Chip sensor. The ACM includes a two-terminal capacitor and two pairs of terminals. Each pair of terminals is connected via switches to separate circuits. The switches are controlled to isolate one side of the ACM from the other, thereby reducing the noise pickup between the circuits.
    Type: Application
    Filed: June 20, 2007
    Publication date: December 25, 2008
    Inventor: Giuseppe Rossi
  • Patent number: 7432784
    Abstract: A noise filter has an element body, first to fourth terminal electrodes, and a connection conductor. The first to fourth terminal electrodes are disposed on the exterior of the element body. The connection conductor is also disposed on the exterior of the element body. A capacitor is formed in the element body and is electrically connected between the first and second terminal electrodes and the third and fourth terminal electrodes. The first and second terminal electrodes are electrically connected through the connection conductor. The connection conductor is covered by a resin containing ferrite. Since the connection conductor is covered by the resin containing ferrite, the connection conductor and the ferrite-containing resin function as a ferrite bead inductor.
    Type: Grant
    Filed: January 19, 2007
    Date of Patent: October 7, 2008
    Assignee: TDK Corporation
    Inventor: Masaaki Togashi
  • Publication number: 20080084254
    Abstract: An inductance device comprises a magnetic core, a coil a conductor and a dielectric member. The coil is made of turns of insulated conductive wire. The conductor is distinct from the coil and is insulated from the magnetic core. The dielectric member is disposed between the conductor and the coil. The dielectric member, the conductor and the coil constitute a capacitor. The inductance device is used in, for example, a filter device or a noise filter.
    Type: Application
    Filed: October 9, 2007
    Publication date: April 10, 2008
    Applicant: NEC TOKIN Corporation
    Inventors: Masahiko Takahashi, Hiroshi Ono, Satoshi Arai, Teruhiko Fujiwara
  • Patent number: 7355493
    Abstract: A filter element includes a coil part formed in an overall tubular shape by layering a pair of signal transmitting belt-shaped conductors and a grounding belt-shaped conductor with a belt-shaped insulator in between and winding so that the grounding belt-shaped conductor is outside a pair of signal transmitting belt-shaped conductors, a magnetic body attached to a center of the coil part; a pair of input terminals that are connected to respective outermost circumferential parts of the pair of signal transmitting belt-shaped conductors and are respectively led from outer circumferential positions of the coil part; a pair of output terminals that are connected to respective innermost circumferential parts of the pair of signal transmitting belt-shaped conductors and are respectively led from central positions of the coil part located on an opposite side to leading positions of the pair of input terminals with the magnetic body in between; and a grounding terminal that is connected to an outermost circumferentia
    Type: Grant
    Filed: October 31, 2006
    Date of Patent: April 8, 2008
    Assignee: Hioki Denki Kabushiki Kaisha
    Inventors: Koichi Yanagisawa, Fuchun Zhang
  • Patent number: 7336144
    Abstract: A compact multilayer band-pass filter using an interdigital capacitor which can be integrated into a compact form in a relatively low frequency band. The band-pass filter filters only a signal of a predetermined frequency band from a signal applied through an input terminal, and outputs a filtered signal to an output terminal. The band-pass filter includes at least one pair of transmission lines, respectively formed between the input terminal and the output terminal provided on an uppermost layer, for generating an inductor component, a capacitance compensation unit, with the interdigital capacitor having a plurality of layers, for loading a specified capacitance to one end of the transmission line, and a ground layer coupled to a specified layer of the capacitance compensation unit and the other end of the transmission line and formed on a lowermost layer.
    Type: Grant
    Filed: February 11, 2005
    Date of Patent: February 26, 2008
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Seong-soo Lee, Jin-soo Park, Yong-jun Kim
  • Patent number: 7307495
    Abstract: An electrical filter assembly including a housing; at least one electrical wire extending into the housing; and a filter subassembly on the housing, the filter subassembly comprising a lead frame and a filter circuit connected to the lead frame. The filter circuit has a plurality of capacitors attached to the lead frame as a modular block. The lead frame comprises at least one insulation displacement contact section which makes electrical connection with the at least one electrical wire.
    Type: Grant
    Filed: June 6, 2005
    Date of Patent: December 11, 2007
    Assignee: FCI Americas Technology, Inc.
    Inventors: Raymond Bruce McLauchlan, William R. Lyons, Joshy Thomas, Richard A. Schmidt, Jr., Michael S. Glick, Phillip G. Seminara, Cecil Brown
  • Patent number: 7277270
    Abstract: An objective is to provide a multilayer filter capable of preventing an electric current rapidly flowing by virtue of varistor effect, from passing as noise, upon application of noise of a high voltage over a varistor voltage to its input. A multilayer filter has an inductor part 10 and a varistor part 20 in a laminate 2, and the inductor part 10 has the DC resistance of 4 ?-100 ?. This prevents an electric current rapidly flowing by virtue of the varistor effect, from passing as noise, upon application of noise of a high voltage over the varistor voltage to the input.
    Type: Grant
    Filed: September 22, 2006
    Date of Patent: October 2, 2007
    Assignee: TDK Corporation
    Inventors: Takahiro Sato, Kentaro Yoshida, Masashi Orihara, Shumi Kumagai
  • Patent number: 7262675
    Abstract: Disclosed herein is a laminated filter with improved stop band attenuation, which is adopted in devices using a radio frequency, such as communication systems and/or broadcasting systems. The laminated filter forms cross capacitive coupling as feeding lines of input lead and/or output lead are coupled to a resonator pattern, and enhances an attenuation characteristic of stop band. Also, the laminated filter is minimized if feeding lines of the input lead and output lead are aligned in different layers, and the positions of the attenuation poles are easily controlled by adjusting the feeding line length.
    Type: Grant
    Filed: May 11, 2005
    Date of Patent: August 28, 2007
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Dong Hwan Lee, Sung Yeol Park, Ki Pyo Hong, Hee Soo Yoon
  • Patent number: 7148768
    Abstract: A filter element includes a coil part formed in an overall tube-like shape by layering a signal transmitting belt-like conductor and a grounding belt-like conductor with a belt-like insulator in between and winding so that the grounding belt-like conductor is outside the signal transmitting belt-like conductor, a magnetic body being attached to a center of the coil part; an input terminal that is connected to an outermost circumferential part of the signal transmitting belt-like conductor and is led from an outer circumferential position of the coil part; an output terminal that is connected to an innermost circumferential part of the signal transmitting belt-like conductor and is led from a central position of the coil part located on an opposite side to a leading position of the input terminal with the magnetic body in between; and a grounding terminal that is connected to an outermost circumferential part of the grounding belt-like conductor and is led from an outer circumferential position of the coil par
    Type: Grant
    Filed: August 20, 2004
    Date of Patent: December 12, 2006
    Assignee: Hioki Denki Kabushiki Kaisha
    Inventors: Koichi Yanagisawa, Fuchun Zhang
  • Patent number: 7109825
    Abstract: A passive device and a module for a transceiver are provided. The passive device for a transceiver includes a semiconductor substrate or a dielectric substrate, at least one capacitor, a dielectric layer, at least one inductor, a via hole, a metal electrode, radio frequency signal lines, and a radio frequency ground. The at least one capacitor is formed on the substrate. The dielectric layer is formed on the capacitor and the substrate. The at least one inductor is formed on the dielectric layer. The via hole penetrates through the dielectric layer. The metal electrode is formed in the via hole and electrically connects the capacitor and the inductor. The radio frequency signal lines are for the inductor and the capacitor. The radio frequency ground is formed on the substrate and isolated from the radio frequency signal lines. A reduction in the area required for mounting passive devices and modules thereof contributes to the downsizing of communication systems.
    Type: Grant
    Filed: September 30, 2002
    Date of Patent: September 19, 2006
    Assignee: Samsung Electronics Co., Ltd.
    Inventor: Insang Song
  • Patent number: 7091800
    Abstract: A noise filter in which the resonance of noise can be prevented, which is small in size and inexpensive, and is useful especially in an electronic device of which the signal frequency exceeds 100 MHz. In the noise filter, ground conductors are arranged on the outermost layers of a laminate formed by lamination of magnetic sheets and firing thereof. Transmission lines and ground conductors are alternately arranged with the magnetic sheets being sandwiched between them, respectively. Signal electrodes connected to the transmission lines and ground electrodes connected to the ground conductors are formed on the outer surface of the laminate. Thus, a signal is transmitted through the transmission lines while the ground conductors are grounded, and therefore, high frequency noise can be attenuated by utilization of heat loss caused by the magnetic sheets.
    Type: Grant
    Filed: June 12, 2002
    Date of Patent: August 15, 2006
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Hidetoshi Yamamoto, Katsuyuki Uchida, Kousuke Ishida
  • Patent number: 7042703
    Abstract: An energy conditioning structure comprised of any combination of multilayer or monolithic energy conditioners with operable conductors, all selectively arranged and shielded for attachment to at least a conductive substrate.
    Type: Grant
    Filed: May 12, 2003
    Date of Patent: May 9, 2006
    Assignee: X2Y Attenuators, LLC
    Inventors: Anthony Anthony, William Anthony