Smoothing Type (e.g., Direct Current Power Supply Filters Or Decoupling Filters) Patents (Class 333/181)
  • Patent number: 10525690
    Abstract: A method of manufacturing an inductor core includes controlling a flow of magnetic material and a flow of binder material to a nozzle such that the flow magnetic material merges with the flow of binder material at a focal point of a preheater, preheating the magnetic material and the binder material by energizing the preheater, mixing the magnetic material and the binder material according to a ratio based on a magnetic permeability distribution of the inductor core, and depositing the magnetic material and the binder material on a surface to form the inductor core having three layers with recessed patterns defined between the layers for receiving a coil.
    Type: Grant
    Filed: September 7, 2016
    Date of Patent: January 7, 2020
    Assignee: GENERAL ELECTRIC COMPANY
    Inventors: Ruxi Wang, Manoj Ramprasad Shah, Ramanujam Ramabhadran, Yanzhe Yang
  • Patent number: 10499229
    Abstract: Techniques are disclosed for increasing the reliability of transferring data via in-band signaling in a audio channel of a communication network. Techniques include causing an audio decoding process to modify the decoding of audio signals for the audio channel based on obtaining an indication of in-band signaling. The modified decoding may replace an adaptive de-jitter buffer by a static de-jitter buffer or increase the buffering time of an adaptive de jitter buffer. The decoded audio signals may be provided to an in-band message detector, an audio encoder or an audio playback device based on the indication of in-band signaling. The techniques may be employed by a user equipment, a media gateway control function or a media gateway to improve the reliability of in-band transfer of a minimum set of data (MSD) for a Next Generation eCall.
    Type: Grant
    Filed: June 24, 2016
    Date of Patent: December 3, 2019
    Assignee: QUALCOMM Incorporated
    Inventors: Stephen William Edge, Nikolai Leung
  • Patent number: 10491180
    Abstract: A board-type noise filter having higher noise removal performance than that of a conventional noise filter, and an electronic device including the board-type noise filter are provided. The board-type noise filter includes: a printed wiring board having a wiring pattern formed thereon; a choke coil including a core having a toroidal shape; a frame ground portion fixed to the printed wiring board at a position overlapping with a hollow portion of the choke coil when the toroidal shape of the choke coil is seen in plan view, the frame ground portion being capable of being grounded to a frame ground; and a capacitor having a first terminal connected to the frame ground portion through the wiring pattern.
    Type: Grant
    Filed: April 27, 2016
    Date of Patent: November 26, 2019
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Kazuya Yamamoto, Takashi Kumagai
  • Patent number: 10432161
    Abstract: A band-pass filter includes a main body formed of a dielectric, a plurality of resonators, a shield, and a partition formed of a conductor. Each of the plurality of resonators includes a resonator conductor portion. The resonator conductor portion has a first end and a second end opposite to each other in the longitudinal direction. The first end is connected to a ground, and the second end is open. The partition extends to pass through between the respective resonator conductor portions of two resonators, and is electrically connected to the shield.
    Type: Grant
    Filed: January 23, 2018
    Date of Patent: October 1, 2019
    Assignee: TDK CORPORATION
    Inventors: Yuta Ashida, Naoki Sotoma, Shigemitsu Tomaki, Yasuyuki Hiwatashi
  • Patent number: 10404229
    Abstract: An EMI filtering, coaxial power connector may be formed as an inline component or a port of a device. The connector may have dimensions to accept F-type coaxial connectors. The connector includes a conductive outer shell with a first opening and a second opening. A dielectric member is disposed within the shell. A conductive pin is supported by the dielectric member. A feed-through capacitor has a central opening and a first lead formed within the central opening. The pin is electrically connected to the first lead. A second lead of the capacitor is formed at an outer perimeter of the capacitor and is electrically connected to the shell. A metal plate is mounted within the shell. The plate is disk-shaped with a central hole. An outer perimeter of the plate is in electrical contact with the shell. The pin passes through the central hole without making electrical contact with the plate, and the plate resides between the second opening of the shell and the capacitor.
    Type: Grant
    Filed: June 30, 2017
    Date of Patent: September 3, 2019
    Assignee: CommScope Technologies LLC
    Inventors: Shi Man Li, Chi Tsung Yang, Chien Chung Lee
  • Patent number: 10389328
    Abstract: Disclosed herein is a differential mode filter that includes first and second terminal electrodes provided on a first flange part of a core, and first and second wires wound around a winding core part of the core in an opposite direction to each other and connected respectively to the first and second terminal electrodes. The first and second wires cross each other on the winding core part to form a plurality of crossing portions that include first, second, and third crossing portions that are first, second, and third occurrences counting from the one end of the first and second wires, respectively. A first crossing angle between the first and second wires at the first crossing portion is larger than at least one of second and third crossing angles between the first and second wires at the second and third portions, respectively.
    Type: Grant
    Filed: October 3, 2017
    Date of Patent: August 20, 2019
    Assignee: TDK CORPORATION
    Inventors: Tsutomu Kobayashi, Toshio Tomonari, Emi Ito, Yuma Komaya
  • Patent number: 10366822
    Abstract: A method of manufacturing a winged coil structure is provided. The method includes preparing an upper flexible plate having a middle region and two side regions bordering the middle region; preparing a dielectric layer with a lateral size of the dielectric layer being the same as a lateral size of the middle region of the upper flexible plate; preparing a lower flexible plate having a middle region and two side regions bordering the middle region; preparing a bottom flexible plate attached to the lower surface of the lower flexible plate to form a stack body; and performing a process of thermal pressing to sequentially from bottom to top stack and combine the stack body, the dielectric layer, and the upper flexible plate as a multiple layered stack structure via a press mold.
    Type: Grant
    Filed: February 20, 2019
    Date of Patent: July 30, 2019
    Assignee: KINSUS INTERCONNECT TECHNOLOGY CORP.
    Inventors: Ting-Hao Lin, Chiao-Cheng Chang, Yi-Nong Lin
  • Patent number: 10305441
    Abstract: A common mode noise filter includes first to fourth insulator layers stacked in a stacking direction and first to third coils provided on the first to fourth insulator layers independently of one another. The first coil includes a first coil conductor provided on the first insulator layer and a second coil conductor provided on the fourth insulator layer and connected to the first coil conductor. The second coil is provided on the second insulator layer. The third coil is provided on the third insulator layer. The first coil conductor overlaps the second coil viewing from above. At least a part of the second coil overlaps at least a part of the third coil viewing from above. The second coil conductor overlaps the third coil viewing from above.
    Type: Grant
    Filed: December 7, 2015
    Date of Patent: May 28, 2019
    Assignee: Panasonic Intellectual Property Management Co., Ltd.
    Inventors: Yoshiharu Omori, Kenichi Matsushima, Masakatsu Nawate, Ryohei Harada, Kenji Ueno
  • Patent number: 10256030
    Abstract: A winged coil structure and a method of manufacturing the same are disclosed. The winged coil structure includes an upper flexible plate, at least one upper magnetic induction coil, at least one upper connection pad, a lower flexible plate, at least one lower magnetic induction coil, at least one lower connection pad, at least one gold finger, a dielectric layer and at least one connection plug. The connection plug connects the upper connection pad and the lower connection pad through thermal pressing such that the gold finger, the upper magnetic induction coil, the upper connection pad, the lower connection pad, the connection plug, the lower connection pad and the lower magnetic induction coil are electrically connected. The upper flexible plate is provided with notched lines to be easily bent without damage to the upper and lower magnetic induction coils. Thus, a bendable feature for magnetic induction coils is provided.
    Type: Grant
    Filed: November 13, 2017
    Date of Patent: April 9, 2019
    Assignee: KINSUS INTERCONNECT TECHNOLOGY CORP.
    Inventors: Ting-Hao Lin, Chiao-Cheng Chang, Yi-Nong Lin
  • Patent number: 10230296
    Abstract: Systems and methods for reducing low frequency (e.g., 100 Hz, 120 Hz) output ripple of a power converter which receives input power from an AC power source (e.g., AC mains). An output ripple reduction circuit is provided which is electrically coupled between an output of a power converter and a load (e.g., one or more LEDs). The output ripple reduction circuit comprises a transformer having a first winding and a second winding each wrapped around a core. The first winding has a first terminal electrically coupled to an output of the power converter and a second terminal coupled to a capacitor to form a first LC circuit. The second winding has a first terminal electrically coupled to a load and a second terminal coupled to the capacitor to form a second LC circuit.
    Type: Grant
    Filed: September 19, 2017
    Date of Patent: March 12, 2019
    Assignee: EXPRESS IMAGING SYSTEMS, LLC
    Inventor: William G. Reed
  • Patent number: 10229785
    Abstract: An improved capacitor utilizing stacked MLCC's is provided. The capacitor comprising at least one MLCC sandwiched between a first lead and a second lead. Each lead comprises at least one integral lead crimp.
    Type: Grant
    Filed: December 4, 2013
    Date of Patent: March 12, 2019
    Assignee: KEMET Electronics Corporation
    Inventors: John E. McConnell, Alan P. Webster, Lonnie G. Jones, Garry L. Renner, Jeffrey W. Bell
  • Patent number: 10218259
    Abstract: In a power converter having a semiconductor switch, common-mode noise is effectively reduced by setting the common-mode inductance value of reactors which are inserted into both lines such that the resonance frequency of the combined capacity of a line-to-ground bypass capacitor and the reactors which are inserted into both lines becomes a predetermined value or more.
    Type: Grant
    Filed: August 22, 2014
    Date of Patent: February 26, 2019
    Assignee: Mitsubishi Electric Corporation
    Inventors: Tetsuro Fujiwara, Keita Takahashi
  • Patent number: 10210986
    Abstract: An inductor includes a magnetic core lying in a core plane. The magnetic core includes a vertical laminated structure with respect to the core plane of alternating ferromagnetic vertical layers and insulator vertical layers. An easy axis of magnetization can be permanently or semi-permanently fixed in the ferromagnetic vertical layers along an axis orthogonal to the core plane. Methods of manufacturing same are also disclosed.
    Type: Grant
    Filed: December 27, 2016
    Date of Patent: February 19, 2019
    Assignee: Ferric, Inc.
    Inventors: Noah Sturcken, Ryan Davies, Hao Wu, Michael Lekas
  • Patent number: 10205429
    Abstract: An object is to provide an output-noise reduction device that can prevent noise from an electronic device accommodated in a metal casing from being transmitted due to electromagnetic coupling. An output voltage is extracted to the outside through a conducting bar. A magnetic body core includes a through hole through which the conducting bar is inserted. A chip capacitor is mounted on a mounting board and connects between the output terminal VO and ground potential. A section from the output terminal VO to at least part of the chip capacitor mounted on the mounting board is isolated from the electromagnetic coupling from the electronic device. Thus, noise is prevented from being transmitted to the output terminal VO.
    Type: Grant
    Filed: September 21, 2016
    Date of Patent: February 12, 2019
    Assignee: KITAGAWA INDUSTRIES CO., LTD.
    Inventors: Tomokazu Tanimizu, Kazushige Ueno, Katsuyuki Morita, Yoshinori Ohashi
  • Patent number: 10200005
    Abstract: An object is to provide an output-noise reduction device in which a component encapsulated through insert molding can be appropriately protected. In a noise filter module (output-noise reduction device), a conducting bar and a magnetic body core are protected with a molded member formed through insert molding. The molded member is formed of a resin material with a molding shrinkage rate of 0.5% or less. Thus, the amount of shrinkage after the molded member is molded and stress as a result of the shrinkage can be made small, whereby damage on the magnetic body core, deformation of a lead frame, and the like can be prevented from occurring.
    Type: Grant
    Filed: September 20, 2016
    Date of Patent: February 5, 2019
    Assignee: KITAGAWA INDUSTRIES CO., LTD.
    Inventors: Tomokazu Tanimizu, Kazushige Ueno, Katsuyuki Morita
  • Patent number: 10192676
    Abstract: A noise filter includes a plurality of inductor elements connected with one another in series. The inductor element includes a ring-shaped magnetic core, a winding wound around the magnetic core, and a ground terminal disposed between the magnetic core and the winding, the ground terminal being connected to a ground. The ground terminal includes a conductive part that surrounds at least a part of an outer periphery of the magnetic core.
    Type: Grant
    Filed: June 3, 2016
    Date of Patent: January 29, 2019
    Assignee: NEC TOKIN CORPORATION
    Inventor: Yusuke Ohdaira
  • Patent number: 10134529
    Abstract: A composite electronic component includes an electronic element mounted on a resistance element in a height direction. The electronic element includes an electronic element body, and first and second external electrodes separated from each other in a length direction. The resistance element includes a base portion, a resistor disposed on an upper surface of the base portion, and first and second upper surface conductors on the upper surface of the base portion. The first and second upper surface conductors are separated from each other in the length direction, and the resistor is located between the first and second upper surface conductors. A dimension in the height direction of the resistor is smaller than both a dimension in the height direction of the first external electrode of a portion located on a lower surface of the electronic element body, and a dimension in the height direction of the second external electrode of a portion located on a lower surface of the electronic element body.
    Type: Grant
    Filed: July 8, 2016
    Date of Patent: November 20, 2018
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Kazuo Hattori, Isamu Fujimoto, Shinichiro Kuroiwa
  • Patent number: 10115516
    Abstract: The present invention relates to a planar inductor for progressive case hardening, comprising a carrier and an induction coil, which is accommodated by the carrier and exposed on a first side of the carrier and which is in the form of a conductor loop. According to the invention, the inductor comprises two spacing elements, which are space apart from one another and inserted into the carrier and which protrude from the carrier and beyond the conductor loop on the first side. The invention further relates to a preferred method for producing the planar inductor.
    Type: Grant
    Filed: January 28, 2014
    Date of Patent: October 30, 2018
    Assignee: THYSSENKRUPP ROTHE ERDE GMBH
    Inventors: Marco Burtchen, Mathieu Raymond Karl Langels
  • Patent number: 10042133
    Abstract: A first conductive layer includes a first signal wiring including, at a position except for an end portion, a wide portion having a width wider than that of the other portion. A second conductive layer includes a signal electrode electrically continuous with the end portion of the first signal wiring, a first ground plane overlapping the wide portion, and a ground terminal. A third conductive layer includes a second signal wiring including an end portion overlapping and bonded to the signal electrode, and a ground electrode overlapping and bonded to the ground terminal. A fourth conductive layer includes a second ground plane. The second ground plane includes a through hole overlapping the end portion of the second signal wiring. A fifth conductive layer includes a third groundplane. The third groundplane overlaps the end portion of the second signal wiring inside the through hole.
    Type: Grant
    Filed: November 1, 2016
    Date of Patent: August 7, 2018
    Assignee: Oclaro Japan, Inc.
    Inventors: Daisuke Noguchi, Sachiko Mizuseki, Norimichi Shibuya, Hiroshi Yamamoto
  • Patent number: 9978508
    Abstract: A surface mount swing-type inductor component is configured to establish a non-uniform gap when assembled. The non-uniform gap produces swing-type inductor functionality in a compact package for higher current applications while being manufacturable at relatively low cost.
    Type: Grant
    Filed: February 26, 2016
    Date of Patent: May 22, 2018
    Assignee: EATON INTELLIGENT POWER LIMITED
    Inventors: Yipeng Yan, Robert James Bogert
  • Patent number: 9960700
    Abstract: In an electronic apparatus, a case houses an electronic apparatus main body and is electrically conductive. A terminal block is attached to a case wall of the case. In the terminal block, a main body portion is composed of an insulating material. An external terminal is inserted into a through-hole formed in the case wall, and is connected to the electronic apparatus main body. A capacitor is disposed inside the main body portion. An elastic member is disposed inside the main body portion, is composed of a conductive material, is interposed at least one of between the capacitor and the external terminal, and between the capacitor and the case wall, and fixes the capacitor inside the main body portion by pressing the capacitor. The capacitor and the elastic member configure a filter circuit that allows a noise current included in the external terminal to flow to the case wall.
    Type: Grant
    Filed: November 23, 2016
    Date of Patent: May 1, 2018
    Assignee: DENSO CORPORATION
    Inventor: Keiichi Ando
  • Patent number: 9948265
    Abstract: An inductor capacitor (LC) tank includes a first inductor and a first tunable capacitive array. The first inductor has a first terminal and a second terminal, and the first tunable capacitive array has a first terminal and a second terminal. The first tunable capacitive array is at a path branching from a first point between the first terminal and the second terminal of the first inductor, the first terminal of the first tunable capacitive array is coupled to the first point, and the second terminal of the first tunable capacitive array and the second terminal of the first inductor are coupled to a reference voltage.
    Type: Grant
    Filed: February 22, 2016
    Date of Patent: April 17, 2018
    Assignee: MEDIATEK INC.
    Inventors: Kun-Yin Wang, Wei-Hao Chiu, Ang-Sheng Lin
  • Patent number: 9935457
    Abstract: Various arrangements for mitigating voltage droop in a direct current circuit configured to power multiple capacitive loads are presented. A voltage source configured to output a direct current voltage to power the multiple capacitive loads may be present. First and second outputs electrically coupled with the voltage source such that the outputs, when electrically coupled with capacitive loads, provide a voltage to the capacitive load may be provided. A transformer module (which may include a transformer and an impedance) electrically coupled with the first output and the second output may also be provided. When the first capacitive load is electrically coupled with the first output, the transformer may be configured to mitigate droop of the first voltage to the first output upon the second capacitive load being connected to the second output and receiving inrush current.
    Type: Grant
    Filed: December 16, 2015
    Date of Patent: April 3, 2018
    Assignee: Echostar Technologies L.L.C.
    Inventor: John Nicholas Brooksbank
  • Patent number: 9906200
    Abstract: A power filter is provided, including a circuit board module, an insulating base, several connect terminals, and an inductor. The circuit board module includes a circuit board and several electronic components, wherein the circuit board forms several connect holes thereon and the electronic components are electrically connected to the circuit board. The connect terminals are fixed on the insulating base and each has a connecting part and a clamping part, wherein the connecting parts are joined with the connect holes of the circuit board. The inductor includes at least one wire with both terminals clamped by the clamping parts, and the wire is electrically connected to the circuit board module through the connecting parts.
    Type: Grant
    Filed: November 2, 2015
    Date of Patent: February 27, 2018
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Shin-Chih Hsieh, Po-Jen Tsai, Chia-Chi Hsieh
  • Patent number: 9882542
    Abstract: In a filter component with improved attenuation characteristics for common mode noise, an LC series resonance circuit disposed in each of a plurality of shunt circuits is connected at a first end to a first line and is grounded at a second end. The LC series resonance circuit disposed in each of the shunt circuits is grounded at a first end and is connected at a second end to a second line. With this configuration, the LC series resonance circuits resonate reliably so as to define attenuation poles. Accordingly, the resonant frequency of each of the LC series resonance circuits is set to be a frequency that effectively attenuates common mode noise.
    Type: Grant
    Filed: June 2, 2016
    Date of Patent: January 30, 2018
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Masahiro Teramoto
  • Patent number: 9847165
    Abstract: A winged coil structure and a method of manufacturing the same are disclosed. The winged coil structure includes an upper flexible plate, at least one upper magnetic induction coil, at least one upper connection pad, a lower flexible plate, at least one lower magnetic induction coil, at least one lower connection pad, at least one gold finger, a dielectric layer and at least one connection plug. The connection plug connects the upper connection pad and the lower connection pad through thermal pressing such that the gold finger, the upper magnetic induction coil, the upper connection pad, the lower connection pad, the connection plug, the lower connection pad and the lower magnetic induction coil are electrically connected. The upper flexible plate is provided with notched lines to be easily bent without damage to the upper and lower magnetic induction coils. Thus, a bendable feature for magnetic induction coils is provided.
    Type: Grant
    Filed: October 8, 2015
    Date of Patent: December 19, 2017
    Assignee: KINSUS INTERCONNECT TECHNOLOGY CORP.
    Inventors: Ting-Hao Lin, Chiao-Cheng Chang, Yi-Nong Lin
  • Patent number: 9793039
    Abstract: An inductor has a substrate and at least one coil of carbon nanotubes. A trench is formed in the substrate, and the carbon nanotubes are grown in the trench in order to form a coil for the inductor. In some embodiments, multiple coils may be formed in the trench as may be desired.
    Type: Grant
    Filed: May 4, 2012
    Date of Patent: October 17, 2017
    Assignee: The Board of Trustees of the University of Alabama
    Inventor: Jaber A. Abu Qahouq
  • Patent number: 9780754
    Abstract: The branch portion includes: a first circuit portion electrically connected to the main wire while extending to a leading end from a base end of the branch portion; a second circuit portion electrically connected to the main wire while extending to the leading end from the base end of the branch portion and electrically connected to the first circuit portion at the leading end of the branch portion; and a ground conductor that is disposed between the first circuit portion and the second circuit portion while extending to the leading end from the base end of the branch portion and has one end to be grounded and the other end to be opened.
    Type: Grant
    Filed: April 7, 2015
    Date of Patent: October 3, 2017
    Assignee: Yazaki Corporation
    Inventor: Kunihiko Yamada
  • Patent number: 9761369
    Abstract: A coil has multiple coil sections connected to each other and each coil section includes a body portion and at least one direct or protrusive connecting portion disposed at one end of the body portion. Coil sections form at least one spiral path around the central axis of the coil, and on the projection of the coil along the central axis. The protrusive connecting portions protrude out of the path location of the direct connecting portions. Two connected coil sections form only one overlapped surface at the coupled parts of the direct or protrusive connecting portions. Regarding to the body portions in the same spiral path, a first end of one body portion is indirectly connected and disposed adjacent to a second end of another body portion. The second end has one surface with a virtual extension reaching the first end.
    Type: Grant
    Filed: September 24, 2013
    Date of Patent: September 12, 2017
    Inventor: Ghing-Hsin Dien
  • Patent number: 9722417
    Abstract: A transmission circuit including four transmission component sets for Ethernet is provided. For each of the transmission component sets, a first capacitor and a first inductor are cascaded, the first inductor is coupled to the Ethernet connector via the first transmission line (TL), the first capacitor is coupled to the Ethernet chip via the second TL; a second capacitor and a second inductor are cascaded, the second inductor is coupled to the Ethernet connector via the third TL, the second capacitor is coupled to the Ethernet chip via the fourth TL; a first component set is coupled between a first contact and a second contact, the first contact is located between the first capacitor and the first inductor, and the second contact is located between the second capacitor and the second inductor; and a second component set is coupled between the second TL and the fourth TL.
    Type: Grant
    Filed: May 16, 2016
    Date of Patent: August 1, 2017
    Assignee: NLIGHTNING TECHNOLOGY LTD.
    Inventors: Kun Tsen Lin, Shih Peng Wu
  • Patent number: 9693494
    Abstract: Provided is a noise reduction device including: a conductive bar of conductive material extending through a through hole in a metal housing to the outside; a magnetic material core of magnetic material disposed at a peripheral edge of the conductive bar; a substrate attached to the conductive bar so as to be adjacent to the magnetic material core; a capacitor mounted on the substrate and having a first terminal connected to the conductive bar and a second terminal connected to an inner wall of the through hole; and a blocking unit blocking an opening of the through hole so as to affix the conductive bar to the metal housing. The magnetic material core, the substrate, and the capacitor are disposed in the through hole blocked by the blocking unit; and the conductive bar has an outer end that functions as an output terminal.
    Type: Grant
    Filed: August 29, 2016
    Date of Patent: June 27, 2017
    Assignee: KITAGAWA INDUSTRIES CO., LTD.
    Inventors: Yuya Okada, Kazushige Ueno
  • Patent number: 9692385
    Abstract: Provided is a noise reduction device including: a conductive bar of conductive material; a metal tubular portion with a through hole having the conductive bar penetrating therethrough and accommodating a magnetic material core and a substrate therein; a capacitor mounted on the substrate and having a first terminal connected to the conductive bar and a second terminal connected to an inner wall of the through hole; and a blocking unit blocking an opening of the through hole so as to affix the conductive bar with respect to the metal housing and the tubular portion. The tubular portion includes an outer peripheral surface having a threaded engagement part threadedly engaged with the metal housing; and the conductive bar has an outer end that functions as an output terminal.
    Type: Grant
    Filed: September 1, 2016
    Date of Patent: June 27, 2017
    Assignee: KITAGAWA INDUSTRIES CO., LTD.
    Inventors: Yuya Okada, Kazushige Ueno
  • Patent number: 9633779
    Abstract: A composite electronic component may include: a composite body including a capacitor and an inductor coupled to each other, the capacitor having a ceramic body in which dielectric layers and internal electrodes facing each other with the dielectric layers interposed therebetween are stacked, and the inductor having a magnetic body in which magnetic layers having conductive patterns are stacked; an input terminal disposed on a first end surface of the composite body; an output terminal including a first output terminal disposed on a second end surface of the composite body and a second output terminal disposed on any one or more of upper and lower surfaces and a second side surface of the capacitor; and a ground terminal disposed on any one or more of the upper and lower surfaces and a first side surface of the capacitor and connected to the internal electrodes.
    Type: Grant
    Filed: August 11, 2014
    Date of Patent: April 25, 2017
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Young Ghyu Ahn, Byoung Hwa Lee, Sang Soo Park, Min Cheol Park
  • Patent number: 9577597
    Abstract: Provided is an LC composite component having a multi-layer substrate, a pattern coil, and a chip capacitive element. The multi-layer substrate is configured such that insulating layers are stacked. The pattern coil forms a coiled shape of which the coil axis extends along a stacking direction of the multi-layer substrate, and includes a coil conductor disposed between the insulating layers. The chip capacitive element includes a ceramic body having a relative permittivity higher than that of the insulating layers and counter electrodes. The chip capacitive element is at least partially disposed within the pattern coil.
    Type: Grant
    Filed: July 9, 2015
    Date of Patent: February 21, 2017
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Kuniaki Yosui, Takahiro Baba, Wataru Tamura
  • Patent number: 9512863
    Abstract: A silicon alignment pin is used to align successive layers of components made in semiconductor chips and/or metallic components to make easier the assembly of devices having a layered structure. The pin is made as a compressible structure which can be squeezed to reduce its outer diameter, have one end fit into a corresponding alignment pocket or cavity defined in a layer of material to be assembled into a layered structure, and then allowed to expand to produce an interference fit with the cavity. The other end can then be inserted into a corresponding cavity defined in a surface of a second layer of material that mates with the first layer. The two layers are in registry when the pin is mated to both. Multiple layers can be assembled to create a multilayer structure. Examples of such devices are presented.
    Type: Grant
    Filed: April 26, 2013
    Date of Patent: December 6, 2016
    Assignee: CALIFORNIA INSTITUTE OF TECHNOLOGY
    Inventors: Cecile Jung-Kubiak, Theodore Reck, Bertrand Thomas, Robert H. Lin, Alejandro Peralta, John J. Gill, Choonsup Lee, Jose V. Siles, Risaku Toda, Goutam Chattopadhyay, Ken B. Cooper, Imran Mehdi
  • Patent number: 9478976
    Abstract: Provided is a circuit protection device including a plurality of sheets selectively formed with at least one coil pattern, at least one withdrawal electrode, at least one hole filled with a conductive material, and at least one capacitor electrode and at least two inductors and at least two capacitors, in which the at least one coil pattern forms one inductor and a capacitor is formed between the capacitor electrode and the coil pattern.
    Type: Grant
    Filed: May 19, 2014
    Date of Patent: October 25, 2016
    Assignee: INNOCHIPS TECHNOLOGY CO., LTD.
    Inventors: In Kil Park, Tae Hyung Noh, Gyeong-Tae Kim, Myung Ho Lee, Jung Hun Lee, Euy Ho Shin, Jin Hwan Kim, Song Yeon Lee
  • Patent number: 9449753
    Abstract: A particular device includes a substrate and a spiral inductor coupled to the substrate. The spiral inductor includes a first conductive spiral and a second conductive spiral overlaying the first conductive spiral. A first portion of an innermost turn of the spiral inductor has a first thickness in a direction perpendicular to the substrate. The first portion of the innermost turn includes a first portion of the first conductive spiral and does not include the second conductive spiral. A second portion of the innermost turn includes a first portion of the second conductive spiral. A portion of an outermost turn of the spiral inductor has a second thickness in the direction perpendicular to the substrate that is greater than the first thickness. A portion of the outermost turn includes a second portion of the first conductive spiral and a second portion of the second conductive spiral.
    Type: Grant
    Filed: January 14, 2014
    Date of Patent: September 20, 2016
    Assignee: Qualcomm Incorporated
    Inventors: Daeik Daniel Kim, Chengjie Zuo, Changhan Hobie Yun, Mario Francisco Velez, Robert Paul Mikulka, Xiangdong Zhang, Jonghae Kim, Je-Hsiung Lan
  • Patent number: 9429611
    Abstract: The present invention relates to a noise sensor for an alternating or direct current power supply. The sensor comprises a noise sensing unit and a noise separator. The noise separator is configured to receive first, second and third input signals and provide a first output signal representative of the common mode noise and a second output signal representative of the differential mode noise. The noise sensing unit comprises a first capacitive element, a second capacitive element, a first resistive element and a second resistive element.
    Type: Grant
    Filed: January 13, 2012
    Date of Patent: August 30, 2016
    Assignee: NXP B.V.
    Inventors: Juergen Stahl, Alexander Pawellek, Markus Schmid, Thomas Duerbaum, Johann Kuebrich, Hans Halberstadt, Frans Pansier, Jens Goettle, Anton Blom
  • Patent number: 9431163
    Abstract: A transformer includes a first coil spiraling inwardly in a second direction. A second coil spirals along the first coil on the outside relative to the first coil. First and second external electrodes are provided in third and fourth directions relative to a first line passing through a gravity center of the first coil and an outer end thereof, respectively, the third direction being perpendicular to the first line, and the fourth direction being opposite thereto. First and second lead-out conductors are connected to the outer end of the first and the second coil, respectively, and electrically connected to the first and the second external electrodes, respectively. Both coils spiral along each other throughout their lengths. By spiraling in the second direction, the first coil is, at the outer end, oriented in a fourth direction.
    Type: Grant
    Filed: January 7, 2014
    Date of Patent: August 30, 2016
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Sayaka Sekiguchi, Kosuke Ishida
  • Patent number: 9424988
    Abstract: The present invention relates to a common mode filter and a method of manufacturing the same. In order to implement a common mode filter with low shrinkage, high substrate sintered density, and high strength, the present invention provides a common mode filter including: a lower substrate; an insulating layer having a conductor pattern inside and provided on the lower substrate; an upper substrate provided on the insulating layer; and a ferrite core made of ferrite and provided in the center of the insulating layer, the lower substrate, and the upper substrate by penetrating the insulating layer, the lower substrate, and the upper substrate, and a method of manufacturing the same.
    Type: Grant
    Filed: June 3, 2015
    Date of Patent: August 23, 2016
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Yong Suk Kim, Sung Kwon Wi, Jeong Bok Kwak, Sang Moon Lee, Won Chul Sim, Young Seuck Yoo
  • Patent number: 9385485
    Abstract: A modular jack has a magnetic assembly including insulative body, two rows of terminals retained to the insulative body, four transformers, and four common mode chokes. Each of the transformer and common mode choke includes a magnetic core and a plurality of conductive wires wound therearound. Each terminal has a recess for receiving an end portions of a corresponding wire and then the terminal is inserted into a through-hole of an internal printed circuit board for dip soldering. Guiding of the wire to the recess can be automated in contrast to manual winding operation.
    Type: Grant
    Filed: December 15, 2014
    Date of Patent: July 5, 2016
    Assignee: FOXCONN INTERCONNECT TECHNOLOGY LIMITED
    Inventors: Chih-Ching Hsu, Yong-Chun Xu, Zhi-Hui Tang
  • Patent number: 9219463
    Abstract: A system, hybrid common mode choke, and method are described herein. The system includes a differential signal transmitter and a differential signal receiver. A differential signal transmitter ground and a differential signal receiver ground are electrically disconnected in a manner that enables a common mode filter. The transmitter ground and the receiver ground may be coupled using an inductor, a resistor, a capacitor, or any combination thereof.
    Type: Grant
    Filed: February 6, 2013
    Date of Patent: December 22, 2015
    Assignee: Intel Corporation
    Inventor: Chung-Hao J. Chen
  • Patent number: 9209581
    Abstract: An electrical connector includes a dielectric housing with a plurality of filtering modules therein. Each filtering module has a housing and a magnetics assembly including transformer cores with wires wrapped therearound. An array of pins extend from the module housing for connection to the wires. A plurality of tails extend from the module housing for interconnection to a circuit board upon which the connector may be mounted. An interconnection is provided between the pins and tails that may include filtering or other signal modifying circuitry. A circuit member having an enhanced layout is also provided for use in or upon which the connector may be mounted.
    Type: Grant
    Filed: July 7, 2015
    Date of Patent: December 8, 2015
    Assignee: Molex, LLC
    Inventors: Brian P. O'Malley, Michael R. Kamarauskas, Timothy R. McClelland, Emanuel G. Banakis, Johnny Chen, Kent E. Regnier
  • Patent number: 9166644
    Abstract: A dongle transceiver a substrate, a transceiver circuit, a transmit/receive switch, a MIMO antenna structure, and a decoupling module. The transceiver circuit is on at least one of the first and second sides of the substrate and is coupled to the transmit/receive switch. The MIMO antenna structure is on at least one of the first and second sides of the substrate. The decoupling module is on at least one of the first and second sides of the substrate, couples the MIMO antenna structure to the transmit/receive switch, and electrically isolates antennas of the MIMO antenna structure.
    Type: Grant
    Filed: January 6, 2011
    Date of Patent: October 20, 2015
    Assignee: Broadcom Corporation
    Inventors: Seunghwan Yoon, Nicolaos G. Alexopoulos, Jesus Castaneda
  • Patent number: 9130541
    Abstract: Active EMC filter connectable between an electric power source and an electric load. The filter has capacitors (C×N, C×U) connected between active conductors of the power source and a star point electric node. A filter capacitor (Cst, CstU) is connected between the star point and ground. A half-bridge has two switching devices (T3, T4; T1, T2) connected in cascade between a positive supply voltage and a negative supply voltage. A smoothing circuit (RgN, LgN; RgU, RgU) is connected between a common node of the switching devices and the star point. A control unit (Drive_N, Drive_U) drives the switching devices (T3, T4; T1, T2) digitally either in an ON-state or in an OFF-state, such as to limit a leakage current.
    Type: Grant
    Filed: April 15, 2014
    Date of Patent: September 8, 2015
    Assignee: Schaffner EMV AG
    Inventors: Eckart Hoene, Andre Domurat-Linde, Oleg Zeiter
  • Patent number: 9064626
    Abstract: There is provided a thin film-type coil component having a size equal to or less than 0806 and including a ceramic main body, external electrodes including a plurality of first external electrodes formed on one surface of the ceramic main body and a plurality of second external electrodes formed on the other surface facing one surface of the ceramic main body, and a coil unit including a plurality of coil layers stacked in the ceramic main body, thereby obtaining low direct current (DC) resistance.
    Type: Grant
    Filed: March 12, 2012
    Date of Patent: June 23, 2015
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Young Seuck Yoo, Young Ghyu Ahn, Yong Suk Kim, Sung Kwon Wi, Sang Soo Park, Kang Heon Hur
  • Patent number: 9035194
    Abstract: Embodiments of the present disclosure are directed towards a circuit board having integrated passive devices such as inductors, capacitors, resistors and associated techniques and configurations. In one embodiment, an apparatus includes a circuit board having a first surface and a second surface opposite to the first surface and a passive device integral to the circuit board, the passive device having an input terminal configured to couple with electrical power of a die, an output terminal electrically coupled with the input terminal, and electrical routing features disposed between the first surface and the second surface of the circuit board and coupled with the input terminal and the output terminal to route the electrical power between the input terminal and the output terminal, wherein the input terminal includes a surface configured to receive a solder ball connection of a package assembly including the die. Other embodiments may be described and/or claimed.
    Type: Grant
    Filed: October 30, 2012
    Date of Patent: May 19, 2015
    Assignee: Intel Corporation
    Inventors: M D Altaf Hossain, Jin Zhao, John T. Vu
  • Publication number: 20150116054
    Abstract: Apparatus, methods, and systems for filtering for power line communications are described. In one example, a low pass filter for power line communication in a power system including at least one phase conductor and a neutral conductor is described. The filter includes at least one capacitor coupled between the phase conductor and the neutral conductor, at least one resistor coupled between the phase conductor and the neutral conductor, and at least one inductor coupled on the neutral conductor.
    Type: Application
    Filed: October 28, 2014
    Publication date: April 30, 2015
    Inventor: Aner Tennen
  • Patent number: 9019044
    Abstract: An inductive filter for a magnetron power supply lead comprises an electrically insulating tube; a power lead located partially within the electrically insulating tube, and coaxial therewith, for supplying power from a magnetron power supply to a magnetron, a first core of a first magnetic material and a second core of a second magnetic material coaxially located on the electrically insulating tube; an insulating disc of same external diameter as the first core and the second core and coaxially located on the electrically insulating tube between the first core and the second core. The inductive filter is arranged to filter noise of a first frequency band and noise of a second, different, frequency band different from being transmitted along the power lead and to absorb a predetermined transient voltage from being transmitted along the power lead.
    Type: Grant
    Filed: February 9, 2012
    Date of Patent: April 28, 2015
    Assignee: E2V Technologies (UK) Limited
    Inventors: Robert Richardson, Karl Osbourne
  • Patent number: 9019042
    Abstract: A high-frequency swinging choke has at least two rod cores arranged next to one another in the longitudinal direction. The rod cores each have at least one winding. The windings are connected in series.
    Type: Grant
    Filed: February 9, 2010
    Date of Patent: April 28, 2015
    Assignee: Epcos AG
    Inventors: Bernhard Roellgen, Herbert-Maurizio Cardarelli