Stripline Or Microstrip Patents (Class 333/204)
  • Patent number: 11402724
    Abstract: A planar optical resonator capable of parametrically generating frequency combs includes two optical waveguide cores forming inner and outer loops, the resonator having two sections, in which laterally adjacent segments of the cores are resonantly optically coupled to each other at two separate wavelength regions causing separate peaks in the second order dispersion. The resonator sections may be configured to suppress integrated dispersion of the resonator in a broad spectral range favorably for generating a spectrally uniform frequency comb.
    Type: Grant
    Filed: January 15, 2021
    Date of Patent: August 2, 2022
    Assignee: Nokia Solutions and Networks Oy
    Inventors: Andrea Blanco-Redondo, Ali Eshaghian Dorche, Brian Stern
  • Patent number: 11404776
    Abstract: An infusion pump assembly is disclosed. The infusion pump assembly includes a reservoir for receiving an infusible fluid, a pump assembly for pumping a quantity of infusible fluid from the reservoir to an exit, a first valve assembly configured to selectively isolate the pump assembly from the reservoir, a second valve assembly configured to selectively isolate the exit from the pumping assembly, and a split ring resonator antenna having a resonant frequency comprising a plurality of planar metallic layers.
    Type: Grant
    Filed: November 21, 2014
    Date of Patent: August 2, 2022
    Assignee: DEKA Products Limited Partnership
    Inventor: David Blumberg, Jr.
  • Patent number: 11374295
    Abstract: To achieve a filter circuit that is configured to have a good frequency rejection characteristic and suppress an increase in size due to mounting, in a more preferred aspect. A filter circuit includes a first signal line that is arranged to extend longitudinally, and a second signal line that is arranged to extend in parallel with the first signal line, in which the second signal line has one end that is electrically connected to the first signal line, and the other end that is open, in a longitudinal direction, and a length in the longitudinal direction that is determined according to a frequency of a signal to be blocked of signals transmitted through the first signal line.
    Type: Grant
    Filed: February 5, 2019
    Date of Patent: June 28, 2022
    Assignee: SONY GROUP CORPORATION
    Inventor: Goh Kitabata
  • Patent number: 11367939
    Abstract: The present invention includes a method of creating electrical air gap low loss low cost RF mechanically and thermally stabilized interdigitated resonate filter in photo definable glass ceramic substrate. Where a ground plane may be used to adjacent to or below the RF filter in order to prevent parasitic electronic signals, RF signals, differential voltage build up and floating grounds from disrupting and degrading the performance of isolated electronic devices by the fabrication of electrical isolation and ground plane structures on a photo-definable glass substrate.
    Type: Grant
    Filed: September 23, 2020
    Date of Patent: June 21, 2022
    Assignee: 3D Glass Solutions, Inc.
    Inventors: Jeb H. Flemming, Kyle McWethy
  • Patent number: 11362044
    Abstract: A semiconductor package structure is provided. The semiconductor package structure includes a substrate, a frame, a redistribution layer, and a first semiconductor die. The substrate has a wiring structure and is surrounded by a molding material. The frame is disposed in the molding material and surrounds the substrate. The redistribution layer is disposed over the substrate and electrically coupled to the wiring structure. The first semiconductor die is disposed over the redistribution layer.
    Type: Grant
    Filed: May 13, 2020
    Date of Patent: June 14, 2022
    Assignee: MediaTek Inc.
    Inventors: Tzu-Hung Lin, Yung-Chang Lien
  • Patent number: 11362430
    Abstract: A tunable antenna isolator includes a first wall, a second wall, and an electromagnetic band-gap (EBG) structure located between the first wall and the second wall. The first wall may be a metallic wall or an EBG structure, and the second wall may be a metallic wall or an EBG structure.
    Type: Grant
    Filed: November 2, 2020
    Date of Patent: June 14, 2022
    Assignee: HRL Laboratories, LLC
    Inventor: Amit M. Patel
  • Patent number: 11356129
    Abstract: The disclosed embodiments provide an absorptive coupled-line bandpass filter. This bandpass filter includes a first port, which is coupled to a first absorptive stub, and a second port, which is coupled to a second absorptive stub. The bandpass filter also includes a coupled-line bandpass section coupled between the first and second ports, wherein the coupled-line bandpass section comprises a set of one or more parallel strip line resonators, which are coupled together in series and are coupled to the first and second ports through overlapping coupled-line sections, wherein at a center frequency of a passband for the absorptive coupled-line bandpass filter, the first and second absorptive stubs appear as open circuits, and outside of the passband, the first and second absorptive stubs appear as matched loads to ground and contribute to absorption of out-of-band signals.
    Type: Grant
    Filed: April 22, 2021
    Date of Patent: June 7, 2022
    Assignee: The Regents of the University of California
    Inventors: Xiaohu Wu, Xiaoguang Liu
  • Patent number: 11342643
    Abstract: A radio frequency filter includes a first conductive pattern; a second conductive pattern connected to a first point of the first conductive pattern and extended; a third conductive pattern connected to a second point of the first conductive pattern and extended to surround a portion of the second conductive pattern; a fourth conductive pattern; a fifth conductive pattern connected to a third point of the fourth conductive pattern and extended; and a sixth conductive pattern connected to a fourth point of the fourth conductive pattern and extended to surround a portion of the fifth conductive pattern. The first conductive pattern extends toward the fourth conductive pattern and the fourth conductive pattern extends toward the first conductive pattern. A distance between the first conductive pattern and the fourth conductive pattern is greater than or equal to a distance between the third conductive pattern and the sixth conductive pattern.
    Type: Grant
    Filed: July 23, 2020
    Date of Patent: May 24, 2022
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Joong Jin Nam, Kyu Bum Han, Jae Soon Lee, Young Kyoon Im
  • Patent number: 11328861
    Abstract: An LC resonance element (10) includes a dielectric film (12), a common electrode (11) formed of a thin-film conductor on a lower surface (12D) of the dielectric film, a first capacitor (C1) and a second capacitor (C2) that are connected in series via the common electrode (11) and constitute a thin-film capacitor (TC), first and second external connection terminals (14A, 14B) formed on an upper surface (12U) of the dielectric film, a thin-film conductive wire (16) constituting a thin-film inductor (TL), a first upper electrode (13A) of the first capacitor formed on the upper surface (12U), and a second upper electrode (13B) of the second capacitor formed on the upper surface (12U). The thin-film conductive wire (16) is formed in a region (R2) located on the upper surface (12U) of the dielectric film and outside the common electrode (11) in plan view.
    Type: Grant
    Filed: November 28, 2017
    Date of Patent: May 10, 2022
    Assignee: NODA SCREEN CO., LTD.
    Inventor: Masamitsu Yoshizawa
  • Patent number: 11322813
    Abstract: A band pass filter (1) includes two resonators (8) and (10) including respectively linear conductors (9) and (11) disposed inside a dielectric substrate (2), and a pair of input-output lines (13) and (14) to which the two resonators (8) and (10) are connected in parallel. Both ends of the linear conductor (9) of the resonator (8) are left open. The resonator (10) includes vias (12A) and (12B) through which both ends of the linear conductor (11) of the resonator (10) are connected to a ground conductor (6) on a first surface (2A) of the dielectric substrate (2). The pair of input-output lines (13) and (14) include respectively vias (15A) and (15B) for connection to a ground conductor (7) that is disposed on a second surface (2B) of the dielectric substrate (2).
    Type: Grant
    Filed: March 23, 2021
    Date of Patent: May 3, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Toshiro Hiratsuka, Yoshinori Taguchi
  • Patent number: 11309616
    Abstract: A tunable band-stop filter, a method of driving a tunable band-stop filter and an electronic device are provided. The tunable band-stop filter includes a first substrate, a second substrate, and a liquid crystal layer sandwiched between the first substrate and the second substrate. The first substrate includes a wire structure on a first base substrate, the second substrate includes a common electrode on a second base substrate. The wire structure includes a first wire structure and a second wire structure. The first wire structure, the common electrode, and the liquid crystal layer between the first wire structure and the common electrode constitute a first phase modulation structure, and the second wire structure, the common electrode, and the liquid crystal layer between the second wire structure and the common electrode constitute a second phase modulation structure.
    Type: Grant
    Filed: February 25, 2019
    Date of Patent: April 19, 2022
    Assignee: BOE TECHNOLOGY GROUP CO., LTD.
    Inventor: Yongchun Lu
  • Patent number: 11300587
    Abstract: A high-frequency measurement line structure includes a circuit board structure and a multi-conductor transmission line section, a high-frequency measurement probe pad section and a transition section which are formed by the circuit board structure, wherein the transition section is arranged between the multi-conductor transmission line section and the high-frequency measurement probe pad section to be connected to the multi-conductor transmission line section and the high-frequency measurement probe pad section. The high-frequency measurement probe pad section includes a group of high-frequency measurement probe pads arranged on a first metal layer of the circuit board structure to touch a high-frequency probe to transmit a high-frequency signal.
    Type: Grant
    Filed: December 21, 2020
    Date of Patent: April 12, 2022
    Assignee: WANSHIH ELECTRONIC CO., LTD.
    Inventor: Hung-Hsuan Lin
  • Patent number: 11296047
    Abstract: Apparatuses for providing external terminals of a semiconductor device are described. An example apparatus includes: a connection wiring of a ring-shape having comprising a hole and a conductive layer surrounding the hole, the conductive layer including a first connection point and a second connection point that are located so that a straight line between the first connection point and the second connection point crosses over the hole; an external terminal coupled to the first connection point of the conductive layer of the connection wiring; and an internal circuit coupled to the second connection point of the conductive layer of the connection wiring.
    Type: Grant
    Filed: June 26, 2019
    Date of Patent: April 5, 2022
    Assignee: Micron Technology, Inc.
    Inventor: Ken Ota
  • Patent number: 11264337
    Abstract: A semiconductor package structure is provided. The semiconductor package structure includes a substrate, a semiconductor die and a frame. The semiconductor die is disposed over the substrate. The frame is disposed over the substrate, wherein the frame is adjacent to the semiconductor die, and the upper surface of the frame is lower than the upper surface of the semiconductor die.
    Type: Grant
    Filed: December 3, 2019
    Date of Patent: March 1, 2022
    Assignee: MEDIATEK INC.
    Inventors: Chia-Cheng Chang, Tzu-Hung Lin, I-Hsuan Peng, Yi-Jou Lin
  • Patent number: 11244785
    Abstract: An electronic component includes an upper surface, a lower surface, a side surface, a circuit pattern, and an upper surface shield electrode. The circuit pattern is provided inside the electronic component. The upper surface shield electrode is disposed on the upper surface. In a plan view from a normal direction of the upper surface, a center of gravity of the upper surface shield electrode is spaced from a center of gravity of the upper surface.
    Type: Grant
    Filed: April 3, 2019
    Date of Patent: February 8, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Kunihiro Miyahara, Noboru Shiokawa
  • Patent number: 11245168
    Abstract: The disclosure relates to a filter including dielectric substrate, ground and microstrip line layers, and signal and ground vias. The ground layer is formed on the dielectric substrate and has a ground plane and signal terminal contacts. The microstrip line layer is located on the dielectric substrate and includes microstrip resonators, common electrode and input and output terminal contacts. The input and output terminal contacts are connected to the microstrip resonators. The signal and ground vias extend among the ground layer, the dielectric substrate, and the microstrip line layer. The signal terminal contacts are connected to the input and output terminal contacts through the signal vias. The ground plane is connected to the common electrode through the ground vias. The filter further includes at least one capacitive coupling unit capacitive-coupled with two of the microstrip resonators adjacent to each other.
    Type: Grant
    Filed: July 21, 2020
    Date of Patent: February 8, 2022
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventor: Jiun-Jang Yu
  • Patent number: 11201599
    Abstract: A band pass filter includes a first filter circuit, a second filter circuit, a first intermediate circuit, a second intermediate circuit, and a ninth capacitor. The first intermediate circuit includes a seventh inductor connected between a fifth capacitor and a sixth capacitor. The second intermediate circuit includes an eighth inductor connected between a seventh capacitor and an eighth capacitor. The ninth capacitor is connected between the first intermediate circuit and the second intermediate circuit.
    Type: Grant
    Filed: January 8, 2021
    Date of Patent: December 14, 2021
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Tetsuo Taniguchi
  • Patent number: 11190378
    Abstract: This disclosure describes an embodiment of an invention that is sending an information and/or control data signal on a differential signal pair. This embodiment of the apparatus 200 includes an information and/or control data signal 220; a balanced differential signal pair of conductors 212 that includes a positive 202 and a negative 204 differential conductor; a first network of circuits 214 that transforms the information signal 220 into a common mode voltage on the individual conductors 202 and 204 of the balanced differential signal pair of conductors; and a second network of circuits 216 that transforms the common mode voltage on the individual conductors 202 and 204 of the balanced differential signal pair of conductors 212 back to the data signal 222; where the first network of circuits 214 couples to the second network of circuits 216 via the balanced differential signal pair of conductors 202 and 204.
    Type: Grant
    Filed: April 9, 2019
    Date of Patent: November 30, 2021
    Assignee: ClearOne, Inc.
    Inventors: Ed Thurmond, Charles Egan
  • Patent number: 11188849
    Abstract: Apparatus and methods for removing leakage from a qubit. In one aspect, an apparatus includes one or more qubits, wherein each qubit facilitates occupation of at least one of a plurality of qubit levels, the qubit levels including two computational levels and one or more non-computational levels that are each higher than the computational levels, wherein the qubit facilitates transitions between qubit levels associated with a corresponding transition frequency; a cavity, wherein the cavity defines a cavity frequency; one or more couplers coupling each qubit to the cavity; one or more couplers coupling the cavity to an environment external to the one or more qubits and the cavity; a frequency controller that controls the frequency of each qubit such that, for each qubit, the frequency of the qubit is adjusted relative to the cavity frequency such that a population of a non-computational level is transferred to the cavity.
    Type: Grant
    Filed: November 12, 2020
    Date of Patent: November 30, 2021
    Assignee: Google LLC
    Inventor: Rami Barends
  • Patent number: 11175355
    Abstract: This disclosure relates to Superconducting Quantum Interference Apparatuses, such as SQUID arrays and SQUIFs. A superconducting quantum interference apparatus comprises an array of loops each loop constituting a superconducting quantum interference device. The array comprises multiple columns, each of the columns comprises multiple rows connected in series, each of the multiple rows comprises a number of loops connected in parallel, and the number of loops connected in parallel in each row is more than two and less than 20 to improve a performance of the apparatus. It is an advantage that keeping the number of loops in parallel below 20 improves the performance of the apparatus. This is contrary to existing knowledge where it is commonly assumed that a larger number of parallel loops would increase performance.
    Type: Grant
    Filed: March 29, 2019
    Date of Patent: November 16, 2021
    Assignee: COMMONWEALTH SCIENTIFIC AND INDUSTRIAL RESEARCH ORGANISATION
    Inventors: Emma Mitchell, Christopher John Lewis
  • Patent number: 11139903
    Abstract: A technique relates to a superconducting microwave combiner. A first filter through a last filter connects to a first input through a last input, respectively. The first filter through the last filter each has a first passband through a last passband, respectively, such that the first passband through the last passband are each different. A common output is connected to the first input through the last input via the first filter through the last filter.
    Type: Grant
    Filed: January 6, 2020
    Date of Patent: October 5, 2021
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventor: Baleegh Abdo
  • Patent number: 11108369
    Abstract: A band pass filter is provided with a first filter circuit which includes a first resonant circuit including a first inductor and a second resonant circuit including a second inductor, a second filter circuit which includes a third resonant circuit including a third inductor and a fourth resonant circuit including a fourth inductor, and a fifth resonant circuit including a fifth inductor. The fifth inductor is electromagnetically coupled to each of the first inductor, the second inductor, the third inductor, and the fourth inductor.
    Type: Grant
    Filed: July 17, 2020
    Date of Patent: August 31, 2021
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Tetsuo Taniguchi
  • Patent number: 11063330
    Abstract: A filter which stops the propagation of an electromagnetic wave of a predetermined frequency band in a signal line or a power supply line is provided. This filter is a conductor connected to the signal line or the power supply line. This conductor is configured to include a linear portion. The first portion of the linear portion with an end portion connected to the signal line or the power supply line has the first width, and the second portion different from the first portion of the linear portion has the second width different from the first width.
    Type: Grant
    Filed: January 13, 2020
    Date of Patent: July 13, 2021
    Assignee: CANON KABUSHIKI KAISHA
    Inventor: Hajime Shimura
  • Patent number: 11056777
    Abstract: The present invention provides a millimeter wave LTCC filter including system ground layers, metallized vias, perturbation grounding posts, first and second probes, two adjacent layers of the system ground layers define one closed resonant cavity, each closed resonant cavity is provided with a plurality of metallized vias, the metallized vias of different closed resonant cavities form concentric hole structures, the perturbation grounding posts include first perturbation grounding posts penetrating a second closed resonant cavity and second perturbation grounding posts penetrating a third closed resonant cavity, the first perturbation grounding posts respectively face right to the second perturbation grounding posts, one end of the first probe is inserted into the first closed resonant cavity and electrically connected with the first system ground layer, and the second probe is arranged symmetrically with the first probe and inserted into the fourth closed resonant cavity and electrically connected with the s
    Type: Grant
    Filed: December 11, 2019
    Date of Patent: July 6, 2021
    Assignee: AAC Technologies Pte. Ltd.
    Inventor: Jianchun Mai
  • Patent number: 11057078
    Abstract: A wireless communication system includes a first coupler having a first pair of electrodes and second coupler having a second pair of electrodes that at least partially oppose the first pair of electrodes. A transmission circuit applies a differential signal to the first coupler. A reception circuit receives a differential signal output from the second coupler based on electromagnetic coupling between the first coupler and the second coupler. A distance between centroids of the first pair of electrodes differs from a distance between centroids of the second pair of electrodes.
    Type: Grant
    Filed: May 20, 2020
    Date of Patent: July 6, 2021
    Assignee: Canon Kabushiki Kaisha
    Inventor: Hiroto Tamaki
  • Patent number: 11056783
    Abstract: Present disclosure relates to a communication device. The communication device includes a body, a directional antenna array and a radiation structure. The directional antenna array is arranged on a first position of the body. The directional antenna array is configured to transmit a radio frequency signal in a first signal area. The directional antenna array has a non-line-of-sight signal blind area with respect to the body. The radiation structure is arranged on a second position of the body. The directional antenna array is configured to transmit the radio frequency signal guided from the directional antenna array to cover a second signal area. The second position is located in the non-line-of-sight signal blind area of the directional antenna array.
    Type: Grant
    Filed: September 17, 2018
    Date of Patent: July 6, 2021
    Assignee: HTC Corporation
    Inventors: Ta-Chun Pu, Yen-Liang Kuo
  • Patent number: 10957988
    Abstract: A slot array antenna includes: a first conductive member having a first conductive surface and a plurality of slots therein, the slots being arrayed in a first direction and in a second direction which intersects the first direction; a second conductive member having a second conductive surface which opposes the first conductive surface; a plurality of waveguide members arrayed between the first and second conductive members along a direction which intersects the first direction, each waveguide member having an conductive waveguide face which extends along the first direction so as to oppose at least one of the slots; and an artificial magnetic conductor in a subregion which is within a region between the first and second conductive members but outside of a subregion containing the waveguide members. Neither an electric wall nor an artificial magnetic conductor exists in a space between two adjacent waveguide faces among the waveguide members.
    Type: Grant
    Filed: December 26, 2019
    Date of Patent: March 23, 2021
    Assignees: NIDEC CORPORATION, WGR CO., LTD.
    Inventors: Hideki Kirino, Hiroyuki Kamo
  • Patent number: 10944376
    Abstract: An LC resonator includes a laminate body including dielectric layers that are laminated in a lamination direction. The LC resonator includes a first capacitor, a second capacitor, and an inductor connected between the first capacitor and the second capacitor. A first end of the inductor is isolated in a direct current from a ground node by the first capacitor. A second end of the inductor is isolated in a direct current from the ground node by the second capacitor.
    Type: Grant
    Filed: May 31, 2019
    Date of Patent: March 9, 2021
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Tetsuo Taniguchi
  • Patent number: 10925152
    Abstract: Apparatuses, systems and methods associated with dielectric coatings for printed circuit boards are disclosed herein. In embodiments, a printed circuit board (PCB) includes a substrate, microstrip conductors located on a surface of the substrate, a solder mask covering the surface of the substrate and the microstrip conductors, and a dielectric coating located on the solder mask, the dielectric coating on an opposite side of the solder mask from the microstrip conductors, wherein a thickness of the dielectric coating is selected to cause a ratio of capacitive coupling to self capacitance to be approximately equal to a ratio of inductive coupling to self inductance for each microstrip conductor of the microstrip conductors, where the thickness may be determined based on a specific methodology including simulations. Other embodiments may be described and/or claimed.
    Type: Grant
    Filed: September 28, 2018
    Date of Patent: February 16, 2021
    Assignee: Intel Corporation
    Inventors: Albert Sutono, Xiaoning Ye, Jimmy Hsu, Daniel Hull
  • Patent number: 10897069
    Abstract: An architecture for, and techniques for fabricating, a thermal decoupling device are provided. In some embodiments, thermal decoupling device can be included in a thermally decoupled cryogenic microwave filter. In some embodiments, the thermal decoupling device can comprise a dielectric material and a conductive line. The dielectric material can comprise a first channel that is separated from a second channel by a wall of the dielectric material. The conductive line can comprise a first segment and a second segment that are separated by the wall. The wall can facilitate propagation of a microwave signal between the first segment and the second segment and can reduce heat flow between the first segment and the second segment of the conductive line.
    Type: Grant
    Filed: October 2, 2018
    Date of Patent: January 19, 2021
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Patryk Gumann, Salvatore Bernardo Olivadese
  • Patent number: 10886585
    Abstract: An architecture for, and techniques for fabricating, a cryogenic microwave filter having reduced Kapitza resistance are provided. In some embodiments, the cryogenic microwave filter can comprise a substrate and a conductive line. The substrate can be formed of a material having a thermal conductivity property that sufficiently reduces Kapitza resistance in the cryogenic environment. The conductive line can be formed in a recess of the substrate and facilitate a filter operation on a microwave signal propagated in a cryogenic environment. In some embodiments, the conductive line can be formed according to a sintering technique that can reduce Kapitza resistance.
    Type: Grant
    Filed: September 20, 2018
    Date of Patent: January 5, 2021
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Patryk Gumann, Salvatore Bernardo Olivadese
  • Patent number: 10871688
    Abstract: An array substrate, a manufacturing method thereof and a display device are provided. The array substrate includes a first conductive pattern, an insulation layer covering the first conductive pattern, and a second conductive pattern arranged on the insulation layer. The insulation layer includes a via-hole through which the first conductive pattern is connected to the second conductive pattern. A conductive post connected to the first conductive pattern and the second conductive pattern is formed in the via-hole.
    Type: Grant
    Filed: May 27, 2016
    Date of Patent: December 22, 2020
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., BEIJING BOE DISPLAY TECHNOLOGY CO., LTD.
    Inventors: Jinyu Ren, Dan Wang, Changjian Xu, Guojing Ma, Bo Zhou
  • Patent number: 10867258
    Abstract: Apparatus and methods for removing leakage from a qubit. In one aspect, an apparatus includes one or more qubits, wherein each qubit facilitates occupation of at least one of a plurality of qubit levels, the qubit levels including two computational levels and one or more non-computational levels that are each higher than the computational levels, wherein the qubit facilitates transitions between qubit levels associated with a corresponding transition frequency; a cavity, wherein the cavity defines a cavity frequency; one or more couplers coupling each qubit to the cavity; one or more couplers coupling the cavity to an environment external to the one or more qubits and the cavity; a frequency controller that controls the frequency of each qubit such that, for each qubit, the frequency of the qubit is adjusted relative to the cavity frequency such that a population of a non-computational level is transferred to the cavity.
    Type: Grant
    Filed: August 29, 2019
    Date of Patent: December 15, 2020
    Assignee: Google LLC
    Inventor: Rami Barends
  • Patent number: 10854946
    Abstract: The present invention includes a method of creating electrical air gap low loss low cost RF mechanically and thermally stabilized interdigitated resonate filter in photo definable glass ceramic substrate. Where a ground plane may be used to adjacent to or below the RF filter in order to prevent parasitic electronic signals, RF signals, differential voltage build up and floating grounds from disrupting and degrading the performance of isolated electronic devices by the fabrication of electrical isolation and ground plane structures on a photo-definable glass substrate.
    Type: Grant
    Filed: December 13, 2018
    Date of Patent: December 1, 2020
    Assignee: 3D Glass Solutions, Inc.
    Inventors: Jeb H. Flemming, Kyle McWethy
  • Patent number: 10840602
    Abstract: In accordance with one or more embodiments, a communication device includes an antenna having a feed point and an aperture. A feedline is coupled to the feed point of the dielectric antenna. A multi-input multi-output (MIMO) transceiver is coupled to feedline, the MIMO transceiver facilitating a transmission of first electromagnetic waves to the feed point of the antenna, wherein the first electromagnetic waves are guided by the feedline, wherein the first electromagnetic waves propagate along the feedline via a plurality of guided wave modes without requiring an electrical return path, wherein the first electromagnetic waves convey first data in accordance with one or more MIMO techniques and wherein the first electromagnetic waves generate first free-space wireless signals at the aperture of the antenna in accordance with the one or more MIMO techniques.
    Type: Grant
    Filed: January 9, 2020
    Date of Patent: November 17, 2020
    Assignee: AT&T Intellectual Property I, L.P.
    Inventors: Paul Shala Henry, Giovanni Vannucci, Thomas M. Willis, III
  • Patent number: 10826190
    Abstract: An electromagnetic wave absorber includes a first layer and a second layer disposed on the first layer. The first layer may include a first reinforcing fiber impregnated in a first matrix. The second layer may include a second reinforcing fiber impregnated in a second matrix. The second reinforcing fiber may be plated with a metal magnetic coating layer. The electromagnetic wave absorber may provide electromagnetic wave absorbing ability with a low uncertainty without reducing mechanical properties due to the metal magnetic coating layer.
    Type: Grant
    Filed: December 1, 2016
    Date of Patent: November 3, 2020
    Assignee: AGENCY FOR DEFENSE DEVELOPMENT
    Inventors: Chun-Gon Kim, Young-Woo Nam, Jae-Hun Choi
  • Patent number: 10804582
    Abstract: A filter which stops the propagation of an electromagnetic wave of a predetermined frequency band in a signal line or a power supply line is provided. This filter is a conductor connected to the signal line or the power supply line. This conductor is configured to include a linear portion. The first portion of the linear portion with an end portion connected to the signal line or the power supply line has the first width, and the second portion different from the first portion of the linear portion has the second width different from the first width.
    Type: Grant
    Filed: May 30, 2017
    Date of Patent: October 13, 2020
    Assignee: CANON KABUSHIKI KAISHA
    Inventor: Hajime Shimura
  • Patent number: 10791622
    Abstract: A printed wiring board of the present disclosure that includes a power supply layer and a ground layer. A power supply layer pattern formed in the power supply layer includes a power supply layer electrode and a branch that is a direct-current power feeding path connecting adjacent electromagnetic band gap (EBG) unit cells. A capacitive coupling element including a capacitive coupling element body is disposed to oppose the power supply layer electrode with an interlayer provided therebetween.
    Type: Grant
    Filed: July 20, 2017
    Date of Patent: September 29, 2020
    Assignees: NATIONAL UNIVERSITY CORPORATION OKAYAMA UNIVERSITY, KYOCERA CORPORATION
    Inventors: Yoshitaka Toyota, Kengo Iokibe, Xingxiaoyu Lin, Toshiyuki Kaneko, Masanori Naito, Toshihisa Uehara
  • Patent number: 10770773
    Abstract: An electronic apparatus includes a first substrate and a second substrate mounted on the first substrate and having a smaller area than the first substrate. The second substrate extends in a longitudinal direction and has a planar or substantially planar shape with a uniform or substantially uniform width across all portions of the second substrate in the longitudinal direction. The second substrate includes a signal line, and a high-frequency transmission line including the signal line, and further includes an input/output pad electrically connected to the signal line, and an auxiliary pad arranged between two input/output pads, on the mounting surface of the second substrate. The first substrate includes lands each connected to the input/output pad and the auxiliary pad. The input/output pad and the auxiliary pad are each soldered on each of the lands of the first substrate and, thus, the second substrate is surface-mounted on the first substrate.
    Type: Grant
    Filed: January 24, 2020
    Date of Patent: September 8, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Takahiro Baba, Nobuo Ikemoto, Kosuke Nishino, Jun Sasaki
  • Patent number: 10763563
    Abstract: A radio frequency filter includes a first conductive pattern; a second conductive pattern connected to a first point of the first conductive pattern and extended; a third conductive pattern connected to a second point of the first conductive pattern and extended to surround a portion of the second conductive pattern; a fourth conductive pattern; a fifth conductive pattern connected to a third point of the fourth conductive pattern and extended; and a sixth conductive pattern connected to a fourth point of the fourth conductive pattern and extended to surround a portion of the fifth conductive pattern. The first conductive pattern extends toward the fourth conductive pattern and the fourth conductive pattern extends toward the first conductive pattern. A distance between the first conductive pattern and the fourth conductive pattern is greater than or equal to a distance between the third conductive pattern and the sixth conductive pattern.
    Type: Grant
    Filed: October 31, 2018
    Date of Patent: September 1, 2020
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Joong Jin Nam, Kyu Bum Han, Jae Soon Lee, Young Kyoon Im
  • Patent number: 10684418
    Abstract: The use of microresonators with sharp corners (rectangular and square-shaped) can be limited by severe energy loss at the corners. The effect of incorporating fillet design at sharp corners (rounding of corners) of such single mode optical microresonators is described. The effect on quality factor, free spectral range (“FSR”), and energy loss for varying values of fillet radii are quantified and compared with standard circular microring resonator. It is shown that the selection of optimum fillet radius for sharp-cornered microresonators provide higher quality factor than that of the conventional circular resonators.
    Type: Grant
    Filed: November 24, 2016
    Date of Patent: June 16, 2020
    Assignees: New York University, New York Univeristy in Abu Dhabi Corporation
    Inventors: Prabodh Panindre, Sunil Kumar
  • Patent number: 10686419
    Abstract: Various embodiments of the invention relate to a tunable gain equalizer to enable a RF output with constant gain over a wide frequency band. The tunable gain equalizer comprises a series path formed by a plurality of adjustable capacitors coupled in series, and two shunt paths coupled to the series path. The adjustable capacitors may be varactors coupled to a biasing voltage for capacitance adjustment. The shunt paths comprise inductors to enable a positive gain slope to compensate negative gain slope of RF amplifiers. The shunt paths may be bridged by one or more branches connected between the two shunt paths. The bridged branches provide a higher tunable gain slope amount and a better input/output matching. By making the biasing voltage of the tunable gain equalizer temperature dependent, the tunable gain equalizer is able to generate a temperature dependent gain slope to offset the temperature variation influence.
    Type: Grant
    Filed: March 26, 2019
    Date of Patent: June 16, 2020
    Assignee: Chengdu Sicore Semiconductor Corp. Ltd.
    Inventor: Cemin Zhang
  • Patent number: 10673111
    Abstract: A filter is provided, and the filter includes two mutually coupled slow-wave resonators. Each resonator includes a coplanar waveguide (CPW) transmission line, a tapered CPW transmission line, and a ground stub, and can generate a slow-wave feature to push a high-order harmonic wave of a baseband signal to a high frequency, so as to implement a wide stopband feature. In addition, a slow-wave effect is used to properly design a size of a filter, to reduce an entire area of the filter and reduce costs. Moreover, two resonators are coupled, to enhance passband performance of the filter, increase bandwidth, increase in-passband flatness, and reduce an insertion loss.
    Type: Grant
    Filed: April 27, 2018
    Date of Patent: June 2, 2020
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Bingzheng Yang, Huizhen Qian, Xun Luo
  • Patent number: 10665389
    Abstract: An electronic component that includes at least one main body composed of ferrite material, at least one coil embedded in the main body, and at least one conductor track which runs on a side of the main body from a bottom side to a top side of the main body configured such that the main body has at least two side surfaces which enclose an angle of less than 180 angular degrees, where the conductor track is arranged in a recess at the transition between the two side surfaces.
    Type: Grant
    Filed: March 7, 2016
    Date of Patent: May 26, 2020
    Assignee: Würth Elektronik eiSos GmbH & Co. KG
    Inventors: Martin Haug, Dragan Dinulovic
  • Patent number: 10658720
    Abstract: A multilayer electronic component includes a multilayer stack, and a band elimination filter formed using the multilayer stack. The band elimination filter includes a first input/output end, a second input/output end, a connection path connecting the first and second input/output ends, and a resonator coupled to the connection path. The connection path includes an impedance transformer. The resonator includes a first conductor line constituting a first distributed constant line. The impedance transformer includes a second conductor line constituting a second distributed constant line, and a through hole line section connected in series to the second conductor line.
    Type: Grant
    Filed: May 15, 2018
    Date of Patent: May 19, 2020
    Assignee: TDK CORPORATION
    Inventors: Yuta Ashida, Noriyuki Hirabayashi, Shigemitsu Tomaki
  • Patent number: 10644370
    Abstract: An electronic apparatus includes a substrate and an electrical element mounted on the substrate. The electrical element includes a base material including a first principal surface and a second principal surface that are deformable and flat or substantially flat surfaces and a conductor pattern included on the base material. The electrical element further includes a first connection portion and a second connection portion that connect to a circuit included on the substrate and a transmission line portion located in a position different from positions of the first connection portion and the second connection portion that electrically connects the first connection portion and the second connection portion. The conductor pattern includes a conductor pattern of the first connection portion, a conductor pattern of the second connection portion, a conductor pattern of the transmission line portion, and an electrical-element-side bonding pattern arranged in the transmission line portion.
    Type: Grant
    Filed: July 17, 2019
    Date of Patent: May 5, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Takahiro Baba, Akihiro Kikuchi, Genro Kato, Kosuke Nishino, Nobuo Ikemoto
  • Patent number: 10629974
    Abstract: A tunable dual-band resonator and a tunable dual-band band-pass filter using the tunable dual-band resonator. The dual-band resonator is structured such that a stub is added to each half-wavelength resonator provided with half-wavelength resonator protrusions (capacity-component adjust parts). The dual-band resonator is made up of an odd-number mode resonator in a shape including a ground conductor disposed on the back surface of a dielectric body, and a strip conductor disposed on the top surface thereof, and an even-number mode resonator in such a shape as to be formed when the stub is connected to an end face on the opposite side of the open-end of the strip, characterized in that a dielectric rod having a circular cross section is provided in the space above the respective stubs and another dielectric rod having a circular cross section is provided in the space above the half-wavelength resonator protrusions.
    Type: Grant
    Filed: April 18, 2018
    Date of Patent: April 21, 2020
    Assignees: UNIVERSITY OF YAMANASHI, THE JAPAN STEEL WORKS, LTD.
    Inventors: Naoto Sekiya, Katsuhiro Terao, Kazuhito Kishida, Yasuo Sato, Noritaka Kitada
  • Patent number: 10594288
    Abstract: A multilayer resonant circuit component includes a multilayer body in which first electrode layers, which are provided with both coil patterns and capacitor patterns that constitute an LC circuit, are stacked with first insulator layers interposed therebetween. The multilayer body further includes, stacked together with a second insulator layer, at least one of the following: one or more second electrode layers that each include only a capacitor pattern; and a third electrode layer that includes only a coil pattern.
    Type: Grant
    Filed: September 5, 2018
    Date of Patent: March 17, 2020
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Rikiya Sano, Shimpei Tanabe
  • Patent number: 10594013
    Abstract: An electronic apparatus includes a first substrate and a second substrate mounted on the first substrate and having a smaller area than the first substrate. The second substrate extends in a longitudinal direction and has a planar or substantially planar shape with a uniform or substantially uniform width across all portions of the second substrate in the longitudinal direction. The second substrate includes a signal line, and a high-frequency transmission line including the signal line, and further includes an input/output pad electrically connected to the signal line, and an auxiliary pad arranged between two input/output pads, on the mounting surface of the second substrate. The first substrate includes lands each connected to the input/output pad and the auxiliary pad. The input/output pad and the auxiliary pad are each soldered on each of the lands of the first substrate and, thus, the second substrate is surface-mounted on the first substrate.
    Type: Grant
    Filed: March 6, 2019
    Date of Patent: March 17, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Takahiro Baba, Nobuo Ikemoto, Kosuke Nishino, Jun Sasaki
  • Patent number: 10581132
    Abstract: A tunable band pass filter (BPF), including a first transmission line electromagnetically coupled to a second transmission line, wherein a length of at least one of the first transmission and the second transmission line is adjustable, and wherein a frequency of a passband of the BPF is directly related to the length of the adjustable transmission line.
    Type: Grant
    Filed: October 31, 2018
    Date of Patent: March 3, 2020
    Assignee: Eagantu Ltd.
    Inventors: Michael Dakhiya, Roman Joffe