Abstract: A filter device includes first to third resonators. Each of the first to third resonators includes a first line part and a second line part electrically connected to the first line part and having an impedance smaller than an impedance of the first line part. The impedance ratio in at least one of the first to third resonators is 0.3 or smaller. The shape of each of the second line part of the first resonator and the second line part of the second resonator is long in a direction orthogonal to a stacking direction and crossing the longitudinal direction of the second line part of the third resonator.

Abstract: A multilayer substrate module includes a first substrate portion including a first substrate portion body including first insulator layers stacked in a vertical direction and a first conductor layer and/or a first interlayer connection conductor provided at the first substrate portion body. A second substrate portion includes a second substrate portion body including second insulator layers stacked in the vertical direction and a second conductor layer and a second interlayer connection conductor provided at the second substrate portion body, and is mounted on an upper surface of the first substrate portion. A mount device is mounted on an upper surface or a lower surface of the second substrate portion. At least a portion of an inductance component is defined by the first conductor layer and the first interlayer connection conductor.

Abstract: An LC resonator includes first and second plane electrodes, a first line electrode, a first and second via conductors, and a third plane electrode. The second plane electrode is opposed to at least a portion of the first plane electrode in a specific direction. The first via conductor and the second via conductor extend from the first line electrode in the specific direction to be connected to the first plane electrode and the second plane electrode, respectively. The third plane electrode is opposed to at least a portion of the second plane electrode in the specific direction. The second plane electrode is between the first plane electrode and the third plane electrode in the specific direction.

Abstract: A plane filter includes a dielectric substrate, a filter part provided on the dielectric substrate, and an input/output line connected to the filter part on the dielectric substrate. The filter part and the input/output line are provided on a front surface of the dielectric substrate. The dielectric substrate includes first and second regions. The filter part is provided in the first region, and the input/output line is provided in the second region. The first region having a first thickness in a first direction toward the front surface from a back surface at a side opposite to the front surface. The second region having a second thickness in the first direction, the second thickness being less than the first thickness. The back surface includes a step corresponding to a difference between the first thickness and the second thickness.

Abstract: A waveguide structure includes at least one transmission line and at least one conductive pattern layer. At least a portion of the transmission line and at least a portion of the conductive pattern layer overlap each other as observed from a surface side of the conductive pattern layer. A surface electrical resistance value of the conductive pattern layer is in a range of 0.005?/? to 30?/?.

Abstract: A conductor track arrangement for high-frequency signals is provided. The arrangement has a carrier and a layered signal conductor arranged on the carrier. The layered signal conductor is delimited by a first end, a second end, an inner edge, and an outer edge. The layered signal conductor changes direction in a deflection area and has a minimum width in the deflection area. At least one of the inner and outer edges has a curvature in the deflection area. The deflection area is between the first and second ends.

Abstract: An example mobile computing device includes: a battery module including a battery cell having a conductive casing; a coupler; and a controller coupled to the coupler, the controller configured to communicate a broadcast signal to the coupler, the coupler radiating the broadcast signal to the conductive casing of the battery module and causing the conductive casing of the battery module to transmit the broadcast signal from the mobile device.

Abstract: The invention discloses a filter device. The filter device comprises a substrate, at least one transmission conductor, and a reference conductor having a slotted structure. The substrate is provided at a first surface thereof with the transmission conductor, and provided at a second surface thereof with the reference conductor. The slotted structure comprises a frame portion, a slotted portion, and a hollow portion. The slotted portion surrounds the frame portion, and the hollow portion is formed in the frame portion. At least one impedance unit is configured on the frame portion. The equivalent filter circuit of the filter device is formed between the transmission conductor, the slotted structure, the reference conductor, and the impedance unit. Thereby, the equivalent filter circuit absorbs at least one noise at at least one specific frequency by the impedance unit to avoid the noise reflected to affect the transmission quality of signal.

Abstract: An electrical filter structure for forwarding an electrical signal from a first port, e.g. P1, to a second port, e.g. P2, in a frequency selective manner, wherein the filter is a microwave filter, the electrical filter structure comprising: a plurality of pairs of an open stub and a short-circuited stub coupled electrically in parallel to a transmission line comprising a plurality of transmission line portions at a plurality of respective junctions between adjacent transmission line portions, e.g.

Abstract: An electrical component, such as an RF device or thermal bridge, for use with a printed circuit board. The component has a first dielectric layer having a top and a bottom, a first conductive trace positioned on the bottom of the dielectric layer, and a first ground layer positioned on the bottom of the dielectric layer and spaced apart from the first conductive trace. For RF applications, a second conductive trace is positioned on top of first dielectric, a second dielectric is positioned on top of the second conductive trace, and a second ground plane is positioned on top of the second dielectric. A printed circuit board having a third conductive trace may then be coupled to the first conductive trace by a first solder layer.

Abstract: A high frequency filter includes: a multilayer substrate including a first substrate for which lands are provided, a second substrate for which lands are provided, and a third substrate for which lands are provided, the third substrate being sandwiched between the first substrate and the second substrate; a columnar conductor electrically connected to the lands in the multilayer substrate; and columnar conductors provided to surround the columnar conductor, electrically connected to a ground plane of the first substrate, and electrically connected to a ground plane of the second substrate. The spacing between the lands of the first substrate and the lands of the third substrate and the spacing between the lands of the second substrate and the lands of the third substrate are electrical lengths of 90 degrees or less at the cutoff frequency.

Abstract: The power splitter-combiner (1) includes one combining terminal (11), two split terminals (12a, 12b), an absorption resistance (13) connected between the two split terminals, a first transmission line (14a) connected between the combining terminal and one split terminal of the two split terminals, a second transmission line (14b) connected between the combining terminal and the other split terminal of the two split terminals and having a length shorter than that of the first transmission line, and at least one first open stub (15) connected to the second transmission line.

Abstract: A phase shifter includes a printed circuit board and a trace located on the printed circuit board that is configured to transmit signals. The printed circuit board includes a first part covered by the trace and a second part not covered by the trace, where the second part includes at least one hollowed out area near the trace.

Abstract: A filter that can make a reflection delay of an initial stage coupling part correspond to a change in a passband due to a manufacturing error of a substrate or the like is realized. A filter according to an example embodiment includes: a substrate having a dielectric property; an initial stage coupling part formed on the substrate; and an interstage coupling part formed on the substrate. The initial stage coupling part is formed so that a reflection delay is decreased in accordance with an increase in a passband due to a manufacturing error of the substrate or the interstage coupling part, or so that the reflection delay is increased in accordance with a decrease in the passband.

Abstract: An architecture for, and techniques for fabricating, a thermal decoupling device are provided. In some embodiments, thermal decoupling device can be included in a thermally decoupled cryogenic microwave filter. In some embodiments, the thermal decoupling device can comprise a dielectric material and a conductive line. The dielectric material can comprise a first channel that is separated from a second channel by a wall of the dielectric material. The conductive line can comprise a first segment and a second segment that are separated by the wall. The wall can facilitate propagation of a microwave signal between the first segment and the second segment and can reduce heat flow between the first segment and the second segment of the conductive line.

Abstract: A filter comprising a linear array of a plurality of TL-inspired T-networks connected in series by capacitors, each TL-inspired T-network typically comprising a pair of conventional transmission lines connected in series with a circuit comprising pair of inductors and a single capacitor, the conventional transmission lines associated with each TL-inspired T-network being optionally combinable together or with conventional transmission lines in neighboring TL-inspired T-networks, wherein the circuit comprising a pair of inductors and a single capacitor is an artificial transmission line providing target characteristic impedance, which is same as that of the conventional transmission lines, and phase delay.

Abstract: Embodiments provided herein generally include apparatus, plasma processing systems and methods for distortion current mitigation. An example plasma processing system includes a voltage source coupled to an input node, which is coupled to an electrode disposed within a processing chamber, wherein the voltage source is configured to generate a pulsed voltage signal at the input node; a signal generator having an output, wherein the RF signal generator is configured to deliver a first RF signal at a first RF frequency to the input node; a bandpass filter coupled between the output of the signal generator and the input node, wherein the bandpass filter is configured to attenuate second RF signals that are outside a range of frequencies including the first RF frequency of the first RF signal; and an impedance matching circuit coupled between the bandpass filter and the input node.

Abstract: An inductive unit is formed in an integrated circuit. An electromagnetic radiation test is performed thereon. When an amount of electromagnetic radiation exceeds a radiation threshold value, a shielding structure is formed. The shielding structure has a width and a distance separated from the inductive unit such that a decreasing amount of a quality factor of the inductive unit is not larger than a first predetermined value and a shielded amount of electromagnetic radiation is not lower than a second predetermined value. The inductive unit has a symmetric shape and the inductive device further includes a single asymmetric inductive portion. The closed shape of the shielding structure encloses the inductive unit and covers the single asymmetric inductive portion. A part of the single asymmetric inductive portion extends along a peripheral direction of the shielding structure.

Abstract: Methods and apparatuses for providing a tunable Wilkinson power splitter are presented. According to one aspect, the tunable splitter includes tunable branches realized via lumped elements that provide controlled impedance and phase at different selectable center frequencies of operation. For each of the center frequencies, the tunable Wilkinson splitter has a performance according to a corresponding fixed center frequency Wilkinson power splitter provided by a relatively narrow instantaneous bandwidth. Over a number of the center frequencies supported, performances of the tunable Wilkinson splitter overlap to provide a combined performance having a desired wider bandwidth. According to another aspect, each of the tunable branches includes an LC network that includes tunable capacitors and inductors. One or more of the tunable Wilkinson power splitters can be cascaded to provide a performance according to a wider instantaneous bandwidth.

Abstract: An antenna includes a radiator that is electrically coupled to a feed stalk having a common-mode rejection (CMR) filter therein. The CMR filter is configured to suppress common mode radiation from the radiator by providing a frequency dependent impedance to a pair of common mode currents within the feed stalk, which is sufficient to increase a return loss associated with the pair of common mode currents to a level of greater than ?6 dB across a frequency range including a frequency of the common mode radiation.

Abstract: A balun includes an unbalanced terminal, balanced terminals, and lines, and converts a signal between an unbalanced line and an balanced line. A first line is connected between the unbalanced terminal and a reference potential. A second line is connected between the balanced terminal and the reference potential, and is coupled to the first line. A third line is connected between the balanced terminal and the reference potential, and is coupled to the first line. A fourth line is connected in parallel to the second line, and is coupled to the third line. The fourth line is configured such that a signal with an opposite phase to that of a signal passing through the third line passes through the fourth line.

Abstract: Frequency-filtering circuitry is disclosed that rejects power of a wireless signal having an undesired frequency while causing a decreased power loss to a wireless signal having a desired frequency using distributed elements, rather than lumped elements. The frequency-filtering circuitry may reject at least 5 decibels of power of a wireless signal having a frequency over 32 gigahertz, while causing a power loss of at most 1.1 decibels to a wireless signal having a frequency lower than 29.5 gigahertz. The frequency-filtering circuitry may include a main branch, a first parallel branch coupled and parallel to the main branch via a first connecting trace, and a second parallel branch coupled and parallel to the main branch via a second connecting trace. The first connecting trace intersects the main branch and the first parallel branch, and the second connecting trace intersects the main branch and the second parallel branch.

Abstract: A band-pass filter includes a first input/output port, a second input/output port, a plurality of resonators, and a multilayer stack. The multilayer stack includes a plurality of stacked dielectric layers. Each of the resonators is an open-ended resonator formed of a conductor line in the multilayer stack. Each of the resonators includes a resonator conductor portion including a first line part and a second line part located away from each other in a direction orthogonal to a stacking direction of the plurality of dielectric layers, and a third line part connecting the first line part and the second line part. The first to third line parts extend to surround a space between the first line part and the second line part.

Abstract: A transmission line for transmitting radiofrequency range current between a first conductive element and a second conductive element, the transmission line comprising a signal current line and at least one return current line, the signal current line and the return current line(s) extending in parallel. Each current line comprises at least one first segment and at least one second segment. Each first segment is partially aligned with at least one adjacent second segment, aligned segments being separated by a first dielectric gap, and each aligned first segment and second segment forming a capacitive coupling across the first dielectric gap. This solution enables a transmission line which provides only small capacitive loading onto its surroundings, and which therefore can extend, e.g., through an antenna element without significantly affecting the performance of the antenna element.

Abstract: A Substrate Integrated Wave (SIW) coupled to a Suspended Substrate Stripline (SSS) filter for introducing a notch response has a substrate having metal layers formed on a top surface and a bottom surface thereof. A filter circuit is formed on the top surface of the substrate. A top ground plate is provided and has an air cavity formed on a bottom surface of the top ground plate. The air cavity on the top ground plate is positioned directly above the filter circuit when the top ground plate is positioned on the top surface of the substrate. A bottom ground plate is provided and has an air cavity formed on a top surface of the bottom ground plate. The air cavity on the bottom ground plate is positioned directly below the filter circuit when the bottom ground plate is positioned on the bottom surface of the substrate. A SIW cavity resonator is coupled to the filter circuit by means of an aperture to create a notch response in the SSS filter.

Abstract: The present invention includes a method of creating electrical air gap low loss low cost RF mechanically and thermally stabilized interdigitated resonate filter in photo definable glass ceramic substrate. Where a ground plane may be used to adjacent to or below the RF filter in order to prevent parasitic electronic signals, RF signals, differential voltage build up and floating grounds from disrupting and degrading the performance of isolated electronic devices by the fabrication of electrical isolation and ground plane structures on a photo-definable glass substrate.

Abstract: Apparatus for generating THz (terahertz) radiation, the apparatus comprising: a substrate; a planar array of asymmetric point antennas formed on the substrate and excitable by a pump pulse of radiation to radiate THz radiation the point antennas having characteristic dimensions substantially smaller than wavelengths of the radiated THz; wherein the array comprises point antennas aligned in different directions.

Abstract: An antenna includes a housing of a resin, a first conductor group, and a power supply line. The housing includes first and second surfaces opposite in a first direction, third and fourth surfaces opposite in a second direction, and a housing portion surrounded by the first-fourth surfaces. The third surface connects the first and second surfaces. The first conductor group includes a first conductor, a second conductor, a second conductor group, and a third conductor. The first conductor is closer to the first surface than the second surface. The second conductor is closer to the second surface than the first surface. The second conductor group extends along the third surface and capacitively couples the first and second conductors. The third conductor extends along the fourth surface and electrically connects the first and second conductors. The power supply line is connected to any one portion of the second conductor group.

Abstract: A communication device and a radio frequency circuit are provided. The communication device includes an antenna element, a transceiver, and the radio frequency circuit. The radio frequency circuit includes a substrate, a first conducting wire, a second conducting wire, and four transmission lines. The four transmission lines are respectively connected to two ends of the first conducting wire and two ends of the second conducting wire to form an input part, an output part, a coupling part, and an isolation part, respectively. The first conducting wire and the second conducting wire are separate from each other and coupled to each other, and each of a width of the first conducting wire and a width of the second conducting wire is not equal to a width of any one of the four transmission lines.

Abstract: Provided in the present application are a band14 signal suppression circuit and a smart terminal device being equipped with a duplexer, an active low-pass filter, and a resonant filter in a band14 transmission path, implementing filtering and suppression on the second harmonic in the band14 signal, and eliminating the interference of band14 signals on assisted global positioning system signals.

Abstract: There are disclosed acoustic diplexers and radios incorporating the acoustic diplexers. A diplexer includes common port, a low band port, a high band port, n low band sub-filters, and n high band sub-filters, where n is an integer greater than one. Each low band sub-filter has a first sub-filter port connected to the common port and a second sub-filter port connected to the low band port. Each high band sub-filter has a first sub-filter port connected to the common port and a second sub-filter port connected to the high band port. A first acoustic resonator is connected from the common port to ground and a second acoustic resonator is connected from the low band port to ground. The first and second acoustic resonators are configured to create respective transmission zeros adjacent to a lower edge of a passband of the diplexer.

Abstract: Provided is a device for transmitting signals, the device including: a first conductive base and a second conductive base parallel to each other, a waveguide at least partially surrounded by side walls located between the first conductive base and the second conductive base and including at least one electromagnetic band gap (EBG) structure, and at least two directional antennas opposite to or facing each other in a direction in which signals are transmitted, wherein each antenna is on a printed circuit board and includes another EBG structure located on an upper layer and a lower layer of the printed circuit board and at least one matching element, at least a part of each of the antennas is located inside the waveguide to form a wireless channel configured to transmit electromagnetic signals in an area between the antennas, and the at least one matching element is located within a specified distance of the wireless channel and is configured to match the antenna with the wireless channel.

Abstract: The disclosure relates to a composite comprising a metal film having a first major surface and opposed second major surface, at least a portion of the metal film having a sheet resistance of at least 15 ?/sq, an optical transmittance of at least 60% within the visible spectrum, and tunable bandpass filtering effect in the THz frequency range; a dielectric substrate comprising a first major surface and opposed second major surface; the metal film first major surface located on at least a portion of the dielectric substrate first major surface. The disclosure also relates to methods of making such composites and articles comprising such composites.

Abstract: An apparatus includes a first conductor trace arranged to electrically couple a first complementary signal to provide differential signaling. The first conductor trace includes a first plurality of split traces to conduct the first complementary signal, and a first plurality of tie bars to connect the first split traces.

Abstract: The high-frequency transmission line is configured by stacking conductor layers and an insulating layer, and is provided with: a signal via, which extends in a stacking direction and electrically connects the conductor layers together; an input line, which is arranged in one of the conductor layers and inputs an electrical signal to the signal via; a signal line, which is arranged in another one of the conductor layers and is connected to the input line through the signal via; a ground plane, which is arranged in any one of the conductor layers; a conductor arm arranged within a separation region that separates the signal via and the ground plane; and a conductor connection arranged within the separation region and connecting the conductor arm and the ground plane. The conductor arm and the conductor connection are configured to suppress an electrical signal of a predetermined frequency within an electrical signal.

Abstract: Deterioration is reduced in filter characteristics in a type of bandpass filter that is called a strip-line filter or a microstrip filter. A bandpass filter (filter 10) includes a ground conductor layer (12), a plurality of resonators (141 to 146) arranged in a layer spaced from the ground conductor layer (12), a first line (line 151) connected to a first-pole resonator (141) and a second line (line 152) connected to a last-pole resonator (146), wherein a direction in which the first line (line 151) is drawn out from the first-pole resonator (141) and a direction in which the second line (line 152) is drawn out from the last-pole resonator (146) are opposite to each other.

Abstract: A polycrystal having a physical property that enables an AC resistance value to drop sharply is used to reduce transmission loss of a high frequency signal being transmitted. A high frequency transmission device D1 is provided that includes a dielectric 100 and a transmission line 200 adapted for transmitting therethrough high frequency signals. At least part of the transmission line 200 is located on or inside the dielectric 100. At least part of the transmission line 200 is composed of a polycrystal composed of conductor fine particles. The polycrystal has a physical property such that, when a high frequency signal to be transmitted through the transmission line 200 is of frequencies within one or more specific frequency bands, the AC resistance value drops sharply.

Abstract: An architecture for, and techniques for fabricating, a thermal decoupling device are provided. In some embodiments, thermal decoupling device can be included in a thermally decoupled cryogenic microwave filter. In some embodiments, the thermal decoupling device can comprise a dielectric material and a conductive line. The dielectric material can comprise a first channel that is separated from a second channel by a wall of the dielectric material. The conductive line can comprise a first segment and a second segment that are separated by the wall. The wall can facilitate propagation of a microwave signal between the first segment and the second segment and can reduce heat flow between the first segment and the second segment of the conductive line.

Abstract: A wide-bandwidth resonant circuit is provided. In an embodiment disclosed herein, the wide-bandwidth resonant circuit includes a positive resonant circuit coupled in parallel to a negative resonant circuit. The positive resonant circuit and the negative resonant circuit can be configured to collectively exhibit certain impedance characteristics across a wide bandwidth. As a result, it is possible to utilize the wide-bandwidth resonant circuit to support a variety of wide-bandwidth applications, such as in a wide-bandwidth signal filter circuit.

Abstract: A first end of a linear conductor of a resonator is connected to a ground conductor on a first surface of a dielectric substrate through a via. A second end of the linear conductor of the resonator is left open. A first end of a linear conductor of a resonator is connected to a ground conductor on a second surface of the dielectric substrate through a via. A second end of the linear conductor of the resonator is left open. An input-output line is connected to the ground conductor on the second surface of the dielectric substrate through a via. An input-output line is opposed to the second ends of the linear conductor of the two resonators.

Abstract: A filter device includes a filter including at least one inductor and at least one capacitor, and a stack of a plurality of dielectric layers and a plurality of conductor layers. The plurality of dielectric layers include at least one first dielectric layer formed of a first dielectric material and at least one second dielectric layer formed of a second dielectric material. The plurality of conductor layers include at least one first conductor layer in contact with the at least one first dielectric layer, and at least one second conductor layer in contact with the at least one second dielectric layer. The temperature coefficient of resonant frequency of the first dielectric material has a positive value. The temperature coefficient of resonant frequency of the second dielectric material has a negative value.

Abstract: A composite electronic component includes a multilayered body in which a plurality of dielectric layers and a plurality of conductor layers are alternately stacked, a first resonant circuit including a first line and a first capacitor, the first line being formed of one or more first conductor layers of the conductor layers, the first capacitor including a first electrode formed of a plurality of second conductor layers of the conductor layers, and a second resonant circuit including a second line and a second capacitor, the second line being formed of one or more third conductor layers of the conductor layers, the second capacitor including a second electrode formed of the second conductor layers, the second conductor layers being located between the one or more first conductor layers and the one or more third conductor layers.

Abstract: The disclosure is directed to an integrated circuit (IC) die stacked with a backer die, including capacitors and thermal vias. The backer die includes a substrate material to contain and electrically insulate one or more capacitors at a back of the IC die. The backer die further includes a thermal material that is more thermally conductive than the substrate material for thermal spreading and increased heat dissipation. In particular, the backer die electrically couples capacitors to the IC die in a stacked configuration while also spreading and dissipating heat from the IC die. Such a configuration reduces an overall footprint of the electronic device, resulting in decreased integrated circuits (IC) packages and module sizes. In other words, instead of placing the capacitors next to the IC die, the capacitors are stacked on top of the IC die, thereby reducing an overall surface area of the package.

Abstract: A filter circuit includes an input node, an output node, a first filtering element and a second filtering element. The first filtering element has a first terminal coupled to the input node and a second terminal, and is configured to provide a first signal conducting path toward the second terminal for conducting a first signal received at the input node to the second terminal. The second filtering element has a first terminal coupled to the input node and a second terminal, and is configured to provide a second signal conducting path toward the output node for conducting a second signal received at the input node to the output node. The second terminal of the first filtering element and the second terminal of the second filtering element are open-circuit terminals.

Abstract: A filter structure includes a ground plane in a first metal layer of an integrated circuit (IC) package, a plate in a second metal layer of the IC package, a dielectric layer between the ground plane and the plate, the ground plane, the dielectric layer, and the plate thereby being configured as a capacitive device, and an inductive device in a third metal layer of the IC package. The inductive device is electrically connected to the plate, and the plate and the inductive device are configured to have a resonance frequency greater than 1 GHz.

Abstract: A band-pass filter includes an unbalanced port, a first balanced port, a second balanced port, and first to third resonators provided between the unbalanced port and the first and second balanced ports. The second resonator and the third resonator each are a resonator with both ends open. The second resonator and the third resonator are adjacent to each other in a circuit configuration, and electromagnetically coupled by magnetic coupling as main coupling. The first resonator is provided closer to the second resonator than to the third resonator, and jump-coupled to the third resonator.

Abstract: An electronic apparatus includes a substrate and an electrical element mounted on the substrate. The electrical element includes a base material including a first principal surface and a second principal surface that are deformable and flat or substantially flat surfaces and a conductor pattern included on the base material. The electrical element further includes a first connection portion and a second connection portion that connect to a circuit included on the substrate and a transmission line portion located in a position different from positions of the first connection portion and the second connection portion that electrically connects the first connection portion and the second connection portion. The conductor pattern includes a conductor pattern of the first connection portion, a conductor pattern of the second connection portion, a conductor pattern of the transmission line portion, and an electrical-element-side bonding pattern arranged in the transmission line portion.

Abstract: Provided are a resonator having a good Q value and a filter using the resonator. The resonator has: a via electrode portion formed inside a dielectric substrate; a plurality of shielding conductors formed on the dielectric substrate to surround the via electrode portion; a first strip line which is connected to one end of the via electrode portion in the dielectric substrate and faces a first shielding conductor among the plurality of shielding conductors; and a second strip line which is connected to the other end of the via electrode portion in the dielectric substrate and faces a second shielding conductor among the plurality of shielding conductors.

Abstract: An optical device may include an optical subassembly and a digital signal processor (DSP). The optical device may include a radio frequency (RF) interconnect that electrically connects the optical subassembly and the DSP. The optical device may include a passive RF filter on one or more transmission lines of the RF interconnect.

Abstract: An electronic component includes a body having a side surface, coil conductor layers wound along main surfaces parallel to the side surface, and capacitor conductor layers each having a substantially plate-like shape parallel to the side surface. The coil conductor layers and the capacitor conductor layers are arranged in a widthwise direction perpendicular to the side surface. The capacitor conductor layers include first and second capacitor conductor layers adjacent to each other in the widthwise direction. The coil conductor layers include a first coil conductor layer that is in the same layer as the first capacitor conductor layer and a second coil conductor layer that is in the same layer as the second capacitor conductor layer. The shortest distance between the first coil conductor layer and the first capacitor conductor layer is larger than the shortest distance between the second coil conductor layer and the second capacitor conductor layer.