Stripline Or Microstrip Patents (Class 333/204)
  • Patent number: 10957988
    Abstract: A slot array antenna includes: a first conductive member having a first conductive surface and a plurality of slots therein, the slots being arrayed in a first direction and in a second direction which intersects the first direction; a second conductive member having a second conductive surface which opposes the first conductive surface; a plurality of waveguide members arrayed between the first and second conductive members along a direction which intersects the first direction, each waveguide member having an conductive waveguide face which extends along the first direction so as to oppose at least one of the slots; and an artificial magnetic conductor in a subregion which is within a region between the first and second conductive members but outside of a subregion containing the waveguide members. Neither an electric wall nor an artificial magnetic conductor exists in a space between two adjacent waveguide faces among the waveguide members.
    Type: Grant
    Filed: December 26, 2019
    Date of Patent: March 23, 2021
    Assignees: NIDEC CORPORATION, WGR CO., LTD.
    Inventors: Hideki Kirino, Hiroyuki Kamo
  • Patent number: 10944376
    Abstract: An LC resonator includes a laminate body including dielectric layers that are laminated in a lamination direction. The LC resonator includes a first capacitor, a second capacitor, and an inductor connected between the first capacitor and the second capacitor. A first end of the inductor is isolated in a direct current from a ground node by the first capacitor. A second end of the inductor is isolated in a direct current from the ground node by the second capacitor.
    Type: Grant
    Filed: May 31, 2019
    Date of Patent: March 9, 2021
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Tetsuo Taniguchi
  • Patent number: 10925152
    Abstract: Apparatuses, systems and methods associated with dielectric coatings for printed circuit boards are disclosed herein. In embodiments, a printed circuit board (PCB) includes a substrate, microstrip conductors located on a surface of the substrate, a solder mask covering the surface of the substrate and the microstrip conductors, and a dielectric coating located on the solder mask, the dielectric coating on an opposite side of the solder mask from the microstrip conductors, wherein a thickness of the dielectric coating is selected to cause a ratio of capacitive coupling to self capacitance to be approximately equal to a ratio of inductive coupling to self inductance for each microstrip conductor of the microstrip conductors, where the thickness may be determined based on a specific methodology including simulations. Other embodiments may be described and/or claimed.
    Type: Grant
    Filed: September 28, 2018
    Date of Patent: February 16, 2021
    Assignee: Intel Corporation
    Inventors: Albert Sutono, Xiaoning Ye, Jimmy Hsu, Daniel Hull
  • Patent number: 10897069
    Abstract: An architecture for, and techniques for fabricating, a thermal decoupling device are provided. In some embodiments, thermal decoupling device can be included in a thermally decoupled cryogenic microwave filter. In some embodiments, the thermal decoupling device can comprise a dielectric material and a conductive line. The dielectric material can comprise a first channel that is separated from a second channel by a wall of the dielectric material. The conductive line can comprise a first segment and a second segment that are separated by the wall. The wall can facilitate propagation of a microwave signal between the first segment and the second segment and can reduce heat flow between the first segment and the second segment of the conductive line.
    Type: Grant
    Filed: October 2, 2018
    Date of Patent: January 19, 2021
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Patryk Gumann, Salvatore Bernardo Olivadese
  • Patent number: 10886585
    Abstract: An architecture for, and techniques for fabricating, a cryogenic microwave filter having reduced Kapitza resistance are provided. In some embodiments, the cryogenic microwave filter can comprise a substrate and a conductive line. The substrate can be formed of a material having a thermal conductivity property that sufficiently reduces Kapitza resistance in the cryogenic environment. The conductive line can be formed in a recess of the substrate and facilitate a filter operation on a microwave signal propagated in a cryogenic environment. In some embodiments, the conductive line can be formed according to a sintering technique that can reduce Kapitza resistance.
    Type: Grant
    Filed: September 20, 2018
    Date of Patent: January 5, 2021
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Patryk Gumann, Salvatore Bernardo Olivadese
  • Patent number: 10871688
    Abstract: An array substrate, a manufacturing method thereof and a display device are provided. The array substrate includes a first conductive pattern, an insulation layer covering the first conductive pattern, and a second conductive pattern arranged on the insulation layer. The insulation layer includes a via-hole through which the first conductive pattern is connected to the second conductive pattern. A conductive post connected to the first conductive pattern and the second conductive pattern is formed in the via-hole.
    Type: Grant
    Filed: May 27, 2016
    Date of Patent: December 22, 2020
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., BEIJING BOE DISPLAY TECHNOLOGY CO., LTD.
    Inventors: Jinyu Ren, Dan Wang, Changjian Xu, Guojing Ma, Bo Zhou
  • Patent number: 10867258
    Abstract: Apparatus and methods for removing leakage from a qubit. In one aspect, an apparatus includes one or more qubits, wherein each qubit facilitates occupation of at least one of a plurality of qubit levels, the qubit levels including two computational levels and one or more non-computational levels that are each higher than the computational levels, wherein the qubit facilitates transitions between qubit levels associated with a corresponding transition frequency; a cavity, wherein the cavity defines a cavity frequency; one or more couplers coupling each qubit to the cavity; one or more couplers coupling the cavity to an environment external to the one or more qubits and the cavity; a frequency controller that controls the frequency of each qubit such that, for each qubit, the frequency of the qubit is adjusted relative to the cavity frequency such that a population of a non-computational level is transferred to the cavity.
    Type: Grant
    Filed: August 29, 2019
    Date of Patent: December 15, 2020
    Assignee: Google LLC
    Inventor: Rami Barends
  • Patent number: 10854946
    Abstract: The present invention includes a method of creating electrical air gap low loss low cost RF mechanically and thermally stabilized interdigitated resonate filter in photo definable glass ceramic substrate. Where a ground plane may be used to adjacent to or below the RF filter in order to prevent parasitic electronic signals, RF signals, differential voltage build up and floating grounds from disrupting and degrading the performance of isolated electronic devices by the fabrication of electrical isolation and ground plane structures on a photo-definable glass substrate.
    Type: Grant
    Filed: December 13, 2018
    Date of Patent: December 1, 2020
    Assignee: 3D Glass Solutions, Inc.
    Inventors: Jeb H. Flemming, Kyle McWethy
  • Patent number: 10840602
    Abstract: In accordance with one or more embodiments, a communication device includes an antenna having a feed point and an aperture. A feedline is coupled to the feed point of the dielectric antenna. A multi-input multi-output (MIMO) transceiver is coupled to feedline, the MIMO transceiver facilitating a transmission of first electromagnetic waves to the feed point of the antenna, wherein the first electromagnetic waves are guided by the feedline, wherein the first electromagnetic waves propagate along the feedline via a plurality of guided wave modes without requiring an electrical return path, wherein the first electromagnetic waves convey first data in accordance with one or more MIMO techniques and wherein the first electromagnetic waves generate first free-space wireless signals at the aperture of the antenna in accordance with the one or more MIMO techniques.
    Type: Grant
    Filed: January 9, 2020
    Date of Patent: November 17, 2020
    Assignee: AT&T Intellectual Property I, L.P.
    Inventors: Paul Shala Henry, Giovanni Vannucci, Thomas M. Willis, III
  • Patent number: 10826190
    Abstract: An electromagnetic wave absorber includes a first layer and a second layer disposed on the first layer. The first layer may include a first reinforcing fiber impregnated in a first matrix. The second layer may include a second reinforcing fiber impregnated in a second matrix. The second reinforcing fiber may be plated with a metal magnetic coating layer. The electromagnetic wave absorber may provide electromagnetic wave absorbing ability with a low uncertainty without reducing mechanical properties due to the metal magnetic coating layer.
    Type: Grant
    Filed: December 1, 2016
    Date of Patent: November 3, 2020
    Assignee: AGENCY FOR DEFENSE DEVELOPMENT
    Inventors: Chun-Gon Kim, Young-Woo Nam, Jae-Hun Choi
  • Patent number: 10804582
    Abstract: A filter which stops the propagation of an electromagnetic wave of a predetermined frequency band in a signal line or a power supply line is provided. This filter is a conductor connected to the signal line or the power supply line. This conductor is configured to include a linear portion. The first portion of the linear portion with an end portion connected to the signal line or the power supply line has the first width, and the second portion different from the first portion of the linear portion has the second width different from the first width.
    Type: Grant
    Filed: May 30, 2017
    Date of Patent: October 13, 2020
    Assignee: CANON KABUSHIKI KAISHA
    Inventor: Hajime Shimura
  • Patent number: 10791622
    Abstract: A printed wiring board of the present disclosure that includes a power supply layer and a ground layer. A power supply layer pattern formed in the power supply layer includes a power supply layer electrode and a branch that is a direct-current power feeding path connecting adjacent electromagnetic band gap (EBG) unit cells. A capacitive coupling element including a capacitive coupling element body is disposed to oppose the power supply layer electrode with an interlayer provided therebetween.
    Type: Grant
    Filed: July 20, 2017
    Date of Patent: September 29, 2020
    Assignees: NATIONAL UNIVERSITY CORPORATION OKAYAMA UNIVERSITY, KYOCERA CORPORATION
    Inventors: Yoshitaka Toyota, Kengo Iokibe, Xingxiaoyu Lin, Toshiyuki Kaneko, Masanori Naito, Toshihisa Uehara
  • Patent number: 10770773
    Abstract: An electronic apparatus includes a first substrate and a second substrate mounted on the first substrate and having a smaller area than the first substrate. The second substrate extends in a longitudinal direction and has a planar or substantially planar shape with a uniform or substantially uniform width across all portions of the second substrate in the longitudinal direction. The second substrate includes a signal line, and a high-frequency transmission line including the signal line, and further includes an input/output pad electrically connected to the signal line, and an auxiliary pad arranged between two input/output pads, on the mounting surface of the second substrate. The first substrate includes lands each connected to the input/output pad and the auxiliary pad. The input/output pad and the auxiliary pad are each soldered on each of the lands of the first substrate and, thus, the second substrate is surface-mounted on the first substrate.
    Type: Grant
    Filed: January 24, 2020
    Date of Patent: September 8, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Takahiro Baba, Nobuo Ikemoto, Kosuke Nishino, Jun Sasaki
  • Patent number: 10763563
    Abstract: A radio frequency filter includes a first conductive pattern; a second conductive pattern connected to a first point of the first conductive pattern and extended; a third conductive pattern connected to a second point of the first conductive pattern and extended to surround a portion of the second conductive pattern; a fourth conductive pattern; a fifth conductive pattern connected to a third point of the fourth conductive pattern and extended; and a sixth conductive pattern connected to a fourth point of the fourth conductive pattern and extended to surround a portion of the fifth conductive pattern. The first conductive pattern extends toward the fourth conductive pattern and the fourth conductive pattern extends toward the first conductive pattern. A distance between the first conductive pattern and the fourth conductive pattern is greater than or equal to a distance between the third conductive pattern and the sixth conductive pattern.
    Type: Grant
    Filed: October 31, 2018
    Date of Patent: September 1, 2020
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Joong Jin Nam, Kyu Bum Han, Jae Soon Lee, Young Kyoon Im
  • Patent number: 10684418
    Abstract: The use of microresonators with sharp corners (rectangular and square-shaped) can be limited by severe energy loss at the corners. The effect of incorporating fillet design at sharp corners (rounding of corners) of such single mode optical microresonators is described. The effect on quality factor, free spectral range (“FSR”), and energy loss for varying values of fillet radii are quantified and compared with standard circular microring resonator. It is shown that the selection of optimum fillet radius for sharp-cornered microresonators provide higher quality factor than that of the conventional circular resonators.
    Type: Grant
    Filed: November 24, 2016
    Date of Patent: June 16, 2020
    Assignees: New York University, New York Univeristy in Abu Dhabi Corporation
    Inventors: Prabodh Panindre, Sunil Kumar
  • Patent number: 10686419
    Abstract: Various embodiments of the invention relate to a tunable gain equalizer to enable a RF output with constant gain over a wide frequency band. The tunable gain equalizer comprises a series path formed by a plurality of adjustable capacitors coupled in series, and two shunt paths coupled to the series path. The adjustable capacitors may be varactors coupled to a biasing voltage for capacitance adjustment. The shunt paths comprise inductors to enable a positive gain slope to compensate negative gain slope of RF amplifiers. The shunt paths may be bridged by one or more branches connected between the two shunt paths. The bridged branches provide a higher tunable gain slope amount and a better input/output matching. By making the biasing voltage of the tunable gain equalizer temperature dependent, the tunable gain equalizer is able to generate a temperature dependent gain slope to offset the temperature variation influence.
    Type: Grant
    Filed: March 26, 2019
    Date of Patent: June 16, 2020
    Assignee: Chengdu Sicore Semiconductor Corp. Ltd.
    Inventor: Cemin Zhang
  • Patent number: 10673111
    Abstract: A filter is provided, and the filter includes two mutually coupled slow-wave resonators. Each resonator includes a coplanar waveguide (CPW) transmission line, a tapered CPW transmission line, and a ground stub, and can generate a slow-wave feature to push a high-order harmonic wave of a baseband signal to a high frequency, so as to implement a wide stopband feature. In addition, a slow-wave effect is used to properly design a size of a filter, to reduce an entire area of the filter and reduce costs. Moreover, two resonators are coupled, to enhance passband performance of the filter, increase bandwidth, increase in-passband flatness, and reduce an insertion loss.
    Type: Grant
    Filed: April 27, 2018
    Date of Patent: June 2, 2020
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Bingzheng Yang, Huizhen Qian, Xun Luo
  • Patent number: 10665389
    Abstract: An electronic component that includes at least one main body composed of ferrite material, at least one coil embedded in the main body, and at least one conductor track which runs on a side of the main body from a bottom side to a top side of the main body configured such that the main body has at least two side surfaces which enclose an angle of less than 180 angular degrees, where the conductor track is arranged in a recess at the transition between the two side surfaces.
    Type: Grant
    Filed: March 7, 2016
    Date of Patent: May 26, 2020
    Assignee: Würth Elektronik eiSos GmbH & Co. KG
    Inventors: Martin Haug, Dragan Dinulovic
  • Patent number: 10658720
    Abstract: A multilayer electronic component includes a multilayer stack, and a band elimination filter formed using the multilayer stack. The band elimination filter includes a first input/output end, a second input/output end, a connection path connecting the first and second input/output ends, and a resonator coupled to the connection path. The connection path includes an impedance transformer. The resonator includes a first conductor line constituting a first distributed constant line. The impedance transformer includes a second conductor line constituting a second distributed constant line, and a through hole line section connected in series to the second conductor line.
    Type: Grant
    Filed: May 15, 2018
    Date of Patent: May 19, 2020
    Assignee: TDK CORPORATION
    Inventors: Yuta Ashida, Noriyuki Hirabayashi, Shigemitsu Tomaki
  • Patent number: 10644370
    Abstract: An electronic apparatus includes a substrate and an electrical element mounted on the substrate. The electrical element includes a base material including a first principal surface and a second principal surface that are deformable and flat or substantially flat surfaces and a conductor pattern included on the base material. The electrical element further includes a first connection portion and a second connection portion that connect to a circuit included on the substrate and a transmission line portion located in a position different from positions of the first connection portion and the second connection portion that electrically connects the first connection portion and the second connection portion. The conductor pattern includes a conductor pattern of the first connection portion, a conductor pattern of the second connection portion, a conductor pattern of the transmission line portion, and an electrical-element-side bonding pattern arranged in the transmission line portion.
    Type: Grant
    Filed: July 17, 2019
    Date of Patent: May 5, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Takahiro Baba, Akihiro Kikuchi, Genro Kato, Kosuke Nishino, Nobuo Ikemoto
  • Patent number: 10629974
    Abstract: A tunable dual-band resonator and a tunable dual-band band-pass filter using the tunable dual-band resonator. The dual-band resonator is structured such that a stub is added to each half-wavelength resonator provided with half-wavelength resonator protrusions (capacity-component adjust parts). The dual-band resonator is made up of an odd-number mode resonator in a shape including a ground conductor disposed on the back surface of a dielectric body, and a strip conductor disposed on the top surface thereof, and an even-number mode resonator in such a shape as to be formed when the stub is connected to an end face on the opposite side of the open-end of the strip, characterized in that a dielectric rod having a circular cross section is provided in the space above the respective stubs and another dielectric rod having a circular cross section is provided in the space above the half-wavelength resonator protrusions.
    Type: Grant
    Filed: April 18, 2018
    Date of Patent: April 21, 2020
    Assignees: UNIVERSITY OF YAMANASHI, THE JAPAN STEEL WORKS, LTD.
    Inventors: Naoto Sekiya, Katsuhiro Terao, Kazuhito Kishida, Yasuo Sato, Noritaka Kitada
  • Patent number: 10594288
    Abstract: A multilayer resonant circuit component includes a multilayer body in which first electrode layers, which are provided with both coil patterns and capacitor patterns that constitute an LC circuit, are stacked with first insulator layers interposed therebetween. The multilayer body further includes, stacked together with a second insulator layer, at least one of the following: one or more second electrode layers that each include only a capacitor pattern; and a third electrode layer that includes only a coil pattern.
    Type: Grant
    Filed: September 5, 2018
    Date of Patent: March 17, 2020
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Rikiya Sano, Shimpei Tanabe
  • Patent number: 10594013
    Abstract: An electronic apparatus includes a first substrate and a second substrate mounted on the first substrate and having a smaller area than the first substrate. The second substrate extends in a longitudinal direction and has a planar or substantially planar shape with a uniform or substantially uniform width across all portions of the second substrate in the longitudinal direction. The second substrate includes a signal line, and a high-frequency transmission line including the signal line, and further includes an input/output pad electrically connected to the signal line, and an auxiliary pad arranged between two input/output pads, on the mounting surface of the second substrate. The first substrate includes lands each connected to the input/output pad and the auxiliary pad. The input/output pad and the auxiliary pad are each soldered on each of the lands of the first substrate and, thus, the second substrate is surface-mounted on the first substrate.
    Type: Grant
    Filed: March 6, 2019
    Date of Patent: March 17, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Takahiro Baba, Nobuo Ikemoto, Kosuke Nishino, Jun Sasaki
  • Patent number: 10581132
    Abstract: A tunable band pass filter (BPF), including a first transmission line electromagnetically coupled to a second transmission line, wherein a length of at least one of the first transmission and the second transmission line is adjustable, and wherein a frequency of a passband of the BPF is directly related to the length of the adjustable transmission line.
    Type: Grant
    Filed: October 31, 2018
    Date of Patent: March 3, 2020
    Assignee: Eagantu Ltd.
    Inventors: Michael Dakhiya, Roman Joffe
  • Patent number: 10559889
    Abstract: A slot array antenna includes: a first conductive member having a first conductive surface and a plurality of slots therein, the slots being arrayed in a first direction and in a second direction which intersects the first direction; a second conductive member having a second conductive surface which opposes the first conductive surface; a plurality of waveguide members arrayed between the first and second conductive members along a direction which intersects the first direction, each waveguide member having an conductive waveguide face which extends along the first direction so as to oppose at least one of the slots; and an artificial magnetic conductor in a subregion which is within a region between the first and second conductive members but outside of a subregion containing the waveguide members. Neither an electric wall nor an artificial magnetic conductor exists in a space between two adjacent waveguide faces among the waveguide members.
    Type: Grant
    Filed: June 13, 2019
    Date of Patent: February 11, 2020
    Assignees: NIDEC CORPORATION, WGR CO., LTD.
    Inventors: Hideki Kirino, Hiroyuki Kamo
  • Patent number: 10553531
    Abstract: A process-invariant RC circuit is formed by patterning a metal layer using the same mask pattern to form a metal layer resistor and a metal layer capacitor. The same mask pattern results in the metal layer resistor and the metal layer capacitor each having a plurality of longitudinally-extending fingers having the same width and separation.
    Type: Grant
    Filed: September 20, 2017
    Date of Patent: February 4, 2020
    Assignee: QUALCOMM Incorporated
    Inventors: Chao Song, Xuhao Huang, Marzio Pedrali-Noy
  • Patent number: 10553956
    Abstract: In accordance with one or more embodiments, a communication device includes an antenna having a feed point and an aperture. A feedline is coupled to the feed point of the dielectric antenna. A multi-input multi-output (MIMO) transceiver is coupled to feedline, the MIMO transceiver facilitating a transmission of first electromagnetic waves to the feed point of the antenna, wherein the first electromagnetic waves are guided by the feedline, wherein the first electromagnetic waves propagate along the feedline via a plurality of guided wave modes without requiring an electrical return path, wherein the first electromagnetic waves convey first data in accordance with one or more MIMO techniques and wherein the first electromagnetic waves generate first free-space wireless signals at the aperture of the antenna in accordance with the one or more MIMO techniques.
    Type: Grant
    Filed: August 20, 2019
    Date of Patent: February 4, 2020
    Assignee: AT&T Intellectual Property I, L.P.
    Inventors: Paul Shala Henry, Giovanni Vannucci, Thomas M. Willis, III
  • Patent number: 10516379
    Abstract: A radio frequency (RF) filter circuit for rejecting one or more spurious components of an input signal has a first resonator circuit including a first capacitor and a first coupled inductor pair of a first inductor and a second inductor, and a second resonator circuit with a second capacitor and a second coupled inductor pair of a third inductor and a fourth inductor. First and second resonator coupling capacitors are connected to the first resonator circuit and the second resonator circuit. A first port and a second port are connected to the first resonator circuit and the second resonator, with the filtered signal of the input signal passed through both the first resonator circuit and the second resonator circuit being output.
    Type: Grant
    Filed: October 6, 2017
    Date of Patent: December 24, 2019
    Assignee: Skyworks Solutions, Inc.
    Inventors: Oleksandr Gorbachov, Lisette L. Zhang, Huan Zhao, Lothar Musiol
  • Patent number: 10432256
    Abstract: A system that reduces crosstalk and return loss within electrical communication connectors includes at least two compensating capacitors connected in series that compensate each offending capacitor. An additional inductive component that is connected between two compensating capacitors so that the adjustable inductance of the inductive component can be varied to modify the capacitive coupling effect achieved by the compensating capacitors as a function of frequency. A shape-neutral structure containing two compensating capacitors and one series inductive component in between is positioned so that each compensating capacitor is juxtaposed parallel to the offending capacitor. There is no direct contact between the shape-neutral structure and the transmission lines, and the shape-neutral structure does not change the shape of PCB traces and reduces both crosstalk and return loss.
    Type: Grant
    Filed: July 25, 2017
    Date of Patent: October 1, 2019
    Assignee: Optical Cable Corporation
    Inventors: Derrick F. Stikeleather, John Michael Ray, Ian J. Timmins
  • Patent number: 10432163
    Abstract: The present disclosure provides a variable filter circuit capable of controlling a band width and a center frequency of a pass band, and also capable of suppressing the total number of pieces of variable reactance. That is, a variable filter circuit includes a serial arm in which a plurality of circuit elements are connected in series with respect to a signal path and a parallel arm in which a plurality of circuit elements are connected in parallel with respect to the signal path, wherein the serial arm and the parallel arm each includes a variable reactance element, a series reactance element that is connected in series to the variable reactance element and resonates therewith, and a parallel reactance element that is connected in parallel to the variable reactance element and resonates therewith.
    Type: Grant
    Filed: August 2, 2017
    Date of Patent: October 1, 2019
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Hirotsugu Mori
  • Patent number: 10422607
    Abstract: Apparatus and methods for removing leakage from a qubit. In one aspect, an apparatus includes one or more qubits, wherein each qubit facilitates occupation of at least one of a plurality of qubit levels, the qubit levels including two computational levels and one or more non-computational levels that are each higher than the computational levels, wherein the qubit facilitates transitions between qubit levels associated with a corresponding transition frequency; a cavity, wherein the cavity defines a cavity frequency; one or more couplers coupling each qubit to the cavity; one or more couplers coupling the cavity to an environment external to the one or more qubits and the cavity; a frequency controller that controls the frequency of each qubit such that, for each qubit, the frequency of the qubit is adjusted relative to the cavity frequency such that a population of a non-computational level is transferred to the cavity.
    Type: Grant
    Filed: February 25, 2019
    Date of Patent: September 24, 2019
    Assignee: Google LLC
    Inventor: Rami Barends
  • Patent number: 10424824
    Abstract: An electronic apparatus includes a substrate and an electrical element mounted on the substrate. The electrical element includes a base material including a first principal surface and a second principal surface that are deformable and flat or substantially flat surfaces and a conductor pattern included on the base material. The electrical element further includes a first connection portion and a second connection portion that connect to a circuit included on the substrate and a transmission line portion located in a position different from positions of the first connection portion and the second connection portion that electrically connects the first connection portion and the second connection portion. The conductor pattern includes a conductor pattern of the first connection portion, a conductor pattern of the second connection portion, a conductor pattern of the transmission line portion, and an electrical-element-side bonding pattern arranged in the transmission line portion.
    Type: Grant
    Filed: January 17, 2017
    Date of Patent: September 24, 2019
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Takahiro Baba, Akihiro Kikuchi, Genro Kato, Kosuke Nishino, Nobuo Ikemoto
  • Patent number: 10389034
    Abstract: In an embodiment, an antenna is disclosed. The antenna comprises: a substrate of dielectric material, the substrate being substantially planar and defining a first surface and a second surface opposed to the first surface; an electrically conductive ground plane on the first surface, the ground plane defining a slot; a first feed line configured to receive a first input signal having a frequency within an operating frequency range, the first feed line extending over the slot on the second surface in a first direction by a length of between 0.3 and 0.
    Type: Grant
    Filed: January 16, 2015
    Date of Patent: August 20, 2019
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Sema Dumanli Oktar, Ian James Craddock, David Rhys Gibbins
  • Patent number: 10381741
    Abstract: A slot array antenna includes: a first conductive member having a first conductive surface and a plurality of slots therein, the slots being arrayed in a first direction and in a second direction which intersects the first direction; a second conductive member having a second conductive surface which opposes the first conductive surface; a plurality of waveguide members arrayed between the first and second conductive members along a direction which intersects the first direction, each waveguide member having an conductive waveguide face which extends along the first direction so as to oppose at least one of the slots; and an artificial magnetic conductor in a subregion which is within a region between the first and second conductive members but outside of a subregion containing the waveguide members. Neither an electric wall nor an artificial magnetic conductor exists in a space between two adjacent waveguide faces among the waveguide members.
    Type: Grant
    Filed: December 22, 2016
    Date of Patent: August 13, 2019
    Assignees: NIDEC CORPORATION, WGR CO., LTD.
    Inventors: Hideki Kirino, Hiroyuki Kamo
  • Patent number: 10349513
    Abstract: A system includes: a printed circuit board having a plurality of conductive traces; a processing device coupled to the printed circuit board and in electrical communication with the plurality of conductive traces; a first memory module and a second memory module in electrical communication with the plurality of conductive traces and sharing channels of the conductive traces, wherein the first memory module is physically more proximate to the processing device than is the second memory module; and an electronic band gap (EBG) structure physically disposed in an area between the first memory module and the second memory module.
    Type: Grant
    Filed: July 25, 2017
    Date of Patent: July 9, 2019
    Assignee: QUALCOMM Incorporated
    Inventor: Priyatharshan Pathmanathan
  • Patent number: 10333225
    Abstract: The embodiments herein provide a multiband reconfigurable filtenna comprising a monopole antenna coupled to a center split transmission line and a reconfigurable microstrip filter replacing a feed-in end of the center split transmission line to provide resonance to the monopole antenna at a plurality of frequency bands. The reconfigurable microstrip filter includes a C-shaped resonator (CSR), a meandered loop resonator (MLR), an Inverted Pulse Shaped Resonator (IPSR) and an Open Circuited Stub (OCS). Further, a plurality of switches is coupled to the reconfigurable microstrip filter to switch coupling of the monopole antenna between the CSR, the MLR, the IPSR and the OCS for operating the monopole antenna, at one of the plurality of frequency bands.
    Type: Grant
    Filed: February 24, 2018
    Date of Patent: June 25, 2019
    Inventors: Malathi Kanagasabai, Thipparaju Rama Rao, Sandeep Kumar Palaniswamy, Saffrine Kingsly, Mohammed Gulam Nabi Alsath, Deepa Thangarasu, Padmathilagam Sambandam, Sangeetha Subbaraj, Yogeshwari Panneer Selvam
  • Patent number: 10312564
    Abstract: A filter is disposed on a base board. The filter includes a first portion, a second portion, a ground portion, a first coupling portion and a second coupling portion. The first portion is disposed on a first layer in the base board to input signals. The second portion is disposed on the first layer to output signals. The ground portion is disposed on a second layer in the base board. The first coupling portion is disposed on the first layer. The first coupling portion is electrically coupled to the first portion and the second portion. The first coupling portion is electrically coupled to the ground portion through via holes. The second coupling portion is disposed on the first layer. The second coupling portion is electrically coupled to the first portion and the second portion. The second coupling portion is electrically coupled to the ground portion through the via holes.
    Type: Grant
    Filed: May 10, 2017
    Date of Patent: June 4, 2019
    Assignee: AMBIT MICROSYSTEMS (SHANGHAI) LTD.
    Inventors: Ming-Hsien Hsu, Shii-Rong Den
  • Patent number: 10304759
    Abstract: An electronic device has a first surface, a second surface opposite to the first surface, and sidewalls located between and adjoining the first and second surfaces. The electronic device includes contact pads on the first surface. The contact pads extend from the first surface to adjoining sidewalls, and abut the sidewalls.
    Type: Grant
    Filed: August 5, 2016
    Date of Patent: May 28, 2019
    Assignee: Nexperia B.V.
    Inventors: Kan Wae Lam, Shun Tik Yeung, Pompeo V. Umali, Chi Ho Leung, Chi Ling Shum
  • Patent number: 10297893
    Abstract: A circuit includes a conductive layer, an insulation layer on the conductive layer, a transmission line on the insulation layer, the transmission line having a first end and a second end, and a stub on the insulation layer and having a first section of a first constant width connected to the transmission line at a location on the transmission line between the first and second ends, and a second section of a second constant width adjacent to the first section. The first constant width is less than the second constant width.
    Type: Grant
    Filed: March 2, 2017
    Date of Patent: May 21, 2019
    Assignee: TOSHIBA MEMORY CORPORATION
    Inventor: Satoru Fukuchi
  • Patent number: 10276904
    Abstract: A resonant unit and a filter, where the resonant unit includes a dielectric substrate, a metal microstrip disposed on a plane of the dielectric substrate, where the metal microstrip is used as a signal input/output port, and a defected ground structure disposed on another plane opposite to the plane of the dielectric substrate, where the defected ground structure includes a ground loop and an interdigital structure located inside the ground loop, the interdigital structure includes multiple fingers, and the ground loop or at least one finger in the interdigital structure includes at least one embedded interdigital structure. Harmonic suppression capabilities of the resonant unit and the filter can be improved, and an area can be reduced.
    Type: Grant
    Filed: June 16, 2017
    Date of Patent: April 30, 2019
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Zeming Zhang, Huizhen Qian, Xun Luo
  • Patent number: 10270150
    Abstract: An electronic apparatus includes a first substrate and a second substrate mounted on the first substrate and having a smaller area than the first substrate. The second substrate extends in a longitudinal direction and has a planar or substantially planar shape with a uniform or substantially uniform width across all portions of the second substrate in the longitudinal direction. The second substrate includes a signal line, and a high-frequency transmission line including the signal line, and further includes an input/output pad electrically connected to the signal line, and an auxiliary pad arranged between two input/output pads, on the mounting surface of the second substrate. The first substrate includes lands each connected to the input/output pad and the auxiliary pad. The input/output pad and the auxiliary pad are each soldered on each of the lands of the first substrate and, thus, the second substrate is surface-mounted on the first substrate.
    Type: Grant
    Filed: October 11, 2016
    Date of Patent: April 23, 2019
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Takahiro Baba, Nobuo Ikemoto, Kosuke Nishino, Jun Sasaki
  • Patent number: 10259704
    Abstract: Nanopillar-based THz metamaterials, such as split ring resonator (SRR) MMs, utilizing displacement current in the dielectric medium between nanopillars that significantly increases energy storage in the MMs, leading to enhanced Q-factor. A metallic nanopillar array is designed in the form of a single gap (C-shape) SRR. Vacuum or dielectric materials of different permittivities are filled between the nanopillars to form nanoscale dielectric gaps. In other embodiments, formation of patterned nanowires using anodic aluminum oxide (AAO) templates with porous structures of different heights resulting from an initial step difference made by etching the aluminum (Al) thin film with a photoresist developer prior to the anodization process are disclosed.
    Type: Grant
    Filed: April 7, 2017
    Date of Patent: April 16, 2019
    Assignee: Regents of the University of Minnesota
    Inventors: Jeong-Hyun Cho, Chao Liu, Seung Yeon Lee
  • Patent number: 10249582
    Abstract: The embodiments described herein use resonant circuits to provide isolation between closely proximate conductors. For example, these resonant circuits can be used to reduce unwanted electromagnetic coupling and minimize crosstalk energy between package leads, bonding wires, and circuit board traces on radio frequency (RF) electronic devices, including RF power amplifiers. To facilitate a reduction in electromagnetic coupling, the resonant circuit is configured resonate with the closely proximate conductors at a selected frequency f0, and when resonating at the selected frequency f0 the resonant circuit provides a path to ground for the crosstalk energy. This path to ground reduces the crosstalk energy that would otherwise be shared between the two closely proximate conductors, and thus provides the electromagnetic isolation between the conductors.
    Type: Grant
    Filed: December 19, 2016
    Date of Patent: April 2, 2019
    Assignee: NXP USA, Inc.
    Inventor: Nick Yang
  • Patent number: 10193518
    Abstract: First no-electrode-forming areas where first wiring electrodes such as internal wiring electrodes and external connection terminals are not formed are set to ranges that overlap inductor components in a plan view of at least one of dielectric layers of a first substrate, and second no-electrode-forming areas where second wiring electrodes such as internal wiring electrodes and mounting electrodes are not formed are set to ranges that overlaps the inductor components in a plan view of at least one of dielectric layers of a second substrate. Accordingly, reduction of the inductance of the inductor components, which is caused by the first and second wiring electrodes crossing the magnetic field of the inductor components, can be suppressed. Therefore, the overall component size can be reduced without deteriorating the Q value of the inductor components by configuring an RF component with a stacking structure.
    Type: Grant
    Filed: January 27, 2017
    Date of Patent: January 29, 2019
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Seigo Hino
  • Patent number: 10186744
    Abstract: The microstrip Fano resonator switch is a microstrip circuit having a varactor diode electrically connected between identical quarter-wavelength open stubs formed from two elongate planar strip elements disposed on a substrate having a permittivity of approximately 2.94 and a thickness of approximately 0.76 mm, the circuit forming a Fano resonator switch that provides approximately 50 dB of isolation.
    Type: Grant
    Filed: February 6, 2017
    Date of Patent: January 22, 2019
    Assignee: United Arab Emirates University
    Inventors: Rashad Ramzan, Muhammad Amin, Omar Farooq Siddiqui, Nabil Bastaki
  • Patent number: 10186743
    Abstract: The microstrip circuits exhibiting electromagnetically induced transparency and Fano resonance include a microstrip transmission line and at least two identical parallel quarter-wavelength open stubs extending from the transmission line in close proximity so that mutual coupling between the electromagnetic fields at adjacent ends of the stubs induces Faro resonances and electromagnetically induced transparency (EIT). The circuits may be used for microwave buffers, or when a variable capacitance, such as a varactor, is inserted between the open ends of the stubs, the circuits may be used for active transmission phase control.
    Type: Grant
    Filed: January 30, 2017
    Date of Patent: January 22, 2019
    Assignee: United Arab Emirates University
    Inventors: Rashad Ramzan, Muhammad Amin, Omar Farooq Siddiqui, Nabil Bastaki
  • Patent number: 10178764
    Abstract: A Printed Circuit Board (PCB) includes a via extending through at least one layer of the PCB. The PCB may also include a first catch pad connected to the via and located within a first metal layer of the PCB. The first catch pad may have a first size. The PCB may further include a second catch pad connected to the via and located within a second metal layer of the PCB. The second catch pad may have a second size greater than the first size. The second catch pad may overlap horizontally with a portion of a metallic feature in the first metal layer to obstruct light incident on a first side of the PCB from transmission to a second side of the PCB through a region of dielectric material near the via.
    Type: Grant
    Filed: June 5, 2017
    Date of Patent: January 8, 2019
    Assignee: Waymo LLC
    Inventors: Augusto Tazzoli, Blaise Gassend
  • Patent number: 10158153
    Abstract: Systems and methods are provided for creating higher order microwave bandstop filters with total through-line length of significantly less than one-quarter wavelength at the filter center frequency. The mixed electric and magnetic field coupling bandstop filter topologies provided by embodiments of the present disclosure can be used to reduce the size, weight, and throughline insertion loss of microwave bandstop filters. In an embodiment, if the relative field strengths are intelligently designed for each coupling structure, effective phase offsets can be produced between resonators along the through line. These phase offsets can be used to absorb some or all of the length of the ?/4 inverters between resonators.
    Type: Grant
    Filed: January 1, 2018
    Date of Patent: December 18, 2018
    Assignee: The United States of America, as represented by the Secretary of the Navy
    Inventors: Andrew C. Guyette, Eric J. Naglich
  • Patent number: 10153535
    Abstract: A flat plate assembly is provided from at least a pair of plates with at least one surface of one plate have one or more relief channels provided therein around epoxy bonded signal channels. The relief channels are provided having a size and shape selected to control the flow of a liquid bonding adhesive. Adhesive location can thus be controlled through geometry of the relief channels rather than through process controls. Thus, this approach reduces dependence on adhesive process control, reduces wicking of adhesive into signal channels and reduces the number of voids in a bond line of a bonded flat plate assembly.
    Type: Grant
    Filed: September 20, 2016
    Date of Patent: December 11, 2018
    Assignee: Raytheon Company
    Inventor: Matthew J. Wargo
  • Patent number: 10142029
    Abstract: Device for modulating the intensity of an optical signal on four levels, this device comprising: a first resonant ring modulator comprising an output port capable of delivering a first modulated optical signal, a second resonant ring modulator comprising an output port capable of delivering a second modulated optical signal, an optical assembler comprising: a first input optically coupled to the output port of the second resonant ring modulator, a second input optically coupled to the output port of the first resonant ring modulator, and an output capable of delivering the optical signal of which the intensity is modulated on four different levels constructed by combining the optical signals received on its first and second inputs.
    Type: Grant
    Filed: November 8, 2016
    Date of Patent: November 27, 2018
    Assignee: Commissariat A L'Energie Atomique et aux Energies Alternatives
    Inventors: Olivier Dubray, Benjamin Blampey, Sylvie Menezo