Abstract: The disclosure relates to a composite comprising a metal film having a first major surface and opposed second major surface, at least a portion of the metal film having a sheet resistance of at least 15 ?/sq, an optical transmittance of at least 60% within the visible spectrum, and tunable bandpass filtering effect in the THz frequency range; a dielectric substrate comprising a first major surface and opposed second major surface; the metal film first major surface located on at least a portion of the dielectric substrate first major surface. The disclosure also relates to methods of making such composites and articles comprising such composites.

Abstract: An apparatus includes a first conductor trace arranged to electrically couple a first complementary signal to provide differential signaling. The first conductor trace includes a first plurality of split traces to conduct the first complementary signal, and a first plurality of tie bars to connect the first split traces.

Abstract: The high-frequency transmission line is configured by stacking conductor layers and an insulating layer, and is provided with: a signal via, which extends in a stacking direction and electrically connects the conductor layers together; an input line, which is arranged in one of the conductor layers and inputs an electrical signal to the signal via; a signal line, which is arranged in another one of the conductor layers and is connected to the input line through the signal via; a ground plane, which is arranged in any one of the conductor layers; a conductor arm arranged within a separation region that separates the signal via and the ground plane; and a conductor connection arranged within the separation region and connecting the conductor arm and the ground plane. The conductor arm and the conductor connection are configured to suppress an electrical signal of a predetermined frequency within an electrical signal.

Abstract: A polycrystal having a physical property that enables an AC resistance value to drop sharply is used to reduce transmission loss of a high frequency signal being transmitted. A high frequency transmission device D1 is provided that includes a dielectric 100 and a transmission line 200 adapted for transmitting therethrough high frequency signals. At least part of the transmission line 200 is located on or inside the dielectric 100. At least part of the transmission line 200 is composed of a polycrystal composed of conductor fine particles. The polycrystal has a physical property such that, when a high frequency signal to be transmitted through the transmission line 200 is of frequencies within one or more specific frequency bands, the AC resistance value drops sharply.

Abstract: Deterioration is reduced in filter characteristics in a type of bandpass filter that is called a strip-line filter or a microstrip filter. A bandpass filter (filter 10) includes a ground conductor layer (12), a plurality of resonators (141 to 146) arranged in a layer spaced from the ground conductor layer (12), a first line (line 151) connected to a first-pole resonator (141) and a second line (line 152) connected to a last-pole resonator (146), wherein a direction in which the first line (line 151) is drawn out from the first-pole resonator (141) and a direction in which the second line (line 152) is drawn out from the last-pole resonator (146) are opposite to each other.

Abstract: An architecture for, and techniques for fabricating, a thermal decoupling device are provided. In some embodiments, thermal decoupling device can be included in a thermally decoupled cryogenic microwave filter. In some embodiments, the thermal decoupling device can comprise a dielectric material and a conductive line. The dielectric material can comprise a first channel that is separated from a second channel by a wall of the dielectric material. The conductive line can comprise a first segment and a second segment that are separated by the wall. The wall can facilitate propagation of a microwave signal between the first segment and the second segment and can reduce heat flow between the first segment and the second segment of the conductive line.

Abstract: A wide-bandwidth resonant circuit is provided. In an embodiment disclosed herein, the wide-bandwidth resonant circuit includes a positive resonant circuit coupled in parallel to a negative resonant circuit. The positive resonant circuit and the negative resonant circuit can be configured to collectively exhibit certain impedance characteristics across a wide bandwidth. As a result, it is possible to utilize the wide-bandwidth resonant circuit to support a variety of wide-bandwidth applications, such as in a wide-bandwidth signal filter circuit.

Abstract: A first end of a linear conductor of a resonator is connected to a ground conductor on a first surface of a dielectric substrate through a via. A second end of the linear conductor of the resonator is left open. A first end of a linear conductor of a resonator is connected to a ground conductor on a second surface of the dielectric substrate through a via. A second end of the linear conductor of the resonator is left open. An input-output line is connected to the ground conductor on the second surface of the dielectric substrate through a via. An input-output line is opposed to the second ends of the linear conductor of the two resonators.

Abstract: A composite electronic component includes a multilayered body in which a plurality of dielectric layers and a plurality of conductor layers are alternately stacked, a first resonant circuit including a first line and a first capacitor, the first line being formed of one or more first conductor layers of the conductor layers, the first capacitor including a first electrode formed of a plurality of second conductor layers of the conductor layers, and a second resonant circuit including a second line and a second capacitor, the second line being formed of one or more third conductor layers of the conductor layers, the second capacitor including a second electrode formed of the second conductor layers, the second conductor layers being located between the one or more first conductor layers and the one or more third conductor layers.

Abstract: A filter device includes a filter including at least one inductor and at least one capacitor, and a stack of a plurality of dielectric layers and a plurality of conductor layers. The plurality of dielectric layers include at least one first dielectric layer formed of a first dielectric material and at least one second dielectric layer formed of a second dielectric material. The plurality of conductor layers include at least one first conductor layer in contact with the at least one first dielectric layer, and at least one second conductor layer in contact with the at least one second dielectric layer. The temperature coefficient of resonant frequency of the first dielectric material has a positive value. The temperature coefficient of resonant frequency of the second dielectric material has a negative value.

Abstract: The disclosure is directed to an integrated circuit (IC) die stacked with a backer die, including capacitors and thermal vias. The backer die includes a substrate material to contain and electrically insulate one or more capacitors at a back of the IC die. The backer die further includes a thermal material that is more thermally conductive than the substrate material for thermal spreading and increased heat dissipation. In particular, the backer die electrically couples capacitors to the IC die in a stacked configuration while also spreading and dissipating heat from the IC die. Such a configuration reduces an overall footprint of the electronic device, resulting in decreased integrated circuits (IC) packages and module sizes. In other words, instead of placing the capacitors next to the IC die, the capacitors are stacked on top of the IC die, thereby reducing an overall surface area of the package.

Abstract: A filter circuit includes an input node, an output node, a first filtering element and a second filtering element. The first filtering element has a first terminal coupled to the input node and a second terminal, and is configured to provide a first signal conducting path toward the second terminal for conducting a first signal received at the input node to the second terminal. The second filtering element has a first terminal coupled to the input node and a second terminal, and is configured to provide a second signal conducting path toward the output node for conducting a second signal received at the input node to the output node. The second terminal of the first filtering element and the second terminal of the second filtering element are open-circuit terminals.

Abstract: A band-pass filter includes an unbalanced port, a first balanced port, a second balanced port, and first to third resonators provided between the unbalanced port and the first and second balanced ports. The second resonator and the third resonator each are a resonator with both ends open. The second resonator and the third resonator are adjacent to each other in a circuit configuration, and electromagnetically coupled by magnetic coupling as main coupling. The first resonator is provided closer to the second resonator than to the third resonator, and jump-coupled to the third resonator.

Abstract: A filter structure includes a ground plane in a first metal layer of an integrated circuit (IC) package, a plate in a second metal layer of the IC package, a dielectric layer between the ground plane and the plate, the ground plane, the dielectric layer, and the plate thereby being configured as a capacitive device, and an inductive device in a third metal layer of the IC package. The inductive device is electrically connected to the plate, and the plate and the inductive device are configured to have a resonance frequency greater than 1 GHz.

Abstract: Provided are a resonator having a good Q value and a filter using the resonator. The resonator has: a via electrode portion formed inside a dielectric substrate; a plurality of shielding conductors formed on the dielectric substrate to surround the via electrode portion; a first strip line which is connected to one end of the via electrode portion in the dielectric substrate and faces a first shielding conductor among the plurality of shielding conductors; and a second strip line which is connected to the other end of the via electrode portion in the dielectric substrate and faces a second shielding conductor among the plurality of shielding conductors.

Abstract: An electronic apparatus includes a substrate and an electrical element mounted on the substrate. The electrical element includes a base material including a first principal surface and a second principal surface that are deformable and flat or substantially flat surfaces and a conductor pattern included on the base material. The electrical element further includes a first connection portion and a second connection portion that connect to a circuit included on the substrate and a transmission line portion located in a position different from positions of the first connection portion and the second connection portion that electrically connects the first connection portion and the second connection portion. The conductor pattern includes a conductor pattern of the first connection portion, a conductor pattern of the second connection portion, a conductor pattern of the transmission line portion, and an electrical-element-side bonding pattern arranged in the transmission line portion.

Abstract: An optical device may include an optical subassembly and a digital signal processor (DSP). The optical device may include a radio frequency (RF) interconnect that electrically connects the optical subassembly and the DSP. The optical device may include a passive RF filter on one or more transmission lines of the RF interconnect.

Abstract: An electronic component includes a body having a side surface, coil conductor layers wound along main surfaces parallel to the side surface, and capacitor conductor layers each having a substantially plate-like shape parallel to the side surface. The coil conductor layers and the capacitor conductor layers are arranged in a widthwise direction perpendicular to the side surface. The capacitor conductor layers include first and second capacitor conductor layers adjacent to each other in the widthwise direction. The coil conductor layers include a first coil conductor layer that is in the same layer as the first capacitor conductor layer and a second coil conductor layer that is in the same layer as the second capacitor conductor layer. The shortest distance between the first coil conductor layer and the first capacitor conductor layer is larger than the shortest distance between the second coil conductor layer and the second capacitor conductor layer.

Abstract: A radio frequency module includes a first terminal, a second terminal, a third terminal, a first switching circuit, a bandpass filter, a first band elimination filter, and a first wiring conductor. The first switching circuit switches between a connection between a first switch terminal and a second switch terminal and a connection between the first switch terminal and a third switch terminal. The bandpass filter is disposed on a first signal path connecting the first terminal to the first switch terminal, and has a first passband. The first band elimination filter is disposed on a second signal path connecting the second switch terminal to the second terminal, and has a first elimination band included in the first passband. The first wiring conductor forms a third signal path connecting the third switch terminal to the third terminal.

Abstract: In a transmission line, a first ground conductor pattern and a second ground conductor pattern are connected through a first interlayer connecting conductor, and the first ground conductor pattern and a third ground conductor pattern are connected through a second interlayer connecting conductor. A first signal conductor pattern includes a first bypassing pattern portion that bypasses the first interlayer connecting conductor, and a second signal conductor pattern includes a second bypassing pattern portion that bypasses the second interlayer connecting conductor. Bypassing directions of the first bypassing pattern portion and the second bypassing pattern portion are opposite to each other.

Abstract: Described is a bandpass filter comprising a multi-layered body, a first resonator conductor formed on a first layer of the body and a second resonator conductor formed on a second, tower layer of the body. The first resonator conductor and the second resonator conductor comprise a first coupling area formed by only a partial overlap of the first resonator conductor and the second resonator conductor. A length of each said resonator conductor is in the range of ?g/3 to ?g/5, where ?g. is a center wavelength of the bandpass filter passband.

Abstract: A multilayer electronic device may include a plurality of dielectric layers stacked in a Z-direction that is perpendicular to an X-Y plane. The device may include a first conductive layer overlying one of the plurality of dielectric layers. The multilayer electronic device may include a second conductive layer overlying another of the plurality of dielectric layers and spaced apart from the first conductive layer in the Z-direction. The second conductive layer may overlap the first conductive layer in the X-Y plane at an overlapping area to form a capacitor. The first conductive layer may have a pair of parallel edges at a boundary of the overlapping area and an offset edge within the overlapping area that is parallel with the pair of parallel edges. An offset distance between the offset edge and at least one of the pair of parallel edges may be less than about 500 microns.

Abstract: A wireless communication system includes a first coupler having a first pair of electrodes and second coupler having a second pair of electrodes that at least partially oppose the first pair of electrodes. A transmission circuit applies a differential signal to the first coupler. A reception circuit receives a differential signal output from the second coupler based on electromagnetic coupling between the first coupler and the second coupler. A distance between centroids of the first pair of electrodes differs from a distance between centroids of the second pair of electrodes.

Abstract: A split-ring resonator comprises a first ground terminal which is separated from a ground pattern.

Abstract: An architecture for, and techniques for fabricating, a thermal decoupling device are provided. In some embodiments, thermal decoupling device can be included in a thermally decoupled cryogenic microwave filter. In some embodiments, the thermal decoupling device can comprise a dielectric material and a conductive line. The dielectric material can comprise a first channel that is separated from a second channel by a wall of the dielectric material. The conductive line can comprise a first segment and a second segment that are separated by the wall. The wall can facilitate propagation of a microwave signal between the first segment and the second segment and can reduce heat flow between the first segment and the second segment of the conductive line.

Abstract: A test socket for a device under test (DUT) is disclosed in several embodiments. One embodiment shows a test socket base (16) with apertures (30) for insertion of test pin insert blocks (28). The blocks are inserted top—in or bottom—in and are provided with registration bosses 80 and teeth 92 or other means for maintaining registration. Blocks are provided with dielectric constants to achieve different frequency response relative to other pins. To achieve great EMI and cross talk isolation, the socket may be made of aluminum with hard anodize coating to insulate test pins (32) from the housing.

Abstract: A RAMP-radio frequency (RAMP-RF) assembly is provided and includes an RF panel including a microstrip interface, a plate including a stripline interface and a microstrip-to-stripline transition element operably connectable to the microstrip interface and to the stripline interface.

Abstract: A planar optical resonator capable of parametrically generating frequency combs includes two optical waveguide cores forming inner and outer loops, the resonator having two sections, in which laterally adjacent segments of the cores are resonantly optically coupled to each other at two separate wavelength regions causing separate peaks in the second order dispersion. The resonator sections may be configured to suppress integrated dispersion of the resonator in a broad spectral range favorably for generating a spectrally uniform frequency comb.

Abstract: An infusion pump assembly is disclosed. The infusion pump assembly includes a reservoir for receiving an infusible fluid, a pump assembly for pumping a quantity of infusible fluid from the reservoir to an exit, a first valve assembly configured to selectively isolate the pump assembly from the reservoir, a second valve assembly configured to selectively isolate the exit from the pumping assembly, and a split ring resonator antenna having a resonant frequency comprising a plurality of planar metallic layers.

Abstract: To achieve a filter circuit that is configured to have a good frequency rejection characteristic and suppress an increase in size due to mounting, in a more preferred aspect. A filter circuit includes a first signal line that is arranged to extend longitudinally, and a second signal line that is arranged to extend in parallel with the first signal line, in which the second signal line has one end that is electrically connected to the first signal line, and the other end that is open, in a longitudinal direction, and a length in the longitudinal direction that is determined according to a frequency of a signal to be blocked of signals transmitted through the first signal line.

Abstract: The present invention includes a method of creating electrical air gap low loss low cost RF mechanically and thermally stabilized interdigitated resonate filter in photo definable glass ceramic substrate. Where a ground plane may be used to adjacent to or below the RF filter in order to prevent parasitic electronic signals, RF signals, differential voltage build up and floating grounds from disrupting and degrading the performance of isolated electronic devices by the fabrication of electrical isolation and ground plane structures on a photo-definable glass substrate.

Abstract: A semiconductor package structure is provided. The semiconductor package structure includes a substrate, a frame, a redistribution layer, and a first semiconductor die. The substrate has a wiring structure and is surrounded by a molding material. The frame is disposed in the molding material and surrounds the substrate. The redistribution layer is disposed over the substrate and electrically coupled to the wiring structure. The first semiconductor die is disposed over the redistribution layer.

Abstract: A tunable antenna isolator includes a first wall, a second wall, and an electromagnetic band-gap (EBG) structure located between the first wall and the second wall. The first wall may be a metallic wall or an EBG structure, and the second wall may be a metallic wall or an EBG structure.

Abstract: The disclosed embodiments provide an absorptive coupled-line bandpass filter. This bandpass filter includes a first port, which is coupled to a first absorptive stub, and a second port, which is coupled to a second absorptive stub. The bandpass filter also includes a coupled-line bandpass section coupled between the first and second ports, wherein the coupled-line bandpass section comprises a set of one or more parallel strip line resonators, which are coupled together in series and are coupled to the first and second ports through overlapping coupled-line sections, wherein at a center frequency of a passband for the absorptive coupled-line bandpass filter, the first and second absorptive stubs appear as open circuits, and outside of the passband, the first and second absorptive stubs appear as matched loads to ground and contribute to absorption of out-of-band signals.

Abstract: A radio frequency filter includes a first conductive pattern; a second conductive pattern connected to a first point of the first conductive pattern and extended; a third conductive pattern connected to a second point of the first conductive pattern and extended to surround a portion of the second conductive pattern; a fourth conductive pattern; a fifth conductive pattern connected to a third point of the fourth conductive pattern and extended; and a sixth conductive pattern connected to a fourth point of the fourth conductive pattern and extended to surround a portion of the fifth conductive pattern. The first conductive pattern extends toward the fourth conductive pattern and the fourth conductive pattern extends toward the first conductive pattern. A distance between the first conductive pattern and the fourth conductive pattern is greater than or equal to a distance between the third conductive pattern and the sixth conductive pattern.

Abstract: An LC resonance element (10) includes a dielectric film (12), a common electrode (11) formed of a thin-film conductor on a lower surface (12D) of the dielectric film, a first capacitor (C1) and a second capacitor (C2) that are connected in series via the common electrode (11) and constitute a thin-film capacitor (TC), first and second external connection terminals (14A, 14B) formed on an upper surface (12U) of the dielectric film, a thin-film conductive wire (16) constituting a thin-film inductor (TL), a first upper electrode (13A) of the first capacitor formed on the upper surface (12U), and a second upper electrode (13B) of the second capacitor formed on the upper surface (12U). The thin-film conductive wire (16) is formed in a region (R2) located on the upper surface (12U) of the dielectric film and outside the common electrode (11) in plan view.

Abstract: A band pass filter (1) includes two resonators (8) and (10) including respectively linear conductors (9) and (11) disposed inside a dielectric substrate (2), and a pair of input-output lines (13) and (14) to which the two resonators (8) and (10) are connected in parallel. Both ends of the linear conductor (9) of the resonator (8) are left open. The resonator (10) includes vias (12A) and (12B) through which both ends of the linear conductor (11) of the resonator (10) are connected to a ground conductor (6) on a first surface (2A) of the dielectric substrate (2). The pair of input-output lines (13) and (14) include respectively vias (15A) and (15B) for connection to a ground conductor (7) that is disposed on a second surface (2B) of the dielectric substrate (2).

Abstract: A tunable band-stop filter, a method of driving a tunable band-stop filter and an electronic device are provided. The tunable band-stop filter includes a first substrate, a second substrate, and a liquid crystal layer sandwiched between the first substrate and the second substrate. The first substrate includes a wire structure on a first base substrate, the second substrate includes a common electrode on a second base substrate. The wire structure includes a first wire structure and a second wire structure. The first wire structure, the common electrode, and the liquid crystal layer between the first wire structure and the common electrode constitute a first phase modulation structure, and the second wire structure, the common electrode, and the liquid crystal layer between the second wire structure and the common electrode constitute a second phase modulation structure.

Abstract: A high-frequency measurement line structure includes a circuit board structure and a multi-conductor transmission line section, a high-frequency measurement probe pad section and a transition section which are formed by the circuit board structure, wherein the transition section is arranged between the multi-conductor transmission line section and the high-frequency measurement probe pad section to be connected to the multi-conductor transmission line section and the high-frequency measurement probe pad section. The high-frequency measurement probe pad section includes a group of high-frequency measurement probe pads arranged on a first metal layer of the circuit board structure to touch a high-frequency probe to transmit a high-frequency signal.

Abstract: Apparatuses for providing external terminals of a semiconductor device are described. An example apparatus includes: a connection wiring of a ring-shape having comprising a hole and a conductive layer surrounding the hole, the conductive layer including a first connection point and a second connection point that are located so that a straight line between the first connection point and the second connection point crosses over the hole; an external terminal coupled to the first connection point of the conductive layer of the connection wiring; and an internal circuit coupled to the second connection point of the conductive layer of the connection wiring.

Abstract: A semiconductor package structure is provided. The semiconductor package structure includes a substrate, a semiconductor die and a frame. The semiconductor die is disposed over the substrate. The frame is disposed over the substrate, wherein the frame is adjacent to the semiconductor die, and the upper surface of the frame is lower than the upper surface of the semiconductor die.

Abstract: An electronic component includes an upper surface, a lower surface, a side surface, a circuit pattern, and an upper surface shield electrode. The circuit pattern is provided inside the electronic component. The upper surface shield electrode is disposed on the upper surface. In a plan view from a normal direction of the upper surface, a center of gravity of the upper surface shield electrode is spaced from a center of gravity of the upper surface.

Abstract: The disclosure relates to a filter including dielectric substrate, ground and microstrip line layers, and signal and ground vias. The ground layer is formed on the dielectric substrate and has a ground plane and signal terminal contacts. The microstrip line layer is located on the dielectric substrate and includes microstrip resonators, common electrode and input and output terminal contacts. The input and output terminal contacts are connected to the microstrip resonators. The signal and ground vias extend among the ground layer, the dielectric substrate, and the microstrip line layer. The signal terminal contacts are connected to the input and output terminal contacts through the signal vias. The ground plane is connected to the common electrode through the ground vias. The filter further includes at least one capacitive coupling unit capacitive-coupled with two of the microstrip resonators adjacent to each other.

Abstract: A band pass filter includes a first filter circuit, a second filter circuit, a first intermediate circuit, a second intermediate circuit, and a ninth capacitor. The first intermediate circuit includes a seventh inductor connected between a fifth capacitor and a sixth capacitor. The second intermediate circuit includes an eighth inductor connected between a seventh capacitor and an eighth capacitor. The ninth capacitor is connected between the first intermediate circuit and the second intermediate circuit.

Abstract: This disclosure describes an embodiment of an invention that is sending an information and/or control data signal on a differential signal pair. This embodiment of the apparatus 200 includes an information and/or control data signal 220; a balanced differential signal pair of conductors 212 that includes a positive 202 and a negative 204 differential conductor; a first network of circuits 214 that transforms the information signal 220 into a common mode voltage on the individual conductors 202 and 204 of the balanced differential signal pair of conductors; and a second network of circuits 216 that transforms the common mode voltage on the individual conductors 202 and 204 of the balanced differential signal pair of conductors 212 back to the data signal 222; where the first network of circuits 214 couples to the second network of circuits 216 via the balanced differential signal pair of conductors 202 and 204.

Abstract: Apparatus and methods for removing leakage from a qubit. In one aspect, an apparatus includes one or more qubits, wherein each qubit facilitates occupation of at least one of a plurality of qubit levels, the qubit levels including two computational levels and one or more non-computational levels that are each higher than the computational levels, wherein the qubit facilitates transitions between qubit levels associated with a corresponding transition frequency; a cavity, wherein the cavity defines a cavity frequency; one or more couplers coupling each qubit to the cavity; one or more couplers coupling the cavity to an environment external to the one or more qubits and the cavity; a frequency controller that controls the frequency of each qubit such that, for each qubit, the frequency of the qubit is adjusted relative to the cavity frequency such that a population of a non-computational level is transferred to the cavity.

Abstract: This disclosure relates to Superconducting Quantum Interference Apparatuses, such as SQUID arrays and SQUIFs. A superconducting quantum interference apparatus comprises an array of loops each loop constituting a superconducting quantum interference device. The array comprises multiple columns, each of the columns comprises multiple rows connected in series, each of the multiple rows comprises a number of loops connected in parallel, and the number of loops connected in parallel in each row is more than two and less than 20 to improve a performance of the apparatus. It is an advantage that keeping the number of loops in parallel below 20 improves the performance of the apparatus. This is contrary to existing knowledge where it is commonly assumed that a larger number of parallel loops would increase performance.

Abstract: A technique relates to a superconducting microwave combiner. A first filter through a last filter connects to a first input through a last input, respectively. The first filter through the last filter each has a first passband through a last passband, respectively, such that the first passband through the last passband are each different. A common output is connected to the first input through the last input via the first filter through the last filter.

Abstract: A band pass filter is provided with a first filter circuit which includes a first resonant circuit including a first inductor and a second resonant circuit including a second inductor, a second filter circuit which includes a third resonant circuit including a third inductor and a fourth resonant circuit including a fourth inductor, and a fifth resonant circuit including a fifth inductor. The fifth inductor is electromagnetically coupled to each of the first inductor, the second inductor, the third inductor, and the fourth inductor.

Abstract: A filter which stops the propagation of an electromagnetic wave of a predetermined frequency band in a signal line or a power supply line is provided. This filter is a conductor connected to the signal line or the power supply line. This conductor is configured to include a linear portion. The first portion of the linear portion with an end portion connected to the signal line or the power supply line has the first width, and the second portion different from the first portion of the linear portion has the second width different from the first width.