Abstract: A digital system has a substrate having a top surface on which a waveguide is formed on the top surface of the substrate. The waveguide is formed by a conformal base layer formed on the top surface of the substrate, two spaced apart sidewalls, and a top conformal layer connected to the base layer to form a longitudinal core region. The waveguide may be a metallic or otherwise conductive waveguide, a dielectric waveguide, a micro-coax, etc.

Abstract: Aspects of the subject disclosure may include, for example a communication device that includes first and second waveguide devices that provide communications via electromagnetic waves that propagate along a transmission medium without utilizing an electrical return path, where the electromagnetic waves are guided by the transmission medium. The communication device can include a housing supporting a first plurality of antennas and a second plurality of antennas. The communication device can include a support structure physically connecting the first and second waveguide devices with the housing. Other embodiments are disclosed.

Abstract: Disclosed is a printed-circuit board (PCB) structure having an electromagnetic-tunnel-embedded architecture, the PCB structure including a PCB, and an EM-tunnel-embedded in the PCB, wherein the EM-tunnel includes a dielectric core and a metal clad which surrounds the dielectric core and has at least one port exposed to a surface of the PCB.

Abstract: A steerable beam antenna includes a rotatable drum having a diffraction grating surface, and a waveguide feed including first and second conductive metal bases extending axially along the length of the drum, each of the bases having an inner surface spaced from and opposed to the inner surface of the other base, and a proximal surface spaced from the drum surface by a gap. First and second parallel conductive metal plates extend distally from the first and second bases, respectively, the first and second plates having respective inner surfaces separated by an inter-plate space. First and second dielectric strips are flush-mounted on the inner surfaces of the first and second conductive metal bases, respectively, the first dielectric strip extending longitudinally along the inner surface of the first base, and the second dielectric strip extending longitudinally along the inner surface of the second base, opposite the first dielectric strip.

Abstract: A flexible and twistable terahertz waveguide assembly has a flexible waveguide with waveguide flange connectors at its ends. The flexible waveguide comprises a segmented tube of a plurality of tube segments which are connected to each other. The tube encloses a dielectric waveguide which is held by means of threads (filaments) at the center of the tube. The individual segments are tiltable and/or pivotable against each other, allowing bending and twisting of the waveguide cable.

Abstract: Dielectric coupler devices and dielectric coupling systems for communicating EHF electromagnetic signals, and their methods of use. The coupler devices include an electrically conductive body having a major surface, the electrically conductive body defining an elongate recess, and the elongate recess having a floor, where a dielectric body is disposed in the elongate recess and configured to conduct an EHF electromagnetic signal.

Abstract: An antenna bracket for electronic devices includes a solid bracket having an aperture formed therethrough. The solid antenna bracket has side walls that are rounded to a predetermined radius, and at least one antenna pocket positioned on said side walls. The antenna pocket receives and secures at least one antenna. The antenna bracket has a polygon shape that follows the contours of the electronic device housing.

Abstract: Aspects of the subject disclosure may include, for example, a transmission device that includes a transmitter that generates a first electromagnetic wave to convey data, the first electromagnetic wave having at least one carrier frequency and corresponding wavelength. A coupler couples the first electromagnetic wave to a transmission medium having at least one inner portion surrounded by a dielectric material, the dielectric material having an outer surface and a corresponding circumference, wherein the coupling of the first electromagnetic wave to the transmission medium forms a second electromagnetic wave that is guided to propagate along the outer surface of the dielectric material via at least one guided-wave mode that can include an asymmetric mode, wherein the at least one carrier frequency is within a microwave or millimeter-wave frequency band and wherein the at least one corresponding wavelength is less than the circumference of the transmission medium. Other embodiments are disclosed.

Abstract: Embodiments of the present invention provide a multi-polarization substrate integrated waveguide antenna. In the multi-polarization substrate integrated waveguide antenna of the present invention, the antenna is of a multi-layer structure and includes a first metal copper clad layer, a first dielectric layer, a second metal copper, clad layer, a second dielectric layer, and a third metal copper clad layer successively from top to bottom, where plated through holes are provided on both the first dielectric layer and the second dielectric layer, and etching grooves are provided on both the first metal copper clad layer and the second metal copper clad layer. The embodiments of the present invention resolve a problem that feeding efficiency is reduced in a high frequency application when a microstrip is used to feed electricity.

Abstract: A waveguide device includes: an electrically conductive member having an electrically conductive surface; a waveguide member having an electrically-conductive waveguide face of a stripe shape opposing the electrically conductive surface, the waveguide member extending along the electrically conductive surface; and an artificial magnetic conductor extending on both sides of the waveguide member. The waveguide member has a bend at which the direction that the waveguide member extends changes. A waveguide which is defined by the electrically conductive surface, the waveguide face, and the artificial magnetic conductor includes a gap enlargement where a gap between the electrically conductive surface and the waveguide face is locally increased. In a perspective view along a direction perpendicular to the electrically conductive surface, at least a portion of the bend has an overlap with the gap enlargement.

Abstract: The waveguide device, in which first/second openings are formed at end parts of a waveguide path, comprises a waveguide path obtained by uniting first/second waveguides. The first waveguide is provided with a first recessed part which has an opening with a same shape as the first opening and has a bottom part formed in a first direction as seen from the opening. The second waveguide is provided with a second recessed part which has an opening with a same shape as the second opening and has a bottom part formed in a second direction as seen from the opening. The first/second waveguides are united in a manner such that, positions of the bottom parts of the first/second recessed parts are different from each other in a direction differing from the first/second directions, and the first/second recessed parts connect with each other at the respective bottom parts.

Abstract: Composite Right/Left Handed (CRLH) Leaky-Wave Antennas (LWAs) are a class of radiating elements characterized by an electronically steerable radiation pattern. The design is comprised of a cascade of CRLH unit-cells populated with varactor diodes. By varying the voltage across the varactor diodes, the antenna can steer its directional beam from broadside to backward and forward end-fire directions. A CRLH Leaky-Wave Antenna for the 2.4 GHz Wi-Fi band is miniaturized by etching a Complementary Split-Ring Resonator (CSRR) underneath each CRLH unit-cell. As opposed to conventional LWA designs, the LWA layout does not require thin interdigital capacitors, significantly reducing the PCB manufacturing constraints required to achieve size reduction. The resulting antenna enables CRLH LWAs to be used not only for wireless access points, but also potentially for mobile devices.

Abstract: A connector apparatus of the present disclosure is configured to include: a waveguide cable; a substrate including a waveguide structure; and a coupling section configured to electromagnetically couple an end portion of the waveguide cable to the waveguide structure. Furthermore, a communication system of the present disclosure is a communication system including: a transmitter configured to transmit high-frequency signals; a receiver configured to receive high-frequency signals; a waveguide cable configured to transmit high-frequency signals between the transmitter and the receiver; and a connector apparatus configured to connect between at least one of the transmitter and the receiver to the waveguide cable. A connector apparatus having the above-mentioned configuration is used as the connector apparatus.

Abstract: A semiconductor antenna includes an antenna region. The antenna region includes semiconductor nano-antennas. The semiconductor nano-antennas are formed of a semiconductor material have a doping concentration such that the real part of the permittivity of the semiconductor material is negative over at least a portion of radio frequencies from 1 MHz to 300 GHz.

Abstract: Aspects of the subject disclosure may include, for example, a transmission device that includes a transmitter that generates a first electromagnetic wave to convey data, the first electromagnetic wave having at least one carrier frequency and corresponding wavelength. A coupler couples the first electromagnetic wave to a transmission medium having at least one inner portion surrounded by a dielectric material, the dielectric material having an outer surface and a corresponding circumference, wherein the coupling of the first electromagnetic wave to the transmission medium forms a second electromagnetic wave that is guided to propagate along the outer surface of the dielectric material via at least one guided-wave mode that can include an asymmetric mode, wherein the at least one carrier frequency is within a microwave or millimeter-wave frequency band and wherein the at least one corresponding wavelength is less than the circumference of the transmission medium. Other embodiments are disclosed.

Abstract: The various technologies presented herein relate to utilizing a sealing layer of malleable material to seal gaps, etc., at a joint between edges of a waveguide channel formed in a first plate and a surface of a clamping plate. A compression pad is included in the surface of the clamping plate and is dimensioned such that the upper surface of the pad is less than the area of the waveguide channel opening on the first plate. The sealing layer is placed between the waveguide plate and the clamping plate, and during assembly of the waveguide module, the compression pad deforms a portion of the sealing layer such that it ingresses into the waveguide channel opening. Deformation of the sealing layer results in the gaps, etc., to be filled, improving the operational integrity of the joint.

Abstract: A waveguide assembly for propagating electromagnetic signals along a defined path includes a conductive waveguide and a dielectric waveguide. The conductive waveguide includes two side walls that extend parallel to each other between first and second ends of the conductive waveguide. A channel is defined between the two side walls. The dielectric waveguide includes a cladding formed of a first dielectric material. The cladding defines a core region therethrough that is filled with a second dielectric material different than the first dielectric material. A mating end of the dielectric waveguide is received in the channel at the first end of the conductive waveguide to electromagnetically connect the dielectric waveguide to the conductive waveguide. A remainder of the dielectric waveguide is exterior of the conductive waveguide and extends away from the conductive waveguide.

Abstract: Systems and methods of engineering the optical properties of an optical Integrated Computational Element device using ion implantation during fabrication are provided. A system as disclosed herein includes a chamber, a material source contained within the chamber, an ion source configured to provide a high-energy ion beam, a substrate holder to support a multilayer stack of materials that form the Integrated Computational Element device, a measurement system, and a computational unit. The material source provides a material layer to the multilayer stack, and at least a portion of the ion beam is deposited in the material layer according to an optical value provided by the measurement system.

Abstract: Aspects of the subject disclosure may include, for example, a transmission device that includes a transmitter that generates a first electromagnetic wave to convey data, the first electromagnetic wave having at least one carrier frequency and corresponding wavelength. A coupler couples the first electromagnetic wave to a transmission medium having at least one inner portion surrounded by a dielectric material, the dielectric material having an outer surface and a corresponding circumference, wherein the coupling of the first electromagnetic wave to the transmission medium forms a second electromagnetic wave that is guided to propagate along the outer surface of the dielectric material via at least one guided-wave mode that can include an asymmetric mode, wherein the at least one carrier frequency is within a microwave or millimeter-wave frequency band and wherein the at least one corresponding wavelength is less than the circumference of the transmission medium. Other embodiments are disclosed.

Abstract: Aspects of the subject disclosure may include, for example, a transmission medium that includes a dielectric core comprising a plurality of rigid dielectric members configured to propagate guided electromagnetic waves. A dielectric cladding is disposed on at least a portion of an outer surface of the first dielectric core. Other embodiments are disclosed.

Abstract: A Printed Circuit Board (PCB) comprising various integral components and method of manufacture are provided. The PCB includes a Substrate Integrated Waveguide (SIW), integrated waveguide antennas disposed above the SIW, apertures formed in SIW for coupling with the waveguide antennas, a transmission line routed above the SIW and using the SIW as a ground plane thereof, and further antennas, integrated into the PCB and disposed above and coupled to the transmission line. The SIW and the transmission line may be branched structures for feeding corresponding arrays of waveguide antennas and further antennas. Coplanar waveguides may also be integrated into the PCB and coupled to the SIW and the transmission line via integral impedance matching structures. PCB feature re-use and component interleaving may provide for a desirable and manufacturable PCB structure.

Abstract: A first module and a second module are formed on a complementary metal-oxide-semiconductor (CMOS) chip substrate. The first module is to serialize and de-serialize a data signal. The second module is to up-convert and down-convert the data signal to and from the first module. An antenna is coupled to the second module and integrated onto the CMOS chip substrate. The antenna is coupleable to a hollow metal waveguide (HMWG). The first and second modules are arranged for proximity to the antenna to avoid substantially degrading the data signal at millimeter wave frequencies in migrating the data signal between the first module and the antenna.

Abstract: A digital system has a dielectric core waveguide that has a longitudinal dielectric core member. The core member has a body portion and may have a cladding surrounding the dielectric core member. A radiated radio frequency (RF) signal may be received on a first portion of a radiating structure embedded in the end of a dielectric waveguide (DWG). Simultaneously, a derivative RF signal may be launched into the DWG from a second portion of the radiating structure embedded in the DWG.

Abstract: A digital system has a dielectric core waveguide that is formed within a multilayer substrate. The dielectric waveguide has a longitudinal dielectric core member formed in the core layer having two adjacent longitudinal sides each separated from the core layer by a corresponding slot portion formed in the core layer The dielectric core member has the first dielectric constant value. A cladding surrounds the dielectric core member formed by a top layer and the bottom layer infilling the slot portions of the core layer. The cladding has a dielectric constant value that is lower than the first dielectric constant value.

Abstract: A digital system has a dielectric core waveguide that has a longitudinal dielectric core member. The core member has a body portion and a transition region, with a cladding surrounding the dielectric core member. The body portion of the core member has a first dielectric constant. The transition region of the core member has a graduated dielectric constant value that gradually changes from the first dielectric constant value adjacent the body portion to a third dielectric constant.

Abstract: The device includes: a signal generating unit generating a millimeter wave signal by signal processing of an input signal; a coupling circuit transmitting an electromagnetic wave from the millimeter wave signal generated by the signal generating unit to one end of a circuit board; a coupling circuit receiving the electromagnetic wave from the millimeter wave signal from the other end of the circuit board; and a signal generating unit that generates an output signal by signal processing of the millimeter wave signal from the electromagnetic wave received by the coupling circuit. Preferably, the circuit board is constituted by a dielectric material whose the dielectric loss tangent is relatively large, and a transmission line functioning as a millimeter wave transmission path is constituted within this circuit board. With this construction, extremely high-speed signals can be transmitted through a circuit board having a prescribed dielectric constant representing a large loss.

Abstract: The present invention relates to a method for designing an electrically small antenna, in one embodiment, within an enclosing volume. In a preferred embodiment, the method comprises the steps of designing the electrically small antenna which has a general cross-sectional contour shape of an oblate spheroid from a top load portion to a stem portion below the top load portion. The oblate spheroid contour shape is represented by an antenna dipole moment algorithm which includes a dipole moment term. The method further comprises the steps of controlling the amplitude of the dipole moment term, including adjusting the amplitude of the dipole moment term to independently change the oblate spheroid contour shape, resulting in a change to the electric field outside the enclosing volume and a change to the electric field inside the enclosing volume.

Abstract: Aspects of the subject disclosure may include, for example, a transmission device that includes a transmitter that generates a first electromagnetic wave to convey data, the first electromagnetic wave having at least one carrier frequency and corresponding wavelength. A coupler couples the first electromagnetic wave to a transmission medium having at least one inner portion surrounded by a dielectric material, the dielectric material having an outer surface and a corresponding circumference, wherein the coupling of the first electromagnetic wave to the transmission medium forms a second electromagnetic wave that is guided to propagate along the outer surface of the dielectric material via at least one guided-wave mode that can include an asymmetric mode, wherein the at least one carrier frequency is within a microwave or millimeter-wave frequency band and wherein the at least one corresponding wavelength is less than the circumference of the transmission medium. Other embodiments are disclosed.

Abstract: Aspects of the subject disclosure may include, for example, a transmission device that includes a transmitter that generates a first electromagnetic wave to convey data, the first electromagnetic wave having at least one carrier frequency and corresponding wavelength. A coupler couples the first electromagnetic wave to a transmission medium having at least one inner portion surrounded by a dielectric material, the dielectric material having an outer surface and a corresponding circumference, wherein the coupling of the first electromagnetic wave to the transmission medium forms a second electromagnetic wave that is guided to propagate along the outer surface of the dielectric material via at least one guided-wave mode that can include an asymmetric mode, wherein the at least one carrier frequency is within a microwave or millimeter-wave frequency band and wherein the at least one corresponding wavelength is less than the circumference of the transmission medium. Other embodiments are disclosed.

Abstract: Embodiments include package structures having integrated waveguides to enable high data rate communication between package components. For example, a package structure includes a package substrate having an integrated waveguide, and first and second integrated circuit chips mounted to the package substrate. The first integrated circuit chip is coupled to the integrated waveguide using a first transmission line to waveguide transition, and the second integrated circuit chip is coupled to the integrated waveguide using a second transmission line to waveguide transition. The first and second integrated circuit chips are configured to communicate by transmitting signals using the integrated waveguide within the package carrier.

Abstract: Embodiments include package structures having integrated waveguides to enable high data rate communication between package components. For example, a package structure includes a package substrate having an integrated waveguide, and first and second integrated circuit chips mounted to the package substrate. The first integrated circuit chip is coupled to the integrated waveguide using a first transmission line to waveguide transition, and the second integrated circuit chip is coupled to the integrated waveguide using a second transmission line to waveguide transition. The first and second integrated circuit chips are configured to communicate by transmitting signals using the integrated waveguide within the package carrier.

Abstract: Aspects of the subject disclosure may include, for example, a transmission device that includes a transmitter that generates a first electromagnetic wave to convey data. A coupler couples the first electromagnetic wave to a single wire transmission medium having an outer surface, to forming a second electromagnetic wave that is guided to propagate along the outer surface of the single wire transmission medium via at least one guided wave mode that includes an asymmetric or non-fundamental mode having a lower cutoff frequency. A carrier frequency of the second electromagnetic wave is selected to be within a limited range of the lower cutoff frequency, so that a majority of the electric field is concentrated within a distance from the outer surface that is less than half the largest cross sectional dimension of the single wire transmission medium, and/or to reduce propagation loss. Other embodiments are disclosed.

Abstract: A communication cable includes a dielectric wave guide (DWG) that has a dielectric core member that has a first dielectric constant value and a cladding surrounding the dielectric core member that has a second dielectric constant value that is lower than the first dielectric constant. An RJ45 compatible connector is attached to a mating end of the DWG. The RJ45 connector is configured to retain a complimentary coupling mechanism on a mating end of a second DWG.

Abstract: A dielectric wave guide (DWG) has a longitudinal dielectric core member. The core member has a first dielectric constant value. A cladding surrounds the dielectric core member and has a second dielectric constant value that is lower than the first dielectric constant. A portion of the DWG is configured as a corner having a radius. A conductive layer formed on an outer radius of the corner.

Abstract: Substrate-free mechanical structural systems comprised of interconnected subsystems of electronic and/or electromechanical components are provided.

Abstract: A system includes an electronic device coupled to a mating end of a dielectric wave guide (DWG). The electronic device has a multilayer substrate that has an interface surface configured for interfacing to the mating end of the DWG. A conductive layer is etched to form a dipole antenna disposed adjacent the interface surface. A reflector structure is formed in the substrate adjacent the dipole antenna opposite from the interface surface. A set of director elements is embedded in the mating end of the DWG. Specific spacing is maintained between the dipole antenna and the set of director elements.

Abstract: A printed circuit board 100 for forming a diplexer circuit 200 comprising a first connector 110 for connecting a first filter 112 and second connector 120 for connecting a second filter 122, wherein the first connector 110 and the second connector 120 are located on opposite sides of the printed circuit board 100.

Abstract: Composite material, devices incorporating the composite material and methods of forming the composite material are provided. The composite material includes interstitial material that has at least one of a select relative permittivity property value and a select relative permeability property value. The composite material further includes inclusion material within the interstitial material. The inclusion material has at least one of a select relative permeability property value and a select relative permittivity property value. The select relative permeability and permittivity property values of the interstitial and the inclusion materials are selected so that the effective intrinsic impedance of the interstitial material and the inclusion material match the intrinsic impedance of air. Devices made from the composite include metamaterial and/or metamaterial-inspired (e.g., near-field LC-type parasitic) substrates and/or lenses, front-end protection, stealth absorbers, filters and mixers.

Abstract: A method has been described for making an electrical structure having an air dielectric and includes forming a first subunit including a sacrificial substrate, an electrically conductive layer including a first metal on the sacrificial substrate, and a sacrificial dielectric layer on the sacrificial substrate and the electrically conductive layer. The method further includes forming a second subunit including a dielectric layer and an electrically conductive layer thereon including the first metal, and coating a second metal onto the first metal of one or more of the first and second subunits. The method also includes aligning the first and second subunits together, heating and pressing the aligned first and second subunits to form an intermetallic compound of the first and second metals bonding adjacent metal portions together, and removing the sacrificial substrate and sacrificial dielectric layer to thereby form the electrical structure having the air dielectric.

Abstract: Three-dimensional electromagnetic signal interconnect systems and methods for fabricating the interconnect systems are described. An example apparatus may comprise a first layer including a first dielectric layer coupled to one or more of a first and second conducting layer. The first layer may also include at least one hole. The apparatus may also comprise a second layer including at least one through-hole and a second dielectric layer coupled between a third and fourth conducting layer. The apparatus may further comprise a third layer including at least one hole and a third dielectric layer coupled to one or more of a fifth and sixth conducting layer. The at least one hole/through-hole of each layer may be aligned at least in part with the at least one hole/through-hole of each other layer, and may include metal plating coupled to an inner surface of the respective at least one hole/through-hole.

Abstract: Example multi-layer apparatus for electromagnetic waves and methods for fabricating such apparatus are described. An example apparatus may include a first conducting layer including an input port and a second conducting layer including at least one through-hole. The apparatus may also include a first layer between the first conducting layer and the second conducting layer, including a first waveguide aligned at least in part with the input port and the at least one through-hole. The apparatus may also include a third conducting layer including an output port. The apparatus may also include a second layer between the second conducting layer and the third conducting layer, including a second waveguide aligned at least in part with the output port and the at least one through-hole. The at least one through-hole may be configured to couple millimeter electromagnetic waves from the first waveguide to the second waveguide.

Abstract: A laminated waveguide diplexer includes a first laminated waveguide, a second laminated waveguide, and a coupling metal connecting the first and second laminated waveguides. The first laminated waveguide has a first upper conductor with a first slot, and the second laminated waveguide has a second upper conductor with a second slot. The coupling metal includes a first line crossing over the first slot and a second line crossing over the second slot. In addition, the laminated waveguide diplexer further includes a first via connecting the first upper conductor and the first line, and a second via connecting the second upper conductor and the second line. The first and second vias are adjacent to the first and second slots, respectively, such that the first and second lines are short stubs for respective radio frequency signals propagating thereon.

Abstract: An integrated chip (IC) package may include a waveguide that comprises a cavity, a first chip and a second chip. The first chip includes a first radio frequency (RF) transceiver that may be coupled to a first probe that extends into the cavity of the waveguide and/or a first antenna that is positioned over a first opening in the waveguide. The second chip includes a second RF transceiver that may be coupled to a second probe that extends into the cavity of the waveguide and/or a second antenna that is positioned over a second opening in the waveguide. The first and second chips may be configured to communicate with one another exclusively by the first and second RF transceivers transmitting and receiving RF signals through the cavity of the waveguide via the first and second probes and/or the first and second antennas.

Abstract: According to an embodiment, a circuit board includes a signal line including at least portion of a first conductive layer that has a first portion extending over a cavity in the circuit board from a first side of the cavity. The circuit board also includes a first plurality of conductive vias surrounding the cavity and the first plurality of vias include at least one blind via disposed adjacent to the first side of the cavity.

Abstract: A signal transmission device includes: a transmitting device that transmits a transmission subject signal through a first waveguide as a wireless signal; and a receiving device that receives the wireless signal of the transmission subject signal transmitted from the transmitting device through a second waveguide, wherein the wireless signal is transmitted between the transmitting device and the receiving device in a state where the first waveguide faces the second waveguide.

Abstract: This application is directed to an apparatus for creating microwave radiation patterns for an object detection system. The apparatus includes a waveguide conduit having first slots at one side of the conduit and corresponding second slots at an opposite side of the conduit. The waveguide conduit is coupled to a microwave source for transmitting microwaves from the microwave source through the plurality of first slots. A plunger is moveably positioned in the waveguide conduit from one end thereof. The plunger allows the waveguide conduit to be tuned to generally optimize the power of the microwaves exiting the first slots. Secondary plungers are each fitted in one of the second slots to independently tune or detune microwave emittance through a corresponding first slot.

Abstract: A dielectric waveguide comprising a dielectric probe at each end, wherein the dielectric probes are arranged to transfer energy.

Abstract: Openings are formed by removing part of a ground conductor, and a differential signal line including signal line conductors is configured with some of the openings. In addition, a metal block is mounted thereon to cover the opening to thus configure a waveguide using the metal block and ground conductor as wall surfaces. A planar circuit to waveguide transition according to the above can achieve traveling wave conversions from a waveguide mode to a slot mode, and from the slot mode to a differential mode without utilizing resonance, which makes it possible to align a dominant direction of an electric field by the three ones; thus, a wider bandwidth can be expected. Thus, the wider bandwidth can be achieved with a simple layer structure.

Abstract: A dielectric waveguide (DWG) has a dielectric core member that has a length L and an oblong cross section. The core member has a first dielectric constant value. A dielectric cladding surrounds the dielectric core member; the cladding has a second dielectric constant value that is lower than the first dielectric constant. A conductive shield layer surrounds a portion of the dielectric cladding.

Abstract: The present technology relates to a transmission line and transmission method that allow multi-mode transmission to be easily performed using electrical signals as a transmission target. A multi-mode waveguide is connected to a metal wire configured to transmit an electrical signal via a matching structure configured to perform impedance matching between the multi-mode waveguide and the metal wire. For example, the electrical signal can be a signal of a millimeter wave band. For example, the multi-mode waveguide, the metal wire, and the matching structure can be arranged to be aligned on a plane. The present technology can be applied to, for example, transmission for electrical signals such as millimeter waves.