Abstract: A method and system for an integrated transceiver is presented. The integrated transceiver includes a transceiver housing, where a waveguide is formed inside the transceiver housing using a transceiver housing and a sub-floor component. Neither transceiver housing nor the sub-floor component alone is configured to operate as a waveguide. The integrated transceiver can include a transceiver housing that forms a portion of an integrated waveguide assembly, where the transceiver housing alone does not form the waveguide, and another portion of the integrated waveguide assembly couples with the transceiver housing to form the waveguide of the integrated waveguide assembly. Further, the integrated waveguide portion of the sub-floor component can be a flat surface, where the integrated waveguide portion of the transceiver housing comprises substantially all the features of said integrated waveguide.

Abstract: A radio transceiver device includes circuitry for radiating electromagnetic signals at a very high radio frequency both through space, as well as through wave guides that are formed within a substrate material. In one embodiment, the substrate comprises a dielectric substrate formed within a board, for example, a printed circuit board. In another embodiment of the invention, the wave guide is formed within a die of an integrated circuit radio transceiver. A plurality of transceivers with different functionality is defined. Substrate transceivers are operable to transmit through the wave guides, while local transceivers are operable to produce very short range wireless transmissions through space. A third and final transceiver is a typical wireless transceiver for communication with remote (non-local to the device) transceivers.

Abstract: Various embodiments of millimeter-wave systems on a printed circuit board, including a microstrip, a probe, and an RF integrated circuit, as well as methods for manufacturing said systems. Various embodiments have holes extending through lamina in the PCB, thereby improving radiation propagation. Various embodiments have conductive cages created by multiple through-holes extending through lamina in the PCB, thereby increasing radiation propagation. The manufacture of such systems is easier and less expensive than the manufacture of current systems.

Abstract: A plasma processing apparatus includes a microwave introduction device which introduces a microwave into a process chamber. The microwave introduction device includes a plurality of microwave transmitting plates which is fitted into a plurality of openings of a ceiling. The microwave transmitting plates are arranged on one virtual plane parallel to a mounting surface of a mounting table, with the microwave transmitting plates fitted into the respective openings. The microwave transmitting plates includes first to third microwave transmitting plates. The first to third microwave transmitting plates are arranged in such a manner that a distance between the center point of the first microwave transmitting window and the center point of the second microwave transmitting window becomes equal or approximately equal to a distance between the center point of the first microwave transmitting window and the center point of the third microwave transmitting window.

Abstract: An apparatus has a waveguide that includes a multiferroic medium. A controller is configured to apply a mechanical strain or a control electric or magnetic field to the multiferroic medium. The multiferroic medium has a dielectric permittivity or magnetic permeability that is responsive to the strain or the control field.

Abstract: A broadband waveguide incorporates various reflection suppression techniques to reduce reflections in signals communicated thereby. The waveguide includes one or more filaments that each include a first and second end. A first matrix may be configured proximate the first end(s) while a second matrix may be configured proximate an intermediate location between the first and second ends. A damping material may cover a portion of the filament(s) that extends from the second matrix to the second end(s) (including the second end(s) themselves) and/or the second end(s) of the filament(s) is/are shaped to at least partially suppress reflections of the signal therefrom. When configured with multiple filaments, at least two of the filaments may have differing lengths that extend from the second matrix and also operate to at least partially suppress reflections of a signal.

Abstract: Provided are three-dimensional microstructures and their methods of formation. The microstructures are formed by a sequential build process and include microstructural elements which are affixed to one another. The microstructures find use, for example, in coaxial transmission lines for electromagnetic energy.

Abstract: A signal transmission device includes: a transmitting device that transmits a transmission subject signal through a first waveguide as a wireless signal; and a receiving device that receives the wireless signal of the transmission subject signal transmitted from the transmitting device through a second waveguide, wherein the wireless signal is transmitted between the transmitting device and the receiving device in a state where the first waveguide faces the second waveguide.

Abstract: Electromagnetic slow wave structures (SWS) comprised of arrays of conductive obstacles are formed inside conductive parallel-plate waveguides These SWS may be formed using, for example, MEMS manufacturing processes at the wafer level on substrates including ceramic and silicon. An effective relative permittivity in the range of 15 to 40 may be obtained at millimeterwave frequencies. The SWS can be made absorptive by incorporating resistive losses in a plate of the PPW. Applications of these slow wave structures include delay lines and bootlace lens beamformers for microwave and millimeterwave antenna systems.

Abstract: A microwave waveguide, and a system and method related to a microwave waveguide, is described. One embodiment includes an integrated microwave waveguide comprising a waveguide block, a first waveguide section in the waveguide block, a second waveguide section in the waveguide block, a first impedance transition section integrated with the first waveguide section in the waveguide block, wherein the first impedance section comprises a first conduit with a first end and a second end, wherein the first conduit is tapered from the first end to the second end, and a second impedance transition section integrated with the second waveguide section in the waveguide block, wherein the second impedance section comprises a second conduit with a third end and a fourth end, wherein the second conduit is tapered from the third end to the fourth end, and wherein the second end of the first impedance transition section and the fourth end of the second impedance transition section are connected.

Abstract: A fuselage structure includes a fuselage body and framework for stiffening the body. The framework includes at least one frame member having a duct therein for routing a utility through the body.

Abstract: A waveguide having a non-conductive material with a high permeability (?, ?r for relative permeability) and/or a high permittivity (?, ?r for relative permittivity) positioned within a housing. When compared to a hollow waveguide, the waveguide of this invention, reduces waveguide dimensions by ? 1 ? r * ? r . The waveguide of this invention further includes ridges which further reduce the size and increases the usable frequency bandwidth.

Abstract: An integral high frequency communication apparatus comprises a case, a waveguide apparatus having an extension portion, and a circuit board having a signal transmitting unit and a signal receiving unit. The transceiver module having two waveguide openings is retained in the case. The case has an opening through which the extension portion extends outside of the case. The integral high frequency communication apparatus can receive and transmit high frequency signals by the extension portion.

Abstract: The invention relates to a high-frequency transmission line connection structure, a circuit board having the connection structure, a high-frequency module having the circuit board, and a radar apparatus. A first laminated waveguide sub-line part (21) includes a pair of main conductor layers that oppose each other in a thickness direction with a dielectric layer (31) having the same thickness as a dielectric layer (31) of a microstrip line (1) interposed therebetween. A second laminated waveguide sub-line part (22) includes dielectric layers (31, 32) thicker than the dielectric layer of the first laminated waveguide sub-line part (21). A laminated waveguide main-line part (23) includes dielectric layers (31, 32, 33) thicker than the dielectric layers of the second laminated waveguide sub-line part (22). A conversion part (10) connected to the microstrip line (1) is formed by integrating with an upper main conductor layer constituting the respective line parts.

Abstract: An arrangement for measuring fill level of a fill substance in a container, comprising: a fill level measuring device, wherein the device includes measuring device electronics and an antenna connected to the measuring device electronics; and at least one feedthrough installed in a signal path of the microwave signals or the reflection signals; the feedthrough. The feedthrough comprises a hollow conductor, into which a microwave transparent window is inserted gas tightly. The window comprises: a disk, whose thickness corresponds approximately to a half wavelength or a small integer multiple of the half wavelength of a first, hollow conductor propagation capable, signal mode of the microwave signals at a predetermined signal frequency in the disk; and two matching layers located on oppositely lying, outer surfaces of the disk.

Abstract: There are provided a waveguide plate that is made of metallic plates through which through holes are formed and a pair of resin made substrates (first and second substrates) on which a grounding pattern is formed to cover the through holes. Both the waveguide plate and the substrates are laminated with each other using a conductive adhesive such that the waveguide plate is sandwiched by the substrates, whereby a rectangular waveguide is provided. The first substrate has high frequency circuits such as an oscillator that generates high frequency signals. The high frequency signals generated by the oscillator are supplied to an antenna section that is formed on the second substrate via the rectangular waveguide.

Abstract: A waveguide component encapsulation device may include a housing having first and second surfaces, the housing defining a channel extending through the first and second surfaces, a micromachined waveguide component configured to be positioned in the channel, the waveguide component having first and second ends extending outside the channel and beyond the first and second surfaces of the housing by a finite length, and a pair of spacing members configured to align and stabilize the waveguide component within the channel.

Abstract: This disclosure provides a waveguide converter, which includes a first waveguide for propagating an electromagnetic wave, a second waveguide for being inputted the electromagnetic wave from the first waveguide and propagating the electromagnetic wave in a direction different from the propagating direction of the electromagnetic wave in the first waveguide, and an elongated-plate-shaped inner conductor arranged between the first waveguide and the second waveguide so that end portions of the inner conductor are exposed to the inside of the first waveguide and the second waveguide, respectively.

Abstract: There are provided an electronic device having a transmission line pattern embedded in a case and a method for manufacturing the same. The electronic device includes a line pattern body embedded in a case and including a line pattern for electrically connecting components to each other, terminal portions respectively disposed at portions of the line pattern corresponding to terminals of the components to be electrically connected, and exposed from the bottom of the case, and connection members connecting the terminals of the components with the terminal portions.

Abstract: A circuit board is provided. The circuit board includes a substrate, a waveguide line and a laminated waveguide. The waveguide line is at least partially positioned on a first surface of the substrate. The waveguide line transmits a high frequency signal. The laminated waveguide is formed inside the substrate. The laminated waveguide is electromagnetically coupled to the waveguide line, and has a lead-out portion led out from inside the substrate to a surface other than the first surface. The laminated waveguide includes a dielectric layer, a pair of main conductive layers and a through conductor group. The pair of main conductive layers sandwiches the dielectric layer in a thickness direction thereof. In the through conductor group, a plurality of through conductors are arranged along a high frequency signal transmitting direction. The plurality of through conductors electrically connect the pair of main conductive layers.

Abstract: A waveguide structure according to one embodiment includes an upper waveguide and a mode conversion portion. The upper waveguide internally transmits a high frequency signal in TE10 mode along a first direction. The mode conversion portion is configured to electromagnetically couple with the upper waveguide. The mode conversion portion converts the high frequency signal propagating through the upper waveguide from TE10 mode to TM11 mode. The mode conversion portion transmits the high frequency signal converted in a second direction perpendicular to the first direction. According to the waveguide structure pursuant to the embodiment, it is possible to attain excellent transmission characteristics of high frequency signals.

Abstract: A high-frequency module includes a high-frequency component including a high-frequency circuit, a conductor plate including a slot, a first conductive wire, and two second conductive wires. The high-frequency component includes a signal terminal and two reference potential terminals. The signal terminal is used for at least one of input and output of a high-frequency signal. The two reference potential terminals are connected to a reference potential. The first conductive wire is connected to the signal terminal in terms of high-frequency. The first conductive wire crosses over above the slot. The two second conductive wires are connected to the two reference potential terminals in terms of high-frequency. The two second conductive wires are so disposed along the first conductive wire and do not cross over the slot. The first conductive wire and the two second conductive wires form a pair and are electromagnetically coupled to the slot.

Abstract: A precision alloy for die-casting contains aluminum, silicon and zinc, wherein on the basis of the overall mass, the content of aluminum is 40% by mass or more and 45% by mass or less, and the content of silicon is 2% by mass or more and 8% by mass or less. Also other solving means will be described.

Abstract: Long-side length a1 to a5 of rectangular waveguide tubes in a long-side direction (magnetic field direction) become greater, the shorter a line length is (the closer a rectangular waveguide tube is to the center). ai and Li are set such that line lengths L1 to L5 of each rectangular waveguide tube is Li=m?gi (i=1 to 5, and m is a positive integer number), with guide wavelengths of each rectangular waveguide tube, determined by the length a1 to a5, as ?g1 to ?g5. Hence, the line length Li of each rectangular waveguide tube can be arbitrarily set, while maintaining a phase relationship between high frequency signals transmitted by each rectangular waveguide tube. When a difference in line lengths between rectangular waveguide tubes is set to be shorter, the degree of freedom in arrangement of the rectangular waveguide tubes can be improved while suppressing the degradation of propagation characteristics caused by temperature change.

Abstract: An apparatus has an antenna configured to receive transmitted digital data, wherein the data comprises circular polarity (CP) and linear polarity (LP) format signals. The apparatus also has a waveguide coupled to the antenna and configured to propagate: 1) a first component of the CP format signal which is received; 2) a second component of the CP format signal which is received, said second component being substantially orthogonal to said first component; and 3) the LP format signal which is received. The apparatus further has one or more phase adjusters configured to allow adjustment to be made to match a phase of the first and second components of the CP format signal. The apparatus also has one or more amplitude adjusters configured to allow adjustments to be made to match an amplitude of the first and second components of the CP format signal.

Abstract: A radio transceiver device includes circuitry for radiating electromagnetic signals at a very high radio frequency both through space, as well as through wave guides that are formed within a substrate material. In one embodiment, the substrate comprises a dielectric substrate formed within a board, for example, a printed circuit board. In another embodiment of the invention, the wave guide is formed within a die of an integrated circuit radio transceiver. A plurality of transceivers with different functionality is defined. Substrate transceivers are operable to transmit through the wave guides, while local transceivers are operable to produce very short range wireless transmissions through space. A third and final transceiver is a typical wireless transceiver for communication with remote (non-local to the device) transceivers.

Abstract: The present invention relates to a tunable microwave arrangement (100) comprising a waveguide arrangement and tuning elements comprising a number of varactors for tuning an electromagnetic signal input to the waveguide arrangement. It comprises a substrate (1), a layered structure (20) comprising at least two conducting layers (2,3) and at least one dielectric layer (4) which are arranged in an alternating manner. The layered structure is arranged on the substrate (1) such that a first of said conducting layers (2) is closest to the substrate (1). It also comprises at least one surface mounted waveguide (5), a second of the conducting layers (3), most distant from the substrate, being adapted to form a wall of the surface mounted waveguide (5), which wall incorporates said tuning elements which are arranged to enable control of surface currents generated in said wall, hence loading the waveguide (5) with a tunable, controllable impedance.

Abstract: The invention relates to a process for the production of a microwave waveguide having a step of determining the zone or zones of the waveguide where an electric field concentration occurs. A step of produces at least one enlargement of the waveguide in the zone or zones thus determined. The invention also relates to a microwave filter in which the stubs are provided with such enlargement. The invention has application in microwave filters.

Abstract: A sandwich vehicle structure may allow for confined propagation of electromagnetic radiation within the sandwich vehicle structure. The sandwich vehicle structure may include at least one upper conducting plate, at least one lower conducting plate, and a core extending between the upper and lower conducting plates. The core may comprise a core medium, and a plurality of spaced apart core members embedded in the core medium and extending between the upper and lower conducting plates. The core medium and the core members may allow for the propagation of electromagnetic radiation within the core.

Abstract: A waveguide is provided that includes an elongate dielectric inner region, and an electrically conducting outer region spaced apart from the dielectric inner region. The dielectric inner region may be arranged to be flexible, and in some examples may be formed from powdered dielectric contained in a polymer tube or matrix, or in other examples may be formed from a plurality of segments. In some examples of the waveguide, each segment may be formed to have lenticular end faces, and may be formed from sintered BaTi4O9.

Abstract: The invention relates to a small and low-voltage operable dielectric waveguide device. First and second electrode are embedded in a dielectric part and are formed to be thinner than a skin depth for a frequency of electromagnetic wave propagating along a first dielectric part included in the dielectric part. Thereby, even if the first and second electrodes are arranged to be in contact with the first dielectric part, the propagating electromagnetic wave can transmit the first and second electrodes, and therefore the electromagnetic wave can propagate without being cut off and there is no influence on waveguide modes of the electromagnetic wave. Further, in a state where a transmission loss due to the embedded of the electrode is suppressed, an electric field with large electric field strength can be applied to the first dielectric part by the first and second electrodes, and a small and low-voltage operable dielectric waveguide device can be achieved.

Abstract: Provided are coaxial waveguide microstructures. The microstructures include a substrate and a coaxial waveguide disposed above the substrate. The coaxial waveguide includes: a center conductor; an outer conductor including one or more walls, spaced apart from and disposed around the center conductor; one or more dielectric support members for supporting the center conductor in contact with the center conductor and enclosed within the outer conductor; and a core volume between the center conductor and the outer conductor, wherein the core volume is under vacuum or in a gas state. Also provided are methods of forming coaxial waveguide microstructures by a sequential build process and hermetic packages which include a coaxial waveguide microstructure.

Abstract: A division type waveguide circuit is provided, in which fixing a metal cover to a waveguide body with screws can prevent radiowave leak suitably without any application of the conductive adhesive, solder and braze as a material for the radiowave leak prevention. A radiowave leak preventing plate 8 is provided at the end of an opening area 3 of a waveguide body 2 in a radiowave traveling direction and overlaps with the end of a metal cover 4.

Abstract: A waveguide for transmission of data signals therealong. Data signals are typically received from and/or transmitted to a remote location and subsequently passed to or emitted from the apparatus which allows the data to be processed. The waveguide includes a channel which has a cross-sectional shape, the angular orientation of which is changed at least one point along the length of the same so as to provide a waveguide which is less sensitive to interferences. The waveguide, in one embodiment, can also include recessed portions and/or ridges along the length of the channel which ensures that the waveguide can be formed in a more reliable and controlled manner.

Abstract: A waveguide structure including a first member, made of metal, in a surface portion of which a first groove having a linear shape is formed; and a second member, made of resin, in a surface portion of which a second groove having a linear shape is formed and to the surface of which metal plating is applied. The first member and the second member are arranged in such a way that the first groove and the second groove face each other so that a waveguide tube is configured. The first member in the surface portion of which the first groove is formed and the second member in the surface portion of which the second groove is formed are held in such a way that a gap exists between the respective surfaces thereof.

Abstract: This high-frequency waveguide is formed by first and second conductors (22, 23) disposed opposite each other at a spacing of ?0/2, where ?0 is the free space wavelength of the operating frequency of a high-frequency signal. A ridge (25) is provided at the waveguide formation portion between these first and second conductors (22, 23), which protrudes from one of the first and second conductors (22, 23) toward the other and is formed extending along the waveguide formation portion. A plurality of columnar protrusions (24) with a height of ?0/4 are disposed at a spacing of less than ?0/2 to at least one of the first and second conductors (22, 23) on the outside of the waveguide formation portion and to the outside of the ridge (25).

Abstract: A microwave device having a narrow gap between two parallel surfaces of conducting material by using a texture or multilayer structure on one of the surfaces. The fields are mainly present inside the gap, and not in the texture or layer structure itself, so the losses are small. The microwave device further comprises one or more conducting elements, such as a metal ridge or a groove in one of the two surfaces, or a metal strip located in a multilayer structure between the two surfaces. The waves propagate along the conducting elements. At least one of the surfaces is provided with means to prohibit the waves from propagating in other directions between them than along the ridge, groove or strip. At very high frequency the gap waveguides and gap lines may be realized inside an IC package or inside the chip itself.

Abstract: Systems and methods for detecting electromagnetic waves are disclosed. A system for use in detecting an electromagnetic wave includes an inductive device and a spintronic device. The inductive device generates an induced electromagnetic field when the inductive device receives the electromagnetic wave. The spintronic device has an impedance that changes when exposed to the induced electromagnetic field from the inductive device. The change in impedance is indicative of the electromagnetic wave received by the inductive device. Another system for use in detecting or transmitting an electromagnetic wave includes a conductive device and an inductive device. The inductive device is configured to generate an induced electromagnetic wave when the inductive device receives an electromagnetic wave passed by the conductive device. Another system for detecting electromagnetic wave permittivity or permeability of an object includes a pair of antennas and an inductive device.

Abstract: The invention relates to electromagnetic wave guiding devices or waveguides (f<10 THz) and to processes for manufacturing these waveguides, which comprise at least one body (30) supporting at least one active wall (40). The body (30) of the waveguide is made from a volume of a ceramic selected from the following: silicon carbides, aluminum nitride, boron nitrides, and especially 3C cubic and 2H hexagonal varieties of boron nitride, diamond, beryllium oxide or assemblies of said materials. Applications: waveguides, filter cavities, reflectors and antennas for radiofrequency waves and microwaves, atomic clocks and particle accelerators.

Abstract: A short slot directional coupler includes a dielectric substrate having both surfaces each covered by a metal film, a first via-hole string and a second via-hole string, each of which has via-holes penetrating through the substrate, and formed so that a distance between the first via-hole string and the second via-hole string is narrow at a center of a length direction of the string and wider along directions of both ends of the string, and a pair of third via-hole strings each having via-holes penetrating through the substrate, and formed between parts adjacent to both ends of the first via-hole string and parts adjacent to both ends of the second via-hole string to form a first post-wall waveguide along with the first via-hole string and a second post-wall waveguide along with the second via-hole string.

Abstract: An electronic device provided with a plurality of circuit boards uses a support member for supporting the circuit boards as the transmission path of a wireless signal. For example, the electronic device is provided with a first printed circuit board for processing a millimeter-wave signal, a second printed circuit board which is signal-coupled to the printed circuit board and receives the millimeter-wave signal to subject the received signal to signal processing, and a waveguide which is disposed with a predetermined dielectric constant between the printed circuit boards, wherein the waveguide constitutes the dielectric transmission path, and the waveguide supports the printed circuit boards. This configuration makes it possible to receive the electromagnetic wave based on a millimeter-wave signal radiated from one end of the waveguide constituting the dielectric transmission path, at the other end thereof.

Abstract: A waveguide receives a wave transmitted from an external power source and to guide the wave to reach within a width of a rectenna. The waveguide may include a negative refractive index medium and/or a surface plasmon medium.

Abstract: A system for injecting and guiding millimeter-waves through a Printed Circuit Board (PCB) including at least two laminas belonging to a PCB, an electrically conductive plating applied on the insulating walls of a cavity formed perpendicularly through the laminas, and optionally a probe located above the cavity printed on a lamina belonging to the PCB. Optionally, the cavity guides millimeter-waves injected by the probe at one side of the cavity to the other side of the cavity.

Abstract: A system for directing electromagnetic millimeter-waves towards a waveguide using an electrically conductive formation within a Printed Circuit Board (PCB). The system includes a waveguide having an aperture and at least two laminas belonging to a PCB. A first electrically conductive surface printed on one of the laminas is located over the aperture such that the first electrically conductive surface covers at least most of the aperture. A plurality of Vertical Interconnect Access (VIA) holes, optionally filled or plated with an electrically conductive material, are electrically connecting the first electrically conductive surface to the waveguide, forming an electrically conductive cage over the aperture. Optionally, a probe printed on one of the laminas of the PCB is located inside the cage and over the aperture.

Abstract: An integrated circuit transmission system includes a dielectric substrate wave guide and first and second substrate antennas. A substrate transmitter is operable to produce an radio frequency (RF) signal, the RF signal having first and second components. A micro-strip resonator filter module generates a filtered RF signal by adjusting phases of the first and second components of the RF signal via selection of one of a plurality of selectable tap points. A third substrate antenna generates a beam formed signal for transmission through the dielectric substrate wave guide, wherein the beam form signal is directed, via the filtered RF signal, to either the first substrate antenna or the second substrate antenna.

Abstract: A method for fabrication of an inaccessible RF microwave waveguide structure is provided. The method includes providing an RF microwave waveguide network including an array of waveguide components that have one or more apertures in a wall. The method also includes providing one or more dummy load elements made of a ceramic material having high-temperature stable properties. The dummy load elements are mounted in a predetermined place on the wall in the vicinity of the aperture. The method also includes providing a blocking assembly configured for covering RF microwave waveguide network. The blocking assembly is connected to the RF microwave waveguide network by using dip brazing.

Abstract: A radio frequency circuit structure for transmitting radio signals includes a lower guide portion having a plurality of photocurable layers deposited on a substrate and an upper guide portion interfacing with the lower guide portion to define a guiding geometry. The upper guide portion may also include a plurality of photocurable layers deposited on a second substrate. A method for fabricating the radio frequency circuit structure includes depositing the plurality of photocurable layers on the substrate. A portion of each photocurable layer of the plurality of photocurable layers is exposed to ultraviolet light to form a latent image. The plurality of photocurable layers is developed to remove the portions not exposed to ultraviolet light to form a guide portion. The guide portion may be metalized and closed to form a guiding geometry. A lower guide portion may be closed by an upper guide portion formed in substantially the same manner as the lower guide portion.

Abstract: A gain medium may be arranged to provide energy to a surface state.

Abstract: The invention discloses a high electromagnetic transmission composite structure for reducing the transmission loss of an electromagnetic wave. The high electromagnetic transmission composite structure includes a first composite structure layer, a second composite structure layer, and a first buffer layer. The first composite structure layer has a first thickness and a first dielectric constant. The second composite structure layer has a second thickness and a second dielectric constant. The first buffer is disposed between the first composite structure layer and the second composite structure layer and has a third thickness and a third dielectric constant. The transmission loss of the electromagnetism wave can be adjusted by adjusting the first thickness, the first dielectric constant, the second thickness, the second dielectric constant, the third thickness, and the third dielectric constant.

Abstract: An electronic system. The electronic system includes a waveguide structure having a first waveguide-coupling point and a second waveguide-coupling point and an active electronic circuit having a first circuit-coupling point and a second circuit-coupling point. The second waveguide-coupling point is coupled to the first circuit-coupling point; the system is capable of receiving an input signal at the first waveguide-coupling point and transmitting an output signal at the second circuit-coupling point and/or receiving the input signal at the second circuit-coupling point and transmitting the output signal at the first waveguide-coupling point; the input signal and the output signal have frequencies in a terahertz frequency range; and the system is fabricated as a monolithic integrated structure having the waveguide structure fabricated by micromachining and the circuit fabricated monolithically.