Balanced To Unbalanced Circuits Patents (Class 333/25)
  • Patent number: 11876278
    Abstract: An example balun includes a center conductor that passes through a printed wiring board having multiple dielectric layers and cage vias arranged relative to the center conductor. The cage vias include a first set of cage vias that extend between an unbalanced connection to the balun and a balanced connection to the balun. The first set of cage vias are part of a first circular arc and are connected to electrical ground through a first ground ring. The cage vias include a second set of cage vias that extend from the unbalanced connection part-way through the printed wiring board. The second set of cage vias are part of a second circular arc and are connected to the electrical ground through a second ground ring. The second circular arc is longer than the first circular arc.
    Type: Grant
    Filed: March 29, 2021
    Date of Patent: January 16, 2024
    Assignee: RAYTHEON COMPANY
    Inventors: Angelo M. Puzella, John B. Francis
  • Patent number: 11837398
    Abstract: A thin-film inductor device includes a substrate made of an electrically insulating material, a first coil unit, a second coil unit, and an inductance-enhancing structure. The first coil unit includes a first upper coil, a first lower coil, and two first electrodes electrically connected to the first upper and lower coils, respectively. The second coil includes a second upper coil, a second lower coil, and two second electrodes electrically connected to the second upper and lower coils, respectively. The first and second upper/lower coils are disposed spacedly and arranged by bifilar winding. The inductance-enhancing structure encapsulates the substrate, the first coil unit, and the second coil unit such that two terminal parts of each of the first electrodes and the second electrodes are exposed for external electrical connection.
    Type: Grant
    Filed: August 12, 2020
    Date of Patent: December 5, 2023
    Assignee: CHILISIN ELECTRONICS CORP.
    Inventors: Tim Wang, Hung-Pin Lin
  • Patent number: 11824510
    Abstract: A balun comprising a three-dimensional (3D) printed base. In one embodiment the balun further comprises a piece of copper tape adhered to an outer surface of the 3D printed base.
    Type: Grant
    Filed: October 7, 2021
    Date of Patent: November 21, 2023
    Assignee: WINCHESTER INTERCONNECT CORPORATION
    Inventors: Richard Harold Grape, Jose Miguel Vega Haro
  • Patent number: 11810875
    Abstract: A packaged integrated circuit (IC) includes an IC die having first and second external contacts and a package substrate. The IC die is attached to the package substrate which includes a balun in a first metal layer. The balun is connected to the first and second external contacts of the IC die and to a first external contact of the package substrate. The first and second external contacts of the IC die communicate a differential signal with the package substrate, and the first external contact of the package substrate communicates a single-ended signal corresponding to the differential signal. Alternatively, the balun is connected to an external contact of the IC die and to first and second external contacts of the package substrate, in which the external contact of the IC die communicates a single-ended signal and the first and second external contacts of the package substrate communicate a differential signal.
    Type: Grant
    Filed: April 9, 2021
    Date of Patent: November 7, 2023
    Assignee: NXP B.V.
    Inventors: Waqas Hassan Syed, Cicero Silveira Vaucher, Antonius Johannes Matheus de Graauw
  • Patent number: 11799438
    Abstract: An integrated circuit including a first circuit module and a second circuit module is provided. A layer stack may include one or multiple metal layers with a power segment and a ground segment connected to the first circuit module and the second circuit module, which form a resonant current loop. A pickup loop may be inductively coupled to the resonant current loop to dampen its resonance, thereby making the IC compliant with its EMC requirements or removing functional errors such as problems in the signal or power integrity.
    Type: Grant
    Filed: May 17, 2021
    Date of Patent: October 24, 2023
    Assignee: Infineon Technologies AG
    Inventors: Alexander Schade, Sergey Miropolskiy
  • Patent number: 11791860
    Abstract: A folded Marchand Balun includes a first, a second, a third port, and a first transmission line being folded into a first and second intermediate transmission lines, the first intermediate transmission line disposed on a first signal plane and electrically connected through metal vias to the second intermediate transmission line disposed on a second signal plane. The first transmission line has one end as the first port and an opposite end as an open circuit. The Balun includes a second transmission line disposed on the first signal plane and is adjacent to the first intermediate transmission line. The second transmission line has one end as the second port and an opposite end grounded. The Balun includes a third transmission line disposed on the second signal plane and adjacent to the second intermediate transmission line. The third transmission line has one end as the third port and an opposite end grounded.
    Type: Grant
    Filed: January 19, 2022
    Date of Patent: October 17, 2023
    Assignee: SWIFTLINK TECHNOLOGIES INC.
    Inventors: Min-Yu Huang, Srinaga Nikhil Nallandhigal
  • Patent number: 11770101
    Abstract: The invention relates to a radio frequency oscillator, the radio frequency oscillator comprising a resonator circuit being resonant at an excitation of the resonator circuit in a differential mode and at an excitation of the resonator circuit in a common mode, wherein the resonator circuit has a differential mode resonance frequency at the excitation in the differential mode, and wherein the resonator circuit has a common mode resonance frequency at the excitation in the common mode, a first excitation circuit being configured to excite the resonator circuit in the differential mode to obtain a differential mode oscillator signal oscillating at the differential mode resonance frequency, and a second excitation circuit being configured to excite the resonator circuit in the common mode to obtain a common mode oscillator signal oscillating at the common mode resonance frequency.
    Type: Grant
    Filed: April 18, 2022
    Date of Patent: September 26, 2023
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Mina Shahmohammadi, Masoud Babaie, Robert Bogdan Staszewski
  • Patent number: 11646697
    Abstract: The invention relates to a resonator circuit, the resonator circuit comprising a transformer comprising a primary winding and a secondary winding, wherein the primary winding is inductively coupled with the secondary winding, a primary capacitor being connected to the primary winding, the primary capacitor and the primary winding forming a primary circuit, and a secondary capacitor being connected to the secondary winding, the secondary capacitor and the secondary winding forming a secondary circuit, wherein the resonator circuit has a common mode resonance frequency at an excitation of the primary circuit in a common mode, wherein the resonator circuit has a differential mode resonance frequency at an excitation of the primary circuit in a differential mode, and wherein the common mode resonance frequency is different from the differential mode resonance frequency.
    Type: Grant
    Filed: April 1, 2022
    Date of Patent: May 9, 2023
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Mina Shahmohammadi, Masoud Babaie, Robert Bogdan Staszewski
  • Patent number: 11615910
    Abstract: A transformer structure includes a first inductor and a second inductor. The first inductor has first turns. The second inductor has second turns. The first inductor and the second inductor are disposed in an interlaced manner. Except jump wires, the first and the second inductors are substantially disposed on a first layer. At least one of the first turns is substantially disposed between another first turn and one of the second turns.
    Type: Grant
    Filed: October 11, 2018
    Date of Patent: March 28, 2023
    Assignee: REALTEK SEMICONDUCTOR CORPORATION
    Inventors: Hsiao-Tsung Yen, Yuh-Sheng Jean, Ta-Hsun Yeh
  • Patent number: 11515905
    Abstract: A radio frequency module with common access point (1) comprising a common access point (2) adapted to send and receive radio frequency signals, said common access point (2) having a common access point impedance, a first radio frequency communication circuit (6) and a second radio frequency communication circuit (8), a first balun (10) coupled to the first radio frequency communication circuit (6) by first ports (11a, 11b) wherebetween a first impedance (Z1) varying between a high value and a low value is established, and a second balun (20) coupled to the second radio frequency communication circuit (8) by second ports (21a, 21b) wherebetween a second impedance (Z2) varying between a high value and a low value is established, wherein the radio frequency module with common access point (1) comprises an impedance matching circuit (18) connected between the first ports (11a, 11b) in parallel with the first balun (10), and a switch (16) configured to open and close the impedance matching circuit (18).
    Type: Grant
    Filed: November 18, 2020
    Date of Patent: November 29, 2022
    Assignee: STMICROELECTRONICS SA
    Inventor: Vincent Knopik
  • Patent number: 11515072
    Abstract: An inductor device includes a first inductor unit and a second inductor unit. The first inductor unit includes a first side to a fourth side, a first wire, and a first input terminal. The first wire is winded to form a plurality of circles. The first wire is winded in an interlaced manner at one of the first to fourth sides of the first inductor unit. The first input terminal is disposed on one of the first to fourth sides. The second inductor unit includes a fifth side to an eighth side, a second wire, and a second input terminal. The second wire is winded to form a plurality of circles. The second wire is winded in an interlaced manner at one of the fifth to eighth sides of the second inductor unit. The second input terminal is disposed on one of the fifth to eighth sides.
    Type: Grant
    Filed: March 6, 2019
    Date of Patent: November 29, 2022
    Assignee: REALTEK SEMICONDUCTOR CORPORATION
    Inventor: Hsiao-Tsung Yen
  • Patent number: 11469028
    Abstract: An inductor device includes a first and a second inductor. First inductor includes plural first wires and a first connection member. Second inductor includes plural second wires and a second connection member. Part of first wires are winded/located at a first area, and part of first wires are winded/located at a second area. First and second areas are located on two opposite sides of inductor device. First connection member connects first wire located at first area and located at second area. Part of second wires are winded/located at first area, and part of second wires are winded/located at second area. One terminal of second connection member connects a terminal of second wire at an inner side of inductor device, and another terminal of second connection member is disposed outside inductor device. First and second inductors are symmetrical with respect to a center line of inductor device.
    Type: Grant
    Filed: October 16, 2018
    Date of Patent: October 11, 2022
    Assignee: REALTEK SEMICONDUCTOR CORPORATION
    Inventors: Hsiao-Tsung Yen, Yuh-Sheng Jean, Ta-Hsun Yeh
  • Patent number: 11394105
    Abstract: A component carrier has a laminated stack including at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, a front-end chip on and/or in the stack and extending at least up to a main surface of the stack, an antenna interface on an opposing other main surface of the stack, and an impedance matching circuitry in the stack and arranged vertically between the front-end chip and the antenna interface.
    Type: Grant
    Filed: December 9, 2020
    Date of Patent: July 19, 2022
    Assignee: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
    Inventor: Gerald Weis
  • Patent number: 11393619
    Abstract: A transformer has a first inductor that includes a first port. The transformer also has a second inductor magnetically coupled to the first inductor. The second inductor includes a second port. The second inductor includes a first portion configured to permit current flow in a clockwise direction and a second portion configured to permit current flow in a counter-clockwise direction. The transformer also has a third inductor magnetically coupled to the first inductor. The third inductor includes a third port. The counter-clockwise direction is opposite the clockwise direction to reduce magnetic coupling between the second inductor and the third inductor based on magnetic coupling cancellation.
    Type: Grant
    Filed: October 26, 2018
    Date of Patent: July 19, 2022
    Assignee: QUALCOMM Incorporated
    Inventors: Haitao Cheng, Sherif Mahmoud Shakib Roshdy, Abbas Abbaspour-Tamijani, Chinmaya Mishra
  • Patent number: 11336229
    Abstract: The disclosure relates to a radio frequency oscillator. The radio frequency oscillator includes a resonator circuit being resonant at an excitation of the resonator circuit in a differential mode and at an excitation of the resonator circuit in a common mode. The resonator circuit has a differential mode resonance frequency at the excitation in the differential mode, and the resonator circuit has a common mode resonance frequency at the excitation in the common mode. A first excitation circuit is configured to excite the resonator circuit in the differential mode to obtain a differential mode oscillator signal oscillating at the differential mode resonance frequency, and a second excitation circuit is configured to excite the resonator circuit in the common mode to obtain a common mode oscillator signal oscillating at the common mode resonance frequency.
    Type: Grant
    Filed: May 12, 2021
    Date of Patent: May 17, 2022
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Mina Shahmohammadi, Masoud Babaie, Robert Bogdan Staszewski
  • Patent number: 11336331
    Abstract: Systems and methods are disclosed for an integrated circuit (IC) comprising an oscillator, an on-off-keying modulator configured to modulate input data coupled to the oscillator, a serial communications transmitter coupled to the on-off-keying modulator, a serial communications receiver coupled to the serial communications transmitter by a set of cables, and an envelope detector coupled to the serial communications receiver. In the IC, power and data are simultaneously delivered across the same set of cables from the serial communications transmitter to the serial communications receiver.
    Type: Grant
    Filed: May 27, 2021
    Date of Patent: May 17, 2022
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Dushmantha Bandara Rajapaksha, Wesley Ray, Hao Liu, Maxwell Robertson
  • Patent number: 11195647
    Abstract: Systems and implementations for inductance tuning systems that are configured to operate in a wide range of frequencies are provided herein. The subject matter described herein can in some embodiments include an inductance tuning system including at least one inductor connected to a first terminal, the at least one inductor comprising of a plurality of inductive elements that are substantially magnetically coupled to each other, wherein spacing between the inductive elements are substantially less than diameters of the windings. At least one capacitor can be connected between one or more of the plurality of inductive elements and a second terminal.
    Type: Grant
    Filed: August 27, 2020
    Date of Patent: December 7, 2021
    Assignee: WISPRY, INC.
    Inventor: Jørgen Bøjer
  • Patent number: 11108372
    Abstract: An apparatus comprises a first circuit and a second circuit. The first circuit generally comprises differential symmetric band extension circuitry. The second circuit generally comprises coupled inductor coils configured to convert between differential and single-ended signal formats.
    Type: Grant
    Filed: November 4, 2019
    Date of Patent: August 31, 2021
    Assignee: Integrated Device Technology, Inc.
    Inventors: Chuying Mao, Ran Li
  • Patent number: 11038553
    Abstract: A near field communication (NFC) device capable of operating by being powered by the field includes an NFC module for generating an electromagnetic carrier signal and modulating the carrier signal according to data to be transmitted, and an antenna circuit coupled to and driven by said NFC module with the modulated carrier signal. The device includes an RF front end coupled between said NFC module and said antenna circuit. The RF front end includes a balanced to unbalanced (Balun) transformer and a tuning capacitor to provide a function of an electromagnetic compatibility (EMC) filter. A powered by the field circuit of the NFC device is adapted to harvest energy from an external field to power said NFC device. The power by the field circuit is coupled to said Balun transformer via one or more impedance elements.
    Type: Grant
    Filed: December 10, 2018
    Date of Patent: June 15, 2021
    Assignee: NXP B.V.
    Inventors: Jingfeng Ding, Gernot Hueber, Erich Merlin
  • Patent number: 11025197
    Abstract: The invention relates to a resonator circuit, the resonator circuit comprising a transformer comprising a primary winding and a secondary winding, wherein the primary winding is inductively coupled with the secondary winding, a primary capacitor being connected to the primary winding, the primary capacitor and the primary winding forming a primary circuit, and a secondary capacitor being connected to the secondary winding, the secondary capacitor and the secondary winding forming a secondary circuit, wherein the resonator circuit has a common mode resonance frequency at an excitation of the primary circuit in a common mode, wherein the resonator circuit has a differential mode resonance frequency at an excitation of the primary circuit in a differential mode, and wherein the common mode resonance frequency is different from the differential mode resonance frequency.
    Type: Grant
    Filed: March 27, 2020
    Date of Patent: June 1, 2021
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Mina Shahmohammadi, Masoud Babaie, Robert Bogdan Staszewski
  • Patent number: 11025198
    Abstract: The invention relates to a radio frequency oscillator, the radio frequency oscillator comprising a resonator circuit being resonant at an excitation of the resonator circuit in a differential mode and at an excitation of the resonator circuit in a common mode, wherein the resonator circuit has a differential mode resonance frequency at the excitation in the differential mode, and wherein the resonator circuit has a common mode resonance frequency at the excitation in the common mode, a first excitation circuit being configured to excite the resonator circuit in the differential mode to obtain a differential mode oscillator signal oscillating at the differential mode resonance frequency, and a second excitation circuit being configured to excite the resonator circuit in the common mode to obtain a common mode oscillator signal oscillating at the common mode resonance frequency.
    Type: Grant
    Filed: April 14, 2020
    Date of Patent: June 1, 2021
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Mina Shahmohammadi, Masoud Babaie, Robert Bogdan Staszewski
  • Patent number: 11005443
    Abstract: A multilayer balun includes first, second, and third terminals, first and second inductors, and an open line conductor. The first inductor is electrically connected between the first terminal and ground points. The second inductor is electrically connected between the second terminal and the third terminal and is magnetically coupled with the first inductor. The open line conductor has one end that is an open end and another end that is electrically connected to a via conductor pattern, which is a signal path between the first terminal and ground points.
    Type: Grant
    Filed: December 16, 2019
    Date of Patent: May 11, 2021
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Noboru Shiokawa
  • Patent number: 10998121
    Abstract: An inductor coil includes a wire which is wound in alternating layers such that the surface area of the wire in each winding viewed from above or below the coil is substantially equal in each half of the coil defined by a line bisecting the center point in each layer. The layers are also wound in a serpentine fashion to balance the capacitance between layers. The substantially equal surface area of wire in each half of a coil layer and in adjacent coil layers results in a balanced capacitance of the coil which, in turn, results in reduced common mode noise.
    Type: Grant
    Filed: July 31, 2017
    Date of Patent: May 4, 2021
    Assignee: Apple Inc.
    Inventors: Yehonatan Perez, Makiko K. Brzezinski, Karl Ruben F. Larsson, Christopher S. Graham
  • Patent number: 10978547
    Abstract: An integrated inductor includes a first coil and a second coil. The first coil has at least one first turn disposed in a first area and at least one second turn disposed in a second area, a number of the at least one first turn is different from a number of the at least one second turn. The second coil has at least one third turn disposed in the first area and at least one fourth turn disposed in the second area, a number of the at least one third turn is different from a number of the at least one fourth turn. The number of the at least one first turn is different from the number of the at least one third turn, and the number of the at least one second turn is different from the number of the at least one fourth turn.
    Type: Grant
    Filed: September 10, 2018
    Date of Patent: April 13, 2021
    Assignee: REALTEK SEMICONDUCTOR CORPORATION
    Inventors: Hsiao-Tsung Yen, Yuh-Sheng Jean, Ta-Hsun Yeh
  • Patent number: 10917139
    Abstract: According to one embodiment, there is provided a magnetic coupling device including a first coil, a second coil, a third coil, a fourth coil, a first constant-potential node and a second constant-potential node. The second coil is electrically connected with one end of the first coil and wound in a direction opposite to a direction in which the first coil is wound. The third coil faces the first coil. The fourth coil faces the second coil. The first constant-potential node is electrically connected with one end of the third coil. The second constant-potential node is electrically connected with one end of the fourth coil.
    Type: Grant
    Filed: February 28, 2019
    Date of Patent: February 9, 2021
    Assignees: KABUSHIKI KAISHA TOSHIBA, TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
    Inventors: Toyoaki Uo, Tsuneo Suzuki, Hiroaki Ishihara
  • Patent number: 10903544
    Abstract: A high input impedance magnetic balun/transformer having a phase balancing network (PBN) and method of operating. The balun is fully configurable and trimmable post fabrication using independently adjustable resistive and reactive parts by changing the resistance of a programmed transistor, e.g., NMOS. Parallel connected legs each having a field effect transistors (FETs) that make up NMOS device alter the impedance at the balun output terminals. The ground terminal of a secondary winding or coil at an unbalanced, single-ended side is connected to a phase balancing network. The phase balancing network includes at least two parallel legs, each leg having a resistive element in the form of a transistor device and at least one leg including a capacitive element. The transistor device at a leg can be operated in a linear region to trim the resistance and capacitances at the unbalanced side in order to achieve proper phase balancing and amplitude matching.
    Type: Grant
    Filed: April 25, 2019
    Date of Patent: January 26, 2021
    Assignee: International Business Machines Corporation
    Inventors: Sudipto Chakraborty, Rajiv Joshi, Steven J. Holmes, Bruce B. Doris
  • Patent number: 10873318
    Abstract: Filter circuits having acoustic wave resonators in a transversal configuration are disclosed. In the transversal configuration, the acoustic wave resonators are arranged transverse to an input and output port of the filter circuit. As such, all the acoustic wave resonators of the filter circuit are connected to the input port and connected to the output port. In the transversal configuration, the filter circuit can be designed for any transfer function without being restricted to a coupling coefficient of a piezoelectric material used in the acoustic wave resonators. In this regard, the filter circuit can achieve very wideband filter responses, multiband responses, and/or responses with arbitrary position of transmission zeros. The filter circuit having the transversal configuration can also be designed for complex transmission zeros for phase equalization.
    Type: Grant
    Filed: June 8, 2018
    Date of Patent: December 22, 2020
    Assignee: Qorvo US, Inc.
    Inventors: Jordi Mateu, Carlos Collado Gomez, Alberto Hueltes Escobar, Robert Aigner, Nadim Khlat
  • Patent number: 10867742
    Abstract: A helical stacked integrated inductor formed by a first inducing unit and a second inducing unit includes a first helical coil and a second helical coil. The first helical coil is substantially located at a first plane and includes a first outer turn and a first inner turn. The first inner turn is surrounded by the first outer turn. The first helical coil forms a part of the first inducing unit and a part of the second inducing unit. The second helical coil is substantially located at a second plane different from the first plane and overlaps the first helical coil. The second helical coil forms a part of the first inducing unit and a part of the second inducing unit. The first helical coil and the second helical coil are stacked in a staggered arrangement.
    Type: Grant
    Filed: October 13, 2016
    Date of Patent: December 15, 2020
    Assignee: REALTEK SEMICONDUCTOR CORPORATION
    Inventor: Hsiao-Tsung Yen
  • Patent number: 10854367
    Abstract: An inductor and method for making the same are provided. The inductor includes a coil formed from a conductor and having a serpentine shape. The coil may have an “S”-shape. The coil has two leads extending from opposite ends of the coil. An inductor body surrounds the coil and portions of the leads. The leads may be wrapped around the body to create contact points on the exterior of the inductor.
    Type: Grant
    Filed: August 31, 2017
    Date of Patent: December 1, 2020
    Assignee: VISHAY DALE ELECTRONICS, LLC
    Inventors: Benjamin M. Hanson, Darek Blow, Chris Grubbels
  • Patent number: 10826457
    Abstract: According to one embodiment, a matching network circuit includes a first capacitor coupled, in parallel, to an input port of the matching network circuit; a broadband on-chip transformer coupled, in parallel, to the first capacitor, where the broadband on-chip transformer includes a primary winding and a secondary winding, where the secondary winding is a partial winding. The matching network circuit includes a second capacitor coupled, in series, in between the broadband on-chip transformer and an output port of the matching network circuit.
    Type: Grant
    Filed: February 7, 2018
    Date of Patent: November 3, 2020
    Assignees: SWIFTLINK TECHNOLOGIES INC., GEORGIA TECH RESEARCH CORPORATION
    Inventors: Taiyun Chi, Hua Wang, Thomas Chen
  • Patent number: 10673394
    Abstract: A power amplifier (PA) cell is coupled to an input signal source an a load, and includes a transistor coupled to the load; a first inductor coupled to a gate of the transistor; and a second inductor coupled to a source of the transistor, wherein the first inductor and the second inductor each includes a first conductive coil and a second conductive coil, respectively, having first and second inductance values, respectively, such that the power cell is coupled to the input signal source without an input impedance matching circuit disposed between the gate of the transistor and the input signal source, and without an output impedance matching circuit disposed between a drain of the transistor and the load.
    Type: Grant
    Filed: July 20, 2018
    Date of Patent: June 2, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventor: Jun-De Jin
  • Patent number: 10644648
    Abstract: The embodiments of the invention relate to a radio frequency oscillator, the radio frequency oscillator comprising a resonator circuit resonant at an excitation of the resonator circuit in a differential mode and at an excitation of the resonator circuit in a common mode, wherein the resonator circuit has a differential mode resonance frequency at the excitation in the differential mode, and wherein the resonator circuit has a common mode resonance frequency at the excitation in the common mode, a first excitation circuit configured to excite the resonator circuit in the differential mode to obtain a differential mode oscillator signal oscillating at the differential mode resonance frequency, and a second excitation circuit configured to excite the resonator circuit in the common mode to obtain a common mode oscillator signal oscillating at the common mode resonance frequency.
    Type: Grant
    Filed: July 25, 2017
    Date of Patent: May 5, 2020
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Mina Shahmohammadi, Masoud Babaie, Robert Bogdan Staszewski
  • Patent number: 10637395
    Abstract: The invention relates to a resonator circuit, the resonator circuit comprising a transformer comprising a primary winding and a secondary winding, wherein the primary winding is inductively coupled with the secondary winding, a primary capacitor being connected to the primary winding, the primary capacitor and the primary winding forming a primary circuit, and a secondary capacitor being connected to the secondary winding, the secondary capacitor and the secondary winding forming a secondary circuit, wherein the resonator circuit has a common mode resonance frequency at an excitation of the primary circuit in a common mode, wherein the resonator circuit has a differential mode resonance frequency at an excitation of the primary circuit in a differential mode, and wherein the common mode resonance frequency is different from the differential mode resonance frequency.
    Type: Grant
    Filed: July 25, 2017
    Date of Patent: April 28, 2020
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Mina Shahmohammadi, Masoud Babaie, Robert Bogdan Staszewski
  • Patent number: 10607765
    Abstract: A coil component and a board having the same are provided. The coil component includes: a first coil; a second coil sharing a magnetic core with the first coil; a main board disposed between the first and second coils; first and second external electrodes connected to the first coil; and third and fourth external electrodes connected to the second coil.
    Type: Grant
    Filed: August 5, 2016
    Date of Patent: March 31, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Chan Yoon, Dong Hwan Lee, Young Ghyu Ahn
  • Patent number: 10594274
    Abstract: A power amplifier cell comprising a first power amplifier, a second power amplifier and a balun. The balun comprises a first inductor and a second inductor that define a first transformer; and a third inductor and a fourth inductor that define a second transformer. The following: (i) a parasitic capacitance of the first power amplifier; (ii) a leakage inductance of the first transformer; and (iii) a capacitive coupling between the first inductor and the second inductor, contribute to a first impedance matching circuit for the first power amplifier. Also, the following (iv) a parasitic capacitance of the second power amplifier; (v) a leakage inductance of the second transformer; and (vi) a capacitive coupling between the third inductor and the fourth inductor, contribute to a second impedance matching circuit for the second power amplifier.
    Type: Grant
    Filed: August 31, 2018
    Date of Patent: March 17, 2020
    Assignee: NXP B.V.
    Inventors: Jawad Hussain Qureshi, Mustafa Acar
  • Patent number: 10594290
    Abstract: The present invention provides a planar balun and a multi-layer circuit board. The planar balun formed on the multi-layer circuit board comprises: a first winding with at least one turn, which is formed in a first conductive layer, and has a first lead and a second lead serving as a first balanced end and a second balanced end of the balun respectively; a second winding with at least one turn, which is formed in a second conductive layer separated from the first conductive layer by at least a first insulating layer, and has a third lead and a fourth lead, wherein the third lead is connected to a ground potential, and the fourth lead serves as an unbalanced end of the balun; and a first balancing capacitor, which is connected between a selected portion near a center of the first winding and the ground potential.
    Type: Grant
    Filed: December 21, 2017
    Date of Patent: March 17, 2020
    Assignee: General Electric Company
    Inventors: Yu Liu, Dongliang Yang, Xin Xie, Haoyang Xing, Kai Wang, Chunlai Xiao
  • Patent number: 10574205
    Abstract: Disclosed is a balanced to unbalanced converter, which relates to the field of semiconductor technologies. The balanced to unbalanced converter includes a first spiral coil and a second spiral coil. The first spiral coil includes: multiple rings of first metal wires; and a second metal wire, which is located above the multiple rings of first metal wires and is connected to an innermost ring of the first metal wires using a conductive plug.
    Type: Grant
    Filed: July 25, 2018
    Date of Patent: February 25, 2020
    Assignees: Semiconductor Manufacturing International (Shanghai) Corporation, Semiconductor Manufacturing International (Beijing) Corporation
    Inventors: XiNing Wang, JenHao Cheng, Ling Liu, Jin Feng Gao
  • Patent number: 10504647
    Abstract: An isolation transformer includes a transformer core. First and second through-bores extend through the transformer core from a first surface to a second surface. Each through-bore has an elongated profile with at least a portion of the elongated profile providing a respective flat winding surface. The flat winding surfaces are spaced apart by a central portion of the transformer core. The transformer is wound with a six-wire cable having a central non-conductive core. First, second, third, fourth, fifth and sixth conductive wires are positioned around and adjacent to the central non-conductive core in a substantially equally spaced angular relationship. The second conductive wire is positioned between the first conductive wire and the third conductive wire; and the fifth conductive wire is positioned between the fourth conductive wire and the sixth conductive wire. The conductive wires are twisted about the central non-conductive core at a selected twist density.
    Type: Grant
    Filed: October 4, 2017
    Date of Patent: December 10, 2019
    Assignee: Bel Fuse (Macao Commercial Off
    Inventors: Victor H. Renteria, Chun Wing (Alan) Ng, Wai Shun Leung
  • Patent number: 10411564
    Abstract: A robot includes a driving unit, a flexible board including a power line that transmits electric power to the driving unit, and a choke coil connected to the power line. A band rejection filter is formed by parasitic capacitance, which is formed by the electric line, and the choke coil.
    Type: Grant
    Filed: October 21, 2015
    Date of Patent: September 10, 2019
    Assignee: Seiko Epson Corporation
    Inventors: Takema Yamazaki, Izumi Iida, Shigenori Sasai
  • Patent number: 10371770
    Abstract: An embodiment provides a radio frequency (RF) receiving coil unit for a magnetic resonance imaging (MRI) system. The RF receiving coil unit includes an RF coil and a circuit. The circuit is configured to monitor a current flowing through the RF coil by using electromagnetic coupling between the RF coil and the first coil.
    Type: Grant
    Filed: January 8, 2017
    Date of Patent: August 6, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventor: George Verghese
  • Patent number: 10355356
    Abstract: A metamaterial-based phase shifting element utilizes a variable capacitor (varicap) to control the effective capacitance of a metamaterial structure in order to control the phase of a radio frequency output signal generated by the metamaterial structure. The metamaterial structure is configured to resonate at the same radio wave frequency as an incident input signal (radiation), whereby the metamaterial structure emits the output signal by way of controlled scattering the input signal. A variable capacitance applied on metamaterial structure by the varicap is adjustable by way of a control voltage, whereby the output phase is adjusted by way of adjusting the control voltage. The metamaterial structure is constructed using inexpensive metal film or PCB fabrication technology including an upper metal “island” structure, a lower metal backplane layer, and a dielectric layer sandwiched therebetween.
    Type: Grant
    Filed: December 20, 2017
    Date of Patent: July 16, 2019
    Assignee: Palo Alto Research Center Incorporated
    Inventors: Bernard D. Casse, Armin R. Volkel, Victor Liu, Alexander S. Tuganov
  • Patent number: 10326424
    Abstract: A filter device includes a filter chip on a multilayer substrate. The filter chip includes a reception filter chip portion and a transmission filter chip portion, and a reception filter defined by a first bandpass filter includes first and second balanced output terminals. First and second balance wirings connect first and second balanced input pads and first and second balanced output pads provided on a second principal surface of the multilayer substrate. The first and second balance wirings cross each other within the multilayer substrate and are electrically insulated from each other. A portion of a ground conductor is disposed at a region in which the first and second balance wirings overlap, interposed between portions of the first and second balance wirings, and disposed at a different substrate layer.
    Type: Grant
    Filed: April 26, 2018
    Date of Patent: June 18, 2019
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Toshishige Koreeda
  • Patent number: 10326231
    Abstract: A modular power supply for connecting to a power cord includes a housing defining an interior, a cover releasably engaged to the housing to enclose the interior, and a carrier plate within the interior including opposed primary channels configured to receive the power cord. A control assembly is within the interior and includes a logic controller electrically coupled to spikes extending outside of the control assembly and through the primary channels, as well as a charging port electrically coupled to the spikes via the logic controller. The cover is applicable to the carrier plate so as to define a hold that captures the power cord on the spikes in the primary channels when the power cord is applied to the primary channels.
    Type: Grant
    Filed: April 18, 2018
    Date of Patent: June 18, 2019
    Assignee: EJ Technologies, LLC
    Inventors: Eric A. Hinsch, Jonathan D. Sands, Thomas G. Canady
  • Patent number: 10236841
    Abstract: A differential amplifier includes a pre-driver stage, an input balun, a matching network, a differential transistor pair, a bias network and an output balun. An output terminal of the pre-driver stage is connected to an input terminal of the input balun. An output terminal of the input balun is connected to the matching network. An output terminal of the matching network is connected to an input terminal of the differential transistor pair and to the bias network. An output terminal of the differential transistor pair is connected to the output balun. A single-turn laminated transformer is used as the input balun of the present invention, and the output balun is of a structure having an inner full frame and an outer half frame, thereby making the differential amplifier have small occupation area, low loss, high operating frequency and high power amplification efficiency.
    Type: Grant
    Filed: August 10, 2016
    Date of Patent: March 19, 2019
    Assignee: University of Electronic Science and Technology
    Inventors: Yuehang Xu, Wei Xiao, Xiansuo Liu, Bowen Sun
  • Patent number: 10200091
    Abstract: A device for inductively coupled communications includes an NFC module for generating an electromagnetic carrier signal and modulating the carrier signal according to data to be transmitted, and an antenna circuit coupled to and driven by said NFC module with the modulated carrier signal. The device includes an RF front end coupled between said NFC module and said antenna circuit. The RF front end includes a balanced to unbalanced (Balun) transformer and a tuning capacitor. The Balun transformer has a first winding coupled to said NFC module via differential transmitter terminals of said NFC module and a second winding coupled to said tuning capacitor. A first terminal of said tuning capacitor is coupled to a receiving terminal of said NFC module. The Balun transformer and tuning capacitor provide a function of an electromagnetic compatibility (EMC) filter.
    Type: Grant
    Filed: June 13, 2017
    Date of Patent: February 5, 2019
    Assignee: NXP B.V.
    Inventors: Jingfeng Ding, Gernot Hueber, Ian Thomas Macnamara
  • Patent number: 10148010
    Abstract: An antenna system includes an antenna having a symmetric geometry with respect to first and second antenna feed ports associated therewith, and a hybrid antenna feed circuit coupled to the first and second antenna feed ports of the antenna. The hybrid antenna feed circuit is configured to receive first and second transmit signals and feed the first transmit signal to the first and second antenna feed ports in a balanced feed mode and feed the second transmit signal to the first and second antenna feed ports in an unbalanced mode in a concurrent fashion.
    Type: Grant
    Filed: December 21, 2015
    Date of Patent: December 4, 2018
    Assignee: Intel Corporation
    Inventors: Saku Lahti, Mikko S. Komulainen
  • Patent number: 10135106
    Abstract: The present disclosure is directed to a balun circuit adapted to operate at a frequency of between about 5 GHz to about 110 GHz. The balun circuit includes first and second output striplines and an input stripline formed on a first surface of the substrate, and a slotline formed on a second surface of the substrate opposite the first surface. The slotline has first and second ends, the first end overlapping the first output stripline and the second end overlapping the second output stripline, and the input stripline overlapping the slotline midway between the first end and the second end.
    Type: Grant
    Filed: February 7, 2018
    Date of Patent: November 20, 2018
    Assignee: Synergy Microwave Corporation
    Inventors: Ajay Kumar Poddar, Ulrich L. Rohde, Shiban K. Koul
  • Patent number: 10020793
    Abstract: Certain aspects of the present disclosure provide an integrated impedance matching and filtering circuit. One example circuit generally includes an impedance matching circuit having a first inductor and a resonant circuit having a resonant frequency and comprising a second inductor magnetically coupled to the first inductor. The resonant circuit is configured to filter out the resonant frequency from the impedance matching circuit. In certain aspects, the resonant circuit may further include a capacitor. The second inductor may include a ring of metal having a gap, and the capacitor may comprise a dielectric material between ends of the ring surrounding the gap. For other aspects, the capacitor may be an integrated circuit element, having a fixed or variable value.
    Type: Grant
    Filed: January 21, 2015
    Date of Patent: July 10, 2018
    Assignee: QUALCOMM Incorporated
    Inventor: Guy Klemens
  • Patent number: 10003318
    Abstract: The disclosure relates to a circuit comprising a balun portion, a balanced side impedance transforming element and an unbalanced side impedance transforming element. The balun portion at least partly transforms the signal between a balanced signal input/output terminal and an unbalanced signal input/output terminal. The impedance transforming elements at least partly alter the impedance presented at the balanced and unbalanced side of the balun. In addition at least one matching transmission element is provided. By separating the role of impedance transformation from balun signal conversion, the useful bandwidth of the circuit can be improved in comparison to a balun that provides both signal conversion and impedance transformation functions.
    Type: Grant
    Filed: June 9, 2017
    Date of Patent: June 19, 2018
    Assignee: Ampleon Netherlands B.V.
    Inventor: Jawad Hussain Qureshi
  • Patent number: 9979116
    Abstract: A modular power supply for connecting to a power cord includes a housing defining an interior, a cover releasably engaged to the housing to enclose the interior, and a carrier plate within the interior including opposed primary channels configured to receive the power cord. A control assembly is within the interior and includes a logic controller electrically coupled to spikes extending outside of the control assembly and through the primary channels, as well as a charging port electrically coupled to the spikes via the logic controller. The cover is applicable to the carrier plate so as to define a hold that captures the power cord on the spikes in the primary channels when the power cord is applied to the primary channels.
    Type: Grant
    Filed: September 13, 2017
    Date of Patent: May 22, 2018
    Inventors: Eric A. Hinsch, Jonathan D. Sands, Thomas G. Canady