Having Long Line Elements Patents (Class 333/26)
  • Patent number: 10872718
    Abstract: A coil component includes a first magnetic body, an insulator stacked on the first magnetic body, a second magnetic body stacked on the insulator, a coil which is disposed in the insulator and which includes at least one coil conductor layer, and an internal magnetic body disposed within the inner circumference of the coil and connected to the first magnetic body and the second magnetic body. In a cross section in a stacking direction, the width of the internal magnetic body increases continuously from the first magnetic body side toward the second magnetic body side. Also, the inner circumferential surface of an end coil conductor layer located closest to the second magnetic body faces the outer circumferential surface of the internal magnetic body and is inclined in the same direction as the outer circumferential surface of the internal magnetic body with respect to the stacking direction.
    Type: Grant
    Filed: July 6, 2018
    Date of Patent: December 22, 2020
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Morihiro Hamano, Keiichi Tsuduki, Kouhei Matsuura, Minoru Matsunaga
  • Patent number: 10862544
    Abstract: According to one embodiment, in a magnetic coupler, a plurality of coils includes a first pattern and a second pattern. The first pattern includes a first winding portion and a second winding portion. The second winding portion is arranged in a first direction to the first winding portion. The second pattern is disposed adjacent to the first pattern along the first plane. The second pattern is arranged at a position corresponding to a boundary between the first winding pattern and the second winding pattern. The second pattern includes a third winding portion and a fourth winding portion. The fourth winding portion is arranged in a second direction to the third winding portion. The second direction is a different direction from the first direction. The fourth winding portion is wound in a reversed direction with the third winding portion.
    Type: Grant
    Filed: February 6, 2019
    Date of Patent: December 8, 2020
    Assignees: Kabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage Corporation
    Inventor: Katsuyuki Ikeuchi
  • Patent number: 10854984
    Abstract: A method of manufacturing an integrated radio frequency (RF) module, comprising structurally forming at least one RF waveguide and at least one RF radiator of a metalized ceramic material. The RF waveguide(s) and the RF radiator(s) are connected and operatively coupled with each other. Each of the RF radiator(s) comprises a metalized outer wall and at least one metalized axial ridge extending along an inner surface of the outer wall. The method further comprises sintering the metalized ceramic material to create a monolithic structure comprising the RF waveguide and RF radiator, and operatively coupling RF circuitry to the RF waveguide(s).
    Type: Grant
    Filed: March 10, 2016
    Date of Patent: December 1, 2020
    Assignee: The Boeing Company
    Inventors: Yong U. Kim, Andrew G. Laquer
  • Patent number: 10854965
    Abstract: A ground shield is connected to a princted circuit board or antenna card in an antenna unit cell to cover a balun to prevent or inhibit the ability of a differential signal flowing towards or through the balun from coupling with a similar differential signal flowing through an adjacent antenna card in the antenna unit cell. This ground shield may be one of a pair of ground shields on the antenna card. Two ground shield can be positioned on opposing sides of the balun to enhance isolation thereof by shielding the differential signals flowing towards and through the balun from coupling with adjacent differential signals to thereby increase bandwidth performance of the antenna unit cell. The ground shields may be generally or substantially or totally planar so as to be conformal with a substrate or dielectric layer of the antenna card or printed circuit board.
    Type: Grant
    Filed: February 15, 2019
    Date of Patent: December 1, 2020
    Assignee: BAE Systems Information and Electronic Systems Integration Inc.
    Inventors: Matilda Livadaru, Andrew C. Maccabe
  • Patent number: 10811752
    Abstract: A waveguide coupler includes a waveguide having a first and a second port, and a slot formed in a broadwall of the waveguide between the first and second ports, the slot centered on the first broadwall. A plurality of shifted waveguide sections are arranged between the first and second ports and extend along a length of the waveguide. A parallel-plate transmission line structure is coupled to the slot, wherein RF signals within one of the waveguide or the parallel-plate transmission line are communicated to the other of the waveguide and the parallel-plate transmission line through the slot.
    Type: Grant
    Filed: March 15, 2019
    Date of Patent: October 20, 2020
    Assignee: ThinKom Solutions, Inc.
    Inventors: Shahrokh Hashemi-Yeganeh, William Milroy
  • Patent number: 10784564
    Abstract: An antenna-integrated radio frequency (RF) module includes a multilayer substrate disposed between an integrated chip (IC) and patch antennas, signal vias, and ground members. The IC is configured to generate RF signals. The signal vias are configured to connect and transmit/receive the RF signals from each of the patch antennas to the IC. The ground members are disposed on an outer surface layer and intermediate surface layers of the multilayer substrate to surround each of the patch antennas and the signal vias.
    Type: Grant
    Filed: November 25, 2019
    Date of Patent: September 22, 2020
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hong In Kim, Thomas A. Kim, Ho Kyung Kang
  • Patent number: 10768035
    Abstract: A radar fill-level measuring device for measuring a fill level of a fill substance in a container using the travel time principle, comprising a circuit board with a sending/receiving system for sending and receiving high-frequency radar waves, wherein the circuit board has at least two openings, a hollow conductor having at least two lateral edge projections, wherein lengths of the at least two projections are greater than the thickness of the circuit board, wherein the at least two projections are led through the at least two openings, so that the at least two projections extend partially out from a second side of the circuit board, a lid, which is secured to parts of the at least two projections, which extend out from the second side of the circuit board, such that the hollow conductor is secured to the circuit board by means of the lid.
    Type: Grant
    Filed: July 26, 2016
    Date of Patent: September 8, 2020
    Assignee: ENDRESS+HAUSER SE+CO.KG
    Inventors: Christian Seiler, Thomas Blodt, Jorg Fuglistaller
  • Patent number: 10770774
    Abstract: The present invention relates to a microstrip-waveguide transition for transmission of electromagnetic wave signals. According to one aspect of the invention, there is provided a microstrip-waveguide transition for transmission of electromagnetic wave signals, comprising: a feeding part for providing an electromagnetic wave signal to be transmitted through the waveguide; and a ground part formed at a predetermined interval from the feeding part, wherein the microstrip and the waveguide are coupled alongside each other along a length direction of the waveguide, and wherein a distance between the feeding part and the ground part in a direction perpendicular to the length direction of the waveguide is greater as it is closer to the waveguide.
    Type: Grant
    Filed: September 28, 2018
    Date of Patent: September 8, 2020
    Assignee: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Hyeon Min Bae, Ha Il Song, Joon Yeong Lee, Tae Hoon Yoon, Hyo Sup Won
  • Patent number: 10756435
    Abstract: An antenna module is described where uniform radiation pattern coverage is provided in the plane of a low profile antenna radiating element. A polarization that is orthogonal to the plane of the low profile antenna radiating element can be achieved for the radiated field. A ground plate aperture is implemented into the antenna ground plate to minimize frequency shift as the antenna is installed on metallic (conductive) and non-metallic (non-conductive) ground planes of varying sizes. This antenna system technique is applicable for use in communication systems such as a local Area network (LAN), cellular communication network, and Machine to Machine (M2M).
    Type: Grant
    Filed: April 18, 2017
    Date of Patent: August 25, 2020
    Assignee: Ethertronics, Inc.
    Inventor: Laurent Desclos
  • Patent number: 10739437
    Abstract: Provided is a frequency selective surface including a conductor plane (101), nine loop slots (102) each formed to be surrounded by the conductor plane (101), and a capacitance component (103) disposed to straddle the loop slots (102) in a width direction, both ends of the capacitance component being connected to the conductor plane (101) at a position near the loop slots (102). The conductor plane (101) and the loop slots (102) each formed to be surrounded by the conductor plane (101) constitute a unit cell (110). The unit cells (110) are two-dimensionally periodically arranged. One or more (four in the case of FIG. 1) capacitance components (103) disposed to straddle the loop slots (102) in the width direction are provided for each loop slot (102). Operating frequencies can be easily changed by adjusting only a component connected to the unit cell, or a part of metallic patterns.
    Type: Grant
    Filed: January 26, 2016
    Date of Patent: August 11, 2020
    Assignee: NEC CORPORATION
    Inventor: Hiroshi Toyao
  • Patent number: 10727806
    Abstract: A balun includes a first LC resonator, a second LC resonator, a third LC resonator, and a fourth LC resonator. The second LC resonator is magnetically coupled with the first LC resonator. The fourth LC resonator is magnetically coupled with the third LC resonator and electrically connected between a third terminal and a fourth terminal in parallel with the second LC resonator. Each of the first LC resonator and the second LC resonator has a resonant frequency that is a first resonant frequency. Each of the third LC resonator and the fourth LC resonator has a resonant frequency that is a second resonant frequency higher than the first resonant frequency.
    Type: Grant
    Filed: August 27, 2019
    Date of Patent: July 28, 2020
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Tetsuo Taniguchi
  • Patent number: 10714251
    Abstract: Antenna structures including two anti-symmetrically wound transformers to compensate for stray radiation. In one example an antenna structure includes a transformer assembly connected between an antenna and first and second balanced signal contacts, the transformer assembly including first and second transformer cores independently positionable in space relative to one another, a pair of primary windings connected to the antenna in parallel with one another, and a pair of balanced secondary windings connected in parallel with one another between the first and second balanced signal contacts.
    Type: Grant
    Filed: April 26, 2018
    Date of Patent: July 14, 2020
    Assignee: RAYTHEON COMPANY
    Inventors: Benjamin P. Dolgin, Thomas Lavedas, Joseph J. Fraundorfer
  • Patent number: 10707549
    Abstract: A radio frequency (RF) assembly that includes a microstrip to waveguide transition is described herein. In one example, the RF assembly can include a substrate, a microstrip, and a waveguide. The substrate can include an antenna that includes an antenna slot. A portion of the microstrip, such as an end of the microstrip, can be disposed within and/or underneath the antenna slot. The microstrip can be embedded within the substrate and can be electrically coupled to the antenna. At least a portion of the waveguide can be disposed over the antenna slot.
    Type: Grant
    Filed: April 10, 2018
    Date of Patent: July 7, 2020
    Assignee: The Boeing Company
    Inventors: John E. Rogers, Corey M. Thacker
  • Patent number: 10644412
    Abstract: An antenna includes first and second conductive plates disposed to face each other, a dielectric disposed between the first and second conductive plates, and a plurality of via holes which penetrate the first and second conductive plates and the dielectric. A first emission cavity and a plurality of second emission cavities which emit radio waves are formed by the plurality of via holes and the first and second conductive plates.
    Type: Grant
    Filed: December 1, 2015
    Date of Patent: May 5, 2020
    Assignee: Hyundai Motor Company
    Inventor: Dongjin Kim
  • Patent number: 10616996
    Abstract: A printed circuit board for a radar level measurement device with a printed circuit board substrate is provided, wherein a microwave signal is coupled via a microwave conductor into a waveguide. A connection region on a front side of the printed circuit board substrate serves to receive the waveguide. A shape of a resonator shell is generated inversely by producing an annular peripheral recess whose wall has an electromagnetically reflecting coating on a rear side of the printed circuit board substrate. The annular peripheral recess on the rear side, together with a region surrounded by the recess, forms a resonator for the injected microwave signals.
    Type: Grant
    Filed: December 4, 2018
    Date of Patent: April 7, 2020
    Assignee: VEGA GRIESHABER KG
    Inventors: Juergen Motzer, Winfried Rauer, Daniel Schultheiss, Christoph Mueller
  • Patent number: 10528693
    Abstract: An integrated circuit device includes first and second features, each including an end portion arranged along a common axis, and separated by a space. The end portion of the first feature includes a first indention adjacent to the space. The end portion of the second feature includes a first indention adjacent to the space, mirroring the first indention of the first feature about the space. The end portions are substantially similar in shape.
    Type: Grant
    Filed: November 21, 2016
    Date of Patent: January 7, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Shih-Ming Chang, Kuei-Liang Lu
  • Patent number: 10522894
    Abstract: A coaxial microstrip line conversion circuit includes: a waveguide including first and second through holes, spaced apart from each other, the second through hole having a dimension to cut off a used frequency; a coaxial connector including a central conductor including a projection projecting from an axial end of an outer conductor; and a microstrip line including a ground conductor provided on one surface of an insulating substrate, and a strip line provided on the other surface of the insulating substrate and including a projection projecting axially from the ground conductor. The outer conductor is connected to an outer wall of the waveguide. The projection of the central conductor is inserted through the first through hole into the waveguide, the ground conductor is connected to an inner wall of the second through hole, and the projection of the strip line is inserted through the second through hole into the waveguide.
    Type: Grant
    Filed: May 18, 2016
    Date of Patent: December 31, 2019
    Assignee: Mitsubishi Electric Corporation
    Inventors: Jun Nishihara, Hiroyuki Nonomura, Toshihiro Fujii
  • Patent number: 10483611
    Abstract: A metal member which allows a waveguide to extend inside a dielectric substrate and is adapted to hold a short-circuit metal layer at a potential same as a potential of the waveguide is made to remain along cross-sections of the two wide walls of the waveguide and is removed along cross-sections of two narrow walls of the waveguide so as to prevent an electromagnetic wave from unintendedly being radiated.
    Type: Grant
    Filed: March 18, 2016
    Date of Patent: November 19, 2019
    Assignee: Japan Radio Co., Ltd.
    Inventor: Masayuki Sugano
  • Patent number: 10461810
    Abstract: A system is provided in which a set of modules each have a substrate on which is mounted a radio frequency (RF) transmitter and/or an RF receiver coupled to a near field communication (NFC) coupler located on the substrate. Each module has a housing that surrounds and encloses the substrate. The housing has a port region on a surface of the housing. Each module has a field confiner located between the NFC coupler and the port region on the housing configured to guide electromagnetic energy emanated from the NFC coupler through the port region to a port region of an adjacent module. A reflective surface is positioned adjacent the backside of each NFC coupler to reflect back side electromagnetic towards the port region.
    Type: Grant
    Filed: June 29, 2017
    Date of Patent: October 29, 2019
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Benjamin Stassen Cook, Nathan Brooks, Swaminathan Sankaran, Bradley Allen Kramer, Mark W. Morgan, Baher Haroun
  • Patent number: 10432165
    Abstract: Provided is a balanced/unbalanced converter (1) that includes a first strip line (40), a second strip line (41), a third strip line (42), a fourth strip line (43), an unbalanced terminal (4), and an open terminal (7). The first strip line (40) includes a spiral first conductor (19), and the second strip line (41) includes a spiral second conductor (14). An outer circumferential end (19b) of the first conductor (19) is electrically connected to the unbalanced terminal (4), and an outer circumferential end (14a) of the second conductor (14) is electrically connected to the open terminal (7).
    Type: Grant
    Filed: December 14, 2017
    Date of Patent: October 1, 2019
    Assignee: TDK CORPORATION
    Inventors: Hiroya Suzuki, Noriaki Ootsuka, Yuta Ashida
  • Patent number: 10425793
    Abstract: A system is provided in which a set of modules each have a substrate on which is mounted a radio frequency (RF) transmitter and/or an RF receiver coupled to a near field communication (NFC) coupler located on the substrate. Each module has a housing that surrounds and encloses the substrate. The housing has a port region on a surface of the housing. Each module has a field confiner located between the NFC coupler and the port region on the housing configured to guide electromagnetic energy emanated from the NFC coupler through the port region to a port region of an adjacent module. The port region is offset laterally from the NFC coupler. The field confiner is skewed to provide a pathway between the NFC coupler and the port region.
    Type: Grant
    Filed: June 29, 2017
    Date of Patent: September 24, 2019
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Swaminathan Sankaran, Benjamin Stassen Cook, Nathan Brooks, Bradley Allen Kramer, Mark W. Morgan, Baher Haroun
  • Patent number: 10403954
    Abstract: In described examples, an integrated waveguide transition includes a substrate with a waveguide side and an opposing waveguide termination side. A first layer of metal covers a portion of the waveguide side, a second layer of metal is separated from the first layer of metal by a first layer of dielectric, and a third layer of metal covers a portion of the waveguide termination side and is separated from the second layer of metal by a second layer of dielectric. A substrate waveguide perpendicular to a plane of the substrate extends from the waveguide side to the waveguide termination side; and a length and a width of the substrate waveguide is defined by a fence of ground-stitching vias that short the first layer of metal and the second layer of metal to a plate of the third layer of metal that forms a back short.
    Type: Grant
    Filed: December 30, 2017
    Date of Patent: September 3, 2019
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventor: Meysam Moallem
  • Patent number: 10396452
    Abstract: A dielectric substrate for transmitting a signal with a frequency f0 includes a dielectric and a copper film pattern arranged on a first surface of the dielectric. The copper film pattern has a first dimension L in a direction parallel to a propagation direction of an electromagnetic wave that has the frequency f0 and that propagates on the first surface, and the first dimension L is given by: L = 1 ? r - 1 ? k ? ? ? 0 where ?r represents a relative permittivity of the dielectric, k represents a constant in a range of 0.15 to 0.70, and ?0 represents a free space wavelength of the signal.
    Type: Grant
    Filed: May 23, 2017
    Date of Patent: August 27, 2019
    Assignee: Panasonic Intellectual Property Management Co., Ltd.
    Inventors: Ken Takahashi, Yuichi Kashino, Ryosuke Shiozaki
  • Patent number: 10389410
    Abstract: A system is provided in which a set of modules each have a substrate on which is mounted a radio frequency (RF) transmitter and/or an RF receiver coupled to a near field communication (NFC) coupler located on the substrate. Each module has a housing that surrounds and encloses the substrate. The housing has a port region on a surface of the housing. Each module has a field confiner located between the NFC coupler and the port region on the housing configured to guide electromagnetic energy emanated from the NFC coupler through the port region to a port region of an adjacent module. An artificial magnetic conductor surface is positioned adjacent the backside of each NFC coupler to reflect back side electromagnetic energy with a phase shift of approximately zero degrees.
    Type: Grant
    Filed: June 29, 2017
    Date of Patent: August 20, 2019
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Nathan Brooks, Benjamin Stassen Cook, Swaminathan Sankaran, Bradley Allen Kramer, Mark W. Morgan, Baher S Haroun
  • Patent number: 10381717
    Abstract: An antenna for transmitting a first frequency and a second frequency signals is enclosed. The antenna includes a first metallic section having a first end and a second end, a second metallic section located on a side of the first metallic section and having a first end and a second end. The second metallic section is separated from the first metallic section by a first non-conducting gap. The antenna further includes a third metallic section located on a side of the second metallic section and having a first end and a second end. The third metallic section is separated from the second metallic section by a second non-conducting gap. The first end of the first metallic section is connected to a first electronic circuit, the first end of the third metallic section is connected to a second electronic circuit, and the first end of the second metallic section is connected to a feeding port. The second end of the first metallic section is electrically attached to a first metallic plate.
    Type: Grant
    Filed: March 17, 2017
    Date of Patent: August 13, 2019
    Assignee: NXP B.V.
    Inventors: Anthony Kerselaers, Liesbeth Gommé
  • Patent number: 10320047
    Abstract: A waveguide interface comprising a support block configured to support a printed circuit board assembly. An interface is coupled to an end portion of the support block and extends from the support block. The interface includes a slot positioned to receive at least a portion of the printed circuit board assembly and one or more holes positioned to receive attachment devices to secure the interface to a waveguide component. The support block and interface are molded as a monolithic device. A method of forming the waveguide interface, a waveguide assembly including the waveguide interface, and a method of making the waveguide assembly including the waveguide interface are also disclosed.
    Type: Grant
    Filed: December 21, 2017
    Date of Patent: June 11, 2019
    Assignee: VUBIQ NETWORKS, INC.
    Inventor: Michael Gregory Pettus
  • Patent number: 10290915
    Abstract: A waveguide launch includes a first substrate having a first electrically insulating layer having first and second faces, an internal waveguide extending through the first electrically insulating layer, the internal waveguide being defined by an electrically conductive internal waveguide side wall, and, first and second electrically conductive layers in electrical contact with the internal waveguide side wall, and an electrically conductive probe launch. The waveguide launch also includes; a second substrate having a second electrically insulating layer having third and fourth faces, a backshort recess arranged within the second electrically insulating layer, a third electrically conductive layer on the third face, and, an interconnection waveguide extending between the first and third faces.
    Type: Grant
    Filed: April 13, 2017
    Date of Patent: May 14, 2019
    Assignee: Filtronic Broadband Limited
    Inventors: Gary Flatters, Richard Smith
  • Patent number: 10211504
    Abstract: A radio frequency transmission arrangement comprises a ground plate having an aperture comprising a slot with an elongate cross-section and substantially parallel sides, and a first and second transmission line. The thickness of the ground plate is greater than a width of the slot. The first transmission line comprises a first elongate conductor on a first side of the ground plate and has an end terminated with a first termination stub. The second transmission line comprises a second elongate conductor on the opposite side of the ground plate and has an end terminated with a second termination stub. The first transmission line is arranged to cross the slot at a point adjacent to the first termination stub, and the second transmission line is arranged to cross the slot at a point adjacent to the second termination stub.
    Type: Grant
    Filed: December 1, 2017
    Date of Patent: February 19, 2019
    Assignee: CAMBIUM NETWORKS LIMITED
    Inventors: Peter Strong, Adam Wilkins, Carl Morrell, Paul Clark, Nigel Jonathan Richard King
  • Patent number: 10200122
    Abstract: A communication device is disclosed herein. In an example embodiment, a communication device includes an aperture section configured to attach to a protruding section of another communication device magnetically, and a first wireless communicator configured to wirelessly communicate with a second wireless communicator of the another communication device at a frequency associated with a millimeter-wave band, the first wireless communicator including at least one transmitting coupler, wherein the at least one transmitting coupler converts a wired signal to a radio signal.
    Type: Grant
    Filed: July 20, 2017
    Date of Patent: February 5, 2019
    Assignee: Sony Corporation
    Inventors: Koichiro Kishima, Ayataka Nishio, Tamotsu Yamagami
  • Patent number: 10181629
    Abstract: A marchand balun with a reduced plane size is disclosed. The marchand balun provides two coupling units each having two transmission lines coupled to each other and having a length of ?/8, where ? is a characteristic wavelength of a signal subject to the marchand balun. The marchand balun further provides an additional unit, where two coupling unit and the additional unit are connected in series to each other. The additional unit is one of a transmission line with a length of ?/16 with one open end and a capacitor with one grounded end.
    Type: Grant
    Filed: February 23, 2017
    Date of Patent: January 15, 2019
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Osamu Anegawa, Tsuneo Tokumitsu
  • Patent number: 10141623
    Abstract: Embodiments herein describe a high-speed communication channel in a PCB that includes a dielectric waveguide coupled at respective ends to coaxial vias. The dielectric waveguide includes a core and a cladding where the material of the core has a higher dielectric constant than the material of the cladding. Thus, electromagnetic signals propagating in the core are internally reflected at the interface between the core and cladding such that the electromagnetic signals are primary contained in the core. The coaxial vias include a center conductor and an outer conductor (or shield) which extend through one or more layers of the PCB. One of the coaxial vias radiates electromagnetic signals into the dielectric waveguide at a first end of the core while the other coaxial via receives the radiated signals at a second end of the core.
    Type: Grant
    Filed: October 17, 2016
    Date of Patent: November 27, 2018
    Assignee: International Business Machines Corporation
    Inventors: Samuel R. Connor, Jose A. Hejase, Joseph Kuczynski, Joshua C. Myers, Junyan Tang
  • Patent number: 10109604
    Abstract: A package for embedding one or more electronic components comprises a carrier structure a silicon-based carrier layer, one or more electronic components embedded in one or more cavities formed in the carrier layer, and a cover structure arranged on top of the carrier structure. The cover structure comprises a cover layer and one or more cavities formed in the cover layer. An antenna element and/or a waveguide for connection to an antenna element is formed in and/or on top of the cover layer and coupled to the one or more cavities.
    Type: Grant
    Filed: March 23, 2016
    Date of Patent: October 23, 2018
    Assignee: SONY CORPORATION
    Inventors: Ali Eray Topak, Marcel Daniel Blech
  • Patent number: 10107771
    Abstract: A sensor for dielectric spectroscopy of a sample is disclosed. The sensor comprises a waveguide inductively loaded with a composite dielectric section which comprises a sample holder and a discontinuity separating the sample holder from the waveguide. The electromagnetic impedance of the composite dielectric section varies gradually, at least along the propagation direction of the waveguide, and at least from the onset of the discontinuity towards the sample holder.
    Type: Grant
    Filed: September 17, 2014
    Date of Patent: October 23, 2018
    Assignees: IMEC VZW, VRIJE UNIVERSITEIT BRUSSEL
    Inventors: Vladimir Matvejev, Johan Stiens, Yuchen Zhang
  • Patent number: 10027010
    Abstract: There is provided a printed circuit board structure, a dielectric substrate structure and a method of manufacturing thereof using wideband microstrip lines for reducing signal reflection, resonance and radiation for maintaining signal quality. The widths of certain portions of the wideband microstrips and underlying substrate portions are tapered gradually for achieving a reduction in a signal reflection, resonance and radiation therefore resulting in maintaining signal quality.
    Type: Grant
    Filed: November 17, 2015
    Date of Patent: July 17, 2018
    Assignee: United Arab Emirates University
    Inventors: Rashad Ramzan, Omar Farooq Sidiqui, Azam Beg
  • Patent number: 9979066
    Abstract: A feed line in the form of a trip late line that runs from a waveguide/triplate-line converter coupled to a radio to a plurality of patch antennas in a cluster pattern. The width and length of a section of said feed line between the waveguide/triplate-line converter and the branch point nearest thereto are set such that the impedance of said section directly matches the parallel combination of the impedances of branches beyond said branch point and the loss in said section is kept to or below a predetermined upper limit.
    Type: Grant
    Filed: May 20, 2014
    Date of Patent: May 22, 2018
    Assignee: JAPAN RADIO CO., LTD.
    Inventors: Keiichi Natsuhara, Katsuyoshi Ishida, Kazuaki Yoshida, Kiyomi Okawa, Hiroshi Itoh, Takeshi Oga, Kazufumi Igarashi
  • Patent number: 9929462
    Abstract: A directional antenna has a body made of a stack of layers of dielectric panels. A radiating plate is recessed in the top panel of the stack. A grounding plate is attached to the bottom panel of the stack. A feed wire attaches to the radiating plate to feed a signal to the radiating plate. A grounding conductor attaches to the grounding plate for ground. In at least one embodiment the internal feed wire of a coaxial connector provides the feed wire and the external chassis of the coaxial connector provides the grounding conductor.
    Type: Grant
    Filed: June 11, 2012
    Date of Patent: March 27, 2018
    Inventor: Xizhong Long
  • Patent number: 9881860
    Abstract: To allow a metal film to have a sufficient thickness around a bottom surface of a non-through hole and prevent the metal film from being peeled from a substrate surface, a method for producing a waveguide substrate includes forming a first metal film on (i) a first main surface of a substrate, at which first main surface a non-through hole opens, and on (ii) an inner wall of the non-through hole, forming resist on a first main surface side of the substrate in such a manner that the resist blocks the opening of the non-through hole, removing a first portion of the first metal film which first portion is on the first main surface, removing the resist, and forming a second metal film on the first main surface of the substrate in a state where the first metal film is present on the inner wall of the non-through hole.
    Type: Grant
    Filed: June 10, 2016
    Date of Patent: January 30, 2018
    Assignee: FUJIKURA LTD.
    Inventor: Kan Asahi
  • Patent number: 9871500
    Abstract: A multilayer electronic component includes a stack and a balun. The stack includes a plurality of stacked dielectric layers and conductor layers. The balun is formed using the stack. The balun includes an unbalanced transmission line and first to fourth balanced transmission lines. The unbalanced transmission line includes a first line portion and a second line portion connected in series. The first and second balanced transmission lines are configured to be electromagnetically coupled to the first line portion. The third and fourth balanced transmission lines are configured to be electromagnetically coupled to the second line portion.
    Type: Grant
    Filed: March 28, 2016
    Date of Patent: January 16, 2018
    Assignee: TDK CORPORATION
    Inventors: Masanori Tsutsumi, Kazuhiro Tsukamoto, Manabu Kitami, Toshiyuki Takami, Shohei Kusumoto, Noriyuki Hirabayashi
  • Patent number: 9831539
    Abstract: A coaxial waveguide conversion device according to the present invention includes a first member; a second member provided so as to be opposed to the first member; and a conductor plate provided so as to be sandwiched between the first member and the second member. A waveguide is formed in the first member and the second member to a depth that penetrates the first member and does not penetrate the second member. The conductor plate includes an opening having a shape corresponding to a shape of an aperture plane of the waveguide; a conductor surface portion provided around the opening; an antenna portion; a waveguide short-circuit portion connecting the antenna portion with the conductor surface portion; a coaxial wiring portion provided at one end of the antenna portion; and a coaxial line short-circuit portion connecting another end of the antenna portion with the conductor surface portion.
    Type: Grant
    Filed: October 3, 2014
    Date of Patent: November 28, 2017
    Assignee: NEC Corporation
    Inventors: Norihisa Shiroyama, Kiyotake Sasaki, Sumio Ueda, Takahiro Miyamoto
  • Patent number: 9825349
    Abstract: A system is provided for combining multiple solid-state amplifiers using a radial combiner/divider. The system includes a coaxial input port, a coaxial output port, a first plurality of N waveguides radially disposed around a first transition, a second plurality of N waveguides radially disposed around a second transition, and a plurality of N amplifiers. A first end of each of the first plurality of waveguides is operatively connected to the coaxial input port via the first transition. A first end of each of the second plurality of waveguides is operatively connected to the coaxial output port via the second transition. A first port of each of the plurality of amplifiers is connected to a second end of one of the first plurality of waveguides and a second port of each of the plurality of amplifiers is connected to a second end of one of the second plurality of waveguides.
    Type: Grant
    Filed: June 15, 2016
    Date of Patent: November 21, 2017
    Assignee: The United States of America as represented by Secretary of the Navy
    Inventors: Jia-Chi S. Chieh, Aaron Clawson, Michael Civerolo
  • Patent number: 9819067
    Abstract: A planar-transmission-line-to-waveguide adapter is provided, to reduce limitations on bandwidth expansion. The planar-transmission-line-to-waveguide adapter includes a planar transmission line structure includes at least a planar transmission line, a dielectric substrate, and a metal ground having a coupling gap. a gradient waveguide structure includes m dielectric waveguides with gradient sizes, and any dielectric waveguide is surrounded by metal via holes in a dielectric substrate, where m is a positive integer not less than 2. a1st dielectric waveguide in the m dielectric waveguides with gradient sizes is coupled with the coupling gap in the planar transmission line structure. Adjacent dielectric waveguides are connected by using a metal ground, and a radiation patch is disposed between the adjacent dielectric waveguides. A metal ground and a radiation patch are disposed on a surface on which an mth dielectric waveguide comes into contact with a standard waveguide.
    Type: Grant
    Filed: August 12, 2016
    Date of Patent: November 14, 2017
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Bo Yang, Hua Cai, Guolong Huang
  • Patent number: 9812765
    Abstract: An embodiment of the present invention provides an antenna assembly and a mobile terminal. The antenna assembly includes an antenna body provided with a grounding plate and a feeding portion. The antenna body includes a radiating portion provided with an unclosed loop structure. The antenna assembly further has a metal frame. The metal frame is provided with a closed first loop portion surrounding an outer periphery of the radiating portion. An annular gap is formed between the first loop portion and the radiating portion. The antenna assembly of the present disclosure improves the product performance and makes the product appearance more aesthetic.
    Type: Grant
    Filed: March 18, 2014
    Date of Patent: November 7, 2017
    Assignee: AAC TECHNOLOGIES PTE. LTD.
    Inventors: Ng Guan Hong, Tay Yew Siow
  • Patent number: 9812754
    Abstract: An electronic device may include a wireless circuit, and a coaxial cable device having an S-shaped balun segment coupled to the wireless circuit, and an antenna segment coupled to the S-shaped balun segment. The S-shaped balun segment may include a first inner conductor segment, and a first outer conductor segment surrounding the first inner conductor segment. The antenna segment may include a second inner conductor segment coupled to the first inner conductor segment, and a second outer conductor segment surrounding the second inner conductor segment and coupled to the first outer conductor segment, the second inner conductor segment extending from the second outer conductor segment.
    Type: Grant
    Filed: February 27, 2015
    Date of Patent: November 7, 2017
    Assignee: HARRIS CORPORATION
    Inventor: Francis Eugene Parsche
  • Patent number: 9780728
    Abstract: A FET based double balanced mixer (DBM) that exhibits good conversion gain and IIP3 values and provides improved linearity and wide bandwidth. In one embodiment, a first balun is configured to receive a local oscillator (LO) signal and generate two balanced LO signals that are coupled to two corresponding opposing nodes of a four-node FET ring. A second balun is configured to pass an RF signal on the unbalanced side. The FET ring includes at least four FETs connected as branches of a ring, with the source of each FET connected to the drain of a next FET in the ring. Each FET is preferably fabricated as, or configured as, a low threshold voltage device having its gate connected to its drain, which causes the FET to operate as a diode, but with the unique characteristic of having close to a zero turn-on voltage.
    Type: Grant
    Filed: March 29, 2016
    Date of Patent: October 3, 2017
    Assignee: Peregrine Semiconductor Corporation
    Inventor: Daoud Salameh
  • Patent number: 9716304
    Abstract: A balun includes: a balanced port; an unbalanced port; and a double-y junction portion between the balanced port and the unbalanced port, the double-y junction portion including: a balanced y junction portion having first and second balanced stubs; and an unbalanced y junction portion having first and second unbalanced stubs, wherein at least one of the first balanced stub, the second balanced stub, the first unbalanced stub, and the second unbalanced stub includes a switch.
    Type: Grant
    Filed: September 18, 2015
    Date of Patent: July 25, 2017
    Assignee: RAYTHEON COMPANY
    Inventor: Mikel J. White
  • Patent number: 9692135
    Abstract: An assembly for confining electromagnetic radiation in a waveguide. The assembly comprises a waveguide, comprising walls surrounding a cavity and an aperture in the walls that opens to the cavity, and a substrate assembly disposed in the aperture. The substrate assembly comprises a substrate comprising an antenna, wherein the antenna is located within the cavity and is configured for transmission of radiation within the cavity. The substrate assembly comprises an integrated circuit (IC) electrically connected to the substrate, where the IC comprises semi-conductor components and a ground plane on one side of the IC. The ground plane is located between the IC semi-conductor components and the antenna. The ground plane is located across the aperture to reduce the area of the aperture and to reflect some of the radiation directed to the aperture back into the cavity.
    Type: Grant
    Filed: December 10, 2015
    Date of Patent: June 27, 2017
    Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: Danny Elad, Noam Kaminski, Ofer Markish
  • Patent number: 9655230
    Abstract: The present invention is related to an electromagnetic noise filter device and an equivalent filter circuit thereof. The filter device comprises a substrate, a transmission line and a ground plane having slotted ground structure. The transmission line is configured on the top surface of the substrate, and the grounding plane is configured on the bottom surface of the substrate. At least one pair of impedance elements are configured within the slotted ground structure. The transmission line can be electromagnetic coupled to the slotted ground structure and the impedance elements so as to form an equivalent filter circuit. Thereby, the electromagnetic noises on at least one specific frequency may be absorbed by the impedance elements of the filter device so as to avoid the electromagnetic reflection induced by the electromagnetic noise and interfering the signal transmitted on the transmission line.
    Type: Grant
    Filed: December 3, 2014
    Date of Patent: May 16, 2017
    Assignee: National Taiwan University
    Inventors: Tzong-Lin Wu, Chih-Ying Hsiao, Chien-Hua Hung
  • Patent number: 9653820
    Abstract: A system and method uses an active manifold for an antenna array. The manifold can be assembled by a method including providing a first set of cards including a first set of antenna elements and a corresponding number of integrated circuit based time delay units or phase shifters for the first set of antenna elements. The first set of antenna elements is associated with a row of the antenna array. The method also includes providing a second set of cards including a second set of antenna elements and a corresponding number of integrated circuit based time delay units or phase shifters for the second set of antenna elements. The second set of antenna elements is associated with a column of the antenna array.
    Type: Grant
    Filed: June 9, 2014
    Date of Patent: May 16, 2017
    Assignee: Rockwell Collins, Inc.
    Inventors: James B. West, Michael L. Hageman, Russell D. Wyse
  • Patent number: 9647313
    Abstract: The invention relates to a surface mount microwave system, comprising a multilayer arrangement comprising a first conductive layer, a second conductive layer and a dielectric layer, wherein the first conductive layer is arranged on the dielectric layer, and wherein the dielectric layer is arranged on the second conductive layer, wherein the first conductive layer comprises a microwave circuit and wherein the second conductive layer forms a reference potential layer, a hollow microwave waveguide being at least partly formed in the second conductive layer, and a microwave transition structure for electromagnetically coupling the first conductive layer with the hollow microwave waveguide. According to some implementation forms, a reflector on a cover covering the multilayer arrangement may be avoided.
    Type: Grant
    Filed: July 18, 2014
    Date of Patent: May 9, 2017
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Franco Marconi, Fabio Morgia, Haiou Gou, Stefano Verzura, Guoyu Su
  • Patent number: 9634439
    Abstract: The invention relates to contactless plug connectors and contactless plug connector systems for electromagnetically connecting a corresponding mating plug connector. In order to allow for an electromagnetic connection, the invention suggest providing at least one input terminal for inputting a baseband input signal; an antenna element arranged at the mating end of the contactless plug connector; and a transmitting circuit for modulating the inputted baseband input signal on a predetermined carrier frequency and for transmitting the modulated baseband input signal via the antenna element as a radio wave with the predetermined carrier frequency. In particular, the contactless plug connector and contactless plug connector system include an electromagnetic shielding element arranged to surround the transmitting circuit and the antenna element with a rim portion forming an opening at the mating end of the contactless plug connector.
    Type: Grant
    Filed: October 9, 2012
    Date of Patent: April 25, 2017
    Assignees: TE Connectivity Nederland B.V., TE Connectivity Germany GmbH
    Inventors: Dirk-Jan Riezebos, Bert Bergner, Gied Habraken