Having Long Line Elements Patents (Class 333/26)
  • Patent number: 12015388
    Abstract: Techniques are provided for a broadband microwave/millimeter-wave balanced-to-unbalanced transformer (balun). A balun implementing the techniques according to an embodiment includes a first impedance matching network configured to reduce insertion and return losses of a single-ended signal at a first port of the balun. The balun also includes a first planar bifilar coupled transmission line coupled to the first impedance matching network and configured to transform the single-ended signal into a differential signal. The balun further includes a second planar bifilar coupled transmission line coupled to the first bifilar coupled transmission line and configured to compensate for amplitude and phase imbalance induced on the differential signal by the first bifilar coupled transmission line.
    Type: Grant
    Filed: May 28, 2021
    Date of Patent: June 18, 2024
    Assignee: BAE Systems Information and Electronic Systems Integration Inc.
    Inventor: Mark D. Hickle
  • Patent number: 11877412
    Abstract: Provided is an electronic control device capable of suppressing failure of an electronic component due to static electricity. The electronic control device 100 includes a substrate 10, an electronic component 1 mounted on the substrate 10, an insulating case 20 that holds the substrate 10, a conductive cover 30 that covers the insulating case 20, a conductive base 40 that holds the insulating case 20, and a conductive fixture 21 that fixes the insulating case 20 to the conductive base 40. A distance L1 between the conductive cover 30 and the conductive fixture 21 is equal to or less than a distance L2 between the conductive cover 30 and a conductive terminal 1a of the electronic component 1.
    Type: Grant
    Filed: July 10, 2020
    Date of Patent: January 16, 2024
    Assignee: Hitachi Astemo, Ltd.
    Inventors: Yoshio Kawai, Ryo Akiba
  • Patent number: 11843156
    Abstract: An aspect of the present invention simplifies a method of manufacturing a mode converter. A mode converter (10) includes: a post-wall waveguide (PW); a microstrip line (MS); and a blind via (BV) configured to carry out conversion between a waveguide mode of the post-wall waveguide (PW) and a waveguide mode of the microstrip line (MS), the blind via (BV) having a shape approximated by a shape obtained by combining a plurality of cylinders (C1 to C4), each of the plurality of cylinders (C1 to C4) having a diameter equal to the diameter of through vias 14i.
    Type: Grant
    Filed: April 28, 2020
    Date of Patent: December 12, 2023
    Assignee: FUJIKURA LTD.
    Inventor: Yusuke Uemichi
  • Patent number: 11804803
    Abstract: A system-on-chip may include an inductor-capacitor oscillator monolithically integrated into the system-on-chip The inductor-capacitor oscillator may be configured to improve frequency stability and reduce noise when compared to a resistor-capacitor oscillator. Methods of making integrated oscillators may involve forming an inductor at least partially while forming a BEOL structure on a substrate. A capacitor supported on and/or embedded within the semiconductor material of the substrate may be formed before or while forming the BEOL structure. The inductor may be connected to the capacitor in parallel at least partially utilizing the BEOL structure to form an integrated inductor-capacitor oscillator.
    Type: Grant
    Filed: April 1, 2020
    Date of Patent: October 31, 2023
    Assignee: Microchip Technology Incorporated
    Inventor: Yaojian Leng
  • Patent number: 11757166
    Abstract: Waveguide assemblies are described that utilize a surface-mount waveguide for vertical transitions of a printed circuit board (PCB). The surface-mount waveguide enables low transmission-loss (e.g., increased return-loss bandwidth) by utilizing a waveguide cavity positioned over a plated slot to efficiently transfer electromagnetic energy from one side of the PCB to another side. The waveguide cavity is designed to excite two resonant peaks of the EM energy to reduce a return-loss of power and increase power delivered to an antenna while supporting a high bandwidth of EM energy. Furthermore, the surface-mount waveguide does not require precise fabrication often required for vertical transitions, allowing the surface-mount waveguide to be compatible with low-cost PCB materials (e.g., hybrid PCB stack-ups).
    Type: Grant
    Filed: January 22, 2021
    Date of Patent: September 12, 2023
    Assignee: Aptiv Technologies Limited
    Inventors: Biswadeep Das Gupta, Sara J. Cavazos, Kurt E. Gilbertson
  • Patent number: 11716826
    Abstract: Embodiments may relate an electronic device that includes a first platform and a second platform coupled with a chassis. The platforms may include respective microelectronic packages. The electronic device may further include a waveguide coupled to the first platform and the second platform such that their respective microelectronic packages are communicatively coupled by the waveguide. Other embodiments may be described or claimed.
    Type: Grant
    Filed: May 2, 2019
    Date of Patent: August 1, 2023
    Assignee: Intel Corporation
    Inventors: Telesphor Kamgaing, Johanna M. Swan, Georgios Dogiamis, Henning Braunisch, Adel A. Elsherbini, Aleksandar Aleksov, Richard Dischler
  • Patent number: 11670857
    Abstract: An antenna apparatus includes a first patch antenna pattern comprising a through-hole, a second patch antenna pattern disposed above the first patch antenna pattern and spaced apart from the first patch antenna pattern, a first feed via electrically connected to the first patch antenna pattern, a second feed via penetrating through the through-hole of the first patch antenna pattern, and a feed pattern disposed between the first patch antenna pattern and the second patch antenna pattern, and having one end connected to the second feed via, and another end connected to the second patch antenna pattern at a point closer to an edge of the second patch antenna pattern than the second feed.
    Type: Grant
    Filed: September 13, 2021
    Date of Patent: June 6, 2023
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Won Cheol Lee, Nam Ki Kim, Jae Min Keum, Jeong Ki Ryoo
  • Patent number: 11515646
    Abstract: A coupler comprising a silicon substrate with one or more double slot radiators configured to transmit or receive an RF signal, a slot balun circuit configured to isolate the RF signal, and a grounded coplanar waveguide configured to propagate the RF signal in a horizontal direction. The coupler can be included on an integrated chip with a second coupler and the chip can be positioned over two waveguides such that each coupler is positioned within the center of each waveguide aperture.
    Type: Grant
    Filed: October 20, 2020
    Date of Patent: November 29, 2022
    Assignee: Massachusetts Institute of Technology
    Inventors: Ruonan Han, Cheng Wang
  • Patent number: 11482921
    Abstract: Systems and methods are described for active harmonics cancellation. A wireless charging apparatus includes a wireless-power transfer circuit comprising a wireless-power transfer coil configured to generate or couple to a magnetic field to transfer or receive power and a plurality of tuning capacitors electrically coupled to the wireless-power transfer coil. The apparatus also includes a power converter circuit electrically coupled to the wireless-power transfer circuit. Additionally, the apparatus includes a signal generation circuit different from the power converter circuit and electrically coupled to one or more nodes between capacitors of the plurality of tuning capacitors. The signal generation circuit is configured to generate and inject a signal into the wireless-power transfer circuit at the nodes between the capacitors. The signal generation circuit includes a rejection filter tuned to an operating frequency of the wireless-power transfer coil.
    Type: Grant
    Filed: May 3, 2019
    Date of Patent: October 25, 2022
    Assignee: WiTricity Corporation
    Inventors: Marcel Fischer, Mircea-Florian Vancu, Hans Peter Widmer, Prasanth Venugopal
  • Patent number: 11417938
    Abstract: In described examples, an integrated waveguide transition includes a substrate with a waveguide side and an opposing waveguide termination side. A first layer of metal covers a portion of the waveguide side, a second layer of metal is separated from the first layer of metal by a first layer of dielectric, and a third layer of metal covers a portion of the waveguide termination side and is separated from the second layer of metal by a second layer of dielectric. A substrate waveguide perpendicular to a plane of the substrate extends from the waveguide side to the waveguide termination side; and a length and a width of the substrate waveguide is defined by a fence of ground-stitching vias that short the first layer of metal and the second layer of metal to a plate of the third layer of metal that forms a back short.
    Type: Grant
    Filed: September 3, 2019
    Date of Patent: August 16, 2022
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventor: Meysam Moallem
  • Patent number: 11411292
    Abstract: A waveguide device includes a first electrical conductor including a first electrically conductive surface extending along first and second directions, a second electrical conductor including a second electrically conductive surface opposing the first electrically conductive surface, a waveguide located between the first electrical conductor and the second electrical conductor and extending along the first direction, the waveguide including an electrically-conductive waveguide surface opposing the first electrically conductive surface, and a plurality of electrically-conductive rod rows located on opposite sides of the waveguide, each rod row including a plurality of electrically conductive rods arranged along the first direction. At least one of the first electrical conductor and the second electrical conductor includes at least one hole.
    Type: Grant
    Filed: January 15, 2020
    Date of Patent: August 9, 2022
    Assignee: WGR CO., LTD.
    Inventor: Hideki Kirino
  • Patent number: 11329697
    Abstract: The present invention broadly relates to a multi-layer electromagnetic coupler arrangement, for encoding an RFID tag, suitable for being used in a printing device. The coupler arrangement employs a differential transmission line loop, as a coupling element arranged on a top surface layer of the multi-layer arrangement, which is arranged close to a metallic ground plane layer for shielding on the side opposite the top surface. Coupling is achieved by inductive coupling in the reactive near field and based on the fact that each RFID tag comprises a current loop, itself. The differential property of the transmission line loop is achieved by feeding the terminals of the loop with signal parts having a phase shift of 180° with respect to each other. The feeding components are arranged on the opposite side of the ground plane with respect to the top surface layer comprising the current loop.
    Type: Grant
    Filed: November 27, 2015
    Date of Patent: May 10, 2022
    Assignee: SATO HOLDINGS KABUSHIKI KAISHA
    Inventors: Markus Frank, Mats Hedberg
  • Patent number: 11316273
    Abstract: A waveguide microstrip line converter includes a waveguide, a dielectric substrate, a ground conductor including a slot, and a line conductor. The line conductor includes a first section that is a microstrip line having a first line width, a conversion unit that is a second section positioned immediately above the slot and having a second line width greater than the first line width, and a third section extending from the second section in a first direction and performing impedance matching between the first section and the second section. One of the opposite ends of the third section in the first direction is connected to the second section. The first section extends in a second direction perpendicular to the first direction continuously from the other end of the opposite ends of the third section.
    Type: Grant
    Filed: August 30, 2018
    Date of Patent: April 26, 2022
    Assignee: Mitsubishi Electric Corporation
    Inventors: Takashi Maruyama, Shigeo Udagawa
  • Patent number: 11303004
    Abstract: A microstrip-to-waveguide transition includes a substrate and a waveguide. The substrate has a metal layer, a ground layer and a dielectric layer disposed between the metal layer and a ground layer. The substrate includes a microstrip line impedance transformer and a substrate integrated waveguide that is electromagnetically coupled to the microstrip line impedance transformer. The substrate integrated waveguide has a 90 degree substrate integrated waveguide bend section at an end portion thereof. The waveguide is arranged perpendicularly relative to the substrate. The waveguide is electromagnetically coupled to the substrate integrated waveguide at the 90 degree substrate integrated waveguide bend section. The microstrip-to-waveguide transition is free of a back-short at a location corresponding to the 90 degree substrate integrated waveguide bend section.
    Type: Grant
    Filed: June 10, 2019
    Date of Patent: April 12, 2022
    Assignee: HUGHES NETWORK SYSTEMS, LLC
    Inventors: Yu Yung, Rajesh Joshi, George Eapen, Guo Chen, Kumud Patel
  • Patent number: 11303003
    Abstract: A waveguide microstrip line converter includes a dielectric substrate, a ground conductor, and a line conductor. The ground conductor is provided on a first surface of the dielectric substrate and is joined to an open end that is an end portion of the waveguide. The slot is formed in a region surrounded by an opening edge portion of the open end of the ground conductor. The line conductor is provided on a second surface of the dielectric substrate. The line conductor includes first portions that are the microstrip lines, a second portion located just above the slot, and third portions responsible for impedance matching between the first portions and the second portion. The third portions each include an impedance transforming unit that is a portion having a wider line width than the first portions.
    Type: Grant
    Filed: June 30, 2017
    Date of Patent: April 12, 2022
    Assignee: Mitsubishi Electric Corporation
    Inventors: Takashi Maruyama, Shigeo Udagawa
  • Patent number: 11258154
    Abstract: An apparatus includes a substrate containing a cavity and a dielectric structure covering at least a portion of the cavity. The cavity is hermetically sealed. The apparatus also may include a launch structure formed on the dielectric structure and outside the hermetically sealed cavity. The launch structure is configured to cause radio frequency (RF) energy flowing in a first direction to enter the hermetically sealed cavity through the dielectric structure in a direction orthogonal to the first direction.
    Type: Grant
    Filed: December 2, 2019
    Date of Patent: February 22, 2022
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Adam Joseph Fruehling, Benjamin Stassen Cook, Juan Alejandro Herbsommer, Swaminathan Sankaran
  • Patent number: 11251512
    Abstract: Embodiments of the invention include an active mm-wave interconnect. In an embodiment, the active mm-wave interconnect includes a dielectric waveguide that is coupled to a first connector and a second connector. According to an embodiment, each of the first and second connectors may include a mm-wave engine. In an embodiment, the mm-wave engines may include a power management die, a modulator die, a demodulator die, a mm-wave transmitter die, and a mm-wave receiver die. Additional embodiments may include connectors that interface with predefined interfaces, such as small form-factor pluggables (SFP), quad small form-factor pluggables (QSFP), or octal small form-factor pluggables (OSFP). Accordingly, embodiments of the invention allow for plug and play functionality with existing servers and other high performance computing systems.
    Type: Grant
    Filed: January 5, 2017
    Date of Patent: February 15, 2022
    Assignee: Intel Corporation
    Inventors: Georgios Dogiamis, Sasha Oster, Telesphor Kamgaing
  • Patent number: 11227825
    Abstract: Embodiments of the invention include an electrical package and methods of forming the package. In one embodiment, a transformer may be formed in the electrical package. The transformer may include a first conductive loop that is formed over a first dielectric layer. A thin dielectric spacer material may be used to separate the first conductive loop from a second conductive loop that is formed in the package. Additional embodiments of the invention include forming a capacitor formed in the electrical package. For example, the capacitor may include a first capacitor plate that is formed over a first dielectric layer. A thin dielectric spacer material may be used to separate the first capacitor plate form a second capacitor plate that is formed in the package. The thin dielectric spacer material in the transformer and capacitor allow for increased coupling factors and capacitance density in electrical components.
    Type: Grant
    Filed: December 21, 2015
    Date of Patent: January 18, 2022
    Assignee: Intel Corporation
    Inventors: Adel A. Elsherbini, Mathew J. Manusharow, Krishna Bharath, William J. Lambert, Robert L. Sankman, Aleksandar Aleksov, Brandon M. Rawlings, Feras Eid, Javier Soto Gonzalez, Meizi Jiao, Suddhasattwa Nad, Telesphor Kamgaing
  • Patent number: 11183751
    Abstract: An illustrative example transmission device, which is useful for an automated vehicle, includes a substrate having a metal layer near one surface of the substrate and a waveguide area. The metal layer includes a slot that at least partially overlaps the waveguide area. A source of radiation includes a first radiation output situated on a first side of the slot and a second radiation output situated on a second, opposite side of the slot.
    Type: Grant
    Filed: September 20, 2017
    Date of Patent: November 23, 2021
    Assignee: APTIV TECHNOLOGIES LIMITED
    Inventors: George J. Purden, Shawn Shi, David W. Zimmerman
  • Patent number: 11145596
    Abstract: A package structure and method of forming the same are provided. The package structure includes a die, a redistribution structure and a conductive pad. The redistribution structure is disposed on and electrically connected to the die. The redistribution structure includes a dielectric film, a conductive line, an adhesive layer and a conductive via. The dielectric film has a first surface and a second surface opposite to each other. The conductive line and the adhesive layer are located between the first surface of the dielectric film and the die. The conductive line is electrically connected to the die, and the adhesive layer laterally surrounds the conductive line. The conductive via penetrates through the dielectric film and the adhesive layer to electrically connect to the conductive line. The conductive pad is electrically connected to the die through the redistribution structure.
    Type: Grant
    Filed: December 17, 2019
    Date of Patent: October 12, 2021
    Assignee: Winbond Electronics Corp.
    Inventor: Yen-Jui Chu
  • Patent number: 11101536
    Abstract: A transition device includes a first metal layer, a signaling metal line, an excitation metal piece, a first dielectric layer, a plurality of conductive via elements, a reflector, and a waveguide. The first metal layer has a notch. The notch extends to the interior of the first metal layer, forming a first slot region. The signaling metal line is disposed in the notch. The excitation metal piece is disposed in the first slot region and is coupled to the signaling metal line. The first dielectric layer has a pair of first openings. The first dielectric layer includes a bridging portion disposed between the first openings. The bridging portion is configured to carry the excitation metal piece. The conductive via elements penetrate the first dielectric layer and are coupled to the first metal layer. The conductive via elements at least partially surround the first slot region.
    Type: Grant
    Filed: November 13, 2019
    Date of Patent: August 24, 2021
    Assignee: WISTRON NEWEB CORP.
    Inventors: An-Ting Hsiao, Shun-Chung Kuo, Cheng-Geng Jan
  • Patent number: 11095013
    Abstract: A waveguide low profile slide-screw impedance tuner, for high tuning range (GAMMA) and seamless on-wafer integration, uses spring-loaded control of gold-plated alumina (Al2O3) tuning probe, controlling amplitude and phase of the reflection factor using miniature high precision piezo-electric actuators. This ensures the highest possible passive reflection factor GAMMA at THz frequencies. The tuner is integrated on appropriately modified commercially available THz waveguide wafer probes.
    Type: Grant
    Filed: April 16, 2020
    Date of Patent: August 17, 2021
    Inventor: Christos Tsironis
  • Patent number: 11095369
    Abstract: Disclosed is a device communicably coupled to a power transmission line and capable of launching transverse electromagnetic waves onto the transmission line. The waves propagate data received from a data source connected to the device through a center conductor surrounded by a shield conductor. The device may include a reflector and a coupler adjacent to each other, the reflector electrically connected to the shield conductor and the coupler electrically connected to the center conductor at an unshielded connection point, wherein time-varying E-fields between the reflector and coupler are caused by the data received from the data source, and induce a transverse magnetic wave that propagates longitudinally along the surface of the transmission line.
    Type: Grant
    Filed: March 9, 2020
    Date of Patent: August 17, 2021
    Assignee: ARRIS Enterprises LLC
    Inventors: David B. Bowler, Shaoting Gu, Xinfa Ma, Clarke V. Greene, David Grubb, III, Samuel Francois, Lawrence M. Hrivnak, Bruce C. Pratt, Theodore A. Colarusso, Thomas F. Kister, Robert Noonan, Vincent T. Lucarini, David F. Hubbell
  • Patent number: 11088465
    Abstract: A unit cell of for a phased array antenna includes a base plate, a first dielectric layer projecting from the base plate, and a first conductive layer disposed on a side of the first dielectric layer, the first conductive layer includes a ground pillar, a first ground member spaced apart from a first edge of the ground pillar, and a first signal member disposed between the ground pillar and the first ground member, wherein: the first signal member is electrically insulated from the ground pillar and the first ground member, and an edge of the first signal member is configured to capacitively couple to the first edge of the ground pillar.
    Type: Grant
    Filed: August 7, 2018
    Date of Patent: August 10, 2021
    Assignees: The MITRE Corporation, The Government of the United States of America, as Represented by the Secretary of the Navy
    Inventors: Wajih Elsallal, Jamie Hood, Al Locker, Rick W. Kindt
  • Patent number: 11069949
    Abstract: A hollow-waveguide-to-planar-waveguide transition circuit includes: strip conductors formed on a first main surface of a dielectric substrate; a ground conductor formed on the back side, facing the strip conductors; a slot formed in the ground conductor; and a coupling conductor formed at a position to be electrically coupled with the strip conductors. The coupling conductor has: a main body portion electrically coupled with the strip conductors; and protruding portions protruding from the main body portion. The protruding portions are formed so as to face an end portion of the slot.
    Type: Grant
    Filed: July 5, 2016
    Date of Patent: July 20, 2021
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Hiromasa Nakajima, Akimichi Hirota, Naofumi Yoneda, Takeshi Oshima
  • Patent number: 11069984
    Abstract: A radiating element for a phased array antenna includes a first dielectric layer, a first conductive layer disposed on a first side of the first dielectric layer, the first conductive layer including a first member comprising a first stem and a first impedance matching portion, wherein the first impedance matching portion comprises at least one projecting portion projecting from a first edge of the first impedance matching portion, and a second member spaced apart from the first member, the second member including a second impedance matching portion, wherein the second impedance matching portion comprises at least one other projecting portion projecting toward the first edge of the first impedance matching portion.
    Type: Grant
    Filed: August 7, 2018
    Date of Patent: July 20, 2021
    Assignees: The MITRE Corporation, The Government of the United States of America, as Represented by the Secretary of the Navy
    Inventors: Wajih Elsallal, Jamie Hood, Al Locker, Rick W. Kindt
  • Patent number: 11056759
    Abstract: This invention refers to hybrid coupler with the sum port and difference port located on the same side. The hybrid coupler can be efficiently integrated into the high frequency circuit with its simple structure, using common material. To achieve this purpose, the hybrid coupler in this invention consists of the following parts: sum port, difference port, output port 1, output port 2, connection line 1, connection line 2 and microstrip line.
    Type: Grant
    Filed: October 30, 2019
    Date of Patent: July 6, 2021
    Assignee: VIETTEL GROUP
    Inventors: Tat Thang Nguyen, Ngoc Viet Tung Dinh, Hoang Viet Tran, Thi Huong Ngo, Dinh Toai Pham
  • Patent number: 11050130
    Abstract: Provided is a dielectric waveguide having a good reflection characteristic also in a band on a low frequency side of a center frequency of a given operation band. A dielectric waveguide (1) includes: a waveguide region (12) which is defined by a first wide wall (21), a second wide wall (22), a first narrow wall (23), a second narrow wall (24), and a short wall (25) and which is filled with a dielectric; and a mode conversion section (31) which includes a columnar conductor (34) extending from a surface of the waveguide region (12) toward an inside of the waveguide region (12). A width (W2) of the short wall (25) is configured to be greater than a waveguide width (Wi) at a location (x=x1) at which the columnar conductor (34) is provided.
    Type: Grant
    Filed: October 26, 2018
    Date of Patent: June 29, 2021
    Assignee: FUJIKURA LTD.
    Inventor: Yusuke Uemichi
  • Patent number: 11045069
    Abstract: A flexible waveguide includes an inner dielectric, and a flexible external conductor disposed in a position covering an outer periphery of the dielectric, the flexible waveguide conducting a radio wave in a frequency band equal to or longer than a millimeter wave or a submillimeter wave near 60 GHz or more. The external conductor includes a metal layer, the metal layer has a shape displacement structure, a shape of an inner periphery side section of which faces the inner dielectric and is cyclic in the waveguide longitudinal direction, the shape displacement structure being a cyclic structure satisfying ?mr<?ch, where ?mr represents a center wavelength of a main reflection band due to the cyclic structure and ?ch represents a cutoff wavelength in a high-order mode of the waveguide.
    Type: Grant
    Filed: November 1, 2019
    Date of Patent: June 29, 2021
    Assignee: OLYMPUS CORPORATION
    Inventors: Keigo Ito, Tadashi Watanabe
  • Patent number: 10985434
    Abstract: A waveguide assembly which includes an elongated waveguide element (1) and a connector body (2). The connector body (2) is connected to an end of the elongated waveguide element (1) and has a substantially planar bottom surface (24) and an opposing top surface (23). The connector body is made from a single piece of partially metallized dielectric. The connector body has a waveguide coupling element (21) adjacent to the elongated waveguide element (1). The connector body further has an arrangement of electromagnetic band gap elements (27) adjacent to the waveguide coupling element (21).
    Type: Grant
    Filed: January 18, 2018
    Date of Patent: April 20, 2021
    Assignee: HUBER+SUHNER AG
    Inventors: Martin Wagner, Ulf Hügel, Michael Thiel
  • Patent number: 10978771
    Abstract: The present invention discloses a lumped circuit balance converter applied to double-sided parallel lines, comprising a radio frequency transceiver, a balance converter, a filter and a matching network. The filter is connected with the matching network through the balance transmission line. The balance converter comprises a second circuit block, a first circuit block, a third circuit block, a first port, a second port and a third port. A positive polarity of a signal is positioned at the top of the second port and the bottom of the third port. Balance signals are respectively fed to the converter at the top of the second port and the bottom of the third port, and the signals are combined in the first port. The present invention has simple structure and better effect when used, can be easily changed to different required performance, and has good applicability and strong practicability.
    Type: Grant
    Filed: September 11, 2019
    Date of Patent: April 13, 2021
    Assignee: Innovation Sound Technology Co., Ltd.
    Inventors: Shun Ming Yuen, Wai Yin Mung, Ka Ming Wu
  • Patent number: 10957971
    Abstract: Waveguide module assemblies for vehicles, such as radar sensor waveguide feed to waveguide transition assemblies. In some embodiments, an antenna module may comprise an antenna assembly that includes a resonating element and a waveguide component that defines, at least in part, a waveguide configured to guide electromagnetic energy radiating from the resonating element. The resonating element of the antenna assembly may directly feed electromagnetic energy into the waveguide defined by the waveguide component.
    Type: Grant
    Filed: July 23, 2019
    Date of Patent: March 23, 2021
    Assignee: Veoneer US, Inc.
    Inventors: Scott B. Doyle, Angelos Alexanian, Konstantinos Konstantinidis
  • Patent number: 10950369
    Abstract: An improved electrical cable design for high-speed, low loss signal transmission. The improved cable design may be a three-conductor cable having a center conductor, a middle conductor and an outer conductor, where each conductor is separated by a dielectric layer. The electrical cable provides an inverted cable design, in which signal transmission occurs within the middle conductor, the center conductor is used as a return or drain line to ground and the outer conductor is used as a shield. The middle conductor of the electrical cable provides a larger surface area for signal conductance than the center conductor, thereby transmitting signals with significantly less loss (e.g., at least 50% less loss).
    Type: Grant
    Filed: July 20, 2020
    Date of Patent: March 16, 2021
    Assignee: Dell Products L.P.
    Inventors: Sandor Farkas, Bhyrav Mutnury
  • Patent number: 10950928
    Abstract: A line conductor is configured so as to be arranged between a lower surface conductor and an upper surface conductor in parallel with the lower surface conductor in such a way as to extend around the periphery of a hollow cylindrical conductor in a state in which an end is connected to a side surface of the hollow cylindrical conductor and another end is open. As a result, efficient supply of power to a conductive liquid can be performed without disposing a conducting tube having a length of approximately ?/4 at an operating frequency.
    Type: Grant
    Filed: March 24, 2017
    Date of Patent: March 16, 2021
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Shimpei Akimoto, Takashi Yanagi, Yasuhiro Nishioka
  • Patent number: 10951179
    Abstract: An impedance control unit is disclosed. Also disclosed are a balun unit, an electronic device, and a Doherty amplifier, each comprising the impedance control unit. The impedance control unit comprises a pair of re-entrant type coupled lines, and further comprises an electrical short between the intermediate plane and the ground plane arranged locally inside the pair of coupled lines.
    Type: Grant
    Filed: September 12, 2019
    Date of Patent: March 16, 2021
    Assignee: Ampleon Netherlands B.V.
    Inventors: Lei Zhou, John Gajadharsing
  • Patent number: 10896779
    Abstract: The present invention relates to an isolation transformer suitable for use in a modulator for generating high voltage pulses for supply across a high voltage load having a thermionic cathode such as a magnetron, the isolation transformer comprising a primary winding formed from a triaxial cable where the triaxial cable comprises a core conductor surrounded by a dielectric insulator, in turn surrounded by a screening conductor, with an outer insulating jacket.
    Type: Grant
    Filed: March 31, 2016
    Date of Patent: January 19, 2021
    Assignee: TELEDYNE UK LIMITED
    Inventor: John Winslow
  • Patent number: 10872718
    Abstract: A coil component includes a first magnetic body, an insulator stacked on the first magnetic body, a second magnetic body stacked on the insulator, a coil which is disposed in the insulator and which includes at least one coil conductor layer, and an internal magnetic body disposed within the inner circumference of the coil and connected to the first magnetic body and the second magnetic body. In a cross section in a stacking direction, the width of the internal magnetic body increases continuously from the first magnetic body side toward the second magnetic body side. Also, the inner circumferential surface of an end coil conductor layer located closest to the second magnetic body faces the outer circumferential surface of the internal magnetic body and is inclined in the same direction as the outer circumferential surface of the internal magnetic body with respect to the stacking direction.
    Type: Grant
    Filed: July 6, 2018
    Date of Patent: December 22, 2020
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Morihiro Hamano, Keiichi Tsuduki, Kouhei Matsuura, Minoru Matsunaga
  • Patent number: 10862544
    Abstract: According to one embodiment, in a magnetic coupler, a plurality of coils includes a first pattern and a second pattern. The first pattern includes a first winding portion and a second winding portion. The second winding portion is arranged in a first direction to the first winding portion. The second pattern is disposed adjacent to the first pattern along the first plane. The second pattern is arranged at a position corresponding to a boundary between the first winding pattern and the second winding pattern. The second pattern includes a third winding portion and a fourth winding portion. The fourth winding portion is arranged in a second direction to the third winding portion. The second direction is a different direction from the first direction. The fourth winding portion is wound in a reversed direction with the third winding portion.
    Type: Grant
    Filed: February 6, 2019
    Date of Patent: December 8, 2020
    Assignees: Kabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage Corporation
    Inventor: Katsuyuki Ikeuchi
  • Patent number: 10854965
    Abstract: A ground shield is connected to a princted circuit board or antenna card in an antenna unit cell to cover a balun to prevent or inhibit the ability of a differential signal flowing towards or through the balun from coupling with a similar differential signal flowing through an adjacent antenna card in the antenna unit cell. This ground shield may be one of a pair of ground shields on the antenna card. Two ground shield can be positioned on opposing sides of the balun to enhance isolation thereof by shielding the differential signals flowing towards and through the balun from coupling with adjacent differential signals to thereby increase bandwidth performance of the antenna unit cell. The ground shields may be generally or substantially or totally planar so as to be conformal with a substrate or dielectric layer of the antenna card or printed circuit board.
    Type: Grant
    Filed: February 15, 2019
    Date of Patent: December 1, 2020
    Assignee: BAE Systems Information and Electronic Systems Integration Inc.
    Inventors: Matilda Livadaru, Andrew C. Maccabe
  • Patent number: 10854984
    Abstract: A method of manufacturing an integrated radio frequency (RF) module, comprising structurally forming at least one RF waveguide and at least one RF radiator of a metalized ceramic material. The RF waveguide(s) and the RF radiator(s) are connected and operatively coupled with each other. Each of the RF radiator(s) comprises a metalized outer wall and at least one metalized axial ridge extending along an inner surface of the outer wall. The method further comprises sintering the metalized ceramic material to create a monolithic structure comprising the RF waveguide and RF radiator, and operatively coupling RF circuitry to the RF waveguide(s).
    Type: Grant
    Filed: March 10, 2016
    Date of Patent: December 1, 2020
    Assignee: The Boeing Company
    Inventors: Yong U. Kim, Andrew G. Laquer
  • Patent number: 10811752
    Abstract: A waveguide coupler includes a waveguide having a first and a second port, and a slot formed in a broadwall of the waveguide between the first and second ports, the slot centered on the first broadwall. A plurality of shifted waveguide sections are arranged between the first and second ports and extend along a length of the waveguide. A parallel-plate transmission line structure is coupled to the slot, wherein RF signals within one of the waveguide or the parallel-plate transmission line are communicated to the other of the waveguide and the parallel-plate transmission line through the slot.
    Type: Grant
    Filed: March 15, 2019
    Date of Patent: October 20, 2020
    Assignee: ThinKom Solutions, Inc.
    Inventors: Shahrokh Hashemi-Yeganeh, William Milroy
  • Patent number: 10784564
    Abstract: An antenna-integrated radio frequency (RF) module includes a multilayer substrate disposed between an integrated chip (IC) and patch antennas, signal vias, and ground members. The IC is configured to generate RF signals. The signal vias are configured to connect and transmit/receive the RF signals from each of the patch antennas to the IC. The ground members are disposed on an outer surface layer and intermediate surface layers of the multilayer substrate to surround each of the patch antennas and the signal vias.
    Type: Grant
    Filed: November 25, 2019
    Date of Patent: September 22, 2020
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hong In Kim, Thomas A. Kim, Ho Kyung Kang
  • Patent number: 10770774
    Abstract: The present invention relates to a microstrip-waveguide transition for transmission of electromagnetic wave signals. According to one aspect of the invention, there is provided a microstrip-waveguide transition for transmission of electromagnetic wave signals, comprising: a feeding part for providing an electromagnetic wave signal to be transmitted through the waveguide; and a ground part formed at a predetermined interval from the feeding part, wherein the microstrip and the waveguide are coupled alongside each other along a length direction of the waveguide, and wherein a distance between the feeding part and the ground part in a direction perpendicular to the length direction of the waveguide is greater as it is closer to the waveguide.
    Type: Grant
    Filed: September 28, 2018
    Date of Patent: September 8, 2020
    Assignee: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Hyeon Min Bae, Ha Il Song, Joon Yeong Lee, Tae Hoon Yoon, Hyo Sup Won
  • Patent number: 10768035
    Abstract: A radar fill-level measuring device for measuring a fill level of a fill substance in a container using the travel time principle, comprising a circuit board with a sending/receiving system for sending and receiving high-frequency radar waves, wherein the circuit board has at least two openings, a hollow conductor having at least two lateral edge projections, wherein lengths of the at least two projections are greater than the thickness of the circuit board, wherein the at least two projections are led through the at least two openings, so that the at least two projections extend partially out from a second side of the circuit board, a lid, which is secured to parts of the at least two projections, which extend out from the second side of the circuit board, such that the hollow conductor is secured to the circuit board by means of the lid.
    Type: Grant
    Filed: July 26, 2016
    Date of Patent: September 8, 2020
    Assignee: ENDRESS+HAUSER SE+CO.KG
    Inventors: Christian Seiler, Thomas Blodt, Jorg Fuglistaller
  • Patent number: 10756435
    Abstract: An antenna module is described where uniform radiation pattern coverage is provided in the plane of a low profile antenna radiating element. A polarization that is orthogonal to the plane of the low profile antenna radiating element can be achieved for the radiated field. A ground plate aperture is implemented into the antenna ground plate to minimize frequency shift as the antenna is installed on metallic (conductive) and non-metallic (non-conductive) ground planes of varying sizes. This antenna system technique is applicable for use in communication systems such as a local Area network (LAN), cellular communication network, and Machine to Machine (M2M).
    Type: Grant
    Filed: April 18, 2017
    Date of Patent: August 25, 2020
    Assignee: Ethertronics, Inc.
    Inventor: Laurent Desclos
  • Patent number: 10739437
    Abstract: Provided is a frequency selective surface including a conductor plane (101), nine loop slots (102) each formed to be surrounded by the conductor plane (101), and a capacitance component (103) disposed to straddle the loop slots (102) in a width direction, both ends of the capacitance component being connected to the conductor plane (101) at a position near the loop slots (102). The conductor plane (101) and the loop slots (102) each formed to be surrounded by the conductor plane (101) constitute a unit cell (110). The unit cells (110) are two-dimensionally periodically arranged. One or more (four in the case of FIG. 1) capacitance components (103) disposed to straddle the loop slots (102) in the width direction are provided for each loop slot (102). Operating frequencies can be easily changed by adjusting only a component connected to the unit cell, or a part of metallic patterns.
    Type: Grant
    Filed: January 26, 2016
    Date of Patent: August 11, 2020
    Assignee: NEC CORPORATION
    Inventor: Hiroshi Toyao
  • Patent number: 10727806
    Abstract: A balun includes a first LC resonator, a second LC resonator, a third LC resonator, and a fourth LC resonator. The second LC resonator is magnetically coupled with the first LC resonator. The fourth LC resonator is magnetically coupled with the third LC resonator and electrically connected between a third terminal and a fourth terminal in parallel with the second LC resonator. Each of the first LC resonator and the second LC resonator has a resonant frequency that is a first resonant frequency. Each of the third LC resonator and the fourth LC resonator has a resonant frequency that is a second resonant frequency higher than the first resonant frequency.
    Type: Grant
    Filed: August 27, 2019
    Date of Patent: July 28, 2020
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Tetsuo Taniguchi
  • Patent number: 10714251
    Abstract: Antenna structures including two anti-symmetrically wound transformers to compensate for stray radiation. In one example an antenna structure includes a transformer assembly connected between an antenna and first and second balanced signal contacts, the transformer assembly including first and second transformer cores independently positionable in space relative to one another, a pair of primary windings connected to the antenna in parallel with one another, and a pair of balanced secondary windings connected in parallel with one another between the first and second balanced signal contacts.
    Type: Grant
    Filed: April 26, 2018
    Date of Patent: July 14, 2020
    Assignee: RAYTHEON COMPANY
    Inventors: Benjamin P. Dolgin, Thomas Lavedas, Joseph J. Fraundorfer
  • Patent number: 10707549
    Abstract: A radio frequency (RF) assembly that includes a microstrip to waveguide transition is described herein. In one example, the RF assembly can include a substrate, a microstrip, and a waveguide. The substrate can include an antenna that includes an antenna slot. A portion of the microstrip, such as an end of the microstrip, can be disposed within and/or underneath the antenna slot. The microstrip can be embedded within the substrate and can be electrically coupled to the antenna. At least a portion of the waveguide can be disposed over the antenna slot.
    Type: Grant
    Filed: April 10, 2018
    Date of Patent: July 7, 2020
    Assignee: The Boeing Company
    Inventors: John E. Rogers, Corey M. Thacker
  • Patent number: RE49317
    Abstract: Disclosed herein are a transformer and a method of manufacturing the same. The transformer includes: a primary side winding having a loop shape; a secondary side winding formed on the same plane as that of the primary side winding in a remaining section except for at least a section at which it intersects with the primary side winding and having the same loop shape as that of the primary side winding so as to be electromagnetically coupled to the primary side winding; and an intersecting section formed so that the primary side and secondary side windings having the sum of the turn numbers of 3 or more intersect with each other in a two-layer structure, wherein the intersecting section includes at least one point of intermediate node having one side connected in a first layer and the other side connected in a second layer.
    Type: Grant
    Filed: December 13, 2019
    Date of Patent: November 29, 2022
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hyun Paek, Yoo Sam Na, Hyeon Seok Hwang, Gyu Suck Kim, Su Gyeong Kim, Shin Hwan Hwang, Moon Suk Jeong