Flattened Resistance Element Between Flat Layers Patents (Class 338/254)
  • Patent number: 10692633
    Abstract: Resistors and a method of manufacturing resistors are described herein. A resistor includes a resistive element and a plurality of upper heat dissipation elements. The plurality of heat dissipation elements are electrically insulated from one another via a dielectric material and thermally coupled to the resistive element via an adhesive material disposed between each of the plurality of heat dissipation elements and a surface of the resistive element. Electrode layers are provided on a bottom surface of the resistive element. Solderable layers form side surfaces of the resistor and assist in thermally coupling the heat dissipation elements, the resistor and the electrode layers.
    Type: Grant
    Filed: October 7, 2019
    Date of Patent: June 23, 2020
    Assignee: Vishay Dale Electronics, LLC
    Inventors: Todd L. Wyatt, Darin W. Glenn
  • Patent number: 10083781
    Abstract: Resistors and a method of manufacturing resistors are described herein. A resistor includes a resistive element and a plurality of conductive elements. The plurality of conductive elements are electrically insulated from one another via a dielectric material and thermally coupled to the resistive element via an adhesive material disposed between each of the plurality of conductive elements and a surface of the resistive element. The plurality of conductive elements is coupled to the resistive element via conductive layers and solderable layers.
    Type: Grant
    Filed: October 30, 2015
    Date of Patent: September 25, 2018
    Assignee: VISHAY DALE ELECTRONICS, LLC
    Inventors: Clark Smith, Todd Wyatt
  • Patent number: 9916921
    Abstract: A metal strip resistor is provided. The metal strip resistor includes a metal strip forming a resistive element and providing support for the metal strip resistor without use of a separate substrate. There are first and second opposite terminations overlaying the metal strip. There is plating on each of the first and second opposite terminations. There is also an insulating material overlaying the metal strip between the first and second opposite terminations. A method for forming a metal strip resistor wherein a metal strip provides support for the metal strip resistor without use of a separate substrate is provided. The method includes coating an insulative material to the metal strip, applying a lithographic process to form a conductive pattern overlaying the resistive material wherein the conductive pattern includes first and second opposite terminations, electroplating the conductive pattern, and adjusting resistance of the metal strip.
    Type: Grant
    Filed: February 1, 2016
    Date of Patent: March 13, 2018
    Assignee: VISHAY DALE ELECTRONICS, LLC
    Inventors: Clark L. Smith, Thomas L. Bertsch, Todd L. Wyatt, Thomas L. Veik, Rodney Brune
  • Patent number: 8686828
    Abstract: A metal strip resistor is provided. The metal strip resistor includes a metal strip forming a resistive element and providing support for the metal strip resistor without use of a separate substrate. There are first and second opposite terminations overlaying the metal strip. There is plating on each of the first and second opposite terminations. There is also an insulating material overlaying the metal strip between the first and second opposite terminations. A method for forming a metal strip resistor wherein a metal strip provides support for the metal strip resistor without use of a separate substrate is provided. The method includes coating an insulative material to the metal strip, applying a lithographic process to form a conductive pattern overlaying the resistive material wherein the conductive pattern includes first and second opposite terminations, electroplating the conductive pattern, and adjusting resistance of the metal strip.
    Type: Grant
    Filed: August 8, 2012
    Date of Patent: April 1, 2014
    Assignee: Vishay Dale Electronics, Inc.
    Inventors: Clark L. Smith, Thomas L. Bertsch, Todd L. Wyatt, Thomas L. Veik, Rodney Brune
  • Patent number: 8242878
    Abstract: A metal strip resistor is provided. The metal strip resistor includes a metal strip forming a resistive element and providing support for the metal strip resistor without use of a separate substrate. There are first and second opposite terminations overlaying the metal strip. There is plating on each of the first and second opposite terminations. There is also an insulating material overlaying the metal strip between the first and second opposite terminations. A method for forming a metal strip resistor wherein a metal strip provides support for the metal strip resistor without use of a separate substrate is provided. The method includes coating an insulative material to the metal strip, applying a lithographic process to form a conductive pattern overlaying the resistive material wherein the conductive pattern includes first and second opposite terminations, electroplating the conductive pattern, and adjusting resistance of the metal strip.
    Type: Grant
    Filed: September 5, 2008
    Date of Patent: August 14, 2012
    Assignee: Vishay Dale Electronics, Inc.
    Inventors: Clark L. Smith, Thomas L. Bertsch, Todd L. Wyatt, Thomas L. Veik, Rodney Brune
  • Patent number: 8193898
    Abstract: A laminated body and fabrication method thereof, which allow space saving and control of variation in internal layer resistance, are provided. When forming an internal-layer resistive element 7 in a multilayer ceramic substrate 10, the internal-layer resistive element 7 is connected to exterior electrodes (an upper surface electrode 32 and an undersurface electrode 34) via multiple via-electrodes 3a and 3b arranged in parallel, without a pad electrode adopted in the conventional laminated body. Moreover, in a multilayer ceramic substrate having multiple internal-layer resistive elements arranged in a multilayer structure, multiple internal-layer resistive elements are directly connected via multiple via-electrodes arranged in parallel.
    Type: Grant
    Filed: February 28, 2008
    Date of Patent: June 5, 2012
    Assignee: Koa Kabushiki Kaisha
    Inventor: Isao Tonouchi
  • Patent number: 8098127
    Abstract: A resistor assembly for use at microwave frequencies, has a substrate with first and second contacts or metalizations at either end of the substrate. A third contact or metallization is provided on one side of the substrate generally in the middle thereof. First and second resistors, as thin film resistors, are provided on the substrate extending between the first and second contacts and the third, central contact. A third resistor is provided on the other side of the substrate, connecting the first and second contacts, so as to form a delta configuration of three resistors. This then provides a resistor configuration that can be used to implement a three port Wilkinson splitter or combiner.
    Type: Grant
    Filed: June 9, 2008
    Date of Patent: January 17, 2012
    Assignee: ITS Electronics Inc.
    Inventor: Ilya Tchaplia
  • Patent number: 8085551
    Abstract: The present invention is to provide an electronic component where positional accuracy for arranging members constituting a circuit element such as a resistor element and the like is mitigated and corrosion of a terminal electrode caused by sulfur in the atmosphere is reduced.
    Type: Grant
    Filed: March 18, 2008
    Date of Patent: December 27, 2011
    Assignee: KOA Corporation
    Inventors: Seiji Karasawa, Koji Fujimoto
  • Patent number: 8031043
    Abstract: The invention relates to an arrangement comprising a shunt resistor with at least an electrically conductive first connecting leg and an electrically conductive second connecting leg. A resistance area of the shunt resistor is electrically connected to the first connecting leg and to the second connecting leg. The arrangement further comprises a circuit carrier with a first metallization and a second metallization. The first connecting leg is directly joined to the first metallization and the second connecting leg is directly joined to the second metallization. The resistance area of the shunt resistor is in thermal contact with the thermally conductive substrate by use of a thermal filler arranged between the resistance area and the substrate, and/or by directly contacting the resistance area with the substrate. The invention further relates to a method for producing an arrangement with a shunt resistor and a circuit carrier.
    Type: Grant
    Filed: January 8, 2008
    Date of Patent: October 4, 2011
    Assignee: Infineon Technologies AG
    Inventors: Martin Schultz, Peter Kanschat
  • Patent number: 7378936
    Abstract: A circuit element has a substrate layer with first and second faces. A conductive first layer overlays the first surface, and a conductive second layer overlays the second surface. The first layer defines a pattern with a trimmable portion. The second layer defines a pattern having a first conductive element registered with at least a portion of the trimmable portion, and a second conductive element electrically isolated from first element and encompassing the first element. The second element may be a ground plane that has an aperture surrounding the first component, which serves as a shield to prevent damage to any elements beyond the second layer.
    Type: Grant
    Filed: May 23, 2005
    Date of Patent: May 27, 2008
    Assignee: Tektronix, Inc.
    Inventors: Devin Bingham, Daniel J. Ayres, Alvin Chow
  • Patent number: 7292133
    Abstract: A resistance circuit included in a semiconductor apparatus, which is formed of a plurality of thin film metal resistors connected in series, capable of achieving a precise resistance adjustment over a wide range by disconnecting or changing the resistors by laser beam irradiation. With three thin film metal resistors R1, R2, and R3 connected in series, for example, each having resistance adjustable ranges ?R1, ?R2, and ?R3, resistance adjustment accuracies R1_step, R2_step, and R3_step, and the total resistance adjustable range ?R0 specified by the relation ?R0=?R1+?R2+?R3, the resistance circuit is formed to satisfy relational expressions, R1_step??R2, R2_step??R3, and R3_step?0.001×?R0<R2_step?0.01×?R0<R1_step?0.1×?R0. This resistance circuit is suitably incorporated into high precision constant voltage generating, and voltage detecting circuits.
    Type: Grant
    Filed: September 28, 2006
    Date of Patent: November 6, 2007
    Assignee: Ricoh Company, Ltd.
    Inventor: Hidenori Kato
  • Patent number: 7173512
    Abstract: A thermistor of which resistance is changed depending on temperature and a secondary battery to which the thermistor is attached are disclosed. The thermistor is attached to an object via a lead which is made of different kinds of materials. The lead is configured so that a part of the lead to be united to the thermistor electrode is mainly made of the same material as the electrode and a part of the lead to be united to the object is mainly made of the same material as the surface of the object. Thus, the thermistor may be simply attached to the object only using the ultrasonic welding, thereby remarkably reducing junction inferiorities.
    Type: Grant
    Filed: July 9, 2004
    Date of Patent: February 6, 2007
    Assignee: LG Cable, Ltd.
    Inventors: Chang-Mo Ko, Su-An Choi, Jun-Ku Han, An-Na Lee, Jong-Hwan Lee, Ju-Dam Kim, Jong-Ho Lee, Jong-Seo Yoon
  • Patent number: 7042330
    Abstract: The low resistance value resistor 11 has two electrodes 12,13 of metal strips having a high electrical conductivity. The metal strips are affixed on the resistor body by means of rolling and/or thermal diffusion bonding. A fused solder layer is formed on a surface of each electrode comprised by the metal strip. Thus, sufficient bonding strength and superior current distribution in the resistor body is obtained. Further, a portion of the resistor body is trimmed by removing a portion of the body material along a direction of current flow between the electrodes to adjust a resistance value. Thus, a precise resistor value and superior characteristics of temperature coefficient of resistance (TCR) can be obtained.
    Type: Grant
    Filed: April 14, 2004
    Date of Patent: May 9, 2006
    Assignee: KOA Corporation
    Inventors: Keishi Nakamura, Mikio Tatuguchi
  • Patent number: 6960980
    Abstract: A power converter includes a shunt resistor constituted by a shunt resistance and a plurality of main electrodes made of a sheet-like resistive material. In the shunt resistor, plates lower in volume electric resistivity than the resistive material, higher in thermal conductivity than the resistive material and thicker in thickness than the resistive material are fixedly attached by solder, to the side surfaces of the main electrodes opposite to the side surfaces with which the main electrodes are fixedly attached to an insulating layer. At least one plate main electrode for electrically connecting with main circuit wiring is provided in each of the plates. At least one constricted portion is formed between each of the plate main electrodes and the shunt resistance. Plate detection electrodes for detecting a voltage between the opposite ends of the shunt resistance is provided on the plates near the shunt resistance portion.
    Type: Grant
    Filed: March 19, 2002
    Date of Patent: November 1, 2005
    Assignee: Hitachi, Ltd.
    Inventors: Kinya Nakatsu, Masataka Sasaki, Ryuichi Saito, Satoshi Ibori, Masato Takase
  • Patent number: 6935554
    Abstract: There is provided a method for producing a metal/ceramic bonding article, the method including the steps of: arranging a metal plate 12 of an overall-rate solid solution type alloy on a ceramic substrate 10; and heating the metal plate 12 and the ceramic substrate 10 in a non-oxidizing atmosphere at a temperature of lower than a melting point of the alloy to bond the metal plate 12 directly to the ceramic substrate 10. According to this method, it is possible to easily bond an alloy plate directly to a ceramic substrate, and it is possible to inexpensively provide an electronic member for resistance without causing the alloy plate to be deteriorated.
    Type: Grant
    Filed: September 25, 2002
    Date of Patent: August 30, 2005
    Assignee: Dowa Mining, Co. Ltd.
    Inventors: Masami Kimura, Susumu Shimada
  • Patent number: 6876291
    Abstract: The present invention relates to an electrical resistor (1), in particular for measuring alternating currents of high frequency, comprising connectors (2, 3) for feeding the current to be measured and connectors (4, 5) for tapping the voltage to be measured and having a layered structure including at least one resistive layer (10), a return conducting layer (11) and any possibly provided insulating layers (7, 12, 21, 22, 24). To obtain a measuring resistance having a particularly good frequency response, a high long-term stability and an efficient cooling and which, moreover, is inexpensive to produce, it is provided for the resistive layer (10) together with the return conducting layer (11) and the possible insulating layers (7, 12, 21, 22, 24) to be part of a multilayered printed circuit board and to comprise a plurality of conductive tracks (14) extending from a central region of the resistive layer (10) towards outside.
    Type: Grant
    Filed: January 4, 2002
    Date of Patent: April 5, 2005
    Assignee: Lem Norma GmbH
    Inventor: Wolfram Teppan
  • Patent number: 6794985
    Abstract: The low resistance value resistor 11 has two electrodes 12, 13 of metal strips having a high electrical conductivity. The metal strips are affixed on the resistor body by means of rolling and/or thermal diffusion bonding. A fused solder layer is formed on a surface of each electrode comprised by the metal strip. Thus, sufficient bonding strength and superior current distribution in the resistor body is obtained. Further, a portion of the resistor body is trimmed by removing a portion of the body material along a direction of current flow between the electrodes to adjust a resistance value. Thus, a precise resistor value and superior characteristics of temperature coefficient of resistance (TCR) can be obtained.
    Type: Grant
    Filed: April 4, 2001
    Date of Patent: September 21, 2004
    Assignee: KOA Corporation
    Inventors: Keishi Nakamura, Mikio Tatuguchi
  • Patent number: 6677850
    Abstract: An electrical current sensor and utility electricity meter, the current sensor comprising a &pgr; resistor shunt configuration, wherein the resistors comprise layered conductors at substantially equal temperatures to provide a zero temperature coefficient sensor. A fiscal electricity meter is described together with a four-layered current sensor fabricated using PCB techniques.
    Type: Grant
    Filed: December 22, 2000
    Date of Patent: January 13, 2004
    Assignee: Sentec Ltd.
    Inventor: Andrew Nicholas Dames
  • Patent number: 6556123
    Abstract: A chip PTC thermistor is provided which is capable of increasing the rate of increase in resistance when an overcurrent is applied, thereby increasing the breakdown voltage. The PTC thermistor comprises: a first main electrode and a first sub-electrode disposed on a first face of a conductive polymer with PTC properties; a second main electrode and a second sub-electrode disposed on a second face of the conductive polymer, which is facing the first face; and first and second side electrode and disposed on side faces of the conductive polymer. Cut-off sections are provided to the vicinity of joints of the first main electrode and the first side electrode, and joints of the second main electrode and the second side electrode.
    Type: Grant
    Filed: January 2, 2002
    Date of Patent: April 29, 2003
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Toshiyuki Iwao, Junji Kojima, Akira Tanaka, Takashi Ikeda, Kiyoshi Ikeuchi
  • Patent number: 6507271
    Abstract: A resistor is provided that is made by laminating at least two resistive layers, where these resistors have conductive particles held in a binder resin. The resistors are laminated such that a top resistor covers a bottom resistor, and a surface of the top resistor is exposed. The resistivity of the top resistor is made smaller than that of the bottom resistor. The top resistor contains carbon fiber and carbon black, where the central particle size of the carbon fiber ranges from 3.5 to 9.0 &mgr;m. The resistor has excellent durability and micro-linearity characteristics. The resistor may also be used as a variable resistor.
    Type: Grant
    Filed: October 30, 2001
    Date of Patent: January 14, 2003
    Assignee: ALPS Electric Co., Ltd
    Inventors: Yoshihiro Taguchi, Hisashi Komatsu, Takayuki Fujita, Michita Suzuki
  • Patent number: 6414585
    Abstract: A method and apparatus for an electronic component package of a passive component using wafer level processing is provided. Posts are formed on the active side of the substrate of an electronic component. A conductive layer leads the contact areas of the electronic component to the tops of the posts. The conductive layer on the top of the posts acting as leads, attaching to traces on a printed circuit board.
    Type: Grant
    Filed: May 13, 1997
    Date of Patent: July 2, 2002
    Assignee: Chipscale, Inc.
    Inventors: Phil P. Marcoux, James L. Young, Changsheng Chen
  • Patent number: 6396387
    Abstract: In thin layer resistors comprising a patch of a layer of resistive material on an insulating substrate and means at spaced apart locations on the patch, the resistive material is formed of 95 to 99.5 wt % of a zero valence metal and between 5 and 0.5 wt % of a dielectric material.
    Type: Grant
    Filed: April 13, 1999
    Date of Patent: May 28, 2002
    Assignee: MicroCoating Technologies, Inc.
    Inventors: Andrew T. Hunt, Wen-Yi Lin, Shara S. Shoup
  • Patent number: 6317023
    Abstract: The invention is directed to a method of embedding thick film passive components on an organic substrate wherein a flexible metallic substrate has a conductive paste underprint applied thereon. The method comprises the following steps: applying a conductor paste underprint onto a flexible metallic substrate; firing the preceding article; applying at least one passive component paste onto the underprint; firing the preceding article; and applying the passive component side of the metallic substrate onto at least one side of an organic layer which is at least partially coated with an adhesive layer wherein the passive component side of the article is embedded into the adhesive layer.
    Type: Grant
    Filed: October 15, 1999
    Date of Patent: November 13, 2001
    Assignee: E. I. du Pont de Nemours and Company
    Inventor: John James Felten
  • Patent number: 6242997
    Abstract: An electronic device has three conductive polymer layers sandwiched between two external electrodes and two internal electrodes. The electrodes are staggered to create a first set of electrodes, in contact with a first terminal, alternating with a second set of electrodes in contact with a second terminal.
    Type: Grant
    Filed: December 18, 1998
    Date of Patent: June 5, 2001
    Assignee: Bourns, Inc.
    Inventors: Andrew Brian Barrett, Steven D. Hogge, Wen Been Li, Kun Ming Yang
  • Patent number: 6215388
    Abstract: A plurality of PTC material layers and a plurality of metal plates are sandwiched together with one adjacent pair of metal plates connected in series through one layer of PTC material. The remaining PTC material layers are connected in parallel with the one layer by selectively interconnecting the other metal plates with the one adjacent pair of metal plates.
    Type: Grant
    Filed: September 27, 1996
    Date of Patent: April 10, 2001
    Assignee: Therm-Q-Disc, Incorporated
    Inventor: Jeffrey A. West
  • Patent number: 6194990
    Abstract: A thin-film metal resistor (44) suitable for a multilayer printed circuit board (12), and a method for its fabrication. The resistor (44) generally has a multilayer construction, with the individual layers (34, 38) of the resistor (44) being self-aligned with each other so that a negative mutual inductance is produced that very nearly cancels out the self-inductance of each resistor layer (34, 38). As a result, the resistor (44) has a very low net parasitic inductance. In addition, the multilayer construction of the resistor (44) reduces the area of the circuit board (12) required to accommodate the resistor (44), and as a result reduces the problem of parasitic interactions with other circuit elements on other layers of the circuit board (12).
    Type: Grant
    Filed: March 16, 1999
    Date of Patent: February 27, 2001
    Assignee: Motorola, Inc.
    Inventors: Tien Lee, Lawrence Lach, Gregory J. Dunn
  • Patent number: 6148018
    Abstract: An induction melting furnace includes a detection system for sensing metal penetration into a wall of the furnace depending upon detecting heat flow from the hearth to the furnace. The furnace includes a crucible including a refractory lining for holding molten metal, a coil for inductively heating the molten metal, and a power supply for supplying energy to the coil and the detection system. An electrode system is interposed between the coil and the lining comprising a sensing mat housing conductors receiving a test signal from the power supply, wherein the sensing mat includes a temperature sensitive binder that varies conductivity between the conductors in response to heat penetration through the lining. The sensing mat is preferably comprised of flexible phillosilicate mica for enhanced thermal conduction and the binder comprises an organic resin compound which carburizes at a predetermined elevated temperature.
    Type: Grant
    Filed: October 29, 1997
    Date of Patent: November 14, 2000
    Assignee: Ajax Magnethermic Corporation
    Inventors: Jose A. Garcia, David A. Lazor, Jack L. McMillin
  • Patent number: 6144287
    Abstract: A chip resistor is provided which includes: an insulating substrate (1); a pair of main electrodes (2, 3) formed on a surface of the insulating substrate (1) and spaced from each other; a resistor film (4) formed on the surface of the insulating substrate (1) to bridge between the main electrodes (2, 3), the resistor film (4) being provided with a trimming groove (6) for resistor adjustment; a protective coating (5, 7, 8) formed to cover the resistor film (4); and a metal plating (13, 14) formed in electrical conduction with each of the main electrodes (2, 3). The trimming groove (6) has a width which is no less than 80 .mu.m but smaller than an interval between the main electrodes (2, 3), and is formed at an inclination angle of 20-45 degrees with respect to the substrate. Three glass coat layers are also employed.
    Type: Grant
    Filed: December 15, 1998
    Date of Patent: November 7, 2000
    Assignee: Rohm Co., Ltd.
    Inventor: Masayoshi Komeda
  • Patent number: 6124769
    Abstract: The invention provides an electronic device comprising a first metal layer containing a first metal converted into an oxide upon firing in an oxidizing atmosphere and a second metal layer formed by firing of a second metal particle containing a metal that is not oxidized upon firing in an oxidizing atmosphere, with an intermediate oxide layer interleaved between these two metal layers. The intermediate oxide layer contains an oxide of the first metal contained in the first metal layer. Preferably, the second metal particle contained in the second metal layer is dispersed in the intermediate oxide layer. A uniform oxide layer is obtained at a simple step, and the resistance value provided by the oxide layer is easily controllable with high precision. It is thus possible to achieve an electronic device in which the bonding strength of the oxide layer with respect to the other metal-containing layer is improved with an improvement in the bonding strength with respect to lead wires.
    Type: Grant
    Filed: June 7, 1999
    Date of Patent: September 26, 2000
    Assignee: TDK Corporation
    Inventors: Katsuhiko Igarashi, Sunao Masuda, Tomoko Uchida, Yasumichi Tokuoka, Shigeki Sato
  • Patent number: 6073340
    Abstract: Several heater patterns are printed on a ceramic green sheet for substrates, and the ceramic green sheet is laminated with a ceramic green sheet for cover plates, thereby forming a lamination body. Then, the lamination body is cut so that it is divided into several intermediate bodies, each of which holds a corresponding one of the heater patterns therein and has a side surface on which a terminal portion of the heater pattern is exposed. Then, the intermediate body is baked. As a result, a ceramic heater composed of a heater substrate holding the heater pattern and a cover plate disposed on the heater substrate to cover the heater pattern can be provided without any micro-cracks therein.
    Type: Grant
    Filed: May 29, 1998
    Date of Patent: June 13, 2000
    Assignee: Denso Corporation
    Inventors: Makoto Shirai, Akira Fujii, Masayuki Kobayashi
  • Patent number: 6018288
    Abstract: The flat resistor comprises a stack of flat components including a first metal plate having assembly tabs bent, a first outer electrical insulator having alignment slots for receiving the tabs, a first sheet metal resistance element having slots for receiving the tabs with a clearance fit, a first inner electrical insulator having alignment slots for receiving the tabs, a metal midplate having oversize slots for receiving the tabs with a clearance fit, a second thin inner insulator having alignment slots for receiving the tabs, a second sheet metal resistance element having clearance slots for receiving the tabs, a second thin outer insulator having alignment slots for receiving the tabs, and a second metal outer plate having alignment slots for receiving the tabs, which are bent into engagement with the second plate for compressing the stack. The resistance elements have alignment tabs extending through alignment slots in the corresponding outer insulators and securely bent behind the insulators.
    Type: Grant
    Filed: May 14, 1998
    Date of Patent: January 25, 2000
    Assignee: Indak Manufacturing Corp.
    Inventors: Daryn L. Waite, Raymond S. Anderson, Scott D. Smith
  • Patent number: 5997998
    Abstract: Concerning a resistance element comprising a laminated and sintered article of an insulating material substrate layer and a conductor layer formed on or embedded in the insulating material substrate layer, a material which is constituted of tungsten and carbon and has an atomic ratio of tungsten to carbon equal to 1:0.4 to 1:0.98 is used as said conductor layer. Such resistance element can be used at a temperature of 1400.degree. C. or more and even further at a temperature of 1500.degree. C. or more. The resistance element can increase its temperature rapidly to 1100.degree. C. or more within about 3 seconds without any control circuit. The resistance element is a rapid temperature-rise resistance element with a high ignition performance constituted of ceramics with superior durability including resistance to repetitions of temperature increase and decrease, and resistance to oxidation at a high temperature.
    Type: Grant
    Filed: March 15, 1999
    Date of Patent: December 7, 1999
    Assignee: TDK Corporation
    Inventor: Kentaro Sawamura
  • Patent number: 5955938
    Abstract: A ceramic circuit substrate having a resistor deposited on a surface thereof, said ceramic substrate having a coefficient of thermal expansion ranging from 5.0.times.10.sup.-6 /.degree. C. to 7.0.times.10.sup.-6 /.degree. C., the resistor being coated with a glass overcoat and made of 15 to 50% of RuO.sub.2 and 85 to 50% of a CaO--Al.sub.2 O.sub.3 --SiO.sub.2 --B.sub.2 O.sub.3 -system glass, the glass overcoat being made of 60 to 100% of a CaO--Al.sub.2 O.sub.3 --SiO.sub.2 --B.sub.2 O.sub.3 -system glass and up to 40% of alumina, wherein the resistor has a coefficient of thermal expansion greater than that of the glass overcoat. Due to the above specific relationship between the coefficient of thermal expansion of the resistor and that of the overcoat, the resistor is not subject to cracking at the time of trimming and thereafter, and realizes the exertion of resistance performance ensuring excellent weather resistance and stability.
    Type: Grant
    Filed: November 26, 1997
    Date of Patent: September 21, 1999
    Assignee: Sumitomo Metal (SMI) Electronics Devices, Inc.
    Inventor: Masashi Fukaya
  • Patent number: 5907273
    Abstract: Use is made of thermoplastic materials in layered configurations as a thermally stable, rigid but not brittle strip of lengths of six inches to ten feet or more. The layered strip contains layers of conductive fibers in a resin matrix, which, through use of appropriate contact mechanisms and wiring, provide an assembly with an infinite potentiometer scale. The strips are especially useful in linear positioning indicators such as pneumatic and hydraulic cylinder and liquid level gauges. The strips are conductively connected by cutting a bias surface relative to said strips and placing resin thereon.
    Type: Grant
    Filed: September 24, 1997
    Date of Patent: May 25, 1999
    Assignee: Rochester Gauges, Inc.
    Inventors: Herbert G. Ross, Jr., Carl A. Taylor, Cecil M. Williamson
  • Patent number: 5889462
    Abstract: A surge r or network comprises a substrate layer having a first thick film resistive element, a dielectric layer covering the first thick film resistive element and a second thick film resistive element applied to the dielectric layer. The dielectric layer has a pair of vias that extend therethrough so that the first resistive element is electrically connected to the second resistive element through the vias. A pair of electrical terminals are coupled to the first resistive layer at the substrate. The first resistive element comprises a first pair of unconnected adjacent tracks that each spiral respectively inward in a serpentine pattern. Each one of the tracks has an electrical pad disposed at a first end thereof for attachment to respective ones of the pair of electrical terminals. A second end of the tracks is disposed at a center of each serpentine pattern. The second resistive element comprises a second pair of adjacent tracks that each spiral respectively outward in a serpentine pattern.
    Type: Grant
    Filed: April 8, 1996
    Date of Patent: March 30, 1999
    Assignee: Bourns, Inc.
    Inventors: Joseph M. Rana, Prasanna E. Paralkar, Bruce L. Jeppesen
  • Patent number: 5889459
    Abstract: According to the present invention, there is provided a metal oxide film resistor which has an insulating substrate, a metal oxide resistive film having at least a metal oxide film having a positive temperature coefficient of resistance and/or a metal oxide film having a negative temperature coefficient of resistance, and/or a metal oxide insulating film. The metal oxide film resistor is not affected by moisture or alkali ions in the insulating substrate. The resistance of the film itself does not change. The metal oxide film resistor is extremely reliable.
    Type: Grant
    Filed: November 27, 1996
    Date of Patent: March 30, 1999
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Akiyoshi Hattori, Yoshihiro Hori, Masaki Ikeda, Akihiko Yoshida, Yasuhiro Shindo, Kouzou Igarashi
  • Patent number: 5841340
    Abstract: Solderless RF power film resistor and termination assemblies which include a flat film resistor or termination pressed by a nonmetallic clamping plate into thermal contact with a base plate functioning as a heat sink. A substrate such as a BeO ceramic substrate provides an RF power film resistor or termination, and has a flat mounting surface positioned against a flat mounting surface of the base plate. A clamping plate clamps the ceramic substrate securely against the base plate, thereby eliminating a soldered interface connection between the flat mounting surfaces of the ceramic substrate and the base plate. The clamping plate includes at least one lug, and the base plate includes at least one lug hole. The lug is larger than, and is plastically deformed into and through the hole to clamp the flat surface of the ceramic substrate securely against the flat surface of the base plate. The hole in the base plate preferably includes an undercut shoulder through and around which the lug is plastically deformed.
    Type: Grant
    Filed: May 7, 1996
    Date of Patent: November 24, 1998
    Assignee: RF Power Components, Inc.
    Inventors: Thomas J. Passaro, Jr., Thomas J. Dowling, Paul S. Davidsson
  • Patent number: 5822675
    Abstract: Disclosed is a heating element having improved performance, particularly at high power densities and high temperatures. The heating element comprises a substrate having a first layer comprising a silicon based electrically insulating material on its surface. On a surface of the first layer is a second layer comprising a silicon based electrically resistive material. Attached to the second layer are at least two separate areas of silicon based electrically conductive material. Each of these separate areas are suitable for connection to a power supply.
    Type: Grant
    Filed: February 12, 1997
    Date of Patent: October 13, 1998
    Assignee: Dow Corning S.A.
    Inventors: Rene Paquet, Eric Vanlathem
  • Patent number: 5804791
    Abstract: A heating structure for use in an appliance, the heating structure being a sandwich structure composed of two rigid elements constituting external elements of the sandwich structure, with at least one of the rigid elements being a heating plate; a heating unit composed of an electrical resistance component disposed between the rigid elements for producing heat which is diffused through the rigid elements, and electrical insulation material covering the electrical resistance component; and bonding layers securing the heating unit to the rigid elements. The heating unit further includes a primary layer of thermoplastic resin material into which the electrical resistance component is inserted, the electrical insulation material is composed of first and second layers of electrical insulation material which enclose the electrical resistance component, and the primary layer of thermoplastic resin material adheres to the layers of electrical insulation material.
    Type: Grant
    Filed: January 25, 1993
    Date of Patent: September 8, 1998
    Assignee: SEB S.A.
    Inventor: Dominique Gelus
  • Patent number: 5641421
    Abstract: An electrical heating system uses heating elements made of ribbons of amorphous metallic alloys. The heating elements have a large area using long and wide ribbons, to achieve good heat transfer to the surroundings, that is low thermal resistance. The area of the heating elements and thus the thermal resistance is determined according to the desired thermal power, under the constraint of a low operating temperature, that is a temperature well below the embrittlement temperature of the amorphous alloy used in the heating elements. The operating temperature is preferably kept low enough so as not to generate benzopyrene or other unhealthy or ecologically unfavorable fumes or gases. The thin ribbons with low thermal resistance also have a fast heating constant, that is the heater reaches its steady state temperature in a short time. The electrical heating system uses low cost insulation and support materials, that is materials intended for use at low temperatures only.
    Type: Grant
    Filed: September 10, 1996
    Date of Patent: June 24, 1997
    Inventors: Vladimir Manov, Eliezer Adar, Mark Geller, Evgeni Sorkine, Iosef Margolin
  • Patent number: 5635893
    Abstract: A resistor structure (10) having a heating element (35) and a resistor (32), and a method of trimming the resistor (32). The heating element (35) is separated from the resistor (32) by a layer of dielectric material (19). The resistor (32) has a layer of resistive material (23) on an etch control layer (22). The resistor (32) is trimmed by providing current pulses (62) through the heating element (35). Heat generated by the current pulses flows to the resistor (32) and anneals or trims the resistor (32). A resistor trimming variable, e.g. a voltage across resistor contacts (30, 31), is monitored and the current pulses are modulated in accordance with the value of the resistor trimming variable (63). The trimming step is terminated when the desired resistance value of the resistor (32) is attained.
    Type: Grant
    Filed: November 2, 1995
    Date of Patent: June 3, 1997
    Assignee: Motorola, Inc.
    Inventors: Gary L. Spraggins, Martin J. Abresch, William B. Newton, Renwin J. Yee
  • Patent number: 5563572
    Abstract: A resistor of SMD (Surface Mounted Device) construction includes a film of a resistive alloy as a resistive track on two electrically separated carrier plate elements of copper, which are constructed as contact elements solderable to the terminals of a printed circuit board to thereby ensure good heat dissipation into a printed circuit board. In order to manufacture such resistors, a resistive film sufficient for a plurality of individual resistors is adhered to but electrically isolated from a large copper plate and the laminate formed thereby is split into the individual resistors after producing the individual resistive tracks and their electrical connections to the copper plate and after producing gaps between the plate elements for each track.
    Type: Grant
    Filed: May 23, 1994
    Date of Patent: October 8, 1996
    Assignee: Isabellenhutte Heusler GmbH KG
    Inventor: Ullrich Hetzler
  • Patent number: 5530418
    Abstract: A polysilicon resistor structure and a method by which the polysilicon resistor structure may be formed. A polysilicon resistor is formed upon the surface of a semiconductor substrate. A pair of dummy polysilicon layers is formed along opposite edges and separated from the polysilicon resistor. A pair of metal sidewalls is then formed upon the upper surfaces of the pair of dummy polysilicon layers, and a top metal layer is formed bridging the upper surfaces of the pair of metal sidewalls. The pair of dummy polysilicon layers, the pair of metal sidewalls and the top metal layer form an open ended cavity upon the semiconductor substrate within which structure the polysilicon resistor resides. The polysilicon resistor is separated from the structure by an insulating material which is not susceptible to outgassing of hydrogen.
    Type: Grant
    Filed: July 26, 1995
    Date of Patent: June 25, 1996
    Assignee: Taiwan Semiconductor Manufacturing Company
    Inventors: Shun-Liang Hsu, Han-Liang Tseng, Mou-Shiung Lin
  • Patent number: 5501007
    Abstract: A resistor, such as a resistor wire, is contained in a sheet, preferably a low density sheet consisting mainly of inorganic fiber. Adsorbent or absorbent (hereinafter "sorbent" collectively) is fixed to the sheet to obtain sorbing characteristics, such that desorption and reactivation can be accomplished by applying an electric current to the resistor to heat the sheet. A sorbing laminate with many channels may be used by laminating the sorbing sheets. The sorbing sheet can therefore be heated directly from the inner side by the resistor contained in the sheet desorbing the sheets rapidly while the time for reactivating the sorbing sheet is reduced and the reactivation efficiency increased.
    Type: Grant
    Filed: May 28, 1993
    Date of Patent: March 26, 1996
    Assignee: Kabushiki Kaisha Seibu Giken
    Inventor: Toshimi Kuma
  • Patent number: 5355112
    Abstract: A resistor having a ceramic sintered body and at least one resistor film embedded therein so as to be covered by the ceramic sintered body except for portions of the resistor film-chat are connected to external electrodes. The sintered body is mainly composed of ZnO, and contains at least one element of Bi, Pb, B and Si as a subcomponent with respect to the main component.
    Type: Grant
    Filed: February 5, 1993
    Date of Patent: October 11, 1994
    Assignee: Murata Mfg., Co., Ltd.
    Inventors: Kazutaka Nakamura, Keisuke Nagata, Yasunobu Yoneda, Hiroji Tani
  • Patent number: 5208576
    Abstract: An electrical external resistor with a plate-like, electrical insulating carrier element and a flat resistance element arranged on the upper side of the carrier element. The carrier element has several films forming a closed coating and varying in their electrical conductivity. The films arranged on the upper side and on the lower side of the carrier element consist of cermet, and the film covering the edge area of the carrier element consists of an electrically insulating material. By means of springs or a pressure distribution plate, the resistance element is pressed against the upper cermet film of the carrier element. The interior space of the housing is filled with a casting compound made of addition cross-linking two-component silicon caoutchouc (rubber). The electrical external resistance is discharge-free.
    Type: Grant
    Filed: May 1, 1991
    Date of Patent: May 4, 1993
    Assignee: Draloric Electronic GmbH
    Inventors: Dieter Wunderlich, Ernst Karich, Claus Degel
  • Patent number: 5181007
    Abstract: A PTC temperature sensor, in particular for use in the exhaust gas system of internal combustion engines, has a sensing element including a PTC resistor connected to conductor webs disposed in a housing. The PTC resistor and the conductor webs are composed of a homogeneous material to form a PTC resistor track. The temperature sensing element is formed from a laminated composite of ceramic films in which the PTC resistor track is hermetically encapsulated with respect to the gas being measured and the ambient air.
    Type: Grant
    Filed: January 10, 1990
    Date of Patent: January 19, 1993
    Assignee: Robert Bosch GmbH
    Inventors: Karl-Hermann Friese, Hans-Martin Wiedenmann
  • Patent number: 5140298
    Abstract: A ceramic base component packaging assembly with high thermal transfer rates. The packaging assembly includes a molded plastic cover that receives spring washers, ceramic pads, resistive elements or other electronic components, and a thermally conductive ceramic base. The spring washers press the electronic elements against the ceramic base ensuring good thermal transfer. The ceramic base is an effective thermal conductor and electrical isolator for the device.
    Type: Grant
    Filed: September 4, 1990
    Date of Patent: August 18, 1992
    Assignee: International Business Machines Corporation
    Inventors: James C. Gordon, Eric P. Lovgren, Herman P. Meyer, Donald P. Rearick
  • Patent number: 5039976
    Abstract: A high-precision and high-stability resistor element, which exhibits zero, or close to zero, resistance deviation during time and in given temperature and power ranges, includes a bonded sandwich of several substrates of inorganic insulating material having a substantially zero coefficient of thermal expansion with one or more R (Resistance) and TCR (Temperature Coefficient of Resistance) trimmed resistive metal foil patterns which can be retrimmed in two directions during periodic verifications.
    Type: Grant
    Filed: February 21, 1990
    Date of Patent: August 13, 1991
    Inventor: Alexander Drabkin
  • Patent number: 4794228
    Abstract: A heater assembly includes a heater with an electrical resistance wire element bonded between first and second layers of silicone rubber insulation. First and second conductor plates each having inner and outer surfaces are clamped together with the heater between their inner surfaces. A resettable, thermostatic switch is mounted on the outer surface of one of the conductor plates and opens when the conductor plate reaches a predetermined temperature.
    Type: Grant
    Filed: August 25, 1986
    Date of Patent: December 27, 1988
    Assignee: Heatron, Inc.
    Inventor: Fred P. Braun, Jr.