Incased, Embedded, Or Housed Patents (Class 338/226)
  • Patent number: 10896775
    Abstract: A resistor has a structure including a resistor substrate that has paired electrodes and a resistive element formed on an insulating substrate, an insulating exterior material that covers at least the upper and the side surface of the resistor substrate, and harness electric wires that have one end parts connected to the respective electrodes, pass through the exterior material, and extend outside. The paired electrodes are formed on areas other than the end parts of the insulating substrate, and junctions of the end parts of the harness electric wires and the paired electrodes are at positions where creepage distance of insulation from the junctions to the bottom ends of the insulating substrate is a predetermined distance or longer. Such structure provides the resistor having a secured creepage distance of insulation between the conductor parts of the resistor and the metal case in which the resistor is installed.
    Type: Grant
    Filed: February 20, 2017
    Date of Patent: January 19, 2021
    Assignee: KOA Corporation
    Inventors: Masaki Miyagawa, Kyohei Miyashita, Hiroshi Sakai, Hidekazu Karasawa, Takashi Ito
  • Patent number: 10854360
    Abstract: A power resistor comprises a tubular housing composed of metal and a resistor element received therein, wherein the housing has four side walls that extend along a longitudinal axis of the housing between two ends and define a rectangular cross-section. The housing comprises four edges of the four side walls at at least one of the two ends. Two of the four side walls have a respective incision at their edges for introducing a fastening element and the two other side walls have a respective clearance in alignment with the oppositely disposed incision to facilitate a placement of a tool at a fastening element introduced into the respective incision.
    Type: Grant
    Filed: June 15, 2018
    Date of Patent: December 1, 2020
    Assignee: VISHAY ELECTRONIC GMBH
    Inventors: Matthias Dressler, Bertram Schott
  • Patent number: 10833145
    Abstract: A compact and refined chip resistor, with which a plurality of types of required resistance values can be accommodated readily with the same design structure, was desired. The chip resistor is arranged to have a resistor network on a substrate. The resistor network includes a plurality of resistor bodies arrayed in a matrix and having an equal resistance value. A plurality of types of resistance units are respectively arranged by one or a plurality of the resistor bodies being connected electrically. The plurality of types of resistance units are connected in a predetermined mode using connection conductor films and fuse films. By selectively fusing a fuse film, a resistance unit can be electrically incorporated into the resistor network or electrically separated from the resistor network to make the resistance value of the resistor network the required resistance value.
    Type: Grant
    Filed: January 17, 2019
    Date of Patent: November 10, 2020
    Assignee: ROHM CO., LTD.
    Inventors: Hiroshi Tamagawa, Yasuhiro Kondo, Yasuhiro Fuwa, Hiroyuki Okada, Eiji Nukaga, Katsuya Matsuura
  • Patent number: 10054492
    Abstract: A thermistor includes a case having a bottom section at one end and an opening section at the other end, a thermistor element housed in the case, a conducting wire housed in the case and connected to the thermistor element, and a lead wire connected to the conducting wire. The lead wire has a first portion including an insulating coating, and a second portion connected to the conducting wire and exposed from the insulating coating. A resin is filled up to a position away from an end edge of the opening section toward the bottom section so as to enclose at least the thermistor element, the conducting wire, and the second portion. The first portion is guided out of the resin to the outside of the case. An inner peripheral surface of the opening section is curved so as to increase an opening area of the opening section.
    Type: Grant
    Filed: November 16, 2015
    Date of Patent: August 21, 2018
    Assignees: TDK CORPORATION, TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Satoru Shiraki, Keiichi Kaneshige, Masashi Matsumoto, Masayuki Ikemoto, Tsutomu Hatakeyama
  • Patent number: 9735225
    Abstract: A compact and refined chip resistor, with which a plurality of types of required resistance values can be accommodated readily with the same design structure, was desired. The chip resistor is arranged to have a resistor network on a substrate. The resistor network includes a plurality of resistor bodies arrayed in a matrix and having an equal resistance value. A plurality of types of resistance units are respectively arranged by one or a plurality of the resistor bodies being connected electrically. The plurality of types of resistance units are connected in a predetermined mode using connection conductor films and fuse films. By selectively fusing a fuse film, a resistance unit can be electrically incorporated into the resistor network or electrically separated from the resistor network to make the resistance value of the resistor network the required resistance value.
    Type: Grant
    Filed: December 2, 2015
    Date of Patent: August 15, 2017
    Assignee: ROHM CO., LTD.
    Inventors: Hiroshi Tamagawa, Yasuhiro Kondo, Yasuhiro Fuwa, Hiroyuki Okada, Eiji Nukaga, Katsuya Matsuura
  • Patent number: 9398642
    Abstract: A heater assembly including a foil heater having at least one slot. The heater assembly includes an insulating plate configured to electrically and thermally insulate the foil heater, the insulating plate having a central opening, at least one first mounting hole and at least one first fastening hole. The heater assembly includes a heat dissipation element configured to conduct heat from the foil heater to an exterior of the heater assembly, the heat dissipation element having at least one second mounting hole and at least one second fastening hole. The foil heater is between the insulating plate and the heat dissipation element. The at least one first mounting hole, the at least one slot and the at least one second mounting hole are aligned. The at least one first fastening hole, the at least one slot and the at least one second fastening hole are aligned.
    Type: Grant
    Filed: October 22, 2012
    Date of Patent: July 19, 2016
    Assignee: Thales Canada Inc
    Inventors: Richard Lawrence Swain, Jeffrey Allan Thomson
  • Patent number: 9377491
    Abstract: A temperature sensor (60) is placed positionally corresponding to a central portion of a shunt resistor portion (SR). According to the configuration, it is possible to detect an approximately average temperature of the shunt resistor portion (SR) while avoiding a temperature biased in the temperature distribution in the shunt resistor portion (SR). As a result, the temperature of the shunt resistor portion which is the base of the resistance is reliably detected to enable the accuracy of current detection to be improved.
    Type: Grant
    Filed: December 11, 2012
    Date of Patent: June 28, 2016
    Assignee: YAZAKI CORPORATION
    Inventor: Takashi Sato
  • Publication number: 20140367153
    Abstract: A chip resistor with a reduced thickness is provided. The chip resistor includes an insulating substrate, a resistor embedded in the substrate, a first electrode electrically connected to the resistor, and a second electrode electrically connected to the resistor. The first electrode and the second electrode are spaced apart from each other in a lateral direction that is perpendicular to the thickness direction of the substrate.
    Type: Application
    Filed: June 3, 2014
    Publication date: December 18, 2014
    Applicant: ROHM CO., LTD.
    Inventor: Masaki YONEDA
  • Patent number: 8911148
    Abstract: A temperature detector for a contact thermometer of process measurement technology having a thermowell, at least one thermal sensor element arranged in a process-side end of the thermowell, and at least one electrical connecting means connected to the thermal sensor element with a first connection side and extending in the thermowell at least up to an evaluation-side end of the thermowell, so that the thermal sensor element can be electrically contacted via a second connection side of the electrical connecting means, and in which the electrical connecting means is formed by a connection printed circuit board with conducting paths.
    Type: Grant
    Filed: May 24, 2012
    Date of Patent: December 16, 2014
    Assignee: INOR Process AB
    Inventor: Hans-Owe Mårtensson
  • Publication number: 20140262971
    Abstract: The present invention relates to a component comprising a tubular structure having interior and exterior surfaces with the interior surface defining an interior passage through the tubular structure, said tubular structure extending longitudinally between opposed ends. The component also includes a resistive film bound to the interior surface of the tubular structure having a pattern configured so that when the resistive film is connected to an electrical source, an electric field is established within the interior passage with an electrical potential that differs along the length of the interior passage while each plane perpendicular to the length of the interior passage is equipotential. Also disclosed are a method of making the component, a charged particle transportation chamber system comprising the component, and a method of identifying and/or separating charged particles.
    Type: Application
    Filed: March 18, 2014
    Publication date: September 18, 2014
    Inventor: Alan Drumheller
  • Publication number: 20140191841
    Abstract: A corrosion-resistant apparatus may contain an electronic component having a first metal and a polymer coating covering the electronic component. The polymer coating includes polymer chains with unsaturated groups to scavenge sulfur and an anionic initiator dispersed in the polymer coating to convert cyclic elemental sulfur to linear polysulfide.
    Type: Application
    Filed: January 4, 2013
    Publication date: July 10, 2014
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Dylan J. Boday, Joseph Kuczynski, Jason T. Wertz, Jing Zhang
  • Patent number: 8461957
    Abstract: An article of manufacture having an in-molded resistive and/or shielding element and method of making the same are shown and described. In one disclosed method, a resistive and/or shielding element is printed on a film. The film is formed to a desired shape and put in an injection mold. A molten plastic material is introduced into the injection mold to form a rigid structure that retains the film.
    Type: Grant
    Filed: May 16, 2012
    Date of Patent: June 11, 2013
    Assignee: Ink-Logix, LLC
    Inventors: Ronald H. Haag, Jeffrey R. Engel, William W. Boddie, Jr.
  • Patent number: 8451013
    Abstract: An insulated fiber sensor apparatus is used in a composite that includes a number of fibers in a matrix. An insulated fiber is connected with the composite and is covered with insulation such that the insulation separates the insulated fiber from the matrix and from the number of fibers in the matrix. Further, a measurement device is connected with the insulated fiber. According to one aspect of the invention, the fibers are carbon fibers.
    Type: Grant
    Filed: April 29, 2010
    Date of Patent: May 28, 2013
    Inventor: Kuang-Ting Hsiao
  • Publication number: 20130093558
    Abstract: An electronic component that can be prevented from being shifted from a normal mount position and can be manufactured with a low cost is provided. The component is configured by stacking a plurality of insulating layers and a plurality of inner conductors provided on the respective insulating layers. The connection conductors have respective exposure portions that are each exposed between corresponding ones of the insulating layers at a surface of the stack. An outer electrode is formed, for example, by plating on the lower surface so that the exposure portions are covered with the outer electrode. The plurality of exposure portions do not have uniform thicknesses or are not arranged at uniform intervals in the stacking direction.
    Type: Application
    Filed: December 4, 2012
    Publication date: April 18, 2013
    Applicant: MURATA MANUFACTURING CO., LTD.
    Inventor: Murata Manufacturing Co., Ltd.
  • Patent number: 8310334
    Abstract: A surface mount resistor includes a resistance body, a first protective layer, a heat-transfer layer, a second protective layer and two electrode layers. The resistance body has a first end portion, a second end portion and a central portion between the first end portion and the second end portion. The first protective layer is disposed on the central portion of the resistance body, and the first end portion and the second end portion are exposed. The heat-transfer layer is plated on at least part of the resistance body. The second protective layer is disposed on at least part of the heat-transfer layer. The electrode layers are respectively arranged on the first end portion and the second end portion, and electrically connected with the heat-transfer layer.
    Type: Grant
    Filed: May 4, 2010
    Date of Patent: November 13, 2012
    Assignee: Cyntec, Co., Ltd.
    Inventors: Ching-Feng Chen, Kun-Hong Shih, Yen-Ting Lin, Yin-Tien Yeh
  • Patent number: 8274357
    Abstract: A varistor for protecting a power circuit from explosion and flaming is disclosed. The varistor includes a surge absorber sintered at a first predetermined temperature and having a plurality of electrodes, a plurality of leads connected to the electrodes respectively, a coating enrobing the surge absorber, and the ceramic case sintered at a second predetermined temperature and housing the surge absorber and the coating. The second predetermined temperature is higher than the first predetermined temperature. The ceramic case has a plurality of openings for the leads to extend outside of the ceramic case. The ceramic case is made from Al2O3, SiO2 and MgO.
    Type: Grant
    Filed: October 13, 2010
    Date of Patent: September 25, 2012
    Assignee: Powertech Industrial Co., Ltd.
    Inventor: Bi-Yung Chang
  • Patent number: 8149082
    Abstract: The resistor device is provided with a resistive plate (11) of metal plate material, which is used as a resistance body; a radiative plate (15) of metal plate material, which is spaced from the resistive plate and intercrossed on the resistive plate; a molded resin body (19), which encloses an intercrossing portion of the resistive plate and the radiative plate; terminal portions of the resistive plate (11a), which comprises so that both ends of the resistive plate extending from the molded resin body are bent along an end face and a bottom face of the molded resin body; and terminal portions of the radiative plate (15a), which comprises so that both ends of the radiative plate extending from the molded resin body are bent along an end face and a bottom face of the molded resin body. Accordingly, the surface-mountable resin-sealed metal plate resistor device is enabled to increase the power capacity drastically and to improve the reliability without changing most of the size.
    Type: Grant
    Filed: June 26, 2008
    Date of Patent: April 3, 2012
    Assignee: Koa Corporation
    Inventors: Koichi Hirasawa, Hitoshi Amemiya, Atsunori Hayashi
  • Patent number: 8084721
    Abstract: An electrical heating apparatus has: a fin brazed on at least one of a main body upper wall and a main body lower wall of a tube; an insertion unit having an electro-heat-generating element pressure-welded to a wall of one of the main body upper wall and the main body lower wall; and an edge part projecting in the width direction from each of main body vertical walls to form an edge space. The edge space is formed so as to be continuous with the insertion space and is smaller in thickness dimension than the thickness dimension of the insertion unit. The edge part has an edge part upper wall, an edge part lower wall, and an edge part vertical wall disposed in a concave shape.
    Type: Grant
    Filed: October 24, 2008
    Date of Patent: December 27, 2011
    Assignee: Calsonic Kansei Corporation
    Inventors: Kazuaki Mori, Syotaro Abe
  • Patent number: 7880581
    Abstract: A PTC thermistor includes two electric conducting plates connected with different electrodes and an intermediate insulating plate clamped between the two electric conducting plates. The intermediate insulating plate has its surface bored with openings at locations respectively corresponding with those of each PTC thermal resistance member for the PTC thermal resistance member to be engaged therein. The intermediate insulating plate can surely separate and insulate the two different-electrode electric conducting plates and stably fix the PTC thermal resistance members in position.
    Type: Grant
    Filed: September 15, 2008
    Date of Patent: February 1, 2011
    Inventor: Chung-Tai Chang
  • Publication number: 20100328021
    Abstract: The resistor device is provided with a resistive plate (11) of metal plate material, which is used as a resistance body; a radiative plate (15) of metal plate material, which is spaced from the resistive plate and intercrossed on the resistive plate; a molded resin body (19), which encloses an intercrossing portion of the resistive plate and the radiative plate; terminal portions of the resistive plate (11a), which comprises so that both ends of the resistive plate extending from the molded resin body are bent along an end face and a bottom face of the molded resin body; and terminal portions of the radiative plate (15a), which comprises so that both ends of the radiative plate extending from the molded resin body are bent along an end face and a bottom face of the molded resin body. Accordingly, the surface-mountable resin-sealed metal plate resistor device is enabled to increase the power capacity drastically and to improve the reliability without changing most of the size.
    Type: Application
    Filed: June 26, 2008
    Publication date: December 30, 2010
    Applicant: KOA CORPORATION
    Inventors: Koichi Hirasawa, Hitoshi Amemiya, Atsunori Hayashi
  • Publication number: 20100156589
    Abstract: A resistor having a body, a fuse component, a resistor component, a wire and a cover. The body has a top, a first positioning hole and a second positioning hole being formed in the top of the body. The fuse component is inserted in the first positioning hole. The resistor component is inserted in the second positioning hole. The wire connects the fuse component and the resistor component and is mounted outside the body. The cover is attached to the top of the body around the wire. Therefore, the body of resistor as described may be dried in an oven without damaging the resistor component. A method having steps of forming a body having two positioning holes, drying the body in an oven heated above 130° C., mounting a resistor component and a fuse component respectively in the positioning holes, and covering the positioning holes with an insulating cover.
    Type: Application
    Filed: December 23, 2008
    Publication date: June 24, 2010
    Applicant: TY-OHM ELECTRONIC WORKS CO., LTD.
    Inventor: Samuel Kuo
  • Patent number: 7675401
    Abstract: A circuit board, for an electronic circuit having a passive circuit component, has a component region, a non-component region, and circuit wiring conductors on its surface. The component region includes a polymer composition comprising a mixture of polymer resin and filler material that, in combination with the circuit wiring conductors, forms the passive circuit component.
    Type: Grant
    Filed: June 9, 2005
    Date of Patent: March 9, 2010
    Assignee: The Hong Kong Polytechnic University
    Inventors: Ka Wai Eric Cheng, Chak Yin Tang
  • Patent number: 7675008
    Abstract: Connector bushings are crimped to the terminal ends of tubular electrical heating elements for heating equipment, particularly equipment intended for use in hazardous environments, e.g. where there is a risk of explosion.
    Type: Grant
    Filed: October 23, 2006
    Date of Patent: March 9, 2010
    Assignee: CCI Thermal Technologies Inc.
    Inventors: Michael Arbour-Neagoe, Chris Duggan, Eric Anzinger
  • Patent number: 7522030
    Abstract: A starter relay comprises a container composed of an electrical insulating hard resin, a resistor having a positive resistance temperature coefficient and housed in the container, and contact springs of feeding devices having conduction and resilience configured to press the resistor to establish connection with the resistor. The contact springs each include a body, two arms extending from the body, and spaced press-fit contacts extending from the arms to press the resistor. The press-fit contacts of one of the contact springs and the press-fit contacts of the other are arranged in crossed directions. Thus, a broken fragment of the resistor is not pinched between the contact springs even when the resistor pinched is broken.
    Type: Grant
    Filed: June 13, 2006
    Date of Patent: April 21, 2009
    Assignee: Sanyo Electric Co., Ltd.
    Inventor: Masahide Kobayasi
  • Patent number: 7504606
    Abstract: An apparatus for separating fluid flows in a heating device, particularly for heating the interior of a motor vehicle is proposed, the heating device having at least one heater equipped with a plurality of lamellar heat emission or delivery elements. In order to ensure an easy, inexpensive separation of several fluid flows and in particular also downstream of the heater equipped with the lamellar heat emission elements, according to the invention a substantially plate-shaped separator is provided having an opening with a contour adapted for the pushing of the separator onto the heater equipped with the lamellar heat emission elements. The invention also relates to a method for separating several fluid flows in a heating device of the aforementioned type.
    Type: Grant
    Filed: May 3, 2005
    Date of Patent: March 17, 2009
    Assignees: Eichenauer Heizelemente GmbH & Co. KG, Beru AG
    Inventors: Andreas Hamburger, Christian Dörrie
  • Publication number: 20090065495
    Abstract: Connector bushings are crimped to the terminal ends of tubular electrical heating elements for heating equipment, particularly equipment intended for use in hazardous environments, e.g. where there is a risk of explosion.
    Type: Application
    Filed: October 23, 2006
    Publication date: March 12, 2009
    Applicant: CCI Thermal Technologies Inc.
    Inventors: Michael Arbour-Neagoe, Chris Duggan, Eric Anzinger
  • Publication number: 20080266047
    Abstract: A power resistor module for electrical circuits has at least one resistor element and at least one housing element. The at least one resistor element is mounted at least section-wise between two electrically insulating, thermally conductive insulation elements in the housing element. The insulation elements at least section-wise abut against the at least one housing element. Methods for producing an electrical power resistor module for an electrical circuit include compressing, at least one resistor element with two electrically insulating, thermally conductive insulation elements. At least one of the two insulation elements is pressed at least section-wise against a housing element. If a wire is used as the resistor element, the use of possible fillers such as magnesium oxide may be waived by providing that the wire abuts at least section-wise against at least one of the two insulation elements during the compression.
    Type: Application
    Filed: March 12, 2008
    Publication date: October 30, 2008
    Applicant: DBK David + Baader GmbH
    Inventors: Leonhard Vetter, Norbert Buchlaub
  • Patent number: 7420454
    Abstract: A resistive element in the form of a bent metal plate is placed in a box-shaped case and has electrodes exposed out of the box-shaped case. A heat radiator in the form of a bent metal plate is also placed in the box-shaped case and has heat radiating electrodes exposed out of the box-shaped case. The resistive element and the heat radiator are held out of contact with each other and disposed in criss-cross relation to each other. The box-shaped case is filled with a cement material in surrounding relation to the resistive element and the heat radiator.
    Type: Grant
    Filed: May 4, 2007
    Date of Patent: September 2, 2008
    Assignee: KOA Corporation
    Inventors: Katsumi Takagi, Koichi Hirasawa
  • Patent number: 7190252
    Abstract: An electrical resistor is provided with a resistive element and terminations extending from opposite ends of the resistive element. The terminations are folded under the resistive element, with a thermally conductive and electrically insulative filler being sandwiched and bonded between the resistive element and the terminations. The terminations provide for mounting of the resistor to an electronic circuit assembly. The intimate bond between the resistive element, filler and terminations allow for enhanced dissipation of heat generated in the use of the resistive element, so as to produce a resistor which operates at a lower temperature, and improves component reliability.
    Type: Grant
    Filed: February 25, 2005
    Date of Patent: March 13, 2007
    Assignee: Vishay Dale Electronics, Inc.
    Inventors: Clark L. Smith, Thomas L. Veik, Todd L. Wyatt, Thomas L. Bertsch, Rodney Brune, William Mac Arthur
  • Patent number: 7161461
    Abstract: A trim resistor assembly includes a trimmable resistor element embedded within a polymeric housing. The trimmable resistor element includes trimmable resistive film disposed on a nonconductive substrate. Lead wires are connected to contact pads on the substrate. The resistor element and wires are pre-assembled and placed within a mold defining a cavity. The mold includes a pedestal that covers a central region of the substrate that includes the trimmable resistive film. A polymeric material is injected into the cavity to form an integrally molded body that is the polymeric housing. In addition to the trim resistor element and the bare end sections of the wires, the section of the wires that are adjacent the end sections and include the polymeric sheath are also embedded in the housing to strengthen and seal the joint. The pedestal forms an opening in the housing that exposes the resistive film to provide access for trimming the resistance to a desired value.
    Type: Grant
    Filed: March 7, 2006
    Date of Patent: January 9, 2007
    Assignee: Delphi Technologies, Inc.
    Inventor: Charles Scott Nelson
  • Patent number: 6541137
    Abstract: A dielectric film is formed on a free-standing conductive metal layer to form a multi-layer foil comprising a conductive metal layer, a barrier layer and a dielectric oxide layer. Such multi-layer foils are mechanically flexible, and useful for the manufacture of capacitors. Examples of barrier layers include Ni—P or Ni—Cr alloys. After a second layer of conductive metal is deposited on a dielectric oxide surface opposing the first conductive metal layer, the resulting capacitor foil is processed into a capacitor. The resulting capacitor is a surface mounted capacitor or is formed as a integrated or embedded capacitor within a circuit board.
    Type: Grant
    Filed: July 31, 2000
    Date of Patent: April 1, 2003
    Assignee: Motorola, Inc.
    Inventors: Angus Kingon, Gregory J. Dunn, Stephen Streiffer, Kevin Cheek, Min-Xian Zhang, Jon-Paul Maria, Jovica Savic
  • Patent number: 6535105
    Abstract: An electronic device and process of making the device is disclosed. The device includes a multi-sided body defined by a plurality of electrode plates arranged in a stack. A resin layer is applied to both conductive and semiconductive regions of the device, and metal is plated upon terminals to create a conductive element. The device may be a varistor, thermistor, resistor, or other microelectronic component having a multi-sided body and terminal structures that are capable of receiving a resin coating. The multi-sided body has a resin coating on at least a portion of an exterior surface, the resin coating substantially preventing plating of metal onto the exterior surface of the body. One suitable resin coating that may be employed is a thermoset resin comprising a B-staged divinylsiloxane-bis(benzocyclobutene)(i.e. “BCB”) resin dissolved in mesitylene solvent.
    Type: Grant
    Filed: March 16, 2001
    Date of Patent: March 18, 2003
    Assignee: AVX Corporation
    Inventors: Robert H. Heistand, II, John L. Galvagni, Jeffrey P. Mevissen, Robert Moffatt Kennedy, III
  • Publication number: 20020109575
    Abstract: A ceramic chip-type device having a glass coating film and a fabricating method thereof are provided, in which a coating film having an excellent acid-resistant property is formed on the surface of the ceramic chip device. Thus, the ceramic chip-type device having a glass coating film stands an attack due to a flux at the time of reflow soldering, to thereby maintain an initial insulation resistance. The ceramic chip-type device is made of a ceramic passive device chip including a pair of external electrode terminals on either end of the ceramic chip-type device, and a glass coating film of an excellent acid-resistant property formed on the surface of a ceramic body located between the pair of external electrode terminals.
    Type: Application
    Filed: April 23, 2001
    Publication date: August 15, 2002
    Inventors: Jun Hwan Jeong, Seung Chul Lee, Hyun Choi
  • Publication number: 20010035810
    Abstract: An electronic device and process of making the device is disclosed. The device includes a multi-sided body defined by a plurality of electrode plates arranged in a stack. A resin layer is applied to both conductive and semiconductive regions of the device, and metal is plated upon terminals to create a conductive element. The device may be a varistor, thermistor, resistor, or other microelectronic component having a multi-sided body and terminal structures that are capable of receiving a resin coating. The multi-sided body has a resin coating on at least a portion of an exterior surface, the resin coating substantially preventing plating of metal onto the exterior surface of the body. One suitable resin coating that may be employed is a thermoset resin comprising a B-staged divinylsiloxane-bis(benzocyclobutene)(i.e. “BCB”) resin dissolved in mesitylene solvent.
    Type: Application
    Filed: March 16, 2001
    Publication date: November 1, 2001
    Inventors: Robert H. Heistand, John L. Galvagni, Jeffrey P. Mevissen, Robert Moffatt Kennedy
  • Patent number: 6208233
    Abstract: An improved IDC trim resistor connector assembly made up of a generally open top cup shape connector with side wall slots and an interior first array of terminal posts arranged for passage therethrough of a first lead wire of sensor circuitry. A first stamped metal IDC terminal is push-on mounted on the terminal posts for IDC cradling and electrically and mechanically receiving and connecting to the first lead wire. A conventional trim resistor substrate is loose mounted but accurately positioned on the connector bottom wall and has an “E” pattern of resistive material adapted for center leg laser trimming to calibrate the associated sensor circuitry. A first IDC terminal spring leg overlap contacts one side leg of the trim resistor E-pattern and thereby spring clamps the resistor substrate. A cover is snap-latch mounted on the connector and has an access opening to enable laser trimming of the trim resistor after cover installation.
    Type: Grant
    Filed: March 3, 2000
    Date of Patent: March 27, 2001
    Assignee: Delphi Technologies, Inc.
    Inventors: William L. Stein, Sr., Rick Loutzenhiser, Mark D. McCall
  • Patent number: 6140908
    Abstract: A focus volume of an FBT (fly back transformer) focus unit and its coupling device are disclosed, in which a volume board is provided in a small size, but the voltage breakdown resisting strength is reinforced. At least one or more round resistor patterns 130 are formed on a volume board 120 which is installed within a focus volume 100 of the FBT focus unit 110. An opening 140 is formed within each of round portions of the resistor patterns 130, and a volume case 180 has a pair of isolating walls 160 within its interior 170, for being inserted into the opening 140 of the volume board 120. The volume case 180 is installed on a side of an FBT case 150. Thus the volume board is made to have a small size, but its voltage breakdown resisting strength is reinforced. Therefore, the filling of an epoxy resin is not required, thereby simplifying the manufacturing process, and making it easy to manufacture the product.
    Type: Grant
    Filed: March 25, 1999
    Date of Patent: October 31, 2000
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventor: Dae Sung Choi
  • Patent number: 5961868
    Abstract: An electrical heater for heating an object having a generally cylindrical outer surface has a helicoidal coil having a plurality of turns centered on an axis and inner and outer ends and adapted to fit around the object in contact with the outer surface thereof. A source of electricity is connected to the inner end for supplying electricity thereto and thereby heating the coil. An anchor fixed on one of the turns adjacent the outer end is connected to an element extending to the anchor for drawing the outer end and anchor together and thereby reducing an inside diameter of at least an outer turn of the coil and tightening the outer turn around the object around which the coil is fitted.
    Type: Grant
    Filed: June 5, 1998
    Date of Patent: October 5, 1999
    Assignee: Hotset Heizpatronen U. Zubehor GmbH
    Inventor: Eugen Schwarzkopf
  • Patent number: 5910189
    Abstract: It is aimed to present a liquid level detector that can be assembled by simply stacking component parts one upon another, without using any soldering work at all. In the liquid level detector, a thermistor (7) is placed on an electrode (2a) of element holder (2) and is pressed by an electrode (3a) of a terminal (3), a coil spring (4) is inserted around the terminal (3) for the electrode (3a) to press the thermistor (7). An insulator (5), with which a terminal member (6) is calked together in advance, is placed to a fitting portion (2c) of the element holder (2), and then the entire assembly is inserted from the opening into a metal case (1), so that the opening is closed with the insulator (5) calked by a fitting portion (1a) of case (1) and the fitting portion (2c) of element holder (2) aligned to an indention (5c) of insulator (5).
    Type: Grant
    Filed: February 12, 1998
    Date of Patent: June 8, 1999
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Kotaro Suzuki, Kikuo Kainou
  • Patent number: 5811761
    Abstract: A ceramic sheath capable of preventing damage to conductive wire rod exhibits excellent thermal resistance and a thermal shock resistance. A conductive wire rod is provided in a protective pipe of silicon nitride, silicon carbide or SiAlON so as to extend longitudinally from one end toward the other, and buried in a filler of reaction sintered silicon nitride. The filler comprises two layers, i.e. a core portion having a low sintering time size variation ratio, and a seal portion constituting a boundary layer between the core portion and the protective pipe and having a sintering time size variation ratio higher than that of the core portion. The conductive wire rod comprises a coil of a metal wire. The coil is formed helically along its whole length, and the winding pitch of the coil is set small, large and small in this order from the front end portion of the shell of the protective pipe toward its base end portion.
    Type: Grant
    Filed: April 10, 1996
    Date of Patent: September 22, 1998
    Assignee: Isuzu Ceramics Research Institute Co., Ltd.
    Inventors: Hideki Kita, Hisataka Numao, Hideo Kawamura
  • Patent number: 5621378
    Abstract: A power resistor having much improved heat dissipation ability to an underlying heatsink because a step or protuberance is provided that cooperates with the mounting bolt or screw to largely nullify the effects of molding-caused camber or curvature.
    Type: Grant
    Filed: April 20, 1995
    Date of Patent: April 15, 1997
    Assignee: Caddock Electronics, Inc.
    Inventors: Richard E. Caddock, Jr., Richard E. Caddock
  • Patent number: 5430429
    Abstract: A resistor 1 in which at least one resistance film 4 is embedded in a ceramic sintered body 3, glass is diffused into the sintered body 3 to form a glass diffusion layer 6, and both end faces 4a and 4b of the resistance film 4 are respectively exposed to both end faces 3a and 3b of the ceramic sintered body 3.
    Type: Grant
    Filed: September 27, 1993
    Date of Patent: July 4, 1995
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Kazutaka Nakamura, Hiroyuki Kubota, Yasunobu Yoneda, Akinori Nakayama, Tohru Tominaga, Tomoaki Ushiro
  • Patent number: 5300917
    Abstract: A junction box incorporating an integrally formed shunt busbar. The shunt busbar incorporates a first pair of terminals to act as leads to couple the shunt busbar in a current loop of a circuit, and a second pair of terminals to couple a voltage sensing device across a portion of the shunt busbar. The voltage sensing device is preferably a high input impedance voltage comparator. The input impedance of the voltage comparator is great enough to negate the affect of the internal resistance of the mating terminals of the busbar. Furthermore, the second pair of terminals is located on the shunt busbar such that the terminal resistances thereof are outside of the current loop. The electrical busbar is preferably mounted in a suitable insulating housing. When the shunt busbar of the present invention is connected to the high input impedance voltage comparator, a circuit path that allows for easily and accurately measuring the voltage drop across the busbar is made possible.
    Type: Grant
    Filed: January 15, 1993
    Date of Patent: April 5, 1994
    Inventors: H. Winston Maue, Zenon Hotra, Tomoyuki Yamai
  • Patent number: 5291178
    Abstract: A film-type resistor having a high power rating and a relatively low manufacturing cost. The structural strength of the resistor is derived primarily from a molded body that covers both a film-coated substrate and a heatsink. The heatsink, to which the substrate is bonded in high thermal-conductivity relationship, has an exposed flat bottom surface of relatively large area.
    Type: Grant
    Filed: March 17, 1992
    Date of Patent: March 1, 1994
    Assignee: Caddock Electronics, Inc.
    Inventors: Milton J. Strief, David L. Martin
  • Patent number: 5278939
    Abstract: A vacuum-molded electrical radiant heating unit having a resistance heating coil embedded in a ceramic fiber body is prepared by a process in which a resistance heating coil (5) is placed on a sieve-like tray (1), above a suction box, and a slip is applied thereto composed of ceramic fibres, so that a ceramic fibre layer (4) builds up under the action of suction. Portions of the sieve-tray (1) are closed, in regions beneath the resistance heating coil (5) by means of spacing strips (11). These strips, which cover some of the perforations in the sieve-tray (1), are placed beneath the resistance-heating coil (5), in a manner such that the impervious regions of the sieve tray (1) are narrower than the width dimensions of the heating coil (5).
    Type: Grant
    Filed: April 10, 1992
    Date of Patent: January 11, 1994
    Assignee: Kanthal GmbH
    Inventors: Josef Boes, Leo Saris
  • Patent number: 5210517
    Abstract: A self-resetting overcurrent protection element uses an element body made up of a mixture of polymers and carbon black grafted with polymers. A resilient sheathing material covering the element body permits free expansion of the element body to permit the resistance of the overcurrent protection element to increase substantially in response to Joule's heating from high current. The sheathing materials preferably are made of elastic epoxy resins or silicone resins that allow significant expansion of the element body at the time of overcurrent protection, thus increasing the ratio of resistance in the element between an overcurrent state and a normal operating state.
    Type: Grant
    Filed: June 3, 1991
    Date of Patent: May 11, 1993
    Assignee: Daito Communication Apparatus Co., Ltd.
    Inventor: Toshiaki Abe
  • Patent number: 5196678
    Abstract: A radiant heater with partly embedded and otherwise projecting heating coils (16) is produced in that the coils (16) are placed in grooves (14) of a tool or mould (13), the interior of the heating coils is partly filled with a filling material (17) and then the dry, pourable insulating material is pressed thereon. Thus, the filling material forms a counter-die and is removed on taking the compressed insulator (21) out of apparatus (11) in that it drops between the heating coils.
    Type: Grant
    Filed: April 24, 1991
    Date of Patent: March 23, 1993
    Assignee: E.G.O. Elektro-Gerate Blanc u. Fischer
    Inventor: Leonhard Doerner
  • Patent number: 5189387
    Abstract: A nonlinear resistive surface mount device for protecting against electrical overvoltage transients is disclosed which includes a pair of conductive sheets and a foldback switching material disposed between the pair of conductive sheets. This configuration serves to connect the conductive sheets by a foldback switching mechanism thereby providing predetermined resistance when the voltage between the conductive sheets exceeds a predetermined voltage.
    Type: Grant
    Filed: July 11, 1991
    Date of Patent: February 23, 1993
    Assignee: Electromer Corporation
    Inventors: Richard K. Childers, John H. Bunch
  • Patent number: 5153555
    Abstract: There is disclosed an electronic device comprising a plate-shaped electronic element having electrode films. The electronic element is elastically supported by spring members in an electrically insulating case so as to be respectively in contact with the electrode films. Each spring member includes supporting plates opposing to the electrode films and spring pieces for being respectively in contact with the electrode films at contact points thereof. Each spring piece is formed integrally with the supporting plate so as to be extended with a curvature toward the electrode film from one end of the supporting plate in the longitudinal direction thereof to the contact point, to be folded by a predetermined angle at the contact point, and to be further extended toward the supporting plate from the contact point without contact with the supporting plate.
    Type: Grant
    Filed: November 28, 1990
    Date of Patent: October 6, 1992
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Hisao Enomoto, Takayo Katsuki
  • Patent number: 5140298
    Abstract: A ceramic base component packaging assembly with high thermal transfer rates. The packaging assembly includes a molded plastic cover that receives spring washers, ceramic pads, resistive elements or other electronic components, and a thermally conductive ceramic base. The spring washers press the electronic elements against the ceramic base ensuring good thermal transfer. The ceramic base is an effective thermal conductor and electrical isolator for the device.
    Type: Grant
    Filed: September 4, 1990
    Date of Patent: August 18, 1992
    Assignee: International Business Machines Corporation
    Inventors: James C. Gordon, Eric P. Lovgren, Herman P. Meyer, Donald P. Rearick
  • Patent number: 5111178
    Abstract: An electrically conductive polymer film composition includes a polymeric resin, an electrically conductive substance intimately mixed in sufficient quantity with the polymeric resin to render the polymeric resin electrically conductive, and particles, such as fibers or spheres of appropriate size, admixed with the polymer composition in sufficient quantity so that in the cured polymer film the particles protrude from the surface of the film and render the surface uneven on a micro scale. The cured polymer film composition of the invention is incorporated in potentiometers and similar electric and electronic devices as a thick film where a contact wiper rides substantially continuously in contact with the protruding fibers.
    Type: Grant
    Filed: June 15, 1990
    Date of Patent: May 5, 1992
    Assignee: Bourns, Inc.
    Inventor: Wayne P. Bosze