Resistance Element Formed As A Coating On Interior Of Casing Or Housing Patents (Class 338/258)
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Patent number: 8987864Abstract: There is provided an array type chip resistor including: a chip body, four pairs of lower electrodes disposed on both sides of a lower surface of the chip body and formed so as to be extended to edges of the chip body, side electrodes formed so that the lower electrodes are extended to sides of the chip body, and a resistor interposed between the lower electrodes on the lower surface of the chip body and electrically connected to the lower electrode through a contact portion, wherein when a width of the side electrode is defined as d1, a distance between adjacent side electrodes is defined as d2, and a height of the side electrode is defined as h, in the case in which d1/d2 is 0.5 to 1.5, a value of h is 4,300/d1 ?m or above and is 0.24d2+87.26 ?m or less.Type: GrantFiled: September 5, 2013Date of Patent: March 24, 2015Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Jung Il Kim, Ha Sung Hwang, Hae In Kim, Ichiro Tanaka, Oh Sung Kwon
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Patent number: 8085551Abstract: The present invention is to provide an electronic component where positional accuracy for arranging members constituting a circuit element such as a resistor element and the like is mitigated and corrosion of a terminal electrode caused by sulfur in the atmosphere is reduced.Type: GrantFiled: March 18, 2008Date of Patent: December 27, 2011Assignee: KOA CorporationInventors: Seiji Karasawa, Koji Fujimoto
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Patent number: 7563024Abstract: For some embodiments, skin temperature of a computer system may be determined by using a network of thermistors and conductors. A thermistor may be positioned at an intersection of two conductors. Current may be supplied to a first conductor. Voltage may be measured at a second conductor. Resistance information associated with the thermistor may be determined. Skin temperature may be determined from the resistance information.Type: GrantFiled: September 28, 2006Date of Patent: July 21, 2009Assignee: Intel CorporationInventors: Efraim Rotem, Rajiv K. Mongia
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Publication number: 20080278278Abstract: The present invention is directed to a thick film patterned resistor on a substrate and to a method of forming it. The method involves providing a substrate with opposed surfaces, where one surface is coated with a layer of a resistor composition. A photoresist is applied over the layer of the resistor composition, and a desired pattern in the photoresist is formed, where the pattern leaves certain regions of the resistor composition layer uncovered by the photoresist. The resistor composition layer which is uncovered by the photoresist is etched under conditions effective to leave a mass of loosely bound resistor particles at regions of the resistor composition which are not covered by photoresist. The mass of resistor particles is then removed from the substrate to produce a thick film patterned resistor on the substrate.Type: ApplicationFiled: July 21, 2008Publication date: November 13, 2008Applicant: Micropen Technologies CorporationInventors: Timothy S. BARGE, Franklyn M. COLLINS
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Patent number: 6631551Abstract: A process for forming stable integrated resistors (14) and capacitors (28) on organic substrates (12). The resistors (14) and capacitors (28) are capable of a wide range of resistance and capacitance values, yet can be processed in a manner that does not detrimentally effect the organic substrate (12) or entail complicated processing. The method generally entails the use of thick-film materials usually of the types used to form resistors and capacitors on ceramic substrates. The thick-film materials are applied to an electrically-conductive foil (20) and then heated to bond the thick-film material to the foil (20) and form a solid resistive or capacitive mass (16/30). The foil (20) is then laminated to an organic substrate (12), such that the resistive/capacitive mass (16/30) is attached to and preferably embedded in the organic substrate (12).Type: GrantFiled: June 26, 1998Date of Patent: October 14, 2003Assignee: Delphi Technologies, Inc.Inventors: Philip Harbaugh Bowles, Washington Morris Mobley, Richard Dixon Parker, Marion Edmond Ellis
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Publication number: 20020047771Abstract: A resistor foil, comprised of a copper layer having a first side and a second side. An intermediate layer having a thickness of between 5 Å and 70 Å is disposed on the first side of the copper layer. A first layer of a first resistor metal having a thickness of between 50 Å and 2 &mgr;m is disposed on the intermediate layer, and a second layer of a second resistor metal having a thickness of between 50 Å and 2 &mgr;m is disposed on the first layer of the first resistor metal. The first resistor metal has a resistance different from the second resistor metal.Type: ApplicationFiled: August 2, 2001Publication date: April 25, 2002Applicant: Gould Electronics Inc.Inventors: Jiangtao Wang, Michael A. Centanni, Sidney J. Clouser
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Patent number: 5998036Abstract: The present invention relates to dielectric materials which may be used in the manufacture of, e.g., low profile heaters. Such dielectric materials comprise at least about 50% of a glass composition having about 35-50% SiO.sub.2, about 30-40% of an alkaline earth metal oxide selected from the group consisting of CaO, MgO, and SrO, about 13--22% Al.sub.2 O.sub.3, and about 0-10% B.sub.2 O.sub.3, the percentages being weight percentages based on the weight of the total glass composition. Certain dielectric compositions of the disclosure have a linear thermal expansion coefficient in the range of about 6.0 to 9.0 ppm/.degree. C.Type: GrantFiled: February 9, 1998Date of Patent: December 7, 1999Inventors: Sidney J. Stein, Richard L. Wahlers, Paul W. Bless, Charles Barclay, Richard B. Tait
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Patent number: 5252943Abstract: A resistor element including a cylindrical ceramic support having two openings open on longitudinally opposite end faces thereof, an electrically resistive layer formed on an outer circumferential surface, a pair of electrical conductors for connecting the electrically resistive layer to an external circuit, each of which has an end portion inserted into a corresponding one of the openings of the ceramic support, and an electrically conductive adhesive filling each opening of the ceramic support, for securing the end portion of the corresponding conductor to the ceramic support. The electrically resistive layer has two integrally formed extensions for covering the opposite end faces of the ceramic support, respectively, and respective inner wall surfaces of the openings of the ceramic support. The conductors are electrically connected to the extensions of the resistive layer by the electrically conductive adhesive filling each opening of the ceramic support.Type: GrantFiled: September 9, 1991Date of Patent: October 12, 1993Assignees: NGK Insulators, Ltd., KOA CorporationInventors: Motoi Kitabayashi, Soya Miyajima, Yasuhito Yajima, Takayuki Ogasawara
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Patent number: 5084694Abstract: A detection element including a cylindrical base body, an electric resistor formed on an outer peripheral surface of the base body, and lead wires attached to ends of the base body. The lead wires are electrically connected to the electric resistor. An electrically thick film is provided over end faces of the base body, an inner peripheral surface and an outer peripheral surface of the base body near each of the opposite ends of the base body, and the lead wires are electrically connected to the resistor at least through the electrically conductive thick film.Type: GrantFiled: June 25, 1990Date of Patent: January 28, 1992Assignee: NGK Insulators, Ltd.Inventors: Toru Kikuchi, Yasuhito Yajima
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Patent number: 4909079Abstract: A heat wire type airflow meter having a resistance element disposed within an airflow, the rate of which is measured, and a detection circuit for producing an airflow rate signal by detecting resistance change of the element depending on the airflow rate, in which the resistance element comprises a heat wire coil, lead wires attached to the heat wire coil at both ends thereof, a ceramic layer covering the heat wire coil and junctions of the heat wire coil and the lead wires to form a cylindrical member in such a manner that the heat wire coil is contained therein coaxially and along an inner surface thereof and a glass layer for coating an outer surface of the cylindrical member.Type: GrantFiled: June 23, 1989Date of Patent: March 20, 1990Assignees: Hitachi, Ltd., Hitachi Automotive Engineering Co., Ltd.Inventors: Yutaka Nishimura, Izumi Watanabe, Hiroshi Yoneda, Hiroatsu Tokuda