Abstract: A multilayer ceramic electronic component includes a ceramic body including a first internal electrode and a second internal electrode disposed to be alternately stacked with a dielectric layer interposed therebetween, a first external electrode connected to the first internal electrode and including a first electrode layer, a first conductive layer, and a first metal layer, a second external electrode connected to the second internal electrode and including a second electrode layer, a second conductive layer, and a second metal layer, and a first coating layer disposed on the ceramic body, the first electrode layer and the second electrode layer, wherein the first coating layer may include an alkyl(meth)acrylate-based polymer.

Abstract: A multilayer ceramic electronic component includes a multilayer body and a protective layer provided at least on a first main surface or a second main surface of the multilayer body, in which the protective layer includes a carbon material, has a carbon content of about 70 atm % or more determined through exclusion of hydrogen, oxygen, and halogen contents, and has a sp3 percentage of about 10% or more as an index of C—C bond type.

Abstract: In a method for manufacturing a shunt resistor, a resistor plate with a first side surface and a second side surface opposite to each other is provided. A first electrode plate and a second electrode plate are respectively pressed onto the first side surface and the second side surface, thereby forming a first connection surface between the first electrode plate and the resistor plate, and a second connection surface between the second electrode plate and the resistor plate. A first conductive module is placed on opposite ends of the first connection surface, and a second conductive module is placed on opposite ends of the second connection surface. Current is applied to the first and second connection surfaces via the first and second conductive modules respectively to weld the first electrode plate and the resistor plate, and to weld the second electrode plate and the resistor plate.

Abstract: The present technology is directed toward a resistor and method of manufacturing the resistor. One or more layers of insulative material are formed on a length of resistive material. Portions of the one or more layers insulative material are removed from the resistive material in a pattern based on a predetermined approximate dimension and predetermined approximate resistance value. A first set of one or more conductive layers are formed on the portions of the resistive material exposed by the insulative coating to form a plurality of conductive pads on the resistive material between the patterned insulative material. The sets of conductive pads are probed to measure a preliminary resistance value between the sets of conductive pads.

Abstract: A chip resistor includes: a resistor body having a front surface and a mounting surface which face in opposite directions; a pair of electrodes which are disposed on both sides of the resistor body with the resistor body sandwiched therebetween and are in electrical conduction with the resistor body; and a protective film covering a portion of the resistor body, wherein a plurality of grooves, which does not penetrate through the resistor body, is formed in the front surface of the resistor body.

Abstract: An electrical heating evaporator for evaporating active substances such as perfumes and/or insecticides, in which the evaporation rate regulator includes an electrical heater resistor for which the power supplied is regulated through a potentiometer constructed on a printed circuit board. The evaporation rate can be adjusted for a wide variety of types of chemical substances, without the need of substantially modifying the design of the device.

Abstract: An anti-sulfurization memory storage device is provided, which includes a connection interface unit, a plurality of volatile memory units and a printed circuit board. The connection interface unit is configured to communicate with a host. The printed circuited board may include a plurality of anti-sulfurization passive components and a protective film. The plurality of anti-sulfurization passive components are configured to control and transmit a current to a plurality of volatile memory units. The protective file is configured to cover the printed circuit board. Wherein, the plurality of anti-sulfurization passive components may include an anti-sulfurization resistor and an anti-sulfurization resistor network.

Abstract: A method of making an electronic device may include forming at least one circuit layer that includes solder pads on a substrate and forming at least one liquid crystal polymer (LCP) solder mask having mask openings therein. The method may also include forming at least one thin film resistor on the LCP solder mask and coupling the at least one LCP solder mask to the substrate so that the at least one thin film resistor is coupled to the at least one circuit layer and so that the solder pads are aligned with the mask openings.

Abstract: [Object] A method for efficiently manufacturing chip resistors is provided. [Means] The method includes the steps of preparing at least three conductive elongated boards 711 made of an electrically conductive material and a resistive member 702 made of a resistive material, arranging the at least three conductive elongated boards 711 apart from each other along a width direction crossing a longitudinal direction in which one of the at least three conductive elongated boards 711 is elongated, forming a resistor aggregate 703 by bonding the resistive member 702 to the at least three conductive elongated boards 711, and collectively dividing the resistor aggregate 703 into a plurality of chip resistors by punching so that each of the chip resistors includes two electrodes and a resistor portion bonded to the two electrodes.

Abstract: A chip resistor includes an insulating substrate, top terminal electrodes formed on top surface of the substrate using silver-based cermet, bottom electrodes, resistive element that is situated between the top terminal electrodes and overlaps them partially, an optional internal protective coating that covers resistive element completely or partially, an external protective coating that covers completely the internal protection coating and partially covers top terminal electrodes, a plated layer of nickel that covers face sides of the substrate, top and bottom electrodes, and overlaps partially external protective coating, finishing plated layer that covers nickel layer. The overlap of nickel layer and external protective layer possesses a sealing property because of metallization of the edges of external protective layer prior to the nickel plating process.

Abstract: A surface mount resistor includes a resistance body, a first protective layer, a heat-transfer layer, a second protective layer and two electrode layers. The resistance body has a first end portion, a second end portion and a central portion between the first end portion and the second end portion. The first protective layer is disposed on the central portion of the resistance body, and the first end portion and the second end portion are exposed. The heat-transfer layer is plated on at least part of the resistance body. The second protective layer is disposed on at least part of the heat-transfer layer. The electrode layers are respectively arranged on the first end portion and the second end portion, and electrically connected with the heat-transfer layer.

Abstract: A chip-like electric component such as a chip resistor is provided, which is easy to manufacture and in which cracks or fractures of an insulating substrate are unlikely to occur. A pair of surface electrodes 21, 23 are formed so that thicknesses of the pair of surface electrodes increase from a resistor layer 13 toward end portions 30 of an insulating substrate 29 in a direction in which the pair of surface electrodes 21, 23 are arranged. A plating reservoir S is formed between one of the surface electrodes 21, 23 and an insulating protective layer 15. When forming at least one plated layer 33, a plated metal pools in the plating reservoir S. The at least one plated layer 33 may work to reduce to some extent a height difference between a soldering electrode portion 21, 23, 27, 33 and the insulating protective layer 15.

Abstract: A non-film based, thermally conditionable light transmitting article is provided. The article includes an adhesively coated resistive wire and a substrate suitably selected for light transmittance. The adhesively coated resistive wire is solely and directly adhesively affixed to the substrate so as to be thereby supported upon and by the substrate. A layer of adhesive, in the form of an adhesive linkage originating from the adhesive of the adhesively coated resistive wire, is present between the resistive wire and the substrate.

Abstract: This is to provide a conductive paste with higher electroconductivity containing, as raw materials: a metallic powder; a thermosetting resin; and a flux-activating compound having a carboxyl group and a phenolic hydroxyl group, which is applicable to the fine pitch-utilization.

Abstract: A chip-like electric component such as a chip resistor is provided, which is easy to manufacture and in which cracks or fractures of an insulating substrate are unlikely to occur. A pair of surface electrodes 21, 23 are formed so that thicknesses of the pair of surface electrodes increase from a resistor layer 13 toward end portions 30 of an insulating substrate 29 in a direction in which the pair of surface electrodes 21, 23 are arranged. A plating reservoir S is formed between one of the surface electrodes 21, 23 and an insulating protective layer 15. When forming at least one plated layer 33, a plated metal pools in the plating reservoir S. The at least one plated layer 33 may work to reduce to some extent a height difference between a soldering electrode portion 21, 23, 27, 33 and the insulating protective layer 15.

Abstract: A surface mount resistor includes a resistance body, a first protective layer, a heat-transfer layer, a second protective layer and two electrode layers. The resistance body has a first end portion, a second end portion and a central portion between the first end portion and the second end portion. The first protective layer is disposed on the central portion of the resistance body, and the first end portion and the second end portion are exposed. The heat-transfer layer is plated on at least part of the resistance body. The second protective layer is disposed on at least part of the heat-transfer layer. The electrode layers are respectively arranged on the first end portion and the second end portion, and electrically connected with the heat-transfer layer.

Abstract: A metal strip resistor is provided. The metal strip resistor includes a metal strip forming a resistive element and providing support for the metal strip resistor without use of a separate substrate. There are first and second opposite terminations overlaying the metal strip. There is plating on each of the first and second opposite terminations. There is also an insulating material overlaying the metal strip between the first and second opposite terminations. A method for forming a metal strip resistor wherein a metal strip provides support for the metal strip resistor without use of a separate substrate is provided. The method includes coating an insulative material to the metal strip, applying a lithographic process to form a conductive pattern overlaying the resistive material wherein the conductive pattern includes first and second opposite terminations, electroplating the conductive pattern, and adjusting resistance of the metal strip.

Abstract: A terminal resistor is provided at the end of a bus formed on a wiring substrate. An insulator having a large dielectric loss angle is provided in the vicinity of the terminal resistor to absorb high frequency electromagnetic waves in the vicinity. This arrangement permits successful transmission of digital signals in the GHz region using a conventional terminal resistor.

Abstract: A terminal resistor is provided at the end of a bus formed on a wiring substrate. An insulator having a large dielectric loss angle is provided in the vicinity of the terminal resistor to absorb high frequency electromagnetic waves in the vicinity. This arrangement permits successful transmission of digital signals in the GHz region using a conventional terminal resistor.

Abstract: A liquid crystal display (LCD) includes an LCD panel providing a surface. A flexible heating system of the invention includes a substantially transparent flexible sheet substrate disposed adjacent the surface of the LCD panel and a substantially transparent resistive heating element formed on the flexible sheet substrate. One or more serpentine shaped thermal sensors are formed in the resistive heating element. Control circuitry coupled to the serpentine shaped thermal sensors and to the substantially transparent resistive heating element and other heaters controls the heating element and other heaters based resistances of the serpentine shaped thermal sensors.

Abstract: A printed circuit board having resistors formed therein. A conductive layer composed of two different metals is provided on top of an insulating layer in a printed circuit board. The first metal layer is highly conductive and the second metal layer is highly resistive. For a major portion of the layer, both layers are connected electrically in parallel so that they provide a highly conductive path. At selected locations throughout the printed circuit board, the highly conductive metal is removed providing only the high resistivity metal to act as a resistor between selected locations in the conductive layer. Many resistors are formed at the same time, thus providing ease of fabrication and precision in resistor values across the entire printed circuit board. Following the formation of the resistor, additional insulating and conductive layers are formed to complete the printed circuit board.

Abstract: A heating element, including a sensor conductor, two resistive conductors, with one resistive conductor arranged on one side of the sensor conductor and an other resistive conductor arranged on an other side of the sensor conductor such that the sensor conductor and the two resistive conductors are substantially parallel and plastic electrical insulation surrounding the sensor conductor and each resistive conductor.

Abstract: Various components of thermal systems are shown molded within a polymer composite sheath, including heaters, sensors, and control circuits. The use of transfer and compression molding allows for the use of thermoset polymers containing very high levels of reinforcement fillers. These improved materials, in turn, create a component with superior thermophysical properties, including high heat flux levels, thermal conductivity, impact resistance, corrosion resistance, and maintenance of mechanical properties at high temperatures (>300° F.). The present invention also allows for wide variety of geometric configurations and the possibility to insert temperature sensors directly in hot zones of heaters.

Abstract: Various components of thermal systems are shown molded within a polymer composite sheath, including heaters, sensors, and control circuits. The use of transfer and compression molding allows for the use of thermoset polymers containing very high levels of reinforcement fillers. These improved materials, in turn, create a component with superior thermophysical properties, including high heat flux levels, thermal conductivity, impact resistance, corrosion resistance, and maintenance of mechanical properties at high temperatures (>300.degree. F.). The present invention also allows for wide variety of geometric configurations and the possibility to insert temperature sensors directly in hot zones of heaters.

Abstract: The present invention discloses a substrate structure for supporting a thin film with specific temperature coefficient of resistance (TCR) thereon. The substrate structure includes a substrate composed of a borosilicate glass. The substrate further includes an interface layer of LaSiONx covering a top surface of the substrate. The substrate supports the thin film includes a platinum thin film thereon. The substrate structure further includes an adhesion anchoring seam disposed as a bonding seam interfacing the thin film to the substrate for securely attaching the thin film to the substrate therein. The bonding seam is disposed on a boundary edge of the thin film and includes a nickel-chromium alloy anchor seam disposed on the boding seam. In a preferred embodiment, the substrate structure includes a protective layer covering and protecting the substrate structure thereunder.

Abstract: An electrically modulatable radiant source includes an essentially planar substrate, a well or hole formed in the substrate, and at least one incandescent filament attached to the substrate. The incandescent filament is aligned with the well or hole and is formed of a metallic compound which readily oxidizes at an operating temperature of the incandescent filament. An oxidation resistant film encapsulates the incandescent filament to prevent the filament from oxidizing. Furthermore, contact pads are formed on the substrate at both ends of the incandescent filament for feeding electric current to the incandescent filament.

Abstract: A resistor element has a ceramic substrate and a metallic resistor coated onto the substrate. The metallic resistor has varied electrical resistance depending on temperature. A pair of leads are electrically connected to the metallic resistor. A plurality of glass layers having different compositions are coated onto the metallic resistor. The second glass layer fills a hole formed in the first glass layer, thereby improving response of the resistor element. The second glass layer has a softening point lower than the first glass layer, thereby small bubbles remain dispersed in each glass layer without aggregation. An outermost glass layer is composed of a glass resisting chemicals or a glass resisting abrasion. An innermost glass layer is composed of a glass containing up to 3 percent by mole of a sum of Na.sub.2 O and K.sub.2 O.

Abstract: An insulating glass layer covers the surface of a thermistor element except at the two end surfaces. The insulating glass layer is partially or fully composed of crystallized glass. A terminal electrode is integrally formed on both end surfaces. The terminal electrodes include a baked-on electrode layer formed from a conductive paste. Layers of nickel and tin or lead/tin are plated onto the baked-on electrode. The insulating glass layer enhances shape-maintainability of the insulating glass layer and the baked-on electrodes, provides a smoother glass surface, resulting in a more aesthetically pleasing thermistor, prevents resistance variance due to plating of the baked-on electrodes and provides a strong anti-breaking strength thermistor. The coefficient of thermal expansion of the glass layer is less than the coefficient of thermal expansion of the thermistor element. This difference in coefficients of thermal expansion tends to help the thermistor element resist stress breakage.

Abstract: A heating element for deodorization contains a metallic substrate, an enamel layer formed on the surface of the metallic substrate, a catalyst layer comprising at least an active alumina, a platinum group metal and a zeolite and formed on the enamel layer, and an electric resistor; the electric resistor being insulated from the environment; and the metallic substrate, the enamel layer, the catalyst layer and the electric resistor being arranged so that heat generated when electric power is applied to the electric resistor is conducted to the catalyst layer through the enamel layer. It can remove unpleasant odor and harmful gases.

Abstract: A heat generator comprising a quartz tube containing an electric resistor and a catalyst coating layer comprising at least active alumina, silica and a platinum group metal, formed on the surface of the quartz tube can heat a material to be heated and the catalyst coating layer itself because of the catalyst coating layer being provided on the surface of the quartz tube. The catalyst coating layer surrounds the quartz tube and thus efficiently absorbs heat from the electric resistor by radiation and heat conductance, whereby the catalyst coating layer can be heated to the activation temperature within a short time. Furthermore, the heat generator also heats air around the heat generator to circulate the air as a convection air stream around the heat generator.

Abstract: An electric heater for heating a workpiece including at least one heat generating wire which generates heat upon application of an electric current thereto, and which has a diameter of not more than 1 mm. Each heat generating wire has a heating portion which is formed by bending so as to at least partially define a heating space. The workpiece to be heated by the electric heater is positioned relative to the heating space, such that the workpiece is spaced apart from the heating portion of the heat generating wire or wires.

Abstract: A detection element including a cylindrical base body, an electric resistor formed on an outer peripheral surface of the base body, and lead wires attached to ends of the base body. The lead wires are electrically connected to the electric resistor. An electrically thick film is provided over end faces of the base body, an inner peripheral surface and an outer peripheral surface of the base body near each of the opposite ends of the base body, and the lead wires are electrically connected to the resistor at least through the electrically conductive thick film.

Abstract: A heat exchange assembly for raising a process fluid, such as ultra-pure, de-ionized water, to an elevated temperature without adversely affecting the quality thereof includes coaxially-arranged inner and outer pipes, the annular space therebetween defining a flow passage for the fluid to be heated. The inner pipe is formed of high-strength metal of good thermal conductivity and encloses a heat source, such as steam, circulating heated fluid or an electric heater. The inner pipe is ensheathed by an extruded heat-shrinkable plastic tube of non-reactive material, such as PTFE or polypropylene not exceeding 7 mils in thickness, which is shrunk-fit thereon to form one wall of the flow passage. The opposing wall of the passage is formed by the interior surface of the outer pipe which is also constituted by non-reactive plastic material such as PTFE or polypropylene.

Abstract: An RC composite component with a spark gap comprises a pair of discharge electrodes defining the predetermined spark gap and formed on a dielectric substrate. The discharge electrodes are coated with a film of varnish with a controlled thickness by the screen process.

Abstract: In a film resistor comprising a substrate of insulative material and a film of Cermet formed as resistance material on the substrate, a protective film of insulative material is formed on the surface of the film of Cermet to reduce the temperature coefficient of resistance of the film resistor. The protective film is formed of magnesium fluoride.

Abstract: A process for coating electronic elements comprises the steps of (1) forcibly impregnating an element with a liquid thermosetting resin undercoat, (2) depositing a powdered coating material on the element as a topcoat by electrostatic fluidized bed dip coating the element before the undercoat is dry, and (3) curing the resin by heating.

Abstract: An electrode suitable for use in corrosion conditions is formed with its exposed surface composed of a substantially pore-free material consisting of an acid-resistant, semi-conducting oxide material in a fused glass. Titanium-doped ferric oxide semi-conducting material in a soda-glass or boro-silicate glass is preferred.

Abstract: An infrared emitter panel comprising a body of refractory material, a non-helical continuous heating element of serpentine form embedded within said refractory material and having opposed ends projecting through said refractory material for connection in circuit to a source of electrical power. Said body of refractory material is provided with expansion zones adjacent each of the hair pin-like bent ends of said heating element for allowing unimpeded linear expansion and contraction of said heating element upon energization and de-energization respectively.