Abstract: A resistor comprising a substrate, a pair of first top electrode layers disposed at least on the top face of the substrate, a resistance layer disposed so as to electrically connect with the first top electrode layers, a protective layer disposed so as to cover at least the resistance layer, and a pair of second top electrode layers disposed at least on the top faces of the pair of first top electrode layers. At least one of the pairs of first top electrode layers or second top electrode layers partially extends to the substrate side faces.

Abstract: A conductive polymer PTC device includes upper, lower, and center electrodes, with a first PTC conductive polymer layer between the upper and center electrodes, and a second PTC conductive polymer layer between the center and lower electrodes. Each of the upper and lower electrodes is separated into an isolated portion and a main portion. The isolated portions of the upper and lower electrodes are electrically connected to each other and to the center electrode by an input terminal. Upper and lower output terminals are provided, respectively, on the main portions of the upper and lower electrodes and are electrically connected to each other. The resulting device is, effectively, two PTC devices connected in parallel, thereby providing an increased effective cross-sectional area for the current flow path, and thus a larger hold current, for a given footprint.

Abstract: A metal alloy having an intrinsically low TCR, and which preferably comprises a metal oxide and forms part of the resistance material in a quantity of 15-60 vol. %. The best results are achieved with a resistance material which comprises an alloy of CuNi as the metal alloy and SiO.sub.2 as the high-ohmic component. The resistors exhibit a relatively high resistance value as well as a relatively low TCR value.

Abstract: A thick film resistor assembly comprising: (a) an insulation substrate, (b) a resistor layer being formed on surface of the insulation substrate, (c) a pair of conductor pads comprising a first Ag conductor layer comprising Ag powder and palladium or platinum or mixtures thereof, disposed on the insulation substrate with predetermined spaces from the resistor layer to sandwich the resistor layer in a direction of its conductive resistance path; and (d) a second Ag conductor layer comprising a Ag conductor composition devoid palladium or platinum or mixtures thereof, disposed over the resistor layer and conductor pads at their respective edges to connect electrically the resistor layer to the conductor pads forming a conductive resistance path.

Abstract: A thermistor chip is made by first forming first metal layers with a three-layer structure at both end parts of a thermistor element and then forming second metal layers with a three-layer structure on the first metal layers so as to have edge parts that are formed directly in contact with a surface area of the thermistor element and will reduce its normal temperature resistance value. The first and second metal layers are each of a three-layer structure with a lower layer made of a metal with resistance against soldering heat, a middle layer made of a metal with both wettability to solder and resistance against soldering heat, and an upper layer made of a metal having wettability to solder.

Abstract: A high power resistor includes a substrate of an insulating material having opposed first and second surfaces, and a strip of a resistance material on the first surface of the substrate. The resistance strip has side edges which are spaced from the side edges of the substrate. A contact of a conductive material is at each end of the resistance strip. Each contact extends to a separate end of the substrate, across the end and over a portion of the second surface of the substrate. The portions of the contacts which are on the second surface of the substrate or no longer than the portions of the contacts on the first surface of the substrate. At least one heat sink strip of a conductive material is on the second surface of the substrate. The heat sink strip is of a size that it does not overlap the resistance strip so as to minimize any capacitance between the heat sink strip and the resistance strip.

Abstract: A surface mounted thin film precision voltage divider is provided by incorporating two resistors on a single base of the same size and configuration as prior art surface mounted thin film precision resistors. Because the resistors were made at the same time, using the same materials and under the same conditions, the resistors react substantially equally to changes in temperature, aging, thermal shock, short time overload, high temperature exposure, resistance to bond exposure, moisture resistance, load life and low temperature operation. The voltage divider replaces two conventional surface mounted thin film precision resistors at a fraction of the cost.

Abstract: Circuit protection device having a PTC element in series with a fusible element. The device includes a PTC element having first and second electrodes in electrical contact with the PTC element. An insulating layer is disposed on the first and second electrodes. Portions of the insulating layer are removed to form first and second contact points. A first conductive layer is in electrical contact with the first electrode and wraps around the PTC element. A portion of the first conductive layer forms a fusible element. A second conductive layer is in electrical contact with the second electrode. The wrap-around configuration of the device allows for an electrical connection to be made to both electrodes from the same side of the electrical device. The wrap-around configuration also permits current to flow in series through the PTC element and the fusible element for added protection from overcurrent conditions.

Abstract: Use is made of thermoplastic materials in layered configurations as a thermally stable, rigid but not brittle strip of lengths of six inches to ten feet or more. The layered strip contains layers of conductive fibers in a resin matrix, which, through use of appropriate contact mechanisms and wiring, provide an assembly with an infinite potentiometer scale. The strips are especially useful in linear positioning indicators such as pneumatic and hydraulic cylinder and liquid level gauges. The strips are conductively connected by cutting a bias surface relative to said strips and placing resin thereon.

Abstract: An electrical device having a resistive element having a first electrode in electrical contact with the top surface of the resistive element and a second electrode in electrical contact with the bottom surface of the resistive element. An insulating layer is formed on the first and second electrodes. A portion of the insulating layer is removed from the first and second electrodes to form first and second contact points. A conductive layer is formed on the insulating layer and makes electrical contact with the first and second electrodes at the contact points. The conductive layer has portions removed to form first and second end terminations separated by electrically non-conductive gaps. The wrap-around configuration of the device allows for an electrical connection to be made to both electrodes from the same side of the electrical device.

Abstract: An electrical device comprising a resistive element having a first electrode in electrical contact with the top surface of the resistive element and a second electrode in electrical contact with the bottom surface of the resistive element. An insulating layer is formed on the first and second electrodes. A portion of the insulating layer is removed from the first and second electrodes to form first and second contact points. A conductive layer is formed on the insulating layer and makes electrical contact with the first and second electrodes at the contact points. The conductive layer has portions removed to form first and second end terminations separated by electrically non-conductive gaps. The wrap-around configuration of the device allows for an electrical connection to be made to both electrodes from the same side of the electrical device.

Abstract: Electrical devices, particularly circuit protection devices, contain conductive polymer elements whose edges are formed by breaking the conductive polymer element, along a desired path, without the introduction of any solid body into the element. The resulting cohesive failure of the conductive polymer produces a distinctive fractured surface. One method of preparing such devices involves etching fracture channels in the electrodes of a plaque containing a PTC conductive polymer element sandwiched between metal foil electrodes, and then snapping the plaque along the fracture channels to form individual devices.

Abstract: A chip resistor includes a substantially rectangular substrate of an insulating material having opposed substantially flat top and bottom surfaces and edges extending between the top and bottom surfaces. A layer of a resistance material is on the top surface of the substrate. Separate termination layers of a conductive material are on the top surface or the substrate and contact the resistance layer at opposite ends thereof. Each of the termination layers extends across an edge of the substrate and over a portion of the bottom surface of the substrate. The total area of the portions of the termination layers on the bottom surface of the substrate is greater than the total area of the portions of the termination layers on the top surface of the substrate so that the spacing between the ends of the portions of the termination layers on the bottom surface of the substrate is smaller than the spacing between the ends of the portions of the termination layers on the top surface of the substrate.

Abstract: An electrical device comprising a resistive element having a first electrode in electrical contact with the top surface of the resistive element and a second electrode in electrical contact with the bottom surface of the resistive element. An insulating layer is formed on the first and second electrodes. A portion of the insulating layer is removed from the first and second electrodes to form first and second contact points. A conductive layer is formed on the insulating layer and makes electrical contact with the first and second electrodes at the contact points. The conductive layer has portions removed to form first and second end terminations separated by electrically non-conductive gaps. The wrap-around configuration of the device allows for an electrical connection to be made to both electrodes from the same side of the electrical device.

Abstract: A resistor network is disclosed which is suited for surface mount which does not incorporate wire terminations. The network is fabricated entirely from cermet, ceramic, and solder, yet will absorb thermal stresses normally associated with circuitry energization when properly mounted upon a substrate. This is accomplished by controlling the formation of solder bumps and simultaneously controlling the mounted distance between those bumps and a wiring substrate upon which the network is mounted. Additionally, the network may be formed to be either a SIP or DIP configuration, depending upon whether an additional groove is incorporated into the termination side of the substrate. Two alternative embodiments are also disclosed which incorporate various features of the invention.

Abstract: An electric tool rheostatic device in a switching arrangement is provided for regulating the speed of an electric motor in an electric tool. A circuit board for receiving electronic components is disposed in a switch housing. A potentiometer disposed within the switch housing includes a potentiometer slider operatively connected with a manually-operated actuating member and a resistance track that is constituted by a chip resistance element produced independently of the circuit board according to surface mounted device technology and mounted on the circuit board independently of the potentiometer slider. Upon assembly of the switching arrangement the potentiometer slide is adjustably located on the resistance track by the manually-operated actuating member for controlling resistance.

Abstract: A square chip resistor in which, when the protective glass layers are fired, a powder of an inorganic material such as alumina or the like having a greater thermal expansion coefficient than glass is mixed into glass paste to thereby adjust the thermal expansion coefficient of the protective glass layers. This makes it possible to prevent generation of any crack on the glass surface due to a stress produced by a difference between the thermal expansion coefficients of the glass layer and an alumina substrate.

Abstract: A platinum temperature sensor includes a meandering pattern portion and outlet portions continuously connected to respective ends thereof which are defined by a platinum film which is formed on an insulating substrate. External electrodes are formed to cover the outlet portions as well as the ends of the insulating substrate provided with the outlet portions. Each of the external electrodes comprises a first layer containing platinum or nickel which is in contact with the outlet portion and with the insulating substrate, a second layer containing silver and platinum which is formed on the first layer, a third layer containing nickel which is formed on the second layer, and a fourth layer containing tin or solder which is formed on the third layer. The first layer suppresses diffusion of silver contained in the second layer, and the third layer improves heat resistance of the second layer, while the fourth layer improves solderability.

Abstract: Disclosed herein is a chip-type network resistor characterized in that resistance layers are formed between a common electrode extending across an insulative substrate and each of a plurality of separate electrodes disposed in the opposite sides of the insulative substrate used to support the common electrode, and overcoat layers are provided to cover the resistance layers and positioned to expose the common electrode, whereby the plating process is applied to the common electrode and the separate electrodes.

Abstract: A nonlinear resistive surface mount device for protecting against electrical overvoltage transients is disclosed which includes a pair of conductive sheets and a foldback switching material disposed between the pair of conductive sheets. This configuration serves to connect the conductive sheets by a foldback switching mechanism thereby providing predetermined resistance when the voltage between the conductive sheets exceeds a predetermined voltage.

Abstract: An end terminated high power chip resistor-printed circuit board assembly (9) suitable for use in applications requiring miniature surface mount resistors capable of high power dissipation. An end terminated high power chip resistor (8) is constructed by coating a portion of the bottom of an end terminated chip resistor with a conductive plate (12). The end terminated high power chip resistor (8) is mounted to a printed circuit board having at least one via (23) lined with metal (20) wherein the conductive plate (12) is positioned above the via (23) lined with metal (20). A heat sink (16) is mounted to the printed circuit board opposite to the side to which the end terminated high power chip resistor (8) is mounted and is in contact with the metal (20) lining via (23).

Abstract: A leadless electrical resistor (40), comprising a parallelepiped dielectric body (42), or chip, having a resistive film element (44) on one face. A pair of conductive terminations (46) are connected to opposite ends of the resistive element in order to form a chip resistor. A second resistive film element (54) is formed on the opposing face of the dielectric body in a direction perpendicular to the first resistor. A second pair of conductive terminations (56) are connected to opposite ends of the second resistive element (54) in order to form a second resistor on the back side of the chip. The terminations of the second resistor are on adjacent sides of the chip body compared to the terminations of the first resistor, thus forming a chip resistor (40) having two resistive elements (44 and 54) with terminations (46 and 56) on the four vertical walls of the chip.

Abstract: The chip form electrical resistance is designed to be soldered notably on a printed circuit card or on an hybrid circuit substratum. It includes an electrically insulating substratum (1) of the ceramic type, to which is attached by a layer of adhesive organic resin (2) a sheet of metal or of resistive alloy (3) which is engraved to provide a sinuous resistance. The layer of resin (6) leaves in the area of the two opposite sides of the substratum (1), two free areas (5), at the extremities of the engraved resistive sheet (3).

Abstract: A resistor device includes a thick-film resistor which includes a mixture of electrical conductive material and glass, and which has the electrical conductive material at a surface portion exposed; and electrodes which are deposited on the thick-film resistor to be connected to the exposed electrical conductive material.

Abstract: A process of automatic sequential production of potentiometers, and potentiometers obtained thereby. The potentiometers are generally low profile rotary-type potentiometers. The potentiometers are formed with a low profile cylindrical casing into which is inserted a laminate electrical resistance element of an incomplete annular shape, the ends of which remain connected to terminals. The casing engages a slider, which is in permanent mechanical and electrical contact with the resistance element and a collector terminal. The slider is assembled on a slider-holder rotatably attached through an aperture formed axially through the body and which is operable from the external surface of the casing. The process consists of automatically assembling the potentiometers in an in-line process. The metallic components are formed on a continuous metallic band by die-cutting the band to produce such components.

Abstract: A metal film resistors consisting of an Ni-Al alloy with an Al content of at least 14.5 and at most 22% by weight with a maximum of 2.5% by weight of compatible contaminants are disclosed. Those can be used in the resistance range between 0.5 Ohm and 5 KOhm, are very stable and can be obtained with a low temperature coefficient of the resistance below .+-.50 ppm/.degree. C. between -55.degree. C.-+150.degree. C.

Abstract: The present invention provides a voltage-dependent resistor of the bulk-type in which zinc oxide (ZnO) powder and additives are admixed to form a sintered body composition having as the main constituent, zinc oxide, and in which the mixture is formed into a resistor body, the body is sintered, and electrodes are applied to the opposite surfaces of the sintered body, the improvement comprising the step of, prior to sintering and admixture with said zinc oxide, admixing all amount of boron oxide (B.sub.2 O.sub.3) with other additives in the form of a borosilicate glass, which is composed of 5 to 30 weight percent of boron oxide (B.sub.2 O.sub.3) and 70 to 95 weight percent of silicon oxide (SiO.sub.2). A process for the production of said resistor is also provided.

Abstract: A device for measuring the mass of a flowing medium. The device includes a flat carrier to which at least one resistor layer is applied. Electrical conductor connections extending in alignment with one another are fixed on one end, with ends in elastic holder bodies and oriented with ends toward the carrier. On the other end, the ends of the electrical conductor connections rest with support segments each on one end face of the carrier and with fastening segments partially encompassing and gripping the carrier. The fastening segments are soldered or welded to a connecting layer or directly to the temperature-dependent resistor. As a result, the soldered or welded connection is held in a flexion-free and thrust-free manner on the fastening segments.

Abstract: A resistor, which can be of either the fixed or variable type, having a metal base covered by an insulating coating over all but an exposed area of the metal. A film type resistive compound or a wire winding covers the insulating coating but overruns it in the exposed area of the metal base and is bonded to the metal base. A suitable conventional terminal member is in conductive relation to the resistive compound covering at a point remote from the exposed area of the base so that the base, itself, may function as one terminal for the resistor.