Abstract: Hall sensing signals are received in a spinning readout pattern of subsequent readout phases, wherein the pattern is cyclically repeated at a spinning frequency and a polarity of the Hall sensor signals is reversed in two non-adjacent readout phases of the readout pattern. A signal storage circuit includes signal storage capacitors. An accumulation circuit includes accumulation capacitors. A switch network is selectively actuated to couple the signal storage capacitors with the accumulation capacitors synchronously with phases in the spinning readout pattern in subsequent alternating first and second periods. The spinning output is stored with alternating opposite signs on the signal storage capacitors and the Hall sensing signals are stored in the signal storage capacitors and then accumulated on the accumulation capacitors with alternate signs in subsequent periods. The accumulated output signal is then demodulated with a demodulation frequency half the spinning frequency.

Abstract: A ceramic main body 1 is composed of a (Mn,Ni)3O4- or (Mn,Co)3O4-based ceramic material. A first phase has a spinel structure. A second phase is formed of high-resistance plate crystals. The second phase is present in the first phase in a dispersed state. A heated pathway having a predetermined pattern is formed on a surface of the ceramic main body by the application of heat by laser irradiation. In the heated pathway, the second phase disappears and is crystallographically equivalent to the first phase. The plate crystals of the second phase precipitate at 800° C. or lower in the cooling substep during firing. The formation of the heated pathway facilitates the adjustment of the resistance of an NTC thermistor. Thereby, provided are an NTC thermistor ceramic with a resistance that can be easily adjusted to a lower value even after sintering, a method for producing the NTC thermistor ceramic, and an NTC thermistor.

Abstract: A method for manufacturing an over-current protection device comprises a step of providing at least one current sensitive device and a step of pressing. The current sensitive device comprises a first electrode foil, a second electrode foil and a PTC conductive layer physically laminated between the first and second electrode foils. The pressing step is to press the current sensitive device at a predetermined temperature, thereby generating at least one overflow portion at sides of the PTC conductive layer to form the over-current protection device. The predetermined temperature is higher than the softening temperature of the PTC conductive layer. The over-current protection devices manufactured according to the present invention have superior resistance distribution.

Abstract: Embodiments of a resistor are disclosed.

Abstract: The present invention provides a novel method for electrical connection between a polymer PTC device and a metal lead element to thereby prevent the problems of the connection by caulking or soldering. For this purpose, the present invention provides a process for producing a connection structure by laser welding, said connection structure having (A) a PTC device (10) including (i) a laminar polymer PTC element (12) and (ii) a metal foil electrode (14) disposed on a main surface of the laminar polymer PTC element (12), and (B) a metal lead element (20) electrically connected to the metal foil electrode. The metal foil electrode (14) has at least two metal layers, one of which, the X-th layer, has laser beam absorption a % that is the lowest among the metal layers of the metal foil electrode (14). The X-th layer is present between a first metal layer (18) of the metal foil electrode and the laminar polymer PTC element (12).

Abstract: A heater strip for use as a heating element in an electric heater is made up of a profiled strip made of a flat metallic material forming a resistor section and of mounting elements extending over one common longitudinal side and they are manufactured as one piece with the resistor section for mounting the heater strip to a support. The strip has a zigzag-shaped structure. The mounting elements are provided only on the flat leg sections of the zigzag-shaped heater strip.

Abstract: Embodiments of a resistor are disclosed.

Abstract: A method of manufacturing a PTC element comprising a pair of lead terminals bonded together by thermocompression with a matrix held therebetween comprises a matrix preparing step of preparing a matrix constructed by dispersing a conductive filler into a crystalline polymer; a terminal preparing step of preparing a pair of lead terminals holding the matrix therebetween, a surface of each lead terminal facing the matrix being formed with a plurality of anchor protrusions separated from each other; a flattening step of flattening the anchor protrusions formed in respective nonoverlapping areas in the pair of lead terminals kept from overlapping the matrix; and a thermocompression bonding step of holding the matrix between respective overlapping areas in the pair of lead terminals overlapping the matrix, and securing the pair of lead terminals and the matrix together by thermocompression bonding.

Abstract: A microelectronic assembly, including a microelectronic element such as a semiconductor chip and a dielectric material covering the chip and forming a body having a bottom surface. The assembly includes conductive units having portions exposed at the bottom surface, posts extending upwardly from said exposed portions and top flanges spaced above the bottom surface.

Abstract: A metal plate resistor includes a resistive body comprising a metal plate, and at least a pair of electrodes joined respectively to opposite ends of the resistive body, the electrodes being made of a highly conductive metal conductor. The resistive body has a main section positioned between the electrodes and a pair of electrode sections progressively wider than the main section in directions away from the main section. The electrodes are disposed respectively beneath the electrode sections and identical in shape to the electrode sections.

Abstract: A semiconductor resistor comprises a resistor body formed on a semiconductor substrate and first and second conductive terminals electrically connected to the resistor body at opposite ends thereof. The semiconductor resistor further includes at least first and second conductive paths between at least one of the first and second conductive terminals and the resistor body. The at least one conductive terminal is configured such that a resistance of the at least one conductive terminal between the at least first and second conductive paths is substantially matched to a resistance of the resistor body between the at least first and second conductive paths. In this manner, a current distribution between the at least first and second conductive paths is substantially matched.

Abstract: A method of making resistors includes providing a sacrificial layer. Conductive material is then formed over a region of the sacrificial layer. Resistive material is then deposited over the first surface of the sacrificial layer such that the resistive material covers the sacrificial layer and the conductive material. A portion of the sacrificial layer is then removed to expose the conductive material. A method of making resistors includes the steps of providing a sacrificial layer, removing at least a portion of the sacrificial layer from regions of the sacrificial layer so as to create a plurality of cavities within the sacrificial layer, plating said cavities with a conductive material, disposing resistive material over the first surface of the sacrificial layer such that resistive material covers the sacrificial layer and said conductive material, and removing at least a portion of said sacrificial layer to expose the conductive material.

Abstract: A surface-mount positive coefficient thermistor includes a plate-like positive coefficient thermistor element, a pair of electrodes on the respective two main surfaces of the positive coefficient thermistor element, a pair of metal terminals each having a cutout at one end region connected to the corresponding electrode, the metal terminals including a metal having a low thermal conductivity, and solders each connecting the end region of the corresponding metal terminal to the outermost layer of the corresponding electrode. The metal terminal is readily and uniformly soldered to the electrode in a short period of time.

Abstract: A thermistor having multiple metal layers about at least a portion of a semiconductor body. The thermistor includes a first thick film electrode layer, a reactive metal layer, a barrier metal layer and, optionally, a layer to facilitate attachment to an electrical contact. Also, a method of making the thermistor is described.

Abstract: The present invention relates to a resistor and a manufacturing method of the same. The invention aims at providing the resistor and the manufacturing method thereof that can reduce a soldering area that occupies a mount area, when the resistor is mounted on a mount board. In order to achieve the foregoing object, a resistor comprises a substrate (21), a pair of first upper surface electrode layers (22), each provided on a side portion of an upper surface toward a portion of a side surface of the substrate (21), a pair of second upper surface electrode layers (23) provided in a manner to make electrical connections with the first upper surface electrode layers (22), a resistance layer (24) provided in a manner to make electrical connections with the second surface electrode layers (23), and a protective layer (25) provided to cover at least an upper surface of the resistance layer (24).

Abstract: An electrical resistive device in which an element composed of a conductive polymer is positioned in contact with the surface layer of one or more metal electrodes. The metal electrode contains a base layer which includes a first metal, an intermediate metal layer which includes a metal that is different from the first metal, and a surface layer which (i) includes a second metal, (ii) has a center line average roughness {overscore (Ra)} of at least 1.3, and (iii) has a reflection density Rd of at least 0.60. The conductive polymer composition preferably exhibits PTC behavior density requirements, which may be, for example, circuit protection devices or heaters, have improved thermal and electrical performance over devices prepared with electrodes which do not meet the center line average roughness and reflection density requirements.

Abstract: An electrical device in which an element composed of a conductive polymer composition is positioned in contact with the first surface of a metal electrode, the first surface having a center line average roughness Ra and a reflection density RD, the product Ra times RD being at least 0.06 &mgr;m, with an adhesion promoting layer positioned between the first surface of the metal electrode and the polymer element. The conductive polymer composition preferably exhibits PTC behavior. In other aspects, electrical devices using more than one adhesion promoting layer, and electrical devices using an adhesion promoting layer in combination with a crosslinking agent are provided. Other embodiments include electrical devices with metal electrodes made by pulse plating processes, and metal electrodes made by electrodeposition under diffusion-limited conditions. The electrical devices may be circuit protection devices and have improved electrical and physical properties.

Abstract: A low profile mount for a disc varistor. A thermally sensitive switch is provided both for single and multiple electrode embodiments. The switch may be placed in a shorting circuit and include a spring biased conductor prevented from closure by a heat sensitive element which softens in responsive to excessive heat. The varistor may be fused to prevent excessive current from a short circuited but not open circuited varistor. Methods are also provided.

Abstract: A low resistance high current sense resistor is formed on a semiconductor die using conventional semiconductor processing techniques. The resistor die has one or two resistive layers which are photolithographically divided into a plurality of series and parallel resistor sections connected to first and second main terminals. First and second sense terminals are connected across one or a pattern of plural ones of the resistors to produce an output related to the current between the main terminals. Fusible links permit the trimming of the final resistance value.

Abstract: A thermistor with positive resistance-to-temperature characteristic used in a overcurrent protection circuit has electrodes on mutually opposite main surfaces and is mounted to a substrate having electrically conductive members such that deterioration of its voltage resistance due to heat emission can be controlled. A spacer with smaller thermal conductivity than the substrate and penetrated by a conductor piece with a small cross-sectional area is inserted between solder materials connecting to one of the thermistor electrodes. The other electrode is contacted by an elongated connecting member through its sectional surface transverse to its longitudinal direction such that the cross-sectional area of electrical conduction is reduced.

Abstract: Described is a magnetic field sensor with a Hall element and a rectangular change-over switch, which controls the Hall element, dependent upon a timing signal. An active ladder-type filter creates a low pass filtered outlet signal. It uses OTA modules, which work with gyrator switching. By means of a chopper operation, capacitors, dependent on the timing signal, are charged alternately from the outlets of the OTA modules.

Abstract: A magnetic field sensor for measurement of the three components (Bx, By, Bz) of a magnetic field comprises a Hall-effect element (1) and an electronic circuit (22). The Hall-effect element (1) comprises an active area (18) of a first conductivity type which is contacted with voltage and current contacts (2-5 or 6-9). Four voltage contacts (2-5) are present which are connected to inputs of the electronic circuit (22). By means of summation or differential formation of the electrical potentials (V2, V3, V4, V5) present at the voltage contacts (2-5), the electronic circuit (22) derives three signals (Vx, Vy, Vz) which are proportional to the three components (Bx, By, Bz) of the magnetic field.

Abstract: A thermistor device includes a thermistor element body, an ohmic electrode which is provided on a major surface of the thermistor element body with its outer peripheral edge positioned within that of the thermistor element, thereby defining a gap, and an insulating coating which is formed so as to cover a portion where the outer peripheral edge of the ohmic electrode is in contact with the thermistor element body.

Abstract: A thermistor device manufactured at low cost in which atoms of Ag do not migrate substantially into the thermistor body. The device comprises a disk-like thermistor body and annular first electrodes formed in peripheral portions of the front and back surfaces, respectively, of the thermistor body. The first electrodes are made from a conductive material not containing silver. Second electrodes are formed in central portions of the front and back surfaces, respectively, of the thermistor body. The second electrodes are in ohmic contact with the thermistor body, and are made from a conductive material made mostly of silver.

Abstract: A magnetic rotational position sensor senses each rotational position of a control shaft about a first rotational axis over a definable range of rotation of the control shaft. The magnetic rotational position sensor includes a magnetic circuit, a magnetic flux sensor, a drive circuit, and an output signal amplifier. The magnetic circuit encloses an equally balanced magnetic field, and is adjoined to the control shaft to synchronously rotate the magnetic field about a second rotational axis. The magnetic flux sensor is disposed within the magnetic field to sense each rotational position of the control shaft as the control shaft is rotated about the first rotational axis over the definable range of rotation. The drive circuit is operable to generate a constant current drive signal and a constant voltage drive signal.

Abstract: A magnetic field sensor device is disclosed comprising two substantially identical n-doped, high carrier mobility semiconductor films (e.g., InSb films) each containing a pattern of cylindrical holes or antidots that cause the resistance of the respective films to vary depending upon the direction of the in-plane component of an applied magnetic field.

Abstract: A thermistor with positive resistance-to-temperature characteristic used in a overcurrent protection circuit has electrodes on mutually opposite main surfaces and is mounted to a substrate having electrically conductive members such that deterioration of its voltage resistance due to heat emission can be controlled. A spacer with smaller thermal conductivity than the substrate and penetrated by a conductor piece with a small cross-sectional area is inserted between solder materials connecting to one of the thermistor electrodes. The other electrode is contacted by an elongated connecting member through its sectional surface transverse to its longitudinal direction such that the cross-sectional area of electrical conduction is reduced.

Abstract: A resistor network for terminating active electronic devices has low cross talk noise between the adjoining resistors and the conductors that connect the resistors to other electronic packages. A substrate has a top and a bottom surface. Resistors are located on the top surface. Conductors are also located on the top surface and are electrically connected to each end of the resistors. Vias extend through the substrate and electrically connect to the conductors. Solder spheres are positioned on the bottom surface and are electrically connected to the vias. An end of each of the resistors is electrically connected in common through a common conductor. The commoned resistors are electrically connected to a common via through the common conductor. The resistor network minimizes cross talk noise between the resistors and provides a high density interconnection.

Abstract: A thermistor with positive resistance-to-temperature characteristic used in a overcurrent protection circuit has electrodes on mutually opposite main surfaces and is mounted to a substrate having electrically conductive members such that deterioration of its voltage resistance due to heat emission can be controlled. A spacer with smaller thermal conductivity than the substrate and penetrated by a conductor piece with a small cross-sectional area is inserted between solder materials connecting to one of the thermistor electrodes. The other electrode is contacted by an elongated connecting member through its sectional surface transverse to its longitudinal direction such that the cross-sectional area of electrical conduction is reduced.

Abstract: A surface mountable electronic device comprising a body incorporating an electronic device and having a substantially planar mounting surface and another surface extending from the mounting surface, at least one electrical lead extending from the device, and a terminal of conductive material having a first portion fixedly received in the body and extending through the other surface, a second portion extending from the first portion and electrically connected to the lead and a third portion extending along the mounting surface for providing electrical connection to a circuit. A recess preferably is provided in the other surface of the body for receiving the first portion of the terminal.

Abstract: A chip resistor includes a resistor body, a wire-bonding electrode, and a soldering electrode respectively disposed on a first major surface and a second major surface of the resistor. Two electrodes are electrically connected to each other only through the resistor body. The resistor body includes an insulating substrate having a resistance layer printed on both its major surfaces and one of its side surfaces. The resistor body may include a semiconductor material. A semiconductor device having the chip resistor in which a wire from an electronic component is directly bonded to the wire-bonding electrode of the chip resistor is also disclosed.

Abstract: A magnetic field sensing device for simultaneously measuring all components of a magnetic field is disclosed. The present invention includes a conductive stack formed in a semiconductor substrate, where the conductive stack includes some ion-implanted layers abutting to each other, and each of the ion-implanted layers has a different and decreasing dosage level down to the bottom layer. The present invention also includes a first conductive contact on a first end of the top layer surface of the ion-implanted layers, and a second conductive contact on a second end of the top layer surface of the ion-implanted layers. A current flows into the first conductive contact and leave the second conductive contact, so that a horizontal magnetic field that exerts on the magnetic field sensing device is measured.

Abstract: Laminar electrical devices, in particular circuit protection devices, contain two laminar electrodes, with a PTC element between them, and a cross-conductor which passes through the thickness of the device and contacts one only of the two electrodes. This permits connection to both electrodes from the same side of the device. The device also includes layers of solder on the areas of the device through which connection is made, and separation and/or masking members which (a) reduce the danger of short circuits formed by solder flow during installation of the device and/or (b) provide a site for permanent marking of the device.

Abstract: A conductive polymer device includes an active element comprising a conductive polymeric layer laminated between a pair of electrodes to which terminal leads are attached. The active element is enclosed in an insulative package. Each of the electrodes may be formed integrally with its associated terminal lead in a single lead frame, with a layer of conductive polymeric material laminated between two such lead frames. Alternatively, a conductive polymeric layer may be laminated between two electrodes, with a terminal lead then being soldered to each electrode. The insulative package for the active element may be either an over-molded housing encasing the active element, or a pre-molded housing having a cavity into which the active element is installed, and which is then hermetically sealed with a suitable sealant material.

Abstract: An organic PTC thermistor having a positive temperature coefficient of resistivity, which comprises a PTC composition comprising an organic polymer having dispersed therein a conductive substance, and at least one pair of electrodes, wherein the conductive substance is tungsten carbide powder; or the electrodes each comprise a metal mesh and a metal layer.

Abstract: In a positive temperature coefficient thermistor, a terminal holding member is provided between an outer casing and an elastic terminal electrically connected to the semiconductor ceramic element. The terminal holding member is formed of a thermoplastic resin having a low softening point. Consequently, when an abnormally large amount of heat is generated in the semiconductor ceramic element, the terminal holding member melts and deforms, causing the semiconductor ceramic element to be separated and thereby electrically disconnected from the terminal.

Abstract: An electronic component device includes an electronic component element 13 that is interposed between a pair of spring terminals 14 and 15. The electronic component element 13 is resiliently held by the spring terminals 14 and 15, and contact portions 17 and 18 of the spring terminals 14 and 15, which are respectively brought into contact with electrodes 13b and 13c of the electronic component element 13, are positioned on both major surfaces of the electronic component element 13 so as not to be opposed to each other. At least one groove of a set of grooves 16a to 16c is formed on at least one of the major surfaces of the electronic component element 13 for guiding the direction in which the electronic component element 13 is divided when the electronic component element 13 is destroyed by, for example, an abnormal voltage.

Abstract: A thermistor includes a plate-like thermistor body and a first and a second electrode formed on each of the main surfaces of said plate-like thermistor body. The first electrode is formed so that its outer periphery reaches the outer peripheral edge of the thermistor and the second electrode is formed to extend from the area encircled by said first electrode onto the first electrode but not reach the outer periphery of the first electrode. The first and second electrodes are made of material which can make an ohmic-contact with the main surface of said thermistor body. The first electrode is made of the material which is hard to generate inter-electrode migration and said second electrode is made of the material which is easy to generate the inter-migration compared with the first electrode. Thus, the thermistor can prevent short-circuiting due to inter-electrode migration without deteriorating the characteristic such as a current capacity.

Abstract: A rotational position detecting sensor such as a cylinder discriminating sensor, which is capable of detecting the rotational position of a rotor from immediately after the rotor starts to rotate as at an engine start, arranged such that when used as a cylinder discriminating sensor using a rotor for cylinder discrimination having a tooth formed around a semicircular portion thereof and a groove formed around another semicircular portion thereof, at an engine start, a binary output DO is set forcedly regardless of the positional relation between the rotor and the pick-up means, and then, if a difference Sn=Di-Dr as a result of comparison between the magnetic output Di resulting from rotation of the rotor and a reference value Dr is equal to and larger than 0, the difference most significant bit signal Sn(MSB) is set to "0", or if the difference Sn is less than 0, the Sn(MSB) is set to "1", and if the difference signal Sn is larger than a hysteresis width HYS, the binary output DO is set again, and when the si

Abstract: An insulating glass layer covers the surface of a thermistor element except at the two end surfaces. The insulating glass layer is partially or fully composed of crystallized glass. A terminal electrode is integrally formed on both end surfaces. The terminal electrodes include a baked-on electrode layer formed from a conductive paste. Layers of nickel and tin or lead/tin are plated onto the baked-on electrode. The insulating glass layer enhances shape-maintainability of the insulating glass layer and the baked-on electrodes, provides a smoother glass surface, resulting in a more aesthetically pleasing thermistor, prevents resistance variance due to plating of the baked-on electrodes and provides a strong anti-breaking strength thermistor. The coefficient of thermal expansion of the glass layer is less than the coefficient of thermal expansion of the thermistor element. This difference in coefficients of thermal expansion tends to help the thermistor element resist stress breakage.

Abstract: A chip-type ceramic element contains a terminal electrode at each end and an inorganic insulating layer on the surface of the ceramic element between the electrodes. The terminal electrodes include a baked electrode formed from a conductive paste reacted with the material of the inorganic insulating layer. Layers of nickel and tin are plated on the baked electrode for improved heat resistance and soldering adhesion, respectively. The insulating layer prevents unwanted portions of the terminal electrodes from coming into contact with the ceramic element, thereby preventing dispersion in the resistance values of the element.

Abstract: An apparatus and method is provided for dividing a voltage with a resistor voltage divider and for employing the voltage divider in an integrated circuit. The resistor voltage divider utilizes inaccessible compensation taps that are placed between nonlinearly spaced output taps. The compensation taps reduce the impact of tap resistance on the voltage divider transfer function. The number of inaccessible compensation taps placed between output taps is dependant upon a chosen tap density that is substantially maintained across the body of the resistor voltage divider. The resistor may be used in integrated circuits employing amplifiers, such as volume control circuitry.

Abstract: A positive characteristic thermistor, in which the outer periphery of a first electrode including a metal other than silver as its main component is positioned on the inside of the outer periphery of the main body of this thermistor, and is made to coincide with the outer periphery of a second electrode which includes silver as its main component and formed on the first electrode or to be placed on the inside of the periphery of the second electrode.

Abstract: A magnetically sensitive switch is provided with an electromagnetic interference shield molded within the housing of the switch. In one embodiment, the magnetically sensitive switch is a vane switch for use in an automobile ignition system. The electromagnetic interference shield is formed by appropriately bending a flat sheet at a plurality of bend lines to form a box-like structure. The box like structure has five surfaces and one or more connection legs extending from one of the surfaces. One surface of the box-like structure also serves as a potting dam when a potting material is deposited into the cavity formed by the five surfaces during the process by which internal components are potted within the cavity of the EMI shield. The vane switch also includes a magnet encapsulated within its housing structure and spaced apart from the magnetically sensitive device within the EMI shield by a predetermined gap.

Abstract: A self-resetting overcurrent protection element uses an element body made up of a mixture of polymers and carbon black grafted with polymers. A resilient sheathing material covering the element body permits free expansion of the element body to permit the resistance of the overcurrent protection element to increase substantially in response to Joule's heating from high current. The sheathing materials preferably are made of elastic epoxy resins or silicone resins that allow significant expansion of the element body at the time of overcurrent protection, thus increasing the ratio of resistance in the element between an overcurrent state and a normal operating state.

Abstract: A resistor element for determining a parameter, including a ceramic support having a bearing surface, an electrically resistive body formed on the bearing surface of the ceramic support, a conductor or conductors electrically connected to the electrically resistive body, the conductor(s) having a lower thermal conductivity than a conductor made of platinum, and an adhesive for securing the conductor(s) to the ceramic support. The conductor is defined by a lead wire made of an alloy and a covering layer made of a metal which covers the lead wire. The adhesive contains at least one metal of which at least an outer surface of each conductor is formed, so as to increase bonding strength between the conductor(s) and the adhesive.

Abstract: A PTC thermistor device including a PTC thermistor element of a circular configuration, and a casing made of a plastic material. The casing has a substantially parallelepipedic body portion and a projecting portion having a pair of parallel side surfaces and a planar top surface. A terminal fitting is provided in contact with the PTC element and has plug portions projecting from the casing at the opposite sides of the projecting portion. The plugs has projecting lengths which are not higher than the height of the projecting portion of the casing.

Abstract: A microwave attenuator is constructed on an insulative substrate which supports a resistive region, input/output electrodes and shunt electrodes. The shunt electrodes are preferably constructed using trapezoidally shaped portions on the face of the insulative substrate, on which the resistive region is formed, to increase the width of the electrodes. The shunt electrodes extend down to a ground plane on the face of the insulative substrate opposite the face on which the resistive region is formed. In one embodiment, the shunt electrodes form a wide strip on the outside of a rectangular substrate. In another embodiment, the shunt electrodes extend from the resistive region through holes positioned close to the resistive region.

Abstract: An organic positive temperature coefficient (PTC) thermistor includes an organic PTC thermistor sheet on which a roughened surface is formed by pressing a wire mesh against one main surface thereof at a predetermined pressure. This results in the main surface of the organic PTC thermistor sheet being roughtened. A pair of electrodes are then formed on the main surface of the organic PTC thermistor sheet.

Abstract: At two large opposite end faces a component composed of a wafer-shaped or lamina-shaped body (1) has coatings (2, 3) and ribbon-shaped terminal elements (5, 6) and is pressure-coated with a lamina-shaped or cuboid insulating coat (7). The terminal elements (5, 6) of the component are conducted toward the outside through the insulating coat (7) at the level of the end faces of the body (1) without being bent off, the upper terminal element (5) is bent off in a downward direction and is then bent over onto the underside (19) of the insulating coat, and the lower terminal element (6) is first bent off in an upward direction, and is then arranged at the surface of the insulating coat (7) at the level of the exit location of the first terminal element (5), is then bent over by 180.degree. at this level and, lying against the terminal element (6), is bent down under the underside (19) of the insulating coat (7).