With Terminal Patents (Class 338/322)
  • Patent number: 10438730
    Abstract: A current sensing resistor includes a conductive body comprising a resistor portion and a pair of electrode portions connecting to two ends of the resistor portion, a receiving blind hole disposed on a top surface of each of the pair of electrode portions, and a detection terminal disposed on the receiving blind hole. The detection terminal includes a base fixed in the receiving blind hole and a terminal pin protruding from the top surface.
    Type: Grant
    Filed: June 29, 2018
    Date of Patent: October 8, 2019
    Assignee: CYNTEC CO., LTD.
    Inventors: Kuo-Tung Kao, Yang-Sheng Chou, Chieh-Yuan Feng
  • Patent number: 9502161
    Abstract: A resistor and an integrated heat spreader are provided. A resistive element having a first surface is in contact with electrically conducting terminals. A heat spreader is provided having at least a portion in thermally conductive contact with at least a portion of the first surface of the resistive element. The heat spreader comprising a thermally conducting and electrically insulating material, and has terminations, each termination adjacent to one of the electrically conducting terminals. Each termination is in thermally conducting contact with the adjacent electrically conducting terminal. A method of fabricating a resistor and an integrated heat spreader is also provided.
    Type: Grant
    Filed: August 29, 2014
    Date of Patent: November 22, 2016
    Assignee: VISHAY DALE ELECTRONICS, LLC
    Inventors: Clark Smith, Todd Wyatt
  • Patent number: 9247330
    Abstract: A speaker module includes a speaker, a bracket and a pair of conductive pins. The bracket holds the speaker. The pair of pins is arranged diagonally on the corners of the bracket and is configured for mounting to and electrically connecting the speaker with a PCB.
    Type: Grant
    Filed: June 27, 2013
    Date of Patent: January 26, 2016
    Assignee: Chi Mei Communication Systems, Inc.
    Inventor: Hsiao-Yuan Lee
  • Publication number: 20150102897
    Abstract: The invention relates to a resistor, in particular a low-resistance current-measuring resistor, comprising a first connection part (1) that consists of a conductor material for introducing an electrical current (I), a second connection part (2) that consists of a conductor material for discharging said electrical current (I), and a resistor element (3) that consists of a resistor material and is arranged between the two connection parts (1, 2) in the direction of the current, also comprising a resistor coating (7) that consists of a metallic material for the purpose of achieving protection from corrosion, and/or improving solderability. According to the invention, the metallic coating (7) is applied directly to the entire free surface of the resistor element (3) without any insulation layer.
    Type: Application
    Filed: June 5, 2013
    Publication date: April 16, 2015
    Inventor: Ullrich Hetzler
  • Patent number: 8963471
    Abstract: A controller for a DC motor comprises an output switching element configured to couple to the DC motor; an input switching element coupled to the output switching element; a pulse width modulated (PWM) signal coupled to a control terminal of the input switching element and a supply voltage applied to the output switching element. A resistive-capacitive (RC) network may be coupled to a control terminal of the output switching element, with the RC network being configured to integrate the PWM signal into a DC voltage. A first resistive network may be configured to set a bias for the output switching element when the input switching element is turned off, and a second resistive network may be configured to set the bias for the output switching element when the input switching element is turned on, such that the controller is effective to provide zero-to-full supply voltage control to the DC motor.
    Type: Grant
    Filed: March 29, 2012
    Date of Patent: February 24, 2015
    Assignee: Western Digital Technologies, Inc.
    Inventor: Charles A. Neumann
  • Publication number: 20150048923
    Abstract: Provided is a resistor for current detection, wherein connection failure etc. due to electro-migration is prevented from being generated in state that the resistor is mounted on a mounting board. The resistor has a resistance body (11) and electrodes (12). The electrode (12) includes first electrode portion (12a) connected to the resistance body (11) and second electrode portion (12b) formed on the first electrode portion (12a). The second electrode portion (12b) consists of material having higher resistivity than the first electrode portion (12a) and solder, which is used for mounting the resistor on the mounting board.
    Type: Application
    Filed: March 25, 2013
    Publication date: February 19, 2015
    Inventors: Kenji Kameko, Koichi Hirasawa
  • Publication number: 20140339955
    Abstract: The present invention provides a base metal combination electrode of electronic ceramic component and manufacturing method thereof, wherein said base metal combination electrode comprises a first base metal electrode layer covering on two sides of said electronic ceramic chip and a second base metal electrode layer covering on said first base metal electrode layer, the manufacturing method for base metal combination electrode of electronic ceramic component comprises using thermal spray equipment to spray the electrode material to the surface of electronic ceramic chip. Comparing with using silver paste or copper paste only, it reduces the cost of electrode material without destroying the function of the electrode. The manufacturing method for base metal combination electrode of the present invention has simple technological process, high preparation efficiency and low cost, and it reduces the production cost of electrode of the electronic ceramic component on the whole.
    Type: Application
    Filed: September 3, 2013
    Publication date: November 20, 2014
    Applicant: LONGKE ELECTRONICS (HUIYANG) CO., LTD.
    Inventor: Chinglung TSENG
  • Publication number: 20140218163
    Abstract: The subject matter of the present application is a curable adhesive composition having PTC characteristics after curing, containing (i) a reactive binder system, based on an epoxy-resin-component and a curing agent-component, (ii) particles of a carbon modification in a range of 0.01 wt % to 15.0 wt %, based on the total weight of the curable adhesive composition, and (iii) copper powder in a range of 0.5 wt % to 5.0 wt %, based on the total weight of the curable adhesive composition, wherein the reactive binder system comprises>70 wt % of all organic polymers of the adhesive composition.
    Type: Application
    Filed: April 4, 2014
    Publication date: August 7, 2014
    Applicant: HENKEL AG & CO. KGAA
    Inventors: Giorgio Zaffaroni, Daniela Sicari, Eugen Bilcai
  • Publication number: 20140176294
    Abstract: An integrated assembly includes a resistor and a heat spreader. The resistor includes a resistive element and terminals. The heat spreader is integrated with the resistor and includes a heat sink of thermally conducting and electrically insulating material and terminations of a thermally conducting material and situated at an edge of the heat sink. At least a portion of a top surface of the resistive element is in thermally conductive contact with the heat sink. Each resistor terminal is in thermally conductive contact with a corresponding termination of the heat sink. A method of fabricating an integrated assembly of a resistor and a heat spreader includes forming the heat spreader, forming the resistor, and joining the heat spreader to the resistor by bonding at least a portion of a top surface of the resistive element to the heat sink and bonding each electrically conducting terminal to a corresponding termination.
    Type: Application
    Filed: December 21, 2012
    Publication date: June 26, 2014
    Applicants: VISHAY DALE ELECTRONICS, INC.
    Inventors: Clark Smith, Todd Wyatt
  • Patent number: 8686826
    Abstract: A surface mount circuit protection device includes a laminar PTC resistive element having first and second major surfaces and a thickness therebetween. A first electrode layer substantially coextensive the first surface is formed of a first metal material of a type adapted to be soldered to a printed circuit substrate. A second electrode layer formed at the second major surface includes structure forming or defining a weld plate. The metal weld plate has a thermal mass and thickness capable of withstanding resistance micro spot welding of a strap interconnect without significant resultant damage to the device. The device is preferably surface mounted to a printed circuit board assembly forming a battery protection circuit connected to a battery/cell by battery strap interconnects, wherein one of the battery strap interconnects is micro spot welded to the weld plate of the device.
    Type: Grant
    Filed: April 5, 2011
    Date of Patent: April 1, 2014
    Assignee: Tyco Electronics Corporation
    Inventors: Daniel A. Chandler, Matthew P. Galla
  • Publication number: 20140015636
    Abstract: It is an object to provide a configuration with an enhanced sensing accuracy, in which a shunt resistance main body and a terminal member are formed as separate pieces. A shunt resistor includes a resistance main body and a terminal member (21) that is electrically connected to the resistance main body. The terminal member (21) includes a resistance connection portion (23) to be in contact with the resistance main body, and a circuit connection portion (24) provided so as to extend from the resistance connection portion (23). The circuit connection portion (24) is divided into two parts by a slit (27) being formed therein. The slit (27) is formed up to a part of the resistance connection portion (23).
    Type: Application
    Filed: March 30, 2012
    Publication date: January 16, 2014
    Applicants: FURUKAWA AUTOMOTIVE SYSTEMS INC., FURUKAWA ELECTRIC CO., LTD
    Inventors: Kazuyuki Tanaka, Kengo Aburaya, Yuuichi Watanabe, Kazumasa Sakata
  • Patent number: 8598976
    Abstract: The invention relates to an electronic component (1), in particular a low-ohm current-sense resistor, comprising at least one plate-shaped section (2, 3) and at least one terminal (7, 8) to electrically contact the plate-shaped section (2, 3). According to the invention, the terminals (7, 8) for measuring the voltage drop created by the current flow are formed by means of stamping and thread-shaping in the plate-shaped sections (2, 3).
    Type: Grant
    Filed: June 16, 2010
    Date of Patent: December 3, 2013
    Assignee: Isabellenhütte Heusler GmbH & Co. KG
    Inventor: Ullrich Hetzler
  • Patent number: 8531264
    Abstract: The present invention relates to a current sensing resistor made by an electrically conductive metal plate, and the current sensing resistor comprising: a middle portion; a first portion with a first slot located at one side of the middle portion; and a second portion with a second slot located at the other side of the middle portion opposite to the first portion; wherein each of the first and second portions is divided into a current terminal and a sensing terminal by the first and second slots respectively, and the current terminals of the first and second portions have a length greater than that of the sensing terminals of the first and second portions; characterized in that the middle portion has a middle slot and the length of the middle slot can be used for controlling the stability of resistance for the current sensing resistor.
    Type: Grant
    Filed: January 3, 2012
    Date of Patent: September 10, 2013
    Assignee: TA-I Technology Co., Ltd.
    Inventors: Chun-Yen Li, Yi-Kun Chiu, Ching-Chen Hu
  • Publication number: 20130229257
    Abstract: Provided is a resistive element which is excellent in inrush current resistance even in the case of having a surface-mountable small chip shape. The resistive element has an element main body composed of a semiconductor ceramic in which a main constituent thereof is composed of a Mn compound represented by the general formula (Nd1-xMx)yBazMn2O6 (M is at least one rare-earth element selected from Sm, Gd, Eu, Tb, Dy, Ho, Er, and Y), and x, y, and z respectively meet the conditions of: 0.05?x?0.4; 0.80?y?1.2; and 0.80?z?1.2 in the chemical formula.
    Type: Application
    Filed: April 22, 2013
    Publication date: September 5, 2013
    Applicant: MURATA MANUFACTURING CO., LTD.
    Inventor: Sakyo Hirose
  • Patent number: 8492682
    Abstract: A micro heater includes a first electrode, a second electrode, a first carbon nanotube, and a second carbon nanotube. The first carbon nanotube extends from the first electrode. The second carbon nanotube branches from the second electrode. The first carbon nanotube and the second carbon nanotube intersect with each other to define a node therebetween.
    Type: Grant
    Filed: December 30, 2010
    Date of Patent: July 23, 2013
    Assignees: Tsinghua University, Hon Hai Precision Industry Co., Ltd.
    Inventors: Xue-Shen Wang, Qun-Qing Li, Shou-Shan Fan
  • Patent number: 8410894
    Abstract: A method for manufacturing terminals for electric resistors consists in preparing a piece of substantially pure copper; reducing the thickness, by cold pressing, of the piece so as to obtain from it at least one thick part and one thin part designed to form the tip of an electrical terminal to be obtained; obtaining, by rolling, a groove which is central to the thick part; and tapering, by rolling, the thin portion.
    Type: Grant
    Filed: June 16, 2011
    Date of Patent: April 2, 2013
    Assignee: Bonaiti S.p.A.
    Inventor: Luca Bonaiti
  • Patent number: 8344846
    Abstract: A resistor includes a substantially cylindrical resistive element having a resistance of less than about 1 m?, a substantially cylindrical first termination electrically connected to the resistive element and a second termination electrically connected to the resistive element. The substantially cylindrical first termination is hollow to allow for accepting a connection such as from a battery cable. In addition there may be sense leads present on the resistor. A method of forming a substantially cylindrical resistor includes forming a hollow cylindrical resistor body by rolling a flat sheet comprising a resistive element and a first termination and a second termination joined on opposite ends of the resistive element.
    Type: Grant
    Filed: March 18, 2011
    Date of Patent: January 1, 2013
    Assignee: Vishay Dale Electronics, Inc.
    Inventors: Clark L. Smith, Joel J. Smejkal, David L. Lange, Thomas L. Bertsch, Steve Hendricks, Rod Brune
  • Patent number: 8325006
    Abstract: A chip resistor includes a substrate, a pair of electrode elements, a resistive layer, and a protective layer. The substrate is insulating and includes a first surface, a second surface opposite the first surface and a thickness defined between the first and second surface. The electrode elements are formed on the first and spaced apart. The resistive layer is formed on the first surface and electrically connected to the electrode elements. The protective layer to covers the resistive layer. The first surface faces toward a mounting target, on which the chip resistor is mounted. Each of the electrode elements comprises an electrode layer and a conductive layer formed on the electrode layer. The boundary between the electrode layer and the conductive layer in each of the electrode elements is positioned closer to the substrate than the end surface of the protective layer in the thickness direction of the substrate.
    Type: Grant
    Filed: December 16, 2009
    Date of Patent: December 4, 2012
    Assignee: Rohm Co., Ltd.
    Inventor: Masaki Yoneda
  • Patent number: 8325007
    Abstract: A metal strip resistor is provided with a resistive element disposed between a first termination and a second termination. The resistive element, first termination, and second termination form a substantially flat plate. A thermally conductive and electrically non-conductive thermal interface material such as a thermally conductive adhesive is disposed between the resistive element and first and second heat pads that are placed on top of the resistive element and adjacent to the first and second terminations, respectively.
    Type: Grant
    Filed: December 30, 2009
    Date of Patent: December 4, 2012
    Assignee: Vishay Dale Electronics, Inc.
    Inventors: Clark L. Smith, Todd L. Wyatt, Thomas L. Bertsch, Rodney J. Brune
  • Publication number: 20110309909
    Abstract: A method for manufacturing terminals for electric resistors consists in preparing a piece of substantially pure copper; reducing the thickness, by cold pressing, of the piece so as to obtain from it at least one thick part and one thin part designed to form the tip of an electrical terminal to be obtained; obtaining, by rolling, a groove which is central to the thick part; and tapering, by rolling, the thin portion.
    Type: Application
    Filed: June 16, 2011
    Publication date: December 22, 2011
    Inventor: Luca Bonaiti
  • Patent number: 7956716
    Abstract: A surface mount variable resistor meets the needs of user for front and rear terminals of an insulating substrate. The surface mount variable resistor includes an insulating substrate 1 with a variable resistor pattern 3 and electrode patterns 5 formed thereon, resistor termination terminal fittings 7 connected to the electrode patterns 5, an electrically conductive slider 15 including a sliding contact 15c that slides on the variable resistor pattern 3, and an intermediate terminal 17 that includes a rear intermediate terminal fitting portion 17a and is electrically connected to the electrically conductive slider 15. The intermediate terminal 17 includes an extended conductor portion 17c and the rear intermediate terminal fitting portion 17a integrally formed with the extended conductor portion 17c. A front intermediate terminal fitting portion 17d located between the resistor termination terminal fittings 7 is integrally formed with the extended conductor portion 17c.
    Type: Grant
    Filed: July 19, 2007
    Date of Patent: June 7, 2011
    Assignee: Hokuriku Electric Industry Co., Ltd.
    Inventors: Morio Tada, Masanori Urayama
  • Patent number: 7947933
    Abstract: A ceramic heater comprising a ceramic body, a heat generating resistor buried in the ceramic body, an electrode pad that is electrically connected to the heat generating resistor and is formed on the surface of the ceramic body and a lead member bonded onto the electrode pad.
    Type: Grant
    Filed: November 24, 2004
    Date of Patent: May 24, 2011
    Assignee: Kyocera Corporation
    Inventors: Ryuichi Nagasako, Osamu Hamada, Koji Sakamoto
  • Patent number: 7759618
    Abstract: A strip-form silicon carbide furnace heating element is provided having a higher radiating surface area to volume ratio than a conventional tubular element.
    Type: Grant
    Filed: July 16, 2004
    Date of Patent: July 20, 2010
    Assignee: Sandvik Materials Technology UK Limited
    Inventor: John George Beatson
  • Patent number: 7667568
    Abstract: A chip resistor (A1) includes a chip-like resistor element (1), two electrodes (31) spaced from each other on the bottom surface (1a) of the resistor element, and an insulation film (21) between the two electrodes. Each electrode (31) has an overlapping portion (31c) which overlaps the insulation film (21) as viewed in the vertical direction.
    Type: Grant
    Filed: March 23, 2005
    Date of Patent: February 23, 2010
    Assignee: Rohm Co., Ltd.
    Inventors: Masanori Tanimura, Torayuki Tsukada, Kousaku Tanaka
  • Patent number: 7543632
    Abstract: An automotive heat, ventilation and air conditioning (HVAC) system including an electrical control module for controlling the motor of the system. The module includes a connector base supporting a circuit board having spaced side edges extending into the housing. The circuit board having a first leg extending from the base and through a curved section and into a second leg to a distal end spaced from the base with an electrical circuit extending over the exterior of the first leg and over the curved section and over the second leg. The circuit board includes an offset section between the base and the first leg for centralizing the legs on the base.
    Type: Grant
    Filed: January 9, 2006
    Date of Patent: June 9, 2009
    Assignee: Delphi Technologies, Inc.
    Inventors: Edward Douglas Pettitt, Jeffrey Charles Kinmartin
  • Publication number: 20090116167
    Abstract: An EMI filter capacitor assembly and implantable passive electronic network components utilize biocompatible and non-migratable materials to adapt the electronic components for direct body fluid exposure. The assembly includes a capacitor having first and second sets of electrode plates which are constructed of non-migratable biocompatible material. A conductive hermetic terminal of non-migratable and biocompatible material adjacent to the capacitor is conductively coupled to the second set of electrode plates. One or more conductive terminal pins having at least an outer surface of non-migratable and biocompatible material are conductively coupled to the first set of electrode plates, while extending through the hermetic terminal in non-conductive relation. The terminal pins may be in direct contact with the first set of electrode plates, or in contact with a termination surface of conductive connection material. The termination surface is also constructed of non-migratable and biocompatible materials.
    Type: Application
    Filed: November 12, 2008
    Publication date: May 7, 2009
    Applicant: GREATBATCH LTD.
    Inventors: Robert A. Stevenson, Richard L. Brendel, John Roberts, Christine A. Frysz
  • Patent number: 7528350
    Abstract: The present invention provides a novel method for electrical connection between a polymer PTC device and a metal lead element to thereby prevent the problems of the connection by caulking or soldering. For this purpose, the present invention provides a process for producing a connection structure by laser welding, said connection structure having (A) a PTC device (10) including (i) a laminar polymer PTC element (12) and (ii) a metal foil electrode (14) disposed on a main surface of the laminar polymer PTC element (12), and (B) a metal lead element (20) electrically connected to the metal foil electrode. The metal foil electrode (14) has at least two metal layers, one of which, the X-th layer, has laser beam absorption a % that is the lowest among the metal layers of the metal foil electrode (14). The X-th layer is present between a first metal layer (18) of the metal foil electrode and the laminar polymer PTC element (12).
    Type: Grant
    Filed: September 3, 2003
    Date of Patent: May 5, 2009
    Assignee: Tyco Electronics Raychem KK
    Inventors: Atsushi Nakagawa, Arata Tanaka, Mikio Iimura
  • Patent number: 7446286
    Abstract: A heater strip for use as a heating element in an electric heater is made up of a profiled strip made of a flat metallic material forming a resistor section and of mounting elements extending over one common longitudinal side and they are manufactured as one piece with the resistor section for mounting the heater strip to a support. The strip has a zigzag-shaped structure. The mounting elements are provided only on the flat leg sections of the zigzag-shaped heater strip.
    Type: Grant
    Filed: July 14, 2006
    Date of Patent: November 4, 2008
    Assignee: Electrovac AG
    Inventors: Josef Reithofer, Christian Auradnik
  • Patent number: 7330099
    Abstract: A chip resistor includes a resistive element (1), an insulation layer (4) formed in a back surface of the flat surface, and two electrodes (3) spaced from each other via the insulation layer. Each electrode (3) makes contact with the insulation layer (4). Each electrode (3) has a lower surface formed with a solder layer (39).
    Type: Grant
    Filed: July 22, 2003
    Date of Patent: February 12, 2008
    Assignee: Rohm Co., Ltd.
    Inventor: Torayuki Tsukada
  • Patent number: 7326889
    Abstract: A method of manufacturing a PTC element comprising a pair of lead terminals bonded together by thermocompression with a matrix held therebetween comprises a matrix preparing step of preparing a matrix constructed by dispersing a conductive filler into a crystalline polymer; a terminal preparing step of preparing a pair of lead terminals holding the matrix therebetween, a surface of each lead terminal facing the matrix being formed with a plurality of anchor protrusions separated from each other; a flattening step of flattening the anchor protrusions formed in respective nonoverlapping areas in the pair of lead terminals kept from overlapping the matrix; and a thermocompression bonding step of holding the matrix between respective overlapping areas in the pair of lead terminals overlapping the matrix, and securing the pair of lead terminals and the matrix together by thermocompression bonding.
    Type: Grant
    Filed: September 15, 2006
    Date of Patent: February 5, 2008
    Assignee: TDK Corporation
    Inventors: Hisanao Tosaka, Tokuhiko Handa, Hirokazu Satoh, Tsutomu Hatakeyama
  • Patent number: 7176781
    Abstract: A resistor formed on a material layer of a semiconductor integrated circuit and a method for forming the resistor. The resistor comprises a region of resistive material with a plurality of conductive contacts or plugs in electrical contact with and extending away from the resistive material. A first and a second interconnect line are formed overlying the plugs and in conductive contact with one or more of the plurality of plugs, such that a portion of the resistive material between the first and the second interconnect lines provides a desired resistance. According to a method of the present invention, the plurality of conductive contacts are formed using a first photolithographic mask and the first and the second interconnect lines are formed using a second photolithographic mask. The desired resistance is changed by modifying the first or the second mask such that one or more dimensions of a region of the resistive material between the first and the second interconnect lines is altered.
    Type: Grant
    Filed: September 29, 2004
    Date of Patent: February 13, 2007
    Assignee: Agere Systems Inc
    Inventors: Daniel Charles Kerr, Roger W. Key, Bradley J. Albers, William A. Russell, Alan Sangone Chen
  • Patent number: 7164341
    Abstract: A surface-mountable PTC thermistor element includes electrodes disposed on a top surface and a bottom surface of a thermistor element body, in which each of the electrodes is connected with a terminal respectively and each of the terminals is extended downward. An upper terminal is protected from being detached by a reaction force acting against pressing at the time of press-mounting the PTC thermistor element onto a surface of a substrate. A vertical-leg portion of the lower terminal is placed inside the thermistor element body in the radial direction from the outer edge of the thermistor element body. Preferably, the vertical-leg portion of the lower terminal is placed in the vicinity of the center of the thermistor element body.
    Type: Grant
    Filed: September 27, 2001
    Date of Patent: January 16, 2007
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Takayo Katsuki, Takeo Haga
  • Patent number: 7145431
    Abstract: A thermistor is disclosed, which comprises a resistance element having upper and lower surfaces and showing a resistance varying characteristics according to the change of temperature; first and second conductive layers formed on the upper surface of the resistance element and engaged to each other with a non-conductive gap interposed therebetween; first and second electrodes formed on the lower surface of the resistance element and electrically separated from each other; a first connector for electrically connecting the first conductive layer to the first electrode; and a second connector for electrically connecting the second conductive layer to the second electrode. Thus, the thermistor has a structurally point-symmetric shape, so it is possible to prevent the Tombstone phenomenon, caused by an asymmetric structure.
    Type: Grant
    Filed: November 28, 2003
    Date of Patent: December 5, 2006
    Assignee: LG Cable, Ltd.
    Inventors: Jun-Ku Han, Su-An Choi, Chang-Mo Ko, An-Na Lee, Jong-Hwan Lee, Ju-Dam Kim, Jong-Ho Lee
  • Patent number: 7042330
    Abstract: The low resistance value resistor 11 has two electrodes 12,13 of metal strips having a high electrical conductivity. The metal strips are affixed on the resistor body by means of rolling and/or thermal diffusion bonding. A fused solder layer is formed on a surface of each electrode comprised by the metal strip. Thus, sufficient bonding strength and superior current distribution in the resistor body is obtained. Further, a portion of the resistor body is trimmed by removing a portion of the body material along a direction of current flow between the electrodes to adjust a resistance value. Thus, a precise resistor value and superior characteristics of temperature coefficient of resistance (TCR) can be obtained.
    Type: Grant
    Filed: April 14, 2004
    Date of Patent: May 9, 2006
    Assignee: KOA Corporation
    Inventors: Keishi Nakamura, Mikio Tatuguchi
  • Patent number: 7034653
    Abstract: A semiconductor resistor comprises a resistor body formed on a semiconductor substrate and first and second conductive terminals electrically connected to the resistor body at opposite ends thereof. The semiconductor resistor further includes at least first and second conductive paths between at least one of the first and second conductive terminals and the resistor body. The at least one conductive terminal is configured such that a resistance of the at least one conductive terminal between the at least first and second conductive paths is substantially matched to a resistance of the resistor body between the at least first and second conductive paths. In this manner, a current distribution between the at least first and second conductive paths is substantially matched.
    Type: Grant
    Filed: January 30, 2004
    Date of Patent: April 25, 2006
    Assignee: Agere Systems Inc.
    Inventors: Dipankar Bhattacharya, John Christopher Kriz, Stefan Allen Siegel, Joseph E. Simko, Yehuda Smooha
  • Patent number: 6856235
    Abstract: A method of making resistors includes providing a sacrificial layer. Conductive material is then formed over a region of the sacrificial layer. Resistive material is then deposited over the first surface of the sacrificial layer such that the resistive material covers the sacrificial layer and the conductive material. A portion of the sacrificial layer is then removed to expose the conductive material. A method of making resistors includes the steps of providing a sacrificial layer, removing at least a portion of the sacrificial layer from regions of the sacrificial layer so as to create a plurality of cavities within the sacrificial layer, plating said cavities with a conductive material, disposing resistive material over the first surface of the sacrificial layer such that resistive material covers the sacrificial layer and said conductive material, and removing at least a portion of said sacrificial layer to expose the conductive material.
    Type: Grant
    Filed: September 12, 2001
    Date of Patent: February 15, 2005
    Assignee: Tessera, Inc.
    Inventor: Joseph Fjelstad
  • Patent number: 6825448
    Abstract: Embodiments of the present invention are directed to relieving the stresses caused by a mismatch in the coefficients of thermal expansion in the components forming the connections at the terminals of a heater. In one embodiment, a heater comprises a heater body having an electrical heating element and a bottom surface, and a rod configured to be coupled with an electrical power source. A plug has a first end which is coupled to the heater body and extends into the heater body through the bottom surface of the heater body, and which is electrically connected with the electrical heating element. The plug has a second end which includes a cavity to receive a portion of the rod. The cavity is surrounded by a slotted side wall of the plug which is disposed outside of the heater body and includes a plurality of slots extending from the second end toward the bottom surface of the heater body and terminating near the bottom surface but before reaching the bottom surface.
    Type: Grant
    Filed: May 1, 2003
    Date of Patent: November 30, 2004
    Assignee: Applied Materials, Inc.
    Inventor: Steven E. Gianoulakis
  • Patent number: 6794985
    Abstract: The low resistance value resistor 11 has two electrodes 12, 13 of metal strips having a high electrical conductivity. The metal strips are affixed on the resistor body by means of rolling and/or thermal diffusion bonding. A fused solder layer is formed on a surface of each electrode comprised by the metal strip. Thus, sufficient bonding strength and superior current distribution in the resistor body is obtained. Further, a portion of the resistor body is trimmed by removing a portion of the body material along a direction of current flow between the electrodes to adjust a resistance value. Thus, a precise resistor value and superior characteristics of temperature coefficient of resistance (TCR) can be obtained.
    Type: Grant
    Filed: April 4, 2001
    Date of Patent: September 21, 2004
    Assignee: KOA Corporation
    Inventors: Keishi Nakamura, Mikio Tatuguchi
  • Patent number: 6597277
    Abstract: A printed circuit board having resistors formed therein. A conductive layer composed of two different metals is provided on top of an insulating layer in a printed circuit board. The first metal layer is highly conductive and the second metal layer is highly resistive. For a major portion of the layer, both layers are connected electrically in parallel so that they provide a highly conductive path. At selected locations throughout the printed circuit board, the highly conductive metal is removed providing only the high resistivity metal to act as a resistor between selected locations in the conductive layer. Many resistors are formed at the same time, thus providing ease of fabrication and precision in resistor values across the entire printed circuit board. Following the formation of the resistor, additional insulating and conductive layers are formed to complete the printed circuit board.
    Type: Grant
    Filed: August 3, 2001
    Date of Patent: July 22, 2003
    Assignee: Cray Inc.
    Inventor: Steven V. R. Hellriegel
  • Patent number: 6577225
    Abstract: An array resistor network that has a high density of resistors per unit area. The array resistor network includes a ceramic substrate having a top and bottom surface. Apertures extend through the substrate between the top and bottom surfaces. Recesses are located on opposite edges of the substrate. Resistors are located on the top surface. Each resistor is located between a recess and an apertures. Inner conductors are connected to one end of the resistors. The Inner conductors are located on the top surface and extend through the aperture onto the bottom surface. Outer conductors are connected to another end of the resistors. The outer conductors are located on the top surface and extend along the recess onto the second surface.
    Type: Grant
    Filed: April 30, 2002
    Date of Patent: June 10, 2003
    Assignee: CTS Corporation
    Inventor: David L. Poole
  • Publication number: 20030090361
    Abstract: A leadframe resistance structure comprises: at least a resistance foil; a plurality of leads, each of the plurality of leads respectively having a first lead surface and an opposite second lead surface, wherein the resistance foil is disposed on the first lead surface of the leads and connected to the leads; and an encapsulating material that encapsulates the resistance foil, and a portion of the first surface of the leads.
    Type: Application
    Filed: August 27, 2002
    Publication date: May 15, 2003
    Inventors: Steven Liu, Horng-Yih Juang, Yih-Wen Shiao, Cheng-Er Fan
  • Patent number: 6515264
    Abstract: A rod-shaped heater provided is composed of a carbon wire heating element 2 sealed in a small or large diameter quartz glass tube, a small diameter quartz glass tube portions 3a and 3b charged with compressed wire carbon members at opposite ends thereof; a sealed terminal section 10 having connection lines 11a and 11b for power supply held between the compressed wire carbon members charged in the small diameter quartz glass tube. The connection lines and the carbon wire heating element are electrically connected by way of the wire carbon members. This rod-shaped heater using the carbon wire heating element is suitable for readily raising the temperature of the agent in the storage tank of the wet etching agent or the grinding agent.
    Type: Grant
    Filed: June 14, 2002
    Date of Patent: February 4, 2003
    Assignees: Toshiba Ceramics Co., Ltd., Tokyo Electron Limited
    Inventors: Eiichi Toya, Tomio Konn, Tomohiro Nagata, Norihiko Saito, Shigeru Yamamura, Ken Nakao, Takanori Saito, Hisaei Osanai, Toshiyuki Makiya
  • Publication number: 20030000941
    Abstract: A method of heating air, fluid or materials in dry or humid conditions, fed by low voltage alternate or continuous electrical current or TBTS.
    Type: Application
    Filed: June 17, 2002
    Publication date: January 2, 2003
    Inventor: Jean-Claude Couraud
  • Publication number: 20020195443
    Abstract: The present invention provides an inexpensive heater exhibiting good gas-tightness, as well as a method for manufacturing the same. The heater includes a cylindrical metallic shell having a through-hole with a heating element disposed in the through-hole such that a portion projects from one end of the shell. The heater is adapted to generate heat upon application of electricity thereto. A rod-like axial member has a coil lead for electrically connecting a portion of the axial member and the heating element. A gas-tight seal member formed of an insulating polymeric material is interposed between the axial member and the inner surface of the through-hole in such a manner to surround the outer circumferential surface of the axial member. A crimped portion of the metallic shell brings the gas-tight seal member into close contact with the outer circumferential surface of the axial member and the inner wall surface of the through-hole form a gas tight seal.
    Type: Application
    Filed: May 31, 2002
    Publication date: December 26, 2002
    Inventors: Katsuhiko Tanaka, Masakazu Nagasawa
  • Patent number: 6498561
    Abstract: A thermistor having multiple metal layers about at least a portion of a semiconductor body. The thermistor includes a first thick film electrode layer, a reactive metal layer, a barrier metal layer and, optionally, a layer to facilitate attachment to an electrical contact. Also, a method of making the thermistor is described.
    Type: Grant
    Filed: January 26, 2001
    Date of Patent: December 24, 2002
    Assignee: Cornerstone Sensors, Inc.
    Inventor: Gregg J. Lavenuta
  • Patent number: 6489880
    Abstract: A thermistor with positive resistance-to-temperature characteristic used in a overcurrent protection circuit has electrodes on mutually opposite main surfaces and is mounted to a substrate having electrically conductive members such that deterioration of its voltage resistance due to heat emission can be controlled. A spacer with smaller thermal conductivity than the substrate and penetrated by a conductor piece with a small cross-sectional area is inserted between solder materials connecting to one of the thermistor electrodes. The other electrode is contacted by an elongated connecting member through its sectional surface transverse to its longitudinal direction such that the cross-sectional area of electrical conduction is reduced.
    Type: Grant
    Filed: September 21, 2001
    Date of Patent: December 3, 2002
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Michio Miyazaki, Haruyuki Takeuchi, Tadao Bekku
  • Patent number: 6404324
    Abstract: A resistor having a generally planar substrate with a resistive element located on each side of the substrate and a plurality of terminals for connecting opposing portions of each of the resistive elements to an electronic circuit. The resistive elements have substantially equal dimensions and resistive properties such that they have substantially equal resistance values and exhibit substantially equal current densities for any given applied voltage. The substrate can be a ceramic-coated metal core with the resistive elements silk-screened onto opposite sides of the substrate. The resistive elements have a substantially uniform thickness so that they exhibit a uniform current density when subjected to an applied voltage. With this dual resistive layer design, thermal bending of the resistor due to differential thermal expansion at one of the ceramic layers is substantially offset by thermal bending due to differential thermal expansion at the other ceramic layer.
    Type: Grant
    Filed: September 7, 1999
    Date of Patent: June 11, 2002
    Assignee: General Motors Corporation
    Inventors: David B. Witt, Scott E. Crawford
  • Publication number: 20020021203
    Abstract: Chip PTC thermistors that can easily be inspected the soldered portions after it is mounted on a printed circuit board and that can be used in a flow soldering process, and methods of making same. A chip PTC thermistor of the present invention includes: a first main electrode and a first sub-electrode on first surface of a cuboidal form conductive polymer having the PTC characteristics, a second main electrode and a second sub-electrode on a second surface opposite the first surface of the conductive polymer. Between the first sub-electrode and the second sub-electrode, and between the first sub-electrode and the second main electrode are electrically connecting with a first side electrode and a second side electrode, respectively.
    Type: Application
    Filed: February 16, 2000
    Publication date: February 21, 2002
    Inventors: JUNJI KOJIMA, KOHICHI MORIMOTO, TAKASHI IKEDA, TOSHIYUKI IWAO
  • Patent number: 6311390
    Abstract: Thermistor chips are produced by first obtaining elongated strips made of a sintered ceramic plate having a specified resistance-temperature characteristic and having thereon a plurality of mutually parallel grooves extending perpendicularly to its direction of elongation. On each of these strips, ohmic electrodes are formed, one extending continuously from one of its main surfaces to one of its side surfaces and another extending continuously from the other oppositely facing main surface to the opposite side surface. This may done by covering the strip completely with an electrically conductive film and separating it into two areal parts by forming a longitudinally extending slit on each of the main surfaces. These strips are then stacked one on top of another by aligning the grooves on each of these strips and adhesively attached together with a glass paste in between.
    Type: Grant
    Filed: October 8, 1999
    Date of Patent: November 6, 2001
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Yoshiaki Abe, Takahiko Kawahara, Toshiharu Hirota
  • Patent number: 6252200
    Abstract: This invention relates to a process for sealing of the terminal-side end area of the glow tube of a glow plug, this area of the glow tube (3) being crimped.
    Type: Grant
    Filed: March 31, 2000
    Date of Patent: June 26, 2001
    Assignee: Beru AG
    Inventors: Rudi Heinz, Rainer Hain