Welded Or Soldered Patents (Class 338/329)
  • Patent number: 11313885
    Abstract: An integrated current-measuring apparatus including a printed circuit board, a shunt resistor including a resistive element having a preset resistance and terminals extending from both sides of the resistive element, the shunt resistor being attached to a bottom surface of the printed circuit board, and a Hall sensor mounted on a top surface of the printed circuit board to face the shunt resistor with the printed circuit board being interposed between the Hall sensor and the shunt resistor.
    Type: Grant
    Filed: November 19, 2019
    Date of Patent: April 26, 2022
    Inventor: Jong-Tae Choi
  • Patent number: 10980124
    Abstract: A multilayer electronic component includes a multilayer capacitor including a capacitor body in which internal electrodes are stacked to be parallel with respect to a mounting surface and external electrodes disposed on opposing end surfaces of the capacitor body, respectively, and a metal frame having a solder pocket and including a vertical portion, an upper horizontal portion extending from an upper end of the vertical portion, and a lower horizontal portion extending from a lower end of the vertical portion, the upper horizontal portion connected to an upper band portion of each of the external electrodes. 0.1?G/CT?0.7 is satisfied, in which CT is a height of the vertical portion and G is a distance between the lower band portion of each of the external electrodes and a lower end of the metal frame.
    Type: Grant
    Filed: July 10, 2019
    Date of Patent: April 13, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Heung Kil Park, Gu Won Ji, Se Hun Park
  • Patent number: 10147524
    Abstract: A resistor includes a substantially cylindrical resistive element having a resistance of less than about 1 m?, a substantially cylindrical first termination electrically connected to the resistive element and a second termination electrically connected to the resistive element. The substantially cylindrical first termination is hollow to allow for accepting a connection such as from a battery cable. In addition there may be sense leads present on the resistor. A method of forming a substantially cylindrical resistor includes forming a hollow cylindrical resistor body by rolling a flat sheet comprising a resistive element and a first termination and a second termination joined on opposite ends of the resistive element.
    Type: Grant
    Filed: June 27, 2016
    Date of Patent: December 4, 2018
    Assignee: VISHAY DALE ELECTRONICS, LLC
    Inventors: Clark L. Smith, Joel J. Smejkal, David Lange, Thomas L. Bertsch, Steve Hendricks, Rod Brune
  • Patent number: 9425016
    Abstract: A main body of an electronic part has multiple electrodes, to which multiple terminals are respectively connected. The terminals include a normal terminal and a fuse terminal, each of which extends from lands formed in a printed board so as to hold the main body at a position above and separated from a board surface of the printed board. The fuse terminal has multiple leg portions divided by slits. A first leg portion forms an electrical path portion having a cut-off portion, a width of which is smaller than that of other portions of the electrical path portion. A second leg portion has a first supporting leg and a second supporting leg, which are arranged at both sides of the first leg portion. Each of the supporting legs is connected to each of dummy lands formed in the printed board.
    Type: Grant
    Filed: February 26, 2014
    Date of Patent: August 23, 2016
    Assignees: DENSO CORPORATION, Murata Manufacturing Co., Ltd.
    Inventors: Toru Itabashi, Yuki Mikami, Ryoichi Shiraishi, Akihiro Yanagisawa, Shigeki Nishiyama
  • Patent number: 9368309
    Abstract: A main body of an electronic part has multiple electrodes, to which multiple terminals are connected. The terminals include a normal terminal and a fuse terminal, each of which extends from lands formed in a printed board so as to hold the main body at a position above and separated from a board surface of the printed board. The fuse terminal has a cut-off portion having a smaller width than other portions of the fuse terminal, so that the cut-off portion is melted down when excess current flows in the fuse terminal. The normal terminal holds the main body at the position above and separated from the board surface even in a case of melt-down of the cut-off portion.
    Type: Grant
    Filed: February 26, 2014
    Date of Patent: June 14, 2016
    Assignees: DENSO CORPORATION, Murata Manufacturing Co., Ltd.
    Inventors: Yuki Mikami, Toru Itabashi, Ryoichi Shiraishi, Shigeki Nishiyama
  • Patent number: 8970340
    Abstract: A method of manufacturing a chip resistor includes forming a resistor assembly in which a conductive member including portions separated from each other in a first direction is provided in a resistance body member; and dividing the resistor assembly into chip resistors, each including a chip-shaped resistance body formed by a part of the resistance body member, a pair of main electrodes formed by a part of the conductive member and separated from each other in the first direction, and a pair of sub-electrodes formed by a part of the conductive member, separated from each other in the first direction, and adjacent to the main electrodes in a second direction perpendicular to the first direction with concave portions recessed in the first direction interposed therebetween, by punching.
    Type: Grant
    Filed: January 3, 2013
    Date of Patent: March 3, 2015
    Assignee: Rohm Co., Ltd.
    Inventors: Torayuki Tsukada, Kentaro Naka
  • Patent number: 8963679
    Abstract: It is an object to provide a configuration with an enhanced sensing accuracy, in which a shunt resistance main body and a terminal member are formed as separate pieces. A shunt resistor includes a resistance main body and a terminal member (21) that is electrically connected to the resistance main body. The terminal member (21) includes a resistance connection portion (23) to be in contact with the resistance main body, and a circuit connection portion (24) provided so as to extend from the resistance connection portion (23). The circuit connection portion (24) is divided into two parts by a slit (27) being formed therein. The slit (27) is formed up to a part of the resistance connection portion (23).
    Type: Grant
    Filed: March 30, 2012
    Date of Patent: February 24, 2015
    Assignees: Furukawa Electric Co., Ltd, Furukawa Automotive Systems Inc.
    Inventors: Kazuyuki Tanaka, Kengo Aburaya, Yuuichi Watanabe, Kazumasa Sakata
  • Publication number: 20140327512
    Abstract: A resistor includes a substantially cylindrical resistive element having a resistance of less than about 1 m?, a substantially cylindrical first termination electrically connected to the resistive element and a second termination electrically connected to the resistive element. The substantially cylindrical first termination is hollow to allow for accepting a connection such as from a battery cable. In addition there may be sense leads present on the resistor. A method of forming a substantially cylindrical resistor includes forming a hollow cylindrical resistor body by rolling a flat sheet comprising a resistive element and a first termination and a second termination joined on opposite ends of the resistive element.
    Type: Application
    Filed: May 16, 2014
    Publication date: November 6, 2014
    Applicant: Vishay Dale Electronics, Inc.
    Inventors: Clark Smith, Joel J. Smejkal, David Lange, Thomas L. Bertsch, Steve Hendricks, Rod Brune
  • Patent number: 8730003
    Abstract: A resistor includes a substantially cylindrical resistive element having a resistance of less than about 1 m?, a substantially cylindrical first termination electrically connected to the resistive element and a second termination electrically connected to the resistive element. The substantially cylindrical first termination is hollow to allow for accepting a connection such as from a battery cable. In addition there may be sense leads present on the resistor. A method of forming a substantially cylindrical resistor includes forming a hollow cylindrical resistor body by rolling a flat sheet comprising a resistive element and a first termination and a second termination joined on opposite ends of the resistive element.
    Type: Grant
    Filed: December 28, 2012
    Date of Patent: May 20, 2014
    Assignee: Vishay Dale Electronics, Inc.
    Inventors: Clark L. Smith, Joel J. Smejkal, David Lange, Thomas L. Bertsch, Steve Hendricks, Rod Brune
  • Publication number: 20140015636
    Abstract: It is an object to provide a configuration with an enhanced sensing accuracy, in which a shunt resistance main body and a terminal member are formed as separate pieces. A shunt resistor includes a resistance main body and a terminal member (21) that is electrically connected to the resistance main body. The terminal member (21) includes a resistance connection portion (23) to be in contact with the resistance main body, and a circuit connection portion (24) provided so as to extend from the resistance connection portion (23). The circuit connection portion (24) is divided into two parts by a slit (27) being formed therein. The slit (27) is formed up to a part of the resistance connection portion (23).
    Type: Application
    Filed: March 30, 2012
    Publication date: January 16, 2014
    Applicants: FURUKAWA AUTOMOTIVE SYSTEMS INC., FURUKAWA ELECTRIC CO., LTD
    Inventors: Kazuyuki Tanaka, Kengo Aburaya, Yuuichi Watanabe, Kazumasa Sakata
  • Patent number: 8610534
    Abstract: A component includes a component body and a contact-connection element composed of sheet metal having a contact region, which has an outer contour line and at least one hole. The contact region is arranged on a side of the component body having a side edge and the outer contour line has straight regions running along straight regions of the side edge. The straight regions of the outer contour line are connected by rounded corners.
    Type: Grant
    Filed: November 30, 2012
    Date of Patent: December 17, 2013
    Assignee: Epcos AG
    Inventors: Franz Rinner, Christoph Auer, Shaoyu Sun, Yihai Sun
  • Patent number: 8514052
    Abstract: A surface-mounted resistor includes a flat-type base member having a first surface, a second surface, and a lateral surface. Each of the first and second surfaces has a rectangular shape. The surface-mounted resistor also includes a resistance element formed on the first surface; a pair of internal electrodes formed on both ends of the resistance element by being partially superposed with the resistance element; and a pair of external electrodes. Each of the external electrodes has a first bended portion having an L-shape formed by an internal electrode connection portion and a lateral portion, and a second bended portion having an L-shape formed by the lateral portion and a substrate connection portion. The internal electrode and the internal electrode connection portion are fixed to each other through a conductive fixation material, and a position of the base member is biased in a thickness direction toward the first bended portion.
    Type: Grant
    Filed: May 17, 2011
    Date of Patent: August 20, 2013
    Assignee: Rohm Co., Ltd.
    Inventors: Masaki Yoneda, Makoto Toyonaga
  • Patent number: 8344846
    Abstract: A resistor includes a substantially cylindrical resistive element having a resistance of less than about 1 m?, a substantially cylindrical first termination electrically connected to the resistive element and a second termination electrically connected to the resistive element. The substantially cylindrical first termination is hollow to allow for accepting a connection such as from a battery cable. In addition there may be sense leads present on the resistor. A method of forming a substantially cylindrical resistor includes forming a hollow cylindrical resistor body by rolling a flat sheet comprising a resistive element and a first termination and a second termination joined on opposite ends of the resistive element.
    Type: Grant
    Filed: March 18, 2011
    Date of Patent: January 1, 2013
    Assignee: Vishay Dale Electronics, Inc.
    Inventors: Clark L. Smith, Joel J. Smejkal, David L. Lange, Thomas L. Bertsch, Steve Hendricks, Rod Brune
  • Patent number: 8248202
    Abstract: A metal strip resistor includes a resistor body having a resistive element formed from a strip of an electrically resistive metal material and a first termination electrically connected to the resistive element to form a first junction and a second termination electrically connected to the resistive element to form a second junction, the first termination and the second termination formed from strips of electrically conductive metal material. The resistive element, the first termination, and the second termination being arranged mitigate thermally induced voltages between the first junction and the second junction.
    Type: Grant
    Filed: August 6, 2009
    Date of Patent: August 21, 2012
    Assignee: Vishay Dale Electronics, Inc.
    Inventors: Doug Brackhan, Clark L. Smith, Thomas L. Veik
  • Patent number: 7940157
    Abstract: A resistor layout structure and a manufacture method thereof are provided. The resistor layout structure includes a substrate, a plurality of metals, and a plurality of resistor lumps. The plurality of metals is disposed on the substrate. The plurality of first resistor lumps is disposed on the substrate. The metals are used as a supporting structure during the disposing process. Besides, the metals are interlaced and connected in series connected with the resistor lumps to form the resistor. Therefore, the present invention decreases the resistance variability of the resistor.
    Type: Grant
    Filed: May 29, 2007
    Date of Patent: May 10, 2011
    Assignee: Industrial Technology Research Institute
    Inventors: Wei-Ting Chen, Chang-Sheng Chen, Chin-Sun Shyu, Chang-Lin Wei
  • Patent number: 7911319
    Abstract: A resistor includes a substantially cylindrical resistive element having a resistance of less than about 1 m?, a substantially cylindrical first termination electrically connected to the resistive element and a second termination electrically connected to the resistive element. The substantially cylindrical first termination is hollow to allow for accepting a connection such as from a battery cable. In addition there may be sense leads present on the resistor. A method of forming a substantially cylindrical resistor includes forming a hollow cylindrical resistor body by rolling a flat sheet comprising a resistive element and a first termination and a second termination joined on opposite ends of the resistive element.
    Type: Grant
    Filed: February 6, 2008
    Date of Patent: March 22, 2011
    Assignee: Vishay Dale Electronics, Inc.
    Inventors: Clark L. Smith, Joel J. Smejkal, David Lange, Thomas L. Bertsch, Steve Hendricks, Rod Brune
  • Patent number: 7847673
    Abstract: This is a ceramic disk PTC and heater assembly, and a method for attaching one to the other, the combination useful in the heating elements of solid ink printing apparatus. The ceramic disk PTC attachment method is made up of a low melting temperature solder and a high operating temperature adhesive. The solder attaches the disk to a substrate, and provides a low resistance electrical and thermal bond to the substrate. The adhesive is used to substantially completely encircle the solder, containing the solder when melted, and keeping the PTC attached when the solder is melted. The adhesive can also partially encircle the solder to a degree sufficient to substantially prevent substantial escape of molten solder from the attachment area.
    Type: Grant
    Filed: October 18, 2007
    Date of Patent: December 7, 2010
    Assignee: Xerox Corporation
    Inventor: Thomas R. Scott
  • Patent number: 7446286
    Abstract: A heater strip for use as a heating element in an electric heater is made up of a profiled strip made of a flat metallic material forming a resistor section and of mounting elements extending over one common longitudinal side and they are manufactured as one piece with the resistor section for mounting the heater strip to a support. The strip has a zigzag-shaped structure. The mounting elements are provided only on the flat leg sections of the zigzag-shaped heater strip.
    Type: Grant
    Filed: July 14, 2006
    Date of Patent: November 4, 2008
    Assignee: Electrovac AG
    Inventors: Josef Reithofer, Christian Auradnik
  • Patent number: 7241975
    Abstract: Resistive igniter systems are provided that comprise a metal substrate with an associated resistive igniter element in electrical connection through braze applied to the metal substrate. Igniter systems of the invention can enable significantly simplified manufacturing as well as notably higher yield production of more robust igniters. In preferred systems, the braze material is applied to the metal substrate prior to adjoining the igniter and metal substrate, which can enable application of a relatively precise amount of braze in a defined area of the metal substrate.
    Type: Grant
    Filed: May 25, 2005
    Date of Patent: July 10, 2007
    Assignee: Saint-Gobain Ceramics and Plastics, Inc.
    Inventors: Scott M. Hamel, Taehwan Yu, Louis Castriotta, III, Jack F. Eckalbar, Jr.
  • Patent number: 7161463
    Abstract: The organic NTC composition according to the present invention is a mixture of a conjugated organic semiconductor polymer and a thermoplastic resin or thermosetting resin. For example, the mixed amount of the thermoplastic resin or thermosetting resin is preferably equal to or lower than two times the amount of the conjugated organic semiconductor polymer, and a conjugated organic semiconductor polymer selected from solvent-soluble polyaniline, polythiophene, polypyrrole and their derivatives is preferably used. This organic NTC composition makes it possible to provide an organic NTC device without using any expensive material and facilitates easy production at low temperatures.
    Type: Grant
    Filed: December 13, 2002
    Date of Patent: January 9, 2007
    Assignee: Shin-Etsu Polymer Co., Ltd.
    Inventors: Toshiyuki Kawaguchi, Masayuki Takahashi
  • Patent number: 7148785
    Abstract: A circuit protection device (31) suitable for surface mounting on a substrate (19). The device has a laminar PTC resistive element (3) which is composed of a conductive polymer composition and is positioned between first and second electrodes (5,7). Attached to the first electrode is a first electrical terminal (33) containing an electrically conductive material which has a first attachment portion (35) connected to a first flexible portion (39) by means of a first connection portion (47). At least part of the first flexible portion is free of attachment to the first electrode. The first attachment portion is coplanar with at least one of the first connection portion and the first flexible portion. The first attachment portion may contain a slot (49) and a solid hinge portion (51).
    Type: Grant
    Filed: April 30, 2004
    Date of Patent: December 12, 2006
    Assignee: Tyco Electronics Corporation
    Inventors: Paul N. Becker, Sirikhit Maniraj, Martin Pineda, Anthony Vranicar, Francis M. Yankello, Frank Wasilewski
  • Patent number: 7053750
    Abstract: A resistive pin for use in a voltage probe includes a pin-head that is configured to contact a test point in a device under test, and a resistor that is attached to the pin-head. Other systems are also provided for establishing electrical connections between testing instruments and devices under test.
    Type: Grant
    Filed: May 29, 2002
    Date of Patent: May 30, 2006
    Assignee: Agilent Technologies, Inc.
    Inventor: David J Dascher
  • Patent number: 6906611
    Abstract: A ceramic component includes a ceramic body, electrodes applied to the ceramic body, electrical connectors that connect the electrodes with one or both of an external circuit and a voltage source, a substance that connects the electrical connectors to the electrodes, and a casing that covers the electrodes at least partly. The substance is cured and electrically conductive, and contains a precious metal that is not silver.
    Type: Grant
    Filed: May 7, 2001
    Date of Patent: June 14, 2005
    Assignee: EPCOS AG
    Inventors: Franz Schrank, Gerald Kloiber
  • Patent number: 6441718
    Abstract: A surface mount resistor includes an elongated piece of resistive material having strips of conductive material attached to its opposite ends. The strips of conductive material are separated to create an exposed central portion of the resistive material therebetween. According to the method the resistive strip is attached to a single co-extensive strip of conductive material and a central portion of the conductive material is removed to create the exposed central portion of the resistive strip.
    Type: Grant
    Filed: November 17, 2000
    Date of Patent: August 27, 2002
    Assignee: Vishay Dale Electronics, Inc.
    Inventors: Joel J. Smejkal, Steve E. Hendricks
  • Patent number: 6326677
    Abstract: A ball grid array resistor network has a substrate that has top and bottom surfaces. Resistors are disposed on the top surface. Conductors are disposed on the top surface, and each conductor is electrically connected to an end of each resistor. Vias extend through the substrate and are electrically connected to the conductors. Solder spheres are disposed on the bottom surface, and are electrically connected to the vias. A cover coat is disposed over the conductors and resistors. In an alternative embodiment, the vias are eliminated and the resistor network is formed on the bottom surface of the substrate. The resistor network provides a high density of resistors per unit area.
    Type: Grant
    Filed: September 4, 1998
    Date of Patent: December 4, 2001
    Assignee: CTS Corporation
    Inventors: Terry R. Bloom, Stephen W. Burry, Lewis L. Seffernick, Robert M. VandenBoom, John Zdanys, Jr.
  • Patent number: 6181234
    Abstract: A monolithic resistor is provided with a central resistive metallic foil strip positioned between and attached to a pair of wings formed from an electrically conductive metallic foil. The wings include large surface areas to dissipate heat. A plurality of terminal pins are formed in the conductive strips for connection to an integrated circuit board, as well as a current source.
    Type: Grant
    Filed: December 29, 1999
    Date of Patent: January 30, 2001
    Assignee: Vishay Dale Electronics, Inc.
    Inventors: Joseph Szwarc, Joel J. Smejkal
  • Patent number: 6097277
    Abstract: A resistor network has a substrate with top and side surfaces. Resistors are located on the side surfaces. Several side conductors are located on the side surface and are electrically connected to the resistors. Several top conductors are located on the top surface and are electrically connected to the side conductors. Each top conductor has a cavity. A solder sphere is partially located in the cavity and is electrically and mechanically connected to the top conductor by reflowed solder paste. A cover coat covers the side conductors and the resistors. The resistor network provides a high density of resistors per unit area.
    Type: Grant
    Filed: November 5, 1998
    Date of Patent: August 1, 2000
    Assignee: CTS
    Inventors: Steven N. Ginn, James N. Hufford, John Zdanys, Jr., Stephen W. Burry, Lewis L. Seffernick, Robert M. VandenBoom
  • Patent number: 6090313
    Abstract: A high temperature PTC device comprising a polymeric conductive composition that includes nylon-11 and a carbon-based particulate conductive filler has a switching temperature greater than 150.degree. C., preferably between about 160.degree. C. and 200.degree. C. The composition demonstrates a high PTC effect (at least 10.sup.3, and more typically 10.sup.4 to 10.sup.5 or greater) and a resistivity at 25.degree. C. of 100 .OMEGA.cm or less, preferably 10 .OMEGA.cm or less. High temperature PTC devices that comprise nylon-11 or nylon-12 compositions and that are manufactured by extrusion/lamination demonstrate good thermal and electrical stability compared with those manufactured by compression molding and do not require composition crosslinking for stability, although crosslinking may be used to further improve stability. The use of a high temperature solder for attaching electrical terminals to the device improves the PTC properties of the device.
    Type: Grant
    Filed: June 28, 1999
    Date of Patent: July 18, 2000
    Assignee: Therm-O-Disc Inc.
    Inventor: Liren Zhao
  • Patent number: 6078028
    Abstract: An electrical connection for a ceramic hot surface element in which the ends of the hot surface element are essentially interference fit within a pair of metallic termination sleeves, and electrical connection to the hot surface element is provided by an active metal braze which is directly chemically bonded to the metallic termination.
    Type: Grant
    Filed: February 19, 1999
    Date of Patent: June 20, 2000
    Assignee: Saint-Gobain Industrial Ceramics, Inc.
    Inventors: John Cooper, Bela Nagy, David Shum, Brian Kochan, Scott Hamel
  • Patent number: 6020809
    Abstract: A thermistor with positive resistance-to-temperature characteristic used in a overcurrent protection circuit has electrodes on mutually opposite main surfaces and is mounted to a substrate having electrically conductive members such that deterioration of its voltage resistance due to heat emission can be controlled. A spacer with smaller thermal conductivity than the substrate and penetrated by a conductor piece with a small cross-sectional area is inserted between solder materials connecting to one of the thermistor electrodes. The other electrode is contacted by an elongated connecting member through its sectional surface transverse to its longitudinal direction such that the cross-sectional area of electrical conduction is reduced.
    Type: Grant
    Filed: February 9, 1999
    Date of Patent: February 1, 2000
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Michio Miyazaki, Haruyuki Takeuchi, Tadao Bekku
  • Patent number: 5929745
    Abstract: A high-voltage variable resistor unit including a terminal connection structure capable of preventing upward movement or rotation of the terminal by simple construction. A terminal is provided with a connecting portion between a held portion and a lead wire connected portion. A terminal fixing portion of the insulating casing is provided adjacent to a terminal holding portion with a connecting portion receiving recess in which the connecting portion of the terminal is received. An insulating resin is charged in the connecting portion receiving recess and hardened. The walls surrounding the connecting portion receiving recess have a pair of grooves each formed on a pair of walls facing to a first linear connecting portion and a second linear connecting portion of the terminal.
    Type: Grant
    Filed: March 26, 1997
    Date of Patent: July 27, 1999
    Assignee: Hokuriku Electric Industry Co., Ltd.
    Inventors: Ichiro Tsunezawa, Motoharu Higami
  • Patent number: 5734313
    Abstract: A chip-type composite electronic component according to the present invention comprises an insulating substrate (1), a common electrode (2) formed on the substrate (1), a plurality of individual electrodes (3a-3h) formed on the substrate (1) to be spaced from the common electrode (2), and a plurality of electronic elements (4a-4e) each interposed between each of the individual electrodes (3a-3h) and the common electrode (2). Each of the common electrode (2) and individual electrodes (3a-3h) has a plated solder layer as an outermost layer. Each of the electronic elements (4a-4e) has a direct current resistance of no less than 47K .OMEGA., and the solder layer of the common electrode (2) has a layer thickness which is no more than 2.9 times as great as that of the solder layer of the individual electrodes (3a-3h).
    Type: Grant
    Filed: June 27, 1996
    Date of Patent: March 31, 1998
    Assignee: Rohm Co., Ltd.
    Inventors: Masato Doi, Hirotoshi Inoue, Seiji Mitsuno
  • Patent number: 5519187
    Abstract: An electrically conductive ceramic glow plug for assisting in the combustion process of a compression ignition type internal combustion engine. The glow plug comprises a tubular metal outer body member adapted to be secured to a cylinder head of the engine, a lead-in wire terminal extending through the outer body member from one end thereof, and electrically conductive heating element extending through the outer metal body from the other end thereof, secured to the terminal. The heating element is an all-ceramic electrically conductive heating element, and includes a cylindrical body portion of ceramic particles having a thin path of electrically conductive ceramic particles disposed substantially coaxially with the body portion throughout its length from a heating tip at one end to the wire terminal at the other end. The ceramic heating element includes a coaxially extending pocket at the wire terminal end and the base of the pocket is exposed to the thin path of electrically conductive ceramic particles.
    Type: Grant
    Filed: September 6, 1994
    Date of Patent: May 21, 1996
    Assignee: Detroit Diesel Corporation
    Inventor: Stanley J. Hinkle
  • Patent number: 5495223
    Abstract: A hybrid integrated circuit device includes a circuit board having at least two electrical conductors; a chip resistor bridgingly disposed across two of the electrical conductors of the circuit board; and solder electrically connecting the chip resistor to the two electrical conductors. The chip resistor has an electrically insulating substrate, two electrodes disposed on the electrically insulating substrate, separated from each other, and each electrode has a contact end electrically contacting the electrical conductors of the circuit board and a resistor element disposed on the electrically insulating substrate and electrically connected to the contact ends of the electrodes. The solder electrically connects the electrodes of the chip resistor to the electrical conductors of the circuit board.
    Type: Grant
    Filed: December 17, 1993
    Date of Patent: February 27, 1996
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Ziro Honda, Takashi Takahashi
  • Patent number: 5471032
    Abstract: An ignitor for fuel gas burners formed of a plurality of spaced parallel filaments of SiC coated Carbon (C) high temperature brazed with Chromium Silicide in grooves provided in a refractory base block of Aluminum Oxide and Silicon Oxide. Terminal posts of IVIoSi are embedded in the high temperature braze. Stainless steel lead attachment pads are nickel-chrome brazed to the posts at a lower temperature. Removable notched graphite bridges and graphite hold-down blocks position the filaments during the high temperature brazing.
    Type: Grant
    Filed: September 30, 1993
    Date of Patent: November 28, 1995
    Assignee: Eaton Corporation
    Inventors: Gordon B. Spellman, C. Greg Chen
  • Patent number: 5300755
    Abstract: An arrangement and method for establishing an electrical and mechanical connection between electrically conductive members. The arrangement includes an electrically conductive connecting member, two electrically conductive metallic members disposed opposite each other, flanking the connecting member, and clamping the connecting member therebetween, and a source of laser energy oriented such that an output beam therefrom is incident on an outer surface of one of the metallic members and directed towards the underlying connecting member to establish a weld connection at zones of mutual contact between the connecting member and the respective metallic members. The connecting member includes a cable or the like and the metallic members include contact terminals, busbars or the like.
    Type: Grant
    Filed: August 7, 1992
    Date of Patent: April 5, 1994
    Assignee: Yazaki Corporation
    Inventors: Keizo Nishitani, Masuo Sugiura, Isao Takiguchi, Tetsurou Saimoto
  • Patent number: 5287081
    Abstract: Multilayer, thin film multijunction integrated micropotentiometers are formed in an integral multifilm membrane form over a through opening in a nonmagnetic, dielectric substrate. Through the use of conventional photolithographic and etching techniques, integrated structures are formed to include either single elongate heater elements, bifilar heater elements, or trifilar heater elements with multiple return paths. Multijunction thermopiles and resistors are formed with the heater. The individual layers of silicon oxide or silicon nitride, are formed with conventional chemical vapor deposition, sputtering and other known techniques.
    Type: Grant
    Filed: January 13, 1993
    Date of Patent: February 15, 1994
    Assignee: The United States of America as represented by the Secretary of Commerce
    Inventors: Joseph R. Kinard, De-xiang Huang, Donald B. Novotny
  • Patent number: 5204655
    Abstract: A resistor element for determining a parameter, including a planar ceramic substrate having a bearing surface and at least one aperture formed through the thickness thereof, an electrically resistive metallic layer which is substantially formed on the bearing surface of the ceramic substrate and has at least one extension which covers an inner wall surface of the above-indicated at least one aperture, a pair of conductors for connecting the resistive metallic layer to an external circuit, at least one of the pair of conductors being inserted into a corresponding one of the above-indicated at least one aperture of the ceramic substrate, and an electrically conductive adhesive at least partially filling each of the above-indicated at least one aperture, for securing an end portion of the corresponding one of the pair of conductors to the ceramic substrate, the electrically conductive adhesive electrically connecting the above-indicated at least one conductor to the above-indicated at least one extension of the
    Type: Grant
    Filed: September 9, 1991
    Date of Patent: April 20, 1993
    Assignee: NGK Insulators, Ltd.
    Inventors: Yasuhiro Yajima, Takayuki Ogasawara
  • Patent number: 5168256
    Abstract: A resistor element for determining a parameter, including a ceramic support having a bearing surface, an electrically resistive body formed on the bearing surface of the ceramic support, a conductor or conductors electrically connected to the electrically resistive body, the conductor(s) having a lower thermal conductivity than a conductor made of platinum, and an adhesive for securing the conductor(s) to the ceramic support. The conductor is defined by a lead wire made of an alloy and a covering layer made of a metal which covers the lead wire. The adhesive contains at least one metal of which at least an outer surface of each conductor is formed, so as to increase bonding strength between the conductor(s) and the adhesive.
    Type: Grant
    Filed: March 13, 1991
    Date of Patent: December 1, 1992
    Assignee: NGK Insulators, Ltd.
    Inventors: Fujio Ishiguro, Zenji Ishikawa
  • Patent number: 4991059
    Abstract: An electronic component with leads each having a bonding portion is disclosed. Each bonding portion is formed with a through hole or a notch to provide for satisfactory soldering and reduce the possibility of defective soldering.
    Type: Grant
    Filed: September 8, 1988
    Date of Patent: February 5, 1991
    Assignee: Mitsubishi Denki K.K.
    Inventor: Tomohito Kiyose
  • Patent number: 4978814
    Abstract: An electrical connector for making a connection to a thick film track comprises a plurality of conductive fibres braided together, each of the fibres having a diameter so as to provide sufficient stiffness to the connector and to permit adhesion of the connector to a thick film track.
    Type: Grant
    Filed: February 13, 1989
    Date of Patent: December 18, 1990
    Assignee: Thorn EMI plc
    Inventor: Andrew M. Honour
  • Patent number: 4937435
    Abstract: A flexible electric heating pad has a plurality of positive temperature coefficient (PTC) ceramic thermistor chip heating elements arranged in a two dimensional array between first and second flexible planar sheets of electrically conductive material, preferably woven of copper wire or other electrically conductive fibers. The PTC thermistor chips are disposed in spaced openings in a flexible dielectric separator disposed between the sheets and each chip has opposed planar surfaces soldered, welded or brazed to the sheets to establish electrical and thermal contact therewith. An outer flexible dielectric material covers the external surfaces of the sheets to prevent grounding or shock. A metallic enclosure, for example of stainless steel, can be formed over the outer dielectric material to add corrosion or abrasion resistance to the flexible heating pad.
    Type: Grant
    Filed: March 15, 1989
    Date of Patent: June 26, 1990
    Assignee: Thermon Manufacturing Company
    Inventors: David C. Goss, Chandrakant M. Yagnik
  • Patent number: 4937551
    Abstract: An improved PTC thermal protector device is disclosed wherein the PTC element is protected from excessive mechanical forces such as shear forces that would otherwise significantly degrade PTC performance. The PTC element is protected by one or more adhesive masses in contact with both terminals of the device. The improved PTC thermal protector device does not require the use of specially designed terminals or terminal attachments, yet is simple to assemble on a mass-production basis.
    Type: Grant
    Filed: February 2, 1989
    Date of Patent: June 26, 1990
    Assignee: Therm-O-Disc, Incorporated
    Inventor: E. Robert Plasko
  • Patent number: 4855570
    Abstract: An electric heating unit for heating fluid, such as air in a hair drier, includes two ring-shaped electrodes and a plurality of spaced, plate-like ceramic heating elements having a positive temperature coefficient of resistance (PTC) aligned between the electrodes. The electrodes comprise an inner ring and an outer ring disposed in a nested, concentric, spaced relationship. The PTC ceramic plates are radially arranged in aligned spaced relationship with the opposite ends of each PTC ceramic plate mechanically and electrically connected respectively to the inner and outer rings. The inner and outer rings can be formed as arc-shaped segments separated by gaps prevent damage to the PTC ceramic plates by heat strain, and are provided with slits, grooves, etc., for firmly positioning the PTC ceramic plates.
    Type: Grant
    Filed: December 9, 1987
    Date of Patent: August 8, 1989
    Inventor: Tim Wang
  • Patent number: 4823461
    Abstract: A method of manufacturing a fluidic angular rate sensor of the type wherein fine wires, such as tungsten wires, are mounted in tension over the heads of two pairs of spaced apart metal supports which are mounted on a ceramic disc having fluid passage apertures therein, comprising plating gold on the wires; fixedly mounting the wires between the spread apart metal supports by means of thermocompression bonding or the like; and heating the mounted gold plated wires in a predetermined atmosphere for removing the plated gold from the wires and to recrystallize the wires.
    Type: Grant
    Filed: May 24, 1988
    Date of Patent: April 25, 1989
    Assignees: Honda Motor Co., Ltd., Stanley Electric Co., Ltd.
    Inventors: Fumitaka Takahashi, Kunio Okazaki, Masaru Shiraishi, Masayuki Takahashi
  • Patent number: 4803345
    Abstract: A ceramic heater body is formed in a plate shape, and has electrode attaching portions at both ends of the heater body. A plurality of openings are formed in the electrode attaching portion, and a metallized layer is formed on the inner peripheral surface of each of the openings. Electrodes having a plurality of wires are connected to the electrode attaching portions, for supplying power to the heater body. The metal wires are inserted into the openings formed having the metallized layers on the inner peripheral surfaces, and are secured by brazing to the metallized layers. The diameter of the metal wire is set to 0.5 to 3 mm, and the metal wires are buried in the openings, at a depth of 1 to 5 mm.
    Type: Grant
    Filed: July 10, 1987
    Date of Patent: February 7, 1989
    Assignee: Nippondenso Co., Ltd.
    Inventors: Hiroki Hoshizaki, Kazuo Oyobe, Hirofumi Suzuki, Nobuaki Kawahara, Hitoshi Niwa, Terutaka Kageyama
  • Patent number: 4758814
    Abstract: A first layer of titanium or tin is vapor deposited upon opposing major surfaces on the ceramic sensor. A second layer consisting of platinum, palladium or ruthenium is deposited over the first layer. The structure is then preferably annealed in air in order to crystallize the external layer to roughen the exterior surface and enhance adhesion. Lead wires, preferably made of Nichrome, are attached to the opposing surfaces by applying a conductive paste to the wire and surface functions, and firing the structure. The conductive paste provides a relatively low resistance, strong, mechanical bond between the lead wires and the roughened external surfaces of the structure. The first layer facilitates bonding of the second layer to the ceramic. The first and second layers cooperate to protect the ceramic from the potentially harmful glass frit contained in the conductive paste.
    Type: Grant
    Filed: December 2, 1985
    Date of Patent: July 19, 1988
    Assignee: Motorola, Inc.
    Inventors: Wei-Yean Howng, Rong-Fong Huang, Rickey G. Pastor
  • Patent number: 4730102
    Abstract: An electroceramic heater including a pair of metallized electrodes disposed upon the sides of an electroceramic body and a pair of lead wires ultrasonically welded and metallurgically to the electrodes, with the inner ends of the wires being swaged such that they have a generally flat appearance.
    Type: Grant
    Filed: September 15, 1986
    Date of Patent: March 8, 1988
    Assignee: GTE Products Corporation
    Inventor: Lionel J. Melanson
  • Patent number: 4720697
    Abstract: A terminal for electrical resistance heating elements, comprising a thin, resistance thread of a highly temperature resistant material, particularly MoSi.sub.2, which at least one end thereof has a lead-in electrode of a material having a better conductivity than that of the resistance heating element and having a greater cross-sectional area than that of the resistance thread.The terminal comprises an outer thin-walled sheating of stainless steel, one end of which is shaped as a sleeve and the other end of which is flattened into a flat connecting tongue having a transverse bore. The sheating contains a filling of aluminum wherein one end of the resistance thread is molten in.
    Type: Grant
    Filed: November 7, 1985
    Date of Patent: January 19, 1988
    Assignee: Kanthal AB
    Inventor: Venonzio Bizzarri
  • Patent number: H498
    Abstract: Disclosed is an electronic component which includes soldered leads (30 and 31) for electrical connection to other components. The electronic component is typically a film or hybrid integrated circuit formed on an insulating substrate (10) which includes contact pads (20-23) on the periphery. Clip-on type leads (30 and 31) are soldered to these pads. The leads include a thin layer of nickel (36) formed at least in the jaw (32) of the clip-on lead to prevent the formation of brittle intermetallics by the interaction of solder components with the lead components.
    Type: Grant
    Filed: August 31, 1984
    Date of Patent: July 5, 1988
    Inventors: Harry N. Keller, Joseph M. Morabito