Abstract: The present invention relates to a method for heat-treating water-absorbing polymeric particles at a temperature in the range of from 100 to 250° C. in a fluidized bed dryer under specifically adapted apparatus and method conditions, the use of a fluidized bed dryer for heat-treating water-absorbing polymeric particles in continuous or batch mode as well as to the heat-treated polymeric particles obtained by the method of the present invention.

Abstract: A reactor defines a reaction chamber for processing a substrate. The reactor comprises a first inlet for providing a first reactant and to the reaction chamber and a second inlet for a second reactant to the reaction chamber. A first exhaust outlet removes gases from the reaction chamber. A second exhaust outlet removes gases from the reaction chamber. A flow control system is configured to alternately constrict flow through the first and second exhaust outlets. The reactor chamber is configured to for a diffusion barrier within the reaction chamber.

Abstract: A semiconductor wafer drying apparatus is provided. In one embodiment, this apparatus includes a bath which can contain much deionized water so that semiconductor wafers soak in the deionized water; a chamber providing a space where vapor flows over the bath; a vapor supply line supplying vapor to the internal space of the chamber; an exhaust line discharging vapor contained in the chamber; a deionized water exhaust line discharging deionized water in the bath; a semiconductor wafer holder supporting the semiconductor wafer in the bath; and pitch guides placed at left and right sides of the semiconductor wafer, movable to a first position and a second position in a vertical direction, wherein the pitch guides are separated from the semiconductor wafer at the first position and contact the semiconductor wafer at the second position thus preventing the movement of the semiconductor wafer.

Abstract: A semiconductor wafer drying apparatus is provided. In one embodiment, this apparatus includes a bath which can contain much deionized water so that semiconductor wafers soak in the deionized water; a chamber providing a space where vapor flows over the bath; a vapor supply line supplying vapor to the internal space of the chamber; an exhaust line discharging vapor contained in the chamber; a deionized water exhaust line discharging deionized water in the bath; a semiconductor wafer holder supporting the semiconductor wafer in the bath; and pitch guides placed at left and right sides of the semiconductor wafer, movable to a first position and a second position in a vertical direction, wherein the pitch guides are separated from the semiconductor wafer at the first position and contact the semiconductor wafer at the second position thus preventing the movement of the semiconductor wafer.

Abstract: An apparatus for drying semiconductor wafers includes a bath for receiving semiconductor wafers and for holding a fluid, a chamber for providing an area where vapor is flowable over the bath, a supply pipeline for supplying vapor to the chamber, a vapor discharging pipeline for expunging vapor in the chamber, a fluid discharging pipeline for draining fluid in the chamber therefrom, and a protector for maintaining a distance between the semiconductor wafers during a drying process.

Abstract: Liquid for prevention of substrate drying is supplied into a processing chamber so that a pool of the liquid is created as an anti-drying atmosphere in advance inside a processing chamber, and substrates, as they are dipped in the pool, are kept on stand-by in a substrate board. In this manner, air drying of the substrates which are kept on stand-by is prevented. When the number of the substrates in the substrate board reaches a certain number, the anti-drying atmosphere is removed from the processing chamber, which is followed by introduction of an SCF into the processing chamber and supercritical drying (high pressure drying) of all of the plurality of substrates inside the processing chamber, namely, batch supercritical drying.

Abstract: A heat and/or mass transfer process and apparatus for treating various types of materials. A heat and/or mass transfer process includes causing a gas to impinge upon a flowing material, wherein the gas velocity having a component tangential to the flow direction of the material can be characterized such that a fluctuating velocity is superimposed upon the mean velocity of the material in the flow direction. The process further includes effecting velocity fluctuations by means of a traveling tangential acoustic wave while a steady overall gas flow is maintained, and controlling the gas velocity by means of a vernier valve. By using fluctuating velocity superimposed upon the mean velocity, an effective thermal and mass transfer resistance of the boundary layer can be reduced, as well as reducing the pressure fluctuations.

Abstract: Spray drying is performed at increased pressure whereby advantages are obtained as to product characteristics and production capacity. Particulate materials of an amorphous structure and non-dusting high-bulk density powders can be obtained.

Abstract: A method for treating a descending process flow and a spherical-shaped semiconductor integrated circuit manufacturing system incorporating the same. The manufacturing system includes a first processing station, a second processing station and first and second intermediate stations positioned between the first and second processing stations. The first processing station produces, at an output thereof, a first process flow comprised of a first process fluid and spherical-shaped semiconductors. The output of the first processing station is coupled to a first downwardly descending tube which forms an input tube of the first intermediate station. The first process flow enters a porous tube positioned inside an evacuation chamber.

Abstract: The present invention 10 discloses a device for removing water from the surface of a vehicle as the vehicle emerges from a car wash. Disclosed is an arched conduit 12 having a blower 18 for directing outside atmospheric air therethrough along with a plurality of swiveling air egress members 16 for directing a plurality of streams of high pressure air into the vehicle passageway 22 formed by the conduit arch 12. A plurality of electrically controlled position motors 26 are used to directionally position the air egress members 16 which members swivel by means of a ball socket fixture 38 on their base with means for connecting 24 the position motors to the air egress members 16. Also, the plates 44 of the conduit arch are welded to each other with the welds 46 being covered by a silicon-like material 48.

Abstract: A cleaning apparatus capable of supplying on a substantially continuous basis an anhydrous agent and water to an area to be cleaned. The cleaning machine includes an inner enclosure disposed in an interior chamber of an outer enclosure. The outer enclosure is designed to enclose the interior chamber. Also, provided in the cleaning apparatus is a system for purging the interior chamber with dry air. The inner enclosure contains the anhydrous agent, which is typically baking soda. The inner enclosure further includes a system for distributing the anhydrous agent to a cleaning nozzle.

Abstract: A device for preparing a spray-dried product includes a drying chamber with a distribution element placed therein for atomizing liquid to be spray-dried, an element for supplying drying gas, an element supplying a stream of solid particles to a stream of droplets atomized from the distribution element, and one or more fluidized beds, each having at least one bottom plate with openings which has gas supply structure opening out at the underside thereof. These fluidized beds are placed connected to each other inside the drying chamber, opposite the distribution element, the above in such a way that the combined streams of droplets from the distribution element and solid particles fall essentially into the first bed, and conveyance of material from the first bed to the second bed can take place.

Abstract: A device for preparing a spray-dried product is described, the distance between the distribution element and a fluidized bed in the device being such that the particles have essentially reached their critical moisture content. A method showing the mixing of the primary liquid droplets delivered by the distribution element and solid particles is also specified.

Abstract: A method and apparatus for heating a plurality of bottle caps simultaneously. The apparatus comprises a housing with an air blower, resistance heaters and a thermocouple positioned within its interior. Air blown through the interior is heated by resistance heaters and travels through air ducts positioned at the opposite end of the housing. The air duct is positioned in spaced relation to the interior of a hopper and has a series of apertures through which heated air is injected into the hopper's interior. The flow rate of the air is sufficiently high so that the heated air agitates the caps within the hopper and is evenly distributed throughout the interior of the hopper. The temperature of the air is controlled so that the caps are warmed to a temperature within the range of 88.degree. F. to 92.degree. F.