Abstract: The present invention is generally related to an apparatus and method for sanitizing a continuous positive airway pressure (CPAP) device, in particular the invention relates to a system, method and device that attach to a CPAP device and sanitizes all of the parts of the CPAP device, including the inner areas of the hose, reservoir and face mask most prone for bacteria buildup. The device has an ozone operating system and one or more ozone distribution lines that distributes ozone to a CPAP device and a non-permeable bag for sanitizing a CPAP mask.

Abstract: The present invention provides a method for the acetylation of wood comprising treating the wood with an acetylation medium under wood acetylation reaction conditions and drying the acetylated wood, wherein the drying comprises at least two steps, wherein the wood is first dried with a first drying medium and then with a second drying medium.

Abstract: A CPAP equipment sanitizing system that includes an oxidizing gas generator, a sanitizing chamber and tubing. The oxidizing gas generator has an outlet port. The sanitizing chamber includes an enclosure, a fitting and a closure mechanism. The enclosure has an opening. The enclosure is adapted to receive CPAP equipment. The enclosure has an aperture formed in a surface thereof. The fitting that extends through the aperture and sealingly engages the sanitizing chamber. The closure mechanism is capable of substantially closing the opening. The tubing operably attaches the outlet port on the oxidizing gas generator and the fitting.

Abstract: The present disclosure generally relates to an ozone sanitizing system and method. In one embodiment, a system for sanitizing various objects using ozone gas is disclosed. The system comprises an ozone generating device configured generate ozone gas for sanitizing one or more objects, and a vessel configured to couple with the ozone generating device for receiving the ozone gas to sanitize the one or more objects stored inside the vessel during an ozone sanitizing cycle. The system is configured to recirculate at least a gas mixture generated during the ozone sanitizing cycle to increase an ozone concentration inside the vessel.

Abstract: The present invention is generally related to an apparatus and method for sanitizing a continuous positive airway pressure (CPAP) device, in particular the invention relates to a system, method and device that attach to a CPAP device and sanitizes all of the parts of the CPAP device, including the inner areas of the hose, reservoir and face mask most prone for bacteria buildup. The device has an ozone operating system and one or more ozone distribution lines that distributes ozone to a CPAP device and a non-permeable bag for sanitizing a CPAP mask.

Abstract: Cryogenic devices are provided in which liquid nitrogen is used to maintain ultra-low temperatures in which samples can be manipulated.

Abstract: Disclosed is a method for the continuous impregnation of wood elements, such as wood chips. The method comprises the subsequent steps of subjecting the wood elements to vacuum, to contact with acetylation fluid, and to impregnation pressure. Preferably, the process is conducted in a plant having conveyors, such as transportation screws, in suitable positions between the zones in which the subsequent process steps are conducted. The impregnation method is used in connection with the acetylation of the wood elements, and preferably is followed by a continuous acetylation process conducted in an acetylation reaction zone downstream of the zone where the impregnation is conducted.

Abstract: Porous diffuser assemblies including multiple diffuser elements. The porous diffuser assemblies include a diffuser body, a diffuser base coupled to the diffuser body and forming a plenum there between, the diffuser base including a plurality of openings formed therein, and a porous diffuser element disposed in each of the plurality of openings wherein surfaces of the porous diffuser elements are exposed to the plenum. Gas purged chambers and methods of purging a chamber are disclosed, as are numerous other aspects.

Abstract: A process for the acetylation of wood comprising submerging the wood in an acetylation fluid under pressure, and subsequently heating the wood under controlled conditions to initiate two distinct exothermic reactions. The process permits the simultaneous upgrading of large quantities of commercial wood sizes having a natural durability class 4 or class 5 to a unique product of durability class 1 or class 2.

Abstract: According to one embodiment, a supercritical drying method for a semiconductor substrate comprises introducing a semiconductor substrate, a surface of the semiconductor substrate being wet with a water-soluble organic solvent, to the inside of a chamber, hermetically sealing the chamber and increasing a temperature inside the chamber to not lower than a critical temperature of the water-soluble organic solvent, thereby bringing the water-soluble organic solvent into a supercritical state, decreasing a pressure inside the chamber and changing the water-soluble organic solvent in the supercritical state to a gas, thereby discharging the water-soluble organic solvent from the chamber, starting a supply of an inert gas into the chamber as the pressure inside the chamber decreases to atmospheric pressure, and cooling the semiconductor substrate in a state where the inert gas exists inside the chamber.

Abstract: A process of dewatering tailings is provided comprising mixing the tailings with a sufficient amount of an additive or a mixture thereof; depositing the resulting mixture into a disposal area; pumping water from the deposit to one or more sumps, and allowing the deposit to reach a sufficient strength; and removing remaining deposit water and rainfall through one or more of a network of ditches, a decant tower, or a plurality of dike drainage structures to yield a non-segregating deposit for reclamation.

Abstract: The present invention relates to an apparatus for removing liquid from a suspension. More particularly, the present invention relates to a filtration apparatus using vacuum pressure, compressed air and radiant heat to facilitate extraction of water from a suspension and an air flow within the vacuum chamber to remove the evaporate as a cost-efficient and resource-efficient means of filtering and drying solids in large volumes of suspension to remove interstitial and chemically bound liquids, resulting in up to 100% total solids.

Abstract: A process for removing water and solutes from the lumens of green wood, while leaving the cell walls throughout the wood uniformally fully swollen, comprises subjecting the green wood to supercritical carbon dioxide.

Abstract: A coal reforming apparatus includes: a dryer body provided to dry low-quality coal; a pyrolysis body which pyrolyzes the dried coal thus dried; and a briquetter which compression-molds the pyrolyzed coal thus pyrolyzed. The coal reforming apparatus has a radical scavenger supplier which supplies drying gas with a radical scavenger so that the low-quality coal can be dried in an atmosphere containing the radical scavenger, the drying gas being supplied from a drying gas supply source and heated by a heater, the radical scavenger being formed of an organic compound having a hydroxyl group.

Abstract: An evacuation method which can reduce evacuation time without causing moisture-related problems. In a vacuum processing apparatus including a vacuum processing chamber, during the evacuation for the vacuum processing chamber, the pressure in the vacuum processing chamber is maintained at a pressure lower than or equal to the atmospheric pressure but higher than or equal to 6.7×102 Pa (5 Torr).

Abstract: The removal of moisture from an object to be sterilized is provided through at least the steps of placing the load in the chamber, reducing the pressure within the chamber to increase the rate of evaporation of moisture from the load, monitoring over a predetermined period of time the increase in the quantity of vapor within the chamber resulting from evaporation of moisture from the load, admitting gas into the chamber and repeating the steps following placing the load into the chamber.

Abstract: A method of priming and drying substrates having high-aspect ratio trenches. In one aspect, the method comprises: a) supporting at least one substrate having high-aspect ratio trenches in a process chamber having a gaseous atmosphere; b) sealing the process chamber; c) vacuuming the process chamber to achieve a first sub-atmospheric pressure within the process chamber; d) introducing a wetting solution into the process chamber while maintaining the process chamber at a second sub-atmospheric pressure until the substrate is immersed in the wetting solution; e) restoring the process chamber to atmospheric pressure while the substrate remains immersed in the wetting solution; and f) removing the substrate from the wetting solution.

Abstract: A method includes circulating a heat transferring fluid in a substantially closed system including an interstice between a wafer and a chuck at a first pressure. The method further includes pumping the fluid out of the interstice and increasing the pressure of the fluid to a second pressure. The method further includes reducing the pressure of the fluid to the first pressure and returning the fluid to the interstice. In the system, the fluid in the interstice transfers heat from the wafer to the chuck, or vice versa, by conduction. The presence of a conducting fluid in the interstice thereby decreases the resistivity of the interface, and enables more efficient heat transfer from the wafer to the chuck.

Abstract: A synthesis process of trans-1,4-polyisoprene, using bulk precipitation polymerization of isoprene catalyzed by supported titanium catalyst TiCl4/MgCl2. The process includes prepolymerizing carried out in a prepolymerization reactor with an anchor agitator; polymerizing carried out in a polymerization reactor with a helical ribbon agitator; and devolatilizing and drying carried out in a vacuum rake dryer. Not only does the process require lower energy consumption and thus a lower production cost, but it also eliminates the emission of three wastes.

Abstract: Parts to be chemically treated are processed in a controlled-environment processing chamber. The process includes applying a negative gauge pressure to the chamber to remove air or other non-condensable gases. The process includes introducing an oxygen free solvent or aqueous solution in a vapor or liquid state. A first system removes oxygen and volatile contaminants from the object being processed and chamber, and a second system further recovers residual solvent from the object and chamber. Eliminating oxygen from the process prevents deflagration within the system thus allowing for the use of flammable solvents within the process.

Abstract: Provided is a method of manufacturing incombustible wood that enables maximization of the amount of an incombustion agent used to be impregnated into wood. Further provided is a method of manufacturing incombustible wood that completely satisfies incombustible-wood conditions required by the Building Standard law and that can be relatively easily manufactured. The method of manufacturing incombustible wood includes performing plural times of individual drying steps for drying wood (for example, board material B), decompression steps for decompressing the wood, decompression impregnation steps for impregnating the wood with an incombustibility treatment agent in a decompressed state, and compression impregnation steps for impregnating the wood with the incombustibility treatment agent in a compressed state, wherein two times of the individual decompression steps, individual decompression impregnation steps, and compression impregnation steps are performed, and three times of the drying steps are performed.

Abstract: A method of sterilizing and drying a dialyzer or other device, wherein a vacuum drying phase is interrupted by interspersed pulses of air or other gas. The pulses lessen the evaporative cooling effect, to thereby reduce differential shrinkage that can structurally damage the dialyzer.

Abstract: A wafer drying method includes submerging a wafer in a cleaning solution in a dry chamber. An organic liquid vapor from an organic liquid is supplied into the dry chamber at a first volumetric supply rate to form an organic liquid layer on a surface of the cleaning solution, the organic liquid layer having at least a prescribed concentration of the organic liquid. The organic liquid vapor is supplied into the dry chamber at a second volumetric supply rate that is lower than the first volumetric supply rate. During and/or following the supplying of the organic liquid vapor into the dry chamber, at least a portion of the wafer is removed from the cleaning solution through the organic liquid layer.

Abstract: An instantaneous pressure reducing heating and drying apparatus for an object, such as a wafer, includes a pressure reducing chamber; a vacuum pump for reducing a pressure in the pressure reducing chamber to below atmospheric pressure; a drying chamber installed within the pressure reducing chamber for drying the object that is loaded in the drying chamber; a pressure regulating valve installed in a wall of the drying chamber, wherein when the pressure regulating valve is opened a pressure in the drying chamber is instantaneously reduced to the pressure of the pressure reducing chamber; and a heating means for heating the drying chamber. In operation, the vacuum pump reduces a pressure of the pressure reducing chamber to below atmospheric pressure, and the pressure regulating valve installed in a wall of the drying chamber opens thereby instantaneously reducing the pressure the drying chamber to the reduced pressure of the pressure reducing chamber.

Abstract: The present invention is directed to a controlled environment processing chamber of chambers in which parts are to be dried. The parts either contain water on or imbibed into the part. The process includes a means of applying a negative gauge pressure to the chamber to remove air or other non-condensable gases. Further, means are provided for introducing a solvent in a vapor state to the chamber to cause the water to flash off the part. A first system recovers water or aqueous solution(s) from the object being dried and the chamber. A second system, separate from the first system, further recovers residual solvent from the object and chamber after the drying process.

Abstract: An apparatus and method for the spray drying of solvent-containing compositions. A liquid or paste-form solvent-containing composition is heated to a temperature above the boiling point of the solvent, transported under excess pressure and at a temperature above the boiling point of the solvent to a relaxation space where it is sprayed to evaporate the solvent. The relaxation space is not under excess pressure and is at a temperature that is above the boiling point of the solvent.

Abstract: The present invention relates to a method of fumigating closed systems susceptible to microbially influenced corrosion (MIC). The method is particularly useful in a method for mitigating MIC in fire protection sprinkler systems.

Abstract: Method and apparatus are disclosed for improving the cleaning efficiency of a high density plasma system by introducing thermally hot gases to heat downstream chamber walls to improve the fluorine attack on deposit coatings. In certain embodiments of the invention, the cleaning gas and thermally hot gas are allowed into the region of the high vacuum pump to provide cleaning of the high vacuum pump.

Abstract: An apparatus and method for reducing particles in reactors. The apparatus includes an enclosure with a wafer handling chamber connected by an isolation gate valve to a processing chamber. Pipes deliver purge gas into the wafer handling chamber to eliminate particles from the enclosure. A pilot operated back pressure regulator regulates the delivery and removal of the purge gas. The apparatus actuates the isolation gate valve in a controlled rate to reduce disturbances from the purge gas entering into the enclosure. A Bernoulli wand is provided for lifting and holding a single semiconductor wafer. A dome loaded regulator actuated by a pilot gas is used to control the ramp rates of gas to the Bernoulli wand. The ramping rates of the Bernoulli wand gas can be controlled by restrictions and check valves in the pilot gas line. The apparatus also utilizes ionizers in the purge gas lines entering the wafer handling chamber and load locks.

Abstract: A wafer dryer for drying a wafer includes a chamber and a support adapted to support the wafer in the chamber. A spray nozzle is disposed in the chamber. A source gas supply tank is in fluid communication with the spray nozzle. At least one heater is operable to heat the chamber and the source gas supply tank. A pumping line is in fluid communication with the chamber. Drive means are operable to rotate the chamber and the spray nozzle. A method for drying a wafer using a wafer dryer including a chamber and a revolving spray nozzle includes the steps of: loading the wafer in the chamber; reducing the pressure in the chamber in which the wafer is loaded to a near vacuum state; creating a temperature controlled atmosphere in the pressure-reduced chamber to quicken drying of the wafer; and spraying the source gas on the wafer while rotating the chamber and the revolving spray nozzle in opposite directions in the pressure-reduced temperature controlled atmosphere.

Abstract: A method is disclosed for speeding workpiece thoughput in low pressure, high temperature semiconductor processing reactor. The method includes loading a workpiece into a chamber at atmospheric pressure, bringing the chamber down to an intermediate pressure, and heating the wafer while under the intermediate pressure. The chamber is then pumped down to the operating pressure. The preferred embodiments involve single wafer plasma ashers, where a wafer is loaded onto lift pins at a position above a wafer chuck, the pressure is rapidly pumped down to about 40 Torr by rapidly opening and closing an isolation valve, and the wafer is simultaneously lowered to the heated chuck. Alternatively, the wafer can be pre-processed to remove an implanted photoresist crust at a first temperature and the chamber then backfilled to about 40 Torr for further heating to close to the chuck temperature. At 40 Torr, the heat transfer from the chuck to the wafer is relatively fast, but still slow enough to avoid thermal shock.

Abstract: The present invention provides a drying method for removing a residual solution from a semiconductor wafer. The semiconductor wafer is placed into a chamber, and then the air pressure of the chamber is lowered from atmospheric pressure to a lower pressure. Next, an inert gas with a predetermined pressure is injected into the chamber to exchange with the dissolved oxygen in the residual solution. The pressure in the chamber is reduced to 0.5˜100 torr so as to lower the boiling point of the solution and to remove the displaced oxygen. Finally, a heating process is performed to completely evaporate the residual solution on the semiconductor wafer.

Abstract: An apparatus and method for clamping and heating a wafer without using moving parts and without exposing the wafer to external stress is provided. A high backside wafer pressure which provides efficient heat transfer from a heated substrate support to the wafer is offset by a high frontside wafer pressure higher than or lower than the backside wafer pressure. The high frontside pressure reduces wafer stress by providing a uniform frontside/backside pressure and presses the wafer against the heated substrate support. A continuous gas purge for providing a viscous flow across the wafer to carry away desorbed contaminants, and frontside heating elements for improving desorption are provided.

Abstract: Nitrogen gas is jetted into a space on the liquid level of pure water in a drying chamber in which wafers are immersed. Simultaneously therewith, liquid-phase isopropyl alcohol is jetted at a temperature higher than the temperature of the wafers and in the vicinity of jetting openings for the nitrogen gas. When the wafers are exposed above the liquid level in the drying chamber, the pure water held on both front and rear surfaces of the wafers is replaced by the isopropyl alcohol of mist-form. The isopropyl alcohol is then evaporated, whereby the wafers are dried.

Abstract: A portable sport equipment bag having an air distributor is connected with a hose to blower and ozone generator operable to move air and ozone under pressure into the air distributor. The air distributor has one or more manifolds located within the bag. The manifolds have a plurality of holes to allow air and ozone in the manifolds to flow into the bag to dry sport equipment and objects within the bag and destroy bacteria, molds and fungus in the bag. One or more air filters mounted on the bag remove odors and foreign matter from the air flow from the bag into the environment adjacent the bag.

Abstract: Disclosed herein is an apparatus and method for drying solid articles such as semiconductor wafers. In one embodiment, the dryer comprises a process tank and a drying fluid supply system. The process tank includes a plurality spray nozzles to spray a non-flammable drying fluid to wet surfaces of the article for drying without the necessity of heat or other external means. The drying fluid comprises a non-flammable, environmentally compatible, and a non-hazardous fluid including a drying agent of (hydrofluoroether) HFE and a surfactant of isopropyl alcohol (IPA). Even without the benefit of heating, little if any solution or static charge remains after drying. The drying apparatus includes a drying fluid supply system for providing the drying fluid to the plurality of spray nozzles.

Abstract: An improved cool chamber is provided which includes a gas manifold for redistributing the gas flow and reducing the velocity of the gas particles that are directed towards a wafer. The gas manifold has a generally circular body that defines a plurality of outlets. A plurality of tubes, each having a first end and a second end, extend from the body. The first end is coupled to the body at the outlets. A vent diffuser is coupled to the second end of each tube. The vent diffuser includes a sintered gasket for providing point-of-use filtering of the gas and diffusion of the gas. The gas manifold is at a height different from the height of the plane of the wafer. An adapter plate that includes a bypass port is also provided. The bypass port is employed to conduct gas from the gas manifold back into the chamber during de-pressurization.

Abstract: The present invention is concerned with a method for obtaining a wood panel, preferably an OSB panel, with significantly reduced thickness swelling properties when exposed to or contacted with moisture or water. The novel dimensionally stable panels are obtained by an alternate vacuum--steam injection method. The method is an after-fabrication, or post-treatment method, and involves one or more cycles of applying a vacuum followed by injection of hot steam in a sealed treatment chamber.

Abstract: Sensitive articles, such as IC wafers can be maintained in a contamination-free condition. A base member is provided for supporting one or more of the sensitive articles. A cover is provided for sealing engagement with a base member so as form a sealed unit. The sealed unit has an interior. The sealed unit is positioned at a storage position. A particle-free ionized gas is passed though the interior to bathe the articles supported therein with the gas at the storage position. The sealed unit is moved with the articles to an access position on associated processing equipment. The cover is removed from the base to expose the articles. The exposed articles are bathed continuously at the access position with a particle-free ionized gas. The articles are moved sequentially between the access position and a processing position on the associated processing equipment. The articles are bathed with a particle-free ionized gas during the moving steps.

Abstract: The present invention is a method and apparatus for the dynamic cleaning of semiconductor fabrication equipment and particularly quartzware with thermally activated nitrogen trifluoride wherein the cleaning effluent is safely removed and cleaning by-products isolated or diluted to provide for efficient cleaning and rapid restarts of fabrication equipment so cleaned.

Abstract: Methods are providing for cleansing contaminants from substrates, such as semiconductor wafer handling implements, and thereby reduce the incidence of contamination of semiconductor devices being assembled upon the semiconductor wafers. In one aspect of the invention, a substrate such as a semiconductor cassette or other semiconductor wafer handling implement, is inserted into a chamber that is substantially isolated from a surrounding environment. A pressurized, and optionally purified, cleansing medium is directed against at least one surface of the substrate to dislodge contaminants from the substrate surface. Dislodged contaminants are evacuated with negative pressure from the chamber. In a preferred aspect of the invention, the cleansing medium is an inert gas, such as nitrogen, and is applied to the substrate at a pressure from about 10 p.s.i. to about 100 or more p.s.i.

Abstract: An apparatus and method are described for delivering hygroscopic, corrosive chemicals such as hydrogen chloride from a source such as a tube trailer to a use point such as a semiconductor fabrication tool minimizing infiltration of moisture, and entrainment of particulates, while still reducing moisture contents below 100 parts per billion and achieving appropriate pressure drops without two phase flow.

Abstract: In a combined system or method for extending the life expectancy of an article of cellulosic material such as a book or other paper, the book or other paper is put in preservation storage at subnormal temperature and subnormal humidity. The resulting loss of flexibility of the paper is remedied upon withdrawal of the book or other paper from storage through its accelerated simultaneous exposure to a partial vacuum of about 5 to 50 torr and to water vapor; a partial vacuum of about 12 to about 30 torr is preferred. This procedure restores both the temperature and moisture content of the paper to normal values.

Abstract: A vacuum creating method comprising preparing a chamber for forming a space which can be made so atmospheric and vacuous as to allow a substrate to be directly or indirectly carried in and out of the space, exhausting the chamber, filling the space in the chamber with a CO.sub.2 gas whose vapor pressure becomes larger than 1 atm at ambient temperature but smaller than 10 Torr at a temperature lower than the ambient temperature, carrying the substrate into the chamber, cooling the CO.sub.2 gas to solidify, thereby making an internal pressure in the chamber highly vacuous, carrying the substrate out of the chamber, and heating the solidified dry ice to vaporize thereby returning the internal pressure in the chamber to atmospheric pressure.

Abstract: A three step process to season lumber to reduce cracks in the lumber and reduce warping of the lumber. In a first step, the lumber is piled up into a pressure vessel for seasoning. The vessel is charged with saturated steam, the pressure of which fluctuates within the pressure vessel. This is done to enable any contained water within the vessels capillary tubes and cell cavities to evaporate at the same rate. Thereafter, as a second step the lumber is taken out of the pressure vessel in order to allow free water to evaporate from the lumber. The lumber in a third step is placed into the pressure vessel again and charged by a super saturated steam by using a flow of super saturated steam until remaining water is evaporated, thus forming lumber that is seasoned.

Abstract: An apparatus and method are described for delivering hygroscopic, corrosive chemicals such as hydrogen chloride from a source such as a tube trailer to a use point such as a semiconductor fabrication tool minimizing infiltration of moisture, and entrainment of particulates, while still reducing moisture contents below 100 parts per billion and achieving appropriate pressure drops without two phase flow.

Abstract: A method, system and apparatus for maintaining articles to be processed clean, having an airtight transportable container with an inlet valve for admitting ionized gas and an outlet valve for venting gas, a purger with an interface to the container inlet valve and a vacuum pick-up and ionized gas spray wand is disclosed. A purger rack for storing multiple containers is also disclosed.