Abstract: The present invention is directed to an apparatus and method for rapid cooling of a large substrate in a vacuum environment. A first cooled plate is brought into close proximity with one surface of a flat substrate. The spatial volume between the first cooling plate and the substrate is sealed and brought to a higher pressure than the surrounding vacuum level to increase the cooling efficiency. A second cooled plate is brought into close proximity with the opposite surface of the flat substrate. A second spatial volume between the second cooling plate and the substrate is sealed and the gas pressure is equalized to the gas pressure in the first spatial volume. The equalization of the gas pressure on both sides of the flat substrate eliminates deflection of the substrate and bending stress in the substrate.

Abstract: A blueberry drying apparatus is disclosed that includes a longitudinally extending produce conveyer and a drying chamber through which the conveyer passes. The conveyer belt is constructed of a wire mesh, which allows air flow through the conveyer. The drying chamber includes two separate sets of fans. One set of fans is mounted above the conveyer and blows air directly onto the berries carried atop the conveyer. The other set of fans is mounted below the conveyer and draws air through the conveyer and around the berries.

Abstract: A fluid processing unit having first and second interleaved flow paths in a cross flow configuration is disclosed. The first flow paths are substantially longer than the second flow paths such that the pressure drop in the second flow paths can be maintained at a relatively low level and temperature variations across the second flow paths are reduced. One or more of the flow paths can be microchannels. When used as a vaporizer and/or superheater, the longer first flow paths include an upstream liquid flow portion and a downstream vapor flow portion of enlarged cross sectional area. A substantial pressure drop is maintained through the upstream liquid flow portion for which one or more tortuous flow channels can be utilized. The unit is a thin panel, having a width substantially less its length or height, and is manufactured together with other thin units in a bonded stack of thin metal sheets. The individual units are then separated from the stack after bonding.

Abstract: A stationary cooling station for cooling wafers after the wafers have been subjected to semiconductor processing supports the wafer by flowing gas in accordance with the Bernoulli principle. An upper wall of the cooling station contains a plurality of gas outlets that direct gas to flow over the top surface of the wafer. In this way, a low-pressure region is created over the wafer and the wafer is suspended within the cooling station, without directly contacting any surface for support. In addition to providing lift for the wafer, the gas is a thermally conductive gas that can cool the wafer by conducting heat away from it.

Abstract: The present invention is an active microchannel fluid processing unit and method of making, both relying on having (a) at least one inner thin sheet; (b) at least one outer thin sheet; (c) defining at least one first sub-assembly for performing at least one first unit operation by stacking a first of the at least one inner thin sheet in alternating contact with a first of the at least one outer thin sheet into a first stack and placing an end block on the at least one inner thin sheet, the at least one first sub-assembly having at least a first inlet and a first outlet; and (d) defining at least one second sub-assembly for performing at least one second unit operation either as a second flow path within the first stack or by stacking a second of the at least one inner thin sheet in alternating contact with second of the at least one outer thin sheet as a second stack, the at least one second sub-assembly having at least a second inlet and a second outlet.

Abstract: A combined infrared and hot air dryer includes a pressurized hood which is fed with combustion air through an air delivery duct. Each cross-direction zone of the hood includes a mixer. The air enters the mixer without any direct connection between the delivery duct and the mixer. Gas is supplied to each mixer from a gas manifold having a gas supply tube for each mixer. Excess air from the hood is fed through thin-walled tubes into the IR exhaust duct in a counter flow fashion to provide pre-heated clean air for air bars trailing the infrared zone.

Abstract: A method and apparatus is disclosed for staging or cooling a substrate between high temperature thermal processing steps. In the disclosed embodiment, one or more cooling stations are located off-line within a wafer handling chamber, outside the thermal processing chamber. After thermal processing, a hot wafer can be loaded on to one station, where the wafer is subjected to forced convection cooling. In particular, the wafer is subjected to cooling gas from above and below through perforated upper and lower showerhead assemblies. The wafer can thus be cooled rapidly on a station while other wafers are transferred into and out of the processing chamber, Desirably, the wafer is cooled on the station to a point at which it can be handled by a low temperature wafer handler and stored in a low temperature cassette.

Abstract: The invention relates to a method and apparatus of drying a fiber web (5) which is dried between two tight bands (1, 2) that move in parallel and turn around turning rolls (6a, 6b, 7a, 7b), the first band (1) being heated and the second band (2) being cooled, the fiber web (5) being arranged to run through the drying zone defined by the bands (1, 2) together with at least two felts or wires (3, 4) such that the fiber web (5) is in contact with the surface of the first band (1), a coarse wire (4) is in contact with the surface of the second, cooled band (2), and a fine wire (3) is between the fiber web (5) and the coarse wire (4). The fine wire (3) is cleaned with a cleaning device (11).

Abstract: Methods and apparatuses are provided for cooling semiconductor substrates prior to handling. In one embodiment, a substrate and support structure combination is lifted after high temperature processing to a cold wall of a thermal processing chamber, which acts as a heat sink. Conductive heat transfer across a small gap from the substrate to the heat sink speeds wafer cooling prior to handling the wafer (e.g., with a robot). In another embodiment, a separate plate is kept cool within a pocket during processing, and is moved close to the substrate and support after processing. In yet another embodiment, a cooling station between a processing chamber and a storage cassette includes two movable cold plates, which are movable to positions closely spaced on either side of the wafer.

Abstract: Methods and apparatuses are provided for cooling semiconductor substrates prior to handling. In one embodiment, a substrate and support structure combination is lifted after high temperature processing to a cold wall of a thermal processing chamber, which acts as a heat sink. Conductive heat transfer across a small gap from the substrate to the heat sink speeds wafer cooling prior to handling the wafer (e.g., with a robot). In another embodiment, a separate plate is kept cool within a pocket during processing, and is moved close to the substrate and support after processing. In yet another embodiment, a cooling station between a processing chamber and a storage cassette includes two movable cold plates, which are movable to positions closely spaced on either side of the wafer.

Abstract: An apparatus is provided with a cooling unit for cooling a treatment substrate, a supporting body for supporting the treatment substrate before being transferred to the cooling unit and a cooling apparatus for cooling the treatment substrate supported by the supporting body. The apparatus cools the treatment substrate in a position where the treatment substrate stands by before being transferred into the cooling unit and thereafter cools the cooled treatment substrate in the cooling unit, which makes rapid and accurate cooling possible.

Abstract: This invention pertains to a substrate cleaner and dryer or a dryer alone, and in particular, to an improved method of isopropyl alcohol (IPA) vapor drying having "closed loop" processing and capability to process extremely large substrates. The invention uses an inert gas, typically nitrogen (N.sub.2) or argon (Ar), as a process gas for carrying the vapor of a drying fluid in a "closed loop" cycle through a process vessel. The carrier gas and is pumped through a vapor generator and the process vessel in a rapid "closed loop" manner with extremely pure IPA vapor. Various embodiments employ the invention including two different vapor drying methods, a water rinse and vapor dry method and a solvent clean and vapor dry method. In either the water rinse and vapor dry method and a solvent clean and vapor dry method rinse water or cleaning fluid is rapidly drained in an unimpeded manner from the vessel while the process vessel is vented.

Abstract: A method and apparatus for controlling the temperatures of cargo in a container, wherein cooling air is circulated over and beneath the cargo, then between the cargo and the door(s) of the container, for subsequent passage towards the front of the container over the top of the cargo, wherein the cooling air at the rear of the container is separated into two streams by an air separator board having a first limb which is located over the top of the cargo, and a second limb extending approximately at right angles to the first limb so that the internal stream at the rear of the container is separated from the external stream which is subjected to warming from ambient air around the container. The invention also extends to an air separator board per se, which is L-shaped, and preferably made of wood and has ribs on its internal and external faces.

Abstract: A device for drying strips of printed material includes a drying chamber through which the strips of printed material are carried, the drying chamber being divided into at least two sections by walls and being as gas-tight as possible in relation to the environment, at least one burner connected to the drying chamber by an outlet duct for discharging at least a portion of combustion gases and connected to the drying chamber by a feed duct for feeding to the burner gases saturated with solvents and structure for feeding fresh air to a first of the at least two sections being located at a first outer end of the drying chamber. The feed duct is connected to a second of the at least two sections.