Abstract: A desiccating device and method providing variable drying conditions allowing the desiccated material to substantially maintain its natural characteristics upon rehydration as well as have a low microbial content. The method provides a process of subjecting the material to ultrasound and flowing hot air or gas for a defined period of time. The ultrasonic frequency, temperature, air flow and time of exposure can be varied to produce the most efficient drying conditions depending on the material to be dried. The apparatus has plurality of drying chambers with forced heated air or gas input and output ducts and ultrasonic emitter. The material passes through each chamber at a pre-determined rate on a perforated conveyor belt in one embodiment of the invention. Optionally, the material may be placed on a drying bed or substrate comprising a number of spheres.
Abstract: A grain dryer has a horizontal plenum connected to a source of heated forced air and has at least one generally perforated wall. A substantially enclosed grain conduit extends along the plenum and has one of its sidewalls being the perforated wall of the plenum. The grain conduit has upper and lower ends to receive and discharge, respectively, a quantity of grain to be dried by heat conveyed to the grain through the perforated wall of the plenum. The lower end of the grain conduit defines an opening generally dwelling in a substantially vertical plane and having upper and lower discharge ports, separated by a plate extending across the central portion thereof to close the flow of grain therethrough.
Abstract: A material to be dried, such as a semiconductor substrate during manufacturing a semiconductor device, is loaded into a process chamber fitted at a loading opening with a lid which is closed from above. The inner side wall surface of the process chamber has a first surface formed in the lower part thereof and is substantially in parallel with the inner wall surface of the lid, and a second surface extending from the upper end part of the first surface and bent outwards to face the inner wall surface of the lid. A processing solution vapor is fed through a steam supply port in the second surface into the process chamber and flowed downwardly over the material to be dried. The processing solution vapor is condensed and recovered below the material to be dried.
Type:
Grant
Filed:
October 7, 1996
Date of Patent:
January 20, 1998
Assignees:
Mitsubishi Denki Kabushiki Kaisha, Ryoden Semiconductor System Engineering Corporation
Abstract: A method of printing a material web includes the steps of applying ink to the material web, subsequently drying the material web with the use of heat and subsequently drying the material web, and, after cooling and prior to further processing, moistening the material web while simultaneously applying heat to the material web, and subsequently once again cooling the material web. An apparatus for carrying out the method includes, in a travel direction, a printing unit, a drying section following the printing unit, a cooling section following the drying section, a moistening section following the cooling section, and an after-cooling section following the moistening section.