Abstract: A wafer carrier is provided comprised of a circular plate having a flat edge region extending around the circumference of the plate. The plate has a circular recessed center region with a recessed bottom surface and includes an upwardly inclined surface around the periphery of the recessed bottom surface. A substrate is placed in the center region where it is supported by a portion of the upwardly inclined surface and is spaced apart form the recessed bottom surface such that the substrate is supported only around its edge. The wafer carrier minimizes surface contact with the substrate thereby minimizing metal contamination and surface damage to the backside of a substrate and prevents deposition on the backside of the substrate.

Abstract: Apparatus for condensing moisture from an air stream. The condenser includes concentric cylinders having a common wall. The outer cylinder contains a cooling material, such as water, and upon contact therewith, the air stream is cooled and moisture contained therein is condensed.

Abstract: A method for rinsing and drying semiconductor wafers. The method includes placing a semiconductor wafer into a rinse/dry apparatus, directing rinse liquid over the semiconductor wafer, and lowering at least a portion of a side wall of the rinse/dry apparatus to remove rinse liquid therefrom.

Abstract: The device relates to a wood drying plant comprising a wood drying device and a purifying device which is arranged to receive a drying gas from the wood drying device, the drying gas comprising water steam and volatilized organic components such as terpenes, and to purify the drying gas from organic components and to recover the latter. The purifying device comprises at least one condenser which is arranged to separate relatively difficultly volatilized components containing organic components and relatively easily volatilized components. The purifying device also comprises a separating device which is arranged to separate said organic components and a rest material from the relatively difficultly volatilized components. The purifying device also comprises a transferring device which is arranged to transfer organic components present in the rest material to the drying gas introduced in the purifying device.

Abstract: A drying apparatus for processing a surface of a substrate wherein, when a nitrogen gas is fed to a nozzle, a jet of the nitrogen gas spouted through a jet hole is generated. The jet becomes film-shaped and is projected upwardly along an inner surface of a side wall of a processing vessel. Then, the jet is collected into an outside through a suction port formed in an upper portion of the processing vessel. The inner surface of the side wall of the processing vessel is covered with the jet. Therefore, an IPA vapor can be prevented from condensing uselessly on the inner surface. As a result, the IPA vapor is effectively utilized for condensation on a surface of the object to be processed which is mounted on a pan. Thus, defective dryness of the object can be prevented.

Abstract: A method (400) for cleaning a semiconductor wafer. The method includes immersing (420) a wafer in a hot or heated liquid comprising water. The wafer has a front face, a back face, and an edge. The method also includes providing a substantially particle free environment adjacent to the front face and the back face as the liquid is being removed. A step of introducing a carrier gas comprising a cleaning enhancement substance during the providing step (450) also is included. The cleaning enhancement substance dopes the liquid which is attached to the front face and the back face to cause a concentration gradient of the cleaning enhancement substance in the attached liquid to accelerate fluid flow of the attached liquid off of the wafer.

Abstract: A drier for wood chips and other bulk materials includes an incinerator for indirectly heating a drying apparatus. The drier operates in a circulatory gas operation with a high water vapor load. All drier exhaust gases are fed to the incinerator and thermally post-combusted there. The drying apparatus includes two drier lines. The first line is heated with the heat of the inflowing vapor, the heat being removed from the exhaust gas flow in a gas-gas heat exchanger and supplied to the vapor feedback. The second drier line includes a heat register, whose heat is extracted from the exhaust gases in a heater, which is arranged directly after the incinerator and reduces the exhaust gas temperature to approximately 500.degree. to 600.degree.. The gas-gas heat exchanger can thus be embodied as a simple sheet metal structure.

Abstract: A drying equipment includes an equipment body including a vapor bath, carrier for carring a semiconductor wafer, receiver tray, inert gas supply unit, cooling pipe, exhaust unit, transportation unit, control unit, etc. An air supply opening of a blower is opposite to a top opening of the vapor bath. The vapor bath contains an organic solvent therein. A vapor is generated by heating the organic solvent. A vapor phase boundary surface is formed on the boundary between the vapor and air overlying the same. When the wafer at low temperature is put into the vapor bath by means of the transportation unit, the organic solvent vapor condenses on the surface of the wafer. The inert gas supply unit supplies an inert gas to the vapor in the vapor bath. The wafer is pulled up slowly from the vapor by means of the transportation unit, and passes the vapor phase boundary surface on the way.

Abstract: A refrigerant is directly contacted to a substrate to be processed that was heated so as to quickly cool the substrate. Thus, the temperature of the substrate is dropped to a predetermined temperature level. The substrate is cooled by a cooling device and cooling water. Thus, the cooling temperature can be accurately controlled. In addition, the substrate can be effectively cooled.

Abstract: A substrate drying device including a process chamber, a transferring device for transferring a substrate to/from the process chamber, a solvent vapor generating chamber having a container for receiving liquid organic solvent and a heater for heating the liquid organic solvent of the container to generate vapor of the organic solvent, a solvent supply unit for supplying the liquid organic solvent in the container, a first passage, communicating with the solvent vapor generating chamber and the process chamber, for passing vapor of the organic solvent, a second passage, communicating with the container of the solvent vapor generating chamber and the solvent supply unit, for passing liquid organic solvent, a flow rate controller for controlling flow rate of the liquid organic solvent to be supplied to the solvent vapor generating chamber from the solvent supply unit, and a control device for detecting a state of organic solvent of at least one of the solvent supply unit, the solvent vapor generating chamber, an

Abstract: A dryer (10) for printed textiles and substrates is disclosed having a plurality of infrared-based sensors (60) therein for monitoring the temperature of the products as opposed to the ambient environment. Each sensor (60) is positioned within a projecting sensor housing (55,58). The sensor housing (55,58) has an annular chamber (70) to protect and cool the sensor (60). A chilling/dehumidifying system (100) is also disclosed that incorporates a dehumidifier (110) and, humidity monitors (160).

Abstract: A method and apparatus for rinsing and drying semiconductor wafers. The apparatus includes side walls, end walls and a base. At least a portion of the wall descends relative to the base to facilitate the flow of liquid from the chamber. One embodiment of the apparatus includes a rigid side and end walls. In another embodiment of the apparatus, at least a portion of the side wall is collapsible. In yet another embodiment of the apparatus, at least a portion of the wall has a tambour configuration, facilitating bending or rolling of the wall beneath the base. The apparatus includes an assembly for injecting a rinse liquid into the chamber. The apparatus also includes an assembly for injecting a drying fluid into the chamber. The method includes placing a semiconductor wafer into the rinse/dry apparatus, directing rinse liquid over the semiconductor wafer, and lowering a side wall of the rinse/dry apparatus to remove rinse liquid therefrom.

Abstract: A vertically oriented thermal processor for processing batches of semiconductor wafers held within a processing chamber. The processing chamber is contained within a processing vessel. Processing gases are discharged through a processing chamber outflow. An outflow cooler is included to cool gases exhausting from the processing chamber outflow. The outflow cooler includes a fluid heat exchanger and a flow diverter which directs the exhausting gases against cooled walls of the outflow cooler. The cooler also preferably has a liner which lines a casing to which the heat exchanger is connected.

Abstract: The present invention provides a heat-transfer device for use in a convective-heat installation, in particular in a convective soldering installation. A hollow body contains a heated fluid transferring heat via the wall of the hollow body to the soldering item. The advantages of the present invention reside in the fact that the maximum furnace temperature can be exactly adjusted, the dissipated heat is compensated for extremely quickly, the soldering items are treated carefully and the temperature of the system soldering item/soldering installation does not overshoot.

Abstract: A method and apparatus for cleaning the interior of a container or one or more objects suspended therein comprising generating a fluid vapor column by forming an air column having a direction of air flow. The air column is passed through a heating means, so as to heat the air, and then the cleaning fluid is injected into the air column against the direction of air flow. The fluid vapor column is then brought into contact with the interior of the container so that the vapor condenses on the interior of the container or on objects suspended therein.

Abstract: A method for removing moisture and contaminants, at the monolayer level, from the surface of planar and non-planar objects such as semiconductor wafers or corrugated epitaxial layers. The apparatus comprises of two process chambers. Each chamber contains a selected solvent. The interior of each chamber is saturated with the vapors from their respective solvents. The first solvent of the first process chamber has a boiling point much lower than the boiling points of the second solvent in the second process chamber and a rinsing solvent. Vapors from the first solvent displace the rinsing solvent. Vapors from the second solvent displace the first solvent and any other contaminants; the second solvent is then removed resulting in a dry, contaminant free surface.

Abstract: Heat can be supplied effectively to a porous member of a vaporizer apparatus so that a vaporizing operation can be carried out smoothly and efficiently. The vaporizer apparatus includes a vaporizer section having a porous member including a liquid receiving surface and a vapor discharge surface. A feed supply section supplies a liquid feed material to the liquid receiving surface of the porous member. A heating medium passage is in thermal contact with the porous member. A heating medium supply system flows a heating medium of a temperature higher than a vaporization temperature of the liquid feed material through the heating medium passage.

Abstract: A vapor drying system includes a tank for holding a drying liquid and a heater for boiling the drying liquid in the tank to produce a vapor. A manifold is arranged in the tank for bubbling gas into the drying liquid. A controller is configured to cause the manifold to bubble gas into the drying liquid at a time when substrates to be dried are first introduced into the tank in order to quench the boiling of the drying liquid and generate a saturated vapor at a rate sufficient to achieve condensation of the drying liquid over substantially the entire surface of each of the substrates to be dried. In this way, staining of the substrates is reduced and process yield is improved.

Abstract: This invention pertains to a substrate cleaner and dryer or a dryer alone, and in particular, to an improved method of isopropyl alcohol (IPA) vapor drying having "closed loop" processing and capability to process extremely large substrates. The invention uses an inert gas, typically nitrogen (N.sub.2) or argon (Ar), as a process gas for carrying the vapor of a drying fluid in a "closed loop" cycle through a process vessel. The carrier gas and is pumped through a vapor generator and the process vessel in a rapid "closed loop" manner with extremely pure IPA vapor. Various embodiments employ the invention including two different vapor drying methods, a water rinse and vapor dry method and a solvent clean and vapor dry method. In either the water rinse and vapor dry method and a solvent clean and vapor dry method rinse water or cleaning fluid is rapidly drained in an unimpeded manner from the vessel while the process vessel is vented.

Abstract: A processing apparatus, conveyor and method for processing products or materials, such as food processing equipment or methods, is configured such that the conveyor travels in a generally helical path within a processing chamber to expose products on the conveyor to a gaseous processing media such as heated or cooled air. The conveyor includes gas flow compensation including a plurality of gas flow compensation members which partially block a portion of the surface of the conveyor, preferably toward the exterior of the conveyor in the helical path, to deflect or direct more of the gaseous food processing media away from the less densely distributed products or materials at the exterior of the conveyor caused when the conveyor follows the helical path. The processing media is thus preferably forced in the direction of the more densely distributed products toward the interior of conveyor to uniformly expose product on the conveyor to the processing media.

Abstract: In a process for drying a substance, particularly wood shavings, wood chips or wood flakes, a partial stream of the vapor-gas mixture is separated after passing through the drying drum before the vapor-gas mixture is led to a first heat exchanger. This separated partial stream is led through a supplementary heat exchanger before it is conducted into the combustion chamber of the furnace in which combustion takes place of the gases arising during the drying. The flue gases are led through the aforementioned supplementary heat exchanger before they reach the first heat exchanger whereby they are brought down to a lower temperature. In this way the thermal stress on the material of the heat exchanger elements of the first heat exchanger is reduced, thereby increasing the life of these heat exchanger elements.

Abstract: A substrate drying apparatus includes a process bath having an object containing region for containing an object to be treated, a treatment liquid containing region for containing a volatile treatment liquid, and heating member for evaporating the treatment liquid, a receiving container, provided below the object containing region, for receiving water removed from the object with use of the evaporated treatment liquid, an exhaust pipe, attached to the container, for exhausting the water from the container to the outside of the process bath, and a cooling device, provided above the object containing region of the process bath, for condensing the evaporated treatment liquid, wherein the exhaust pipe has a valve and a branch pipe branched from the exhaust pipe such that the branch pipe is closer to the container than the valve is.

Abstract: A substrate drying apparatus comprises a treatment vessel for containing IPA in the form of liquid, an IPA source for supplying IPA into the treatment vessel, a first heat exchanger which is equipped with a heat exchanger tube dipped in IPA and allowing steam to pass therein, the first heat exchanger allowing the steam and IPA to perform heat exchange therebetween to thereby evaporate IPA, and a second heat exchanger provided on or above an upper portion of the treatment vessel and equipped with a heat exchanger tube for allowing a coolant to pass therein, the second heat exchanger allowing the coolant and the evaporated IPA to perform heat exchange therebetween to thereby condense the evaporated IPA.

Abstract: A method operates a system for wet processing of semiconductors. The system includes an inlet coupled to a fluid source, and a filter coupled to the inlet. The system also includes a sealed vessel coupled to the filter where the sealed vessel has a lower liquid portion and an upper vapor portion. The system further includes an outlet coupled to the sealed vessel. The outlet is attached to the lower liquid portion. A solvent injector coupled to the sealed vessel is also used. The solvent injector is coupled to the upper vapor portion, and supplies a gaseous mixture including a polar organic compound. The polar organic compound is a non-saturated polar organic vapor. The system also includes a gas source coupled to the sealed vessel. The gas source is coupled to the upper vapor portion, and supplies an inert gas into the upper vapor portion. A device for removing the liquid from the lower liquid portion at substantially a constant liquid level rate is also included.

Abstract: A steam drying apparatus in which a process chamber is fitted at a loading opening with a lid which is closed from above. The inner side wall surface of the process chamber has a first surface formed in the lower part thereof and is substantially in parallel with the inner wall surface of the lid, and a second surface extending from the upper end part of the first surface and bent outwards to face the inner wall surface of the lid. The second surface is provided with a steam supply port for supplying the processing solution vapor into the process chamber. To the steam supply port is connected a steam supply means for supplying the processing solution vapor into the process chamber.

Abstract: A capillary membrane gas dehydrator. A gaseous stream having water vapor therein flows into the tube side of the capillaries. Water vapor permeates through the fibers to the shell side. A portion of the dehydrated stream is used as a purge stream for the shell side of the dehydrator. A pressure valve meter combination is used in the bypass stream to ensure that the pressure of the purge stream is maintained at a constant level independent of any variation in the pressure of the feed stream. This ensures that if there is an increase in pressure in the feed stream there is no increase in the purge rate and no corresponding increase in purge losses.

Abstract: This invention relates to a compact vacuum dryer for quickly and economically drying objects such as grain, industrial raw materials and thrash. The vacuum dryer includes a combined upper and lower chamber for accommodating the drying objects. A vacuum pump is connected to the upper chamber for drawing in air for creating the vacuum within the system. A direct heating apparatus is provided at one side of the combination of the upper and lower chambers to directly heat the drying objects. A dielectric heating apparatus indirectly heats the drying objects in combination with direct heating apparatus. A moisture removing apparatus is provided along a discharge passage between the upper chamber and the vacuum pump for preventing the vacuum pump from drawing in moisture from the chamber which may damage or disable the pump.

Abstract: A substrate drying apparatus includes a process bath having an object containing region for containing an object to be treated, a treatment liquid containing region for containing a volatile treatment liquid, and heating member for evaporating the treatment liquid, a receiving container, provided below the object containing region, for receiving water removed from the object with use of the evaporated treatment liquid, an exhaust pipe, attached to the container, for exhausting the water from the container to the outside of the process bath, and a cooling device, provided above the object containing region of the process bath, for condensing the evaporated treatment liquid, wherein the exhaust pipe has a valve and a branch pipe branched from the exhaust pipe such that the branch pipe is closer to the container than the valve is.

Abstract: A method for treating substrates includes chemically treating at least one substrate in a container with at least one treatment fluid and washing said at least one substrate with a washing fluid in the same container. Subsequently, the at least one substrate is dried.

Abstract: A wafer holder for handling wafers, particularly during a vapor drying process during automated wafer processing, provides for change of the diameter of the wafers to be held without replacement of one wafer holder with another in a wafer processing apparatus. The wafer holder is a unitary structure having a plurality of wafer holding portions, each wafer holding portion having a geometry appropriate to a single wafer diameter which differs from the diameter of wafers to be held by other wafer holding portions of the unitary structure. The wafer holder is preferably secured onto a robot arm in the wafer processing apparatus and can be rotated in orientation by a mechanical linkage in the robot arm in order to receive and hold wafers of a specific diameter being processed in the wafer processing apparatus at any given time.

Abstract: An Isopropyl Alcohol (IPA) tank vapor/liquid phase separator for collecting liquid while still allowing for efficient vapor flow in an IPA tank includes a first row and a second row of spaced-apart coplanar parallel catch trays. Vapor flows upwardly through the openings between the catch trays. The catch trays are arranged so that contaminated IPA condensate falls into either the first or second row of catch trays. In one embodiment, both of the catch trays are upright V-shaped or upright semi-circular-shaped. In another embodiment the catch trays are formed as plates with staggered holes formed therein for upward passage of vapor and for downward collection of condensate.

Abstract: A process for handling and storing surface-mount, encapsulated flip-chip carrier modules to prevent the formation of amoeba-like solder bridges between the flip-chip C4 connections along the boundary between the encapsulant and the chip surface and/or between the encapsulant and the chip carrier substrate surface. The concentration of free moisture in the encapsulant is maintained below a predetermined safe limit during reflow heating used to mount the modules on a circuit board.

Abstract: An apparatus is provided that comprises a self-stacking spiral conveyor that traverses through a circulating atmosphere. The atmosphere is manipulated by one or more chambers having an open side adjacent to the perforated sides of the spiral conveyor. Additional control over the circulating atmosphere may be achieved by injection or ejection of gas into one or more chambers.

Abstract: Apparatus and method for reducing the concentration of solvent vapor in the drum of a drycleaning machine upon completion of a cleaning and drying operation, during which articles are cleaned in the drycleaning machine, the drycleaning machine being of the type having a drum, and a solvent recovery system communicating with the drum for recovering solvent from solvent-laden air circulated through the solvent recovery system and the drum during a drying and solvent recovery cycle, the apparatus and method including an arrangement for circulating solvent-laden air from the drum through the solvent recovery system during the drying and recovery cycle, and closing communication between the drum and the solvent recovery system during a post-recovery cycle, subsequent to the drying and recovery cycle, and then circulating solvent-laden air from the drum through an adsorption unit during the post-recovery cycle to reduce the concentration of solvent vapor in the drum to an acceptable level prior to accessing the dru

Abstract: A drier having a boxlike housing (12) for receiving a hopper (13) therein which contains a batch of wet sludge. The hopper (13) cooperates with the housing, when closed therein, to define a closed air recirculation system which supplies dry pressurized warm air into an air-receiving chamber (79) located at the bottom of the hopper. The air passes upwardly through a perforated bottom wall (78) into and through the sludge to remove moisture therefrom. The moist air passes upwardly through the open top of the hopper, through a filter and is supplied to a drying unit (34) located in the housing for removing moisture therefrom, which moisture is externally discharged. The drying unit resupplies the dry air back to the drying chamber formed in the hopper.

Abstract: A process for the treatment of objects with an inflammable volatile liquid, in an installation comprising at least one upwardly open tank (16) adapted to be filled with the liquid, a drying device (20) adapted to remove contained treatment liquid from the treated objects, and a transport system adapted to bring an object to be treated above the tank, and to immerse it in the tank, to withdraw it, and to transfer it into the drying device, then to remove it. The tank and the drying device are disposed in a closed chamber (2, 4) containing an atmosphere comprised principally of a protective gas, with an oxygen content maintained sufficiently low that the ignition of the treatment liquid will be impossible. This chamber is separated from the exterior by at least one gas lock (1, 5) containing the same atmosphere. The object to be treated passes through the gas lock to enter the chamber and by the same or another gas lock to be removed.

Abstract: An apparatus for finishing or restoring the surface of a plastic article. A receiving chamber receives the article and conveys the article to a finishing chamber. The surface of the article is exposed to a control led concentration of solvent vapor for a period of time in the finishing chamber. The solvent vapor is absorbed into the surface of the article and reforms the surface of the article to a smooth finish. The solvent evaporates off of the surface of the article leaving a smooth glass like finish. A refrigeration system condenser and evaporator are provided to respectively vaporize the solvent in a heating zone, and condense the vaporized solvent in a cooling zone.

Abstract: An apparatus for drying substrates such as wafers while contacting IPA vapor with them to remove that solution, which adheres to them when they are washed, includes a vessel in which IPA is stored, a unit for supplying the IPA into the vessel, a unit for draining the IPA from the vessel, heater block arranged contactable with the underside of the vessel to heat the IPA in the vessel by heat conduction, a boat elevator for positioning the substrates in a steam existing space in which steam generated from the heated process solution and a water cooling system arranged in the vessel to exchanged heat between the IPA and cooling water so as to cool the IPA, which is to be drained from the vessel, by the cooling water.

Abstract: A new kind of teas named "dry fresh tea" is prepared by drying tea leaves in circulating air at low temperature and low humidity. Quality of teas is improved by preserving volatile flavors.

Abstract: Microprocessor controlled isopropyl alcohol vapor dryer system for robotic drying of wafer cassettes containing wafers or substrates. A wetted wafer or substrate is robotically placed into a virgin isopropyl alcohol vapor zone. The wetted surface and free-moving contaminants are replaced by a layer of isopropyl alcohol (IPA) which condenses on the surface. The dryer then robotically moves the IPA coated wafer or substrate into an upper cooling zone causing the isopropyl alcohol layer to flash off of the substrate surface, leaving the surface completely dry to a molecular level. IPA vapors are heated at the bottom of a quartz tank and maintained as a vapor by electric heating panels surrounding the quartz tank.

Abstract: A substrate drying apparatus comprising a vessel in which IPA is contained, a chamber enclosing the vessel, a heating heater for heating IPA into vapor in the vessel and in that region in the vessel where a plurality of substrates are vapor-processed, a mechanism for carrying the plural water-washed substrates into the vapor-processing region in the vessel, a mechanism located above the vapor-processing region in the vessel to cool the IPA vapor into solution drops, region in the chamber located above the cooling mechanism where the substrates can be dried while removing IPA from the substrates, and gas supply and exhaust devices for causing gas to flow from above to below in the drying region in the chamber.

Abstract: A method is disclosed for the reduction of emissions of solvent vapors from a batch mixing vessel by cryogenically condensing such vapors in and adjacent the top loading hatch at a rate approximating their evaporation from the mix.

Abstract: A method of treating a continuously travelling belt-like article with various processes in a tightly closed treatment chamber, comprising the steps of: introducing the belt-like article horizontally into the treatment chamber; guiding the introduced belt-like article up and down in a meandering path between an upper guide roller and a number of successive drive rollers in the treatment chamber while the belt-like article is being treated with the various processes, the guiding including firstly directing the belt-like article upwards via the first drive roller, twisting the belt-like article by 90.degree. in one direction, winding the belt-like article around the upper guide roller, then directing the belt-like article downwards and winding around the second drive roller, secondly directing the belt-like article upwards again, twisting the belt-like article by 90.degree.

Abstract: A multi-directional flow of isopropyl alcohol vapor is used to uniformly dry a semiconductor substrate. In one embodiment of the invention, isopropyl alcohol vapor (19), which is generated by an external vapor source (30), is injected into the vapor drying system at a location near the top portion (28) of the semiconductor substrate (20), while internally generated isopropyl alcohol vapors (18) are directed toward the bottom portion (26) of the semiconductor substrate (20). Therefore, both the top (28) and the bottom (26) portions of the semiconductor substrate (20) are dried at approximately the same time.

Abstract: An apparatus is provided that comprises a self-stacking spiral conveyor that traverses through a circulating atmosphere. The atmosphere is manipulated by one or more chambers having an open side adjacent to the perforated sides of the spiral conveyor. Additional control over the circulating atmosphere may be achieved by injection or ejection of gas into one or more chambers.

Abstract: A laundry dryer has an interior for holding laundry that is accessible via a door. Vapor-laden warm air from the interior, on the one hand, and a cooling medium, on the other, can be introduced into a condenser. The air and the cooling medium are brought into thermally conductive contact one with the other in the condenser to cool the air. In order to obtain the smallest possible outside dimensions relative to the usable interior and to be able to easily open the condenser or remove it from the laundry dryer for cleaning purposes, the condenser is arranged on an outer panel, preferably integrated in the door.

Abstract: The process for low-emission drying of a substance in a drum-type drying installation is suitable in particular for sewage sludge, fish meal and sludges from starch factories, soap factories and paper mills, which substances are preferably to be converted into granules. The process is likewise very suitable for drying biomass products such as wood chips, grass, sugar beet chips and the like, since the emissions are very greatly reduced by means of this process. The drying process is carried out in such a way that no unpleasant odors and dusts are emitted to the outside, because the actual drying circulation is closed. Fossil fuels are used as the heat source for the burner for heating this air stream.

Abstract: A purpose of this invention is to provide a vapor drier which can continue a process to dry efficiently objects in an extremely clean condition for a long time. A vapor drier of this invention comprises a circulating/dehydrating/refining means for refining said volatile processing liquid stored in said processing room and circulating refined fluid into said processing room, said circulating/dehydrating/refining means having at least an evaporating section to evaporate said volatile processing liquid stored in said processing room, a dehydrating section to remove water from said vapor generated in said evaporating section with a dehydrating/separating membrane, and a distilling section to distill said dehydrated vapor.

Abstract: Drying bulk materials such as wood shavings or wood fibers by contacting the bulk materials with a circulating stream of hot vapor produced by the bulk material drying process, the hot vapor being produced by indirect heat exchange with combustion gas from a fuel-burning combustion chamber, and excess vapor as fuel whereby pollutants are burned before the vapor is discharged into the atmosphere.

Abstract: The present invention provides a vapor processing apparatus in which the vapor is generated in a region adjacent to the vapor processing area. This is generally done in a batch process and a limited volume of processing vapor is generated for each batch. The separation of the vapor generation from the processing avoids the contamination of the vapor source and the inadvertent cooling of the vapor generating area. In the preferred embodiment, two vessels are disposed one inside the other such that a vapor generating region is provided in the annular space between vessels. The vapor is injected into the processing region through channels formed in the annular space. In a preferred embodiment, the vapor is isopropyl alcohol and the substrates for processing are silicon wafers.