Artificial Or Substitute Grounds (e.g., Ground Planes) Patents (Class 343/848)
  • Antenna module
    Patent number: 12176636
    Abstract: A distributing/synthesizing circuit includes first to fourth ports. A first radio frequency circuit transmits and receives a radio frequency signal to and from the first port through a first transmission line. A second transmission line is connected to the second port. A first radiating element is connected to the third port and the fourth port through a third transmission line and a fourth transmission line, respectively. The distributing/synthesizing circuit distributes and outputs the radio frequency signal input to the first port to the third port and the fourth port, synthesizes radio frequency signals that are reflected by the first radiating element and that are input to the third port and the fourth port to output the synthesized radio frequency signal to the second port. The second transmission line is longer than all of the first transmission line, the third transmission line, and the fourth transmission line.
    Type: Grant
    Filed: September 14, 2022
    Date of Patent: December 24, 2024
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Hideki Ueda, Haruka Arakawa
  • Antenna modules in phased array antennas
    Patent number: 12166282
    Abstract: An apparatus includes a plurality of conductive structures having first sides and second sides opposite the first sides, wherein the second sides of the plurality of conductive structures are configured to be physically coupleable with a printed circuit board (PCB) of a receiver, a transmitter, or a transceiver. The first sides of the plurality of conductive structures are configured to be spaced from the PCB by a first distance when the plurality of conductive structures is physically coupled with the PCB. The apparatus includes an antenna having a first side and a second side opposite the first side. The second side of the antenna is disposed closer to the plurality of conductive structures than the first side of the antenna when the plurality of conductive structures is physically coupled with the PCB.
    Type: Grant
    Filed: June 29, 2023
    Date of Patent: December 10, 2024
    Assignee: Space Exploration Technologies Corp.
    Inventors: Javier Rodriguez De Luis, Nil Apaydin, Ersin Yetisir, Alireza Mahanfar, Siamak Ebadi
  • Heatpipe to help reduce radio frequency interference
    Patent number: 12160216
    Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a substrate, a heat source on the substrate, and a heat pipe. The heat pipe includes a plurality of bumps that extend from the heat pipe towards the substrate but do not come into contact with the substrate. The bumps are configured to help mitigate radio frequency interference in the electronic device. More specifically, the bumps can be configured to provide a resonant frequency in a specific radio frequency band and act as a radio frequency filter.
    Type: Grant
    Filed: December 15, 2020
    Date of Patent: December 3, 2024
    Assignee: Intel Corporation
    Inventors: Kae-An Liu, Jaejin Lee, David W. Browning
  • Folded monopole antenna for use within an array
    Patent number: 12142858
    Abstract: An antenna array includes a first ground plane; a second ground plane disposed below the first ground plane; a folded monopole antenna disposed between the first ground plane and the second ground plane, the folded monopole antenna comprising a driven arm, a parasitic arm, and a short connecting the driven arm to the parasitic arm; an antenna disposed above the first ground plane; and a feedline in electrical communication with the antenna such that an electrical signal input to the feedline drives the antenna, wherein the feedline extends through a cavity formed within the parasitic arm of the folded monopole antenna.
    Type: Grant
    Filed: July 30, 2021
    Date of Patent: November 12, 2024
    Assignee: SRC, Inc.
    Inventor: Harvey K. Schuman
  • Integrated circuit packages, antenna modules, and communication devices
    Patent number: 12068525
    Abstract: Disclosed herein are antenna boards, integrated circuit (IC) packages, antenna modules, and communication devices. For example, in some embodiments, an antenna module may include: an IC package having a die and a package substrate, and the package substrate has a recess therein; and an antenna patch, coupled to the package substrate, such that the antenna patch is over or at least partially in the recess.
    Type: Grant
    Filed: October 7, 2022
    Date of Patent: August 20, 2024
    Assignee: Intel Corporation
    Inventors: Sidharth Dalmia, Trang Thai
  • Wireless communication technology, apparatuses, and methods
    Patent number: 11955732
    Abstract: Millimeter wave (mmWave) technology, apparatuses, and methods that relate to transceivers, receivers, and antenna structures for wireless communications are described. The various aspects include co-located millimeter wave (mmWave) and near-field communication (NFC) antennas, scalable phased array radio transceiver architecture (SPARTA), phased array distributed communication system with MIMO support and phase noise synchronization over a single coax cable, communicating RF signals over cable (RFoC) in a distributed phased array communication system, clock noise leakage reduction, IF-to-RF companion chip for backwards and forwards compatibility and modularity, on-package matching networks, 5G scalable receiver (Rx) architecture, among others.
    Type: Grant
    Filed: December 27, 2022
    Date of Patent: April 9, 2024
    Assignee: Intel Corporation
    Inventors: Erkan Alpman, Arnaud Lucres Amadjikpe, Omer Asaf, Kameran Azadet, Rotem Banin, Miroslav Baryakh, Anat Bazov, Stefano Brenna, Bryan K. Casper, Anandaroop Chakrabarti, Gregory Chance, Debabani Choudhury, Emanuel Cohen, Claudio Da Silva, Sidharth Dalmia, Saeid Daneshgar Asl, Kaushik Dasgupta, Kunal Datta, Brandon Davis, Ofir Degani, Amr M. Fahim, Amit Freiman, Michael Genossar, Eran Gerson, Eyal Goldberger, Eshel Gordon, Meir Gordon, Josef Hagn, Shinwon Kang, Te Yu Kao, Noam Kogan, Mikko S. Komulainen, Igal Yehuda Kushnir, Saku Lahti, Mikko M. Lampinen, Naftali Landsberg, Wook Bong Lee, Run Levinger, Albert Molina, Resti Montoya Moreno, Tawfiq Musah, Nathan G. Narevsky, Hosein Nikopour, Oner Orhan, Georgios Palaskas, Stefano Pellerano, Ron Pongratz, Ashoke Ravi, Shmuel Ravid, Peter Andrew Sagazio, Eren Sasoglu, Lior Shakedd, Gadi Shor, Baljit Singh, Menashe Soffer, Ra'anan Sover, Shilpa Talwar, Nebil Tanzi, Moshe Teplitsky, Chintan S. Thakkar, Jayprakash Thakur, Avi Tsarfati, Yossi Tsfati, Marian Verhelst, Nir Weisman, Shuhei Yamada, Ana M. Yepes, Duncan Kitchin
  • Antenna element module
    Patent number: 11936124
    Abstract: An antenna element can include a feed and a radiating element and a dielectric substrate having a first surface and a second surface, the dielectric substrate comprising the feed of the antenna element within the dielectric substrate. The antenna element module can also include an integrated circuit (IC) chip adhered to the first surface the dielectric substrate and coupled to the feed of the antenna element. The IC chip can include a circuit to adjust a signal communicated with the feed. The antenna element module can further include a plastic antenna carrier adhered to the second surface of the dielectric substrate. The plastic antenna carrier can include a body portion comprising a cavity for the radiating element of the antenna element, the radiating element positioned in the cavity of the body portion of the plastic antenna carrier.
    Type: Grant
    Filed: July 31, 2019
    Date of Patent: March 19, 2024
    Assignee: VIASAT, INC.
    Inventors: Douglas J. Mathews, David C. Wittwer, James F. Landers
  • Semiconductor packages with antennas
    Patent number: 11887946
    Abstract: In various embodiments, disclosed herein are systems and methods directed to the fabrication of a coreless semiconductor package (e.g., a millimeter (mm)-wave antenna package) having an asymmetric build-up layer count that can be fabricated on both sides of a temporary substrate (e.g., a core). The asymmetric build-up layer count can reduce the overall layer count in the fabrication of the semiconductor package and can therefore contribute to fabrication cost reduction. In further embodiments, the semiconductor package (e.g., a millimeter (mm)-wave antenna packages) can further comprise dummification elements disposed near one or more antenna layers. Further, the dummification elements disposed near one or more antenna layers can reduce image current and thereby increasing the antenna gain and efficiency.
    Type: Grant
    Filed: September 30, 2022
    Date of Patent: January 30, 2024
    Assignee: Intel Corporation
    Inventors: Telesphor Kamgaing, Adel A. Elsherbini, Sasha N. Oster
  • Structure, antenna, wireless communication module, and wireless communication device
    Patent number: 11876297
    Abstract: A structure includes first to fourth conductors. The first conductor extends along a second plane including a second direction and a third direction intersecting with the second direction. The second conductor faces the first conductor along a first direction intersecting with the second plane and extends along the second plane. The third conductor capacitively connects the first conductor and the second conductor. The fourth conductor is electrically connected to the first conductor and the second conductor, and extends along a first plane including the first direction and the third direction. In the third conductor, a surface facing an opposite direction of the fourth conductor in the second direction is covered by a resist layer that includes a dielectric body. In the resist layer, a thickness above a central portion of the third conductor is lower than a thickness above a peripheral edge portion of the third conductor.
    Type: Grant
    Filed: August 21, 2019
    Date of Patent: January 16, 2024
    Assignee: KYOCERA CORPORATION
    Inventors: Nobuki Hiramatsu, Hiroshi Uchimura, Sunao Hashimoto
  • Antenna modules and communication devices
    Patent number: 11870132
    Abstract: Disclosed herein are integrated circuit (IC) packages, antenna boards, antenna modules, and communication devices (e.g., for millimeter wave communications). For example, in some embodiments, an antenna module may include: a logic die; a radio frequency front-end (RFFE) die in electrical communication with the logic die; and an antenna patch, wherein the RFFE die is closer to the antenna patch than the logic die is to the antenna patch.
    Type: Grant
    Filed: May 9, 2022
    Date of Patent: January 9, 2024
    Assignee: Intel Corporation
    Inventors: Sidharth Dalmia, Jonathan Jensen, Ozgur Inac, Trang Thai, William J. Lambert, Benjamin Jann
  • Antenna module
    Patent number: 11699855
    Abstract: An antenna module includes a ground layer including a through-hole; a feed via disposed to pass through the through-hole; a patch antenna pattern spaced apart from the ground layer and electrically connected to one end of the feed via; a coupling patch pattern spaced apart from the patch antenna pattern; a first dielectric layer to accommodate the patch antenna pattern and the coupling patch pattern; a second dielectric layer to accommodate at least a portion of the feed via and the ground layer; and electrical connection structures disposed between the first dielectric layer and the second dielectric layer to separate the first dielectric layer from the second dielectric layer.
    Type: Grant
    Filed: February 19, 2021
    Date of Patent: July 11, 2023
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Kyung In Kang, Jeong Ki Ryoo, Kyu Bum Han
  • Antenna module
    Patent number: 11658391
    Abstract: Aspects disclosed herein include a device including a first antenna substrate including one or more antennas. The device also includes a metallization structure. The device also includes a first spacer disposed between the first antenna substrate and the metallization structure, configured to maintain a constant distance between the first antenna substrate and the metallization structure. The device also includes a first plurality of conductive elements, disposed within the first spacer, configured to electrically couple the first antenna substrate to the metallization structure. The device also includes where the first spacer is configured to enclose all the conductive elements, electrically coupled to the first antenna substrate, and is configured to form an air gap between the first antenna substrate and the metallization structure. The device also includes where the first plurality of conductive elements is separated by air in the air gap.
    Type: Grant
    Filed: December 21, 2020
    Date of Patent: May 23, 2023
    Assignee: QUALCOMM INCORPORATED
    Inventors: Hong Bok We, Aniket Patil, Jeahyeong Han, Mohammad Ali Tassoudji
  • Antenna apparatus
    Patent number: 11621499
    Abstract: An antenna apparatus includes a ground plane; a first patch antenna pattern having a first bandwidth and spaced apart from the ground plane; a second patch antenna pattern spaced apart from the ground plane and the first patch antenna and overlapping at least a portion of the first patch antenna pattern; and guide vias disposed between the first patch antenna pattern and the ground plane and electrically connecting the first patch antenna pattern to the ground plane. The second patch antenna pattern has a second bandwidth corresponding a frequency higher than a frequency of the first bandwidth. The guide vias are disposed along a first side of the first patch antenna pattern.
    Type: Grant
    Filed: September 30, 2021
    Date of Patent: April 4, 2023
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventor: Sang Hyun Kim
  • On PDCCH DMRS mapping and coreset resource allocation
    Patent number: 11611461
    Abstract: A UE determines a first DCCH resource candidate in a first CORESET on a carrier, the first DCCH resource candidate including a first set of RBs. The UE also determines a first sequence of DMRSs that are mapped, starting at a reference point, to RBs in a predetermined range within the carrier in a frequency domain, the predetermined range containing the first DCCH resource candidate in the frequency domain. The UE further determines a first reference location of the first set of RBs. The UE determines, based on the first reference location, a first set of DMRSs from the first sequence of DMRSs, the first set of DMRSs being mapped to the first set of RBs. The UE obtains a channel estimation based on the first set of DMRSs; and The UE performs blind decoding of the first DCCH resource candidate based on the channel estimation.
    Type: Grant
    Filed: May 19, 2021
    Date of Patent: March 21, 2023
    Assignee: MEDIATEK INC.
    Inventors: Yiju Liao, Chien Hwa Hwang, Chien-Chang Li
  • Structure, antenna, wireless communication module, and wireless communication device
    Patent number: 11509063
    Abstract: There is provided a new type of structure that resonates at a predetermined frequency, an antenna, a wireless communication module, and a wireless communication device. The structure includes a first conductor that extends in a second direction, a second conductor, a third conductor, a fourth conductor. The second conductor faces the first conductor in a first direction and that extends along the second direction. The third conductor is configured to capacitively connect the first conductor and the second conductor. The fourth conductor is configured to be electrically connected to the first conductor and the second conductor and extends along a first plane. Each of the first conductor and the second conductor includes a portion that extends along the second direction and that is exposed to an exterior space.
    Type: Grant
    Filed: August 22, 2019
    Date of Patent: November 22, 2022
    Assignee: KYOCERA CORPORATION
    Inventors: Nobuki Hiramatsu, Hiroshi Uchimura, Yasuhiko Fukuoka, Hikaru Nekozuka, Fangwei Tong, Masamichi Yonehara
  • Resonance structure and antenna
    Patent number: 11431108
    Abstract: A resonance structure includes a conductor part that expands along a first plane including a first direction and a third direction; a ground conductor that expands along the first plane; first pair conductors that electrically connect the conductor part and the ground conductor along a second direction intersecting the first plane and face each other in the first direction; and second pair conductors that electrically connect the conductor part and the ground conductor along the second direction and face each other in the third direction. The conductor part capacitively connects the first pair conductors and capacitively connects the second pair conductors. A first edge and a second edge of the conductor part intersect with each other. The first edge extends in the first direction from one conductor of the first pair conductor. The second edge extends in the third direction from one conductor of the second pair conductors.
    Type: Grant
    Filed: August 21, 2019
    Date of Patent: August 30, 2022
    Assignee: KYOCERA CORPORATION
    Inventor: Hiroshi Uchimura
  • Wireless communication technology, apparatuses, and methods
    Patent number: 11424539
    Abstract: Millimeter wave (mmWave) technology, apparatuses, and methods that relate to transceivers, receivers, and antenna structures for wireless communications are described. The various aspects include co-located millimeter wave (mmWave) and near-field communication (NFC) antennas, scalable phased array radio transceiver architecture (SPARTA), phased array distributed communication system with MIMO support and phase noise synchronization over a single coax cable, communicating RF signals over cable (RFoC) in a distributed phased array communication system, clock noise leakage reduction, IF-to-RF companion chip for backwards and forwards compatibility and modularity, on-package matching networks, 5G scalable receiver (Rx) architecture, among others.
    Type: Grant
    Filed: December 20, 2017
    Date of Patent: August 23, 2022
    Assignee: Intel Corporation
    Inventors: Erkan Alpman, Arnaud Lucres Amadjikpe, Omer Asaf, Kameran Azadet, Rotem Banin, Miroslav Baryakh, Anat Bazov, Stefano Brenna, Bryan K. Casper, Anandaroop Chakrabarti, Gregory Chance, Debabani Choudhury, Emanuel Cohen, Claudio Da Silva, Sidharth Dalmia, Saeid Daneshgar Asl, Kaushik Dasgupta, Kunal Datta, Brandon Davis, Ofir Degani, Amr M. Fahim, Amit Freiman, Michael Genossar, Eran Gerson, Eyal Goldberger, Eshel Gordon, Meir Gordon, Josef Hagn, Shinwon Kang, Te Yu Kao, Noam Kogan, Mikko S. Komulainen, Igal Yehuda Kushnir, Saku Lahti, Mikko M. Lampinen, Naftali Landsberg, Wook Bong Lee, Run Levinger, Albert Molina, Resti Montoya Moreno, Tawfiq Musah, Nathan G. Narevsky, Hosein Nikopour, Oner Orhan, Georgios Palaskas, Stefano Pellerano, Ron Pongratz, Ashoke Ravi, Shmuel Ravid, Peter Andrew Sagazio, Eren Sasoglu, Lior Shakedd, Gadi Shor, Baljit Singh, Menashe Soffer, Ra'anan Sover, Shilpa Talwar, Nebil Tanzi, Moshe Teplitsky, Chintan S. Thakkar, Jayprakash Thakur, Avi Tsarfati, Yossi Tsfati, Marian Verhelst, Nir Weisman, Shuhei Yamada, Ana M. Yepes, Duncan Kitchin
  • Slot antenna apparatus, communication system, and method for adjusting angle of radio waves emitted from slot antenna apparatus
    Patent number: 11387571
    Abstract: A slot antenna apparatus that includes a waveguide including a sidewall and having an extending direction, a slot provided on the sidewall, and a dielectric member that is attached to the waveguide and is slidable in the extending direction with respect to the slot, the dielectric member including a first section and a second section, the first section covering the slot at a first slide position, the second section covering the slot at a second slide position next to the first slide position, and the first section and the second section having different relative permittivities or different thicknesses with each other.
    Type: Grant
    Filed: January 27, 2021
    Date of Patent: July 12, 2022
    Assignee: FUJITSU LIMITED
    Inventors: Tomonori Sato, Shigekazu Kimura, Toshio Kawasaki, Yoji Ohashi
  • Radar sensor
    Patent number: 11300656
    Abstract: Example embodiments describe a radar sensor, whereby the radar sensor comprises a pair of continuous wave (CW) radar transceivers that each has a leaky wave antenna that are provided adjacent to each other. Each CW radar transceiver comprises a microwave frequency transmission circuit configured to transmit and receive signals reflected off a nearby object. The transmitted and received signals are then processed by the radar sensor to determine a relative displacement between the detected object and the radar sensor. This determined relative displacement may then be used with machine learning techniques to identify dynamic gestures made within the radar sensor's range of detection.
    Type: Grant
    Filed: July 24, 2019
    Date of Patent: April 12, 2022
    Assignee: NANYANG TECHNOLOGICAL UNIVERSITY
    Inventors: Karthik Thothathri Chandrasekaran, Arokiaswami Alphones, Muhammad Faeyz Karim, Ashita Priya Thomas
  • Antenna and electronic device including the same
    Patent number: 11276926
    Abstract: An electronic device is provided. The electronic device includes a housing including a first plate, a second plate facing a direction opposite to the first plate, and a lateral member surrounding a space between the first and second plates and connected to or integrally formed with the second plate. The electronic device further includes a display disposed in the space so as to be visible from outside through at least a part of the first plate, and at least one antenna structure disposed in the space, including a first surface and a second surface facing a direction opposite to the first surface, and including a first area and a second area surrounded by the first area when viewed from above the first surface.
    Type: Grant
    Filed: March 9, 2020
    Date of Patent: March 15, 2022
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sumin Yun, Dongyeon Kim, Seongjin Park, Woomin Jang, Myunghun Jeong, Jehun Jong, Jaehoon Jo
  • Inverted microstrip travelling wave patch array antenna system
    Patent number: 11223112
    Abstract: An antenna system includes a substrate of a dielectric material. A conductive feed joins a number of conductive patches arranged in a line forming an array. The conductive patches are spaced from one another and the array is disposed on the substrate. The array has first and second sides. A first ground plane is disposed on the first side of the array and is spaced apart from the array. A number of conducting pillars ground the substrate to the first ground plane, and the conducting pillars define a second ground plane on the substrate. The array is configured to radiate a radiation pattern characterized by a first beam width in a first plane and a second beam width in a second plane perpendicular to the first plane, wherein the first beam width is wider than the second beam width.
    Type: Grant
    Filed: March 29, 2019
    Date of Patent: January 11, 2022
    Assignee: GM GLOBAL TECHNOLOGY OPERATIONS LLC
    Inventor: Keerti S. Kona
  • Antenna device
    Patent number: 11196166
    Abstract: An antenna device includes a ground plate providing a ground potential, a first feeding part and a second feeding part provided to the ground plate, a vertical antenna element electrically connected to the first feeding part, spaced apart from a first surface of the ground plate, and configured to emit a radio wave having a polarization plane in a direction perpendicular to the ground plate, a horizontal antenna element electrically connected to the second feeding part, arranged in parallel with the ground plate, and configured to emit a radio wave having a polarization plane in a direction parallel to the ground plate, and an antenna base disposed on a second surface of the ground plate, and facing the ground plate and the horizontal antenna element. In the antenna base, at least a portion facing the horizontal antenna element is a dielectric.
    Type: Grant
    Filed: April 6, 2020
    Date of Patent: December 7, 2021
    Assignee: DENSO CORPORATION
    Inventors: Yuuji Kakuya, Yuzi Sugimoto, Hidenori Akita
  • Multi-fed patch antennas and devices including the same
    Patent number: 11177550
    Abstract: A radio frequency (RF) device may include a radio frequency integrated circuit (RFIC) chip and an antenna module on an upper surface of the RFIC chip. The antenna module may include a first patch parallel to the RFIC chip and having an upper surface configured to emit radiation in a vertical direction opposite the first patch from the RFIC chip, a ground plate parallel to the first patch, and between the first patch and the RFIC chip, and a first plurality of feed lines connected to a lower surface of the first patch and configured to supply at least one first differential signal to the first patch from the RFIC chip.
    Type: Grant
    Filed: November 6, 2018
    Date of Patent: November 16, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Dooseok Choi, Thomas Byunghak Cho, Seung-chan Heo
  • Tunable, flexible and stretchable adhesive-integrated antenna
    Patent number: 11154231
    Abstract: Disclosed are flexible and stretchable antenna devices, systems and methods of use and manufacture. In some aspects, a flexible and stretchable antenna device includes an adhesive substrate having flexible and stretchable material properties and capable of adhering to a surface of an object; and an antenna attached on or at least partially embedded within the adhesive substrate, the antenna including a radiating element and a ground element, in which one or both of the radiating element and the ground element include a mesh structure allowing the antenna device to transmit or receive wireless communication signals at a predetermined operating frequency while being stretched.
    Type: Grant
    Filed: March 13, 2017
    Date of Patent: October 26, 2021
    Assignee: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA
    Inventors: Todd Prentice Coleman, Amr Haj-Omar, Yun Soung Kim
  • Base station antenna
    Patent number: 11101550
    Abstract: A base station antenna is disclosed. The disclosed antenna includes: a reflector plate made of a metal material; a multiple number of radiators formed on the reflector plate and forming one or more arrays; and conductive rods positioned on both sides of each of the radiators, where the conductive rods are formed in parallel with the arrays formed by the radiators.
    Type: Grant
    Filed: February 21, 2018
    Date of Patent: August 24, 2021
    Assignee: ACE TECHNOLOGIES CORPORATION
    Inventors: Yong Sang Lee, Ho Yong Kim, Tack-Gyu Kim, Jae Hoon Tae, Bayanmunkh Enkhbayar, Kyu Hoon Lee
  • Electronic package
    Patent number: 11081776
    Abstract: An electronic package is provided. A functioning member having a concave portion and a second antenna portion is disposed on a carrier having a first antenna portion. The concave portion and the carrier form a functioning space. The first antenna portion and the second antenna portion are disposed in a projection space of the functioning space. The first antenna portion induces the second antenna portion.
    Type: Grant
    Filed: August 29, 2019
    Date of Patent: August 3, 2021
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Ying-Wei Lu, Bo-Siang Fang, Kuan-Ta Chen, Chia-Chu Lai
  • Antenna-in-package with better antenna performance
    Patent number: 11050135
    Abstract: An Antenna-in-Package (AiP) includes an interface layer having at least an antenna layer and an insulating layer disposed under the antenna layer. The antenna layer includes a first antenna region and a second antenna region spaced apart from the first antenna region. An integrated circuit die is disposed on the interface layer. The integrated circuit die is interposed between the first antenna region and the second antenna region. The first antenna region includes a first antenna element, a second antenna element extending along a first direction, and a feeding network electrically connecting the first antenna element and the second antenna element to the integrated circuit die. The feeding network, the first antenna element, and the second antenna element are coplanar. A plurality of solder balls is disposed on a surface of the interface layer.
    Type: Grant
    Filed: May 27, 2020
    Date of Patent: June 29, 2021
    Assignee: MEDIATEK INC.
    Inventors: Yen-Ju Lu, Wen-Chou Wu
  • On PDCCH DMRS mapping and coreset resource allocation
    Patent number: 11018910
    Abstract: A UE determines a first DCCH resource candidate in a first CORESET on a carrier, the first DCCH resource candidate including a first set of RBs. The UE also determines a first sequence of DMRSs that are mapped, starting at a reference point, to RBs in a predetermined range within the carrier in a frequency domain, the predetermined range containing the first DCCH resource candidate in the frequency domain. The UE further determines a first reference location of the first set of RBs. The UE determines, based on the first reference location, a first set of DMRSs from the first sequence of DMRSs, the first set of DMRSs being mapped to the first set of RBs. The UE obtains a channel estimation based on the first set of DMRSs; and The UE performs blind decoding of the first DCCH resource candidate based on the channel estimation.
    Type: Grant
    Filed: November 15, 2018
    Date of Patent: May 25, 2021
    Assignee: MEDIATEK INC.
    Inventors: Yiju Liao, Chien Hwa Hwang, Chien-Chang Li
  • Lensed antennas for use in wireless communications systems
    Patent number: 10959110
    Abstract: Array antennas include a plurality of lensed multi-beam sub-arrays, where each lensed multi-beam sub-array comprises a RF lens and a plurality of radiating elements that are associated with the RF lens and that are orbitally arranged about the RF lens.
    Type: Grant
    Filed: March 31, 2017
    Date of Patent: March 23, 2021
    Assignee: CommScope Technologies LLC
    Inventor: Kevin Eldon Linehan
  • Antenna device
    Patent number: 10950930
    Abstract: An antenna device has a configuration in which a feeding point is located at a position that is distant from an outer periphery of a ground conductor plate to a center side and that would correspond to polarized waves parallel to the ground conductor plate. The antenna devices includes a ground conductor plate and an antenna element. The antenna element includes a first vertical portion and a second vertical portion which are erected substantially perpendicularly from the ground conductor plate and a first parallel portion, a second parallel portion, and a third parallel portion which extend substantially parallel to the ground conductor plate. An end portion, in the ?Z direction, of the first vertical portion serves as a feeding point and is located at a position that is distant from an outer periphery of the ground conductor plate to a center side.
    Type: Grant
    Filed: November 8, 2017
    Date of Patent: March 16, 2021
    Assignee: YOKOWO CO., LTD.
    Inventor: Takeshi Sampo
  • Modular antenna systems for automotive radar sensors
    Patent number: 10897076
    Abstract: An antenna system includes a printed circuit board (PCB) on which electronic components are mounted and an antenna module mounted on the PCB. A coupling element on the PCB couples the antenna module to at least one of the electronic components. The antenna module comprises a radio-frequency (RF)-compatible antenna substrate and an antenna structure plurality of antenna patches formed on the RF-compatible antenna substrate.
    Type: Grant
    Filed: August 7, 2018
    Date of Patent: January 19, 2021
    Assignee: Veoneer US, Inc.
    Inventor: Majid Ahmadloo
  • Electronic package
    Patent number: 10840581
    Abstract: An electronic package is provided with a first substrate having a first antenna portion that is stacked on a second substrate having a second antenna portion via an antenna component. During a packaging process, a gap between the first substrate and the second substrate is held constantly by the antenna component. At the same time, the antenna component is regarded as a third antenna portion of the electronic package. The performance of the antennae is not adversely affected by the antenna component despite the fact that the antenna component is in close proximity to the first and second antenna portions.
    Type: Grant
    Filed: December 26, 2018
    Date of Patent: November 17, 2020
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Bo-Siang Fang, Kuan-Ta Chen, Chia-Chu Lai
  • Antenna assembly, electronic device and method for switching antenna
    Patent number: 10749245
    Abstract: Antenna assembly, electronic device and method for switching antenna are provided. The antenna assembly includes a first antenna structure, second antenna structure and third antenna structure, the first antenna structure is used as a diversity antenna, the second antenna structure is in an idle state, and the third antenna structure is used as a main antenna; a radio frequency module coupled to each of the first antenna structure, the second antenna structure and the third antenna structure through a switch assembly; and the switch assembly arranged to, according to signal quality of the first antenna structure, the second antenna structure and the third antenna structure, switch one of the first antenna structure or the second antenna structure to the main antenna, switch the other of the first antenna structure or the second antenna structure to the idle state and switch the third antenna structure to the diversity antenna.
    Type: Grant
    Filed: November 7, 2018
    Date of Patent: August 18, 2020
    Assignee: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD.
    Inventor: Yizhou Luo
  • High-efficiency dual-band circularly-polarized antenna for harsh environment for telecommunication
    Patent number: 10680345
    Abstract: An antenna for dual-band or wide-band communication link. The antenna includes a patch array, arranged above a top ground plane, that includes one or more panels, each panel included one or more patch subarrays, and each patch subarray includes single patch elements made from metal. Each patch element includes: a flat rectangular radiation surface element into which a rectangular cutout is formed; an RF power feed point having a cylindrical shape that makes contact to the bottom side of the radiation surface element and feeds through a hole formed in the top ground plane for connection to the RF power; and a structural post having a cylindrical shape that contacts, at one end, the bottom side of the radiation surface element at a region of the radiation surface element where electric surface current is substantially smaller than any other region, and contacts the top ground plane at a second end.
    Type: Grant
    Filed: December 17, 2018
    Date of Patent: June 9, 2020
    Assignee: CALIFORNIA INSTITUTE OF TECHNOLOGY
    Inventors: Nacer E. Chahat, Polly Estabrook, Brant T. Cook
  • Antenna with selectively enabled inverted-F antenna elements
    Patent number: 10651569
    Abstract: A radio frequency (RF) antenna unit is described. The RF antenna unit includes a feed portion, at least first and second selective grounding portions each configured to selectively enable or disable an electrical coupling to a substrate, and at least first and second conductive arms. The first conductive arm provides electrical conduction between the feed portion and the first grounding portion, extending from the first grounding portion towards and beyond the feed portion. The second conductive arm provides electrical conduction between the feed portion and the second grounding portion, extending from the second grounding portion towards and beyond the feed portion. First and second inverted F antenna (IFA) elements are defined by the feed portion, the respective first or second grounding portion and the respective first or second conductive arm. The feed portion is common to both the first and second IFA elements.
    Type: Grant
    Filed: July 20, 2018
    Date of Patent: May 12, 2020
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventor: Paul Robert Watson
  • Communication system, communication apparatus, and communication method
    Patent number: 10637524
    Abstract: A communication system comprises a first conductor member in which a first signal line is connected at a connection position other than end portions on a surface of the first conductor member, a second conductor member connected with a second signal line, and a communication control unit that controls wireless communication by electromagnetic coupling between a first coupler including the first conductor member and a second coupler including the second conductor member. A distance between the connection position and a farthest point from the connection position on the surface of the first conductor member is equal to or less than a quarter wavelength corresponding to a signal to be used in communication by the communication control unit.
    Type: Grant
    Filed: February 5, 2019
    Date of Patent: April 28, 2020
    Assignee: CANON KABUSHIKI KAISHA
    Inventor: Koji Yukimasa
  • Electronic device including loop-shaped antenna
    Patent number: 10559874
    Abstract: An electronic device according to various embodiments of the present invention may comprise: a body which is made of a conductive material and has both ends curvedly extending to be adjacent to each other so as to have a loop shape; a communication module arranged on the body; a feeding line which extends from the communication module and is arranged to cross a gap between both ends of the body; and at least one connection terminal for connecting the feeding line to the body, wherein the body can receive a feeding signal from the communication module through the feeding line, and transmit/receive a wireless signal. The above-mentioned electronic device can be implemented variously according to embodiments.
    Type: Grant
    Filed: July 8, 2015
    Date of Patent: February 11, 2020
    Assignee: Samsung Electronics Co., Ltd
    Inventors: Ioannis Tzanidis, James Vandenheuvel, Mitchell Johnson, Zhouyue Pi
  • Wireless communication system including polarization-agile phased-array antenna
    Patent number: 10516201
    Abstract: A wireless communication device is provided. The wireless communication device includes a millimeter wave antenna comprising a plurality of antenna elements, a radio frequency integrated circuit (RFIC), and a power feeding line, wherein the plurality of antenna elements are dual-type antenna elements configured to excite different polarization modes, and wherein the power feeding line allows a plurality of ports of the RFIC to individually connect to the plurality of dual-type antenna elements to excite the different polarization modes to perform beamforming. The wireless communication device and/or electronic device may be diversified according to various embodiments.
    Type: Grant
    Filed: December 1, 2016
    Date of Patent: December 24, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Alexander Nikolaevich Khripkov, Gennadiy Alexandrovich Evtyushkin, Anton Sergeevich Lukyanov, Won-Bin Hong
  • Fan-out semiconductor package
    Patent number: 10511080
    Abstract: A fan-out semiconductor package includes: a core member including a plurality of insulating layers and a plurality of wiring layers and having a blind cavity penetrating through a portion of the plurality of insulating layers; a semiconductor chip disposed in the blind cavity; an encapsulant encapsulating at least portions of the core member and an active surface of the semiconductor chip and filling at least portions of the blind cavity; and a connection member disposed on the core member and an active surface of the semiconductor chip and including a redistribution layer connected to the connection pads. The plurality of wiring layers include antenna patterns and ground patterns, the antenna patterns and the ground patterns are disposed on different levels, and the antenna patterns are connected to the connection pads through the redistribution layer.
    Type: Grant
    Filed: May 3, 2018
    Date of Patent: December 17, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Won Wook So, Yong Ho Baek, Doo Il Kim, Young Sik Hur
  • Antenna structure and wireless communication device using same
    Patent number: 10505262
    Abstract: An antenna structure includes a first antenna with a first feed point feeding current, a first radiating portion, a second radiating portion, and a first ground point. The first radiating portion is electrically connected to the first feed point and receives radiation signals in a first frequency band. The second radiating portion is electrically connected to the first feed point and receives and sends radiation signals in a second frequency band. The first ground point is spaced apart from the first feed point and is electrically connected to the second radiating portion.
    Type: Grant
    Filed: December 7, 2017
    Date of Patent: December 10, 2019
    Assignee: Chiun Mai Communication Systems, Inc.
    Inventors: Chien-Chang Liu, Ting-Chih Tseng, Kun-Lin Sung, Hsi-Chieh Chen, Peng-Yu Lai
  • Multi-polarization antenna system on a single circuit board
    Patent number: 10347977
    Abstract: Antenna structures and methods of operating the same of an electronic device are described. One apparatus includes a circuit board and an antenna having a ground element disposed on the circuit board. A ground-extension bracket is coupled to the ground element and oriented orthogonally to the circuit board. The antenna further includes a radiating element disposed on the circuit board and oriented linearly with respect to the ground-extension bracket. The antenna, in response to a radio frequency (RF) signal, is configured to radiate electromagnetic energy in a radiation pattern at an angle of polarization with respect to a plane of the circuit board, where the angle of polarization is acute and angled towards the ground-extension bracket.
    Type: Grant
    Filed: May 24, 2017
    Date of Patent: July 9, 2019
    Assignee: Amazon Technologies, Inc.
    Inventors: Namhoon Kim, Ming Zheng
  • Antenna device and electronic device including the same
    Patent number: 10347985
    Abstract: An electronic device is provided that includes a circuit board received in the electronic device and in which at least one board is layered, a communication module disposed at one surface of the circuit board and electrically connected to the circuit board, an antenna electrically connected to the communication module, and a metal structure whose one surface is separated from the other surface of the circuit board to form a space within the electronic device by enclosing the circuit board and in which at least one aperture is formed at one side thereof.
    Type: Grant
    Filed: August 24, 2017
    Date of Patent: July 9, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hyunjin Kim, Kwanghyun Baek, Byungchul Kim, Jungmin Park, Youngju Lee, Sungchul Park
  • Smart watch
    Patent number: 9952563
    Abstract: A smart watch is provided. The smart watch includes: a dial having two ends; a first watchband; a second watchband, the first watchband and the second watchband being connected to the two ends of the dial, respectively; an RF (Radio Frequency) transceiver circuit built in the dial; a feeder arranged on a surface of the first watchband or arranged inside the first watchband; and a conductive connecting member connected to an end of the first watchband and having a non-closed structure, wherein the conductive connecting member is operable as an antenna to connect with the RF transceiver circuit via the feeder and as a first watchband connector to connect the first watchband and the second watchband.
    Type: Grant
    Filed: December 14, 2016
    Date of Patent: April 24, 2018
    Assignee: XIAOMI INC.
    Inventors: Xiaofeng Xiong, Zonglin Xue, Linchuan Wang
  • Antenna and antenna assembly
    Patent number: 9917351
    Abstract: An antenna comprises a main body and a cable connecting to the main body. The main body has a grounding portion, a cantilevered arm, a first connecting portion and a second connecting portion. The first connecting portion connects the grounding portion and the cantilevered arm. The first connecting portion is located at the upper side of the cantilevered arm and defines a first slot with the cantilevered arm. The second connecting portion connects the grounding portion and the cantilevered arm. The second connecting portion is located at the lower side of the cantilevered arm and defines a second slot with the cantilevered arm.
    Type: Grant
    Filed: April 11, 2016
    Date of Patent: March 13, 2018
    Assignee: FOXCONN INTERCONNECT TECHNOLOGY Limited
    Inventor: Lung-Sheng Tai
  • Integrated antenna on interposer substrate
    Patent number: 9779990
    Abstract: Some embodiments relate to a semiconductor module comprising a low-cost integrated antenna that uses a conductive backside structure in conjunction with a ground metal layer to form a large ground plane with a small silicon area. In some embodiments, the integrated antenna structure has an excitable element that radiates electromagnetic radiation. An on-chip ground plane, located on a first side of an interposer substrate, is positioned below the excitable element. A compensation ground plane, located on an opposing side of the interposer substrate, is connected to the ground plane by one or more through-silicon vias (TSVs) that extend through the interposer substrate. The on-chip ground plane and the compensation ground collectively act to reflect the electromagnetic radiation generated by the excitable element, so that the compensation ground improves the performance of the on-chip ground plane.
    Type: Grant
    Filed: February 27, 2013
    Date of Patent: October 3, 2017
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Bo-Jr Huang, William Wu Shen, Chin-Her Chien, Chin-Chou Liu, Yun-Han Lee
  • Method and an apparatus for decoupling multiple antennas in a compact antenna array
    Patent number: 9543644
    Abstract: Disclosed is an apparatus for decoupling two antennas in an antenna array, in which the two antennas transmit and receive signals via a first input/output port and a second input/output port of the apparatus. The device may comprise a first adjusting device connected between a first antenna of the two antennas and the first input/output port, a second adjusting device connected between a second antenna of the two antennas and the second input/output port, and one or more decoupling networks connected between the first input/output port and the second input/output port. The first adjusting device and the second adjusting device are configured to have admittance adjustable to compensate an admittance of the decoupling networks such that an isolation coefficient between the two input/output ports approaches zero as well as reflection coefficients of each input/output port are minimized.
    Type: Grant
    Filed: July 1, 2014
    Date of Patent: January 10, 2017
    Assignee: The Chinese University of Hong Kong
    Inventors: Ke-Li Wu, Luyu Zhao, Kewei Qian, Dacheng Wei
  • Reconfigurable antenna structure with parasitic elements
    Patent number: 9525207
    Abstract: The present invention refers to a reconfigurable antenna structure. The antenna structure comprises an active radiating structure comprising at least an active radiating element, a passive radiating structure comprising at least a passive radiating element, a ground plane structure comprising at least a ground plane element and at least a first circuitry element to selectively electrically connect/disconnect said passive radiating element with/from said ground plane element. The ground plane structure comprises regulating means of the current distribution along said ground plane structure, when said antenna structure emits/receives an electromagnetic radiation.
    Type: Grant
    Filed: July 18, 2013
    Date of Patent: December 20, 2016
    Assignee: ADANT TECHNOLOGIES, INC.
    Inventors: Mauro Facco, Francesco Sacchetto, Daniele Piazza
  • Antenna device
    Patent number: 9385425
    Abstract: The present invention is to provide an antenna device with the isolation among feedpoints being further improved. In order to achieve this goal, the present invention provides an antenna device provided with a substrate having a ground area, and a first conductor, a second conductor and a third conductor. In the antenna, one end of the second conductor is connected to the ground area via a first feedpoint and the other end of the second conductor is connected to the first conductor. A second feedpoint is included serially in the third conductor at any position. Further, at least part of the third conductor is disposed opposite to the first conductor, and both ends of the third conductor are connected to the ground area.
    Type: Grant
    Filed: May 17, 2013
    Date of Patent: July 5, 2016
    Assignee: TDK CORPORATION
    Inventors: Yasuyuki Hara, Kenji Endou, Tetsuya Shibata
  • Antenna with divided ground plane
    Patent number: 9105974
    Abstract: A removable jacket for a modular communicator, including a connector for connecting the jacket to a modular communicator that includes an antenna and a ground plane for the antenna, wherein the jacket may be conveniently attached to and detached from the communicator, an extended ground plane for the antenna, and at least one ground contact, for connecting the extended ground plane to the ground plane of the communicator, wherein the ground plane of the communicator is too short for the antenna to resonate at a desired frequency, but the ground plane of the communicator when connected with the extended ground plane, provides a combined ground plane sufficient for the antenna to resonate at the desired frequency.
    Type: Grant
    Filed: February 7, 2013
    Date of Patent: August 11, 2015
    Assignee: Google Inc.
    Inventors: Sagiv Zeltser, Yohan Cohen
  • ANTENNA ISOLATION USING A TUNED GROUNDPLANE NOTCH
    Publication number: 20150138036
    Abstract: There is disclosed an antenna device relating to a single or dual band antenna system for use in mobile telecommunications devices, laptop and tablet computers, USB adapters and electrically small radio platforms comprising a pair of antennas attached to a conductive ground plane, the antennas being separated by free space in which at least one notch is formed in the conductive ground plane between the pair of antennas characterized in that the notch further includes an inductive component and a capacitive component providing good antenna isolation so as to enable MIMO operation or diversity operation.
    Type: Application
    Filed: January 30, 2015
    Publication date: May 21, 2015
    Inventor: Marc Harper