Glazed Layer Patents (Class 347/202)
  • Patent number: 11345164
    Abstract: The present invention provides a thermal print head capable of better performing printing on a printing medium; the thermal print head including: a substrate (1), formed with single crystal semiconductor; a resistor layer (4), including a plurality of heating portions (41) arranged in a main scan direction; and a wiring layer (3), configuring a charging path to the plurality of heating portions. The substrate includes: a main surface (11), being a surface opposite to the resistor layer; and a convex portion (13), disposed as protruding from the main surface and extending in the main scan direction. The convex portion includes: an inclining surface (132), inclining relative to the main surface and extending in a linear manner when viewing from the main scan direction; and a curving surface (131), disposed, in a protruding direction of the convex portion, on a position farther away from the main surface than the inclining surface, and curving in a manner that protrudes toward the protruding direction.
    Type: Grant
    Filed: June 8, 2020
    Date of Patent: May 31, 2022
    Assignee: ROHM Co., Ltd.
    Inventor: Taro Hayashi
  • Patent number: 10981396
    Abstract: A thermal head of the present disclosure includes a substrate 7, a heat generating unit 9, an electrode, a covering layer 27, and a covering member 29. The heat generating unit 9 is positioned above the substrate 7. The electrode is positioned above the substrate and connected to the heat generating unit 9. The covering layer 27 covers at least a part of the electrode when viewed in plan. The covering member 29 is positioned on the covering layer 27. The covering layer 27 has an upper surface 27a and a lateral surface 27b that is positioned on a side of the heat generating unit 9. An arithmetic-average surface roughness Ra of the lateral surface 27b is higher than an arithmetic-average surface roughness Ra of the upper surface 27a.
    Type: Grant
    Filed: March 29, 2018
    Date of Patent: April 20, 2021
    Assignee: KYOCERA CORPORATION
    Inventor: Yoichi Moto
  • Patent number: 10525730
    Abstract: A thermal head according to the present disclosure includes: a substrate; a first electrode; a heat generating section; a second electrode; a resin layer; and a protective layer. The first electrode is located on the substrate. The heat generating section is located on the substrate. The second electrode is located on the substrate so as to be electrically connected to the heat generating section and the first electrode. The resin layer is located on the first electrode. The protective layer is located on the resin layer. Moreover, the resin layer includes a first portion inserted in the first electrode.
    Type: Grant
    Filed: December 22, 2016
    Date of Patent: January 7, 2020
    Assignee: KYOCERA CORPORATION
    Inventor: Yoshinobu Ishii
  • Patent number: 10302821
    Abstract: The invention pertains to a tintable hard coat composition for forming a film on an optical article, the composition comprising at least one tinting enhancer, and at least two polymerizable monomers, a first monomer being an hydrolysat of an alkoxysilane comprising at least two alkoxy groups and one epoxy group, and a second monomer having at least two functional groups reacting with the first monomer, at least one of the two monomers having three functional groups of the same kind; the tinting enhancer being preferably chosen from the group consisting of 4-(methyl mercapto) phenol, 4,4? thiodiphenol,4,4?-Sulfonyldiphenol, and 3,3?-(Ethylenedioxy)diphenol or a mix thereof: Formulas (I), (II), (III), (IV).
    Type: Grant
    Filed: April 29, 2014
    Date of Patent: May 28, 2019
    Assignee: ESSILOR INTERNATIONAL
    Inventor: Hui Yu
  • Patent number: 10144224
    Abstract: A thermal head according to the disclosure includes: a substrate; a heat generating section disposed on the substrate; an electrode disposed on the substrate so as to be electrically connected to the heat generating section; a protective layer which covers the heat generating section and part of the electrode, the protective layer being formed of an inorganic material; a cover layer disposed on the protective layer, the cover layer being formed of a resin material; and inorganic particles disposed on a surface of the protective layer so as to protrude from the surface. Moreover, the inorganic particles each comprise a first portion located inside the cover layer and a second portion located inside the protective layer.
    Type: Grant
    Filed: June 23, 2016
    Date of Patent: December 4, 2018
    Assignee: Kyocera Corporation
    Inventors: Yuuki Matsusaki, Masashi Yoneta
  • Patent number: 9744774
    Abstract: The present invention provides a thermal print head and a thermal printer that can deliver improved printing quality. The thermal print head includes a main substrate with a main surface, heating elements arranged along a main scanning direction, and a protection layer that covers the heating elements. A belt-shaped heating glaze layer is between the main surface and the heating elements, extends along the main scanning direction, and bulges towards the direction where the main surface faces. The surface shape of the protection layer has an equivalent radius of curvature Re between 6200 ?m and 15000 ?m. The equivalent radius of curvature Re is calculated by Hq and Wq. Hq is ΒΌ of the maximum height Hm of the bulging portion of the protection layer including the heating glaze layer. Wq is the width of the bulging portion along a sub-scanning direction, measured at a height equal to Hm minus Hq.
    Type: Grant
    Filed: December 20, 2016
    Date of Patent: August 29, 2017
    Assignee: ROHM CO., LTD.
    Inventors: Koji Nishi, Tadashi Yamamoto
  • Patent number: 8629892
    Abstract: A thermal printer has a support substrate with a concave portion in a surface thereof, and an upper substrate bonded to the surface of the support substrate and including a convex portion at a position corresponding to the concave portion. A heating resistor is provided on a surface of the upper substrate at a position straddling the convex portion. A pair of electrodes is provided on both sides of the heating resistor, with each of the electrodes being formed in a region outside of the convex portion. The convex portion extends at a height greater than each of the electrodes. At least one of the pair of electrodes has a thin portion connected to the heating resistor in a region corresponding to the concave portion, and a thick portion connected to the heating resistor and having a thickness greater than that of the thin portion.
    Type: Grant
    Filed: February 22, 2012
    Date of Patent: January 14, 2014
    Assignee: Seiko Instruments Inc.
    Inventors: Toshimitsu Morooka, Keitaro Koroishi, Noriyoshi Shoji, Norimitsu Sanbongi
  • Patent number: 8624946
    Abstract: A thermal head has a support substrate including a concave portion formed in a front surface thereof. An upper substrate is bonded in a stacked state to the front surface of the support substrate and includes a convex portion formed within a region corresponding to the concave portion. A heating resistor is provided on a front surface of the upper substrate at a position straddling the convex portion. A pair of electrodes is provided on both sides of the heating resistor. At least one of the pair of electrodes has a thin portion and a thick portion. The thin portion is connected to the heating resistor at one of a side surface and a top surface of the convex portion in the region corresponding to the concave portion. The thick portion is connected to the heating resistor and is formed thicker than the thin portion.
    Type: Grant
    Filed: February 22, 2012
    Date of Patent: January 7, 2014
    Assignee: Seiko Instruments Inc.
    Inventors: Toshimitsu Morooka, Keitaro Karoishi, Noriyoshi Shoji, Norimitsu Sanbongi
  • Patent number: 8553059
    Abstract: A thermal printer head that is highly efficient to manufacture is provided, which includes: a first substrate (11), including a first main surface (110), a first inclined surface (111) that is inclined relative to the first main surface (110), and a second inclined surface (112) that is inclined relative to the first main surface (110); an electrode layer (3), laminated on the first main surface (110), the first inclined surface (111), and the second inclined surface (112); a resistor layer (4), having a plurality of heat dissipation portions (41) respectively laminated on the first inclined surface (111) and crossing separated parts in the electrode layer (3); a driving integrated circuit (IC), for controlling the current passing through each heat dissipation portion (41); and a plurality of wires (81), respectively joined to the driving IC and joined to the second inclined surface (112) through the electrode layer (3).
    Type: Grant
    Filed: December 15, 2011
    Date of Patent: October 8, 2013
    Assignee: Rohm Co., Ltd.
    Inventors: Shigeyoshi Ono, Yasuhiro Yoshikawa
  • Patent number: 8466942
    Abstract: A thermal print head includes a substrate, an electrode layer supported on the substrate and provided with a plurality of mutually spaced-apart portions, a resistor layer provided with a plurality of heating portions arranged along a primary scanning direction, the heating portions lying across the spaced-apart portions, and a protective layer configured to cover the resistor layer, the protective layer including a first layer made of glass matrix and a plurality of alumina grains mixed into the glass matrix.
    Type: Grant
    Filed: December 8, 2011
    Date of Patent: June 18, 2013
    Assignee: Rohm Co., Ltd.
    Inventor: Syojiro Daicho
  • Patent number: 8384749
    Abstract: A thermal head has a support substrate that has a concave portion having an opening portion formed in a surface of the support substrate, and an upper substrate bonded to the surface of the support substrate in a stacked state to close the opening portion. The upper substrate has an external dimension which is smaller than an external dimension of the support substrate and is slightly larger than an external dimension of the opening portion for closing the opening portion. A heating resistor is formed on a surface of the upper substrate in a position opposed to the concave portion of the support substrate. The thermal head is high in durability and reliability with increased printing efficiency as well as increased manufacturing yields.
    Type: Grant
    Filed: February 17, 2011
    Date of Patent: February 26, 2013
    Assignee: Seiko Instruments Inc.
    Inventors: Toshimitsu Morooka, Keitaro Koroishi, Noriyoshi Shoji, Norimitsu Sanbongi
  • Patent number: 8379070
    Abstract: A thermal head includes a support substrate having a concave portion formed in its front surface, and an upper substrate bonded in a stacked state to the front surface of the support substrate. A heating resistor is provided on the front surface of the upper substrate at a position corresponding to the concave portion. A pair of electrodes are provided on opposite sides of the heating resistor, and a convex portion is formed in the front surface of the upper substrate between the pair of electrodes. The heating resistor has a heating portion disposed between and not overlapped by the electrodes, and the heating portion directly overlies the concave portion. The convex portion has a width dimension smaller than that of the heating portion.
    Type: Grant
    Filed: November 10, 2010
    Date of Patent: February 19, 2013
    Assignee: Seiko Instruments Inc.
    Inventors: Toshimitsu Morooka, Keitaro Koroishi, Noriyoshi Shoji, Norimitsu Sanbongi
  • Patent number: 8368733
    Abstract: A thermal head includes a substrate main body including a flat plate-shaped support substrate and a flat plate-shaped upper substrate which are bonded to each other in a stacked state. A rectangular heating resistor is formed on a surface of the flat plate-shaped upper substrate. A bonding surface of the flat plate-shaped support substrate includes a concave portion that forms a cavity portion in a region opposed to the rectangular heating resistor and the concave portion includes a groove formed in an inner wall thereof and recessed along a depth direction of the concave portion within a range of a width of the rectangular heating resistor. The thermal head is capable of enhancing heat-insulating performance while maintaining mechanical strength of the upper substrate.
    Type: Grant
    Filed: December 7, 2010
    Date of Patent: February 5, 2013
    Assignee: Seiko Instruments Inc.
    Inventors: Keitaro Koroishi, Toshimitsu Morooka, Noriyoshi Shoji, Norimitsu Sanbongi
  • Patent number: 8339431
    Abstract: Provided is a thermal head including an intermediate layer between a support substrate and an upper substrate, which is capable of suppressing heat dissipation toward the support substrate while maintaining printing quality. Employed is a thermal head (1) including: an upper substrate (5); a support substrate (3) bonded in a stacked state on one surface side of the upper substrate (5); a heating resistor (7) provided on another surface side of the upper substrate (5); and an intermediate layer (6) including a concave portion that forms a cavity portion (4) in a region corresponding to the heating resistor (7), the intermediate layer (6) being provided between the upper substrate (5) and the support substrate (3), in which the intermediate layer (6) is formed of a plate-shaped glass material having a lower melting point than melting points of the upper substrate (5) and the support substrate (3).
    Type: Grant
    Filed: December 7, 2010
    Date of Patent: December 25, 2012
    Assignee: Seiko Instruments Inc.
    Inventors: Norimitsu Sanbongi, Toshimitsu Morooka, Keitaro Koroishi, Noriyoshi Shoji
  • Patent number: 8334886
    Abstract: A thermal head has a support substrate, an upper plate substrate having a back surface bonded to a top surface of the support substrate, and a heating resistor provided on the upper plate substrate. A concave portion is formed in a region of at least one of the top surface of the support substrate and the back surface of the upper plate substrate and opposes the heating resistor. A through portion is formed in the upper plate substrate and passes through the upper plate substrate from a top surface of the upper plate substrate to the top surface of the support substrate in a plate thickness direction. The upper plate substrate functions as a heat accumulating layer, and the concave portion functions as a heat insulating layer.
    Type: Grant
    Filed: July 28, 2010
    Date of Patent: December 18, 2012
    Assignee: Seiko Instruments Inc.
    Inventors: Norimitsu Sanbongi, Noriyoshi Shoji, Toshimitsu Morooka, Keitaro Koroishi
  • Publication number: 20120287216
    Abstract: A thermal head wherein abrasion of an insulating protection film of a heating resistor formed on a partial glaze layer can be suppressed. A heating resistor is provided on the partial glaze layer provided on a ceramic substrate in the longitudinal direction, and the entire surface including the heating resistor is covered by the insulating protection film. A level difference is formed between the insulating protection film over the heating resistor and a flat portion of the insulating protection film over the area outside of the partial glaze layer. The level difference is set so that the insulating protection film on the heating resistor defines a higher portion and a platen roller can press thermal paper on the insulating protection film over the heating resistor and on the flat insulating protection film outside of the partial glaze layer. Thereby, the pressing force of the platen roller can be dispersed.
    Type: Application
    Filed: June 17, 2010
    Publication date: November 15, 2012
    Applicant: AOI ELECTRONICS CO., LTD.
    Inventor: Norio Yamaji
  • Patent number: 8289354
    Abstract: Provided are a thermal head that has a cavity portion at a position corresponding to heating resistors and is capable of improving thermal efficiency while ensuring strength of the cavity portion, and a printer including the thermal head. The thermal head (1) includes: a supporting substrate (3) including a concave portion (2) in a surface thereof; an upper substrate (5) bonded in a stacked state to the surface of the supporting substrate (3); and a heating resistor (7) provided at a position, which corresponds to the concave portion (2), of a surface of the upper substrate (5), in which a centerline average roughness of at least a region of a back surface of the upper substrate (5) is set to be less than 5 nm, the region being opposed to the concave portion (2).
    Type: Grant
    Filed: September 15, 2010
    Date of Patent: October 16, 2012
    Assignee: Seiko Instruments Inc.
    Inventors: Toshimitsu Morooka, Keitaro Koroishi, Noriyoshi Shoji, Norimitsu Sanbongi
  • Patent number: 8233019
    Abstract: To provide a thermal head which provides an excellent adhesion between the common electrode and the heat element, and in which the content of Pb is sufficiently reduced. A thermal head 5, comprising a substrate 7, a glaze layer 3 provided on the substrate 7, a common electrode 4 provided on the glaze layer 3, a heat element 1 provided on the common electrode 4 and the glaze layer 3, and lead electrodes 2a and 2b provided on the heat element 1, wherein the common electrode 4 includes an electrically conductive material composed of metal and a glass frit, and the glass frit contains 15 to 35% by mass of ZnO, 14 to 34% by mass of SiO2, 2 to 25% by mass of Al2O3, 2 to 15% by mass of TiO2, 5 to 25% by mass of CaO, and 7 to 27% by mass of BaO.
    Type: Grant
    Filed: December 29, 2009
    Date of Patent: July 31, 2012
    Assignee: TDK Corporation
    Inventors: Emi Ninomiya, Hiroshi Yamada, Katsuhiko Igarashi
  • Patent number: 8212849
    Abstract: There are provided a method of manufacturing a thermal head having a hollow portion at a position opposing a heating resistor, the manufacturing method assuring a sufficient strength to an upper plate substrate of the thermal head. The manufacturing method includes: processing a top surface of the upper plate substrate bonded to a support substrate to thin the upper plate substrate to a thickness T; wherein the processing comprises processing the top surface of the upper plate substrate so that a roughness Ra of the top surface of the upper plate substrate satisfies the following expression: Ra?loge(T2)/(3Γ—106)+6.5Γ—10?6.
    Type: Grant
    Filed: June 10, 2010
    Date of Patent: July 3, 2012
    Assignee: Seiko Instruments Inc.
    Inventors: Keitaro Koroishi, Toshimitsu Morooka, Noriyoshi Shoji, Norimitsu Sanbongi
  • Publication number: 20120154504
    Abstract: A thermal printer head that is highly efficient to manufacture is provided, which includes: a first substrate (11), including a first main surface (110), a first inclined surface (111) that is inclined relative to the first main surface (110), and a second inclined surface (112) that is inclined relative to the first main surface (110); an electrode layer (3), laminated on the first main surface (110), the first inclined surface (111), and the second inclined surface (112); a resistor layer (4), having a plurality of heat dissipation portions (41) respectively laminated on the first inclined surface (111) and crossing separated parts in the electrode layer (3); a driving integrated circuit (IC), for controlling the current passing through each heat dissipation portion (41); and a plurality of wires (81), respectively joined to the driving IC and joined to the second inclined surface (112) through the electrode layer (3).
    Type: Application
    Filed: December 15, 2011
    Publication date: June 21, 2012
    Applicant: ROHM CO., LTD.
    Inventors: Shigeyoshi ONO, Yasuhiro YOSHIKAWA
  • Publication number: 20120147118
    Abstract: A thermal print head includes a substrate, an electrode layer supported on the substrate and provided with a plurality of mutually spaced-apart portions, a resistor layer provided with a plurality of heating portions arranged along a primary scanning direction, the heating portions lying across the spaced-apart portions, and a protective layer configured to cover the resistor layer, the protective layer including a first layer made of glass matrix and a plurality of alumina grains mixed into the glass matrix.
    Type: Application
    Filed: December 8, 2011
    Publication date: June 14, 2012
    Applicant: ROHM CO., LTD.
    Inventor: Syojiro DAICHO
  • Patent number: 8031215
    Abstract: A thermal head which forms an image on a recording medium by pressing a protruding portion on which heating elements are arranged on the recording medium while driving the heating elements to be heated includes a support substrate in which a concave gap portion facing the protruding portion is formed and a glaze layer provided on the support substrate and in which the protruding portion is formed, in which the glaze layer has a base layer stacked on the support substrate as well as forming a ceiling surface of the gap portion and a heat resistant layer stacked on the base layer and on which the heating elements are arranged.
    Type: Grant
    Filed: January 29, 2009
    Date of Patent: October 4, 2011
    Assignee: Sony Corporation
    Inventors: Noboru Koyama, Mitsuo Yanase, Toru Morikawa, Kazunori Onuma
  • Patent number: 7990405
    Abstract: A thermal head is provided with increased contact pressure between a heat generating portion and a printing medium to increase printing quality with a low heat loss. The thermal head includes: a plurality of heat generating resistors formed via an insulating layer; a driver circuit unit for driving the plurality of heat generating resistors to generate a heat; a wiring for connecting the driver circuit unit to the plurality of heat generating resistors; a protecting film formed to cover the plurality of heat generating resistors, the driver circuit unit and the wiring. The plurality of heat generating resistors, the driver circuit unit, the wiring and the protecting film are formed on a substrate. A thermal insulating layer having a thermal conductivity smaller than 0.5 W/mΒ·K and having a maximum thickness of larger than 10 ?m is provided between the heat generating resistor and the substrate.
    Type: Grant
    Filed: August 24, 2009
    Date of Patent: August 2, 2011
    Assignee: Canon Kabushiki Kaisha
    Inventor: Yoshihiko Fukumoto
  • Patent number: 7965307
    Abstract: A thermal head is disclosed. The thermal head includes a heat generating element row in which plural heat generating elements are arrayed in a main scanning direction and a glaze that stores heat generated from the respective heat generating elements. The thermal head records an image on a recording medium by causing the respective heat generating elements to generate heat while conveying the recording medium in a sub-scanning direction. A plurality of the heat generating element rows are arrayed in the sub-scanning direction. The glaze includes plural convex portions arranged in the sub-scanning direction in association with the number of arrays of the heat generating element rows. The heat generating elements are arranged on upper sides of the convex portions, respectively.
    Type: Grant
    Filed: November 19, 2007
    Date of Patent: June 21, 2011
    Assignee: Sony Corporation
    Inventors: Takaaki Murakami, Yasushi Hirumi
  • Patent number: 7956880
    Abstract: A heating resistor element component has supporting substrate with a concave portion formed in a surface of the supporting substrate. A glass substrate is disposed on the surface of the supporting substrate. At least a region of the glass substrate opposite to the concave portion of the support substrate has a heterogeneous phase structure with physical properties different from those of the material of the glass substrate such that an overall mechanical strength of the glass substrate is increased. The heterogeneous phase structure is formed by laser processing using a phemtosecond laser having a power intensity of 1Γ—106 W to 1Γ—108 W. Heating resistors are arranged at intervals on the glass substrate and have heating portions disposed opposite to the concave portion of the supporting substrate. A common wire is connected to one end of each of the heating resistors. Individual wires are each connected to another end of each of the heating resistors.
    Type: Grant
    Filed: March 16, 2009
    Date of Patent: June 7, 2011
    Assignee: Seiko Instruments Inc.
    Inventors: Noriyoshi Shoji, Norimitsu Sanbongi, Yoshinori Sato, Toshimitsu Morooka, Keitaro Koroishi
  • Patent number: 7768541
    Abstract: Provided is a heating resistor element including: an insulating substrate including a glass material; a heat accumulating layer bonded to the insulating substrate through heating to temperature ranging from an annealing point to a softening point in a state of being adhered to a surface of the insulating substrate, and including the same material as the glass material of the insulating substrate; and a heating resistor provided on the heat accumulating layer, in which, on at least one of bonded surfaces between the insulating substrate and the heat accumulating layer, at least one of the insulating substrate and the heat accumulating layer is provided with a concave portion in a region opposed to the heating resistor to form a hollow portion. Accordingly, deformation caused by a difference in coefficient of thermal expansion is suppressed to improve printing quality.
    Type: Grant
    Filed: October 20, 2008
    Date of Patent: August 3, 2010
    Assignee: Seiko Instruments Inc.
    Inventors: Keitaro Koroishi, Toshimitsu Morooka, Noriyoshi Shoji, Yoshinori Sato, Norimitsu Sanbongi
  • Publication number: 20100177154
    Abstract: To provide a thermal head which provides an excellent adhesion between the common electrode and the heat element, and in which the content of Pb is sufficiently reduced. A thermal head 5, comprising a substrate 7, a glaze layer 3 provided on the substrate 7, a common electrode 4 provided on the glaze layer 3, a heat element 1 provided on the common electrode 4 and the glaze layer 3, and lead electrodes 2a and 2b provided on the heat element 1, wherein the common electrode 4 includes an electrically conductive material composed of metal and a glass frit, and the glass frit contains 15 to 35% by mass of ZnO, 14 to 34% by mass of SiO2, 2 to 25% by mass of Al2O3, 2 to 15% by mass of TiO2, 5 to 25% by mass of CaO, and 7 to 27% by mass of BaO.
    Type: Application
    Filed: December 29, 2009
    Publication date: July 15, 2010
    Applicant: TDK Corporation
    Inventors: Emi Ninomiya, Hiroshi Yamada, Katsuhiko Igarashi
  • Publication number: 20090207229
    Abstract: A thermal printhead A includes a glaze layer 2 formed on an insulating substrate 1, a resistor layer 3 formed on the glaze layer, a conductor layer 4 formed so that part of the resistor layer is exposed to serve as a heating portion 3c and a protective film 5 formed to cover the conductor layer 4 and the heating portion 3c. The protective film 5 includes a lower first protective layer 5a, and an upper second protective layer 5b overlapping the first protective layer 5a and serving as the outermost layer. The first protective layer 5a has a hardness of 500 to 800 Hk and a thickness of 1 to 2 ?m. The second protective layer 5b has a hardness of 1000 to 2000 Hk and a thickness of 5 to 8 ?m.
    Type: Application
    Filed: June 6, 2006
    Publication date: August 20, 2009
    Applicant: ROHM CO., LTD.
    Inventor: Takumi Yamade
  • Patent number: 7538785
    Abstract: A thermal printhead (A1) includes electrodes (3a-3c) embedded in a glaze layer 2 at least at a portion laminated with a resistor (4). Favorably, the portion of the electrodes (3a-3c) laminated with the resistor (4) is sunk to a depth causing the surfaces of the electrodes to be flush with the surface of the glaze layer 2. Such structure enhances the heat transfer efficiency from a heating portion (40) of the resistor (4) to a thermal recording medium, and smooth transfer of thermal recording paper.
    Type: Grant
    Filed: May 23, 2005
    Date of Patent: May 26, 2009
    Assignee: Rohm Co., Ltd.
    Inventors: Masaya Yamamoto, Shinobu Obata
  • Publication number: 20090115830
    Abstract: A thermal printhead (A) includes an insulating substrate (1), a glaze layer (2), a resistor layer (3), an electrode layer (4) and a protective layer (5). The electrode layer (4) has a two-layer structure made up of a lower first electrode layer (4a) and an upper second electrode layer (4b). The resistor layer (3) includes a heating portion (7). The heating portion (7) is exposed from both the first electrode layer (4a) and the second electrode layer (4b) and is positioned on a bulging portion (2c) of the glaze layer (2).
    Type: Application
    Filed: June 13, 2006
    Publication date: May 7, 2009
    Applicant: ROHM CO., LTD.
    Inventor: Takumi Yamade
  • Patent number: 7460143
    Abstract: A thermal printhead (A1) comprises an insulating substrate (1), a common electrode (31) which is formed on the insulating substrate (1) and includes a plurality of comb teeth (31a), a plurality of individual electrodes (41) formed on the insulating substrate (1), and a resistor layer (51) formed on the insulating substrate (1) and electrically connected to the comb teeth (31a) and the individual electrodes (41). The resistor layer (51) comprises a thin film, whereas the common electrode (31) and the individual electrodes (41) comprise a thick film.
    Type: Grant
    Filed: September 16, 2004
    Date of Patent: December 2, 2008
    Assignee: Rohm Co., Ltd.
    Inventors: Tadashi Yamamoto, Shinobu Obata, Kanjou Ishibashi
  • Patent number: 7427998
    Abstract: A thermal head having electrode wiring lines in a narrow wiring region, in which a line and a space are narrow, with good pattern accuracy and a method of manufacturing the same are provided. A thermal head includes: a plurality of heating resistors arranged in a line at predetermined pitches there between on a protruding level difference part of a glazed substrate; bent wiring lines each of which serves to electrically connect a pair of adjacent heating resistors to each other; a common wiring line and individual wiring lines used to cause the pair of adjacent heating resistors to be electrically conducted through each of the bent wiring lines; and bonding pads formed on one ends of the individual wiring lines. The common wiring line has a narrow wiring region located between the bonding pads arranged in a line and a wide wiring region wider than the narrow wiring region.
    Type: Grant
    Filed: September 5, 2007
    Date of Patent: September 23, 2008
    Assignee: Alps Electric Co., Ltd.
    Inventor: Shinya Yokoyama
  • Publication number: 20080117276
    Abstract: A thermal head is disclosed. The thermal head includes a heat generating element row in which plural heat generating elements are arrayed in a main scanning direction and a glaze that stores heat generated from the respective heat generating elements. The thermal head records an image on a recording medium by causing the respective heat generating elements to generate heat while conveying the recording medium in a sub-scanning direction. A plurality of the heat generating element rows are arrayed in the sub-scanning direction. The glaze includes plural convex portions arranged in the sub-scanning direction in association with the number of arrays of the heat generating element rows. The heat generating elements are arranged on upper sides of the convex portions, respectively.
    Type: Application
    Filed: November 19, 2007
    Publication date: May 22, 2008
    Applicant: SONY CORPORATION
    Inventors: Takaaki Murakami, Yasushi Hirumi
  • Publication number: 20080062239
    Abstract: A thermal head having electrode wiring lines in a narrow wiring region, in which a line and a space are narrow, with good pattern accuracy and a method of manufacturing the same are provided. A thermal head includes: a plurality of heating resistors arranged in a line at predetermined pitches there between on a protruding level difference part of a glazed substrate; bent wiring lines each of which serves to electrically connect a pair of adjacent heating resistors to each other; a common wiring line and individual wiring lines used to cause the pair of adjacent heating resistors to be electrically conducted through each of the bent wiring lines; and bonding pads formed on one ends of the individual wiring lines. The common wiring line has a narrow wiring region located between the bonding pads arranged in a line and a wide wiring region wider than the narrow wiring region.
    Type: Application
    Filed: September 5, 2007
    Publication date: March 13, 2008
    Inventor: Shinya Yokoyama
  • Patent number: 7104713
    Abstract: A printer has a sheet housing unit for storing a heat-sensitive adhesive sheet having a heat-sensitive adhesive layer on one side and a printable surface on the other side. A set of pull-out rollers pulls the heat-sensitive adhesive sheet out of the sheet housing unit and transports the sheet in a given direction, and a cutter device cuts the heat-sensitive adhesive sheet that has been transported by the pull-out rollers. A printing device has a thermal print head for printing letters or images on the printable surface of the heat-sensitive adhesive sheet, and a print platen roller for transporting the heat-sensitive adhesive sheet in the given direction. A thermal activation device has a thermal-activation thermal head for heating the heat-sensitive adhesive layer, and a thermal activation platen roller for transporting the heat-sensitive adhesive sheet in the given direction. A first drive unit drives the pull-out rollers and a second drive unit drives the print platen roller.
    Type: Grant
    Filed: October 14, 2004
    Date of Patent: September 12, 2006
    Assignee: Seiko Instruments Inc.
    Inventors: Minoru Hoshino, Norimitsu Sanbongi, Tatsuya Obuchi, Yoshinori Sato
  • Patent number: 7046265
    Abstract: A thermal head of the present invention is provided with a thermal insulation layer formed on a radiative substrate, a plurality of heating resistors formed on a top face of the thermal insulation layer, a plurality of power suppliers connected to the heating resistors to form a heater on a part of the heating resistors, and a protection layer that covers surfaces of at least the heating resistors and the power suppliers, wherein the thermal insulation layer is formed by laminating an inorganic high thermal insulation layer including a complex oxide ceramic containing Si, transition metal, and oxygen or including complex nitride ceramic containing Si, transition metal, and nitrogen on an organic thermal insulation layer that contains polyimide resin.
    Type: Grant
    Filed: January 28, 2002
    Date of Patent: May 16, 2006
    Assignee: Alps Electric Co., Ltd.
    Inventors: Takashi Shirakawa, Satoru Sasaki, Hirotoshi Terao
  • Patent number: 7011727
    Abstract: A thermal transfer film comprises a coloring layer formed on a substrate film via an intermediate layer, wherein the intermediate layer contains a thermally fusible substance and a non-transferable binder resin, the melt viscosity of the thermally fusible substance in the temperature range 15 to 25Β° C. higher than the fuse peak temperature of the thermally fusible substance is in the range of 100 to 1000 mPaΒ·s, the fuse peak temperature of the thermally fusible substance is in the range of 50 to 110Β° C., the crystallization peak temperature of the thermally fusible substance is in the range of ?20 to 100 Β° C., the crystallization peak temperature of the thermally fusible substance is lower than the fuse peak temperature by 10Β° C. or more, and the softening temperature of the binder resin measured by the ring and ball method is in the range of 130 to 400Β° C. This thermal transfer film is capable of forming a printed product with a good printing quality.
    Type: Grant
    Filed: June 19, 2003
    Date of Patent: March 14, 2006
    Assignee: DAI Nippon Printing Co., Ltd.
    Inventors: Masanori Torii, Mitsuru Maeda, Fumihiko Mizukami, Shigeki Chujo
  • Patent number: 6822665
    Abstract: A thermal head includes a metal substrate; an insulating layer formed on the surface of the metal substrate; a plurality of heating elements disposed on the surface of the insulating layer, the heating elements being arranged with a predetermined pitch along a plurality of lines in a main scanning direction, the plurality of lines being spaced from each other in a paper feeding direction perpendicular to the main scanning direction; and a heat radiating element projecting from the surface of the metal substrate to the side where the insulating layer is disposed. In this structure, although most of heat generated by the respective heating elements is transferred to an ink ribbon or print paper, residual partial heat is absorbed by heat radiating means via the insulating layer and radiated into the atmosphere. This suppresses thermal interference among the heating elements. A thermal head controller is provided for controlling the thermal head for use in a printer.
    Type: Grant
    Filed: March 8, 2001
    Date of Patent: November 23, 2004
    Assignee: Shinko Electric Co., Ltd.
    Inventors: Hayami Sugiyama, Takashi Kubota, Hiroshi Matsuda, Kazunori Masukawa
  • Patent number: 6719407
    Abstract: In a thermal head capable of performing printing of high quality while preventing foreign matters such as dirt or the like from accumulating in a portion, on which a heat reserving layer is formed, at the time of printing, the heat reserving layer comprising a projection formed by partially projecting a surface of the layer and having a top, the projection being provided on a surface thereof with heating elements, the projection being shaped in cross section in a direction perpendicular to a direction of arrangement of the heating elements to form an inclined surface on one surface side, which is formed to be lower than the other surface side. The projection is formed so that a height thereof from the one surface side is 5 to 50 &mgr;m.
    Type: Grant
    Filed: November 25, 2002
    Date of Patent: April 13, 2004
    Assignee: Alps Electric Co., Ltd.
    Inventor: Hiroshi Kobayashi
  • Patent number: 6614460
    Abstract: A thermal head including a protection layer having mutually opposed first and second surfaces, said first surface having a flat or protruded printing surface which is brought into contact with a heat sensitive record medium, a heat generating section including resistors and electrodes connected to the electrodes and provided on said second surface of the protection layer, and a reinforcing member made of a low melting pint glass and provided on a side of the heat generating section remote from the protection layer. The reinforcing member improves a mechanical strength of the thermal head. The reinforcing member made of a glass also serves as a heat storage member, and thus a thermal property of the thermal head is improved. The reinforcing member may be formed by an aggregate of ceramic particles. The reinforcing member may contain a heat storage layer made of a low melting point glass and a heat conduction layer provided on the heat storage layer.
    Type: Grant
    Filed: November 26, 2001
    Date of Patent: September 2, 2003
    Assignee: TDK Corporation
    Inventors: Masato Susukida, Katsuto Nagano, Yoshio Saita, Jun Hirabayashi, Jun Hagiwara
  • Patent number: 6529224
    Abstract: In a thermal head according to the present invention, a sacrificial layer of transition metal is formed on a top surface of a heat radiation substrate; a bridge layer of cermet or ceramic material is formed on a top surface of a heat insulation layer including the sacrificial layer; a cavity is made between the bridge layer and the heat insulation layer; a plurality of slits are made in the bridge layer overlying the cavity to expose the cavity; a highly adiabatic inorganic heat insulation layer is formed on a top surface of the bridge layer including the slits; and an inorganic protective layer of a material selected from among silicon or aluminum oxide, nitride and carbide is formed on a top surface of the inorganic heat insulation layer, where heating elements are formed between the slits over the inorganic heat insulation layer and the inorganic protective layer
    Type: Grant
    Filed: April 3, 2002
    Date of Patent: March 4, 2003
    Assignee: Alps Electric Co., Ltd.
    Inventors: Takashi Shirakawa, Toshifumi Nakatani
  • Publication number: 20020158959
    Abstract: A thermal head of the present invention is provided with a thermal insulation layer formed on a radiative substrate, a plurality of heating resistors formed on a top face of the thermal insulation layer, a plurality of power suppliers connected to the heating resistors to form a heater on a part of the heating resistors, and a protection layer that covers surfaces of at least the heating resistors and the power suppliers, wherein the thermal insulation layer is formed by laminating an inorganic high thermal insulation layer including a complex oxide ceramic containing Si, transition metal, and oxygen or including complex nitride ceramic containing Si, transition metal, and nitrogen on an organic thermal insulation layer that contains polyimide resin.
    Type: Application
    Filed: January 28, 2002
    Publication date: October 31, 2002
    Inventors: Takashi Shirakawa, Satoru Sasaki, Hirotoshi Terao
  • Patent number: 6424367
    Abstract: A thick-film thermal printhead comprises: an oblong rectangular substrate (1) having at least one longitudinal edge (1a); a partial glaze layer provided on the substrate along the longitudinal edge; a linear heating resistor (11) formed on the partial glaze layer; a common electrode (12) formed on the substrate and electrically connected to the heating resistor; and a plurality of individual electrode (13) formed on the substrate and electrically connected to the heating resistor. The common electrode includes a plurality of comb-like teeth (12A). Each of the comb-like teeth includes a tip portion (12c) having a smaller width and a base portion (12d) having a larger width. Each of the individual electrodes includes a tip portion (13d) having a smaller width and an intermediate portion (13e) having a larger width.
    Type: Grant
    Filed: November 6, 2000
    Date of Patent: July 23, 2002
    Assignee: Rohm Co., Ltd.
    Inventors: Shinobu Obata, Eiji Yokoyama
  • Publication number: 20020093560
    Abstract: A cyan thermal coloring layer, a magenta thermal coloring layer, and a yellow thermal coloring layer are successively formed on a base of a thermo-sensitive recording paper. A yellow thermal head, a magenta thermal head, and a cyan thermal head are disposed along a conveyance path. While the thermo-sensitive recording paper is being conveyed in the sub scanning direction along the conveyance path, three colors images are sequentially recorded by the three thermal heads. When the length of heat elements of the respective thermal heads are Ly, Lm and Lc in a sub scanning direction, it follows that Ly<Lm<Lc. When heated by the yellow thermal head, the isothermal curve shows minimum width in the surface of the thermo-sensitive recording paper. Meanwhile the isothermal curve of the cyan thermal head shows maximum width. By changing the isothermal curves of the three colors, the dots of the three colors are made equal in size.
    Type: Application
    Filed: January 14, 2002
    Publication date: July 18, 2002
    Applicant: FUJI PHOTO FILM CO., LTD.
    Inventor: Tomoyoshi Nishimura
  • Publication number: 20020030728
    Abstract: A thermal head including a protection layer having mutually opposed first and second surfaces, said first surface having a flat or protruded printing surface which is brought into contact with a heat sensitive record medium, a heat generating section including resistors and electrodes connected to the electrodes and provided on said second surface of the protection layer, and a reinforcing member made of a low melting pint glass and provided on a side of the heat generating section remote from the protection layer. The reinforcing member improves a mechanical strength of the thermal head. The reinforcing member made of a glass also serves as a heat storage member, and thus a thermal property of the thermal head is improved. The reinforcing member may be formed by an aggregate of ceramic particles. The reinforcing member may contain a heat storage layer made of a low melting point glass and a heat conduction layer provided on the heat storage layer.
    Type: Application
    Filed: November 26, 2001
    Publication date: March 14, 2002
    Applicant: TDK Corporation
    Inventors: Masato Susukida, Katsuto Nagano, Yoshio Saita, Jun Hirabayashi, Jun Hagiwara
  • Patent number: 6344868
    Abstract: A thermal head including a protection layer having mutually opposed first and second surfaces, said first surface having a flat or protruded printing surface which is brought into contact with a heat sensitive record medium, a heat generating section including resistors and electrodes connected to the electrodes and provided on said second surface of the protection layer, and a reinforcing member made of a low melting pint glass and provided on a side of the heat generating section remote from the protection layer. The reinforcing member improves a mechanical strength of the thermal head. The reinforcing member made of a glass also serves as a heat storage member, and thus a thermal property of the thermal head is improved. The reinforcing member may be formed by an aggregate of ceramic particles. The reinforcing member may contain a heat storage layer made of a low melting point glass and a heat conduction layer provided on the heat storage layer.
    Type: Grant
    Filed: July 22, 1998
    Date of Patent: February 5, 2002
    Assignee: TDK Corporation
    Inventors: Masato Susukida, Katsuto Nagano, Yoshio Saita, Jun Hirabayashi, Jun Hagiwara, Atsushi Yoshida
  • Patent number: 6304280
    Abstract: A thermal printhead 1 according to the present invention includes a multiplicity of heating elements 4a formed in a row on an obverse surface of an elongated substrate 2 at a portion which is offset widthwise toward one longitudinal side of the substrate, and a protective film 8 formed on the obverse surface of the substrate 2 at the widthwise offset portion for covering the heating elements 4a. The protective film 8 is formed to extend on the obverse surface of the substrate 2 continuously from the widthwise offset portion onto one longitudinal side surface 2a of the substrate. A longitudinal edge 8b of the protective film 8 directed toward the other longitudinal side of the substrate 2 is tapered.
    Type: Grant
    Filed: May 1, 2000
    Date of Patent: October 16, 2001
    Assignee: Rohm Co., Ltd.
    Inventors: Takumi Yamade, Hiroaki Hayashi, Eiji Yokoyama
  • Patent number: 6181360
    Abstract: The present invention provides a thermal head in which the surface of a heat insulating layer formed by vapor deposition such as sputtering or the like is polished to decrease the rate of defects such as failure in the resistance values of heating elements formed on the heat insulating layer, disconnection and short-circuit of electrodes, apparent foreign materials, etc., and improve the adhesion of the surface of the heat insulating layer. The thermal head includes a heat insulating layer formed on a radiating substrate by sputtering, and heating elements deposited on the surface of the thermal head, wherein the heat insulating layer has columnar crystals composed of silicon, transition metals and oxygen, the surface of the heat insulating layer is polished, and micro irregularity is formed on the polished surface of the heat insulating layer.
    Type: Grant
    Filed: September 30, 1998
    Date of Patent: January 30, 2001
    Assignee: Alps Electric Co., Ltd.
    Inventors: Takashi Shirakawa, Toshifumi Nakatani
  • Patent number: 6151054
    Abstract: A thermal head, used for an image forming device, comprises a glaze formed at at least a portion of a base plate of the thermal head so that at least a portion of the glaze is protruded, and a plurality of heater portions provided at the glaze, a length of each of the heater portions in a image forming direction of a recording material being less than or equal to 100 .mu.m, wherein an outer surface of each of the heater portions is a convex curved surface and is the outermost portion of the glaze.
    Type: Grant
    Filed: March 30, 1998
    Date of Patent: November 21, 2000
    Assignee: Fuji Photo Film Co., Ltd.
    Inventor: Osamu Shimizu
  • Patent number: 6067104
    Abstract: A polycrystalline layer is formed on a surface of a substrate and metal electrode layers are formed thereon to be opposed to each other. The polycrystalline silicon layer includes an exposed region exposed from the metal electrode layers, and this exposed region includes low resistance regions extending under the metal electrode layers to be in a pair, and a high resistance region having a high sheet resistance defined between the low resistance regions. At least one of the low resistance regions is so trimmed as to adjust heat generation from the high resistance region.
    Type: Grant
    Filed: August 19, 1996
    Date of Patent: May 23, 2000
    Assignee: Rohm Co., Ltd.
    Inventors: Hideo Taniguchi, Yasuhisa Fujii