Glazed Layer Patents (Class 347/202)
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Patent number: 11345164Abstract: The present invention provides a thermal print head capable of better performing printing on a printing medium; the thermal print head including: a substrate (1), formed with single crystal semiconductor; a resistor layer (4), including a plurality of heating portions (41) arranged in a main scan direction; and a wiring layer (3), configuring a charging path to the plurality of heating portions. The substrate includes: a main surface (11), being a surface opposite to the resistor layer; and a convex portion (13), disposed as protruding from the main surface and extending in the main scan direction. The convex portion includes: an inclining surface (132), inclining relative to the main surface and extending in a linear manner when viewing from the main scan direction; and a curving surface (131), disposed, in a protruding direction of the convex portion, on a position farther away from the main surface than the inclining surface, and curving in a manner that protrudes toward the protruding direction.Type: GrantFiled: June 8, 2020Date of Patent: May 31, 2022Assignee: ROHM Co., Ltd.Inventor: Taro Hayashi
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Patent number: 10981396Abstract: A thermal head of the present disclosure includes a substrate 7, a heat generating unit 9, an electrode, a covering layer 27, and a covering member 29. The heat generating unit 9 is positioned above the substrate 7. The electrode is positioned above the substrate and connected to the heat generating unit 9. The covering layer 27 covers at least a part of the electrode when viewed in plan. The covering member 29 is positioned on the covering layer 27. The covering layer 27 has an upper surface 27a and a lateral surface 27b that is positioned on a side of the heat generating unit 9. An arithmetic-average surface roughness Ra of the lateral surface 27b is higher than an arithmetic-average surface roughness Ra of the upper surface 27a.Type: GrantFiled: March 29, 2018Date of Patent: April 20, 2021Assignee: KYOCERA CORPORATIONInventor: Yoichi Moto
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Patent number: 10525730Abstract: A thermal head according to the present disclosure includes: a substrate; a first electrode; a heat generating section; a second electrode; a resin layer; and a protective layer. The first electrode is located on the substrate. The heat generating section is located on the substrate. The second electrode is located on the substrate so as to be electrically connected to the heat generating section and the first electrode. The resin layer is located on the first electrode. The protective layer is located on the resin layer. Moreover, the resin layer includes a first portion inserted in the first electrode.Type: GrantFiled: December 22, 2016Date of Patent: January 7, 2020Assignee: KYOCERA CORPORATIONInventor: Yoshinobu Ishii
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Patent number: 10302821Abstract: The invention pertains to a tintable hard coat composition for forming a film on an optical article, the composition comprising at least one tinting enhancer, and at least two polymerizable monomers, a first monomer being an hydrolysat of an alkoxysilane comprising at least two alkoxy groups and one epoxy group, and a second monomer having at least two functional groups reacting with the first monomer, at least one of the two monomers having three functional groups of the same kind; the tinting enhancer being preferably chosen from the group consisting of 4-(methyl mercapto) phenol, 4,4? thiodiphenol,4,4?-Sulfonyldiphenol, and 3,3?-(Ethylenedioxy)diphenol or a mix thereof: Formulas (I), (II), (III), (IV).Type: GrantFiled: April 29, 2014Date of Patent: May 28, 2019Assignee: ESSILOR INTERNATIONALInventor: Hui Yu
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Patent number: 10144224Abstract: A thermal head according to the disclosure includes: a substrate; a heat generating section disposed on the substrate; an electrode disposed on the substrate so as to be electrically connected to the heat generating section; a protective layer which covers the heat generating section and part of the electrode, the protective layer being formed of an inorganic material; a cover layer disposed on the protective layer, the cover layer being formed of a resin material; and inorganic particles disposed on a surface of the protective layer so as to protrude from the surface. Moreover, the inorganic particles each comprise a first portion located inside the cover layer and a second portion located inside the protective layer.Type: GrantFiled: June 23, 2016Date of Patent: December 4, 2018Assignee: Kyocera CorporationInventors: Yuuki Matsusaki, Masashi Yoneta
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Patent number: 9744774Abstract: The present invention provides a thermal print head and a thermal printer that can deliver improved printing quality. The thermal print head includes a main substrate with a main surface, heating elements arranged along a main scanning direction, and a protection layer that covers the heating elements. A belt-shaped heating glaze layer is between the main surface and the heating elements, extends along the main scanning direction, and bulges towards the direction where the main surface faces. The surface shape of the protection layer has an equivalent radius of curvature Re between 6200 ?m and 15000 ?m. The equivalent radius of curvature Re is calculated by Hq and Wq. Hq is ΒΌ of the maximum height Hm of the bulging portion of the protection layer including the heating glaze layer. Wq is the width of the bulging portion along a sub-scanning direction, measured at a height equal to Hm minus Hq.Type: GrantFiled: December 20, 2016Date of Patent: August 29, 2017Assignee: ROHM CO., LTD.Inventors: Koji Nishi, Tadashi Yamamoto
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Patent number: 8629892Abstract: A thermal printer has a support substrate with a concave portion in a surface thereof, and an upper substrate bonded to the surface of the support substrate and including a convex portion at a position corresponding to the concave portion. A heating resistor is provided on a surface of the upper substrate at a position straddling the convex portion. A pair of electrodes is provided on both sides of the heating resistor, with each of the electrodes being formed in a region outside of the convex portion. The convex portion extends at a height greater than each of the electrodes. At least one of the pair of electrodes has a thin portion connected to the heating resistor in a region corresponding to the concave portion, and a thick portion connected to the heating resistor and having a thickness greater than that of the thin portion.Type: GrantFiled: February 22, 2012Date of Patent: January 14, 2014Assignee: Seiko Instruments Inc.Inventors: Toshimitsu Morooka, Keitaro Koroishi, Noriyoshi Shoji, Norimitsu Sanbongi
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Patent number: 8624946Abstract: A thermal head has a support substrate including a concave portion formed in a front surface thereof. An upper substrate is bonded in a stacked state to the front surface of the support substrate and includes a convex portion formed within a region corresponding to the concave portion. A heating resistor is provided on a front surface of the upper substrate at a position straddling the convex portion. A pair of electrodes is provided on both sides of the heating resistor. At least one of the pair of electrodes has a thin portion and a thick portion. The thin portion is connected to the heating resistor at one of a side surface and a top surface of the convex portion in the region corresponding to the concave portion. The thick portion is connected to the heating resistor and is formed thicker than the thin portion.Type: GrantFiled: February 22, 2012Date of Patent: January 7, 2014Assignee: Seiko Instruments Inc.Inventors: Toshimitsu Morooka, Keitaro Karoishi, Noriyoshi Shoji, Norimitsu Sanbongi
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Patent number: 8553059Abstract: A thermal printer head that is highly efficient to manufacture is provided, which includes: a first substrate (11), including a first main surface (110), a first inclined surface (111) that is inclined relative to the first main surface (110), and a second inclined surface (112) that is inclined relative to the first main surface (110); an electrode layer (3), laminated on the first main surface (110), the first inclined surface (111), and the second inclined surface (112); a resistor layer (4), having a plurality of heat dissipation portions (41) respectively laminated on the first inclined surface (111) and crossing separated parts in the electrode layer (3); a driving integrated circuit (IC), for controlling the current passing through each heat dissipation portion (41); and a plurality of wires (81), respectively joined to the driving IC and joined to the second inclined surface (112) through the electrode layer (3).Type: GrantFiled: December 15, 2011Date of Patent: October 8, 2013Assignee: Rohm Co., Ltd.Inventors: Shigeyoshi Ono, Yasuhiro Yoshikawa
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Patent number: 8466942Abstract: A thermal print head includes a substrate, an electrode layer supported on the substrate and provided with a plurality of mutually spaced-apart portions, a resistor layer provided with a plurality of heating portions arranged along a primary scanning direction, the heating portions lying across the spaced-apart portions, and a protective layer configured to cover the resistor layer, the protective layer including a first layer made of glass matrix and a plurality of alumina grains mixed into the glass matrix.Type: GrantFiled: December 8, 2011Date of Patent: June 18, 2013Assignee: Rohm Co., Ltd.Inventor: Syojiro Daicho
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Patent number: 8384749Abstract: A thermal head has a support substrate that has a concave portion having an opening portion formed in a surface of the support substrate, and an upper substrate bonded to the surface of the support substrate in a stacked state to close the opening portion. The upper substrate has an external dimension which is smaller than an external dimension of the support substrate and is slightly larger than an external dimension of the opening portion for closing the opening portion. A heating resistor is formed on a surface of the upper substrate in a position opposed to the concave portion of the support substrate. The thermal head is high in durability and reliability with increased printing efficiency as well as increased manufacturing yields.Type: GrantFiled: February 17, 2011Date of Patent: February 26, 2013Assignee: Seiko Instruments Inc.Inventors: Toshimitsu Morooka, Keitaro Koroishi, Noriyoshi Shoji, Norimitsu Sanbongi
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Patent number: 8379070Abstract: A thermal head includes a support substrate having a concave portion formed in its front surface, and an upper substrate bonded in a stacked state to the front surface of the support substrate. A heating resistor is provided on the front surface of the upper substrate at a position corresponding to the concave portion. A pair of electrodes are provided on opposite sides of the heating resistor, and a convex portion is formed in the front surface of the upper substrate between the pair of electrodes. The heating resistor has a heating portion disposed between and not overlapped by the electrodes, and the heating portion directly overlies the concave portion. The convex portion has a width dimension smaller than that of the heating portion.Type: GrantFiled: November 10, 2010Date of Patent: February 19, 2013Assignee: Seiko Instruments Inc.Inventors: Toshimitsu Morooka, Keitaro Koroishi, Noriyoshi Shoji, Norimitsu Sanbongi
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Patent number: 8368733Abstract: A thermal head includes a substrate main body including a flat plate-shaped support substrate and a flat plate-shaped upper substrate which are bonded to each other in a stacked state. A rectangular heating resistor is formed on a surface of the flat plate-shaped upper substrate. A bonding surface of the flat plate-shaped support substrate includes a concave portion that forms a cavity portion in a region opposed to the rectangular heating resistor and the concave portion includes a groove formed in an inner wall thereof and recessed along a depth direction of the concave portion within a range of a width of the rectangular heating resistor. The thermal head is capable of enhancing heat-insulating performance while maintaining mechanical strength of the upper substrate.Type: GrantFiled: December 7, 2010Date of Patent: February 5, 2013Assignee: Seiko Instruments Inc.Inventors: Keitaro Koroishi, Toshimitsu Morooka, Noriyoshi Shoji, Norimitsu Sanbongi
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Patent number: 8339431Abstract: Provided is a thermal head including an intermediate layer between a support substrate and an upper substrate, which is capable of suppressing heat dissipation toward the support substrate while maintaining printing quality. Employed is a thermal head (1) including: an upper substrate (5); a support substrate (3) bonded in a stacked state on one surface side of the upper substrate (5); a heating resistor (7) provided on another surface side of the upper substrate (5); and an intermediate layer (6) including a concave portion that forms a cavity portion (4) in a region corresponding to the heating resistor (7), the intermediate layer (6) being provided between the upper substrate (5) and the support substrate (3), in which the intermediate layer (6) is formed of a plate-shaped glass material having a lower melting point than melting points of the upper substrate (5) and the support substrate (3).Type: GrantFiled: December 7, 2010Date of Patent: December 25, 2012Assignee: Seiko Instruments Inc.Inventors: Norimitsu Sanbongi, Toshimitsu Morooka, Keitaro Koroishi, Noriyoshi Shoji
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Patent number: 8334886Abstract: A thermal head has a support substrate, an upper plate substrate having a back surface bonded to a top surface of the support substrate, and a heating resistor provided on the upper plate substrate. A concave portion is formed in a region of at least one of the top surface of the support substrate and the back surface of the upper plate substrate and opposes the heating resistor. A through portion is formed in the upper plate substrate and passes through the upper plate substrate from a top surface of the upper plate substrate to the top surface of the support substrate in a plate thickness direction. The upper plate substrate functions as a heat accumulating layer, and the concave portion functions as a heat insulating layer.Type: GrantFiled: July 28, 2010Date of Patent: December 18, 2012Assignee: Seiko Instruments Inc.Inventors: Norimitsu Sanbongi, Noriyoshi Shoji, Toshimitsu Morooka, Keitaro Koroishi
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Publication number: 20120287216Abstract: A thermal head wherein abrasion of an insulating protection film of a heating resistor formed on a partial glaze layer can be suppressed. A heating resistor is provided on the partial glaze layer provided on a ceramic substrate in the longitudinal direction, and the entire surface including the heating resistor is covered by the insulating protection film. A level difference is formed between the insulating protection film over the heating resistor and a flat portion of the insulating protection film over the area outside of the partial glaze layer. The level difference is set so that the insulating protection film on the heating resistor defines a higher portion and a platen roller can press thermal paper on the insulating protection film over the heating resistor and on the flat insulating protection film outside of the partial glaze layer. Thereby, the pressing force of the platen roller can be dispersed.Type: ApplicationFiled: June 17, 2010Publication date: November 15, 2012Applicant: AOI ELECTRONICS CO., LTD.Inventor: Norio Yamaji
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Patent number: 8289354Abstract: Provided are a thermal head that has a cavity portion at a position corresponding to heating resistors and is capable of improving thermal efficiency while ensuring strength of the cavity portion, and a printer including the thermal head. The thermal head (1) includes: a supporting substrate (3) including a concave portion (2) in a surface thereof; an upper substrate (5) bonded in a stacked state to the surface of the supporting substrate (3); and a heating resistor (7) provided at a position, which corresponds to the concave portion (2), of a surface of the upper substrate (5), in which a centerline average roughness of at least a region of a back surface of the upper substrate (5) is set to be less than 5 nm, the region being opposed to the concave portion (2).Type: GrantFiled: September 15, 2010Date of Patent: October 16, 2012Assignee: Seiko Instruments Inc.Inventors: Toshimitsu Morooka, Keitaro Koroishi, Noriyoshi Shoji, Norimitsu Sanbongi
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Patent number: 8233019Abstract: To provide a thermal head which provides an excellent adhesion between the common electrode and the heat element, and in which the content of Pb is sufficiently reduced. A thermal head 5, comprising a substrate 7, a glaze layer 3 provided on the substrate 7, a common electrode 4 provided on the glaze layer 3, a heat element 1 provided on the common electrode 4 and the glaze layer 3, and lead electrodes 2a and 2b provided on the heat element 1, wherein the common electrode 4 includes an electrically conductive material composed of metal and a glass frit, and the glass frit contains 15 to 35% by mass of ZnO, 14 to 34% by mass of SiO2, 2 to 25% by mass of Al2O3, 2 to 15% by mass of TiO2, 5 to 25% by mass of CaO, and 7 to 27% by mass of BaO.Type: GrantFiled: December 29, 2009Date of Patent: July 31, 2012Assignee: TDK CorporationInventors: Emi Ninomiya, Hiroshi Yamada, Katsuhiko Igarashi
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Patent number: 8212849Abstract: There are provided a method of manufacturing a thermal head having a hollow portion at a position opposing a heating resistor, the manufacturing method assuring a sufficient strength to an upper plate substrate of the thermal head. The manufacturing method includes: processing a top surface of the upper plate substrate bonded to a support substrate to thin the upper plate substrate to a thickness T; wherein the processing comprises processing the top surface of the upper plate substrate so that a roughness Ra of the top surface of the upper plate substrate satisfies the following expression: Ra?loge(T2)/(3Γ106)+6.5Γ10?6.Type: GrantFiled: June 10, 2010Date of Patent: July 3, 2012Assignee: Seiko Instruments Inc.Inventors: Keitaro Koroishi, Toshimitsu Morooka, Noriyoshi Shoji, Norimitsu Sanbongi
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Publication number: 20120154504Abstract: A thermal printer head that is highly efficient to manufacture is provided, which includes: a first substrate (11), including a first main surface (110), a first inclined surface (111) that is inclined relative to the first main surface (110), and a second inclined surface (112) that is inclined relative to the first main surface (110); an electrode layer (3), laminated on the first main surface (110), the first inclined surface (111), and the second inclined surface (112); a resistor layer (4), having a plurality of heat dissipation portions (41) respectively laminated on the first inclined surface (111) and crossing separated parts in the electrode layer (3); a driving integrated circuit (IC), for controlling the current passing through each heat dissipation portion (41); and a plurality of wires (81), respectively joined to the driving IC and joined to the second inclined surface (112) through the electrode layer (3).Type: ApplicationFiled: December 15, 2011Publication date: June 21, 2012Applicant: ROHM CO., LTD.Inventors: Shigeyoshi ONO, Yasuhiro YOSHIKAWA
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Publication number: 20120147118Abstract: A thermal print head includes a substrate, an electrode layer supported on the substrate and provided with a plurality of mutually spaced-apart portions, a resistor layer provided with a plurality of heating portions arranged along a primary scanning direction, the heating portions lying across the spaced-apart portions, and a protective layer configured to cover the resistor layer, the protective layer including a first layer made of glass matrix and a plurality of alumina grains mixed into the glass matrix.Type: ApplicationFiled: December 8, 2011Publication date: June 14, 2012Applicant: ROHM CO., LTD.Inventor: Syojiro DAICHO
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Patent number: 8031215Abstract: A thermal head which forms an image on a recording medium by pressing a protruding portion on which heating elements are arranged on the recording medium while driving the heating elements to be heated includes a support substrate in which a concave gap portion facing the protruding portion is formed and a glaze layer provided on the support substrate and in which the protruding portion is formed, in which the glaze layer has a base layer stacked on the support substrate as well as forming a ceiling surface of the gap portion and a heat resistant layer stacked on the base layer and on which the heating elements are arranged.Type: GrantFiled: January 29, 2009Date of Patent: October 4, 2011Assignee: Sony CorporationInventors: Noboru Koyama, Mitsuo Yanase, Toru Morikawa, Kazunori Onuma
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Patent number: 7990405Abstract: A thermal head is provided with increased contact pressure between a heat generating portion and a printing medium to increase printing quality with a low heat loss. The thermal head includes: a plurality of heat generating resistors formed via an insulating layer; a driver circuit unit for driving the plurality of heat generating resistors to generate a heat; a wiring for connecting the driver circuit unit to the plurality of heat generating resistors; a protecting film formed to cover the plurality of heat generating resistors, the driver circuit unit and the wiring. The plurality of heat generating resistors, the driver circuit unit, the wiring and the protecting film are formed on a substrate. A thermal insulating layer having a thermal conductivity smaller than 0.5 W/mΒ·K and having a maximum thickness of larger than 10 ?m is provided between the heat generating resistor and the substrate.Type: GrantFiled: August 24, 2009Date of Patent: August 2, 2011Assignee: Canon Kabushiki KaishaInventor: Yoshihiko Fukumoto
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Patent number: 7965307Abstract: A thermal head is disclosed. The thermal head includes a heat generating element row in which plural heat generating elements are arrayed in a main scanning direction and a glaze that stores heat generated from the respective heat generating elements. The thermal head records an image on a recording medium by causing the respective heat generating elements to generate heat while conveying the recording medium in a sub-scanning direction. A plurality of the heat generating element rows are arrayed in the sub-scanning direction. The glaze includes plural convex portions arranged in the sub-scanning direction in association with the number of arrays of the heat generating element rows. The heat generating elements are arranged on upper sides of the convex portions, respectively.Type: GrantFiled: November 19, 2007Date of Patent: June 21, 2011Assignee: Sony CorporationInventors: Takaaki Murakami, Yasushi Hirumi
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Patent number: 7956880Abstract: A heating resistor element component has supporting substrate with a concave portion formed in a surface of the supporting substrate. A glass substrate is disposed on the surface of the supporting substrate. At least a region of the glass substrate opposite to the concave portion of the support substrate has a heterogeneous phase structure with physical properties different from those of the material of the glass substrate such that an overall mechanical strength of the glass substrate is increased. The heterogeneous phase structure is formed by laser processing using a phemtosecond laser having a power intensity of 1Γ106 W to 1Γ108 W. Heating resistors are arranged at intervals on the glass substrate and have heating portions disposed opposite to the concave portion of the supporting substrate. A common wire is connected to one end of each of the heating resistors. Individual wires are each connected to another end of each of the heating resistors.Type: GrantFiled: March 16, 2009Date of Patent: June 7, 2011Assignee: Seiko Instruments Inc.Inventors: Noriyoshi Shoji, Norimitsu Sanbongi, Yoshinori Sato, Toshimitsu Morooka, Keitaro Koroishi
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Patent number: 7768541Abstract: Provided is a heating resistor element including: an insulating substrate including a glass material; a heat accumulating layer bonded to the insulating substrate through heating to temperature ranging from an annealing point to a softening point in a state of being adhered to a surface of the insulating substrate, and including the same material as the glass material of the insulating substrate; and a heating resistor provided on the heat accumulating layer, in which, on at least one of bonded surfaces between the insulating substrate and the heat accumulating layer, at least one of the insulating substrate and the heat accumulating layer is provided with a concave portion in a region opposed to the heating resistor to form a hollow portion. Accordingly, deformation caused by a difference in coefficient of thermal expansion is suppressed to improve printing quality.Type: GrantFiled: October 20, 2008Date of Patent: August 3, 2010Assignee: Seiko Instruments Inc.Inventors: Keitaro Koroishi, Toshimitsu Morooka, Noriyoshi Shoji, Yoshinori Sato, Norimitsu Sanbongi
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Publication number: 20100177154Abstract: To provide a thermal head which provides an excellent adhesion between the common electrode and the heat element, and in which the content of Pb is sufficiently reduced. A thermal head 5, comprising a substrate 7, a glaze layer 3 provided on the substrate 7, a common electrode 4 provided on the glaze layer 3, a heat element 1 provided on the common electrode 4 and the glaze layer 3, and lead electrodes 2a and 2b provided on the heat element 1, wherein the common electrode 4 includes an electrically conductive material composed of metal and a glass frit, and the glass frit contains 15 to 35% by mass of ZnO, 14 to 34% by mass of SiO2, 2 to 25% by mass of Al2O3, 2 to 15% by mass of TiO2, 5 to 25% by mass of CaO, and 7 to 27% by mass of BaO.Type: ApplicationFiled: December 29, 2009Publication date: July 15, 2010Applicant: TDK CorporationInventors: Emi Ninomiya, Hiroshi Yamada, Katsuhiko Igarashi
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Publication number: 20090207229Abstract: A thermal printhead A includes a glaze layer 2 formed on an insulating substrate 1, a resistor layer 3 formed on the glaze layer, a conductor layer 4 formed so that part of the resistor layer is exposed to serve as a heating portion 3c and a protective film 5 formed to cover the conductor layer 4 and the heating portion 3c. The protective film 5 includes a lower first protective layer 5a, and an upper second protective layer 5b overlapping the first protective layer 5a and serving as the outermost layer. The first protective layer 5a has a hardness of 500 to 800 Hk and a thickness of 1 to 2 ?m. The second protective layer 5b has a hardness of 1000 to 2000 Hk and a thickness of 5 to 8 ?m.Type: ApplicationFiled: June 6, 2006Publication date: August 20, 2009Applicant: ROHM CO., LTD.Inventor: Takumi Yamade
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Patent number: 7538785Abstract: A thermal printhead (A1) includes electrodes (3a-3c) embedded in a glaze layer 2 at least at a portion laminated with a resistor (4). Favorably, the portion of the electrodes (3a-3c) laminated with the resistor (4) is sunk to a depth causing the surfaces of the electrodes to be flush with the surface of the glaze layer 2. Such structure enhances the heat transfer efficiency from a heating portion (40) of the resistor (4) to a thermal recording medium, and smooth transfer of thermal recording paper.Type: GrantFiled: May 23, 2005Date of Patent: May 26, 2009Assignee: Rohm Co., Ltd.Inventors: Masaya Yamamoto, Shinobu Obata
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Publication number: 20090115830Abstract: A thermal printhead (A) includes an insulating substrate (1), a glaze layer (2), a resistor layer (3), an electrode layer (4) and a protective layer (5). The electrode layer (4) has a two-layer structure made up of a lower first electrode layer (4a) and an upper second electrode layer (4b). The resistor layer (3) includes a heating portion (7). The heating portion (7) is exposed from both the first electrode layer (4a) and the second electrode layer (4b) and is positioned on a bulging portion (2c) of the glaze layer (2).Type: ApplicationFiled: June 13, 2006Publication date: May 7, 2009Applicant: ROHM CO., LTD.Inventor: Takumi Yamade
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Patent number: 7460143Abstract: A thermal printhead (A1) comprises an insulating substrate (1), a common electrode (31) which is formed on the insulating substrate (1) and includes a plurality of comb teeth (31a), a plurality of individual electrodes (41) formed on the insulating substrate (1), and a resistor layer (51) formed on the insulating substrate (1) and electrically connected to the comb teeth (31a) and the individual electrodes (41). The resistor layer (51) comprises a thin film, whereas the common electrode (31) and the individual electrodes (41) comprise a thick film.Type: GrantFiled: September 16, 2004Date of Patent: December 2, 2008Assignee: Rohm Co., Ltd.Inventors: Tadashi Yamamoto, Shinobu Obata, Kanjou Ishibashi
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Patent number: 7427998Abstract: A thermal head having electrode wiring lines in a narrow wiring region, in which a line and a space are narrow, with good pattern accuracy and a method of manufacturing the same are provided. A thermal head includes: a plurality of heating resistors arranged in a line at predetermined pitches there between on a protruding level difference part of a glazed substrate; bent wiring lines each of which serves to electrically connect a pair of adjacent heating resistors to each other; a common wiring line and individual wiring lines used to cause the pair of adjacent heating resistors to be electrically conducted through each of the bent wiring lines; and bonding pads formed on one ends of the individual wiring lines. The common wiring line has a narrow wiring region located between the bonding pads arranged in a line and a wide wiring region wider than the narrow wiring region.Type: GrantFiled: September 5, 2007Date of Patent: September 23, 2008Assignee: Alps Electric Co., Ltd.Inventor: Shinya Yokoyama
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Publication number: 20080117276Abstract: A thermal head is disclosed. The thermal head includes a heat generating element row in which plural heat generating elements are arrayed in a main scanning direction and a glaze that stores heat generated from the respective heat generating elements. The thermal head records an image on a recording medium by causing the respective heat generating elements to generate heat while conveying the recording medium in a sub-scanning direction. A plurality of the heat generating element rows are arrayed in the sub-scanning direction. The glaze includes plural convex portions arranged in the sub-scanning direction in association with the number of arrays of the heat generating element rows. The heat generating elements are arranged on upper sides of the convex portions, respectively.Type: ApplicationFiled: November 19, 2007Publication date: May 22, 2008Applicant: SONY CORPORATIONInventors: Takaaki Murakami, Yasushi Hirumi
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Publication number: 20080062239Abstract: A thermal head having electrode wiring lines in a narrow wiring region, in which a line and a space are narrow, with good pattern accuracy and a method of manufacturing the same are provided. A thermal head includes: a plurality of heating resistors arranged in a line at predetermined pitches there between on a protruding level difference part of a glazed substrate; bent wiring lines each of which serves to electrically connect a pair of adjacent heating resistors to each other; a common wiring line and individual wiring lines used to cause the pair of adjacent heating resistors to be electrically conducted through each of the bent wiring lines; and bonding pads formed on one ends of the individual wiring lines. The common wiring line has a narrow wiring region located between the bonding pads arranged in a line and a wide wiring region wider than the narrow wiring region.Type: ApplicationFiled: September 5, 2007Publication date: March 13, 2008Inventor: Shinya Yokoyama
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Patent number: 7104713Abstract: A printer has a sheet housing unit for storing a heat-sensitive adhesive sheet having a heat-sensitive adhesive layer on one side and a printable surface on the other side. A set of pull-out rollers pulls the heat-sensitive adhesive sheet out of the sheet housing unit and transports the sheet in a given direction, and a cutter device cuts the heat-sensitive adhesive sheet that has been transported by the pull-out rollers. A printing device has a thermal print head for printing letters or images on the printable surface of the heat-sensitive adhesive sheet, and a print platen roller for transporting the heat-sensitive adhesive sheet in the given direction. A thermal activation device has a thermal-activation thermal head for heating the heat-sensitive adhesive layer, and a thermal activation platen roller for transporting the heat-sensitive adhesive sheet in the given direction. A first drive unit drives the pull-out rollers and a second drive unit drives the print platen roller.Type: GrantFiled: October 14, 2004Date of Patent: September 12, 2006Assignee: Seiko Instruments Inc.Inventors: Minoru Hoshino, Norimitsu Sanbongi, Tatsuya Obuchi, Yoshinori Sato
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Patent number: 7046265Abstract: A thermal head of the present invention is provided with a thermal insulation layer formed on a radiative substrate, a plurality of heating resistors formed on a top face of the thermal insulation layer, a plurality of power suppliers connected to the heating resistors to form a heater on a part of the heating resistors, and a protection layer that covers surfaces of at least the heating resistors and the power suppliers, wherein the thermal insulation layer is formed by laminating an inorganic high thermal insulation layer including a complex oxide ceramic containing Si, transition metal, and oxygen or including complex nitride ceramic containing Si, transition metal, and nitrogen on an organic thermal insulation layer that contains polyimide resin.Type: GrantFiled: January 28, 2002Date of Patent: May 16, 2006Assignee: Alps Electric Co., Ltd.Inventors: Takashi Shirakawa, Satoru Sasaki, Hirotoshi Terao
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Patent number: 7011727Abstract: A thermal transfer film comprises a coloring layer formed on a substrate film via an intermediate layer, wherein the intermediate layer contains a thermally fusible substance and a non-transferable binder resin, the melt viscosity of the thermally fusible substance in the temperature range 15 to 25Β° C. higher than the fuse peak temperature of the thermally fusible substance is in the range of 100 to 1000 mPaΒ·s, the fuse peak temperature of the thermally fusible substance is in the range of 50 to 110Β° C., the crystallization peak temperature of the thermally fusible substance is in the range of ?20 to 100 Β° C., the crystallization peak temperature of the thermally fusible substance is lower than the fuse peak temperature by 10Β° C. or more, and the softening temperature of the binder resin measured by the ring and ball method is in the range of 130 to 400Β° C. This thermal transfer film is capable of forming a printed product with a good printing quality.Type: GrantFiled: June 19, 2003Date of Patent: March 14, 2006Assignee: DAI Nippon Printing Co., Ltd.Inventors: Masanori Torii, Mitsuru Maeda, Fumihiko Mizukami, Shigeki Chujo
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Patent number: 6822665Abstract: A thermal head includes a metal substrate; an insulating layer formed on the surface of the metal substrate; a plurality of heating elements disposed on the surface of the insulating layer, the heating elements being arranged with a predetermined pitch along a plurality of lines in a main scanning direction, the plurality of lines being spaced from each other in a paper feeding direction perpendicular to the main scanning direction; and a heat radiating element projecting from the surface of the metal substrate to the side where the insulating layer is disposed. In this structure, although most of heat generated by the respective heating elements is transferred to an ink ribbon or print paper, residual partial heat is absorbed by heat radiating means via the insulating layer and radiated into the atmosphere. This suppresses thermal interference among the heating elements. A thermal head controller is provided for controlling the thermal head for use in a printer.Type: GrantFiled: March 8, 2001Date of Patent: November 23, 2004Assignee: Shinko Electric Co., Ltd.Inventors: Hayami Sugiyama, Takashi Kubota, Hiroshi Matsuda, Kazunori Masukawa
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Patent number: 6719407Abstract: In a thermal head capable of performing printing of high quality while preventing foreign matters such as dirt or the like from accumulating in a portion, on which a heat reserving layer is formed, at the time of printing, the heat reserving layer comprising a projection formed by partially projecting a surface of the layer and having a top, the projection being provided on a surface thereof with heating elements, the projection being shaped in cross section in a direction perpendicular to a direction of arrangement of the heating elements to form an inclined surface on one surface side, which is formed to be lower than the other surface side. The projection is formed so that a height thereof from the one surface side is 5 to 50 &mgr;m.Type: GrantFiled: November 25, 2002Date of Patent: April 13, 2004Assignee: Alps Electric Co., Ltd.Inventor: Hiroshi Kobayashi
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Patent number: 6614460Abstract: A thermal head including a protection layer having mutually opposed first and second surfaces, said first surface having a flat or protruded printing surface which is brought into contact with a heat sensitive record medium, a heat generating section including resistors and electrodes connected to the electrodes and provided on said second surface of the protection layer, and a reinforcing member made of a low melting pint glass and provided on a side of the heat generating section remote from the protection layer. The reinforcing member improves a mechanical strength of the thermal head. The reinforcing member made of a glass also serves as a heat storage member, and thus a thermal property of the thermal head is improved. The reinforcing member may be formed by an aggregate of ceramic particles. The reinforcing member may contain a heat storage layer made of a low melting point glass and a heat conduction layer provided on the heat storage layer.Type: GrantFiled: November 26, 2001Date of Patent: September 2, 2003Assignee: TDK CorporationInventors: Masato Susukida, Katsuto Nagano, Yoshio Saita, Jun Hirabayashi, Jun Hagiwara
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Patent number: 6529224Abstract: In a thermal head according to the present invention, a sacrificial layer of transition metal is formed on a top surface of a heat radiation substrate; a bridge layer of cermet or ceramic material is formed on a top surface of a heat insulation layer including the sacrificial layer; a cavity is made between the bridge layer and the heat insulation layer; a plurality of slits are made in the bridge layer overlying the cavity to expose the cavity; a highly adiabatic inorganic heat insulation layer is formed on a top surface of the bridge layer including the slits; and an inorganic protective layer of a material selected from among silicon or aluminum oxide, nitride and carbide is formed on a top surface of the inorganic heat insulation layer, where heating elements are formed between the slits over the inorganic heat insulation layer and the inorganic protective layerType: GrantFiled: April 3, 2002Date of Patent: March 4, 2003Assignee: Alps Electric Co., Ltd.Inventors: Takashi Shirakawa, Toshifumi Nakatani
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Publication number: 20020158959Abstract: A thermal head of the present invention is provided with a thermal insulation layer formed on a radiative substrate, a plurality of heating resistors formed on a top face of the thermal insulation layer, a plurality of power suppliers connected to the heating resistors to form a heater on a part of the heating resistors, and a protection layer that covers surfaces of at least the heating resistors and the power suppliers, wherein the thermal insulation layer is formed by laminating an inorganic high thermal insulation layer including a complex oxide ceramic containing Si, transition metal, and oxygen or including complex nitride ceramic containing Si, transition metal, and nitrogen on an organic thermal insulation layer that contains polyimide resin.Type: ApplicationFiled: January 28, 2002Publication date: October 31, 2002Inventors: Takashi Shirakawa, Satoru Sasaki, Hirotoshi Terao
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Patent number: 6424367Abstract: A thick-film thermal printhead comprises: an oblong rectangular substrate (1) having at least one longitudinal edge (1a); a partial glaze layer provided on the substrate along the longitudinal edge; a linear heating resistor (11) formed on the partial glaze layer; a common electrode (12) formed on the substrate and electrically connected to the heating resistor; and a plurality of individual electrode (13) formed on the substrate and electrically connected to the heating resistor. The common electrode includes a plurality of comb-like teeth (12A). Each of the comb-like teeth includes a tip portion (12c) having a smaller width and a base portion (12d) having a larger width. Each of the individual electrodes includes a tip portion (13d) having a smaller width and an intermediate portion (13e) having a larger width.Type: GrantFiled: November 6, 2000Date of Patent: July 23, 2002Assignee: Rohm Co., Ltd.Inventors: Shinobu Obata, Eiji Yokoyama
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Publication number: 20020093560Abstract: A cyan thermal coloring layer, a magenta thermal coloring layer, and a yellow thermal coloring layer are successively formed on a base of a thermo-sensitive recording paper. A yellow thermal head, a magenta thermal head, and a cyan thermal head are disposed along a conveyance path. While the thermo-sensitive recording paper is being conveyed in the sub scanning direction along the conveyance path, three colors images are sequentially recorded by the three thermal heads. When the length of heat elements of the respective thermal heads are Ly, Lm and Lc in a sub scanning direction, it follows that Ly<Lm<Lc. When heated by the yellow thermal head, the isothermal curve shows minimum width in the surface of the thermo-sensitive recording paper. Meanwhile the isothermal curve of the cyan thermal head shows maximum width. By changing the isothermal curves of the three colors, the dots of the three colors are made equal in size.Type: ApplicationFiled: January 14, 2002Publication date: July 18, 2002Applicant: FUJI PHOTO FILM CO., LTD.Inventor: Tomoyoshi Nishimura
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Publication number: 20020030728Abstract: A thermal head including a protection layer having mutually opposed first and second surfaces, said first surface having a flat or protruded printing surface which is brought into contact with a heat sensitive record medium, a heat generating section including resistors and electrodes connected to the electrodes and provided on said second surface of the protection layer, and a reinforcing member made of a low melting pint glass and provided on a side of the heat generating section remote from the protection layer. The reinforcing member improves a mechanical strength of the thermal head. The reinforcing member made of a glass also serves as a heat storage member, and thus a thermal property of the thermal head is improved. The reinforcing member may be formed by an aggregate of ceramic particles. The reinforcing member may contain a heat storage layer made of a low melting point glass and a heat conduction layer provided on the heat storage layer.Type: ApplicationFiled: November 26, 2001Publication date: March 14, 2002Applicant: TDK CorporationInventors: Masato Susukida, Katsuto Nagano, Yoshio Saita, Jun Hirabayashi, Jun Hagiwara
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Patent number: 6344868Abstract: A thermal head including a protection layer having mutually opposed first and second surfaces, said first surface having a flat or protruded printing surface which is brought into contact with a heat sensitive record medium, a heat generating section including resistors and electrodes connected to the electrodes and provided on said second surface of the protection layer, and a reinforcing member made of a low melting pint glass and provided on a side of the heat generating section remote from the protection layer. The reinforcing member improves a mechanical strength of the thermal head. The reinforcing member made of a glass also serves as a heat storage member, and thus a thermal property of the thermal head is improved. The reinforcing member may be formed by an aggregate of ceramic particles. The reinforcing member may contain a heat storage layer made of a low melting point glass and a heat conduction layer provided on the heat storage layer.Type: GrantFiled: July 22, 1998Date of Patent: February 5, 2002Assignee: TDK CorporationInventors: Masato Susukida, Katsuto Nagano, Yoshio Saita, Jun Hirabayashi, Jun Hagiwara, Atsushi Yoshida
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Patent number: 6304280Abstract: A thermal printhead 1 according to the present invention includes a multiplicity of heating elements 4a formed in a row on an obverse surface of an elongated substrate 2 at a portion which is offset widthwise toward one longitudinal side of the substrate, and a protective film 8 formed on the obverse surface of the substrate 2 at the widthwise offset portion for covering the heating elements 4a. The protective film 8 is formed to extend on the obverse surface of the substrate 2 continuously from the widthwise offset portion onto one longitudinal side surface 2a of the substrate. A longitudinal edge 8b of the protective film 8 directed toward the other longitudinal side of the substrate 2 is tapered.Type: GrantFiled: May 1, 2000Date of Patent: October 16, 2001Assignee: Rohm Co., Ltd.Inventors: Takumi Yamade, Hiroaki Hayashi, Eiji Yokoyama
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Patent number: 6181360Abstract: The present invention provides a thermal head in which the surface of a heat insulating layer formed by vapor deposition such as sputtering or the like is polished to decrease the rate of defects such as failure in the resistance values of heating elements formed on the heat insulating layer, disconnection and short-circuit of electrodes, apparent foreign materials, etc., and improve the adhesion of the surface of the heat insulating layer. The thermal head includes a heat insulating layer formed on a radiating substrate by sputtering, and heating elements deposited on the surface of the thermal head, wherein the heat insulating layer has columnar crystals composed of silicon, transition metals and oxygen, the surface of the heat insulating layer is polished, and micro irregularity is formed on the polished surface of the heat insulating layer.Type: GrantFiled: September 30, 1998Date of Patent: January 30, 2001Assignee: Alps Electric Co., Ltd.Inventors: Takashi Shirakawa, Toshifumi Nakatani
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Patent number: 6151054Abstract: A thermal head, used for an image forming device, comprises a glaze formed at at least a portion of a base plate of the thermal head so that at least a portion of the glaze is protruded, and a plurality of heater portions provided at the glaze, a length of each of the heater portions in a image forming direction of a recording material being less than or equal to 100 .mu.m, wherein an outer surface of each of the heater portions is a convex curved surface and is the outermost portion of the glaze.Type: GrantFiled: March 30, 1998Date of Patent: November 21, 2000Assignee: Fuji Photo Film Co., Ltd.Inventor: Osamu Shimizu
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Thermal print head, method of manufacturing the same and method of adjusting heat generation thereof
Patent number: 6067104Abstract: A polycrystalline layer is formed on a surface of a substrate and metal electrode layers are formed thereon to be opposed to each other. The polycrystalline silicon layer includes an exposed region exposed from the metal electrode layers, and this exposed region includes low resistance regions extending under the metal electrode layers to be in a pair, and a high resistance region having a high sheet resistance defined between the low resistance regions. At least one of the low resistance regions is so trimmed as to adjust heat generation from the high resistance region.Type: GrantFiled: August 19, 1996Date of Patent: May 23, 2000Assignee: Rohm Co., Ltd.Inventors: Hideo Taniguchi, Yasuhisa Fujii