Specific Resistance Recording Element Type Patents (Class 347/200)
  • Patent number: 11400731
    Abstract: A thermal printhead includes a substrate having an obverse surface, a projection formed on the obverse surface and extending in a primary scanning direction, a plurality of heating elements arranged in the primary scanning direction on the top of the projection, a groove dented from the top of the projection and extending in the primary scanning direction, and a heat storage member filling at least an opening of the groove.
    Type: Grant
    Filed: June 5, 2020
    Date of Patent: August 2, 2022
    Assignee: ROHM CO., LTD.
    Inventors: Goro Nakatani, Masatoshi Nakanishi, Yasuhiro Fuwa
  • Patent number: 10787000
    Abstract: An asymmetric thermal print head includes a print head body and a plurality of print elements supported on the print head body. The print elements are aligned along a first axis. Each print element includes a heater portion having a burn width measured along the first axis corresponding to a first print resolution, and a burn length measured along a second axis, which is perpendicular to the first axis, corresponding to a second print resolution. The second print resolution is higher than the first print resolution. One or more control circuits are configured to individually activate the print elements.
    Type: Grant
    Filed: December 28, 2017
    Date of Patent: September 29, 2020
    Assignee: ASSA ABLOY AB
    Inventor: Brent Lien
  • Patent number: 10507679
    Abstract: Techniques for more accurately and efficiently replicating the alignment of one or more printer components with respect to another printer component are described herein. Replication may be achieved by using a fixture and a connection media to create a near exact replica of features of the fixture, or to temporarily hold multiple printer components in position while a joining layer of the connection media hardens. More specifically, a connection media, such as epoxy, can be used to fill an intentionally-established gap between connecting bodies or components that are held in a predetermined position by the replication fixture. The replication fixture represents a mechanical mounting interface that influences the position of a print head (or an array of print heads) within a printer housing or printing mechanism. Joining printer components in such a manner enables a stable mechanical coupling to be formed that does not require post operations.
    Type: Grant
    Filed: May 17, 2017
    Date of Patent: December 17, 2019
    Assignee: ELECTRONICS FOR IMAGING, INC.
    Inventor: John A. Weismantel
  • Patent number: 10399358
    Abstract: The method and apparatus for protecting the printhead in a thermal printer includes preparing the printer for label dispensing and then covering the printhead such that the label run or thermal material passing over the same does not contact the printhead. The cover for the printhead can take various forms. In one implementation, the cover is a sleeve configured to fit over the entire printhead assembly of the thermal printer. The printhead cover has a low coefficient of friction.
    Type: Grant
    Filed: December 12, 2017
    Date of Patent: September 3, 2019
    Assignee: HURST INTERNATIONAL
    Inventor: Ari Lichtenberg
  • Patent number: 9944080
    Abstract: In one example, a fluid flow structure includes a micro device embedded in a molding having a channel therein through which fluid may flow directly into the device and/or onto the device.
    Type: Grant
    Filed: February 28, 2013
    Date of Patent: April 17, 2018
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Chien-Hua Chen, Michael W. Cumbie
  • Patent number: 9796189
    Abstract: A thermal print head includes a semiconductor substrate, a resistor layer with heat generating portions arranged in the main scanning direction, a wiring layer included in a conduction path for energizing the heat generating portions, and a protective layer covering the resistor layer and the wiring layer. The semiconductor substrate includes a projection protruding from the obverse surface of the substrate and elongated in the main scanning direction. The projection has first and second inclined side surfaces spaced apart from each other in the sub-scanning direction. The heat generating portions are arranged to overlap with the first inclined side surface of the projection as viewed in plan view.
    Type: Grant
    Filed: December 23, 2016
    Date of Patent: October 24, 2017
    Assignee: ROHM CO., LTD.
    Inventors: Isamu Nishimura, Yasuhiro Fuwa
  • Patent number: 9706902
    Abstract: An objective lens for an endoscope, an actuator for focusing the objective lens, and an endoscope system including the objective lens are provided. The objective lens for an endoscope includes a plurality of lenses and a stop, and an optical element disposed adjacent to the stop, wherein a focal length may be varied by moving the optical element in a direction different from an optical axis.
    Type: Grant
    Filed: June 21, 2012
    Date of Patent: July 18, 2017
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sergey Menabde, Jong-chul Choi, Hae-in Chung
  • Patent number: 9449180
    Abstract: The present invention provides a method and system for securing sensitive data from unauthorized access or use. The method and system of the present invention is useful in a wide variety of settings, including commercial settings generally available to the public which may be extremely large or small with respect to the number of users. The method and system of the present invention is also useful in a more private setting, such as with a corporation or governmental agency, as well as between corporation, governmental agencies or any other entity.
    Type: Grant
    Filed: April 18, 2008
    Date of Patent: September 20, 2016
    Assignee: Security First Corp.
    Inventors: Mark S. O'Hare, Rick L. Orsini, John Van Zandt, Roger S. Davenport
  • Patent number: 9352585
    Abstract: The object is to provide a thermal print head capable of improving printing quality on a medium. The Solution is to provide a base member 11 including a recess 113a, a heat storage region 2 formed in the recess 113a, a resistor layer 4 formed on the base member 11, and an electrode layer 3 formed on the base member 11 and electrically connected to the resistor layer 4. The resistor layer 4 includes a heating portion 41 spanned between two portions of the electrode layer 3 spaced from each other as viewed in a thickness direction Z of the base member 11. The heating portion 41 is located so as to overlap the recess 113a as viewed in the thickness direction Z. The base member 11 is made of a material having a thermal conductivity of 100 to 300 W/(m·K).
    Type: Grant
    Filed: December 28, 2015
    Date of Patent: May 31, 2016
    Assignee: ROHM CO., LTD.
    Inventors: Hideaki Hoki, Tomohiko Horikawa, Shinobu Obata, Tomoharu Horio, Minoru Sakamoto
  • Patent number: 9302495
    Abstract: A thermal head has a support substrate, an upper substrate arranged on the support substrate on one surface side thereof in a laminated state, and an intermediate layer arranged between the upper substrate and the support substrate to bond the upper substrate and the support substrate to each other. The intermediate layer has one of a through hole and a concave portion forming a cavity portion between the upper substrate and the support substrate. A heat generating resistor is formed on a surface of the upper substrate on a side opposite to the support substrate at a position opposed to the cavity portion. The intermediate layer is formed of a glass paste having a melting point lower than a firing temperature of the support substrate and higher than a melting temperature of the upper substrate.
    Type: Grant
    Filed: May 21, 2013
    Date of Patent: April 5, 2016
    Assignee: SEIKO INSTRUMENTS INC.
    Inventors: Norimitsu Sanbongi, Keitaro Koroishi, Toshimitsu Morooka
  • Patent number: 9248663
    Abstract: The object is to provide a thermal print head capable of improving printing quality on a medium. The Solution is to provide a base member 11 including a recess 113a, a heat storage region 2 formed in the recess 113a, a resistor layer 4 formed on the base member 11, and an electrode layer 3 formed on the base member 11 and electrically connected to the resistor layer 4. The resistor layer 4 includes a heating portion 41 spanned between two portions of the electrode layer 3 spaced from each other as viewed in a thickness direction Z of the base member 11. The heating portion 41 is located so as to overlap the recess 113a as viewed in the thickness direction Z. The base member 11 is made of a material having a thermal conductivity of 100 to 300 W/(m·K).
    Type: Grant
    Filed: August 27, 2013
    Date of Patent: February 2, 2016
    Assignee: ROHM CO., LTD.
    Inventors: Hideaki Hoki, Tomohiko Horikawa, Shinobu Obata, Tomoharu Horio, Minoru Sakamoto
  • Patent number: 9248673
    Abstract: Improved product labels cannot be easily counterfeited. A plurality of small dots printed on the label are interpreted as dirt or flaw or misprint so that the counterfeit label will not reproduce the plurality of small dots. A first image printed on the label and having a first level of spectural reflectivity, and a second image printed atop the first image using ink having a spectural reflectivity different from the spectural reflectivity of the first image. A plurality of very small dots creates a grayscale field, and a symbol printed within the grayscale field of very small dots, thereby creating a watermark of such high complexity that it cannot be counterfeited. A symbol printed on the label, and a raised dot of ink printed atop the symbol at a precise location to be sensed by finger contact and thereby indicate the authenticity of the label.
    Type: Grant
    Filed: November 28, 2012
    Date of Patent: February 2, 2016
    Assignee: GM GLOBAL TECHNOLOGY OPERATIONS LLC
    Inventors: William A Biondo, Frankie K Thomas, Kevin W Snider
  • Patent number: 9061520
    Abstract: A thermal head includes a substrate, a glass-made thermal storage layer disposed on one main surface of the substrate so as to extend to an edge of the substrate; electrodes disposed on or above the thermal storage layer apart from the edge of the substrate; heat-generating resistors disposed above the thermal storage layer apart from the edge of the substrate, the heat-generating resistors being connected to the electrodes; and a first covering layer disposed on or above the electrodes and the heat-generating resistors. The first covering layer extends from atop the electrodes and the heat-generating resistors toward atop the thermal storage layer on the edge of the substrate, and a protection film is disposed on or above the first covering layer disposed on or above the electrodes and the heat-generating resistors and an edge of the protection film is not disposed above the edge of the substrate.
    Type: Grant
    Filed: January 25, 2012
    Date of Patent: June 23, 2015
    Assignee: Kyocera Corporation
    Inventors: Yuuki Matsusaki, Kouji Ochi, Tadashi Mitsuoka
  • Patent number: 8907996
    Abstract: A thermal head in a thermal transfer printer in which a tension is given to an ink ribbon that has warped as being heated by the thermal head to reduce friction force generated between the thermal head and the ink ribbon. A ribbon transport direction changing member 30 pushes the ink ribbon 13 away from a heat generator 21, as a transport direction of the ink ribbon 13 is slightly moved toward a platen roller 10, so a constant tension is given to a film layer 24 of the ink ribbon immediately after being heated.
    Type: Grant
    Filed: July 19, 2011
    Date of Patent: December 9, 2014
    Assignee: Sato Holdings Kabushiki Kaisha
    Inventor: Toshiaki Kyoi
  • Patent number: 8749602
    Abstract: A method of manufacturing a thermal head, comprising the steps of: bonding a support substrate and an upper substrate, which have a flat shape, together in a laminated state, the support substrate and the upper substrate having opposed surfaces, at least one of which includes a concave portion; thinning the upper substrate bonded onto the support substrate; a measurement step of measuring a thickness of the thinned upper substrate; determining a target resistance value of a heating resistor from the following expression based on the measured thickness of the upper substrate; and forming the heating resistor having the target resistance value at a position opposed to the concave portion, Rh=R0×(1+(D1+D0)/(D0+K)) where Rh represents the target resistance value; R0, a design resistance value; D1, the thickness of the upper substrate; D0, a design thickness of the upper substrate; and K, a heating efficiency coefficient.
    Type: Grant
    Filed: November 19, 2012
    Date of Patent: June 10, 2014
    Assignee: Seiko Instruments Inc.
    Inventors: Keitaro Koroishi, Norimitsu Sanbongi, Noriyoshi Shoji, Toshimitsu Morooka
  • Patent number: 8730286
    Abstract: A method of manufacturing a thermal head, including: forming a concave being, which is open on one surface of a support-substrate made of an alumina material; forming an intermediate-layer made of a glass paste by printing the glass paste made of a first-glass-material on the one surface of the support-substrate and baking the glass paste; bonding an upper-substrate to the one surface of the support-substrate by arranging the upper-substrate on the intermediate-layer formed on the one surface of the support-substrate in a laminated state and heating the upper-substrate at a temperature of an annealing point thereof or higher and a softening point thereof or lower, the upper-substrate being made of a second-glass-material having a softening point lower than a softening point of the first-glass-material; and forming a heat generating resistor on a surface of the upper-substrate bonded to the support-substrate at a position opposed to the concave portion.
    Type: Grant
    Filed: June 17, 2013
    Date of Patent: May 20, 2014
    Assignee: Seiko Instruments Inc.
    Inventors: Keitaro Koroishi, Norimitsu Sanbongi, Toshimitsu Morooka
  • Publication number: 20140022325
    Abstract: A thermal head and a printer head are disclosed. The thermal head includes heat generating members, a drive IC disposed, pads and interconnection lines which are all disposed on a substrate. The heat generating members are arranged in a first direction. The drive IC is operable to control driving of the heat generating members. The pads are operable to being electrically connected to terminals of the drive IC. The interconnection lines electrically connect each of the heat generating members to one of the pads. The pads are arranged in a first direction and constitute first pad groups and second pad groups constituted by the pads that constitute the first pad groups. The second pad groups are arranged in the first direction so as to be shifted from each other in a second direction that differs from the first direction.
    Type: Application
    Filed: March 23, 2012
    Publication date: January 23, 2014
    Applicant: KYOCERA CORPORATION
    Inventors: Kenji Miyamura, Tadashi Hamayumiba
  • Patent number: 8619106
    Abstract: A thermal head capable of dissipating heat accumulated in a heat accumulating layer efficiently and achieving clear printing, and a thermal printer including the thermal head are provided. A thermal head includes a substrate, a heat accumulating layer disposed on part of the substrate, a heat generating portion disposed on the heat accumulating layer, an electrode electrically connected to the heat generating portion, a protective layer that covers the heat generating portion and part of the electrode, and an insulating layer having thermal conductivity, the insulating layer covering part of a region of the electrode which region is not covered with the protective layer. The insulating layer covers part of the protective layer and extends over the heat accumulating layer.
    Type: Grant
    Filed: February 24, 2012
    Date of Patent: December 31, 2013
    Assignee: Kyocera Corporation
    Inventors: Yoshihiro Inokuma, Takahiro Shimozono, Yasuyuki Tanaka
  • Publication number: 20130335499
    Abstract: A method of manufacturing a thermal head, including: forming a concave being, which is open on one surface of a support-substrate made of an alumina material; forming an intermediate-layer made of a glass paste by printing the glass paste made of a first-glass-material on the one surface of the support-substrate and baking the glass paste; bonding an upper-substrate to the one surface of the support-substrate by arranging the upper-substrate on the intermediate-layer formed on the one surface of the support-substrate in a laminated state and heating the upper-substrate at a temperature of an annealing point thereof or higher and a softening point thereof or lower, the upper-substrate being made of a second-glass-material having a softening point lower than a softening point of the first-glass-material; and forming a heat generating resistor on a surface of the upper-substrate bonded to the support-substrate at a position opposed to the concave portion.
    Type: Application
    Filed: June 17, 2013
    Publication date: December 19, 2013
    Inventors: Keitaro KOROISHI, Norimitsu SANBONGI, Toshimitsu MOROOKA
  • Patent number: 8587624
    Abstract: There are provided a recording head capable of reduction of variations in heat-generating temperature among heat-generating elements constituting a heat-generating-element array, and a recording device including the recording head. A recording head includes a heat radiator; a head base body having a substrate placed on or above the heat radiator and a heat-generating-element array composed of a plurality of heat-generating elements arranged on or above the substrate; a bonding layer that is interposed between the heat radiator and the substrate and bonds the heat radiator with the substrate; and a plurality of spacer particles arranged within the bonding layer so as to abut on both of the heat radiator and the substrate. The bonding layer includes a first region situated immediately below the heat-generating-element array and a second region extending in parallel with the first region. The spacer particles are arranged in the second region.
    Type: Grant
    Filed: August 26, 2010
    Date of Patent: November 19, 2013
    Assignee: Kyocera Corporation
    Inventors: Hidenobu Nakagawa, Yoichi Moto, Makoto Miyamoto
  • Patent number: 8525859
    Abstract: A thermal head enables printing even after printing for a long time to a print medium with low paper quality. A thermal head 20 to which a print medium P is pressed by a platen roller 10 has a heat unit 21 with a plurality of heat elements 21a arrayed on an axis, and an electrode connection unit 26 that is formed on an extension of the axis. A receptive space A to which the end 11a of the platen roller 10 contact surface 11 that is pressed to the thermal head 20 is positioned is formed on this axis between the heat unit 21 and the electrode connection unit 26.
    Type: Grant
    Filed: November 28, 2011
    Date of Patent: September 3, 2013
    Assignee: Seiko Epson Corporation
    Inventors: Koji Yamada, Akira Koyabu
  • Publication number: 20130200606
    Abstract: A method of creating an optical security element in a value document using a low-cost printing device of a data processing terminal is described. The method comprises: providing a flexible substrate having a pre-printed ink portion; wherein the pre-printed ink portion is provided in an unexposed state which does not provide an optical security function of the security element; configuring a variable laser irradiation device to determine a part of the unexposed pre-printed ink portion to be exposed to laser radiation in a machine-controlled manner, and exposing the unexposed pre-printed ink portion to laser radiation in the machine-controlled manner to create from the pre-printed ink portion a predefined pattern, wherein the optical characteristics of the pattern provide the optical security element.
    Type: Application
    Filed: June 24, 2011
    Publication date: August 8, 2013
    Inventor: Ralph Mahmoud Omar
  • Patent number: 8477166
    Abstract: A thermal head comprises a first substrate having a concave portion, a second substrate mounted on the first substrate and covering the concave portion to form with the first substrate a cavity portion, a heating resistor provided on a surface of the second substrate, and a pair of electrodes connected to the heating resistor for supplying power to the heating resistor. At least one of the pair of electrodes has a low thermal conductivity portion in a region opposed to the cavity portion. The low thermal conductivity portion is made of a material having a thermal conductivity lower than a thermal conductivity in other regions of the pair of electrodes and having an electrical resistance lower than an electrical resistance of the heating resistor.
    Type: Grant
    Filed: July 20, 2011
    Date of Patent: July 2, 2013
    Assignee: Seiko Instruments Inc.
    Inventors: Toshimitsu Morooka, Keitaro Koroishi, Noriyoshi Shoji, Norimitsu Sanbongi
  • Patent number: 8456499
    Abstract: Accumulation of foreign matter on the surface of a thermal head that can cause printing defects can be reliably prevented. The downstream edge of a surface of the thermal head is substantially flush with the downstream end of a paper nipping area and a platen roller in the thermal printer. The downstream end extending from the downstream edge perpendicular to the back side is connected to a through-hole formed in a heat sink. Foreign matter on a liner-less label paper clings to the downstream end of the thermal head after passing the paper nipping area, and is then fed along the downstream end into the through-hole on the back. Foreign matter does not accumulate on the surface of the thermal head, and problems such as streaking and other printing defects caused by foreign matter on the surface of the thermal head do not occur.
    Type: Grant
    Filed: April 8, 2010
    Date of Patent: June 4, 2013
    Assignee: Seiko Epson Corporation
    Inventor: Akira Koyabu
  • Patent number: 8451305
    Abstract: In order to secure printing quality, a head unit includes a thermal head having a heating body formed on one surface of a glass substrate made of a transparent glass material, the heating body being configured to generate heat when supplied with external power, and a support body is laminated onto the glass substrate in a stacked state. The glass substrate and the support body include a plurality of lamination reference marks and a plurality of head positioning reference marks, respectively, which are disposed so as to be mutually aligned in a direction along the one surface of the glass substrate.
    Type: Grant
    Filed: September 21, 2011
    Date of Patent: May 28, 2013
    Assignee: Seiko Instruments Inc.
    Inventors: Noriyoshi Shoji, Toshimitsu Morooka, Keitaro Koroishi, Norimitsu Sanbongi
  • Patent number: 8446442
    Abstract: A thermal print head includes a substrate, a glaze layer formed on the substrate and provided with a heating resistor support portion extending in a primary scanning direction and having an arc-like cross-sectional shape when seen in a direction perpendicular to the primary scanning direction, an electrode layer including a plurality of individual electrodes, each provided with a first strip-shaped portion arranged along the primary scanning direction, each of the first strip-shaped portions formed on the heating resistor support portion, and a common electrode provided with a plurality of second strip-shaped portions arranged along the primary scanning direction, each of the second strip-shaped portions formed on the heating resistor support portion; and a resistor layer including heating portions heated by applying an electric current from the electrode layer and electrode covering portions each configured to cover a gap between the first and second strip-shaped portions.
    Type: Grant
    Filed: November 21, 2011
    Date of Patent: May 21, 2013
    Assignee: Rohm Co., Ltd.
    Inventor: Masaya Yamamoto
  • Patent number: 8384749
    Abstract: A thermal head has a support substrate that has a concave portion having an opening portion formed in a surface of the support substrate, and an upper substrate bonded to the surface of the support substrate in a stacked state to close the opening portion. The upper substrate has an external dimension which is smaller than an external dimension of the support substrate and is slightly larger than an external dimension of the opening portion for closing the opening portion. A heating resistor is formed on a surface of the upper substrate in a position opposed to the concave portion of the support substrate. The thermal head is high in durability and reliability with increased printing efficiency as well as increased manufacturing yields.
    Type: Grant
    Filed: February 17, 2011
    Date of Patent: February 26, 2013
    Assignee: Seiko Instruments Inc.
    Inventors: Toshimitsu Morooka, Keitaro Koroishi, Noriyoshi Shoji, Norimitsu Sanbongi
  • Patent number: 8379070
    Abstract: A thermal head includes a support substrate having a concave portion formed in its front surface, and an upper substrate bonded in a stacked state to the front surface of the support substrate. A heating resistor is provided on the front surface of the upper substrate at a position corresponding to the concave portion. A pair of electrodes are provided on opposite sides of the heating resistor, and a convex portion is formed in the front surface of the upper substrate between the pair of electrodes. The heating resistor has a heating portion disposed between and not overlapped by the electrodes, and the heating portion directly overlies the concave portion. The convex portion has a width dimension smaller than that of the heating portion.
    Type: Grant
    Filed: November 10, 2010
    Date of Patent: February 19, 2013
    Assignee: Seiko Instruments Inc.
    Inventors: Toshimitsu Morooka, Keitaro Koroishi, Noriyoshi Shoji, Norimitsu Sanbongi
  • Patent number: 8339431
    Abstract: Provided is a thermal head including an intermediate layer between a support substrate and an upper substrate, which is capable of suppressing heat dissipation toward the support substrate while maintaining printing quality. Employed is a thermal head (1) including: an upper substrate (5); a support substrate (3) bonded in a stacked state on one surface side of the upper substrate (5); a heating resistor (7) provided on another surface side of the upper substrate (5); and an intermediate layer (6) including a concave portion that forms a cavity portion (4) in a region corresponding to the heating resistor (7), the intermediate layer (6) being provided between the upper substrate (5) and the support substrate (3), in which the intermediate layer (6) is formed of a plate-shaped glass material having a lower melting point than melting points of the upper substrate (5) and the support substrate (3).
    Type: Grant
    Filed: December 7, 2010
    Date of Patent: December 25, 2012
    Assignee: Seiko Instruments Inc.
    Inventors: Norimitsu Sanbongi, Toshimitsu Morooka, Keitaro Koroishi, Noriyoshi Shoji
  • Patent number: 8334886
    Abstract: A thermal head has a support substrate, an upper plate substrate having a back surface bonded to a top surface of the support substrate, and a heating resistor provided on the upper plate substrate. A concave portion is formed in a region of at least one of the top surface of the support substrate and the back surface of the upper plate substrate and opposes the heating resistor. A through portion is formed in the upper plate substrate and passes through the upper plate substrate from a top surface of the upper plate substrate to the top surface of the support substrate in a plate thickness direction. The upper plate substrate functions as a heat accumulating layer, and the concave portion functions as a heat insulating layer.
    Type: Grant
    Filed: July 28, 2010
    Date of Patent: December 18, 2012
    Assignee: Seiko Instruments Inc.
    Inventors: Norimitsu Sanbongi, Noriyoshi Shoji, Toshimitsu Morooka, Keitaro Koroishi
  • Patent number: 8253765
    Abstract: Provided is a thermal head (1) including: a substrate body (12) constituted through bonding a flat supporting substrate (13) and a flat upper substrate (11), which are made of a glass material onto each other in a stacked state; a heating resistor (14) formed on a surface of the upper substrate (11); and a protective film (18) that partially covers the surface of the upper substrate (11) including the heating resistor (14) and protects the heating resistor (14), in which a heat-insulating concave portion (32) and thickness-measuring concave portions (34), which are open to a bonding surface between the supporting substrate and the upper substrate (11) and form cavities are provided in the supporting substrate (13), the heat-insulating concave portion (32) is formed at a position opposed to the heating resistor (14), and the thickness-measuring concave portions (34) is formed in a region that is prevented from being covered with the protective film (18).
    Type: Grant
    Filed: August 3, 2010
    Date of Patent: August 28, 2012
    Assignee: Seiko Instruments Inc.
    Inventors: Noriyoshi Shoji, Norimitsu Sanbongi, Toshimitsu Morooka, Keitaro Koroishi
  • Publication number: 20120133723
    Abstract: A thermal head enables printing even after printing for a long time to a print medium with low paper quality. A thermal head 20 to which a print medium P is pressed by a platen roller 10 has a heat unit 21 with a plurality of heat elements 21a arrayed on an axis, and an electrode connection unit 26 that is formed on an extension of the axis. A receptive space A to which the end 11a of the platen roller 10 contact surface 11 that is pressed to the thermal head 20 is positioned is formed on this axis between the heat unit 21 and the electrode connection unit 26.
    Type: Application
    Filed: November 28, 2011
    Publication date: May 31, 2012
    Applicant: SEIKO EPSON CORPORATION
    Inventors: Koji Yamada, Akira Koyabu
  • Patent number: 8189020
    Abstract: To improve heat generating efficiency and printing quality, a plurality of heating resistors (14) are arranged with spaces therebetween on a heat storage layer (13) laminated on a surface of a supporting substrate (11) via an adhesive layer (12) made of an elastic material. A cavity section (19) is formed at a region between the supporting substrate (11) and the heat storage layer (13), the region being opposed to a heat generating portion of each of the plurality of heating resistors (14). The cavity section (19) includes a concave portion (20) formed in the surface of the supporting substrate (11) and the heat storage layer (13) in which the concave portion (20) is closed and the surface thereof is exposed to the cavity section (19).
    Type: Grant
    Filed: November 6, 2009
    Date of Patent: May 29, 2012
    Assignee: Seiko Instruments Inc.
    Inventors: Keitaro Koroishi, Noriyoshi Shoji, Toshimitsu Morooka, Norimitsu Sanbongi, Yoshinori Sato
  • Patent number: 8189019
    Abstract: To improve printing quality and reduce manufacturing cost, a plurality of heating resistors (14) are arranged with spaces therebetween on a heat storage layer (13) laminated on a surface of a supporting substrate (11) via an adhesive layer (12) made of an elastic material. A cavity portion (19) is formed at a region between the supporting substrate (11) and the heat storage layer (13), the region being opposed to a heat generating portion of each of the plurality of heating resistors (14). The adhesive layer (12) includes a first adhesive layer (12a) laminated on the surface of the supporting substrate (11) and a second adhesive layer (12b) laminated on a surface of the heat storage layer (13). The elastic material constituting the second adhesive layer (12b) is arranged so that the elastic material is in a bonded state with respect to at least a part of the surface of the heat storage layer (13) opposed to the cavity portion (19).
    Type: Grant
    Filed: November 6, 2009
    Date of Patent: May 29, 2012
    Assignee: Seiko Instruments Inc.
    Inventors: Keitaro Koroishi, Noriyoshi Shoji, Toshimitsu Morooka, Norimitsu Sanbongi, Yoshinori Sato
  • Publication number: 20120127254
    Abstract: A thermal print head includes a substrate, a glaze layer formed on the substrate and provided with a heating resistor support portion extending in a primary scanning direction and having an arc-like cross-sectional shape when seen in a direction perpendicular to the primary scanning direction, an electrode layer including a plurality of individual electrodes, each provided with a first strip-shaped portion arranged along the primary scanning direction, each of the first strip-shaped portions formed on the heating resistor support portion, and a common electrode provided with a plurality of second strip-shaped portions arranged along the primary scanning direction, each of the second strip-shaped portions formed on the heating resistor support portion; and a resistor layer including heating portions heated by applying an electric current from the electrode layer and electrode covering portions each configured to cover a gap between the first and second strip-shaped portions.
    Type: Application
    Filed: November 21, 2011
    Publication date: May 24, 2012
    Applicant: ROHM CO., LTD.
    Inventor: Masaya YAMAMOTO
  • Patent number: 8169452
    Abstract: A thermal head has a heat storage layer bonded onto a surface of the substrate, a heating resistor provided on the heat storage layer, and a pair of electrode portions connected to the heating resistor. The heating resistor has a heating portion which does not overlap the pair of electrode portions. A hollow portion is provided in a region of at least one of the surface of the substrate and a surface of the heat storage layer, the region being opposed to the heating resistor. A center line of the hollow portion is shifted with respect to a center line of a heating portion of the heating resistor.
    Type: Grant
    Filed: September 30, 2009
    Date of Patent: May 1, 2012
    Assignee: Seiko Instruments Inc.
    Inventors: Toshimitsu Morooka, Keitaro Koroishi, Yoshinori Sato, Noriyoshi Shoji, Norimitsu Sanbongi
  • Publication number: 20120086764
    Abstract: The disclosure generally relates to a modular printhead configured for ease of access and quick replacement of the printhead. In one embodiment, the disclosure is directed to an integrated printhead which includes: a printhead die supporting a plurality of micropores thereon; a support structure for supporting the printhead die; a heater interposed between the printhead die and the support structure; and an electrical trace connecting the heater to a supply source. The support structure accommodates the electrical trace through a via formed within it so as to form a solid state printhead containing all of the connections within and providing easily replaceable printhead.
    Type: Application
    Filed: December 15, 2011
    Publication date: April 12, 2012
    Applicant: KATEEVA, INC.
    Inventors: Dariusz Golda, Valerie Gassend, Hyeun-Su Kim
  • Patent number: 8144175
    Abstract: Provided is a heating resistor element (1), including: an insulating substrate (9); a heat accumulating layer (10) bonded to a surface of the insulating substrate (9); and a heating resistor (11) provided on the heat accumulating layer (10), in which: on at least one of bonded surfaces (9a) between the insulating substrate (9) and the heat accumulating layer (10), at least one of the insulating substrate (9) and the heat accumulating layer (10) is provided with a concave portion (16) in a region opposed to the heating resistor (11) to form a hollow portion (17); and the hollow portion (17) includes an inner surface on a side of the insulating substrate (9), the inner surface being processed to have surface roughness (Ra) of 0.2 ?m or more. Accordingly, heat accumulation in a gas of the hollow portion (17) can be suppressed to improve printing quality.
    Type: Grant
    Filed: October 20, 2008
    Date of Patent: March 27, 2012
    Assignee: Seiko Instruments Inc.
    Inventors: Keitaro Koroishi, Toshimitsu Morooka, Noriyoshi Shoji, Yoshinori Sato, Norimitsu Sanbongi
  • Publication number: 20120069124
    Abstract: In order to secure printing quality, provided is a head unit (10) including: a thermal head (9), including a heating body (15) formed on one surface of a glass substrate made of a transparent glass material, the heating body being configured to generate heat when supplied with external power; and a support body (11) which is laminated onto the glass substrate in a stacked state, in which the glass substrate and the support body (11) include a plurality of lamination reference marks (21) and a plurality of head positioning reference marks (23), respectively, which are disposed so as to be mutually aligned in a direction along the one surface of the glass substrate.
    Type: Application
    Filed: September 21, 2011
    Publication date: March 22, 2012
    Inventors: Noriyoshi Shoji, Toshimitsu Morooka, Keitaro Koroishi, Norimitsu Sanbongi
  • Patent number: 8139094
    Abstract: A thermal head which forms an image on a recording medium by pressing a protruding portion on which heating elements are arranged on the recording medium while driving the heating elements to be heated includes a head body portion in which the protruding portion and a concave gap portion facing the protruding portion are formed and a heat conductive layer provided on the side of the protruding portion of the head body portion, in which the heat conductive layer includes an electric insulating layer securing electric insulation to the heating elements and a heat diffusion layer diffusing heat generated from the heating elements.
    Type: Grant
    Filed: January 29, 2009
    Date of Patent: March 20, 2012
    Assignee: Sony Corporation
    Inventors: Noboru Koyama, Mitsuo Yanase, Toru Morikawa, Kei Sato
  • Publication number: 20120046166
    Abstract: One or more arrays of heating elements are configured with insulating regions to prevent the dissipation of heat to unintended regions of a thermochromic substrate. Methods include printing and arranging impressions on a two-sided substrate avoiding bleeding and other problems more-commonly associated with traditional two-sided thermal printing techniques. A simple and reliable thermal printing system is provided for use in ballot marking, including several mechanisms for receiving and detecting the orientation of a substrate within a thermal printing apparatus.
    Type: Application
    Filed: November 3, 2011
    Publication date: February 23, 2012
    Inventors: W. Daniel HILLIS, Randall Adam Yates
  • Publication number: 20110279625
    Abstract: An optical recording/reproducing apparatus having a label printer for printing labels on an optical disk and a method for printing labels on an optical disk. The optical recording/reproducing apparatus includes an optical disk drive unit recording and reproducing information on a recording surface of an optical disk, a label printer module printing labels on a label surface of the optical disk using thermal transfer, and a controller controlling a label printing operation of the optical disk drive unit and the label printer module, wherein the label printer module includes a ribbon cartridge in which a thermal transfer ribbon to which dyes are attached is wound and which is disposed to face the label surface of the optical disk mounted in the optical disk drive unit, and a thermal printhead transferring the dyes attached to the thermal transfer ribbon onto the label surface of the optical disk using thermal transfer.
    Type: Application
    Filed: July 25, 2011
    Publication date: November 17, 2011
    Inventors: Won-ik Cho, Ki-won Yoon, Young-won Lee
  • Publication number: 20110216147
    Abstract: Provided is a thermal head that is high in durability and reliability with increased printing efficiency as well as increased manufacturing yields. The thermal head (1) includes: a support substrate (12) including a concave portion (23) having an opening portion (23a) formed in a surface of the support substrate (12); an upper substrate (14) having an external dimension which is smaller than an external dimension of the support substrate (12) and is slightly larger than an external dimension of the opening portion (23a), for closing the opening portion (23a) when bonded to the surface of the support substrate (12) in a stacked state; and a heating resistor (15) formed on a surface of the upper substrate (14) in a position opposed to the concave portion (23) of the support substrate (12).
    Type: Application
    Filed: February 17, 2011
    Publication date: September 8, 2011
    Inventors: Toshimitsu Morooka, Keitaro Koroishi, Noriyoshi Shoji, Norimitsu Sanbongi
  • Patent number: 7965307
    Abstract: A thermal head is disclosed. The thermal head includes a heat generating element row in which plural heat generating elements are arrayed in a main scanning direction and a glaze that stores heat generated from the respective heat generating elements. The thermal head records an image on a recording medium by causing the respective heat generating elements to generate heat while conveying the recording medium in a sub-scanning direction. A plurality of the heat generating element rows are arrayed in the sub-scanning direction. The glaze includes plural convex portions arranged in the sub-scanning direction in association with the number of arrays of the heat generating element rows. The heat generating elements are arranged on upper sides of the convex portions, respectively.
    Type: Grant
    Filed: November 19, 2007
    Date of Patent: June 21, 2011
    Assignee: Sony Corporation
    Inventors: Takaaki Murakami, Yasushi Hirumi
  • Publication number: 20110141215
    Abstract: A thermal head (X1) is provided with a substrate (10), a plurality of heat generating elements (H), a first electrode (31), and a second electrode (32). The heat generating elements (H) are arranged on the substrate (10) The first electrode (31) is provided with a plurality of first connecting sections (311) and a plurality of first conductive sections (312). Each of the first connecting sections (311) is connected to one end portion of each of the heat generating elements (H). Each of the first conductive sections (312) is connected to each of the first connecting sections (311) at one end. The second electrode (32) is provided with a plurality of second connecting sections (321) and a plurality of second conductive sections (322). Each of the second connecting sections (321) is connected to the other end portion of each of the heat generating elements (H). Each of the second conductive sections (322) is connected to each of the second connecting sections (321) at one end.
    Type: Application
    Filed: March 27, 2008
    Publication date: June 16, 2011
    Applicant: KYOCERA CORPORATION
    Inventors: Shigetaka Shintani, Takashi Aso
  • Publication number: 20110128340
    Abstract: Provided is a thermal head with enhanced strength and improved thermal efficiency including a cavity portion formed therein at a position corresponding to a heating resistor. Employed is a thermal head (1) including: a support substrate (3) including a concave portion (2) formed in its front surface; an upper substrate (5) bonded in a stacked state to the front surface of the support substrate (3); a heating resistor (7) provided on the front surface of the upper substrate (5) at a position corresponding to the concave portion (2); a pair of electrode portions (8) provided on both sides of the heating resistor (7); and a concave portion (20) formed in the front surface of the upper substrate (5) on a side of the pair of electrode portions (8), the concave portion being provided between the pair of electrode portions (8).
    Type: Application
    Filed: November 10, 2010
    Publication date: June 2, 2011
    Inventors: Toshimitsu Morooka, Keitaro Koroishi, Noriyoshi Shoji, Norimitsu Sanbongi
  • Patent number: 7944461
    Abstract: A heating device capable of evenly heating a thermal recording medium without increasing the cost of the device is disclosed. The heating device evenly heats the recording surface of a thermally-reversible recording card by conducting the heat energy transferred from a heat generating member by way of a heating member, made of aluminum having high heat conductivity and high heat capacity characteristics. By this feature, it becomes possible to accurately erase the information recorded on the recording card and to use an inexpensive heat generating member as the heat generating member.
    Type: Grant
    Filed: August 10, 2007
    Date of Patent: May 17, 2011
    Assignees: Ricoh Company, Ltd., Wedg Co., Ltd.
    Inventors: Hideo Sakurai, Satoshi Arai, Naoki Yoshida, Tadafumi Tatewaki
  • Patent number: 7889219
    Abstract: A thermal head includes a substrate; a plurality of driver ICs configured to be arranged in a main scanning direction; a heater element configured to include a heat storage layer, a heating resistor layer which is made of a plurality of pairs of effective heating portions, and an electrode layer which is patterned to supply electricity to the heating resistor layer; and a protective layer configured to cover a surface of the heater element, wherein the folded electrode is formed by adjusting an area thereof such that a heat distribution of each heating resistor becomes uniform. In such a thermal head, the number of manufacturing processes or the cost does not increase and a heat distribution becomes uniform, so that a good printing result having good a degree of gloss and image can be obtained.
    Type: Grant
    Filed: June 12, 2009
    Date of Patent: February 15, 2011
    Assignee: Alps Electric Co., Ltd.
    Inventors: Tsuneyuki Sasaki, Hirotoshi Terao, Yukiko Yasuda, Tomoko Wauke
  • Publication number: 20110025808
    Abstract: Provided is a thermal head in which, even when an upper plate substrate and a lower plate substrate are in a bonded state, a thickness of the upper plate substrate is adjusted to an appropriate value to allow an improvement in thermal efficiency. Adopted is a thermal head including: a support substrate; an upper plate substrate having a back surface thereof bonded to a top surface of the support substrate; a heating resistor provided on the upper plate substrate; a concave portion formed in a region of at least one of the top surface of the support substrate and the back surface of the upper plate substrate, which opposes the heating resistor; and a through portion formed in the upper plate substrate, which passes through the upper plate substrate from a top surface of the upper plate substrate to the top surface of the support substrate in a plate thickness direction.
    Type: Application
    Filed: July 28, 2010
    Publication date: February 3, 2011
    Inventor: Norimitsu Sanbongi
  • Patent number: 7880755
    Abstract: A thermal print head assembly comprising a thin ceramic substrate, a thermal insulating glaze layer, an electrically conducive layer, an electrically resistive element layer, and a glass over-coating protective layer, plus an energizing schema that eliminates the need for a heat-sink is disclosed. A method of making this thermal print head assembly is also disclosed.
    Type: Grant
    Filed: April 17, 2009
    Date of Patent: February 1, 2011
    Assignee: Lathem Time
    Inventors: Ellery W. Potash, Hideo Taniguchi