Abstract: A thermal head includes a head base, a wiring board, a plurality of recessed portions, a contact portion, a plurality of drive ICs, a plurality of wire members, and a resin member. The head base includes a substrate. The wiring board is located adjacent to the head base. The plurality of recessed portions are located adjacent to the head base. The contact portion is located between the recessed portions adjacent to each other, and the substrate and the wiring board are in contact with each other at the contact portion. The plurality of drive ICs are located on the first surface of the wiring board so as to face one by one the plurality of recessed portions. The plurality of wire members are located across the recessed portions and electrically connect the substrate and the drive ICs. The resin member seals the plurality of wire members and the plurality of drive ICs.

Abstract: A building material discharge head is provided with, a flow path structure which, by stacking multiple plate-form bodies having a through-hole and closing both ends of the through-holes, forms a flow path in the direction orthogonal to the through-holes and in a long direction of an elongate shape of the through-holes, and in which a discharge opening is formed in at least one end of the body to communicate with the path, a thin plate which closes one side of the path, which is at one end of the through-holes, a heating plate which is provided on the opposite side and which heats the inside of the path, a closing plate which is provided on the other surface of the path, which is the other end of the through-holes, and an LED which is provided near the discharge opening and which irradiates light along the direction of the path.

Abstract: An object of the present disclosure is to provide a chip resistor that reduces a possibility of occurrence of a mounting failure. The chip resistor of the present disclosure includes: insulating substrate; a pair of first upper-face electrodes that is provided at both end portions of an upper face of insulating substrate; and resistor that is provided on the upper face of insulating substrate and is formed between the pair of first upper-face electrodes. The chip resistor also includes: a pair of second upper-face electrodes that is formed on upper faces of the pair of first upper-face electrodes and is connected to resistor; and protective film that is provided to cover exposed resistor and part of the pair of second upper-face electrodes.

Abstract: A thermal printhead includes a substrate, a resistor layer formed on the substrate, an electrode layer formed on the substrate and electrically connected to the resistor layer, and an insulating layer. The electrode layer includes a first electrically conductive portion and a second electrically conductive portion spaced apart from each other. The resistor layer includes a heater portion that bridges the first electrically conductive portion and the second electrically conductive portion as viewed in the thickness direction of the substrate. The insulating layer includes a portion positioned between the electrode layer and the heater portion. This arrangement reduces formation of a eutectic region between the heater portion and the electrode layer.

Abstract: A probe head of vertical probe card and a manufacturing method of a composite board thereof are provided. The probe head includes guide plate, composite board, and probe pin. The composite board includes first board layer and second board layer which are laminated together by joining operation. The composite board further includes through hole which is made by drilling and passed all the way through the first board layer and the second board layer. The friction coefficient of the first board layer is less than that of the second board layer, and the thermal expansion coefficient of the second board layer is less than that of the first board layer. The probe pin is penetrated all the way through the through hole of the composite board. By this, friction between the probe pin and composite board is reduced so as to stabilize the position of the probe pin.

Abstract: According to the present disclosure, a manufacturing method of a fine wiring pattern is disclosed. The manufacturing method includes preparing a support member, forming a first layer on the support member by thick-film printing, and forming a second layer including Ag on the first layer by the thick-film printing. The method also includes forming a predetermined fine wiring pattern by performing an etching process upon the first layer and the second layer.

Abstract: A thermal head in which power durability of the heat-generating element is improved and a thermal printer including the same. A thermal head according to an embodiment includes a substrate, electrodes disposed in a pair on the substrate, a heat-generating element disposed between the electrodes and connecting the electrodes to one another, an electric resistor layer disposed below the electrodes, and a protection film disposed on the electrodes and the heat-generating element. The electrodes include a first electrode and a second electrode electrically connected to the heat-generating element. The heat-generating element and the electric resistor layer each contain at least one metal selected from Al, Cu, Ag, Mo, Y, Nd, Cr, Ni and W, in a region on a protection film side thereof. A content of the metal contained in the heat-generating element is higher than a content of the metal contained in the electric resistor layer disposed below the first electrode.

Abstract: A method of manufacturing a thermal head, comprising the steps of: bonding a support substrate and an upper substrate, which have a flat shape, together in a laminated state, the support substrate and the upper substrate having opposed surfaces, at least one of which includes a concave portion; thinning the upper substrate bonded onto the support substrate; a measurement step of measuring a thickness of the thinned upper substrate; determining a target resistance value of a heating resistor from the following expression based on the measured thickness of the upper substrate; and forming the heating resistor having the target resistance value at a position opposed to the concave portion, Rh=R0×(1+(D1+D0)/(D0+K)) where Rh represents the target resistance value; R0, a design resistance value; D1, the thickness of the upper substrate; D0, a design thickness of the upper substrate; and K, a heating efficiency coefficient.

Abstract: A thermal head comprises: a support substrate; an upper substrate arranged on the support substrate on one surface side thereof in a laminated state; an intermediate layer which is arranged between the upper substrate and the support substrate to bond the upper substrate and the support substrate to each other, and which has one of a through hole and a concave portion to form a cavity portion between the upper substrate and the support substrate; and a heat generating resistor formed on a surface of the upper substrate on a side opposite to the support substrate at a position opposed to the cavity portion, wherein the upper substrate has a melting point lower than a melting point of the intermediate layer.

Abstract: A thermal head in which power durability of the heat-generating element is improved and a thermal printer including the same. A thermal head according to an embodiment includes a substrate, electrodes disposed in a pair on the substrate, a heat-generating element disposed between the electrodes and connecting the electrodes to one another, an electric resistor layer disposed below the electrodes, and a protection film disposed on the electrodes and the heat-generating element. The electrodes include a first electrode and a second electrode electrically connected to the heat-generating element. The heat-generating element and the electric resistor layer each contain at least one metal selected from Al, Cu, Ag, Mo, Y, Nd, Cr, Ni and W, in a region on a protection film side thereof. A content of the metal contained in the heat-generating element is higher than a content of the metal contained in the electric resistor layer disposed below the first electrode.

Abstract: A thermal print head includes a substrate, a resistor layer supported on the substrate and provided with a plurality of heating portions arranged along a primary scanning direction, an electrode layer provided with a plurality of individual electrodes arranged along the primary scanning direction, a drive IC configured to selectively apply an electric current to the plurality of heating portions, and a plurality of wires connected to the plurality of individual electrodes and the drive IC, the plurality of individual electrodes including strip-shaped portions electrically connected to the heating portions and arranged along the primary scanning direction and pad portions greater in width in the primary scanning direction than the strip-shaped portions, the pad portions including bonding pads connected to each of the plurality of wires and probe contact pads, the probe contact pads being narrower in width in the primary scanning direction than bonding pads.

Abstract: There is provided a thermal transfer sheet that, by virtue of flexibility and heat resistance imparted by a primer layer constituting the thermal transfer sheet, is less likely to be broken even upon exposure to a high level of thermal energy and is highly suitable for high-speed printing. The thermal transfer sheet has a thermally transferable colorant layer provided on one surface of a base material sheet, and a heat-resistant slipping layer provided on the other surface of the base material sheet through a primer layer. The primer layer contains at least a polyvinyl alcohol resin and a crosslinking agent.

Abstract: A thermal head avoids a drop in print quality caused by adhesion of printing chaff. A thermal head 39 that presses against thermal paper that moves from one side to the other side and prints by melting dye contained in the thermal paper has a glazed layer 150 that is formed in an area on one part of a ceramic substrate 43 and stores in-flowing heat, and a heating resistor 140 that is located offset to one side from the center of the glazed layer 150, selectively heats the thermal paper S pressed in contact therewith, and melts a dye material contained in the thermal paper. A smooth surface P against which the thermal paper S heated by the heating resistor 140 slides is formed to the other side of the glazed layer 150 from the heating resistor 140.

Abstract: Adopted is a thermal head, including: a support substrate including a concave portion formed in a front surface thereof; an upper substrate, which is bonded in a stacked state to the front surface of the support substrate and includes a convex portion formed at a position corresponding to the concave portion; a heating resistor provided on a front surface of the upper substrate at a position straddling the convex portion; and a pair of electrodes provided on both sides of the heating resistor, in which at least one of the pair of electrodes include: a thin portion, which is connected to the heating resistor at a distal end surface of the convex portion in a region corresponding to the concave portion; and a thick portion, which is connected to the heating resistor and is formed thicker than the thin portion.

Abstract: A thermal print head includes a substrate, a resistor layer supported on the substrate and provided with a plurality of heating portions arranged along a primary scanning direction, an electrode layer provided with a plurality of individual electrodes arranged along the primary scanning direction, a drive IC configured to selectively apply an electric current to the plurality of heating portions, and a plurality of wires connected to the plurality of individual electrodes and the drive IC, the plurality of individual electrodes including strip-shaped portions electrically connected to the heating portions and arranged along the primary scanning direction and pad portions greater in width in the primary scanning direction than the strip-shaped portions, the pad portions including bonding pads connected to each of the plurality of wires and probe contact pads, the probe contact pads being narrower in width in the primary scanning direction than bonding pads.

Abstract: To improve heat generating efficiency and printing quality, a plurality of heating resistors (14) are arranged with spaces therebetween on a heat storage layer (13) laminated on a surface of a supporting substrate (11) via an adhesive layer (12) made of an elastic material. A cavity section (19) is formed at a region between the supporting substrate (11) and the heat storage layer (13), the region being opposed to a heat generating portion of each of the plurality of heating resistors (14). The cavity section (19) includes a concave portion (20) formed in the surface of the supporting substrate (11) and the heat storage layer (13) in which the concave portion (20) is closed and the surface thereof is exposed to the cavity section (19).

Abstract: Provided is a heating resistor element (1), including: an insulating substrate (9); a heat accumulating layer (10) bonded to a surface of the insulating substrate (9); and a heating resistor (11) provided on the heat accumulating layer (10), in which: on at least one of bonded surfaces (9a) between the insulating substrate (9) and the heat accumulating layer (10), at least one of the insulating substrate (9) and the heat accumulating layer (10) is provided with a concave portion (16) in a region opposed to the heating resistor (11) to form a hollow portion (17); and the hollow portion (17) includes an inner surface on a side of the insulating substrate (9), the inner surface being processed to have surface roughness (Ra) of 0.2 ?m or more. Accordingly, heat accumulation in a gas of the hollow portion (17) can be suppressed to improve printing quality.

Abstract: A thermal head includes a substrate main body having a flat plate-shaped support substrate and a flat plate-shaped upper substrate which are bonded to each other in a stacked state. A heating resistor is formed on a surface of the upper substrate, and a pair of electrodes connected to both ends of the heating resistor, respectively, for supplying power to the heating resistor. The substrate main body includes a cavity portion in a region opposed to the heating resistor at a bonding portion between the support substrate and the upper substrate, and at least one of the electrodes includes a thin portion in a region opposed to the cavity portion, the thin portion being thinner than other regions of the electrodes.

Abstract: To achieve improvements in heating efficiency and strength against external load, provided is a thermal head (1), comprising: a supporting substrate (3) having a surface in which a concave portion (2) is formed; a heat storage layer (5) bonded onto the surface of the supporting substrate (3); a heating resistor provided in a region, which is opposed to the concave portion (2) of the supporting substrate (3), on the heat storage layer (5); and a protruding portion (2A), which is provided inside a hollow portion formed between the supporting substrate (3) and the heat storage layer (5) by the concave portion (2), and comes into contact with the heat storage layer (5) and limits deflection of the heat storage layer (5) when the heating resistor is pressurized by predetermined load or more.

Abstract: A thermal head includes a glass layer provided with a groove section formed inside the glass layer, a heat generating resistor disposed outside the glass layer, and a pair of electrodes provided to both sides of the heat generating resistor, wherein a part of the heat generating resistor exposed between the pair of electrodes is defined as a heat generating section, and at least one of the pair of electrodes has a smaller width in an end section on an opposite side to a side of the heat generating section than a width of an end section on the side of the heat generating section.

Abstract: A thermal head is disclosed. The thermal head includes a heat generating element row in which plural heat generating elements are arrayed in a main scanning direction and a glaze that stores heat generated from the respective heat generating elements. The thermal head records an image on a recording medium by causing the respective heat generating elements to generate heat while conveying the recording medium in a sub-scanning direction. A plurality of the heat generating element rows are arrayed in the sub-scanning direction. The glaze includes plural convex portions arranged in the sub-scanning direction in association with the number of arrays of the heat generating element rows. The heat generating elements are arranged on upper sides of the convex portions, respectively.

Abstract: A thermal head includes a glass layer having a protruding section formed on one surface and a concave groove section formed on the other surface facing the protruding section, a heat generation resistor provided on the protruding section, and a pair of electrodes provided to both sides of the heat generation resistor, and a part of the heat generation resistor exposed between the pair of electrodes is defined as a heat generation section, the protruding section has a smaller curvature radius in both sides than a curvature radius in a central portion, and a width of the groove section is one of equal to and larger than a length of the heat generation section.

Abstract: The present invention discloses methods and apparatuses for the separations of IC fabrication and assembling of separated IC components to form complete IC structures. In an embodiment, the present fabrication separation of an IC structure into multiple discrete components can take advantages of dedicated IC fabrication facilities and achieve more cost effective products. In another embodiment, the present chip assembling provides high density interconnect wires between bond pads, enabling cost-effective assembling of small chip components. In an aspect, the present process forms interconnect wires on a thermal decomposable adhesive, and after positioning the wires at proper bond pad locations, releases the interconnect wires onto the bond pads.

Abstract: To improve heat generating efficiency and printing quality, a plurality of heating resistors (14) are arranged with spaces therebetween on a heat storage layer (13) laminated on a surface of a supporting substrate (11) via an adhesive layer (12) made of an elastic material. A cavity section (19) is formed at a region between the supporting substrate (11) and the heat storage layer (13), the region being opposed to a heat generating portion of each of the plurality of heating resistors (14). The cavity section (19) includes a concave portion (20) formed in the surface of the supporting substrate (11) and the heat storage layer (13) in which the concave portion (20) is closed and the surface thereof is exposed to the cavity section (19).

Abstract: Provided are a heat generation sheet and a method of fabricating the same. The heat generation sheet includes: a base comprising first and second sides; a heat generation layer which is formed in at least one region of the first side of the base and in which a plurality of conductive nanoparticles are physically necked; a protective layer protecting the heat generation layer; and an electric feeding part supplying power to the heat generation layer. The heat generation layer is formed by coating and heat treating a nanoparticle dispersion solution.

Abstract: A thermal head avoids a drop in print quality caused by adhesion of printing chaff. A thermal head 39 that presses against thermal paper that moves from one side to the other side and prints by melting dye contained in the thermal paper has a glazed layer 150 that is formed in an area on one part of a ceramic substrate 43 and stores in-flowing heat, and a heating resistor 140 that is located offset to one side from the center of the glazed layer 150, selectively heats the thermal paper S pressed in contact therewith, and melts a dye material contained in the thermal paper. A smooth surface P against which the thermal paper S heated by the heating resistor 140 slides is formed to the other side of the glazed layer 150 from the heating resistor 140.

Abstract: A thermal printhead (A1) includes an insulating substrate (1), a glaze (2), a plurality of pairs of first and second electrodes (3A, 3B) and heating resistors (5). Each of the heating resistors (5) includes a heating portion (5a) spaced apart from the first electrode (3A) and the second electrode (3B). The respective ends (31A, 31B) of the electrodes (3A, 3B) are embedded in the glaze (2). An insulating film (4) is provided between the heating portion (5a) of each heating resistor (5) and the glaze (2). The hardness of the insulating film (4) is higher than that of the glaze (2) and lower than that of the heating resistor (5). The thermal conductivity of the insulating film (4) is higher than that of the glaze (2) and lower than that of the heating resistor (5).

Abstract: A thermal printhead (A1) comprises an insulating substrate (1), a common electrode (31) which is formed on the insulating substrate (1) and includes a plurality of comb teeth (31a), a plurality of individual electrodes (41) formed on the insulating substrate (1), and a resistor layer (51) formed on the insulating substrate (1) and electrically connected to the comb teeth (31a) and the individual electrodes (41). The resistor layer (51) comprises a thin film, whereas the common electrode (31) and the individual electrodes (41) comprise a thick film.

Abstract: A thermal printhead (A) according to the present invention includes a heating resistor (5) formed on a substrate (1), an electrode (3) for energizing the heating resistor (5), and a protection film (6) for covering the heating resistor (5) and the electrode (3). The protection film (6) has a surface with a ten-point mean roughness of no smaller than 0.2 ?m.

Abstract: A thermal printer has a first thermal head, a second thermal head, and a feeding mechanism. The feeding mechanism feeds one of thermal papers which include a double-sided thermal paper having thermosensitive layers formed on both sides thereof and a single-sided thermal paper having a thermosensitive layer formed on one side thereof. The first thermal head is so provided as to be brought into contact with a first side of the thermal paper fed by the feeding mechanism. The second thermal head is so provided as to be brought into contact with a second side of the thermal paper fed by the feeding mechanism. The thermal printer determines whether a mark has been printed at least one of the first and second sides of the thermal paper and controls print operation based on a determination result.

Abstract: A heating element of a thermal head has a first electrode layer formed on a glaze layer and a second electrode layer formed opposite to the first electrode layer. A first insulation layer is formed on the first electrode layer to expose both ends of the first electrode layer in a transporting direction of a recording paper. A third electrode layer is formed on the first insulation layer to expose both ends of the first insulation layer in the transporting direction, and a heating resistor layer is formed across the first to the third electrode layers and the first insulation layer. A protective layer is formed covering the first to the third electrode layers, the first insulation layer, and the heating resistor layer. A system controller selectively applies the current to among the first, the second and the third electrode layers based on the image data to record.

Abstract: The invention provides a heat generating resistant element having a high durability and a high resistance suitable for constituting an electrothermal converting member in an ink jet head or an ink jet apparatus. There is employed, as the heat generating resistant element, a film constituted of Cr, Si and N, having a composition of Cr: 15 to 20 at. %, Si: 40 to 60 at. % and N: 20 to 45 at. %, which constitute 100 at.% or substantially 100 at. %.

Abstract: In a thermal head capable of performing printing of high quality while preventing foreign matters such as dirt or the like from accumulating in a portion, on which a heat reserving layer is formed, at the time of printing, the heat reserving layer comprising a projection formed by partially projecting a surface of the layer and having a top, the projection being provided on a surface thereof with heating elements, the projection being shaped in cross section in a direction perpendicular to a direction of arrangement of the heating elements to form an inclined surface on one surface side, which is formed to be lower than the other surface side. The projection is formed so that a height thereof from the one surface side is 5 to 50 &mgr;m.

Abstract: Diamonds are marked by applying apertured tapes bearing identifying indicia to the girdles, applying a flammable layer over the apertured tapes, and then igniting the flammable layer to burn the indicia into the girdles. Preferably, the flammable layer is prepackaged within the apertured tapes.

Abstract: A thermal printhead includes a substrate, an electrode layer formed on the substrate, and a heating resistor which is formed on the electrode layer and contains a conductive substance and glass. The conductive substance of the heating resistor is doped in advance with an insulating substance which is identical in crystalline structure to the conductive substance. The heating resistor is formed by mixing powder of the insulating substance, which is identical in crystalline structure to the conductive substance, with the conductive substance powder, baking the obtained mixture, pulverizing the baked mixture, mixing the pulverized mixture with glass powder to prepare a resistor paste, and printing and baking the obtained resistor paste.

Abstract: The thermal printhead (1) includes an insulating substrate (2), a heating resister (5) formed on the substrate (2), a first glass coat layer (7) formed on the substrate (2) for covering the heating resister (5), and a second glass coat layer (8) formed on the first glass coat layer (7). The heating resister (5) has a centerline average roughness not greater than 0.3 &mgr;m. The first glass coat layer (7) has a centerline average roughness not greater than 0.1 &mgr;m.

Abstract: The thermal printhead according to the present invention includes an elongated rectangular substrate including an attaching surface and a non-attaching surface, and a heat sink plate attached to the attaching surface of the substrate. The non-attaching surface of the substrate is provided with a common electrode, a plurality of individual electrodes and a heating resistor. The heating resistor is covered with an insulating protective layer and an opaque conductive protective layer. The thermal printhead includes a positioning indicia. In the method of making the thermal printhead according to the present invention, an image of the positioning indicia is taken by an image pick-up device and imaged on a display of a monitor. Two reference lines are set on the display of the monitor. Positioning of the substrate relative to the heat sink plate is performed by moving the substrate so that the reference line of the positioning indicia coincides with the reference line on the display of the monitor.

Abstract: A thermal head, used for an image forming device, comprises a glaze formed at at least a portion of a base plate of the thermal head so that at least a portion of the glaze is protruded, and a plurality of heater portions provided at the glaze, a length of each of the heater portions in a image forming direction of a recording material being less than or equal to 100 .mu.m, wherein an outer surface of each of the heater portions is a convex curved surface and is the outermost portion of the glaze.

Abstract: A polycrystalline layer is formed on a surface of a substrate and metal electrode layers are formed thereon to be opposed to each other. The polycrystalline silicon layer includes an exposed region exposed from the metal electrode layers, and this exposed region includes low resistance regions extending under the metal electrode layers to be in a pair, and a high resistance region having a high sheet resistance defined between the low resistance regions. At least one of the low resistance regions is so trimmed as to adjust heat generation from the high resistance region.

Abstract: A polycrystalline layer is formed on a surface of a substrate and metal electrode layers are formed thereon to be opposed to each other. The polycrystalline silicon layer includes an exposed region exposed from the metal electrode layers, and this exposed region includes low resistance regions extending under the metal electrode layers to be in a pair, and a high resistance region having a high sheet resistance defined between the low resistance regions. At least one of the low resistance regions is so trimmed as to adjust heat generation from the high resistance region.

Abstract: There is provided an ink jet head which includes an electrothermal converting body disposed along a pathway of ink, said electrothermal converting body being provided with a heat generating resistor capable of generating, upon energization, heat energy to be directly applied to ink on a heat acting face whereby discharging said ink, characterized in that said heat generating resistor is composed of a material containing at least Ir and other one specific element at the specific respective composition rates or a material containing at least Ir and other two specific elements at the specific respective composition rates, said heat generating resistor constituted by any of said materials being capable of exhibiting a sufficient durability even in the case of driving the ink jet head with a relatively long drive pulse duration.

Abstract: A thermal print head is provided with a supporting substrate, a glaze layer formed on the substrate, a heating resistor which is formed on the glaze layer and made of Si and O and the rest being substantially composed of a metal, and electrodes connected to the heating resistor. The heating resistor has an unpaired electron density of 1.0.times.10.sup.19 /cm.sup.3. In addition, the reaction layer formed by reaction of the glaze layer and the heating resistor is formed between the glaze layer and resistor.

Abstract: An ink jet printing device including an ink channel wall defining an ink chamber; a nozzle portion formed with a nozzle connecting the ink chamber with atmosphere; and a thermal heater formed to the ink channel wall adjacent to the nozzle portion, the thermal heater including a Ta--Si--O ternary alloy thin film resistor having a composition of 64% .ltoreq.Ta.ltoreq.85%, 5%.ltoreq.Si.ltoreq.26%, and 6%.ltoreq.O.ltoreq.15% and a nickel film conductor.

Abstract: A processor for photothermographic media comprising: a rotatably mounted heated drum; and a plurality of rollers spaced around the periphery of the drum to hold down photothermographic media to the drum over a segment of the circumference thereof, the rollers including an outer layer of low density, low thermal mass, and low thermal conductivity elastomer foam coating which have very little heat contribution to the media to achieve uniform media processing.

Abstract: A pair of opposite end portions of a buckling exothermic body as an exothermic resistor are fixed onto a substrate via insulating members. The buckling exothermic body heats with resistance thereof by applying a voltage from a power source to the buckling exothermic body via a switch. As inner temperature of the exothermic resistor reaches a predetermined temperature or higher required for the exothermic resistor to buckle, and a compressive force exceeds a buckling load, the exothermic resistor buckles and distorts towards thermosensible paper from a non-shifted state in which there is virtually no thermal stress. As the buckled and distorted exothermic resistor comes into contact with the thermosensible paper, recording, such as printing, is performed only at the contact portion. This reduces thermal mutual interference between neighboring buckling exothermic bodies. As a result, recording of high resolution and high print quality is performed.

Abstract: A sputtering target comprises an oxide containing niobium, a silicide containing niobium and silicon oxide substantially for the rest. The sputtering target is formed e.g. by reactive sintering a powdery niobium or a powdery niobium alloy containing silicon oxide in the range of 15 to 70 mol % by mole ratio. A film resistor formed by using the sputtering target exhibits high specific resistance, good stabilities of resistance and a film composition and excellent reproducibility and is used as a heat generating resistor in e.g. a thermal printer head.

Abstract: There is provided an ink jet head which includes an electrothermal converting body disposed along a pathway of ink, said electrothermal converting body being provided with a heat generating resistor capable of generating, upon energization, heat energy to be directly applied to ink on a heat acting face whereby discharging said ink, characterized in that said heat generating resistor is composed of a material containing at least Ir and other one specific element at the specific respective composition rates or a material containing at least Ir and other two specific elements at the specific respective composition rates, said heat generating resistor constituted by any of said materials being capable of exhibiting a sufficient durability even in the case of driving the ink jet head with a relatively long drive pulse duration.

Abstract: A thin-film thermal recording head, used in a facsimile machine or a thermal printer, including heat resistors formed from only a Cr--Si--SiO or Ta--Si--SiO alloy thin-film resistor layer and a chromium, molybdenum, nickel, or tungsten thin-film conductor layer. The heat resistor is formed on a substrate having a linear thermal expansion coefficient from room temperature to 300.degree. C. of 5.times.10.sup.-8 /.degree.C. or less. The heat resistor is also described having a thin anti- abrasion layer with thickness of 0.5 .mu.m or less. The thin-film thermal recording head is also described in monolithic form with a portion of the heat resistor formed to directly contact an output electrode of a drive LSI circuit. In this case, a double-layer thermal-insulation layer can be formed between the substrate and the portion of the heat resistor that contacts and heats heat-sensitive recording paper. The two layers of the thermal-insulation layer are formed from a heat-resistant resin and an inorganic insulator.