Head Substrate Patents (Class 347/205)
  • Patent number: 12151961
    Abstract: A glass manufacturing apparatus includes a delivery tube terminating at a lower end in a delivery slot. A stream of molten material is delivered along a travel plane in a travel direction. A first plate is positioned adjacent the lower end of the delivery tube on a first side of the travel plane. The first plate includes a first edge extending adjacent the travel plane and a first thermal expansion slot extending from the first edge to a first interior. A second plate is positioned adjacent the lower end of the delivery tube on a second side of the travel plane. The second plate includes a second edge extending adjacent the travel plane and a second thermal expansion slot extending from the second edge to a second interior. The second edge is spaced apart from the first edge to define a delivery opening through which the delivery tube extends.
    Type: Grant
    Filed: June 10, 2020
    Date of Patent: November 26, 2024
    Assignee: CORNING INCORPORATED
    Inventors: Kathryn Jean Russell Bourlotos, Gilbert De Angelis, Dale Madard Fisher, Jr., Chunhong Chelsie He, Timothy Joseph Helmers, Benjamin Pelham Schrock, Christopher Myron Smith
  • Patent number: 11973310
    Abstract: A light source unit for thermally-assisted magnetic head includes a substrate member having a first bonding surface; a light source assembly attached on the first bonding surface of the substrate member and having a second bonding surface; and a heater circuit assembly formed between the substrate member and the light source assembly, the heater circuit assembly having a heater formed on the substrate member and two leads connected at two ends of the heater, the lead being thicker than the heater, thereby a distance between the heater and the second bonding surface is farther than that between the lead and the second bonding surface. The light source unit can reduce mechanical stress and thermal conduction between a light source assembly and a substrate member, thereby improving the performance of the light source assembly and the heater.
    Type: Grant
    Filed: July 9, 2019
    Date of Patent: April 30, 2024
    Assignees: SAE MAGNETICS (H.K.) LTD., HEADWAY TECHNOLOGIES, INC.
    Inventors: Takashi Honda, Kowang Liu, Kwun Pan Ng, Makoto Kawato
  • Patent number: 11305553
    Abstract: A thermal print head includes: a substrate; a resistor layer supported by the substrate and including a plurality of heat generating portions arranged in a main scanning direction; a wiring layer supported by the substrate and forming an energizing path to the plurality of heat generating portions; and an insulating layer interposed between the substrate and the resistor layer, wherein the substrate has a cavity portion overlapping the plurality of heat generating portions when viewed in a thickness direction of the substrate.
    Type: Grant
    Filed: June 11, 2020
    Date of Patent: April 19, 2022
    Assignee: ROHM Co., Ltd.
    Inventor: Isamu Nishimura
  • Patent number: 10279596
    Abstract: A thermal head includes: a substrate; a heat generating section which is disposed on the substrate; a plurality of driving ICs including first and second driving ICs which are disposed on the substrate and electrically coupled to the heat generating section; and a cover member covering the first and second driving ICs. The cover member is disposed in an inter-driving IC region between the first driving IC and the second driving IC and above and below the inter-driving IC region, and includes a first void.
    Type: Grant
    Filed: September 26, 2016
    Date of Patent: May 7, 2019
    Assignee: KYOCERA CORPORATION
    Inventors: Arata Okayama, Hisatoshi Takada, Tatsuru Seto, Makoto Watanabe
  • Patent number: 9937729
    Abstract: A thermal print head includes a semiconductor substrate, a resistor layer and a wiring layer. The resistor layer is formed on the semiconductor substrate and has a plurality of heat generating portions arranged in the main scanning direction. The wiring layer is formed on the semiconductor substrate to be included in a conduction path for energizing the plurality of heat generating portions. The conduction path includes a path or paths provided by the semiconductor substrate itself.
    Type: Grant
    Filed: December 21, 2016
    Date of Patent: April 10, 2018
    Assignee: ROHM CO., LTD.
    Inventors: Isamu Nishimura, Yasuhiro Fuwa
  • Patent number: 9079378
    Abstract: An electromagnetic shielding material 50 comprising a plurality of copper foil composites 10 connected together in a longitudinal direction L, the composite having a copper foil 2 and a resin film 4 which are laminated, wherein an overlapped part 50k of the copper foil composites is adhered with an epoxy based adhesive 6 comprising as main components an epoxy resin and one or more of flexibility providing resins selected from the group consisting of nitrile butadiene rubber, natural rubber, styrene butadiene rubber, butadiene rubber, ethylene propylene rubber, isoprene rubber, urethane rubber and acrylic rubber, and wherein the epoxy based adhesive disposed at the overlapped part of the copper foil composites has a length LA in the longitudinal direction of 1 to 6 mm.
    Type: Grant
    Filed: October 16, 2009
    Date of Patent: July 14, 2015
    Assignee: JX Nippon Mining & Metals Corporation
    Inventor: Kazuki Kammuri
  • Patent number: 8922610
    Abstract: A thermal head and a thermal printer are disclosed. The head includes a substrate, heat generating members, an edge portion, and first and second reinforcing members. The substrate includes: first and second surfaces opposing to each other; and an end face connecting the first and second surfaces. The heat generating members are parallel to the end face and located on the substrate. The edge portion is located on the substrate, crosses an array direction of the heating generating members, and includes first, second and third edge portions on the first main surface, the second main surface and the first end face, respectively. The first reinforcing member is located on the first, second and third edge portions. The second reinforcing member is located on the first edge portion, and separated from the first reinforcing member.
    Type: Grant
    Filed: June 22, 2012
    Date of Patent: December 30, 2014
    Assignee: Kyocera Corporation
    Inventors: Youichi Moto, Hidekazu Akamatsu, Daisaku Kato, Naoto Matsukubo, Akihiro Fukami, Kouhei Nakada
  • Patent number: 8451305
    Abstract: In order to secure printing quality, a head unit includes a thermal head having a heating body formed on one surface of a glass substrate made of a transparent glass material, the heating body being configured to generate heat when supplied with external power, and a support body is laminated onto the glass substrate in a stacked state. The glass substrate and the support body include a plurality of lamination reference marks and a plurality of head positioning reference marks, respectively, which are disposed so as to be mutually aligned in a direction along the one surface of the glass substrate.
    Type: Grant
    Filed: September 21, 2011
    Date of Patent: May 28, 2013
    Assignee: Seiko Instruments Inc.
    Inventors: Noriyoshi Shoji, Toshimitsu Morooka, Keitaro Koroishi, Norimitsu Sanbongi
  • Patent number: 8415589
    Abstract: A heating resistance element component has a supporting substrate, an insulating film laminated on the supporting substrate, heating resistors arranged at intervals on the insulating film, a common wire connected to one end of each of the heating resistors, and individual wires each connected to another end of the each of the of heating resistors. A surface of the supporting substrate is formed with a first concave portion and a second concave portion. The first concave portion is arranged in a region opposed to heating portions of the heating resistors. The second concave portion is arranged at an interval in a vicinity of the first concave portion so that heat generated by the heating portions of the plurality of heating resistors is prevented from flowing into the supporting substrate.
    Type: Grant
    Filed: October 2, 2008
    Date of Patent: April 9, 2013
    Assignee: Seiko Instruments Inc.
    Inventors: Toshimitsu Morooka, Norimitsu Sanbongi, Yoshinori Sato, Noriyoshi Shoji, Keitaro Koroishi
  • Patent number: 8253765
    Abstract: Provided is a thermal head (1) including: a substrate body (12) constituted through bonding a flat supporting substrate (13) and a flat upper substrate (11), which are made of a glass material onto each other in a stacked state; a heating resistor (14) formed on a surface of the upper substrate (11); and a protective film (18) that partially covers the surface of the upper substrate (11) including the heating resistor (14) and protects the heating resistor (14), in which a heat-insulating concave portion (32) and thickness-measuring concave portions (34), which are open to a bonding surface between the supporting substrate and the upper substrate (11) and form cavities are provided in the supporting substrate (13), the heat-insulating concave portion (32) is formed at a position opposed to the heating resistor (14), and the thickness-measuring concave portions (34) is formed in a region that is prevented from being covered with the protective film (18).
    Type: Grant
    Filed: August 3, 2010
    Date of Patent: August 28, 2012
    Assignee: Seiko Instruments Inc.
    Inventors: Noriyoshi Shoji, Norimitsu Sanbongi, Toshimitsu Morooka, Keitaro Koroishi
  • Patent number: 8139094
    Abstract: A thermal head which forms an image on a recording medium by pressing a protruding portion on which heating elements are arranged on the recording medium while driving the heating elements to be heated includes a head body portion in which the protruding portion and a concave gap portion facing the protruding portion are formed and a heat conductive layer provided on the side of the protruding portion of the head body portion, in which the heat conductive layer includes an electric insulating layer securing electric insulation to the heating elements and a heat diffusion layer diffusing heat generated from the heating elements.
    Type: Grant
    Filed: January 29, 2009
    Date of Patent: March 20, 2012
    Assignee: Sony Corporation
    Inventors: Noboru Koyama, Mitsuo Yanase, Toru Morikawa, Kei Sato
  • Patent number: 8098268
    Abstract: A thermal head includes a glass layer provided with a groove section formed inside the glass layer, a heat generating resistor disposed outside the glass layer, and a pair of electrodes provided to both sides of the heat generating resistor, wherein a part of the heat generating resistor exposed between the pair of electrodes is defined as a heat generating section, and at least one of the pair of electrodes has a smaller width in an end section on an opposite side to a side of the heat generating section than a width of an end section on the side of the heat generating section.
    Type: Grant
    Filed: March 15, 2007
    Date of Patent: January 17, 2012
    Assignee: Sony Corporation
    Inventors: Izumi Kariya, Noboru Koyama, Mitsuo Yanase, Tooru Morikawa
  • Patent number: 8031216
    Abstract: A printer avoids scratching or damaging the platen and print defects caused by adhesive. The printer 1 prints to thermal paper S that has an adhesive area 150 formed on one side with the edges of the paper adhesive-free, and color layers formed on the other side of the paper. The thermal paper S is wound sequentially into a roll so that the other side is on the outside without applying a liner protecting the adhesive area 150 on the one side. The printer 1 has a platen 18, a heating element unit 43, and a guide incline 45. The platen 18 is disposed to a main cover, rotates in the thermal paper S transportation direction, and applies pressure to the thermal paper S from the one side. The heating element unit 43 selectively heats the other side of the paper.
    Type: Grant
    Filed: March 14, 2008
    Date of Patent: October 4, 2011
    Assignee: Seiko Epson Corporation
    Inventors: Kohei Osawa, Akira Koyabu
  • Patent number: 7965307
    Abstract: A thermal head is disclosed. The thermal head includes a heat generating element row in which plural heat generating elements are arrayed in a main scanning direction and a glaze that stores heat generated from the respective heat generating elements. The thermal head records an image on a recording medium by causing the respective heat generating elements to generate heat while conveying the recording medium in a sub-scanning direction. A plurality of the heat generating element rows are arrayed in the sub-scanning direction. The glaze includes plural convex portions arranged in the sub-scanning direction in association with the number of arrays of the heat generating element rows. The heat generating elements are arranged on upper sides of the convex portions, respectively.
    Type: Grant
    Filed: November 19, 2007
    Date of Patent: June 21, 2011
    Assignee: Sony Corporation
    Inventors: Takaaki Murakami, Yasushi Hirumi
  • Patent number: 7956880
    Abstract: A heating resistor element component has supporting substrate with a concave portion formed in a surface of the supporting substrate. A glass substrate is disposed on the surface of the supporting substrate. At least a region of the glass substrate opposite to the concave portion of the support substrate has a heterogeneous phase structure with physical properties different from those of the material of the glass substrate such that an overall mechanical strength of the glass substrate is increased. The heterogeneous phase structure is formed by laser processing using a phemtosecond laser having a power intensity of 1×106 W to 1×108 W. Heating resistors are arranged at intervals on the glass substrate and have heating portions disposed opposite to the concave portion of the supporting substrate. A common wire is connected to one end of each of the heating resistors. Individual wires are each connected to another end of each of the heating resistors.
    Type: Grant
    Filed: March 16, 2009
    Date of Patent: June 7, 2011
    Assignee: Seiko Instruments Inc.
    Inventors: Noriyoshi Shoji, Norimitsu Sanbongi, Yoshinori Sato, Toshimitsu Morooka, Keitaro Koroishi
  • Publication number: 20110063396
    Abstract: Provided are a thermal head that has a cavity portion at a position corresponding to heating resistors and is capable of improving thermal efficiency while ensuring strength of the cavity portion, and a printer including the thermal head. The thermal head (1) includes: a supporting substrate (3) including a concave portion (2) in a surface thereof; an upper substrate (5) bonded in a stacked state to the surface of the supporting substrate (3); and a heating resistor (7) provided at a position, which corresponds to the concave portion (2), of a surface of the upper substrate (5), in which a centerline average roughness of at least a region of a back surface of the upper substrate (5) is set to be less than 5 nm, the region being opposed to the concave portion (2).
    Type: Application
    Filed: September 15, 2010
    Publication date: March 17, 2011
    Inventors: Toshimitsu Morooka, Keitaro Koroishi, Noriyoshi Shoji, Norimitsu Sanbongi
  • Patent number: 7768541
    Abstract: Provided is a heating resistor element including: an insulating substrate including a glass material; a heat accumulating layer bonded to the insulating substrate through heating to temperature ranging from an annealing point to a softening point in a state of being adhered to a surface of the insulating substrate, and including the same material as the glass material of the insulating substrate; and a heating resistor provided on the heat accumulating layer, in which, on at least one of bonded surfaces between the insulating substrate and the heat accumulating layer, at least one of the insulating substrate and the heat accumulating layer is provided with a concave portion in a region opposed to the heating resistor to form a hollow portion. Accordingly, deformation caused by a difference in coefficient of thermal expansion is suppressed to improve printing quality.
    Type: Grant
    Filed: October 20, 2008
    Date of Patent: August 3, 2010
    Assignee: Seiko Instruments Inc.
    Inventors: Keitaro Koroishi, Toshimitsu Morooka, Noriyoshi Shoji, Yoshinori Sato, Norimitsu Sanbongi
  • Patent number: 7522178
    Abstract: A thermal head is structured to have a substrate, a thermal storage layer formed on one surface of the substrate and made of glass, and heating resistors provided on the thermal storage layer. A plurality of hollow portions are formed at a position spaced apart from a surface where the heating resistors are formed by laser processing using a femtosecond laser, in an area of the thermal storage layer which is opposed to the heating resistors. In this way, to provide a heating resistance element for improving heating efficiency of heating resistors to reduce power consumption, improving strength of a substrate under the heating resistors, and for enabling simple manufacture at a low cost, a thermal head and a printer using the same, and a method of manufacturing a heating resistance element.
    Type: Grant
    Filed: October 19, 2006
    Date of Patent: April 21, 2009
    Assignee: Seiko Instruments Inc.
    Inventors: Noriyoshi Shoji, Yoshinori Sato, Toshimitsu Morooka
  • Patent number: 7414641
    Abstract: Both ends of a head substrate in a longitudinal direction warp in a direction away from a cross section of a print substrate (in the convex shape) when a sealing resin is cured. A central portion of the head substrate in a longitudinal direction warps in a direction away from the cross section of the print substrate (in the concave shape) when heating elements emit heat. A curing condition when curing the sealing resin is changed corresponding to the concave-shaped warpage occurring when the heating elements emit heat, such that the convex-shaped warpage of the head substrate occurring when the sealing resin is cured is offset by the concave-shaped warpage of the head substrate and thus the heating elements are arranged in a straight line when the heating elements emit heat at the time of printing.
    Type: Grant
    Filed: December 21, 2006
    Date of Patent: August 19, 2008
    Assignee: Alps Electric Co., Ltd
    Inventors: Tsuneyuki Sasaki, Hirotoshi Terao
  • Patent number: 7250960
    Abstract: A thermal head includes a head substrate having a plurality of heating resistors which generate heat by electrical dissipation, a common electrode connected to one end of each heating resistor, and a plurality of individual electrodes connected to the other ends of the respective heating resistors. The head substrate is disposed on a heat-dissipation plate. A wide-gap stepped portion is disposed in correspondence with at least a location of the head substrate directly below the heating resistors, and increases an interval between an adhesion surface of the head substrate and an adhesion surface of the heat-dissipation plate. A resilient adhesive capable of absorbing thermal strain is interposed between the adhesion surface of the heat-dissipation plate and the adhesion surface of the head substrate in an adhesion plane where the wide-gap stepped portion is disposed.
    Type: Grant
    Filed: March 29, 2005
    Date of Patent: July 31, 2007
    Assignee: Alps Electric Co., Ltd.
    Inventors: Tsutomu Takeya, Kazuhiko Nakazawa, Shigeto Yamada, Masaru Sakurai
  • Patent number: 7110015
    Abstract: A thermal printing device includes a substrate, an insulation layer on the substrate, and a plurality of microheaters on the insulation layer. Two adjacent ones of the microheaters are separated by a trench. Each of the microheaters includes a body having a heating surface, and two metal wires disposed on two sides of the heating surface of the body. A thermal printing operation is performed by applying a variable voltage or current between the two metal wires in order to heat the microheater to a predetermined temperature.
    Type: Grant
    Filed: March 24, 2004
    Date of Patent: September 19, 2006
    Assignee: LighTuning Tech. Inc.
    Inventor: Bruce C. S. Chou
  • Patent number: 6456312
    Abstract: A thermal head includes a heat radiating plate and an electrical insulating substrate which is provided with a plurality of resistance heater elements arranged in a direction over a predetermined length and a plurality of electrodes for energizing the resistance heater and is integrated with the heat radiating plate. The substrate is smaller than the heat radiating plate in coefficient of thermal expansion and is fixed to the heat radiating plate at a temperature higher than the normal working temperature range of the thermal head. In the normal working temperature range of the thermal head, the thermal head is convex toward the resistance heater in a cross-section taken along a line parallel to the direction in which the resistance heater elements are arranged due to the difference in coefficient of thermal expansion between the heat radiating plate and the substrate.
    Type: Grant
    Filed: August 30, 2000
    Date of Patent: September 24, 2002
    Assignee: Riso Kagaku Corporation
    Inventor: Hikaru Oike
  • Patent number: 6339444
    Abstract: A thermal head of the present invention comprises a substrate (1221) consisting of a metal such as a stainless steel, insulating layers (1226, 1223), with raised portions (1225, 1224) being formed by raising up a part of the surface thereof, and exothermic resistors (1228, 1229) formed on the raised portions. Common electrodes (1222, 1227) are disposed on the substrate, which protrude from the surface of the substrate, penetrate through the raised portions and are connected to the exothermic resistors, to thereby divide the resistors into first exothermic resistors and second exothermic resistors, centering on the connecting point.
    Type: Grant
    Filed: November 8, 2000
    Date of Patent: January 15, 2002
    Assignee: Shinko Electric Co., Ltd.
    Inventor: Hayami Sugiyama
  • Patent number: 6239826
    Abstract: A thermal head includes a heat radiating plate and an electrical insulating substrate which is provided with a plurality of resistance heater elements arranged in a direction over a predetermined length and a plurality of electrodes for energizing the resistance heater and is integrated with the heat radiating plate. The substrate is smaller than the heat radiating plate in coefficient of thermal expansion and is fixed to the heat radiating plate at a temperature higher than the normal working temperature range of the thermal head. In the normal working temperature range of the thermal head, the thermal head is convex toward the resistance heater in a cross-section taken along a line parallel to the direction in which the resistance heater elements are arranged due to the difference in coefficient of thermal expansion between the heat radiating plate and the substrate.
    Type: Grant
    Filed: August 30, 2000
    Date of Patent: May 29, 2001
    Assignee: Riso Kagaku Corporation
    Inventor: Hikaru Oike
  • Patent number: 5949465
    Abstract: A thermal printhead according to the present invention includes a substrate (2) of an insulating material, a heating resistor (3) formed on the substrate (2) to form a plurality of heating dots, a conductor pattern (5, 6) formed on the substrate (2) for electrical connection to the heating resistor (3), and driving elements mounted on the substrate (2) for selectively heating the heating dots via the conductor pattern (5, 6). The substrate (2) has, at the position of the heating resistor (3), a raised portion (2a) and the substrate (2) has, in its wall thickness at the position of the raised portion (2a), a hollow portion (10) extending along the heating resistor (3). The present invention also provides a method for making the substrate (2).
    Type: Grant
    Filed: December 6, 1996
    Date of Patent: September 7, 1999
    Assignee: Rohm Co., Ltd.
    Inventors: Hideo Taniguchi, Shinobu Obata, Hiroshi Kinoshita
  • Patent number: 5940109
    Abstract: A thermal printhead according to the present invention includes a substrate (2) of an insulating material having a substantially flat surface, a heating resistor (3) formed on the substrate (2) to form a plurality of heating dots, a conductor pattern (5, 6) formed on the substrate for electrical connection to the heating resistor (3), and driving elements mounted on the substrate (2) for selectively heating the heating dots via the conductor pattern (5, 6). The substrate (2) has, in its wall thickness, a hollow portion (10) extending along the heating resistor (3). The present invention also provides a method for making the substrate (2).
    Type: Grant
    Filed: October 30, 1997
    Date of Patent: August 17, 1999
    Assignee: Rohm Co. Ltd.
    Inventors: Hideo Taniguchi, Shinobu Obata, Hiroshi Kinoshita
  • Patent number: 5903297
    Abstract: Disclosed is a thermal recording apparatus for forming a desired visual image on a recording medium disposed on the opposite side, by utilizing a thermal energy of heating elements provided on a substrate. In the thermal recording apparatus using a thermal head comprising a plurality of substrates on which the heating elements are arranged in line, the joint section of these substrates is positioned in an auxiliary information recording area outside of the image recording width, thus enabling to increase the recording width without deteriorating the recording quality of a visual image to be recorded. That is, in the present invention, one substrate is at least as wide as the image recording area, and another substrate having heating elements also disposed in line is connected to both sides, or one side, of the substrate for image recording, thereby enabling recording the image nearly at the center of the recording medium and also recording an auxiliary information of the image in a margin.
    Type: Grant
    Filed: December 18, 1996
    Date of Patent: May 11, 1999
    Assignee: Japan Servo Co., Ltd.
    Inventors: Naotaka Sasaki, Shunichi Kawamata, Kenji Sugaya, Atsushi Morita
  • Patent number: 5874983
    Abstract: The printing cost is minimized by reducing the number of parts of a thermal print head used for printers, for such as a facsimile, and the quality of a printed product is improved by preventing the warpage of the thermal print head. A base plate mounting surface of a heat radiation plate (2) is provided with a longitudinally extending mounting surface dividing groove (5). A head base plate (3) having a heating resister (6) for printing and a circuit board (4) having a connector (10) for external connection are fixed on the base plate mounting surface. The two plates (3, 4) are arranged so as to be opposed to each other with the mounting surface dividing groove positioned therebetween. Terminal electrodes (8, 11) provided on groove-side edge portions of the head base plate and circuit board are connected together by a terminal lead (9).
    Type: Grant
    Filed: January 7, 1998
    Date of Patent: February 23, 1999
    Assignee: Rohm Co., Ltd.
    Inventors: Takaya Nagahata, Tadayoshi Sato
  • Patent number: 5861902
    Abstract: The present invention is a thermal printhead which includes a substrate portion, a resistive material configured to form a heating element and a thermal barrier island positioned between the resistive material and the substrate portion. The thermal barrier island is defined between the heating element and the substrate portion to reduce the heat flow between the heating element and the substrate portion.
    Type: Grant
    Filed: April 24, 1996
    Date of Patent: January 19, 1999
    Assignee: Hewlett-Packard Company
    Inventor: Timothy E. Beerling
  • Patent number: 5739837
    Abstract: A thermal printhead according to the present invention includes a stepped heat sink plate (1) having an upper first supporting surface (1a) and a lower second supporting surface (1b), a head substrate (2) mounted on the first supporting surface (1a) of the heat sink plate (1) and formed with printing dots (3), and a printed circuit board (14) mounted on the second supporting surface (1b) of the heat sink plate (1) and formed with various wiring patterns. The head substrate (2) has an edge projecting from the first supporting surface (1a) of the heat sink plate (1) toward the second supporting surface (1b). The printed circuit board (14) overlaps the projecting edge of the head substrate (2) with a predetermined spacing (18) therebetween.
    Type: Grant
    Filed: May 16, 1996
    Date of Patent: April 14, 1998
    Assignee: Rohm Co. Ltd.
    Inventors: Takaya Nagahata, Tokihiko Kishimoto, Koji Nishi, Masanori Minamino
  • Patent number: 5661513
    Abstract: To realize a high-quality and high-speed printing which can sufficiently comply with high definition, a thermal head having a high heat resistance and excellent thermal responsivity comprises a high thermal conductivity substrate, a heat accumulating layer formed on the surface of the substrate, a plurality of heater elements formed on the surface of the heat accumulating layer in line, a common electrode and an individual electrode energizing each of the heater elements, and a protective layer formed so as to cover the heat accumulating layer, the heater elements and the electrodes, wherein a stress-resistant layer composed of an insulating high-modulus ceramic is provided on the surface of the heat accumulating layer.
    Type: Grant
    Filed: September 24, 1996
    Date of Patent: August 26, 1997
    Assignee: Alps Electric Co., Ltd.
    Inventors: Takashi Shirakawa, Toshifumi Nakatani, Toshiya Endoh
  • Patent number: 5660486
    Abstract: An image printing device includes a latent image charge keeping medium including a pyroelectric layer, a thermal head for selectively heating the charge keeping medium according to a signal, and an electrically conductive film disposed to be brought into contact with or to be in the vicinity of a surface of the pyroelectric layer of the medium for being heated by the thermal head, thereby neutralizing charge appearing on the medium due to pyroelectric effect. The device further includes a developer for visualizing with a charged coloring medium an electrostatic latent image formed on the medium, a transfer roller for transferring the developed image onto a sheet of printing paper, and a fixing device for fixing the transferred image on the printing sheet. The conductive layer is applied with a bias voltage from a power source such that a strong absorbing force acts upon charge, thereby efficiently neutralizing the charge.
    Type: Grant
    Filed: May 23, 1995
    Date of Patent: August 26, 1997
    Assignee: NEC Corporation
    Inventors: Masakazu Okuda, Yasuhiro Otsuka
  • Patent number: 5568175
    Abstract: A thermal print head, including a resistance substrate having a front and rear surface, a plurality of heating elements formed on the front surface of the resistance substrate for converting electrical energy into heat energy, a cooling board for dissipating heat generated from the heating elements and the resistance substrate, wherein the cooling board is divided into separable first and second parts, the first part being disposed opposite the rear surface of the resistance substrate and below the heating elements; and a cooling compound with high thermal conductivity inserted between the first part of the cooling board and the rear surface of the resistance substrate.
    Type: Grant
    Filed: November 6, 1995
    Date of Patent: October 22, 1996
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Suhn-Ji Suh, Hong-Geun Yang
  • Patent number: 5444475
    Abstract: A thin-film thermal recording head, used in a facsimile machine or a thermal printer, including heat resistors formed from only a Cr--Si--SiO or Ta--Si--SiO alloy thin-film resistor layer and a chromium, molybdenum, nickel, or tungsten thin-film conductor layer. The heat resistor is formed on a substrate having a linear thermal expansion coefficient from room temperature to 300.degree. C. of 5.times.10.sup.-8 /.degree.C. or less. The heat resistor is also described having a thin anti- abrasion layer with thickness of 0.5 .mu.m or less. The thin-film thermal recording head is also described in monolithic form with a portion of the heat resistor formed to directly contact an output electrode of a drive LSI circuit. In this case, a double-layer thermal-insulation layer can be formed between the substrate and the portion of the heat resistor that contacts and heats heat-sensitive recording paper. The two layers of the thermal-insulation layer are formed from a heat-resistant resin and an inorganic insulator.
    Type: Grant
    Filed: July 6, 1993
    Date of Patent: August 22, 1995
    Assignee: Hitachi Koki Co., Ltd.
    Inventor: Masao Mitani