Abstract: An example of a device (100) may include a valve body (108). The device may include a printing substance transfer window (122) through the valve body (108). The device (100) may include a printing substance dispensing nozzle (110) rotatable within the valve body (108) between a first orientation with an orifice of the printing substance dispensing nozzle (110) facing an internal face of the valve body (108) and a second orientation with the orifice (126) of the printing substance dispensing nozzle (110) facing the printing substance transfer window (122). The device (100) may include a dispensing-side gasket material (132) slideable against the internal face of the valve body (108) when rotating the printing substance dispensing nozzle (110) between the first orientation and the second orientation.

Abstract: A liquid ejecting apparatus includes a liquid ejecting head including head chips each including a nozzle plate, a holder that is formed of resin, holds the head chips, and includes a flow path for supplying the liquid to each of the head chips, a holder cover that is formed of a material having a higher thermal conductivity than a thermal conductivity of the holder and houses the head chips and the holder, and a fixing plate that is formed of metal and to which the holder cover and the head chips are fixed, a carriage on which the liquid ejecting head is mounted, and a heater that is mounted on the carriage and heats the liquid inside each of the head chips via the holder cover and the fixing plate.

Abstract: Provided is an ink-jet head including: a back end portion; a front end portion which ejects the ink; a heating plate which is arranged between the back end portion and the front end portion, and which heats the back end portion and the front end portion; and a temperature detection device which is provided on the heating plate, and which outputs a value in accordance with a temperature of the front end portion, the temperature detection device being held in direct contact with the front end portion.

Abstract: A plurality of head chips including: a nozzle plate having a plurality of nozzles configured to eject a liquid in a first direction, and a case having one or more first flow paths communicating with at least a part of the plurality of nozzles; a holder to which the plurality of head chips are fixed, which includes metal or ceramics, and which has a plurality of second flow paths communicating with at least one of the plurality of first flow paths; and a heater configured to heat the holder.

Abstract: A microfluidic ejection chip includes a silicon substrate having a fluid passageway. The fluid passageway is defined by a silicon sidewall of the silicon substrate that is covered by a permanent passivation layer to protect the silicon sidewall from exposure to an acidic fluid. The permanent passivation layer is retained on the silicon sidewall at a conclusion of etching of the silicon substrate to form the fluid passageway.

Abstract: There is provided a method of manufacturing a liquid ejection head. The liquid ejection head includes a recording device substrate, an electric wiring member configured to be connected to the recording device substrate at an electric connection portion, and a support member including a concave portion and a convex portion. The convex portion includes a first surface and a second surface. The method includes applying an adhesive to the surface of the concave portion on which the recording device substrate is to be placed and to the first surface, pressing the applied adhesive after the recording device substrate is placed on the surface of the concave portion on which the recording device substrate is to be placed, to fill, with the adhesive, a gap between the convex portion and the recording device substrate to a position higher than the first surface, and sealing the electric connection portion.

Abstract: An aqueous-based inkjet ink for a thermal inkjet printhead includes: a pigment; 2 to 90 ppm ammonium ions; and an ink vehicle. The ink has a pH in the range of 8 to 9.5 and exhibits improved lifetime in thermal inkjet printheads with minimal loss of print quality.

Abstract: An assembly, in an example, may include at least one die, a substrate comprising at least one electrical trace, a lid coupled to a first side of the substrate to contain an amount of fluid between the substrate and lid, and an adhesive film coupled to a second side of the substrate to protect the at least one electrical trace wherein the lid further comprises a main chamber for each of at least two distinct fluids and an overflow chamber fluidically coupled to each of the main chambers via an overflow channel.

Abstract: Examples include a fluidic device comprising a fluidic die, a support element, and a conductive member. The support element is coupled to the fluidic die, and the support element has a fluid channel formed therein. The fluid channel exposes at least a portion of a back surface of the fluidic die. The support element further includes a member opening passing therethrough. The conductive member is connected to the fluidic die, and the conductive member is a least partially disposed in the member opening such that a portion of the conductive member is exposed to the fluid channel of the support element.

Abstract: Examples include a fluid ejection die having a die length and a die width. The fluid ejection die may include a plurality of nozzles arranged along the die length and a die width. The plurality of nozzles is arranged such that at least one pair of neighboring nozzles are positioned at different die width positions along the width of the fluid ejection die. The example fluid ejection die further includes a plurality of ejection chambers including a respective ejection chamber fluidically coupled to each respective nozzle. The fluid ejection die further includes an array of fluid feed holes. The array of fluid feed holes includes a first respective fluid feed hole fluidically coupled to each respective ejection chamber, and the array of fluid feed holes includes a second respective fluid feed hole fluidically coupled to each respective ejection chamber.

Abstract: A fluid propelling apparatus, including a plastic compound, a MEMS at least partially surrounded by the compound, and a heat sink next to the MEMS, to transfer heat away from the MEMS, wherein the heat sink is at least partly surrounded by the compound.

Abstract: A method for manufacturing an opening structure is provided. The method may include: forming a patterned mask over a first side of a carrier; forming material over the first side of the carrier covering at least a portion of the carrier; forming a first opening in the carrier from a second side of the carrier opposite the first side of the carrier to at least partially expose a surface of the patterned mask; and forming a second opening in the material from the second side of the carrier using the patterned mask as a mask.

Abstract: In some examples, a fluidic die includes a substrate, a fluidic region comprising fluid chambers formed in a fluidic barrier layer supported by the substrate, fluidic actuators associated with the fluid chambers, electrical structures positioned away from the fluidic region, a metallic layer over the fluidic actuators, and an adherent barrier layer to adhere the metallic layer to the fluidic barrier layer. The adherent barrier layer includes a first adherent barrier layer portion comprising a dielectric layer and an adhesion layer, and a second adherent barrier layer portion comprising the adhesion layer and without the dielectric layer, the first adherent barrier layer portion formed over the electrical structures, and the second adherent barrier layer portion formed in the fluidic region, the adhesion layer of the second adherent barrier layer portion protruding into the fluid chambers.

Abstract: A package structure including a wiring substrate, conductive terminals, an insulating encapsulation, a redistribution circuit structure, guiding patterns and a semiconductor device. The conductive terminals are disposed on a surface of the wiring substrate. The insulating encapsulation laterally encapsulates the wiring substrate and the conductive terminals. The redistribution circuit structure is disposed on the insulating encapsulation and the conductive terminals, and the redistribution circuit structure is electrically connected to the wiring substrate through the conductive terminals. The guiding patterns are disposed between the wiring substrate and the redistribution circuit structure, and the guiding patterns are in contact with and encapsulated by the insulating encapsulation.

Abstract: In one example, a fluid flow structure includes a micro device embedded in a monolithic molding having a channel therein through which fluid may flow directly to the device.

Abstract: A method of manufacturing a liquid ejection head including a first step of having a molten resin becoming a first portion flow in between a first position in a first mold and a first position in a second mold and the molten resin becoming a second portion flow in between a second position in the first mold and a second position in the second mold; a second step of relatively moving the first and second molds, after opening the molds; a third step of closing the molds; a fourth step of joining the first and second portions, a fifth step of taking out the first and second portions and the sealing portion from the molds and mounting a recording element substrate; and a step of forming a space portion between a liquid supply path surface and a mounting surface.

Abstract: A system and apparatus includes a nozzle formed on a first surface of a substrate, and a fluid passage in the substrate and fluidically connected to the nozzle, the fluid passage being nonlinear along at least a portion of its length and having a cross section that varies along its length, wherein the fluid passage has a width near a second surface of the substrate that is different from a width near a bottom of the fluid passage. A system and apparatus includes a nozzle formed on a surface of a substrate, and a fluid passage defined in the substrate and fluidically connected to the nozzle, the fluid passage having a first portion that substantially lies on a first plane, a second portion that substantially lies on a second plane different from the first plane, and a connecting passage fluidically connecting the first portion to the second portion.

Abstract: In some examples, a circuit for a fluid ejection device includes an energy delivery device and a circuit layer. The circuit layer includes first and second activation devices connected to the energy delivery device, the first and second activation devices to activate the energy delivery device, first drive logic coupled to the first activation device, and second drive logic coupled to the second activation device. An interconnect layer couples a same address selection signal to the first drive logic and the second drive logic.

Abstract: An inkjet recording apparatus includes a conveying unit, a recording unit, a heat source, a heat source moving unit and a heat source moving control unit. The conveying unit performs a conveying operation to move a conveying member thereby conveying a recording medium placed on a conveying surface of the conveying member. The recording unit records an image by ejecting ink to the recording medium conveyed by the conveying unit. The heat source moving unit moves the heat source. The heat source moving control unit moves the heat source by the heat source moving unit such that a distance between the heat source and the conveying surface increases when the conveying operation which is performed by the conveying unit stops in a manner in which the conveying operation can be resumed in a state where the heat source is positioned in proximity of the conveying surface.

Abstract: Provided is a liquid ejection head including: a substrate; an energy-generating element, which is arranged on the substrate, and is used for ejecting a liquid; a flow path forming member, which has an ejection orifice for ejecting the liquid, and is configured to form a flow path of the liquid between the flow path forming member and the substrate; an electrode configured to generate a flow of the liquid; and a wiring, which is arranged so as to be brought into contact with the flow path forming member, and is configured to supply electric power to the electrode, in which the flow path forming member contains an organic material, and in which the electrode and the wiring are each formed of a conductive adhesive layer containing at least one of conductive diamond-like carbon or tin-doped indium oxide.

Abstract: The present invention relates to a thermal inkjet print head, comprising a fluid feed channel for delivering fluid, fluid chambers arranged near the fluid feed channel, resistors for actuating the fluid in the chambers, arranged in a staggered pattern with respect to vertical printing lines. At least a part of the fluid feed channel opposite of a rear side of the print head extends substantially orthogonal to the chip surface, and the fluid channel having staggered edges follows the staggered pattern of the resistors so that a fluid path length between a resistor edge and a corresponding staggered edge is substantially similar for each resistor.

Abstract: An integrated semiconductor heating assembly includes a semiconductor substrate, a chamber formed therein, and an exit port in fluid communication with the chamber, allowing fluid to exit the chamber in response to heating the chamber. The integrated heating assembly includes a first heating element adjacent the chamber, which can generate heat above a selected threshold and bias fluid in the chamber toward the exit port. A second heating element is positioned adjacent the exit port to generate heat above a selected threshold, facilitating movement of the fluid through the exit port away from the chamber. Addition of the second heating element reduces the amount of heat emitted per heating element and minimizes thickness of a heat absorption material toward an open end of the exit port. Since such material is expensive, this reduces the manufacturing cost and retail price of the assembly while improving efficiency and longevity thereof.

Abstract: According to an example, a printhead including a thin film passivation layer, an adhesion layer, and a fluidics layer; wherein the thin film passivation layer is an atomic layer deposition thin film layer is disclosed.

Abstract: A liquid discharge head includes a pressure chamber that accommodates a liquid, a diaphragm that forms a wall surface of the pressure chamber, and a piezoelectric element that is provided on an opposite side of the pressure chamber with the diaphragm interposed between the piezoelectric element and the pressure chamber and vibrates the diaphragm. The diaphragm includes a silicon oxynitride layer formed with including silicon oxynitride.

Abstract: A semiconductor device used for a liquid discharge head is provided. The device includes a wiring layer, an insulating member formed above the wiring layer, a heat generation element arranged above and in contact with the insulating member, and electrically connected to the wiring layer, a metal member arranged above and in contact with the insulating member, and electrically connected to the wiring layer, and an electrically conductive member covering an upper surface of the metal member and electrically connected to the wiring layer through the metal member. A resistivity of the electrically conductive member is less than a resistivity of the metal member and a resistivity of the heat generation element. The heat generation element and the metal member are separated from each other.

Abstract: In one example, a printhead structure includes an ejector element, a multi-layer insulator covering the ejector element, and an amorphous metal on the insulator.

Abstract: In one example, a method for fabricating a printhead is described. The method may include applying an electrical interconnect between a printhead die and an electrical fan out structure embedded in a molding of a printhead via a direct patterning additive process. The method may further include applying a passivation layer over the electrical interconnect as a dry film laminate.

Abstract: A liquid ejection head, including: nozzles; and a supply passage through which a liquid is supplied to the nozzles, wherein the supply passage includes (a) a first flow passage and (b) a second flow passage connected to the first flow passage and including two sections that extend in different directions from a connected position at which the first flow passage is connected to the second flow passage, the liquid being supplied to the second flow passage from the first flow passage, wherein the second flow passage has a liquid flow resistance larger in a first section than in a second section, and wherein a protrusion protruding toward the first flow passage is provided on an inner wall surface of the second flow passage facing the first flow passage, for permitting the liquid to more easily flow from the first flow passage into the first section than the second section.

Abstract: Provided is a fabrication method of print head of MCM device formed micro patterned air gap capable of picoliter-scale droplet printing, and more particularly, is characterized in that comprising preparing silicon wafer 10 washed by piranha solution at step A, stacking silicon nitride films 20 and 20? up front surface and back surface of prepared silicon wafer at step B, drying after applying photoresists 30 and 30? to top surface and bottom surface of the silicon nitride film 20 and 20? at step C, removing partially the photoresists through pre-determined pattern by irradiation of ultraviolet after arranging photomask 40 formed through pre-determined pattern in any one side of the photoresists 30 and 30? at step D, forming sample droplet storage space opening by removing silicon nitride film 21 contacted to photoresists removed by pre-determined pattern at step E, removing the photoresists 30 and 30? stacked up the silicon nitride film 20 and 20? at step F, forming sample droplet storage space 50 by etching

Abstract: A fluid dispenser may include an array of fluid delivery assemblies. Each fluid delivery assembly may include orifices through which fluid is to be ejected and slots. Each slot extends to a respective one of the orifices. The slots have different geometric shapes.

Abstract: In accordance with embodiments herein, microfluidics systems and methods are described for identifying and/or tracking particles in a droplet. For example, the particle may be a bead, a cell, or any other type of particle. For example, embodiments herein are useful in distinguishing cells from other particles. The microfluidics systems and methods provide the capability to image a large area (e.g., a few square millimeters) within a digital fluidics chamber using interference microscopy, wherein the image of the interference pattern is acquired, instead of an image of the micrometric object itself. The interference pattern results from the incoming light that interferes with the light scattered by the object. In the case of micrometric objects (e.g., cells, bacteria, etc.), the acquired interference pattern may typically be about 100 jum in diameter so that the area can be imaged using a lens-free imaging configuration or using a low magnification lens.

Abstract: The present subject matter relates to a printhead assembly comprising a plurality of print nozzles in a nozzle array. Each of the plurality of print nozzles is coupled to a printhead firing resistor, the printhead firing resistor being individually addressable. A print control circuit is to actuate the printhead firing resistor. In accordance with one example implementation of the present subject matter, the print control circuit comprises pull-down resistors made of Tantalum-Aluminum (Ta—Al).

Abstract: An inkjet printhead including: an elongate fluid manifold having a plurality of fluid outlets positioned longitudinally along a base of the fluid manifold, each neighboring pair of fluid outlets being separated by a support web; and a plurality of butting printhead chips arranged in a row and attached to the base of the fluid manifold, each printhead chip receiving a printing fluid from one or more fluid outlets. Each butting pair of printhead chips has respective butting end portions commonly supported by one of the support webs.

Abstract: A liquid discharge apparatus has a head provided with discharge sections which discharge a liquid, a drive circuit configured to generate driving signals for driving the discharge sections and discharging the liquid, a carriage mounted with the head and the drive circuit, a motor configured to move the carriage, and a flushing box configured and arranged to receive the liquid discharged from the discharge sections. The drive circuit is mounted at a position so as not to pass above the flushing box while the carriage is being moved.

Abstract: An inkjet printhead includes: an elongate fluid manifold having a base defining a plurality of fluid outlets; and a plurality of printhead chips attached to the base of the fluid manifold, each printhead chip receiving ink from one or more fluid outlets. Each fluid outlet extends transversely across the ink manifold and extends at least half a width of each printhead chip.

Abstract: A liquid ejection head, including: nozzles; and a supply passage through which a liquid is supplied to the nozzles, wherein the supply passage includes (a) a first flow passage and (b) a second flow passage connected to the first flow passage and including two sections that extend in different directions from a connected position at which the first flow passage is connected to the second flow passage, the liquid being supplied to the second flow passage from the first flow passage, wherein the second flow passage has a liquid flow resistance larger in a first section than in a second section, and wherein a protrusion protruding toward the first flow passage is provided on an inner wall surface of the second flow passage facing the first flow passage, for permitting the liquid to more easily flow from the first flow passage into the first section than the second section.

Abstract: The examples provide a fluid ejection apparatus that includes a fluid slot; a passage, a drop generator and a fluid circulation pump. The passage has an inlet connected to the fluid slot and an outlet spaced from the inlet and connected to the fluid slot. The passage as a first portion extending in a first direction from the inlet and a second portion extending from the first portion to the outlet in a second direction, opposite to the first direction. A filter is within the fluid slot across the inlet.

Abstract: A co-extrusion print head has at least one channel, and a set of orifices fluidically connected to the channel, wherein the set of orifices has at least one orifice at each edge of the set has a smaller vertical extent than the other orifices.

Abstract: A fluid ejection head assembly having improved assembly characteristics and methods of manufacturing a fluid ejection head assembly. The fluid ejection head includes a fluid supply body having at least one fluid supply port in a recessed area therein and a semiconductor chip attached in the recessed area of the fluid supply body adjacent the fluid supply port using a thermal cure adhesive. A compression prevention body having a coefficient of thermal expansion ranging from about 1.0 to less than about 30 microns/meter per ° C. disposed adjacent to the fluid supply port of the fluid supply body and the semiconductor chip.

Abstract: A method of printing, including providing a fluid ejection device that includes a substrate, a plurality of drive units formed on the substrate, each drive unit including at least two drive elements electrically coupled in parallel, and a plurality of fluid ejection elements disposed on the substrate, each fluid ejection element of the plurality of fluid ejection elements electrically coupled with a single respective drive unit. Electrical power is selectively supplied via the plurality of drive units to the plurality of fluid ejection elements to cause fluid to be expelled from the fluid ejection device based on image data.

Abstract: The present disclosure includes a method of fabricating a thermal ink jet printhead including depositing a first metal layer having a thickness to form a power bus, deposing a first dielectric layer, forming a via in the first dielectric layer to connect the first metal layer to a second metal layer, depositing the second metal layer, depositing a resistive layer, forming a thermal resistor in the resistive layer, depositing a second dielectric layer, and removing a portion of the second dielectric layer.

Abstract: A liquid ejection head substrate includes a heating resistor array including a plurality of heating resistors and a protective film covering at least one of the heating resistors. The liquid ejection head substrate further includes a supply opening array and an electrode. The supply opening array is disposed on a side of a surface of the liquid ejection head substrate on which the protective film is provided. The supply opening array includes a plurality of supply openings through which a liquid is supplied arranged in a direction along the heating resistor array. The electrode is disposed on the side of the surface in a space between the supply openings adjacent to each other in a direction along the supply opening array. The electrode is configured such that a voltage is applied between the electrode and the protective film.

Abstract: A liquid ejecting head includes a first nozzle row in which nozzles which eject a liquid are juxtaposed along a first direction, first drive elements which cause the liquid to be ejected from each nozzle of the first nozzle row, a plurality of first individual wirings which are connected to the first drive elements, a first common wiring which is connected in common to the first drive elements, a second nozzle row in which nozzles are juxtaposed along the first direction, second drive elements which cause the liquid to be ejected from each nozzle of the second nozzle row, a plurality of second individual wirings which are connected to the second drive elements, and a second common wiring which is connected in common to the second drive elements and is not connected to the first common wiring. The plurality of first individual wirings, the first common wiring, the second individual wirings, and the second common wiring are connected to a common flexible cable.

Abstract: A liquid discharge head has a chamber wall member forming a liquid chamber and a discharge head substrate containing a laminate of a base substrate having a surface for an element generating energy for discharging liquid. A first and second layer is formed contacting the wall. The second layer has adhesiveness with the chamber wall member higher than adhesiveness of the first layer, forming the liquid chamber with the chamber wall member. The first layer has a portion exposed from the second layer as viewed from a first direction orthogonal to the surface and contacting the chamber wail member at a position distant from the liquid chamber in a second direction orthogonal to the inner surface of the wall relative to a portion where the wall and second layer contact, and the length in the second direction of the portion of the first layer is 0.3 ?m or more.

Abstract: Interactive décor and systems and methods of printing an interactive pattern using an inkjet printer are disclosed. An interactive décor may comprise a substrate, and an interactive pattern printed on the substrate. The interactive pattern is addressable using a reader device, but is substantially indiscernible to a naked eye at a viewing distance. A decorative image is printed over the interactive pattern. The decorative image is predominant to the naked eye.

Abstract: A method for producing a base substrate includes preparing an insulator substrate; forming a first film containing, as a main component, a metal that contains at least one of tungsten and molybdenum and has a melting point of 1000° C. or higher on the insulator substrate; forming a second film containing nickel as a main component and also containing boron on the first film; forming a first metal layer by performing a sintering treatment of the first film and the second film; and forming a second metal layer containing palladium as a main component on the first metal layer.

Abstract: A liquid ejection head includes a first recording element substrate, a second recording element substrate, and an electric wiring substrate. The first and second recording element substrates each includes an energy generating element that generates energy for ejecting a liquid, and an electroconductive protective film that is disposed so as to cover at least the energy generating element. The electric wiring substrate includes wiring for supplying electric power to the first and second recording element substrates. The electroconductive protective film of the first recording element substrate and the electroconductive protective film of the second recording element substrate are electrically connected to each other through the electric wiring substrate.

Abstract: Methods of fabricating a printhead having integrated inkjet nozzles are disclosed. The methods include injection molding the printhead having a plurality of manifold features and embossing jet features extending between the manifold features and an outer surface of the printhead.

Abstract: A method of manufacturing a print element substrate, comprising preparing a substrate, including a first region and a second region, in which a printing portion is formed on the first region, and a wiring pattern connected to the printing portion is formed on the first region and the second region, forming an insulating film covering the printing portion and the wiring pattern, and forming a conductive cavitation-resistant film on the insulating film, wherein in the forming the insulating film, the insulating film is formed such that a side surface of a portion of the insulating film, which is formed on the second region, includes an inclined face.

Abstract: The present disclosure relates generally to plasmonic substrates and specifically to high-throughput trapping of particles on a plasmonic substrate.