Flow Path Patents (Class 347/65)
  • Patent number: 11110705
    Abstract: A liquid-discharging-head substrate includes an insulation layer, an electrode, and a heating resistor element, wherein the insulation layer includes a first opening portion including a first opening formed in a surface of the insulation layer, a second opening having a smaller opening area than an opening area of the first opening, and a surface connecting the first opening and the second opening, and a second opening portion extending from the second opening to a back surface of the insulation layer, wherein the electrode is formed in the second opening portion, and a surface of the electrode is exposed from the second opening when viewed from the surface side of the insulation layer, and wherein the heating resistor element is in contact with the surface connecting the first opening and the second opening, and with the surface of the electrode.
    Type: Grant
    Filed: November 20, 2018
    Date of Patent: September 7, 2021
    Assignee: Canon Kabushiki Kaisha
    Inventors: Soichiro Nagamochi, Hirokazu Komuro
  • Patent number: 11090937
    Abstract: In a liquid ejection head, ejection orifices can be densely arranged while suppressing decrease in liquid flow speed. A channel extending through a pressure chamber extends in a direction crossing an ejection orifice array such that a liquid flows between the two ends of the channel located on the sides of the ejection orifice array.
    Type: Grant
    Filed: November 13, 2019
    Date of Patent: August 17, 2021
    Assignee: Canon Kabushiki Kaisha
    Inventors: Yoshiyuki Nakagawa, Kazuhiro Yamada, Takuro Yamazaki, Toru Nakakubo, Ryo Kasai
  • Patent number: 11014392
    Abstract: According to the invention, there is provided a recording method which includes adhering an ink composition to a recording medium, and adhering a reaction liquid to the recording medium, the reaction liquid containing water and a reagent for aggregating or thickening components of the ink composition, and having a pH of 7 to 10. In the adhering of the reaction liquid, an epoxy-based adhesive is used for at least a portion of a reaction liquid passage for supplying the reaction liquid to an ink jet head, and a member in contact with the reaction liquid in the ink jet head, and the reaction liquid is discharged from the ink jet head so as to adhere to the recording medium.
    Type: Grant
    Filed: July 9, 2019
    Date of Patent: May 25, 2021
    Inventors: Ippei Okuda, Mitsuaki Kosaka
  • Patent number: 11001053
    Abstract: An ink jet recording method of the present invention includes: forming an ink image by ejecting an ink onto a transfer body with an ink jet head in which a recording element substrate provided with an element generating energy to be used for ejecting the ink, a pressure chamber including the element inside, and an ejection orifice ejecting the ink is provided, and the ink in the pressure chamber is circulated between the pressure chamber and the outside of the pressure chamber; and transferring the ink image onto a recording medium by bringing the recording medium into contact with the transfer body on which the ink image is formed, wherein a viscosity of the ink is 2 mPa·s or more to 20 mPa·s or less.
    Type: Grant
    Filed: September 30, 2019
    Date of Patent: May 11, 2021
    Assignee: Canon Kabushiki Kaisha
    Inventors: Mitsutoshi Noguchi, Ryosuke Hirokawa, Toru Ohnishi, Shingo Okushima, Yoichi Takada
  • Patent number: 10974507
    Abstract: A liquid ejection head includes a pressure chamber that allows a first liquid and a second liquid to flow inside, a pressure generation element that applies pressure to the first liquid and an ejection port that ejects the second liquid. The first liquid and the second liquid that flows on a side closer to the ejection port than the first liquid flow in contact with each other in the pressure chamber. The first liquid and the second liquid flowing in the pressure chamber satisfy 0.0<0.44(Q2/Q1)?0.322(?2/?1)?0.109<1.0, where ?1 is a viscosity of the first liquid, ?2 is a viscosity of the second liquid, Q1 is a flow rate of the first liquid, and Q2 is a flow rate of the second liquid.
    Type: Grant
    Filed: July 30, 2019
    Date of Patent: April 13, 2021
    Assignee: Canon Kabushiki Kaisha
    Inventors: Yoshiyuki Nakagawa, Akiko Hammura
  • Patent number: 10889114
    Abstract: A liquid ejecting apparatus includes a liquid ejecting unit including at least one pressure chamber filled with a reactive ink, at least one nozzle communicating with the pressure chamber, a supply channel through which the reactive ink is supplied to the pressure chamber, and an elastic compliance film forming a portion of the supply channel; a piezoelectric element that changes a capacity of the pressure chamber when an electric signal is supplied to the piezoelectric element; and a flexible wiring substrate at which a signal wire for supplying the electric signal to a connection terminal of the piezoelectric element is formed. The elastic compliance film is formed of a para-aramid resin. The connection terminal and the signal wire are electrically connected to each other by solder.
    Type: Grant
    Filed: July 19, 2019
    Date of Patent: January 12, 2021
    Inventors: Noriaki Okazawa, Toshiki Usui
  • Patent number: 10843465
    Abstract: A method of making inkjet print heads may include forming recesses in a first surface of a first wafer to define inkjet chambers. The method may also include forming openings extending from a second surface of the first wafer through to respective ones of the inkjet chambers to define inkjet orifices. The method may further include forming a second wafer including ink heaters, and joining the first and second wafers together so that the ink heaters are aligned within respective inkjet chambers to thereby define the inkjet print heads.
    Type: Grant
    Filed: October 19, 2018
    Date of Patent: November 24, 2020
    Assignee: STMICROELECTRONICS, INC.
    Inventors: Murray J. Robinson, Kenneth J. Stewart
  • Patent number: 10828908
    Abstract: A fluid ejection device includes a fluid slot, a fluid ejection chamber communicated with the fluid slot, a drop ejecting element within the fluid ejection chamber, a fluid circulation channel communicated at a first end with the fluid slot and communicated at a second end with the fluid ejection chamber, and a particle tolerant architecture within the fluid circulation channel at the second end.
    Type: Grant
    Filed: September 25, 2018
    Date of Patent: November 10, 2020
    Assignee: Hewlett-Packard Development Company, Ltd.
    Inventors: Nick McGuinness, Lawrence H White, Paul A Richards
  • Patent number: 10832740
    Abstract: In one embodiment, an apparatus includes a module having: an array of transducers formed in thin film structure on a substrate, the array being positioned along a tape bearing surface of the module, and a heating element positioned in the thin film structure and recessed from the tape bearing surface. An apparatus, according to another embodiment, includes a module having an array of transducers formed on a substrate, the array being positioned along a tape bearing surface of the module between skiving edges thereof. A slot is formed in the substrate adjacent one of the skiving edges. A heating element is positioned in the slot.
    Type: Grant
    Filed: October 18, 2018
    Date of Patent: November 10, 2020
    Assignee: International Business Machines Corporation
    Inventors: Robert G. Biskeborn, Calvin S. Lo
  • Patent number: 10828893
    Abstract: A liquid ejecting head includes an element substrate including a common liquid chamber connected to a liquid supply source, a pressure chamber connected to the common liquid chamber and including inside an element to generate energy used for ejecting liquid, a bubble generating chamber connected to the common liquid chamber and including inside a pump to cause a flow of the liquid, and a connection flow path connecting the pressure chamber and the bubble generating chamber. The liquid ejecting head includes a first anti-cavitation film over the element to generate the energy and a second anti-cavitation film over the pump, and the first anti-cavitation film and the second anti-cavitation film have different film thicknesses.
    Type: Grant
    Filed: June 12, 2019
    Date of Patent: November 10, 2020
    Assignee: Canon Kabushiki Kaisha
    Inventors: Masafumi Morisue, Yoshiyuki Nakagawa, Kazuhiro Yamada, Takuro Yamazaki, Ryo Kasai, Tomoko Kudo, Takashi Sugawara
  • Patent number: 10786990
    Abstract: An ink-jet recording apparatus may include an ink-jet head having: individual connection flow channels through which ink can be discharged from pressure chambers; and a common flow channel at which ink from the individual connection flow channels merges, wherein when the ink is ejected, in a nozzle through which the maximum amount of ink per unit time is ejected, the relationship of (Fn/Fi)?10 is satisfied, Fn representing the amount of ink ejected per unit time from the nozzle, and Fi representing the average flow rate of ink discharged per unit time from the individual connection flow channels, and the relationship of (Rc/Rt)?10 is satisfied, Rc representing the flow channel resistance of the common flow channel, and Rt representing the synthetic resistance of the individual connection flow channels.
    Type: Grant
    Filed: June 21, 2017
    Date of Patent: September 29, 2020
    Assignee: KONICA MINOLTA, INC.
    Inventor: Hikaru Hamano
  • Patent number: 10730312
    Abstract: A fluid ejection device includes a fluid slot, a first fluid ejection chamber communicated with the fluid slot and including a first drop ejecting element, a second fluid ejection chamber including a second drop ejecting element, and a fluid circulation path including a first portion communicated with the fluid slot and the second fluid ejection chamber, and a second portion communicated with the first fluid ejection chamber and the second fluid ejection chamber, with the fluid circulation path including a fluid circulating element within the first portion.
    Type: Grant
    Filed: February 8, 2019
    Date of Patent: August 4, 2020
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Alexander Govyadinov, Tsuyoshi Yamashita, Erik D. Torniainen
  • Patent number: 10688788
    Abstract: Provided is a liquid ejection head comprising: an ejection opening row along a first direction; a pressure chamber with print-element; a passage communicating with the pressure chamber; a supply opening row along the first direction with supply openings extending in a second direction to supply liquid to the passage; a collection opening row along the first direction with collection openings extending in the second direction to collect a liquid from the passage; a first common supply passage along the first direction to supply a liquid to the supply opening row; a first common collection passage along the first direction to collect a liquid from the collection opening row; a first supply side communication opening extending in the second direction to supply a liquid to the first common supply passage; and a first collection side communication opening extending in the second direction to collect a liquid from the first common collection passage, wherein at least one of the first supply side communication openi
    Type: Grant
    Filed: November 19, 2018
    Date of Patent: June 23, 2020
    Assignee: Canon Kabushiki Kaisha
    Inventors: Shingo Okushima, Seiichiro Karita, Takatsuna Aoki, Noriyasu Nagai, Eisuke Nishitani, Yumi Komamiya
  • Patent number: 10556431
    Abstract: An electromechanical transducer element including a lower electrode, an electromechanical transducer film and an upper electrode formed on the electromechanical transducer film.
    Type: Grant
    Filed: June 22, 2018
    Date of Patent: February 11, 2020
    Assignee: Ricoh Company, Ltd.
    Inventors: Satoshi Mizukami, Naoya Kondo, Toshiaki Masuda
  • Patent number: 10557567
    Abstract: An example fluidic micro electromechanical system may include a substrate and a first layer supported by the substrate. The first layer forms sides of a chamber, a passage through one of the sides and a chamber and a check valve leaf. The check valve leaf is pivotable about an axis nonparallel to the substrate to open and close the passage. The system may further include a second layer over the chamber, an opening into the chamber and a resistor supported within the chamber.
    Type: Grant
    Filed: April 19, 2016
    Date of Patent: February 11, 2020
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventor: Eric L. Nikkel
  • Patent number: 10548351
    Abstract: The present disclosure relates to aerosol delivery devices. The aerosol delivery devices include mechanisms configured to deliver an aerosol precursor composition from a reservoir to an atomizer including a vaporization heating element to produce a vapor. For example, a bubble jet head may be configured to dispense the aerosol precursor composition to the atomizer. The bubble jet head may be fixedly coupled to the atomizer. The bubble jet head may include a precursor inlet, an ejection heating element, and a precursor nozzle. The atomizer may include a vaporization heating element.
    Type: Grant
    Filed: October 27, 2014
    Date of Patent: February 4, 2020
    Assignee: RAI Strategic Holdings, Inc.
    Inventors: David Allan Brammer, David Jackson, Nigel John Flynn, Eric T. Hunt, Stephen Benson Sears, Dennis Lee Potter
  • Patent number: 10522532
    Abstract: A process for manufacturing an integrated circuit (IC) with a through via extending through a group III-V layer to a diode is provided. An etch is performed through the group III-V layer, into a semiconductor substrate underlying the group III-V layer, to form a via opening. A doped region is formed in the semiconductor substrate, through the via opening. Further, the doped region is formed with an opposite doping type as a surrounding region of the semiconductor substrate. The through via is formed in the via opening and in electrical communication with the doped region.
    Type: Grant
    Filed: July 22, 2016
    Date of Patent: December 31, 2019
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chung-Yen Chou, Chia-Shiung Tsai, Shih-Chang Liu, Yung-Chang Chang
  • Patent number: 10518531
    Abstract: Provided is a liquid ejection head substrate, in which a plurality of units are arranged. Each of the units includes: a pressure generating element formed on a first surface of a support substrate; and a pair of independent liquid chambers, which are formed on both sides of the pressure generating element so as to be opposed to each other, and are opened to the first surface of the support substrate. The liquid ejection head substrate includes, in the support substrate: a first common liquid chamber communicating to a plurality of independent liquid chambers on one side of the pair of independent liquid chambers; a second common liquid chamber communicating to a plurality of independent liquid chambers on another side of the pair of independent liquid chambers; and a partition wall separating the first common liquid chamber and the second common liquid chamber from each other.
    Type: Grant
    Filed: June 15, 2018
    Date of Patent: December 31, 2019
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Hiroshi Higuchi, Toshiyasu Sakai, Masataka Kato, Takayuki Kamimura
  • Patent number: 10507657
    Abstract: A liquid discharge head includes a nozzle plate, a channel substrate, a common-liquid-chamber substrate, an adhesive, and a sealant. The nozzle plate includes a plurality of nozzles to discharge liquid. The channel substrate includes a plurality of individual liquid chambers communicated with the plurality of nozzles. The common-liquid-chamber substrate includes a common liquid chamber to supply the liquid to the plurality of individual liquid chambers. The adhesive bonds two of the nozzle plate, the channel substrate, and the common-liquid-chamber substrate. The adhesive faces a channel through which the liquid flows. The sealant surrounds the adhesive at an opposite side of the channel relative to the adhesive.
    Type: Grant
    Filed: November 29, 2016
    Date of Patent: December 17, 2019
    Assignee: RICOH COMPANY, LTD.
    Inventors: Aki Takahashi, Hitoshi Usami, Masaki Kato, Masataka Yoshiike
  • Patent number: 10493757
    Abstract: Printheads and methods for forming printheads are described herein. In one example, a printhead includes a number of drop generators, wherein a pitch between each adjacent drop generator is substantially the same, and the drop generators alternate between a high drop weight (HDW) drop generator and a low drop weight (LDW) drop generator. The printhead also includes a flow channel from an ink source leading into an ejection chamber associated with each drop generator, wherein the flow channel comprises an inflow region proximate to the ink source, wherein an area of the inflow region is adjusted to control the flux of ink into the ejection chamber.
    Type: Grant
    Filed: October 30, 2014
    Date of Patent: December 3, 2019
    Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Lawrence H White, Melinda M Valencia, Michael Hager
  • Patent number: 10479084
    Abstract: A method for manufacturing liquid ejection heads includes the steps of forming ejection port members on a substrate, the ejection port members each having a liquid channel and an ejection port for ejecting liquid through the channel, the liquid channel communicating with the substrate; forming supply ports passing through the substrate to supply liquid to the channels; and forming a separation groove in the substrate to separate the substrate for each liquid ejection head. The step of forming the ejection port members includes the step of hardening a material constituting the ejection port member by heat treatment. The step of forming the separation groove is performed before the step of hardening.
    Type: Grant
    Filed: May 3, 2017
    Date of Patent: November 19, 2019
    Assignee: Canon Kabushiki Kaisha
    Inventors: Seiichiro Yaginuma, Keiji Matsumoto, Koji Sasaki
  • Patent number: 10464311
    Abstract: An ink jet recording method of the present invention includes: forming an ink image by ejecting an ink onto a transfer body with an ink jet head in which a recording element substrate provided with an element generating energy to be used for ejecting the ink, a pressure chamber including the element inside, and an ejection orifice ejecting the ink is provided, and the ink in the pressure chamber is circulated between the pressure chamber and the outside of the pressure chamber; and transferring the ink image onto a recording medium by bringing the recording medium into contact with the transfer body on which the ink image is formed, wherein a viscosity of the ink is 2 mPa·s or more to 20 mPa·s or less.
    Type: Grant
    Filed: June 29, 2018
    Date of Patent: November 5, 2019
    Assignee: Canon Kabushiki Kaisha
    Inventors: Mitsutoshi Noguchi, Ryosuke Hirokawa, Toru Ohnishi, Shingo Okushima, Yoichi Takada
  • Patent number: 10369788
    Abstract: A fluid ejection device may include a substrate having front and back opposing surfaces and a slot extending through the substrate between the back and front surfaces and along an axis of the substrate. A recessed end region may be formed in the back surface at each end of the slot.
    Type: Grant
    Filed: December 15, 2016
    Date of Patent: August 6, 2019
    Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Rio Rivas, Ed Friesen, Terry McMahon, Donald W. Schulte, David Douglas Hall
  • Patent number: 10336070
    Abstract: According to an example, a fluid ejection device may include a fluid feed slot, a plurality of fluid ejection chambers in fluid communication with the fluid feed slot, a plurality of drop ejecting elements, in which a drop ejecting element of the plurality of drop ejecting elements is positioned within each of the plurality of fluid ejection chambers, a fluid circulation channel in fluid communication at a first end of the fluid circulation channel with the fluid feed slot and in fluid communication at multiple second ends of the fluid circulation channel with the plurality of fluid ejection chambers, and a fluid circulating element within the fluid circulation channel. The fluid ejection device may also include a bubble dissipating structure positioned within the fluid circulation channel outside of the plurality of fluid ejection chambers.
    Type: Grant
    Filed: October 30, 2015
    Date of Patent: July 2, 2019
    Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Nicholas Matthew Cooper McGuinness, Alexander Govyadinov, Chris Bakker, Lawrence H. White, Paul A. Richards
  • Patent number: 10336064
    Abstract: In some examples, a print head comprises a plurality of nozzles comprising respective heaters on the print head, each heater of the heaters to be driven by a respective firing pulse to form a bubble in a corresponding nozzle. The print head further comprises a first time repository on the print head to store a first time instant, and a second time repository on the print head to store a second time instant, and a plurality of detect circuits provided onto the print head and coupled to corresponding nozzles of the plurality of nozzles, wherein each respective detect circuit of the plurality of detect circuits is to detect a change in respective impedances for a respective nozzle at the first time instant and the second time instant.
    Type: Grant
    Filed: February 14, 2018
    Date of Patent: July 2, 2019
    Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Daryl E. Anderson, Eric T. Martin
  • Patent number: 10342140
    Abstract: A printed circuit board has a first coefficient of thermal expansion. A compound is molded about the printed circuit board. The compound has a second coefficient of thermal expansion different than the first coefficient of thermal expansion. An interface is between an edge of the printed circuit board and the compound. The interface has a third coefficient of thermal expansion between the first coefficient of thermal expansion and the second coefficient of thermal expansion.
    Type: Grant
    Filed: July 31, 2015
    Date of Patent: July 2, 2019
    Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Chien-Hua Chen, Gary G. Lutnesky, Michael W. Cumbie, Eric L. Nikkel
  • Patent number: 10308034
    Abstract: A liquid container for accommodating a liquid includes: a plurality of detection electrodes mounted on the liquid container and connected to a detection circuit installed outside the liquid container, wherein the plurality of detection electrodes detects a tilt of the liquid container.
    Type: Grant
    Filed: April 12, 2017
    Date of Patent: June 4, 2019
    Assignee: ROHM CO., LTD.
    Inventors: Hirotoshi Usui, Yukihiro Iwamoto, Masaya Hirakawa, Masao Nakajima
  • Patent number: 10300699
    Abstract: A liquid discharge head includes a recording element substrate having first to fourth discharge port groups, each of which includes a plurality of discharge ports for discharging liquid, first flow path connecting a first liquid tank to the first discharge port group, a second flow path connecting a second liquid tank to the second discharge port group, and a third flow path connecting a third liquid tank to the third discharge port group and the fourth discharge port group, wherein a flow resistance in the first flow path is smaller than a flow resistance in the second flow path and larger than a flow resistance in the third flow path, and wherein a ratio of the flow resistance in the second flow path to the flow resistance in the third flow path is 4 or less.
    Type: Grant
    Filed: July 27, 2017
    Date of Patent: May 28, 2019
    Assignee: Canon Kabushiki Kaisha
    Inventors: Sayaka Seki, Yuichiro Akama, Yuji Tamaru, Naoko Tsujiuchi, Yasuaki Kitayama
  • Patent number: 10276748
    Abstract: Disclosed is a radiation-emitting semi-conductor chip (1) comprising an epitaxial semi-conductor layer sequence (3) which emits electromagnetic radiation in operation. The epitaxial semi-conductor layer sequence (3) is applied on a a transparent substrate (4), wherein the substrate (4) has a first main surface (8) facing the semi-conductor layer sequence (3), a second main surface (9) facing away from the semi-conductor layer sequence (3) and a first lateral flank (10) arranged between the first main surface (8) and the second main surface (9), and the lateral flank (10) has a decoupling structure which is formed in a targeted manner from separating tracks. Also disclosed is a method for producing the semi-conductor chip, and a component comprising such a semi-conductor chip.
    Type: Grant
    Filed: October 7, 2015
    Date of Patent: April 30, 2019
    Assignee: OSRAM OPTO SEMICONDUCTORS GMBH
    Inventors: Mathias Kaempf, Simon Jerebic, Ingo Neudecker, Guenter Spath, Michael Huber, Korbinian Perzlmaier
  • Patent number: 10274826
    Abstract: A method for imparting water repellency to a surface of a member includes a step in which a material including a compound containing a fluorine atom is deposited on a surface of a photosensitive resin layer in order to form a member including a material layer; a first exposure step in which the member is exposed to an amount of light with an exposure apparatus in order to form a latent image in the member; a development step in which the member including the latent image is developed; and a second exposure step in which the member is exposed to an amount of light with an exposure apparatus subsequent to the development step.
    Type: Grant
    Filed: June 2, 2016
    Date of Patent: April 30, 2019
    Assignee: Canon Kabushiki Kaisha
    Inventors: Masataka Nagai, Yoshinori Tagawa, Shingo Nagata, Hiroyuki Murayama, Shuhei Oya, Makoto Watanabe
  • Patent number: 10252528
    Abstract: According to one embodiment, an inkjet recording head includes a plurality of ink pressure chambers arranged in a first direction, a nozzle communicating with each of the ink pressure chambers, a plurality of individual ink supply paths which are arranged in a second direction and communicate with one end of each of the ink pressure chambers, a plurality of individual ink discharge paths which are arranged in the second direction and communicate with another end of each of the ink pressure chambers, a plurality of actuators configured to apply pressure to ink in the ink pressure chambers, a common ink supply path communicating with an end of each of the individual ink supply paths, and a common ink discharge path communicating with an end of each of the individual ink discharge paths.
    Type: Grant
    Filed: August 25, 2017
    Date of Patent: April 9, 2019
    Assignees: Kabushiki Kaisha Toshiba, Toshiba TEC Kabushiki Kaisha
    Inventors: Takashi Kawakubo, Kazuhide Abe, Ryutaro Kusunoki
  • Patent number: 10241410
    Abstract: A method for imparting water repellency to a surface of a member includes a step in which a material including a compound containing a fluorine atom is deposited on a surface of a photosensitive resin layer in order to form a member including a material layer; a first exposure step in which the member is exposed to an amount of light with an exposure apparatus in order to form a latent image in the member; a development step in which the member including the latent image is developed; and a second exposure step in which the member is exposed to an amount of light with an exposure apparatus subsequent to the development step.
    Type: Grant
    Filed: June 2, 2016
    Date of Patent: March 26, 2019
    Assignee: Canon Kabushiki Kaisha
    Inventors: Masataka Nagai, Yoshinori Tagawa, Shingo Nagata, Hiroyuki Murayama, Shuhei Oya, Makoto Watanabe
  • Patent number: 10207516
    Abstract: A fluid ejection device includes a fluid slot, a first fluid ejection chamber communicated with the fluid slot and including a first drop ejecting element, a second fluid ejection chamber including a second drop ejecting element, and a fluid circulation path including a first portion communicated with the fluid slot and the second fluid ejection chamber, and a second portion communicated with the first fluid ejection chamber and the second fluid ejection chamber, with the fluid circulation path including a fluid circulating element within the first portion.
    Type: Grant
    Filed: April 30, 2015
    Date of Patent: February 19, 2019
    Assignee: HEWLETT PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Alexander Govyadinov, Tsuyoshi Yamashita, Erik D Torniainen
  • Patent number: 10189047
    Abstract: The examples provide a fluid ejection apparatus that includes a fluid slot; a passage, a drop generator and a fluid circulation pump. The passage has an inlet connected to the fluid slot and an outlet spaced from the inlet and connected to the fluid slot. The passage as a first portion extending in a first direction from the inlet and a second portion extending from the first portion to the outlet in a second direction, opposite to the first direction. A filter is within the fluid slot across the inlet.
    Type: Grant
    Filed: January 12, 2018
    Date of Patent: January 29, 2019
    Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Alexander N. Govyadinov, Paul A. Richards
  • Patent number: 10166772
    Abstract: A liquid-discharging-head substrate includes an insulation layer, an electrode, and a heating resistor element, wherein the insulation layer includes a first opening portion including a first opening formed in a surface of the insulation layer, a second opening having a smaller opening area than an opening area of the first opening, and a surface connecting the first opening and the second opening, and a second opening portion extending from the second opening to a back surface of the insulation layer, wherein the electrode is formed in the second opening portion, and a surface of the electrode is exposed from the second opening when viewed from the surface side of the insulation layer, and wherein the heating resistor element is in contact with the surface connecting the first opening and the second opening, and with the surface of the electrode.
    Type: Grant
    Filed: February 6, 2017
    Date of Patent: January 1, 2019
    Assignee: Canon Kabushiki Kaisha
    Inventors: Soichiro Nagamochi, Hirokazu Komuro
  • Patent number: 10166776
    Abstract: A fluid flow structure may include a fluid dispensing micro device comprising a tapered fluid port to feed fluid to the micro device, and a monolithic molding comprising a tapered channel defined in the molding through which fluid may flow directly into the micro device. The channel may be fluidically coupled to the fluid port. The micro device is embedded in the molding. The micro device is a printhead die having a thickness less than or equal to 650 ?m. The channel is wider than the fluid port.
    Type: Grant
    Filed: January 16, 2018
    Date of Patent: January 1, 2019
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Chien-Hua Chen, Michael W. Cumbie
  • Patent number: 10118392
    Abstract: A method of forming a substrate for a fluid ejection device includes forming an opening in the substrate from a second side toward a first side, and further forming the opening in the substrate to the first side, including increasing the opening to the first side and increasing the opening at the second side, and forming the opening with substantially parallel sidewalls intermediate the first side and the second side and converging sidewalls to the first side.
    Type: Grant
    Filed: April 6, 2018
    Date of Patent: November 6, 2018
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Ed Friesen, Rio Rivas, Kelly Ronk
  • Patent number: 10118337
    Abstract: A 3-D printer includes build and support material development stations that electrostatically transfer build material and support material to an ITB. The ITB transfers a layer of build and support material to a platen each time the platen contacts one of the layers on the ITB, to successively form a freestanding stack of the layers on the platen. A sensor is positioned to generate a topographic measurement of the layer on the platen, and an aerosol applicator is positioned to propel build and support material on to the layer on the platen. The aerosol applicator controls the build and support material being propelled, based on the topographic measurement from the sensor through a feedback loop, to adjust the amount and location of the build material and the support material propelled on to the layer, and thereby control the flatness of surface topology of the layers in the freestanding stack on the platen.
    Type: Grant
    Filed: June 6, 2016
    Date of Patent: November 6, 2018
    Assignee: Xerox Corporation
    Inventors: William J. Nowak, Jorge A. Alvarez, Robert A. Clark, Michael F. Zona, Chu-heng Liu, Paul J. McConville
  • Patent number: 10112407
    Abstract: A fluid ejection device includes a fluid slot, a fluid ejection chamber communicated with the fluid slot, a drop ejecting element within the fluid ejection chamber, a fluid circulation channel communicated at a first end with the fluid slot and communicated at a second end with the fluid ejection chamber, a fluid circulating element within the fluid circulation channel, and a particle tolerant architecture within the fluid circulation channel at the second end.
    Type: Grant
    Filed: January 29, 2015
    Date of Patent: October 30, 2018
    Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Nick McGuinness, Lawrence H White, Paul A Richards
  • Patent number: 10099473
    Abstract: Systems and methods for evaluating the condition of a print nozzle are described. In one example, impedances across the print nozzle are measured. Subsequently, first test result and second test result are determined and registered at a first predetermined time instant and at a second predetermined time instant, respectively. The first test result and the second test result are obtained based on the measured impedances. Based on the first test result and the second test result, the condition of the print nozzle, is determined.
    Type: Grant
    Filed: January 30, 2014
    Date of Patent: October 16, 2018
    Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Daryl E. Anderson, Eric T. Martin, Peter James Fricke, James Michael Gardner
  • Patent number: 10099483
    Abstract: A fluid ejection cartridge may include a substrate including substrate ribs that define fluid feed slots extending from a first side to a second side of the substrate, fluid chambers having nozzle openings on a first side of the substrate, an ejection element within each of the fluid chambers and a substrate carrier on a second side of the substrate. The substrate carrier may include carrier ribs that define fluid passageways having oblique centerlines and internal widths that gradually increase from a first width proximate the substrate to a second width, greater than the first width, distant the substrate. Concavely tapered adhesive bonds directly contact faces of the substrate ribs and the carrier ribs to adhere the substrate ribs to the carrier ribs.
    Type: Grant
    Filed: January 11, 2017
    Date of Patent: October 16, 2018
    Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Rio Rivas, Ed Friesen
  • Patent number: 10081181
    Abstract: A liquid ejecting head includes a pressure chamber formation substrate provided with pressure chambers that are disposed side by side and that communicate with nozzles that discharge a liquid, a nozzle plate provided with the nozzles, and a flow path formation substrate provided between the pressure chamber formation substrate and the nozzle plate. The flow path formation substrate has a plurality of individual communication paths that supply the liquid to the pressure chambers disposed side by side, a common liquid chamber that communicates with the pressure chambers, a liquid introduction port that introduces the liquid into the common liquid chamber, and a flow path of the liquid from the liquid introduction port toward the individual communication paths.
    Type: Grant
    Filed: June 23, 2017
    Date of Patent: September 25, 2018
    Assignee: Seiko Epson Corporation
    Inventors: Shingo Tomimatsu, Yoichi Naganuma
  • Patent number: 10071553
    Abstract: A liquid ejection device is disclosed. One device includes a liquid supply member defining a liquid supply channel that is in communication with a common liquid chamber via an outlet of the liquid supply channel. The outlet and the common liquid chamber extend along a longitudinal direction respectively. The liquid supply member includes a plurality of ribs located within the liquid supply channel, the plurality of ribs are disposed side by side in the longitudinal direction. The plurality of ribs includes a first rib, a second rib and a third rib. A distance from the first rib to the third rib in the longitudinal direction is smaller than a distance from the first rib to the second rib in the longitudinal direction.
    Type: Grant
    Filed: September 8, 2016
    Date of Patent: September 11, 2018
    Assignee: BROTHER KOGYO KABUSHIKI KAISHA
    Inventors: Taisuke Mizuno, Yasuo Kato, Takashi Aiba, Keita Sugiura
  • Patent number: 10005282
    Abstract: Fluid ejection devices with particle tolerant thin-film extensions are disclosed. An example apparatus includes a printer; a reservoir; and a printhead including: a firing chamber; a channel to receive fluid from the reservoir, the channel is coupled to the firing chamber, the channel having an opening; and a particle-tolerant film disposed adjacent the opening of the channel, the particle-tolerant film disposed between the channel and the reservoir, the particle-tolerant film to deter particles within the fluid from settling in an area adjacent the opening.
    Type: Grant
    Filed: December 3, 2015
    Date of Patent: June 26, 2018
    Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Rio Rivas, Ed Friesen, Kellie Susanne Jensen
  • Patent number: 9975335
    Abstract: In an example implementation, a grounding structure includes a perimeter ground line around the perimeter of a printhead die, and having north, south, east, and west segments. The structure includes an inter-slot ground line extending from the north segment to the south segment between two fluid slots, and an alternative ground line extending from the east segment to the west segment and intersecting the inter-slot ground line in a connection area near ends of the fluid slots.
    Type: Grant
    Filed: August 18, 2014
    Date of Patent: May 22, 2018
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Boon Bing Ng, Thida Ma Win, Jose Jehrome Rando
  • Patent number: 9962938
    Abstract: A method of forming a substrate for a fluid ejection device includes forming an opening in the substrate from a second side toward a first side, and further forming the opening in the substrate to the first side, including increasing the opening to the first side and increasing the opening at the second side, and forming the opening with substantially parallel sidewalls intermediate the first side and the second side and converging sidewalls to the first side.
    Type: Grant
    Filed: February 13, 2013
    Date of Patent: May 8, 2018
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Ed Friesen, Rio Rivas, Kelly Ronk
  • Patent number: 9950525
    Abstract: An element substrate for a liquid ejecting head includes a substrate, an element forming layer on the substrate, and a discharge port forming member formed of an insulating member on the element forming layer. The element forming layer includes an energy generating element configured to provide energy to a liquid for ejection. The discharge port forming member includes a discharge port forming surface having discharge ports through which the liquid is ejected and an exterior side surface positioned between the discharge port forming surface and the element forming layer. The exterior side surface has a first edge facing the element forming layer. The element substrate further includes a conductive layer disposed between the first edge and the element forming layer and grounded.
    Type: Grant
    Filed: October 6, 2016
    Date of Patent: April 24, 2018
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Ryoji Oohashi, Koichi Omata, Hideo Tamura, Takaaki Yamaguchi, Kousuke Kubo, Suguru Taniguchi, Yuji Tamaru, Toshio Negishi, Yohei Osuki
  • Patent number: 9908339
    Abstract: A liquid jet head includes an actuator plate having opposite surfaces with ejection grooves arranged on one surface and a return path arranged on the other surface. A spacer plate has one surface on which the actuator plate is positioned and has a side flow path communicating with the ejection grooves. An air bubble retention suppression unit is provided on the spacer plate and suppresses retention of air bubbles in the side flow path.
    Type: Grant
    Filed: September 23, 2016
    Date of Patent: March 6, 2018
    Assignee: SII PRINTEK INC.
    Inventor: Daiki Irokawa
  • Patent number: 9902157
    Abstract: A first passage layer is provided with a plurality of supply passages each communicating with one portion of each of a plurality of pressure chambers and a plurality of collection passages each communicating with the other portion of each of the plurality of pressure chambers. A second passage layer is provided with a common supply passage communicating with the plurality of supply passages and a common collection passage communicating with the plurality of collection passages.
    Type: Grant
    Filed: December 22, 2016
    Date of Patent: February 27, 2018
    Assignee: Canon Kabushiki Kaisha
    Inventors: Shingo Okushima, Seiichiro Karita, Takatsuna Aoki, Noriyasu Nagai, Yumi Komamiya
  • Patent number: 9895889
    Abstract: Examples of a printhead assembly are disclosed herein. An example of the printhead assembly includes a die to print, a base member, and at least one electrode. The electrode may be used to provide a charge to attract and collect particles that would normally otherwise interfere with operation of the die.
    Type: Grant
    Filed: June 23, 2014
    Date of Patent: February 20, 2018
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Chien-Hua Chen, Jeremy Harlan Donaldson, Teressa L. Roth, Bradley B Branham